CN107429322B - Heat dissipation element copper alloy plate and heat dissipation element - Google Patents
Heat dissipation element copper alloy plate and heat dissipation element Download PDFInfo
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- CN107429322B CN107429322B CN201680017424.6A CN201680017424A CN107429322B CN 107429322 B CN107429322 B CN 107429322B CN 201680017424 A CN201680017424 A CN 201680017424A CN 107429322 B CN107429322 B CN 107429322B
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 92
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 89
- 238000011282 treatment Methods 0.000 claims abstract description 77
- 230000032683 aging Effects 0.000 claims abstract description 73
- 239000010949 copper Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 38
- 230000008569 process Effects 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 229910052742 iron Inorganic materials 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052718 tin Inorganic materials 0.000 claims abstract description 14
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 229910052749 magnesium Inorganic materials 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 229910052726 zirconium Inorganic materials 0.000 claims description 11
- 229910052804 chromium Inorganic materials 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 33
- 238000010438 heat treatment Methods 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 26
- 229910000679 solder Inorganic materials 0.000 description 25
- 238000005098 hot rolling Methods 0.000 description 16
- 238000012360 testing method Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 13
- 238000001556 precipitation Methods 0.000 description 12
- 238000005219 brazing Methods 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000004080 punching Methods 0.000 description 7
- 238000005275 alloying Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000003507 refrigerant Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 208000037656 Respiratory Sounds Diseases 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052748 manganese Inorganic materials 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 3
- 229910017755 Cu-Sn Inorganic materials 0.000 description 3
- 229910017927 Cu—Sn Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010813 municipal solid waste Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Conductive Materials (AREA)
- Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
A kind of copper alloy plate is provided, when manufacturing step of a part of process of heat dissipation element comprising the temperature for being heated to 650 DEG C or more, the heat dissipation element after capable of making manufacture possesses sufficient intensity and heat dissipation performance.A kind of heat dissipation element copper alloy plate, wherein, containing Fe:0.07~0.7 mass %, P:0.2 mass % or less, ratio [Fe]/[P] of the content [P] of the content [Fe] and P of Fe is 2~5, surplus is made of Cu and the impurity that can not be kept away, water cooling after being heated 30 minutes with 850 DEG C, then 0.2% yield strength after ageing treatment is 100MPa or more, and conductivity is 50%IACS or more.When copper alloy contains Sn, in the range of the content of Sn and Fe point A (0.1,0.006) shown in Fig. 1, point B (0.5,0.006), point C (0.05,1.1), point D (0.05,0.05) are surrounded.
Description
Technical field
The present invention relates to heat dissipation element copper alloy plate and heat dissipation elements.
Background technique
The high speed and densification of the operating rate of the CPU mounted such as Desktop PC or notebook type PC rapidly develop,
Thermal discharge from these CPU further increases.If the temperature of CPU rises to the temperature of certain altitude, become failure or heat
Equal reason out of control, therefore effectively radiate from semiconductor devices such as CPU as practical problem.
As the heat for absorbing semiconductor device, it is allowed to diffuse to the heat dissipation element in atmosphere, uses heat sink.Due to heat
Heavy requirement has high-termal conductivity, so the copper or aluminium etc. that use thermal conductivity big as former material.But thermal-convection resistance will limit heat
Heavy performance, it is difficult to meet the cooling requirements of the high function electronic component of thermal discharge increase.
Therefore, as the heat dissipation element with more high-cooling property, proposition has the pipe for having high-termal conductivity and heat transfer potential
Shape heat pipe and planar heat pipe (steam cavity).Heat pipe is by being sealing into the evaporation of internal refrigerant (from the suction of CPU
Heat) and (releasing of the heat of absorption) is condensed by circulation progress, and play than heat sink higher heat dissipation characteristics.In addition it proposes, leads to
Crossing is combined heat pipe with heat dissipation element as heat sink or fan, to solve the problems, such as the heat release of semiconductor device.
As the former material of the heat dissipation element for heat sink, heat sink or heat pipe etc., it is mostly used conductivity and corrosion resistance is excellent
The plate or pipe of different pure copper (oxygen-free copper: C1020).In order to ensure shaping processability uses soft move back as former material
Fiery material (O material) or the quenched material of 1/4H, but in the manufacturing process of aftermentioned heat dissipation element exist and easily deform or fault,
It is easy to appear burr when Punching Technology or punch die is easy the problems such as wearing away.On the other hand, in patent document 1 and 2, as heat dissipation
The former material of element, description be Fe-P system copper alloy plate.
Heat sink and heat sink is that fine copper plate is passed through to stamping, Punching Technology, cutting, aperture processing and etching etc.
After being processed into set shape, plating Ni is carried out as needed or plates Sn, later again with solder, solder or bonding agent etc. with CPU's etc.
Semiconductor device engagement.
Tubulose heat pipe (referring to patent document 3), manufacture is to be sintered copper powders in pipe and form tube core, is being heated
After degassing process, one end is subjected to solder brazing sealing, refrigerant is added into pipe under vacuum or decompression, later again by another party
End carry out solder brazing sealing.
Planar heat pipe (referring to patent document 4 and 5), further increases the heat dissipation performance of tubulose heat pipe.As
Planar heat pipe, it is same as tubulose heat pipe in order to efficiently carry out the condensation and evaporation of refrigerant, propose inner surface
Carry out roughening processing or Pocket Machining etc..The upper and lower of the processing of stamping, Punching Technology, cutting or etching etc. will be carried out
Two fine copper plates are engaged by the method for solder brazing, diffusion bonding or welding etc., after refrigerant is added in inside, pass through hard pricker
The methods of weldering sealing.It is de-gassed in bonding process.
In addition, as planar heat pipe, propose that it, by appearance component, and is housed in the inside structure of the inside of appearance component
Part is constituted.In order to promote the condensation, evaporation and conveying of refrigerant, the one or more internal structures of configuration in the inside of appearance component
Part processes fin, protrusion, hole or slit of various shapes etc..In the planar heat pipe of this form, and will be interior
Portion's component configures behind the inside of appearance component, by the method for solder brazing or diffusion bonding etc., makes appearance component and internal structure
Part engagement integration after refrigerant is added, is sealed by the method for solder brazing etc..
[existing technical literature]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 2003-277853 bulletin
[patent document 2] Japanese Unexamined Patent Publication 2014-189816 bulletin
[patent document 3] Japanese Unexamined Patent Publication 2008-232563 bulletin
[patent document 4] Japanese Unexamined Patent Publication 2007-315745 bulletin
[patent document 5] Japanese Unexamined Patent Publication 2014-134347 bulletin
In the manufacturing process of these heat dissipation elements, heat sink and heat sink it is heated in the process of solder or solder brazing
To 200~700 DEG C or so.Tubulose heat pipe, planar heat pipe in sintering, deaerate, used P-Cu Brazing Materials (BCuP-2 etc.)
Solder brazing, diffusion bonding or welding etc. process in, be heated to 800~1000 DEG C or so.
For example, as heat pipe former material and softening when using fine copper plate, when being heated with 650 DEG C or more of temperature
Acutely.In addition, coarse grainsization sharply occur.Therefore, it is installed on heat sink or semiconductor device, or is embedded into PC framework
Deng when, the heat pipe of manufacture is easily deformed, and the construction inside heat pipe changes, and in addition the bumps on surface become larger, and is existed
The problem of expected heat dissipation performance cannot be played.In addition, increase the thickness of fine copper plate in order to avoid such deformation, but
If so, then the quality of heat pipe and thickness increase.When thickness increases, the gap inside PC framework becomes smaller, and there are convection current
The problem of heat transfer property reduces.
In addition, copper alloy plate described in patent document 1 and 2 (Fe-P system) also can if being heated with 650 DEG C or more of temperature
Softening, furthermore compared with fine copper, conductivity is greatly reduced.Therefore, the process through sintering, degassing, solder brazing or diffusion bonding etc.
When making such as planar heat pipe, equally in the conveying of heat pipe and handling or the easy change into insertion process of pedestal etc.
Shape.In addition, conductivity reduces, the estimated performance as heat pipe can not be shown.
Summary of the invention
The present invention in view of by fine copper or copper alloy plate manufacture heat dissipation element process a part in, comprising being heated to 650
DEG C or more temperature process when above-described problem and complete, it is intended that providing a kind of copper alloy plate, can make
The heat dissipation element manufactured by being heated to this process of 650 DEG C or more of temperature possesses sufficient intensity and heat dissipation performance.
Precipitation hardening type copper alloy is improved by carrying out ageing treatment, intensity and conductivity after solution treatment.But it analyses
The plastic strain for applying plastic processing with cold conditions and becoming drop out point is imported into conjunction after solution treatment by constrictive type copper alloy out
After in gold, if not carrying out ageing treatment, the improvement effect that there is intensity and conductivity from ageing treatment is low
Situation.
The heat dissipation member of the steam cavity made if it is the heating process by solder brazing, diffusion bonding or welding etc. etc.
Part will not then apply plastic processing after the heating process.Therefore, it is dissipated as described in the board making of precipitation strength type copper alloy
When thermal element, after being equivalent to the above-mentioned heating process of solution treatment, even if implement ageing treatment, still have intensity and conductivity without
The case where method sufficiently improves.
On the other hand, present inventors found that, in the Cu-Fe-P system alloy among precipitation hardening type copper alloy, lead to
The compositing range and Fe/P ratio for limiting Fe, P are crossed, after above-mentioned heating process, when not applying plastic processing and carrying out ageing treatment,
The intensity and conductivity of heat dissipation element can still greatly improve, to reach the present invention.
Heat dissipation element of the invention is used for following situation with copper alloy plate, and one of the process as manufacture heat dissipation element
Point, step and ageing treatment comprising being heated to 650 DEG C or more, wherein containing Fe:0.07~0.7 mass %, P:0.2 matter
Amount % is hereinafter, set the content (quality %) of Fe as [Fe], when the content (quality %) of P is [P], ratio [Fe]/[P] of the two is 2
~5, surplus is made of Cu and the impurity that can not be kept away, water cooling after being heated 30 minutes with 850 DEG C, then after progress ageing treatment
0.2% yield strength is 100MPa or more, and conductivity is 50%IACS or more.In addition, the content [P] of the content [Fe] of Fe and P
It is quality %.
Heat dissipation element copper alloy plate of the invention, as alloying element, additionally it is possible to contain Sn.In this case, copper closes
In golden plate, containing point A (0.1,0.006) shown in FIG. 1, point B (0.5,0.006), point C (0.05,1.1), point D (0.05,
0.05) Fe and Sn in the range of surrounding (containing on boundary line).The content of P and [Fe]/[P] are same as described above.The copper is closed
Water cooling after gold is heated 30 minutes with 850 DEG C, then 0.2% yield strength after ageing treatment is 100MPa or more, conductive
Rate is 45%IACS or more.
It, as needed, can also be containing total 0.5% or less but without 0 matter as alloying element in above-mentioned copper alloy plate
The Zn for measuring % is 1.5 mass % or less but without 0 mass % or/and Mn:0.1 mass % or less but is free of 0 mass %, Mg:
0.2 mass % or less but without 0 mass %, Si:0.2 mass % or less but without 0 mass %, Al:0.2 mass % or less but not
Containing 0 mass %, Cr:0.2 mass % or less but without 0 mass %, Ti:0.1 mass % or less but be free of 0 mass % and Zr:
0.05 mass % or less but without 0 mass % one or more of.
Copper alloy plate of the invention, in a part of the process as manufacture heat dissipation element, comprising being heated to 650 DEG C or more
The step of and ageing treatment in the case where use.In short, the heat dissipation element manufactured using copper alloy plate of the invention, high-temperature heating
Ageing treatment is carried out after to 650 DEG C or more, intensity improves.
Copper alloy plate of the invention is heated to 850 DEG C 30 minutes, and when then carrying out ageing treatment, 0.2% yield strength is
100MPa or more, conductivity are 50%IACS or more (when being free of Sn) or 45%IACS or more (when containing Sn).Copper of the invention closes
Golden plate, because the intensity after ageing treatment is high, by the heat dissipation element of the heat pipe for using the copper alloy plate to manufacture etc., installation
Onto heat sink or semiconductor device, or when insertion PC framework etc., which is difficult to deform.In addition, copper of the invention closes
Golden plate, conductivity is lower than fine copper plate, but because the intensity after ageing treatment is high, can be thinning, heat dissipation performance this
It can make up for it the amount of conductivity reduction on point.
Detailed description of the invention
Fig. 1 is the figure for indicating the range of Fe and Sn among the composition of copper alloy plate of the invention.
Specific embodiment
Hereinafter, being illustrated in more detail for heat dissipation element copper alloy plate of the invention.
Copper alloy plate of the invention is processed to set shape by stamping, Punching Technology, cutting or etching etc.,
It is heated at high temperature (degassing, engagement (solder brazing, diffusion bonding or welding) or the heating for be sintered etc.), it is first is made into heat dissipation
Part.According to the type or manufacturing method of heat dissipation element, although the heating condition of the high-temperature heating is different, in the present invention
In, it is contemplated that the case where be to carry out the high-temperature heatings with 650 DEG C~1050 DEG C or so.Copper alloy plate of the invention is made of aftermentioned
Fe-P series copper alloy constitute, if be heated in the temperature range, the Fe-P compound or Fe etc. that are precipitated before heating
At least part is dissolved, grain growth, and softening and the reduction of conductivity occurs.
Copper alloy plate of the invention, water cooling after being heated 30 minutes with 850 DEG C, the then intensity (0.2% after ageing treatment
Yield strength) it is 100MPa or more, conductivity is 50%IACS or more or 45%IACS or more.It is carried out 30 minutes with 850 DEG C
Heating, is the heating condition of the process for the high-temperature heating being envisioned in the manufacture of heat dissipation element.If with this condition for this
The copper alloy plate of invention is heated at high temperature, then the solid solution such as Fe-P compound or Fe for being precipitated before heating, grain growth occurs
The reduction of softening and conductivity.If then carrying out ageing treatment, fine Fe-P compound, Fe etc. to the copper alloy plate
It is precipitated.The intensity and conductivity reduced as a result, by the high-temperature heating significantly improves.
The ageing treatment can be implemented with the methods of following: (a) warm in being precipitated in the cooling process after high-temperature heating
It spends range and keeps certain time；(b) it is cooled to room temperature after being heated at high temperature, is again heated to Precipitation Temperature range thereafter and keeps certain
Time；(c) it after the process of (a), is again heated to Precipitation Temperature range and keeps certain time.
As specific Ageing conditions, the temperature range that can be enumerated at 350~600 DEG C is kept for 5 minutes~10 hours
Condition.It is suitable for that the temperature-time conditions for selecting fine Fe-P precipitate to generate are with intensity when rising to preferential
Can, it is suitable for the temperature-time conditions of the overaging tendency for the Fe and P reduction for selecting solid solution with conductivity when rising to preferential
.
Copper alloy plate after ageing treatment, conductivity are lower than the fine copper plate after high-temperature heating, but intensity is more significant than fine copper plate
It improves.This effect in order to obtain, the heat dissipation element of heat pipe manufactured using copper alloy plate of the invention etc., is being heated at high temperature
After carry out ageing treatment.Ageing conditions are for example aforementioned.Heat dissipation element (copper alloy plate) intensity after ageing treatment is high, is installed to
On heat sink or semiconductor device, or when insertion PC framework etc., the deformation of the heat dissipation element can be prevented.In addition, of the invention
Copper alloy plate (after ageing treatment) is able to carry out because intensity is higher than fine copper plate and is thinning (0.1~1.0mm is thick), thus
The heat dissipation performance that can be improved heat dissipation element, the reduction amount of conductivity when can make up for it compared to fine copper plate.
In addition, copper alloy plate of the invention, the temperature no matter being heated at high temperature is lower than 850 DEG C (650 DEG C or more) or higher than 850
DEG C (1050 DEG C or less) after ageing treatment, can reach 0.2% yield strength and 50%IACS or more of 100MPa or more
Or the conductivity of 45%IACS or more.
Copper alloy plate of the invention is added before being heated at high temperature to 650 DEG C or more of temperature by stamping, punching
Work, cutting or etching etc. are processed to the component of heat dissipation element.It is preferred that copper alloy plate has conveying and dress in the processing
The intensity being not easy to deform in unloading, and with the mechanical characteristic for processing and being not in failure and capable of carrying out.More specifically
Say that copper alloy plate of the invention preferably has 0.2% yield strength 150MPa or more, 5% or more elongation percentage, average crystal grain in ground
20 μm of diameter or less and excellent bendability (referring to aftermentioned embodiment).If the characteristic more than meeting, copper alloy
There is no problem for plate quenched.Such as solution treatment material, ageing treatment material, solution treatment material through cold rolling or ageing treatment material through cold
Roll etc., it can be used.
If average crystal grain diameter is higher than 20 μm, following problem, the i.e. processing due to being processed into when heat dissipation element can occur
(stamping, bending machining, Punching Technology, cutting, etching etc.), causes plate surface coarse, because punching or machining are formed
Burr occur or etching bring dimensional accuracy reduction etc..In addition, due to being heated at high temperature to 650 DEG C or more of temperature thereafter
Degree, leads to the further coarsening of crystal grain, and the flatness as heat dissipation element reduces.Therefore, it is being heated at high temperature to 650 DEG C or more
The average crystal grain diameter of plate surface measurement before temperature is preferably 20 μm hereinafter, more preferably 15 μm or less.
As it was earlier mentioned, the heat dissipation element processing copper alloy plate of the invention and manufacturing, if being heated at high temperature to 650 DEG C or more
Temperature, then soften.Heat dissipation element after high-temperature heating preferably has in conveying and handling when implementing ageing treatment again and does not allow
Easily-deformable intensity.For this purpose, the stage of water cooling is carried out after heating 30 minutes with 850 DEG C, preferably with 40MPa or more
0.2% yield strength.
The heat dissipation element manufactured using copper alloy plate of the invention, after ageing treatment, as needed, to improve corrosion resistant
As the main purpose, a part at least in outer surface forms Sn coating for corrosion and solderability.In Sn coating, including through electricity
What plating or chemical plating were formed, or after these platings, it is heated to the fusing point of Sn or less or fusing point or more and is formed.Sn is coating
Include Sn metal and Sn alloy in layer, as Sn alloy, other than Sn, as alloying element, can enumerate Bi, Ag, Cu, Ni,
More than one, add up to and contain 5 mass % or less among In and Zn.
Under Sn coating, it is capable of forming the substrate coating of Ni, Co or Fe etc..There is these substrate coating conduct to prevent
The function of the barrier of the diffusion of Cu or alloying element from base material, and prevent from scraping caused by the surface hardness because of increase heat dissipation element
The function of wound.Also Cu can be plated on the substrate coating, then after plating Sn, carries out being heated to the fusing point of Sn or less or fusing point
Above heat treatment and form Cu-Sn alloy-layer, become the three-decker of substrate coating, Cu-Sn alloy-layer and Sn coating.
Cu-Sn alloy-layer has the function of the barrier as the diffusion for preventing Cu or alloying element from base material, and prevents because increasing
The surface hardness of heat dissipation element causes the function of scratching.
In addition, the heat dissipation element manufactured using copper alloy plate of the invention, after ageing treatment, as needed, at least
A part in outer surface forms Ni coating.Ni coating has as the diffusion for preventing Cu or alloying element from base material
Barrier function, prevent because increase heat dissipation element surface hardness caused by scratch function and improve corrosion resistance function.
Next, for the composition of copper alloy plate of the invention, the case where being divided into without Sn and the case where containing Sn, are said
It is bright.
(copper alloy is free of the case where Sn)
In this case, in the composition of copper alloy, containing Fe:0.07~0.7 mass %, P:0.2 mass % is hereinafter, Fe
Ratio [Fe]/[P] of content [Fe] and the content [P] of P is 2~5, and surplus is made of Cu and the impurity that can not be kept away.As needed, energy
Enough containing Zn be 1.5 mass % or less but be free of 0 mass %, or/and containing Mn:0.1 mass % or less but without 0 mass %,
Mg:0.2 mass % or less but without 0 mass %, Si:0.2 mass % or less but be free of 0 mass %, Al:0.2 mass % or less
But without 0 mass %, Cr:0.2 mass % or less but without 0 mass %, Ti:0.1 mass % or less but without 0 mass % and
Zr:0.05 mass % or less but without 0 mass % one or more of, add up to 0.5% or less but without 0 matter
Measure %.Hereinafter, the addition reason for each element is illustrated.
Fe and p-shaped have the function of improving the intensity of the copper alloy plate after ageing treatment and conductivity at compound.But
It is that when Fe content is lower than 0.07 mass %, 0.2% yield strength after high-temperature heating and ageing treatment is lower than 100MPa.It is another
Aspect, if Fe content is higher than 0.7 mass %, the conductivity after high-temperature heating and ageing treatment is lower than 50%IACS.Therefore, Fe
Content is 0.07~0.7 mass %.The lower limit of Fe content is preferably 0.15 mass %, and the upper limit is preferably 0.65 mass %.At this
It is main to be precipitated without plastic processing when ageing treatment after solution treatment in the range of the Fe content of the copper alloy plate of invention
Fe-P compound.In contrast, the precipitate of Fe monomer is greatly decreased.
P reduces the oxygen amount for including in copper alloy by deoxidation, and having prevents from heating in hydrogeneous reducing atmosphere
The effect of hydrogen brittleness when heat dissipation element.In addition, the P of solid solution forms Fe-P compound and being heated to Precipitation Temperature, make copper
Intensity, heat resistance and the conductivity of alloy improve.But if the content of P is higher than 0.2 mass %, when carrying out hot rolling to ingot bar
It is 0.2 mass % that crackle, the processing after not can be carried out, therefore the upper limit value of P content, which occurs,.
For above-mentioned effect, the content needs of P are reached a certain level, and but then, are preferably helpless to containing for the P being precipitated
Amount is few as far as possible in the range of can prevent hydrogen brittleness.From this starting point, if the content (quality %) of Fe is [Fe], P's contains
When amount (quality %) is [P], it is in ratio [Fe]/[P] of the two in the range of 2~5.When [Fe]/[P] is lower than 2, to Fe-P
The formation of compound does not have helpful and the P of solid solution quantitative change more, if [Fe]/[P] is higher than 5, the quantitative change for the Fe being equally dissolved
It is more, no matter which kind of situation, all the conductivity of the copper alloy plate after ageing treatment cannot be made to reach 50%IACS or more.In addition,
For [Fe]/[P] lower than 2 or when being higher than 5, the Fe or P for being helpless to the formation of Fe-P compound become more, the ageing treatment of copper alloy plate
Intensity afterwards is unable to fully improve.The lower limit value of [Fe]/[P] is preferably 2.5, and more preferably 3.0, the upper limit value of [Fe]/[P] is excellent
It is selected as 4.5, more preferably 4.0.
Zn has the function of improving the resistance to thermally strippable of the resistance to thermally strippable of the solder of copper alloy plate and plating Sn, therefore basis
It needs to add.When heat dissipation element is inserted into semiconductor device, the case where solder in need, in addition, having after heat dissipation element manufacture
The case where carrying out plating Sn.In the manufacture of such heat dissipation element, it is suitble to use the copper alloy plate containing Zn.But if Zn
Content is higher than 1.5 mass %, then solder wettability reduces, and conductivity also reduces, therefore the content of Zn is 1.5 mass % or less.
The upper limit value of the content of Zn is preferably 0.7 mass % hereinafter, more preferably 0.5 mass % or less.On the other hand, Zn content is lower than
When 0.01 mass %, the improvement of resistance to thermally strippable is insufficient, and the content of Zn is preferably 0.01 mass % or more.The lower limit of Zn content
Value is more preferably 0.05 mass %, further preferably 0.1 mass %.
Mn, Mg, Si, Al, Cr, Ti, Zr have the function of that the intensity for making copper alloy and heat resistance improve, therefore as needed
Add its one or more.Even if Mn, Mg, Si and Al are allowed to contain on a small quantity, the conductivity of copper alloy can also reduced, because
This makes upper limit value, Mn:0.1 mass %, Mg:0.2 mass %, Si:0.2 mass % and Al:0.2 mass % respectively.Cr, Ti and
The field trash of the oxide system that several μm easy to form~several 10 μm or so of Zr, sulfide-based etc., can be in the folder by cold rolling
Gap is formed between sundries and base material, when the field trash is present in surface, reduces the corrosion resistance of copper alloy.Therefore, Cr,
The upper limit value of Ti and Zr is Cr:0.2 mass %, Ti:0.1 mass % and Zr:0.05 mass %.In addition, Mn, Mg, Si, Al,
Multiple element is included in copper alloy among Cr, Ti and Zr, if its total content is higher than 0.5 mass %, the conduction of copper alloy
Rate reduces.Therefore, total content of these elements is 0.5 mass % or less (being free of 0 mass %).On the other hand, these elements
The lower limit values of one or more kinds of total contents be preferably 0.01 mass %, more preferably 0.02 mass %, further
Preferably 0.03 mass %.
(copper alloy contains the case where Sn)
In this case, in the composition of copper alloy, containing point A (0.1,0.006) shown in FIG. 1, point B (0.5,0.006),
The Fe and Sn that point C (0.05,1.1), point D (0.05,0.05) (contain on boundary line) in the range of surrounding, with P:0.2 mass %
Hereinafter, surplus is made of Cu and the impurity that can not be kept away.Ratio [Fe]/[P] of the content [P] of the content [Fe] and P of Fe is 2~5.Root
It is 1.5 mass % or less (being free of 0 mass %) containing Zn according to needs, or/and (is free of 0 matter containing Mn:0.1 mass % or less
Measure %), Mg:0.2 mass % or less (be free of 0 mass %), Si:0.2 mass % or less (being free of 0 mass %), Al:0.2 matter
It measures % or less (being free of 0 mass %), Cr:0.2 mass % or less (being free of 0 mass %), Ti:0.1 mass % or less and (is free of 0 matter
One or more of measure %) and Zr:0.05 mass % or less (being free of 0 mass %), add up to 0.5 mass % or less
(being free of 0 mass %).
Fe and p-shaped have the function of improving the intensity of the copper alloy plate after ageing treatment and conductivity at compound.
If in the range of the content of Fe, Sn point A, B, C and D shown in Fig. 1 are surrounded, (0.2% bends the intensity after ageing treatment
Take intensity) it is 100MPa or more, and conductivity is 45%IACS or more.
The lower limit value of Fe content is preferably 0.07 mass %, more preferably 0.15 mass %.On the other hand, according to Fig. 1, Fe
The interdependent content depending on Sn of upper limit value, be Fig. 1 line segment BC the following value.In addition, set the content (quality %) of Fe as
[Fe] can be expressed from the next when the content (quality %) of Sn is [Sn] based on [Fe] of line segment BC and the relational expression of [Sn].
[Fe]=- 0.411 × [Sn]+0.502
For example, the content that the upper limit value of Fe content is 0.338 mass %, Sn is 0.2 when the content of Sn is 0.4 mass %
When quality %, the upper limit value of Fe content is 0.420 mass %.
The lower limit value of Sn content is preferably 0.01 mass %, more preferably 0.02 mass %, and upper limit value is preferably 0.5 matter
Measure %, more preferably 0.4 mass %.
About the effect and content of P and Zn and Mn, Mg, Si, Al, Cr, Ti and Zr, the case where being free of Sn with copper alloy phase
Together, it omits the description.
Copper alloy plate of the invention, for example, can be by hot rolling ingot bar after, 1 time or 2 times or more cold rolling and Re Chu is repeated
(ageing treatment) is managed to manufacture.Have 0.2% by the copper alloy plate that condition below manufactures using the copper alloy of the composition
Yield strength 150MPa or more, 5% or more elongation percentage and excellent bendability.In addition, after being heated 30 minutes with 850 DEG C,
0.2% yield strength with 40MPa or more, then after ageing treatment, with 100MPa or more 0.2% yield strength and
The conductivity of 50%IACS or more or 45%IACS or more.
Melting or casting can be carried out by the usual way of continuously casting or semi-continuous casting etc..In addition, as copper
Melting raw material is, it is preferable to use S, Pb, Bi, Se and As's is poor.It is further noted that be coated on the charcoal of molten alloyed copper
Red heat (dehydration), parent metal, waste material, sink, the drying of mold and deoxidation of melt etc., preferably reduction O and H.
For ingot bar, preferably progress homogenize process, temperature of the homogenize process preferably inside ingot bar reaches 800 DEG C
Afterwards, kept for 30 minutes or more.The retention time of homogenize process is more preferably 1 hour or more, further preferably 2 hours with
On.
After homogenize process, the temperature with 800 DEG C or more starts hot rolling.It is preferred that coarse not will form in hot rolling material
The mode of Fe or Fe-P precipitate terminates hot rolling in 600 DEG C or more of temperature, and thus temperature is carried out by the method for water cooling etc.
Chilling.If the chilling start temperature after hot rolling is lower than 600 DEG C, coarse Fe-P precipitate is formed, and tissue is easy to become uneven
It is even, the strength reduction of copper alloy plate (sheet).
After hot rolling, hot rolling material is cold-rolled to products thickness by (a), carries out ageing treatment, (b) for hot rolling material carry out cold rolling and
Ageing treatment, then it is cold-rolled to products thickness, or (c) carry out low-temperature annealing (recovery of ductility) after (b).
Ageing treatment (precipitation processing), to keep 0.5~10 hour item under 300~600 DEG C of heating temperature or so
Part carries out.When the heating temperature is lower than 300 DEG C, amount of precipitation is few, if being higher than 600 DEG C, precipitate is easy coarsening.Heating temperature
Lower limit be preferably 350 DEG C, the upper limit is preferably 580 DEG C.The retention time of ageing treatment is suitable for selection, according to heating temperature
It is carried out in the range of 0.5~10 time.The retention time, precipitation was insufficient at 0.5 hour or less, more than 10 hours, was precipitated
Amount is also saturation, and productivity reduces.The lower limit of retention time is preferably 1 hour, and more preferably 2 hours.
[embodiment 1]
The copper alloy (only comparative example 13 is fine copper) for casting composition shown in table 1~4, makes the casting of thickness 45mm respectively
Block.3 hours homogeneous heat treatments are carried out with 965 DEG C for each ingot bar, then carry out hot rolling and the hot rolling material as plate thickness 15mm, from
700 DEG C or more of temperature quenches (water cooling).After respectively grinding 1mm for the two sides of quenched hot rolling material, cold roughing to Target Board
Thick 0.6mm, keep with 500 DEG C 2 hours ageing treatments, then implements 50% final cold rolling, manufacture plate thickness 0.3mm's
Copper alloy plate.
[table 1]
[table 2]
[table 3]
[table 4]
Using obtained copper alloy plate as test material, by following main points, progress conductivity, mechanical characteristic, bending add
Each measurement of work and solder wettability is tested.
In addition, carrying out the displacement of Ar gas at room temperature after the obtained copper alloy plate of vacuum drawing and heating, in the temperature of plate
Water cooling after heating 30 minutes after degree reaches 850 DEG C, then with 500 DEG C of heating water cooling materials 2 hours (ageing treatment), respectively will
Resulting materials are used as each measurement test that conductivity and mechanical characteristic are carried out for test material.
Each test result is shown in table 1~4.
(measurement of conductivity)
The measurement of conductivity, according to the nonferrous materials conductivity measurement method of JIS-H0505 defined, to use
The four-terminal method of double bridge carries out.The size of test film is wide 15mm and long 300mm.
(mechanical characteristic)
From for test material, makes longitudinally rolling parallel direction and cut JIS5 tension test sheet, according to JIS-
Z2241 implements tension test, measures yield strength and elongation percentage.The tension that yield strength is comparable to permanent elongation 0.2% is strong
Degree.
(average crystal grain diameter)
From for test material, the square test film of long 30mm He width 30mm are cut, mirror surface is implemented to its surface (rolling surface)
After research, with by water 120 × 10- 6m3, hydrochloric acid 30 × 10- 6m3, ferric trichloride 10g constitute corrosive liquid be etched.With optics
The etched plate surface of micro- sem observation (100~400 times of multiplying power of observation), is acquired by the process of chopping of JISH0501-1986.
Cutting direction be and rolling direction direction at right angle.For same sample, average crystal grain diameter is acquired at 3, being averaged at 3
Average crystal grain diameter of the value (0.1 μm of digit rounds up) as the sample.
(bendability)
The measurement of bendability, it then follows the W bend test method for stretching copper association criterion JBMA-T307 defined is implemented.
From each test film for cutting wide 10mm, long 30mm in test material, using the fixture of R/t=0.2, carrying out G.W., (Good Way is (curved
Crankshaft is vertical with rolling direction)) and B.W. (Bad Way (bending axis is parallel with rolling direction)) bending.Then, 100 are utilized
Optical microscopy again, visually observing bending section, whether there are cracks, and the both sides of G.W. or B.W. are evaluated as there is no crackle
The either or both generation crackle of zero (qualification), G.W. or B.W. are evaluated as × (unqualified).
(solder wettability)
From each for extracting slat test film in test material, after dip coated nonactivated flux 1 second, the measurement of arc surfaced tin sticky method
The solder time.Solder is using the Sn-3 mass %Ag-0.5 mass %Cu for being maintained at 260 ± 5 DEG C, with impregnating speed
The experimental condition of 25mm/sec, impregnating depth 5mm and dip time 5sec are implemented.The solder time was in evaluation below in 2 seconds
It is excellent for solder wettability.In addition, the solder time is 2 seconds or less in addition to comparative example 10 and 24.
The copper alloy plate of embodiment 1~17 shown in table 1, composition of alloy meet regulation of the invention, with 850 DEG C of heating 30
Minute, then the intensity (0.2% yield strength) after progress ageing treatment is in 100MPa or more, and conductivity is 50%IACS
More than.
In contrast, the fine copper plate of the copper alloy plate of comparative example 1~12 and comparative example 13 shown in table 2, as shown below,
Certain characteristic is poor.
For comparative example 1 because Fe content is few, the intensity after ageing treatment is low.
Its [Fe]/[P] of comparative example 2~4 is high, even if after ageing treatment, the precipitation of Fe-P compound is also insufficient, timeliness
Treated, and conductivity is low.Treated that intensity is also low for comparative example 2 and 3 its timeliness.
For comparative example 5 because Fe content is superfluous, the conductivity after ageing treatment is low.
Comparative example 6 its P content is superfluous, and crackle occurs for when hot rolling, and the process after hot rolling not can be carried out.
Comparative example 12 is because Fe content is higher than 1.0%, Fe content surplus, and [Fe]/[P] is higher than 7, so after ageing treatment
Conductivity is lower than comparative example 5.
Comparative example 7 and 8 is because [Fe]/[P] is low, even if being helpless to the precipitation of Fe-P compound after ageing treatment
P be still dissolved, the conductivity after ageing treatment is low.
Comparative example 9 is because [Fe]/[P] is low, even if after ageing treatment, the precipitation of Fe-P compound is also few, intensity
It is low.
Its Zn content of comparative example 10 is superfluous, and the conductivity after ageing treatment is low, in addition, solder wettability is poor.
In comparative example 11, the content of other elements is superfluous, and the conductivity after ageing treatment is low.
Comparative example 13 is existing fine copper plate, and conductivity is high, but intensity is low after ageing treatment.
The copper alloy plate of embodiment 18~38 shown in table 3, composition of alloy meet regulation of the invention, are heated with 850 DEG C
30 minutes, then the intensity after ageing treatment (0.2% yield strength) was 100MPa or more, and conductivity is 45%IACS
More than.
In contrast, the copper alloy plate of comparative example 14~24 shown in table 4, as shown below, certain characteristic is poor.
Comparative example 14 is because the content of Fe and Sn is detached from the range (Fe content is few) of the ABCD of Fig. 1, after ageing treatment
Intensity it is low.
Comparative example 15~17 is because the content of Fe and Sn is detached from the range (Sn content is superfluous) of the ABCD of Fig. 1, timeliness
Treated, and conductivity is low.
Comparative example 18~20 is because the content of Fe and Sn is detached from the range (Fe content is few) of the ABCD of Fig. 1, at timeliness
Intensity after reason is low.
Comparative example 21 is because [Fe]/[P] is low, even if after ageing treatment, being helpless to the P of the precipitation of Fe-P compound
It is still dissolved, the conductivity after ageing treatment is low.
Comparative example 22 its P content is superfluous, and crackle occurs for when hot rolling, and the process after hot rolling not can be carried out.
Comparative example 23 is because [Fe]/[P] is high, and the Fe for being helpless to the precipitation of Fe-P compound is dissolved, after ageing treatment
Conductivity it is low.
Its Zn content of comparative example 24 is superfluous, and solder wettability is poor.
[embodiment 2]
For aliquot part among copper alloy plate shown in table 1~4 (embodiment 1,3,19 and 24 and comparative example 1,5,14
With 15), after carrying out vacuum drawing at room temperature, carries out the displacement of Ar gas and heat, the temperature of plate heats after reaching 1000 DEG C
Water cooling after 30 minutes, then 2 hours (ageing treatment) is heated for the water cooling material with 500 DEG C, using the copper alloy plate as examination
Material is tested by each measurement that method described in embodiment 1 carries out conductivity and mechanical characteristic.It is as the result is shown in table 5.
[table 5]
As shown in table 5, embodiment 1,3,19 and 24 are heated 30 minutes with 1000 DEG C, then strong after ageing treatment
Spending (0.2% yield strength) is 100MPa or more, and conductivity is 50%IACS or more (when being free of Sn) or 45%IACS or more
(when containing Sn).If 30 minutes will be heated, then (the table 1 and 3 of the measurement result after ageing treatment at each numerical value and 850 DEG C
Reference) compare, then numerical value does not have notable difference.
On the other hand, comparative example 1,5,14 and 15 with 1000 DEG C heat 30 minutes, then the intensity after ageing treatment or
One or both of conductivity is poor.
The disclosure of the specification includes mode below.
Mode 1:
A kind of heat dissipation element copper alloy plate, which is characterized in that containing Fe:0.07~0.7 mass %, P:0.2 mass %
Hereinafter, ratio [Fe]/[P] of the content [Fe] of Fe and the content [P] of P is 2~5, surplus is made of Cu and the impurity that can not be kept away, with
850 DEG C of water coolings after heating 30 minutes, then 0.2% yield strength after ageing treatment is 100MPa or more, and conductivity is
50%IACS or more, a part for manufacturing the process of heat dissipation element includes the step and ageing treatment for being heated to 650 DEG C or more.
Mode 2:
A kind of heat dissipation element copper alloy plate, which is characterized in that contain point A (0.1,0.006) shown in FIG. 1, point B
The Fe and Sn that (0.5,0.006), point C (0.05,1.1), point D (0.05,0.05) (contain on boundary line) in the range of surrounding, and
P:0.2 mass % is hereinafter, ratio [Fe]/[P] of the content [P] of the content [Fe] and P of Fe is 2~5, and surplus is by Cu and unavoidably
Impurity constitute, with 850 DEG C heat 30 minutes after water cooling, then 0.2% yield strength after ageing treatment be 100MPa with
On, conductivity be 45%IACS or more, manufacture the process of heat dissipation element a part include be heated to 650 DEG C or more process and
Ageing treatment.
Mode 3:
According to heat dissipation element copper alloy plate described in mode 1, which is characterized in that be also 1.5 mass % or less containing Zn
(being free of 0 mass %).
Mode 4:
According to the heat dissipation element copper alloy plate of mode 1 or 3, which is characterized in that also containing add up to 0.5 mass % with
Under the Mn:0.1 mass % or less (being free of 0 mass %) of (be free of 0 mass %), Mg:0.2 mass % or less (being free of 0 mass %),
Si:0.2 mass % or less (being free of 0 mass %), Al:0.2 mass % or less (being free of 0 mass %), Cr:0.2 mass % or less
(be free of 0 mass %), Ti:0.1 mass % or less (being free of 0 mass %) and Zr:0.05 mass % or less (without 0 mass %) it
One or more of.
Mode 5:
According to heat dissipation element copper alloy plate described in mode 2, which is characterized in that also containing Zn be 1.5 mass % or less (no
Containing 0 mass %).
Mode 6:
The heat dissipation element copper alloy plate according to mode 2 or 5, which is characterized in that also contain and add up to 0.5 mass %
Mn:0.1 mass % or less (being free of 0 mass %), the Mg:0.2 mass % or less for (being free of 0 mass %) below (are free of 0 matter
Measure %), Si:0.2 mass % or less (be free of 0 mass %), Al:0.2 mass % or less (being free of 0 mass %), Cr:0.2 matter
It measures % or less (being free of 0 mass %), Ti:0.1 mass % or less (being free of 0 mass %) and Zr:0.05 mass % or less and (is free of 0
One or more of quality %).
Mode 7:
The heat dissipation element copper alloy plate according to any one of mode 1,3 or 4, which is characterized in that heated with 850 DEG C
The average crystal grain diameter of the plate surface measured in plate before 30 minutes is 20 μm or less.
Mode 8:
The heat dissipation element copper alloy plate according to any one of mode 2,5 or 6, which is characterized in that heated with 850 DEG C
The average crystal grain diameter of the plate surface measured in plate before 30 minutes is 20 μm or less.
Mode 9:
A kind of heat dissipation element, which is characterized in that the heat dissipation element copper alloy as described in any one of mode 1,3,4 or 7
Plate is constituted, and is precipitated with Fe-P compound, the conduction of 0.2% yield strength and 50%IACS or more with 100MPa or more
Rate.
Mode 10:
A kind of heat dissipation element, which is characterized in that the heat dissipation element copper alloy as described in any one of mode 2,5,6 or 8
Plate is constituted, and is precipitated with Fe-P compound, the conduction of 0.2% yield strength and 45%IACS or more with 100MPa or more
Rate.
Mode 11:
The heat dissipation element according to mode 9 or 10, which is characterized in that Sn quilt is formed at least part of outer surface
Coating.
Mode 12:
The heat dissipation element according to mode 9 or 10, which is characterized in that it is coating that at least part of outer surface is formed with Ni
Layer.
The application is with the Japanese Patent Application with the applying date on March 23rd, 2015, patent application 2015-
No. 058957 and the applying date be the Japanese Patent Application on October 12nd, 2015, patent application the 2015-201655th be
The claim of priority of basis application.Patent application No. 2015-058957 and patent application the 2015-201655th passes through ginseng
According to and be incorporated into this specification.
Claims (14)
1. a kind of heat dissipation element copper alloy plate, which is characterized in that containing Fe:0.07~0.7 mass %, P:0.2 mass % with
Under, ratio [Fe]/[P] of the content [P] of the content [Fe] and P of Fe is 2.55~5, and surplus is made of Cu and the impurity that can not be kept away,
Also, with 850 DEG C heat 30 minutes before, average crystal grain diameter be 20 μm hereinafter, with 850 DEG C heat 30 minutes after water cooling, connect
0.2% yield strength after ageing treatment be 100MPa or more, conductivity is 50%IACS or more, manufactures heat dissipation element
A part of process includes the step and ageing treatment for being heated to 650 DEG C or more.
2. a kind of heat dissipation element copper alloy plate, which is characterized in that in the content for counting Fe using quality % as horizontal axis, the content of Sn is
When the longitudinal axis, containing thering is point A (0.1,0.006), point B (0.5,0.006), point C (0.05,1.1), point D (0.05,0.05) to be surrounded
Hereinafter, the ratio of the content [P] of the content [Fe] and P of Fe in range and containing the Fe and Sn and P:0.2 mass % on boundary line
[Fe]/[P] is 2~5, and surplus is made of Cu and inevitable impurity, also, before being heated 30 minutes with 850 DEG C, average crystalline substance
Grain diameter be 20 μm hereinafter, with 850 DEG C heat 30 minutes after water cooling, then 0.2% yield strength after ageing treatment be
100MPa or more, conductivity are 45%IACS or more, and a part for manufacturing the process of heat dissipation element includes to be heated to 650 DEG C or more
The step of and ageing treatment.
3. heat dissipation element copper alloy plate according to claim 1, which is characterized in that also containing Zn be 1.5 mass % with
Down but be free of 0 mass %.
4. heat dissipation element copper alloy plate according to claim 1, which is characterized in that also containing total 0.5 mass % with
Mn:0.1 mass % or less lower but without 0 mass % but without 0 mass %, Mg:0.2 mass % or less but without 0 mass %,
Si:0.2 mass % or less but without 0 mass %, Al:0.2 mass % or less but be free of 0 mass %, Cr:0.2 mass % or less
But without 0 mass %, Ti:0.1 mass % or less but without 0 mass % and Zr:0.05 mass % or less but without 0 mass % it
One or more of.
5. heat dissipation element copper alloy plate according to claim 3, which is characterized in that also containing total 0.5 mass % with
Mn:0.1 mass % or less lower but without 0 mass % but without 0 mass %, Mg:0.2 mass % or less but without 0 mass %,
Si:0.2 mass % or less but without 0 mass %, Al:0.2 mass % or less but be free of 0 mass %, Cr:0.2 mass % or less
But without 0 mass %, Ti:0.1 mass % or less but without 0 mass % and Zr:0.05 mass % or less but without 0 mass % it
One or more of.
6. heat dissipation element copper alloy plate according to claim 2, which is characterized in that also containing Zn be 1.5 mass % with
Down but be free of 0 mass %.
7. heat dissipation element copper alloy plate according to claim 2, which is characterized in that also contain and add up to 0.5 mass %
Below but is free of the Mn:0.1 mass % or less of 0 mass % but is free of 0 mass %, Mg:0.2 mass % or less but is free of 0 matter
Measure %, Si:0.2 mass % or less but without 0 mass %, Al:0.2 mass % or less but without 0 mass %, Cr:0.2 mass %
Below but without 0 mass %, Ti:0.1 mass % or less but without 0 mass % and Zr:0.05 mass % or less but be free of 0 matter
One or more of amount %.
8. heat dissipation element copper alloy plate according to claim 6, which is characterized in that also containing total 0.5 mass % with
Mn:0.1 mass % or less lower but without 0 mass % but without 0 mass %, Mg:0.2 mass % or less but without 0 mass %,
Si:0.2 mass % or less but without 0 mass %, Al:0.2 mass % or less but be free of 0 mass %, Cr:0.2 mass % or less
But without 0 mass %, Ti:0.1 mass % or less but without 0 mass % and Zr:0.05 mass % or less but without 0 mass % it
One or more of.
9. a kind of heat dissipation element, which is characterized in that the heat dissipation element as described in any one of claim 1,3,4 or 5 is closed with copper
Golden plate is constituted, and is precipitated with Fe-P compound, has 0.2% yield strength of 100MPa or more and leading for 50%IACS or more
Electric rate.
10. a kind of heat dissipation element, which is characterized in that the heat dissipation element as described in any one of claim 2,6,7 or 8 is closed with copper
Golden plate is constituted, and is precipitated with Fe-P compound, has 0.2% yield strength of 100MPa or more and leading for 45%IACS or more
Electric rate.
11. heat dissipation element according to claim 9, which is characterized in that be formed with Sn at least part of outer surface
Coating.
12. heat dissipation element according to claim 9, which is characterized in that be formed with Ni at least part of outer surface
Coating.
13. heat dissipation element according to claim 10, which is characterized in that be formed with Sn at least part of outer surface
Coating.
14. heat dissipation element according to claim 10, which is characterized in that be formed with Ni at least part of outer surface
Coating.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-058957 | 2015-03-23 | ||
| JP2015058957 | 2015-03-23 | ||
| JP2015201655A JP6031576B2 (en) | 2015-03-23 | 2015-10-12 | Copper alloy plate for heat dissipation parts |
| JP2015-201655 | 2015-10-12 | ||
| PCT/JP2016/058122 WO2016152648A1 (en) | 2015-03-23 | 2016-03-15 | Copper alloy sheet for heat dissipating component and heat dissipating component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107429322A CN107429322A (en) | 2017-12-01 |
| CN107429322B true CN107429322B (en) | 2019-12-03 |
Family
ID=57132413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680017424.6A Expired - Fee Related CN107429322B (en) | 2015-03-23 | 2016-03-15 | Heat dissipation element copper alloy plate and heat dissipation element |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6031576B2 (en) |
| KR (1) | KR101979531B1 (en) |
| CN (1) | CN107429322B (en) |
| TW (1) | TWI605139B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6151813B1 (en) * | 2016-03-23 | 2017-06-21 | 株式会社神戸製鋼所 | Vapor chamber manufacturing method |
| JP6762333B2 (en) * | 2018-03-26 | 2020-09-30 | Ｊｘ金属株式会社 | Cu-Ni-Si based copper alloy strip |
| TWI716781B (en) * | 2018-12-04 | 2021-01-21 | 廣州力及熱管理科技有限公司 | A wick structure component |
| JP6878541B2 (en) * | 2019-09-25 | 2021-05-26 | Ｊｘ金属株式会社 | Titanium-copper alloy plate for vapor chamber and vapor chamber |
| KR20240107676A (en) | 2022-12-30 | 2024-07-09 | 이구산업 주식회사 | Copper alloy, and the method of manufacturing the copper alloy |
| CN116970836B (en) * | 2023-07-27 | 2024-06-14 | 中国兵器科学研究院宁波分院 | High-strength tellurium copper alloy material and preparation method thereof |
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| CN101001965A (en) * | 2004-08-17 | 2007-07-18 | 株式会社神户制钢所 | Copper alloy plate for electric and electronic parts having bending workability |
| CN101522926A (en) * | 2006-10-02 | 2009-09-02 | 株式会社神户制钢所 | Copper alloy plate for electrical and electronic components |
| CN101525702A (en) * | 2008-03-07 | 2009-09-09 | 株式会社神户制钢所 | Copper alloy sheet and QFN package |
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| JPS57192238A (en) * | 1981-05-21 | 1982-11-26 | Furukawa Electric Co Ltd:The | Copper alloy useful as fin for radiator of automobile |
| JPH0635633B2 (en) * | 1986-10-29 | 1994-05-11 | 株式会社神戸製鋼所 | Copper alloy for electric and electronic parts and method for producing the same |
| JPH09296237A (en) * | 1996-04-28 | 1997-11-18 | Nikko Kinzoku Kk | Metallic substrate material for semiconductor packaging |
| JP2001326308A (en) * | 2000-05-15 | 2001-11-22 | A & A Kenkyusho:Kk | Skive heat radiation member |
| JP2003277853A (en) | 2002-03-26 | 2003-10-02 | Dowa Mining Co Ltd | Copper alloy for heat spreader |
| JP4057436B2 (en) * | 2003-01-31 | 2008-03-05 | Ｄｏｗａホールディングス株式会社 | Copper base alloy and heat sink material using the copper base alloy |
| JP4112602B2 (en) | 2005-09-01 | 2008-07-02 | 株式会社渕上ミクロ | heat pipe |
| JP4878317B2 (en) | 2007-03-22 | 2012-02-15 | 株式会社コベルコ マテリアル銅管 | Copper tube made of copper or copper alloy |
| JP6176433B2 (en) | 2013-01-10 | 2017-08-09 | 株式会社Ｗｅｌｃｏｎ | Vapor chamber |
| JP5467163B1 (en) * | 2013-03-26 | 2014-04-09 | Ｊｘ日鉱日石金属株式会社 | Copper alloy plate, heat dissipating electronic component comprising the same, and method for producing copper alloy plate |
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2015
- 2015-10-12 JP JP2015201655A patent/JP6031576B2/en not_active Expired - Fee Related
-
2016
- 2016-03-15 CN CN201680017424.6A patent/CN107429322B/en not_active Expired - Fee Related
- 2016-03-15 KR KR1020177030337A patent/KR101979531B1/en not_active Expired - Fee Related
- 2016-03-21 TW TW105108673A patent/TWI605139B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101001965A (en) * | 2004-08-17 | 2007-07-18 | 株式会社神户制钢所 | Copper alloy plate for electric and electronic parts having bending workability |
| CN101522926A (en) * | 2006-10-02 | 2009-09-02 | 株式会社神户制钢所 | Copper alloy plate for electrical and electronic components |
| CN101525702A (en) * | 2008-03-07 | 2009-09-09 | 株式会社神户制钢所 | Copper alloy sheet and QFN package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016180174A (en) | 2016-10-13 |
| KR20170125986A (en) | 2017-11-15 |
| CN107429322A (en) | 2017-12-01 |
| KR101979531B1 (en) | 2019-05-16 |
| TWI605139B (en) | 2017-11-11 |
| TW201704483A (en) | 2017-02-01 |
| JP6031576B2 (en) | 2016-11-24 |
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