CN107393652A - A kind of yttrium system superconducting tape with sealing joint in low-resistance and preparation method thereof - Google Patents
A kind of yttrium system superconducting tape with sealing joint in low-resistance and preparation method thereof Download PDFInfo
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- CN107393652A CN107393652A CN201710405944.0A CN201710405944A CN107393652A CN 107393652 A CN107393652 A CN 107393652A CN 201710405944 A CN201710405944 A CN 201710405944A CN 107393652 A CN107393652 A CN 107393652A
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- yttrium system
- yttrium
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- 229910052727 yttrium Inorganic materials 0.000 title claims abstract description 139
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 title claims abstract description 139
- 238000007789 sealing Methods 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 238000009792 diffusion process Methods 0.000 claims abstract description 68
- 230000004888 barrier function Effects 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 20
- 238000005253 cladding Methods 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 35
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 239000007779 soft material Substances 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011133 lead Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000011135 tin Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910017532 Cu-Be Inorganic materials 0.000 claims description 3
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 239000002887 superconductor Substances 0.000 abstract description 17
- 238000005476 soldering Methods 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 9
- 210000001503 joint Anatomy 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 230000032798 delamination Effects 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000007735 ion beam assisted deposition Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003746 yttrium Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/222—Sheathing; Armouring; Screening; Applying other protective layers by electro-plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
The invention provides a kind of yttrium system superconducting tape with sealing joint in low-resistance, including the yttrium system superconductive long strip (1) of belt lacing and cladding interstitital texture (2);The yttrium system superconductive long strip (1) of the belt lacing includes multistage yttrium system superconduction short strip (101), is connected between adjacent two sections of yttrium systems superconduction short strip by sliver diffusion method joint (11);The cladding interstitital texture (2) is hermetically wrapped in the outside of the yttrium system superconductive long strip of belt lacing.A kind of preparation method with the yttrium system superconducting tape of sealing joint in low-resistance is provided simultaneously.The welding manner that the present invention is combined using sliver diffusion weldering and soldering, overcome the prejudice understanding of superconduction bound pair sliver diffusion weldering, high performance superconductor joint is effectively produced, while solve sliver diffusion weldering in the prior art not being directed to the length of volume two with the technical barrier for carrying out weld.
Description
Technical field
The present invention relates to superconductor technical field, surpasses more particularly, to a kind of yttrium system with sealing joint in low-resistance
Conduction band material and preparation method thereof.
Background technology
1st, it is overall to introduce
The Ka Molinangnasi of Univ Leiden Netherlands in 1911 has been taught since laboratory finds superconducting phenomenon first, is surpassed
Lead material and its application always one of most active research frontier of contemporary science and technology.Between the past more than ten years, with
The research rapid development of superconducting power apparatus based on high-temperature superconductor, in superconducting energy storage, superconducting motor, hyperconductive cable, superconduction limit
Flow the fields such as device, superconducting transformer, super-conductive magnetic suspension, nuclear magnetic resonance and obtain notable achievement.High-temperature superconductor band be divided into bismuth system and
Yttrium system.Bismuth-system superconductor is first generation high temperature superconducting materia, also referred to as BSCCO superconductors;Yttrium series superconducting material is that second generation high temperature surpasses
Lead material, also referred to as YBCO or ReBCO superconductors.
Second-generation high-temperature superconductor using ReBCO as material, also referred to as coating conductor, because it has strong current-carrying energy
Power, high magnetic field performance and low material cost, possesses good application prospect in various fields such as medical treatment, military affairs, the energy.
Second-generation high-temperature superconductor, because it is hard and crisp in itself as the ReBCO of superconduction current-carrying core, so being usually
The technique productions of multilayer coating film are used on nickel-based alloy substrate, so being known as coating conductor again.Second generation hts band
Material is typically made up of base band, cushion (transition zone), superconducting layer and protective layer.The effect of metallic substrates be provided for band it is excellent
Good mechanical performance.On the one hand the effect of transition zone is to prevent superconducting layer from the phase counterdiffusion between element occurring with metallic substrates, separately
The template that the transition zone of one side the top need to provide for the epitaxial growth of superconducting layer, improve YBCO crystal grain arrangement quality.System
The standby excellent coating conductor of superconductivity is, it is necessary to which superconducting layer has consistent biaxial texture.Biaxial texture refers to crystal grain in a/b axles
There is almost consistent arrangement with c-axis (c-axis is perpendicular to a/b faces) both direction.Because ybco film is in the row of a/b direction of principal axis
Row degree (texture in face) relative difficult is realized, and texture is poor in face can seriously reduce superconductivity.Therefore YBCO is needed to surpass
Leading film has biaxial texture and is matching the transition zone Epitaxial growth of lattice.Preparation realizes that biaxial texture has two kinds of masters
The technology path of stream, one kind are rolling auxiliary biaxial texture baseband technologies, and another kind is ion beam assisted deposition.ReBCO
Superconducting layer prepare common technique be divided into it is a variety of, have pulsed laser deposition, metal-organic chemical vapor deposition equipment, reaction coevaporation
Deng.Protective layer is primarily used to protect superconduction film layer, the typically silver layer in superconducting tape surface plating 1-5um.Purely by silver-plated
The superconducting tape of protection can not meet the performance of actual band application, especially electricity and terms of mechanics.Two kinds of generally use
Method carries out protection processing, to lift band performance.The first is that copper facing is strengthened, i.e., is plated on silver-plated superconducting tape surface
1-80um processed layers of copper;It is for second that encapsulation is strengthened, i.e., with materials such as stainless steel, brass or red coppers, with the mode pair of soldering
Superconducting tape carries out overall parcel.
Due to being limited by production scale and preparation technology, it is still one to prepare high quality km level single strips at present
Difficult work.But a large-scale superconductor applications equipment needs the band of dozens or even hundreds of kilometer, therefore, by multistage list
Root band, which connects integral superconducting joint technique, has important practical value.Generally there are a large amount of joints, joint in a device
As most weak point, the quality of its performance decides the performance of final superconductor applications equipment.
Have to the joint of yttrium system superconducting tape claimed below:1st, requiring the electrical property of joint will be got well, including connection resistance is use up
May be small, anti-conveyance capacity is eager to excel.Small connection resistance can reduce superconducting device caloric value in cold operation, reduce refrigeration
Amount, it is most important that reduce due to influence of the local joule to the stability of a system caused by high connection resistance, anti-conveyance capacity is strong,
The robustness of joint can be increased.2nd, requiring the mechanical performance of joint will get well, the tensile stress of joint, delamination stress, turn
The parameters such as radius should try one's best unanimously, and close to the parameter of script band, can so improve the stability of plant running.3rd, require
Repeatability, reliability, the uniformity of joint will get well.4th, require that joint area thickness change is small, it is contemplated that in subsequent applications such as
During coiling, the mutation of thickness can be that coil turn-to-turn produces gap, influence superconducting coil performance.5th, require that the connection of joint can
Think joint form.Joint is divided into bridge-type joint and lap joint, it is contemplated that yttrium system superconductive tape asymmetry, connects face-to-face
Head resistance ratio connects the small 2-3 order of magnitude, it is necessary to which band welds face-to-face in face of backing run.Lap joint i.e. welding face-to-face, bridge joint
Joint, which can be regarded as, has been continuously finished two lap joints, can also regard the series connection of two lap joints as.If bridge joint
Identical with the lap joint gross area, single lap joint area is the half of pure lap joint area in bridge joint, bridge joint
The connection resistance of joint is 4 times of lap joint.6th, require that joint technique can apply between hundred meter levels or the long band of kilometer level
Connection.
The weld technology of second-generation high-temperature superconductor mainly has soldering, the class of sliver diffusion method two.
2nd, prior art strengths and weaknesses analysis
(1) manual welding strengths and weaknesses analysis
American Superconductor Corp. (AMSC) passes through standard for different types of encapsulation band and different types of lead-free brazing
Band cleaning, prewelding, scaling powder use, temperature control, solder coat, pressure application, unnecessary scolding tin and the scaling powder of change remove
Flow, resistance value can be stably obtained and be tens of to hundreds of n Ω (optic zone material encapsulated type and connecting length) joint, and can ensure that
Band performance is undamped after brazing.Band wherein is encapsulated for most common red copper, passes through about 5 × 100mm2 solder side
Product, its joint resistance can be stablized in 20n Ω or so.
The advantages of manual soldering, is:Maturation, technique are simple.
The shortcomings that manual soldering, is:
1st, the thickness change of joint area is larger, the integral thickness (100um-400um) of band generally after encapsulation reinforcement,
The influence of turn-to-turn out-of-flatness can be brought during later stage band coiling.
2nd, dependent on manual welding, the fluctuation of connection resistance is very big, and uniformity stability is poor.
3rd, manual welding is relied on, has and is difficult to further reduce joint resistance by continuing increase bonding area.
(2) sliver diffusion welding strengths and weaknesses analysis
2006, the Kato in Japan internationality superconductor technology research center et al. developed a kind of by the mutual of silver-colored protective layer
Spread the technology that 2 second-generation high-temperature superconductors link together, i.e., so-called " sliver diffusion method ".Its core element is
Uniformity and Technology for Heating Processing of the mould to assembling band pressure applied distribution.Pressurization and Technology for Heating Processing by optimization,
Kato et al. is prepared for the band joint that resistance is less than 16n Ω by the join domain that area is only 2 × 20mm2.
In CN104671818B diffusion welding (DW)s silver layer connection YBC0 high-temperature superconducting thin film band techniques, detailed implementation steps are also have recorded.
The advantages of sliver diffusion welds is:
1st, the connection resistance made under unit area is relatively low, because the interface resistance introduced without layers of copper and encapsulated layer;
2nd, the thickness change of joint area is relatively small, the thickness of strip (30um-100um) after generally silver-plated protection.
The shortcomings that sliver diffusion welds is:
1st, sliver diffusion joint does not have solder, relies on the connection of the thermal diffusion between silver and silver and is easy to tear, delamination stress,
Shearing resistance shearing stress is smaller;
2nd, sliver diffusion joint is in crimping, it is easy to major part face when inequality causes to weld because joint area is under pressure
Long-pending sliver diffusion failure, so that the resistance of joint becomes big, delamination stress is smaller, and joint is easier to tear or is damaged;
3rd, the method and apparatus of open reports all at present are tested only for short sample joint, can not be directed to the long bands of volume two, be entered
Row weld.
The prior art prejudice of sliver diffusion welding:
Based on 3 shortcomings of above-mentioned sliver diffusion welding, therefore the technical staff of superconduction industry thinks that sliver diffusion joint is current
Specific superconducting tape engineer applied field can not be applied to.Further, in all superconductor applications being currently known, do not have
Using the first technology of sliver diffusion joint.
(3) closest to prior art strengths and weaknesses analysis
Closest prior art is to invent as follows with the present invention:Notification number is CN104167487B, and patent name is
Yttrium system superconducting tape that contact resistance is distributed and preparation method thereof, device, this prior patent discloses a kind of soldering and added some points weldering
Method, the superconducting tape of a patch is welded in above joint.At the same time, the encapsulation carried out to this joint design, makes this
The electric property and mechanical property of joint have further raising.
The advantages of this method, is:
1st, the sealed in unit of automation is relied on, can further reduce joint resistance by continuing increase bonding area, most
It is low to be reduced to 1-8n Ω.
2nd, equipment making joint is relied on, joint repeatability and yield rate are high, and stable performance is homogeneous.
3rd, the encapsulation of butt joint is relied on, the mechanical strength of joint is higher, especially tensile stress and delamination stress.
4th, the encapsulation of butt joint is relied on, the anti-conveyance capacity of joint is strong.
5th, the thickness change of joint area is relatively small, the thickness of strip (100um of 30um mono-) after generally silver-plated protection.
The shortcomings that this method, is:
1st, 1 electrical pads therein in manufacturing process, formed when being switched in weld and melt core, inevitably made
The physical characteristic of the point turns into fragility, in the band of flexibility, introduces a brittle point, makes the radius of turn performance of band
It is deteriorated.
2nd, the introducing of fragility point, band is added in the later stage in use, damaging the risk of band under rapid heat cycle environment.
3rd, the joint can only make bridge-type joint form, and same area resistance is high 4 times, and same resistance is, it is necessary to sacrifice 4
Area again.
4th, in the patent of invention, although describe " using the present invention, can the superconducting tape of endless is made, and superconduction
Countless multiple joints can be included inside band ".But bottleneck in practical application be present:Find, to make in actual R&D process
Make the superconducting tape of endless, and it is extremely difficult that countless multiple joints can be included inside superconducting tape.Reason is first
During making joint, it is ensured that the packaging process of script band is continuous, and the band encapsulated out is good.Due to encapsulating
Require that band continuously pulls out from tin stove in journey, it is impossible to pause, if a large amount of tin can be left in script encapsulation strip surface by pausing
Slag causes to encapsulate band layering, can so damage encapsulation band, if band damages, makes joint with regard to meaningless
.So in the case of upper cladding band and superconducting tape continuously motion, dynamically burn-on benefit in upper cladding band internal point
Fourth, simultaneously because the length of patch and the several orders of magnitude of band overall length difference, patch position is accurately found into can make
The superconducting tape of endless, and can include countless multiple most important restriction conditions of joint inside superconducting tape.
Therefore the superconducting tape of endless can not be accomplished at present, and countless multiple joints can be included inside superconducting tape, it is public
The method and apparatus for opening report are only capable of making short sample joint, and this also turns into this area technical barrier urgently to be resolved hurrily.
The content of the invention
In view of above-mentioned background, in place of solving the shortcomings of the prior art, while also overcome existing technical staff and recognize
The technology prejudice in superconducting tape engineer applied field is cannot be used for for sliver diffusion joint, there is provided one kind is with sealing joint in low-resistance
Yttrium system superconducting tape and preparation method thereof, for yttrium based high-temperature superconductive strip, the weldering being combined using sliver diffusion weldering and soldering
Mode is connect, has effectively produced high performance superconductor joint.
What the present invention was achieved through the following technical solutions.
According to the first aspect of the invention, there is provided a kind of yttrium system superconducting tape with sealing joint in low-resistance, including
The yttrium system superconductive long strip 1 and cladding interstitital texture 2 of belt lacing;The yttrium system superconductive long strip 1 of the belt lacing surpasses including multistage yttrium system
Short strip 101 is led, is connected between adjacent two sections of yttrium systems superconduction short strip by sliver diffusion method joint 11;The cladding interstitital texture 2 is close
Feud is wrapped in the outside of the yttrium system superconductive long strip of belt lacing, to prevent that it is described with sealing joint yttrium in low-resistance that refrigerant from penetrating into
It is its superconductivity of the internal influence of superconducting tape 1.
Preferably, the length of the cladding interstitital texture 2 is more than 20 meters.
Preferably, the sliver diffusion method joint 11 uses sliver diffusion method, is prepared by way of overlapping or bridging.
Preferably, in overlap joint, the YBCO faces of two sections of adjacent yttrium system superconduction short strip 101 are oppositely arranged, in bridge joint, two sections
The YBCO faces 1011 of adjacent yttrium system superconduction short strip 101 and the YBCO faces 1011 of bridge joint superconduction patch band 102 are oppositely arranged.
Preferably, the junction of the yttrium system superconduction short strip is provided with soft metal thin slice 103, it is therefore an objective to by improving band
Crimping contact, it is final to reduce band contact resistance.
Preferably, the soft metal thin slice 103 includes:Any one in platinum, silver, gold or any multiple combinations.
Preferably, the sliver diffusion method is pressurizeed heat-treating methods in atmosphere using electric furnace 305.
Preferably, the cladding interstitital texture 2 includes clad 13 and the weldering that is electrically connected under clad 12, metal on metal
Connect metal level 14;The yttrium system superconductive long strip of the belt lacing is arranged on metal under clad and metal between clad, described
Clad between clad and the yttrium system superconductive long strip of belt lacing and under the yttrium system superconductive long strip of belt lacing and metal on metal
Between be filled with electric connection weld metal layers.
Preferably, red copper, brass, copper alloy, stainless is respectively adopted in clad 13 under clad 12, metal on the metal
Any one in steel, aluminium, Cu-Be alloys, Cu-Ni alloys or any a variety of combination.
Preferably, the width of clad 13 is respectively greater than the yttrium system of belt lacing and surpassed under clad 12, metal on the metal
Long band 1 is led, width is more than 5%-30%.
Preferably, the electric connection weld metal layers 14 using melting temperature below 280 DEG C, resistivity is in 50u Ω
Any of below cm indium, silver, tin, copper, zinc, lead, nickel, cadmium appoint a variety of alloy materials.
According to the second aspect of the invention, there is provided a kind of preparation with the yttrium system superconducting tape of sealing joint in low-resistance
Method, comprise the following steps:
Step S1, by multistage yttrium system superconduction short strip 101, make sliver diffusion method joint 11 with sliver diffusion legal system one by one, make its into
For the yttrium system superconductive long strip 1 of belt lacing;
Step S2, copper facing protection is carried out to the yttrium system superconductive long strip 1 of belt lacing, copper electroplating layer thickness is 1um-20um;
Step S3, by clad 13 under clad on metal 12, the yttrium system superconductive long strip 1 of belt lacing, metal according to position
Relation is sent into the preparation facilities equipped with liquid electric connection welding metal material, by extrusion forming, is formed to have and is wrapped on metal
Clad 13 and electric connection weld metal layers 14 with low-resistance under coating 12, the yttrium system superconductive long strip 1 of belt lacing, metal
The yttrium system superconducting tape of sealing joint.
Preferably, the step S1 includes following sub-step:
Step S1-1, the band disk 104 for two being respectively provided with yttrium system superconduction short strip 101 are placed on winding/unwinding device,
One end of wherein one yttrium system superconduction short strip 101 is passed through and passed through with one end of another yttrium system superconduction short strip 101 after electric furnace 305
Following any mode is connected:
- overlapping mode, make the YBCO of wherein one yttrium system superconduction short strip 101 facing to another yttrium system superconduction short strip 101
YBCO faces 1011;
- bridge joint mode, makes the YBCO faces 1011 of the ultrashort band 101 of two yttrium systems against bridge joint superconduction patch band 102
YBCO faces 1011;
Step S1-2, joint is made by top board 301 using bolt and fastened with joint making lower platen 302, ensures band
The band contact of joint area is uniform, and band bears pressure range 10-50Mpa;
Step S1-3, yttrium system superconduction short strip 101 and joint make top board 301 and joint makes lower platen 302 and passed through
Electric furnace 305 is heated, heating-up temperature:400-600 DEG C, the heat time:1-10h;
Step S1-4, whole joint is made into top board 301 after the completion of heating and surpassed with joint making lower platen 302 and yttrium system
Lead short strip 101 and remove electric furnace 305, cooled down;After having cooled down, remove joint and make top board 301 and joint making lower platen
302, form sliver diffusion method joint 11;
Step S1-5, by the yttrium system superconduction short strip 101 on one of band disk, together with the sliver diffusion method joint of formation
11, pour into the making for 104 in another band disk, carrying out next sliver diffusion method joint.
Preferably, also comprise the following steps in the step S1-1:
Soft metal thin slice is inserted at following any position, to improve crimp quality
In-overlapping mode, between the YBCO faces of two yttrium system superconduction short strip;
In-bridge joint mode, in the YBCO faces of two yttrium system superconduction short strip and the YBCO faces of bridge joint superconduction patch band 102
Between.Preferably, also comprise the following steps in the step S1-2:
The heat-resisting soft material tablet 303 and barrier material of the suitable size of groove cutting of lower platen 302 are made according to joint
Piece 304 spreads heat-resisting soft material tablet 303 and barrier material piece successively from bottom to up in the groove that joint makes lower platen 302
304, the junction of two yttrium system superconduction short strip 101 is placed on barrier material piece;Pad upper barrier material successively from bottom to up again
Piece 304 and heat-resisting soft material tablet 303;Cover joint and make top board 301, ensure the junction of two yttrium system superconduction short strip
Uniform force is compacted;The effect for being encased inside heat-resisting soft material tablet 303 is that the pressure for making to be distributed on joint is more uniformly distributed, pad
The purpose for entering barrier material is that the surface for making joint is not polluted by heat-resisting soft material tablet 303;
Simultaneously in step S1-4, after removing joint making top board 301 and joint making lower platen 302, it is also necessary to tear open
Except all pads are in the heat-resisting soft material tablet 303 and barrier material piece 304 of joint area.
Preferably, barrier material piece requirement is fusing point is high, not oxidizable, hard, is not easy and the material piece of silver-colored adhesion.
Preferably, also comprise the following steps in the step S1-2:
Joint is made into top board 301 using spring mode to fasten with joint making lower platen 302, ensures band connector area
The band contact in domain is uniform.
Preferably, also comprise the following steps in the step S1-5:
Before pouring into another band disk, it is also necessary to use parcel plating copper side to the sliver diffusion method joint 11 of formation
Formula is protected.
Preferably, also comprise the following steps in the step S1-5:
After being protected to the sliver diffusion method joint 11 of formation using parcel plating copper mode, then carry out local full-filling parcel and be electrically connected
Logical metal 14, to protect sliver diffusion method joint 11.
Preferably, also comprise the following steps in the step S3:Electric connection welding metal material is positioned over preparation first
In device 401,150 DEG C to 280 DEG C are heated to preparation facilities, obtains liquid electric connection welding metal material.
Preferably, before preparation facilities 401 is entered, the yttrium system superconducting tape 1 and gold of clad 12, belt lacing on metal
Advance applying liquid or colloid scaling powder on subordinate's clad 13.
Compared with prior art, the present invention has following technical characterstic:
1st, should be with sealing joint in the low-resistance in sealing joint yttrium system superconducting tape in low-resistance, because employing sliver diffusion welding
To make, it is small to realize connection resistance.Connection resistance is basically stable at 1-2n Ω;
2nd, because employing the soldering cladding to band and its joint, it is strong to realize the anti-conveyance capacity of joint.Anti- stable state
Conveyance capacity is more than 500-800A;
3rd, because employing the mode of sliver diffusion weldering plus soldering, the good mechanical property of joint is realized.The tension of joint
It is stronger to stretch stress, delamination stress, it is suitable with same specification non junction band;
4th, because employing specific device and process, the repeatability, reliability, uniformity for realizing joint are good;
The present invention has new technique effect prominent as follows by using sliver diffusion method joint and the mode of soldering:
5th, because joint employs the mode that sliver diffusion adds soldering, realizing joint does not have the presence of fragility point.So that connect
Head region is flexibility, and the radius of turn of joint is small, suitable with same specification non junction band.Also so that in superconduction engineer applied
Band damage risk substantially reduces;
6th, because joint employs the mode that sliver diffusion adds soldering, realizing joint can make of joint form, unit
The lower contact resistance of area is small, and under unit resistance, joint area is small;
7th, because joint employs the mode that sliver diffusion adds soldering, hundred meter levels or kilometer can be applied to by realizing joint technique
Connection between the long band of level.
Even if prior art is combined by the effect above, can not also obtain.
Brief description of the drawings
The detailed description made by reading with reference to the following drawings to non-limiting example, further feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is that sliver diffusion method joint makes schematic diagram;
Fig. 2 is to prepare schematic diagram before sliver diffusion method joint makes;
Fig. 3 is the crimping schematic diagram of sliver diffusion method joint;
Fig. 4 is that sliver diffusion method joint (overlap joint) crimps assembling schematic diagram;
Fig. 5 is that sliver diffusion method joint (bridge joint) crimps assembling schematic diagram;
Fig. 6 is the yttrium system superconductive long strip encapsulation schematic diagram of belt lacing;
Fig. 7 is the yttrium system superconducting tape structural representation with sealing joint in low-resistance (overlap joint);
Fig. 8 is the yttrium system superconducting tape structural representation with sealing joint in low-resistance (bridge joint);
Fig. 9 is the yttrium system superconductive long strip structural representation of belt lacing (overlap joint);
Figure 10 is the yttrium system superconductive long strip structural representation of belt lacing (bridge joint).
In figure:
1 is the yttrium system superconductive long strip of belt lacing
2 be cladding interstitital texture
11 be sliver diffusion joint
Clad on 12 metals
Clad under 13 metals
14 electric connection weld metal layers
101 be yttrium system superconducting tape
102 be bridge joint superconduction patch band
103 be soft metal thin slice
104 be band disk
1011 be YBCO faces
301 be that joint makes top board
302 be that joint makes lower platen
303 be heat-resisting soft material tablet
304 be barrier material piece
305 be electric furnace
306 be guide wheel
401 be preparation facilities
The 402 electric connection welding metal to melt
403 be guide wheel
Embodiment
Embodiments of the invention are elaborated below:The present embodiment is carried out lower premised on technical solution of the present invention
Implement, give detailed embodiment and specific operating process.It should be pointed out that to one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.
Embodiment
A kind of yttrium system superconducting tape with sealing joint in low-resistance is present embodiments provided, includes the yttrium system superconduction of belt lacing
Long band 1 and cladding interstitital texture 2;The yttrium system superconductive long strip 1 of the belt lacing includes multistage yttrium system superconduction short strip 101, and adjacent two
Connected between section yttrium system superconduction short strip by sliver diffusion method joint 11;The cladding interstitital texture 2 is hermetically wrapped in belt lacing
Yttrium system superconductive long strip outside, with prevent refrigerant penetrate into it is described with sealing joint yttrium system superconducting tape 1 in low-resistance inside
Influence its superconductivity.
Further, the length of the cladding interstitital texture 2 is more than 20 meters.
Further, the sliver diffusion method joint 11 uses sliver diffusion method, is prepared by way of overlapping or bridging.
Further, in overlap joint, the YBCO faces of two sections of adjacent yttrium system superconduction short strip 101 are oppositely arranged;In bridge joint, two
The YBCO faces 1011 of Duan Xianglin yttrium system superconduction short strip 101 are relative with the YBCO faces 1011 of bridge joint superconduction patch band 102 to be set
Put.
Further, the junction of the yttrium system superconduction short strip is provided with soft metal thin slice 103, it is therefore an objective to by improving band
The crimping contact of material, it is final to reduce band contact resistance.
Further, the soft metal thin slice 103 includes:Any one in platinum, silver, gold or any multiple combinations.
Further, the sliver diffusion method is pressurizeed heat-treating methods in atmosphere using electric furnace 305.
Further, the cladding interstitital texture 2 including clad 13 under clad 12, metal on metal and is electrically connected
Weld metal layers 14;The yttrium system superconductive long strip of the belt lacing is arranged on metal under clad and metal between clad, institute
State on metal between clad and the yttrium system superconductive long strip of belt lacing and the yttrium system superconductive long strip of belt lacing under metal with coating
Electric connection weld metal layers are filled between layer.
Further, red copper, brass, copper alloy, no is respectively adopted in clad 13 under clad 12, metal on the metal
Any one in rust steel, aluminium, Cu-Be alloys, Cu-Ni alloys or any a variety of combination.
Further, the width of clad 13 is respectively greater than the yttrium system of belt lacing under clad 12, metal on the metal
Superconductive long strip 1, width are more than 5%-30%.
Further, the electric connection weld metal layers 14 using melting temperature below 280 DEG C, resistivity is in 50u
Any of below Ω cm indium, silver, tin, copper, zinc, lead, nickel, cadmium appoint a variety of alloy materials.
A kind of yttrium system superconducting tape with sealing joint in low-resistance that the present embodiment provides, its preparation method, including it is as follows
Step:
Step S1, by multistage yttrium system superconduction short strip 101, make sliver diffusion method joint 11 with sliver diffusion legal system one by one, make its into
For the yttrium system superconductive long strip 1 of belt lacing;
Step S2, copper facing protection is carried out to the yttrium system superconductive long strip 1 of belt lacing, copper electroplating layer thickness is 1um-20um;
Step S3, by clad 13 under clad on metal 12, the yttrium system superconductive long strip 1 of belt lacing, metal according to position
Relation is sent into the preparation facilities equipped with liquid electric connection welding metal material, by extrusion forming, is formed to have and is wrapped on metal
Clad 13 and electric connection weld metal layers 14 with low-resistance under coating 12, the yttrium system superconductive long strip 1 of belt lacing, metal
The yttrium system superconducting tape of sealing joint.
Further, the step S1 includes following sub-step:
Step S1-1, the band disk 104 for two being respectively provided with yttrium system superconduction short strip 101 are placed on winding/unwinding device,
One end of wherein one yttrium system superconduction short strip 101 is passed through and passed through with one end of another yttrium system superconduction short strip 101 after electric furnace 305
Following any mode is connected:
- overlapping mode, make the YBCO of wherein one yttrium system superconduction short strip 101 facing to another yttrium system superconduction short strip 101
YBCO faces 1011;
- bridge joint mode, makes the YBCO faces 1011 of the ultrashort band 101 of two yttrium systems against bridge joint superconduction patch band 102
YBCO faces 1011;
Step S1-2, joint is made by top board 301 using bolt and fastened with joint making lower platen 302, ensures band
The band contact of joint area is uniform, and band bears pressure range 10-50Mpa;
Step S1-3, yttrium system superconduction short strip 101 and joint make top board 301 and joint makes lower platen 302 and passed through
Electric furnace 305 is heated, heating-up temperature:400-600 DEG C, the heat time:1-10h;
Step S1-4, whole joint is made into top board 301 after the completion of heating and surpassed with joint making lower platen 302 and yttrium system
Lead short strip 101 and remove electric furnace 305, cooled down;After having cooled down, remove joint and make top board 301 and joint making lower platen
302, form sliver diffusion method joint 11;
Step S1-5, by the yttrium system superconduction short strip 101 on one of band disk, together with the sliver diffusion method joint of formation
11, pour into the making for 104 in another band disk, carrying out next sliver diffusion method joint.
Further, also comprise the following steps in the step S1-1:
Soft metal thin slice is inserted at following any position, to improve crimp quality
In-overlapping mode, between the YBCO faces of two yttrium system superconduction short strip;
In-bridge joint mode, in the YBCO faces of two yttrium system superconduction short strip and the YBCO faces of bridge joint superconduction patch band 102
Between.Preferably, also comprise the following steps in the step S1-2:
The heat-resisting soft material tablet 303 and barrier material of the suitable size of groove cutting of lower platen 302 are made according to joint
Piece 304 spreads heat-resisting soft material tablet 303 and barrier material piece successively from bottom to up in the groove that joint makes lower platen 302
304, the junction of two yttrium system superconduction short strip 101 is placed on barrier material piece;Pad upper barrier material successively from bottom to up again
Piece 304 and heat-resisting soft material tablet 303;Cover joint and make top board 301, ensure the junction of two yttrium system superconduction short strip
Uniform force is compacted;The effect for being encased inside heat-resisting soft material tablet 303 is that the pressure for making to be distributed on joint is more uniformly distributed, pad
The purpose for entering barrier material is that the surface for making joint is not polluted by heat-resisting soft material tablet 303;
Simultaneously in step S1-4, after removing joint making top board 301 and joint making lower platen 302, it is also necessary to tear open
Except all pads are in the heat-resisting soft material tablet 303 and barrier material piece 304 of joint area.
Further, barrier material piece requirement is fusing point is high, not oxidizable, hard, is not easy and the material of silver-colored adhesion
Piece.
Further, also comprise the following steps in the step S1-2:
Joint is made into top board 301 using spring mode to fasten with joint making lower platen 302, ensures band connector area
The band contact in domain is uniform.
Further, also comprise the following steps in the step S1-5:
Before pouring into another band disk, it is also necessary to use parcel plating copper side to the sliver diffusion method joint 11 of formation
Formula is protected.
Further, also comprise the following steps in the step S1-5:
After being protected to the sliver diffusion method joint 11 of formation using parcel plating copper mode, then carry out local full-filling parcel and be electrically connected
Logical metal 14, to protect sliver diffusion method joint 11.
Further, also comprise the following steps in the step S3:Electric connection welding metal material is positioned over system first
In standby device 401,150 DEG C to 280 DEG C are heated to preparation facilities, obtains liquid electric connection welding metal material.
Further, before preparation facilities 401 is entered, clad 12 on metal, belt lacing yttrium system superconducting tape 1 and
Advance applying liquid or colloid scaling powder on clad 13 under metal.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (12)
- A kind of 1. yttrium system superconducting tape with sealing joint in low-resistance, it is characterised in that the yttrium system superconductive long strip including belt lacing (1) and cladding interstitital texture (2);The yttrium system superconductive long strip (1) of the belt lacing includes multistage yttrium system superconduction short strip (101), phase Connected between adjacent two sections of yttrium system superconduction short strip by sliver diffusion method joint (11);The cladding interstitital texture (2) is hermetically wrapped up In the outside of the yttrium system superconductive long strip of belt lacing.
- 2. the yttrium system superconducting tape according to claim 1 with sealing joint in low-resistance, it is characterised in that the sliver diffusion Method joint (11) uses sliver diffusion method, is connected by following any mode:- overlapping mode, the YBCO faces (1011) of two sections of adjacent yttrium system superconduction short strip (101) are oppositely arranged;- bridge joint mode, YBCO faces (1011) and the bridge joint of two sections of adjacent yttrium system superconduction short strip (101) use superconduction patch band (102) YBCO faces (1011) are oppositely arranged.
- 3. the yttrium system superconducting tape according to claim 2 with sealing joint in low-resistance, it is characterised in that the sliver diffusion Method is pressurizeed heat-treating methods in atmosphere using electric furnace (305).
- 4. the yttrium system superconducting tape according to claim 2 with sealing joint in low-resistance, it is characterised in that adjacent two sections of yttriums It is that the junction of superconduction short strip is provided with soft metal thin slice (103);The soft metal thin slice (103) is using in platinum, silver, gold Any one or any a variety of combination;The junction includes the following two kinds situation:- overlapping mode, the overlapping position of adjacent two sections of yttrium systems superconduction short strip is junction;- bridge joint mode, adjacent two sections of yttrium systems superconduction short strip are junction with the overlapping position of superconduction patch band with bridge joint.
- 5. the yttrium system superconducting tape according to claim 1 with sealing joint in low-resistance, it is characterised in that the cladding is filled out Filling structure (2) includes clad (13) and electric connection weld metal layers (14) under clad (12), metal on metal;The band The yttrium system superconductive long strip of joint is arranged on metal under clad and metal between clad, and clad connects with band on the metal It is filled between the yttrium system superconductive long strip of head and and is electrically connected between the yttrium system superconductive long strip of belt lacing and clad under metal Weld metal layers.
- 6. the yttrium system superconducting tape according to claim 5 with sealing joint in low-resistance, it is characterised in that on the metal Red copper, brass, copper alloy, stainless steel, aluminium, Cu-Be alloys, Cu-Ni is respectively adopted in clad (13) under clad (12), metal Any one in alloy or any a variety of combination;The width of clad (13) is respectively greater than the yttrium system superconductive long strip of belt lacing under clad (12) and metal on the metal (1) 5%-30%;And/orThe electric connection weld metal layers (14) use melting temperature below 280 DEG C, resistivity is below 50u Ω cm Any one in indium, silver, tin, copper, zinc, lead, nickel, cadmium or any a variety of alloy material.
- 7. the yttrium system superconducting tape according to claim 1 with sealing joint in low-resistance, it is characterised in that the cladding is filled out The length for filling structure (2) is more than 20 meters.
- 8. a kind of preparation method with the yttrium system superconducting tape of sealing joint in low-resistance, it is characterised in that comprise the following steps:Step S1, by multistage yttrium system superconduction short strip (101), make sliver diffusion method joint (11) with sliver diffusion legal system one by one, make its into For the yttrium system superconductive long strip (1) of belt lacing;Step S2, copper facing protection is carried out to the yttrium system superconductive long strip (1) of belt lacing, copper electroplating layer thickness is 1um-20um;Step S3, by clad (13) under clad on metal (12), the yttrium system superconductive long strip (1) of belt lacing, metal according to position Put relation to be sent into the preparation facilities equipped with liquid electric connection welding metal material, by extrusion forming, being formed has on metal Clad (13) and electric connection weld metal layers (14) under clad (12), the yttrium system superconductive long strip (1) of belt lacing, metal Yttrium system superconducting tape with sealing joint in low-resistance.
- 9. the preparation method according to claim 8 with the yttrium system superconducting tape of sealing joint in low-resistance, it is characterised in that The step S1 includes following sub-step:Step S1-1, two band disks for being respectively provided with yttrium system superconduction short strip (101) (104) are placed on winding/unwinding device, By one end of wherein one yttrium system superconduction short strip (101) through electric furnace (305) afterwards with another yttrium system superconduction short strip (101) one End is connected by following any mode:- overlapping mode, make the YBCO of wherein one yttrium system superconduction short strip (101) facing to another yttrium system superconduction short strip (101) YBCO faces (1011);- bridge joint mode, make the opposite bridge joint superconduction patch band (102) in YBCO faces (1011) of two ultrashort bands of yttrium system (101) YBCO faces (1011);Step S1-2, joint is made by top board (301) using bolt and makes lower platen (302) fastening with joint, ensures band The band contact of joint area is uniform, and band bears pressure range 10-50Mpa;Step S1-3, yttrium system superconduction short strip (101) and joint make top board (301) and joint makes lower platen (302) and led to Cross electric furnace (305) to be heated, heating-up temperature:400-600 DEG C, the heat time:1-10h;Step S1-4, whole joint is made into top board (301) after the completion of heating and surpassed with joint making lower platen (302) and yttrium system Lead short strip (101) and remove electric furnace (305), cooled down;After having cooled down, remove joint and make top board (301) and joint making Lower platen (302), form sliver diffusion method joint (11);Step S1-5, by the yttrium system superconduction short strip (101) on one of band disk, together with the sliver diffusion method joint of formation (11) making in another band disk (104), carrying out next sliver diffusion method joint, is poured into.
- 10. the preparation method according to claim 9 with the yttrium system superconducting tape of sealing joint in low-resistance, its feature exist In, in addition to any one of a following or multinomial feature:Also comprise the following steps in-step the S1-1:In following any position insertion soft metal thin slice:In overlapping mode, between the YBCO faces of two yttrium system superconduction short strip;In bridge joint mode, the YBCO faces of two yttrium system superconduction short strip and bridge joint with the YBCO faces of superconduction patch band (102) it Between;Also comprise the following steps in-step the S1-2:The heat-resisting soft material tablet (303) and barrier material of the suitable size of groove cutting of lower platen (302) are made according to joint Piece (304) spreads heat-resisting soft material tablet (303) and barrier successively from bottom to up in the groove that joint makes lower platen (302) Material piece (304), the junction of two yttrium system superconduction short strip (101) is placed on barrier material piece;Pad successively from bottom to up again Upper barrier material piece (304) and heat-resisting soft material tablet (303);Cover joint and make top board (301), ensure two yttrium systems The junction uniform force of superconduction short strip is compacted;The effect for being encased inside heat-resisting soft material tablet (303) is to make to be distributed in joint On pressure be more uniformly distributed, the purpose for being encased inside barrier material is the surface for making joint not by heat-resisting soft material tablet (303) institute Pollution;Barrier material piece requirement is fusing point is high, not oxidizable, hard, is not easy and the material piece of silver-colored adhesion;Simultaneously in step S1-4, after removing joint making top board (301) and joint making lower platen (302), it is also necessary to tear open Except all pads are in the heat-resisting soft material tablet (303) and barrier material piece (304) of joint area;Also comprise the following steps in-step the S1-2:Joint is made by top board (301) using spring mode and makes lower platen (302) fastening with joint;Also comprise the following steps in-step the S1-5:Before pouring into another band disk, it is also necessary to use parcel plating copper mode to the sliver diffusion method joint (11) of formation Protection;Also comprise the following steps in-step the S1-5:After being protected to the sliver diffusion method joint (11) of formation using parcel plating copper mode, then carry out local full-filling parcel and be electrically connected Metal (14), to protect sliver diffusion method joint (11).
- 11. the preparation method according to claim 8 with the yttrium system superconducting tape of sealing joint in low-resistance, its feature exist In also comprising the following steps in the step S3:Electric connection welding metal material is positioned in preparation facilities (401) first, 150 DEG C to 280 are heated to preparation facilities DEG C, obtain liquid electric connection welding metal material.
- 12. the preparation method according to claim 11 with the yttrium system superconducting tape of sealing joint in low-resistance, its feature exist In also comprising the following steps:Before preparation facilities (401) is entered, on metal under the yttrium system superconducting tape (1) and metal of clad (12), belt lacing Advance applying liquid or colloid scaling powder on clad (13).
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