CN107300436B - Touch display device and pressure sensor thereof - Google Patents
Touch display device and pressure sensor thereof Download PDFInfo
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- CN107300436B CN107300436B CN201710587383.0A CN201710587383A CN107300436B CN 107300436 B CN107300436 B CN 107300436B CN 201710587383 A CN201710587383 A CN 201710587383A CN 107300436 B CN107300436 B CN 107300436B
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- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000001514 detection method Methods 0.000 claims abstract description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000011231 conductive filler Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- WABPQHHGFIMREM-NOHWODKXSA-N lead-200 Chemical compound [200Pb] WABPQHHGFIMREM-NOHWODKXSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 241001212149 Cathetus Species 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
- G01L1/2262—Measuring circuits therefor involving simple electrical bridges
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The invention relates to a touch display device and a pressure sensor thereof. The pressure sensor includes a base material and a sensing unit. The substrate comprises a first surface and a second surface which are opposite; the sensing unit comprises four sensing grids with the same resistance value and four leads, the four sensing grids are connected end to form a Wheatstone bridge and form four nodes, the four leads are respectively connected with the four nodes, the Wheatstone bridge is arranged on the first surface, at least one lead is arranged on the first surface of the four leads of the sensing unit, and at least one lead is arranged on the second surface of the four leads of the sensing unit. The pressure sensor has the characteristic of good detection accuracy.
Description
Technical Field
The present invention relates to the field of touch display technologies, and in particular, to a touch display device and a pressure sensor thereof.
Background
With the increasing popularity of touch display devices, such as touch screen mobile phones, etc., the pressure sensor is added to the touch display device, so that the touch display device can sense the degree of pressure of an operator, the interactivity of a human-computer interface is widened, and the use experience of a user is enhanced. With the continuous development of modern industrial technologies, various types of pressure sensing technologies are applied to touch display devices, but most of the pressure sensing technologies detect pressure by deformation in the Z-axis direction, the deformation in the Z-axis direction directly extrudes a display screen part, and long-time application may affect display of the display screen. The pressure sensing technology for detecting pressure/tension by using the deformation in the XY plane can effectively avoid the problem that the deformation in the Z-axis direction directly extrudes the display screen part, but the signal detection accuracy of the existing pressure sensing technology for detecting pressure/tension by using the deformation in the XY plane is poor.
Disclosure of Invention
Therefore, it is necessary to provide a touch display device with better detection accuracy and a pressure sensor thereof.
A pressure sensor, comprising:
a substrate comprising a first surface and a second surface opposite to each other;
the sensing unit comprises four sensing grids with the same resistance value and four leads, wherein the four sensing grids are connected end to form a Wheatstone bridge and form four nodes, the four leads are respectively connected with the four nodes, the Wheatstone bridge is arranged on the first surface, at least one lead is arranged on the first surface, and at least one lead is arranged on the second surface in the four leads of the sensing unit.
In the above-described sensor unit, the lead is connected to the node, that is, the lead is outside the wheatstone bridge and does not belong to a part of the wheatstone bridge. In addition, in the four lead wires of each sensing unit, part of the lead wires are located on the first surface, and part of the lead wires are located on the second surface, so that the area for wiring the lead wires is increased relative to the situation that all the lead wires are located on the same surface of the substrate, the lead wires with larger line width can be used, and the resistance value of the lead wires is reduced. The overall resistance variation of the lead is much smaller than that of the sensitive grid (in the order of one thousandth). When pressing, although lead wire deformation also can take place the resistance and change, nevertheless because the lead wire is outside wheatstone bridge to the special deformation form of lead wire makes the lead wire influence the output signal of wheatstone bridge far less than thousandth semaphore level, therefore above-mentioned pressure sensor has the characteristics that detect the accuracy is good.
In one embodiment, the wheatstone bridge has an area size of 0.49cm 2 To 25cm 2 . That is, the wheatstone bridge is built in a small area, so that a larger number of wheatstone bridges can be arranged in a unit area, and the pressure sensor has the characteristics of high resolution and high sensing precision.
In one embodiment, the line width of the sensitive grid is preferably 0.005mm to 2.5 mm. The line width of the sensitive grid is too small, the process requirement is high, the process cost is increased, the product yield is low, the line width of the sensitive grid is too large, the resistance value of the sensitive grid is reduced, the proportion of the resistance value change caused by lead deformation to the resistance value change caused by the sensitive grid deformation is increased, and the real response to the deformation is not favorably obtained. The preferred line width of the sensitive grid is 0.005mm to 2.5mm, which can meet the requirements of the manufacturing process and is beneficial to obtaining the real response to the deformation.
In one embodiment, the resistance value of the sensitive grid is 120 Ω to 20M Ω. The resistance value of the sensitive grid is larger, and the detection accuracy can be improved.
In one embodiment, the four sensitive grids are respectively a first sensitive grid, a second sensitive grid, a third sensitive grid and a fourth sensitive grid which are sequentially connected end to end;
a node formed by connecting the first sensitive grid and the second sensitive grid is a first node, a node formed by connecting the second sensitive grid and the third sensitive grid is a second node, a node formed by connecting the third sensitive grid and the fourth sensitive grid is a third node, and a node formed by connecting the fourth sensitive grid and the first sensitive grid is a fourth node;
the lead connected with the first node is a first lead, the lead connected with the second node is a second lead, the lead connected with the third node is a third lead, and the lead connected with the fourth node is a fourth lead;
the first lead and the third lead are arranged on the first surface, and the second lead and the fourth lead are arranged on the second surface. The two lead wires are arranged on the first surface, the two lead wires are arranged on the second surface, namely the four lead wires are respectively arranged on the first surface and the second surface, so that the line widths of the lead wires on the two surfaces can be simultaneously wider, and the circuit integration is facilitated.
In one embodiment, the first sensitive grid and the third sensitive grid are oriented in the same direction, the second sensitive grid and the fourth sensitive grid are oriented in the same direction, and the orientation of the first sensitive grid is perpendicular to the orientation of the second sensitive grid. The arrangement of the orientations of the four sensitive grids of the Wheatstone bridge can enable the routing of the sensitive grids to be highly integrated, so that the detection accuracy of the sensing unit is improved, and the realization of the manufacturing process is facilitated.
In one embodiment, the first lead and the third lead are adapted to be connected to a ground line and a supply voltage, respectively, and the second lead and the fourth lead are adapted to be connected to a detection circuit for detecting a bridge voltage of the wheatstone bridge. The leads for connecting with the ground line or the power supply voltage can be combined, that is, when the pressure sensor comprises a plurality of sensing units, a plurality of sensing units can share the same lead for connecting with the ground line or the power supply voltage, and at the moment, the lead for connecting with the ground line or the power supply voltage and the Wheatstone bridge are positioned on the same surface, which is more beneficial to simplifying the manufacturing process.
In one embodiment, the number of the sensing units is multiple, and the wheatstone bridges of the multiple sensing units are arranged at intervals;
pressure sensor is still including locating the ground connection lead wire and the power lead wire of first surface, ground connection lead wire with the power lead wire be used for respectively with the ground wire with mains voltage connects, a plurality of the first lead wire of sensing element is with same root ground connection lead wire connects, a plurality of the third lead wire of sensing element is with same root power lead wire connects. The number of the grounding lead and the power lead is reduced, so that the grounding lead and the power lead can be made very wide, the resistance of the grounding lead and the power lead is reduced, the resistance change caused by the deformation of the grounding lead and the power lead is reduced, the influence of the resistance change caused by the deformation of the grounding lead and the power lead on the detection structure is further reduced, and the real response to the deformation is obtained.
In one embodiment, the wheatstone bridges of a plurality of the sensing units are arranged in a plurality of rows, the ground leads and the power leads are arranged in a staggered manner, and one row of the wheatstone bridges is sandwiched between the adjacent ground leads and the adjacent power leads;
the ground lead wire between two adjacent rows of the Wheatstone bridges is simultaneously connected with the first lead wires of the two rows of the Wheatstone bridges, the power supply lead wire between two adjacent rows of the Wheatstone bridges is simultaneously connected with the third lead wires of the two rows of the Wheatstone bridges, the ground lead wire at the outermost side is connected with the first lead wires of one row of the Wheatstone bridges, and the power supply lead wire at the outermost side is connected with the third lead wires of one row of the Wheatstone bridges. The number of the grounding lead and the power supply lead can be further reduced, the influence of resistance value change caused by deformation of the grounding lead and the power supply lead on the detection structure is further reduced, and real response to deformation is obtained.
In one embodiment, the substrate comprises a central region and an edge region which are connected, and the Wheatstone bridge is positioned in the central region;
the lead wire positioned on the second surface comprises a connecting section and a line segment which are connected, one end of the connecting section, which is far away from the line segment, is connected with the node positioned on the first surface, the line segment is positioned on the marginal area, and the line width of the connecting section is greater than that of the sensitive grid. The line width of the connecting section is larger than that of the sensitive grid, namely the connecting section with the resistance value smaller than that of the sensitive grid is used, so that the resistance value change caused by lead deformation can be reduced, the influence of the resistance value change caused by lead deformation on the detection structure is further reduced, and the real response to the deformation is obtained.
In one embodiment, the line width of the connecting section is 0.1mm to 5 mm. In a certain range, the smaller the line width of the connecting section is, the larger the resistance increase amplitude of the connecting section is, the larger the line width of the connecting section is, the smaller the resistance decrease amplitude of the connecting section is, the influence of the line width of the connecting section on the resistance of the connecting section and the material cost are comprehensively considered, and the line width of the connecting section is set to be 0.1mm to 5 mm.
In one embodiment, the substrate is provided with a through hole penetrating through the first surface and the second surface, a conductive material penetrates through the through hole, one end of the conductive material is connected with the lead on the second surface, and the other end of the conductive material is connected with one node on the first surface. The nodes on different surfaces are connected with the lead by the mode of forming the through hole and filling the conductive material in the through hole to form the conductive wire.
A touch display device comprises the pressure sensor
Drawings
FIG. 1 is a top view of a first surface of a pressure sensor according to one embodiment;
FIG. 2 is a top view of a second surface of an embodiment of a pressure sensor;
FIG. 3 is a schematic diagram of the Wheatstone bridge of FIG. 1;
FIG. 4 is a schematic diagram of a Wheatstone bridge in another embodiment;
FIG. 5 is a top view of a surface of a substrate having conductive lines;
FIG. 6 is a cross-sectional view of an embodiment of a pressure sensor.
Detailed Description
The touch display device and the pressure sensor thereof are further described with reference to the drawings and the embodiments.
As shown in fig. 1, a pressure sensor 10 of an embodiment includes a substrate 100 and a sensing unit 200 disposed on the substrate 100. After the sensing unit 200 is connected to the detection circuit, when the sensing unit 200 is pressed, the sensing unit 200 includes a full-bridge strain gauge set composed of sensing gates, the resistance of the sensing gates changes after the sensing unit is deformed by a force, so that output signals (electric signals such as current and voltage) of the sensing unit 200 change, and the detection circuit can detect pressure signals by capturing and analyzing the electric signals.
As shown in fig. 1 to 3, the substrate 100 includes a first surface 110 and a second surface 120 opposite to each other. The sensing unit 200 includes four sensing grids 210 with the same resistance and four lead wires 220, the four sensing grids 210 are connected end to form a wheatstone bridge 200a and form four nodes 230, and the four lead wires 220 are respectively connected with the four nodes 230. The wheatstone bridge 200a is disposed on the first surface 110, and among the four leads 220 of each sensing unit 200, at least one lead 220 is disposed on the first surface 110, and at least one lead 220 is disposed on the second surface 120.
In a traditional pressure sensor, four sensitive grids are arranged on a whole substrate, each sensitive grid is led out to the edge of the substrate through two leads, and then a Wheatstone bridge is built, wherein the leads are part of the Wheatstone bridge. When pressing, the lead wire can also take place the resistance change, because the lead wire is one part of wheatstone bridge, the resistance change that the lead wire took place can seriously influence the signal of telecommunication, leads to signal detection inaccurate, can not obtain the true response to deformation. In addition, in the conventional pressure sensor, the four sensitive grids and the lead wires corresponding to the four sensitive grids are all located on the same surface of the substrate, so that the substrate does not have enough wiring area.
In the above-mentioned sensing unit 200, the lead 220 is connected to the node 230, i.e. the lead 220 is outside the wheatstone bridge 200a and is not part of the wheatstone bridge 200 a. In addition, in the four lead wires 220 of each sensing unit 200, a part of the lead wires 220 is located on the first surface 110, and a part of the lead wires 220 is located on the second surface 120, so that the area for routing the lead wires 220 is increased compared with the case that all the lead wires 220 are located on the same surface of the substrate 100, and therefore the lead wires 220 with larger line width can be used to reduce the resistance of the lead wires 220. The overall resistance variation of the lead 220 is much smaller than that of the sensitive grid 210 (in the order of thousandths). When the pressure sensor 10 is pressed, although the resistance value of the lead 220 is changed due to the deformation, the lead 220 is outside the wheatstone bridge 200a, and the influence of the lead on the output signal of the wheatstone bridge 200a is far less than one thousandth of signal quantity level due to the special deformation form of the lead 220, so that the pressure sensor has the characteristic of good detection accuracy.
Further, in the present embodiment, the wheatstone bridge 200a has an area of 0.49cm 2 To 25cm 2 . That is, the wheatstone bridge 200a is built in a small area, so that a larger number of wheatstone bridges 200a can be arranged in a unit area, so that the pressure sensor 10 has the characteristics of high resolution and high sensing accuracy.
Further, in the present embodiment, the resistance of the sensing gate 210 is 120 Ω to 20M Ω. The resistance of the sensitive grid 210 is relatively large, so that the detection accuracy can be improved. Preferably, in the embodiment, the resistance of the sensitive grid 210 is 1K Ω to 500K Ω, so as to avoid a thermal deformation phenomenon caused by excessive heat generated by an excessively large resistance when the sensitive grid 210 works, thereby affecting the detection accuracy.
Further, in the present embodiment, the size of the area of the wheatstone bridge 200a is preferably 1.00cm 2 To 9.00cm 2 . The wheatstone bridge 200a has too small area, which has high requirements for the process, increases the process cost and causes low product yield, while the wheatstone bridge 200a has too large area, which cannot set a sufficient number of wheatstone bridges 200a in a limited space, and further cannot meet the requirements of high resolution and high sensing precision. The wheatstone bridge 200a preferably has an area size of 1.00cm 2 To 9.00cm 2 Thereby, balance can be obtained in the manufacturing process, high resolution and high sensing precision. Specifically, in the present embodiment, the Wheatstone bridge 200a has a square shape, and when the area of the Wheatstone bridge 200a is 0.49cm 2 The wheatstone bridge 200a has dimensions of 0.7cm by 0.7 cm; similarly, when the area of the Wheatstone bridge 200a is 25cm 2 The wheatstone bridge 200a has dimensions of 5cm by 5 cm.
Further, in the present embodiment, the line width of the sensitive gate 210 is preferably 0.005mm to 2.5 mm. The line width of the sensitive gate 210 is too small, which has a high requirement on the process, and may increase the process cost and result in low product yield, while the line width of the sensitive gate 210 is too large, which may decrease the resistance value of the sensitive gate 210, and may increase the ratio of the resistance value change caused by the deformation of the lead 220 to the resistance value change caused by the deformation of the sensitive gate 210, which is not favorable for obtaining a true response to the deformation. The preferred line width of the sensitive gate 210 is 0.005mm to 2.5mm, which can meet the requirements of the manufacturing process and can be beneficial to obtaining a true response to deformation.
It should be noted that the resistance value of the sensing gate 210 is related to the total length of the sensing gate 210 (the area of the sensing gate 210) and the line width of the sensing gate 210, and when the area of the wheatstone bridge 200a is designed and determined, the line width of the sensing gate 210 can be determined according to the resistance value of the sensing gate 210; similarly, when the design determines the line width of the sensing grid 210, the area of the wheatstone bridge 200a can be determined according to the resistance of the sensing grid 210.
Further, in the present embodiment, the four sensitive gates 210 are a first sensitive gate 210a, a second sensitive gate 210b, a third sensitive gate 210c, and a fourth sensitive gate 210d, which are sequentially connected end to end. The node formed by connecting the first sensitive gate 210a and the second sensitive gate 210b is the first node 232, the node formed by connecting the second sensitive gate 210b and the third sensitive gate 210c is the second node 234, the node formed by connecting the third sensitive gate 210c and the fourth sensitive gate 210d is the third node 236, and the node formed by connecting the fourth sensitive gate 210d and the first sensitive gate 210a is the fourth node 238. A lead connected to the first node 232 is a first lead 220a, a lead connected to the second node 234 is a second lead 220b, a lead connected to the third node 236 is a third lead 220c, and a lead connected to the fourth node 238 is a fourth lead 220 d. The first lead 220a and the third lead 220c are disposed on the first surface 110, and the second lead 220b and the fourth lead 220d are disposed on the second surface 120. Two lead wires 220 are disposed on the first surface 110, two lead wires 220 are disposed on the second surface 120, that is, four lead wires 220 are equally distributed on the first surface 110 and the second surface 120, so that the line widths of the lead wires 200 on the two surfaces can be simultaneously wider, and circuit integration is facilitated.
Further, as shown in fig. 3, in the present embodiment, the orientations of the two connected sensitive grids 210 intersect. Preferably, in this embodiment, two sensing grids 210 spaced apart from each other are oriented in the same direction, and two sensing grids 210 connected to each other are oriented in a perpendicular direction. Specifically, as shown in fig. 3 and 4, the orientation of the first sensitive gate 210a is the same as that of the third sensitive gate 210c, the orientation of the second sensitive gate 210b is the same as that of the fourth sensitive gate 210d, the orientation of the first sensitive gate 210a is perpendicular to that of the second sensitive gate 210b, and the orientation of the third sensitive gate 210c is perpendicular to that of the fourth sensitive gate 210 d. The arrangement of the orientations of the four sensitive gates 210 of the wheatstone bridge 200a can make the routing of the sensitive gates 210 highly integrated, so as to improve the detection accuracy of the sensing unit 200, and facilitate the implementation of the manufacturing process.
Specifically, in the present embodiment, in the rectangular coordinate system corresponding to the sensing unit 200, the four sensitive grids 210 are respectively located in the first quadrant, the second quadrant, the third quadrant and the fourth quadrant of the rectangular coordinate system. The sensing grating 210 of the first quadrant is oriented the same or perpendicular to the X-axis of the rectangular coordinate system. In fig. 3, the orientation (direction) of the sensing grating 210 of the first quadrant is perpendicular to the X-axis orientation (direction) of the rectangular coordinate system, and in fig. 4, the orientation (direction) of the sensing grating 210 of the first quadrant is the same as the X-axis orientation (direction) of the rectangular coordinate system. Thereby making the above-described sensing unit 200 very suitable for constructing a square pressure sensor 10.
Further, as shown in fig. 1 and 2, in the present embodiment, the first lead 220a and the third lead 220c are used for connecting with the Ground (GND) and the power Voltage (VDD), respectively, and the second lead 220b and the fourth lead 220d are used for connecting with the detection circuit to detect the bridge voltage of the wheatstone bridge 200 a. The leads 220 for connecting to ground or power voltage may be combined, that is, when the pressure sensor 10 includes a plurality of sensing units 200, several sensing units 200 may share the same lead 220 for connecting to ground or power voltage, and in this case, the lead 220 for connecting to ground or power voltage and the wheatstone bridge 200a are located on the same surface, which is more beneficial to simplify the manufacturing process.
Further, in the present embodiment, the number of the sensing units 200 is plural, and the wheatstone bridges 200a of the plurality of sensing units 200 are arranged at intervals. The pressure sensor 10 further comprises a ground lead 300 and a power lead 400 provided on the first surface 110, the ground lead 300 and the power lead 400 being used for connection with a ground line and a power voltage, respectively. The first leads 220a of the plurality of sensing cells 200 are connected to the same ground lead 300, and the third leads 220c of the plurality of sensing cells 200 are connected to the same power lead 400. The first leads 220a of the sensing units 200 share the same ground lead 300, that is, the ground leads connected with the first leads 220a are combined into one ground lead 300, so that the number of the ground leads 300 is reduced, the ground lead 300 can be widened, the resistance of the ground lead 300 is reduced, the resistance change caused by the deformation of the ground lead 300 is reduced, the influence of the resistance change caused by the deformation of the ground lead 300 on a detection structure is further reduced, and the real response to the deformation is obtained. Similarly, the third leads 220c of the sensing units 200 are connected to the same power lead 400, so that the influence of resistance change caused by deformation of the power lead 400 on the detection structure can be reduced, and a real response to the deformation can be obtained.
Further, in the present embodiment, the wheatstone bridges 200a of the plurality of sensing units 200 are arranged in several rows, the ground leads 300 and the power leads 400 are arranged in a staggered manner, and one row of wheatstone bridges 200a is sandwiched between the adjacent ground leads 300 and the power leads 400. The ground lead 300 between two adjacent rows of wheatstone bridges 200a is connected to the first leads 220a of the two rows of wheatstone bridges 200a, the power lead 400 between the two rows of wheatstone bridges 200a is connected to the third leads 220c of the two rows of wheatstone bridges 200a, the ground lead 300 at the outermost side is connected to the first lead 220a of the one row of wheatstone bridges 200a, and the power lead 400 at the outermost side is connected to the third lead 220c of the one row of wheatstone bridges 200 a. That is, the first nodes 232 of the two adjacent rows of wheatstone bridges 200a are close to each other, and the third nodes 236 of the two adjacent rows of wheatstone bridges 200a are close to each other, so that the number of the grounding lead 300 and the power lead 400 can be further reduced, the influence of resistance change caused by deformation of the grounding lead 300 and the power lead 400 on the detection structure can be further reduced, and the real response to deformation can be obtained.
Further, in the present embodiment, the ground lead 300 and the power lead 400 are linear structures extending in the same direction, and the first lead 220a is perpendicular to the ground lead 300 and the third lead 220c is perpendicular to the power lead 400. The straight line between the two points is the shortest, the length of the ground lead 300 and the length of the power lead 400 are as short as possible due to the straight-line structure of the ground lead 300 and the power lead 400, and the length of the first lead 220a and the length of the third lead 220c are as short as possible due to the first lead 220a being perpendicular to the ground lead 300 and the third lead 220c being perpendicular to the power lead 400. And the shorter the length is, the smaller the resistance of the ground lead 300, the power lead 400, the first lead 220a and the third lead 220c is, so that the influence of the resistance value change caused by the deformation of the ground lead 300, the power lead 400, the first lead 220a and the third lead 220c on the detection structure can be further reduced, and the real response to the deformation is obtained. Specifically, in the present embodiment, the substrate 100 has a rectangular shape, the wheatstone bridges 200a of the plurality of sensor units 200 are arranged in several rows along the long side of the substrate 100, and the ground lead 300 and the power lead 400 have a straight line structure extending along the long side of the substrate 100.
Further, in the present embodiment, the ground lead 300 is integrally formed with the first lead 220a, and the power lead 400 is integrally formed with the third lead 220 c. Therefore, the ground lead 300 and the first lead 220a can be formed at the same time, and the power lead 400 and the third lead 220c can be formed at the same time, which is more beneficial to simplifying the manufacturing process. Preferably, in the present embodiment, the line width of the ground lead 300 is the same as the line width of the first lead 220a, and the line width of the power lead 400 is the same as the line width of the third lead 220c, so that the manufacturing process can be further simplified. Further, it is preferable that the line width of the ground lead 300 is the same as the line width of the power lead 400, so that the manufacturing process can be further simplified.
Further, in the present embodiment, the substrate 100 includes a central region 130 and an edge region 140 connected to each other, the edge region 140 includes a routing region 142 and a bonding region 144 connected to each other, and the wheatstone bridge 200a is located in the central region 130. The pressure sensor 10 further includes a ground line segment 500 and a power line segment 600, which are grounded in the routing area 142, wherein one end of the ground line segment 500 is connected to the ground lead 300, the other end is located in the binding area 144, one end of the power line segment 600 is connected to the power lead 400, and the other end is located in the binding area 144. The line width of the ground line segment 500 is smaller than the line width of the ground lead 300, and the line width of the power line segment 600 is smaller than the line width of the power lead 400. The ground line segment 500 and the power line segment 600 are located in the edge region 140, and when pressed, the deformation of the edge region 140 is much smaller than that of the central region 130, so that the influence of using the ground line segment 500 and the power line segment 600 with relatively small line widths on the detection result is small. Since the plurality of ground line segments 500 and the plurality of power line segments 600 are collected to the binding region 144 through the routing region 142, the ground line segments 500 and the plurality of power line segments 600 with smaller line widths are beneficial to routing layout.
Further, in the present embodiment, the lead 220 on the second surface 120 includes a connecting segment 222 and a trace segment 224 connected to each other. One end of the connecting section 222 away from the routing section 224 is connected to the node 230 on the first surface 110, the routing section 224 is located in the edge region 140, and the line width of the connecting section 222 is greater than the line width of the sensitive gate 210. The line width of the connecting section 222 is greater than the line width of the sensitive gate 210, that is, the connecting section 222 with the resistance value less than the resistance value of the sensitive gate 210 is used, so that the resistance value change caused by the deformation of the lead 220 can be reduced, the influence of the resistance value change caused by the deformation of the lead 220 on the detection structure can be further reduced, and the real response to the deformation can be obtained. Further, in the present embodiment, the line width of the connection segment 222 is 2 times to 500 times the line width of the sensitive gate 210. Preferably, in the present embodiment, the line width of the connection section 222 is 0.1mm to 5 mm. Within a certain range, the smaller the line width of the connection section 222, the larger the increase of the resistance of the connection section 222, and the larger the line width of the connection section 222, the smaller the decrease of the resistance of the connection section 222, and the line width of the connection section 222 is set to 0.1mm to 5mm in consideration of the influence of the line width of the connection section 222 on the resistance of the connection section 222 and the material cost.
Further, in the present embodiment, the substrate 100 is square, the wheatstone bridge 200a is square, and the side line of the 230 node is parallel to the side line of the substrate 100. The connecting segment 222 is a straight line parallel to one side line of the substrate 100 or a rectangular fold line 222a parallel to two adjacent side lines of the substrate 100. The straight line between two points is shortest, and one right-angled side of the right-angled fold line 222a can be used for avoiding other connecting sections 222, and the other right-angled side can be used for realizing the shortest straight line between two points. When the lead 220 is designed to be routed, the connecting section 222 is a straight line parallel to one side line of the substrate 100 or a right-angle folding line 222a parallel to two adjacent side lines of the substrate 100, so that the length of the connecting section 222 is the minimum while the routing requirement is met, and by using the connecting section 222 with a smaller length (the resistance value of the connecting section 222 is in direct proportion to the length), the resistance value of the connecting section 222 is reduced, and further, the influence of the resistance value change caused by the lead 220 on the detection structure is reduced.
Further, in this embodiment, right-angled folding line 222a includes a first right-angled edge 2222 and a second right-angled edge 2224 connected together, and an end of first right-angled edge 2222 away from second right-angled edge 2224 is connected to node 230. When the connecting segment 222 is a straight line, the connecting segment 222 is located between the node 230 corresponding thereto and the edge of the nearest substrate 100 corresponding to the node 230; when the connecting segment 222 is a right-angled fold line, the second cathetus 2224 is located between the node 230 corresponding thereto and the edge of the nearest substrate 100 corresponding to the node 230. I.e., the node 230 is brought to the edge of the substrate 100 nearest the node 230 by the connecting segment 222. For the pressure sensing of the pressure sensor 10, when the pressure sensor 10 is pressed, the deformation amount of the central area 130 of the pressure sensor 10 is much larger than that of the edge area 140, and the wheatstone bridge 200a is led to the nearest edge area 140 through the straight line or the right-angled broken line-shaped connecting section 222, so that the resistance value of the connecting section 222 can be reduced to the maximum extent, and the influence of the resistance value change caused by the lead 220 on the detection structure can be reduced. The lead 200 is led to the nearest edge of the pressure sensor 10 as soon as possible, and the wider lead 200 is adopted in the central area 130 of the pressure sensor 10, so that the influence of resistance value change caused by the lead 220 on the detection structure can be further reduced, and the detection accuracy is improved.
Further, in the present embodiment, the lead 220 located on the second surface 120 further includes a binding section 226 connected to an end of the routing section 224 away from the connection section 222. The routing segment 224 is disposed in the routing region 142, and the bonding segment 226 is disposed in the bonding region 144. Wherein, the line width of the binding segment 226 is greater than the line width of the line segment 224. The binding section 226 is used for being connected with the flexible circuit board, and the binding section 226 with a larger line width is convenient for the binding section 226 to be connected with the gold finger of the flexible circuit board in an alignment manner, so that short circuit and open circuit are not easy to occur.
Further, in this embodiment, the material of the sensing gate 210 is the same as that of the lead 220, so that the sensing gate 210 and the lead 220 can be formed at the same time, and the process can be simplified.
Further, as shown in fig. 5 and fig. 6, in the present embodiment, a through hole penetrating through the first surface 110 and the second surface 120 is formed on the substrate 100, a conductive filler 700 is inserted into the through hole, one end of the conductive filler 700 is connected to the lead 220 on the second surface 120, and the other end is connected to a node 230 on the first surface 110. The nodes 230 on different surfaces are connected to the leads 220 by forming through holes and filling the through holes with conductive material to form conductive fillers 700.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent should be subject to the appended claims.
Claims (10)
1. A pressure sensor, comprising:
a substrate comprising a first surface and a second surface opposite to each other;
the sensing unit comprises four sensing grids with the same resistance value and four leads, the four sensing grids are connected end to form a Wheatstone bridge and form four nodes, and the four leads are respectively connected with the four nodes, wherein the Wheatstone bridge is arranged on the first surface, at least one lead is arranged on the first surface, and at least one lead is arranged on the second surface;
the four sensitive grids are respectively a first sensitive grid, a second sensitive grid, a third sensitive grid and a fourth sensitive grid which are sequentially connected end to end;
a node formed by connecting the first sensitive grid and the second sensitive grid is a first node, a node formed by connecting the second sensitive grid and the third sensitive grid is a second node, a node formed by connecting the third sensitive grid and the fourth sensitive grid is a third node, and a node formed by connecting the fourth sensitive grid and the first sensitive grid is a fourth node;
the lead connected with the first node is a first lead, the lead connected with the second node is a second lead, the lead connected with the third node is a third lead, and the lead connected with the fourth node is a fourth lead;
the first lead and the third lead are respectively used for being connected with a ground wire and a power supply voltage, and the second lead and the fourth lead are used for being connected with a detection circuit to detect the bridge voltage of the Wheatstone bridge;
the number of the sensing units is multiple, and the Wheatstone bridges of the multiple sensing units are arranged at intervals;
the pressure sensor also comprises a grounding lead and a power supply lead which are arranged on the first surface, the grounding lead and the power supply lead are respectively used for being connected with the ground wire and the power supply voltage, the first leads of a plurality of sensing units are connected with the same grounding lead, and the third leads of the plurality of sensing units are connected with the same power supply lead;
the Wheatstone bridges of the sensing units are arranged in a plurality of rows, the grounding lead and the power supply lead are arranged in a staggered mode, and one row of the Wheatstone bridges is clamped between the adjacent grounding lead and the power supply lead;
wherein the ground lead between two adjacent rows of the Wheatstone bridges is simultaneously connected to the first leads of the two rows of the Wheatstone bridges, the power supply lead between two adjacent rows of the Wheatstone bridges is simultaneously connected to the third leads of the two rows of the Wheatstone bridges, the ground lead positioned on the outermost side is connected to the first leads of one row of the Wheatstone bridges, and the power supply lead positioned on the outermost side is connected to the third leads of one row of the Wheatstone bridges,
the ground lead and the first lead are integrally formed, and the power lead and the third lead are integrally formed.
2. According to claimThe pressure sensor of 1, wherein the wheatstone bridge has an area size of 0.49cm 2 To 25cm 2 。
3. A pressure sensor according to claim 2, characterized in that the line width of the sensitive grid is preferably 0.005mm to 2.5 mm.
4. A pressure sensor according to claim 1, wherein the sensing grating has a resistance of 120 Ω to 20M Ω.
5. The pressure sensor of claim 1,
the first lead and the third lead are arranged on the first surface, and the second lead and the fourth lead are arranged on the second surface.
6. The pressure sensor of claim 1, wherein the first and third sensitive grids are oriented in the same direction, the second and fourth sensitive grids are oriented in the same direction, and the first sensitive grid is oriented perpendicular to the second sensitive grid.
7. The pressure sensor of claim 1, wherein the substrate includes a central region and an edge region connected, the wheatstone bridge being located in the central region;
the lead wire positioned on the second surface comprises a connecting section and a line segment which are connected, one end of the connecting section, which is far away from the line segment, is connected with the node positioned on the first surface, the line segment is positioned on the marginal area, and the line width of the connecting section is greater than that of the sensitive grid.
8. The pressure sensor of claim 7, wherein the line width of the connecting segment is 0.1mm to 5 mm.
9. The pressure sensor of claim 1, wherein the substrate has a through hole passing through the first surface and the second surface, and a conductive material is disposed in the through hole, one end of the conductive material is connected to the lead on the second surface, and the other end of the conductive material is connected to a node on the first surface.
10. A touch display device characterized by comprising a pressure sensor according to any one of claims 1-9.
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| CN109917944A (en) * | 2017-12-13 | 2019-06-21 | 南昌欧菲显示科技有限公司 | Forced induction module, touch-control display screen and touch-control electronic equipment |
| CN112824843B (en) * | 2019-11-21 | 2024-07-26 | 上海微创电生理医疗科技股份有限公司 | Strain gauge, pressure sensor and interventional medical catheter |
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