CN105718128A - Touch panel, preparation method thereof and touch device - Google Patents
Touch panel, preparation method thereof and touch device Download PDFInfo
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- CN105718128A CN105718128A CN201610229027.7A CN201610229027A CN105718128A CN 105718128 A CN105718128 A CN 105718128A CN 201610229027 A CN201610229027 A CN 201610229027A CN 105718128 A CN105718128 A CN 105718128A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000002355 dual-layer Substances 0.000 abstract 3
- 238000002955 isolation Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 59
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 6
- 239000002356 single layer Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a touch panel, a preparation method thereof and a touch device, belonging to the fields of display and touch. The touch panel comprises a substrate, an electrode and leads, wherein the electrode and the leads are arranged on the substrate, the electrode is connected with the leads and comprises a plurality of first electrodes and second electrodes, the first electrodes and the second electrodes are arranged in mutual crossing and isolation manners, and at least one of the electrode and the leads is in a dual-layer structure. By producing at least one of the electrode and the leads into the dual-layer structure, the resistance of the electrode and/or the leads which are of the dual-layer structure is reduced, and current on the electrode and the leads can be increased without increasing the driving voltage, so that the area of the touch panel can be increased without increasing the driving voltage and the identification capacity of an IC, and the IC can still normally identify the current running through the electrode and the leads.
Description
Technical field
The present invention relates to display touch-control field, particularly to a kind of contact panel and preparation method thereof, contactor control device.
Background technology
Development along with technology, contact panel is increasingly used on the electronic product such as touch-screen mobile phone or panel computer, to the electronic equipment being provided with contact panel, just can realize electronic equipment is carried out various operation by using finger or other objects to touch contact panel, easy to use.
Common a kind of contact panel is capacitance type touch-control panel, capacitance type touch-control panel generally includes substrate and forms the electrode on substrate, when touching contact panel, electric capacity between electrode can change, the electric current on the lead-in wire being connected with electrode is made also to produce change, IC (IntegratedCircuit, integrated circuit) determines, according to the curent change on lead-in wire, the position being touched.
Along with contact panel area is increasing, the area of the patterned layer being made up of multiple electrodes is also increasing, this makes electric current need to get to IC through longer distance, transmission range is more long, resistance on transmission path is more big, this intensity of variation resulting in electric current is less, it will affect the identification ability of IC, thus limiting the size of contact panel.
Summary of the invention
In order to solve the size-constrained problem of contact panel, embodiments provide a kind of contact panel and preparation method thereof, contactor control device.Described technical scheme is as follows:
Embodiments provide a kind of contact panel, described contact panel includes substrate, arranges electrode on the substrate and lead-in wire, described electrode and described lead-in wire connect, described electrode includes multiple first electrode and multiple second electrode, described first electrode and described second electrode intersect and setting insulated from each other, and described electrode and at least one in described lead-in wire are double-decker.
Alternatively, described first electrode includes ground floor electronic conduction block, connect described ground floor electronic conduction block jumper and the second layer electronic conduction block overlapped with described ground floor electronic conduction block, described second electrode includes the second layer electronic conduction block that ground floor electronic conduction block overlaps and the jumper being connected described second layer electronic conduction block with described ground floor electronic conduction block.
Further, the described jumper of described first electrode, the described ground floor electronic conduction block of described first electrode and the described ground floor electronic conduction block of described second electrode are arranged on same layer, and the described jumper of described second electrode, the described second layer electronic conduction block of described first electrode and the described electronic conduction block of described second electrode are arranged on same layer.
Alternatively, it is provided with collets between described jumper and the described jumper of described second electrode of described first electrode.
Preferably, described collets are made up of transparent organic glass.
Further, the ground floor electronic conduction block of described first electrode, the second layer electronic conduction block of described first electrode, described second electrode ground floor electronic conduction block identical with the shape of the second layer electronic conduction block of described second electrode, described in be shaped as rectangle, square or rhombus.
Preferably, described electrode is made up of transparent conductive material.
Preferably, described first electrode includes overlapped two-layer the first sub-electrode, and described second electrode includes overlapped two-layer the second sub-electrode.
Further, described lead-in wire includes two overlapped straton lead-in wires.
Preferably, described lead-in wire is made up of transparent conductive material.
The embodiment of the present invention additionally provides a kind of contactor control device, and described contactor control device includes any one contact panel aforementioned.
The preparation method that the embodiment of the present invention additionally provides a kind of contact panel, described method includes:
Substrate is provided；
Prepare electrode and lead-in wire on the substrate, described electrode and described lead-in wire connect, described electrode includes multiple first electrode and multiple second electrode, described first electrode and described second electrode and intersects and setting insulated from each other, and described electrode and at least one in described lead-in wire are double-decker.
Alternatively, described prepare electrode and lead-in wire on the substrate, including:
Make the first patterned layer on the substrate, described first patterned layer includes the ground floor electronic conduction block of the ground floor electronic conduction block of described first electrode, the jumper of described first electrode and described second electrode, and the jumper of described first electrode connects the ground floor electronic conduction block of described first electrode；
The jumper of described first electrode makes collets；
Described first patterned layer and described collets make the second patterned layer, described second patterned layer includes the jumper of the second layer electronic conduction block of described first electrode, the second layer electronic conduction block of described second electrode and described second electrode, the jumper of described second electrode connects the second layer electronic conduction block of described second electrode, and described collets are between the described jumper and the described jumper of described second electrode of described first electrode.
Preferably, described first patterned layer also includes the first straton lead-in wire, and it is overlapped that described second patterned layer also includes the second straton lead-in wire, described first straton lead-in wire and described second straton lead-in wire.
Alternatively, described prepare electrode and lead-in wire on the substrate, including:
Form the first straton lead-in wire on the substrate；
Described first straton lead-in wire forms the second straton lead-in wire, described first straton lead-in wire and described second straton lead-in wire overlapped.
The technical scheme that the embodiment of the present invention provides has the benefit that by least one in the electrode of contact panel and lead-in wire is made as double-decker, the resistance with double-deck electrode and/or lead-in wire is reduced, such that it is able to the electric current increased when not improving driving voltage on electrode and lead-in wire, therefore, when not improving driving voltage and IC identification ability, even if being done more by the area of contact panel, IC still can normally identify the electric current flowing through electrode and lead-in wire.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the partial schematic diagram of a kind of contact panel that the embodiment of the present invention provides；
Fig. 2 is the structural representation of double-deck first electrode that the embodiment of the present invention provides；
Fig. 3 is the structural representation of double-deck second electrode that the embodiment of the present invention provides；
Fig. 4 be the embodiment of the present invention provide the first electrode and the second electrode crossing schematic diagram is set；
Fig. 5 is A-A in Fig. 1 to sectional view；
Fig. 6 is the partial schematic diagram of the another kind of contact panel that the embodiment of the present invention provides；
Fig. 7 is the partial schematic diagram of another contact panel that the embodiment of the present invention provides；
Fig. 8 is B-B in Fig. 7 to sectional view；
Fig. 9 is a kind of method flow diagram preparing contact panel that the embodiment of the present invention provides；
Figure 10 is the method flow diagram that the another kind that the embodiment of the present invention provides prepares contact panel；
Figure 11 is the procedure chart that a kind of making has the contact panel of double-deck electrode and double-deck lead-in wire；
Figure 12 is the procedure chart that a kind of making has the contact panel of double-deck electrode and double-deck lead-in wire；
Figure 13 is the procedure chart that a kind of making has the contact panel of double-deck electrode and double-deck lead-in wire.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
Fig. 1 is the partial schematic diagram of a kind of contact panel that the embodiment of the present invention provides, as shown in Figure 1, this contact panel includes substrate (not shown), be arranged on substrate electrode 40 and lead-in wire 50, electrode 40 and lead-in wire 50 connection, electrode 40 includes multiple first electrode 40a and multiple second electrode 40b, first electrode 40a and the second electrode 40b intersects and setting insulated from each other, and electrode 40 and at least one in lead-in wire 50 are double-decker.
The embodiment of the present invention is by being made as double-decker by least one in the electrode of contact panel and lead-in wire, the resistance with double-deck electrode and/or lead-in wire is reduced, such that it is able to the electric current increased when not improving driving voltage on electrode and lead-in wire, therefore, when not improving driving voltage and IC identification ability, even if being done more by the area of contact panel, IC still can normally identify the electric current flowing through electrode and lead-in wire.
It is double-decker for the electrode 40 in Fig. 1 and lead-in wire 50 embodiment of the present invention is illustrated below.
Fig. 2 shows the structural representation of double-deck first electrode that the embodiment of the present invention provides, in conjunction with Fig. 1 and Fig. 2, first electrode 40a includes ground floor electronic conduction block 60a, the jumper 80 connecting ground floor electronic conduction block 60a and the second layer electronic conduction block 60b overlapped with ground floor electronic conduction block 60a, Fig. 3 shows the structural representation of double-deck second electrode that the embodiment of the present invention provides, as shown in Figure 3, second electrode 40b includes ground floor electronic conduction block 60a, the second layer electronic conduction block 60b overlapped with ground floor electronic conduction block 60a and the jumper 80 being connected second layer electronic conduction block 60b, the double-decker of electrode 40 is realized by making overlapped ground floor electronic conduction block 60a and second layer electronic conduction block 60b, to reach to reduce the purpose of the resistance of whole electrode 40.
Preferably, electrode 40 is made up of transparent conductive material, and transparent conductive material can reduce the barrier effect of the light that the electrode 40 display to being arranged under contact panel sends, and improves the brightness of display.
Further, the transparent conductive material making electrode 40 is tin indium oxide, it is also possible to for other transparent conductive materials, for instance nano-silver thread, Graphene etc..
Fig. 4 be the embodiment of the present invention provide the first electrode and the second electrode crossing schematic diagram is set, as shown in Figure 4, the jumper 80 of the first electrode 40a, the ground floor electronic conduction block 60a of the ground floor electronic conduction block 60a and the second electrode 40b of the first electrode 40a is arranged on same layer, the jumper 80 of the second electrode 40b, the second layer electronic conduction block 60b of the second layer electronic conduction block 60b and the second electrode 40b of the first electrode 40a is arranged on same layer, in this setup, the bending degree of jumper 80 is little, such that it is able to reduce the possibility of jumper 80 fracture, improve production qualification rate and the service life of contact panel.
When realizing, the thickness of ground floor electronic conduction block 60a can be 20nm～150nm, and the thickness of second layer electronic conduction block 60b can be 20nm～150nm.The thickness of the jumper 80 of the first electrode 40a can with the consistency of thickness of the ground floor electronic conduction block 60a of the first electrode 40a, and the thickness of the jumper 80 of the second electrode 40b can with the consistency of thickness of the second layer electronic conduction block 60b of the second electrode 40b.
Further, it is provided with collets 70 between jumper 80 and the jumper 80 of the second electrode 40b of the first electrode 40a, guarantees the insulation between the first electrode 40a and the second electrode 40b by collets 70.
Alternatively, the thickness of ground floor electronic conduction block 60a and second layer electronic conduction block 60b can be equal, thus facilitating the making of electrode 40, additionally, the thickness of ground floor electronic conduction block 60a and second layer electronic conduction block 60b can also be unequal.
It should be noted that, when the thickness of ground floor electronic conduction block 60a Yu second layer electronic conduction block 60b is unequal, the thickness changing ground floor electronic conduction block 60a and second layer electronic conduction block 60b can be passed through so that the thickness of conducting block 60 and the thickness of two electrode 40 bridgings place are consistent, namely the thickness sum of ground floor electronic conduction block 60a and second layer electronic conduction block 60b is equal to the thickness of collets 70 and the thickness sum of the jumper 80 being positioned at these collets 70 both sides, specifically, the thickness that can make the thickness not connecting the ground floor electronic conduction block 60a of jumper 80 and second layer electronic conduction block 60b in electrode 40 more than the ground floor electronic conduction block 60a and second layer electronic conduction block 60b that are connected to jumper 80, such that it is able under the premise that the thickness of the contact panel ensured in the embodiment of the present invention is consistent with traditional contact panel thickness, increase the thickness of conducting block 60 as much as possible, thus reducing the resistance of electrode 40 as much as possible, it is bigger that the area making contact panel can do.
Alternatively, collets 70 can be made up of transparent organic glass, adopts transparent organic glass to make collets 70 and can reduce the barrier effect of the light that the collets 70 display to being arranged under contact panel sends, improves the brightness of display.
Fig. 5 is A-A in Fig. 1 to sectional view, as shown in Figure 5, lead-in wire 50 includes two overlapped straton lead-in wires, by arranging the first overlapped straton lead-in wire 50a and the second straton lead-in wire 50b, the resistance on lead-in wire 50 can be reduced, it is also possible to improve the electric current on electrode 40 and lead-in wire 50 when not improving driving voltage.
Preferably, lead-in wire 50 is made up of transparent conductive material, adopting transparent conductive material to make lead-in wire 50 can without hiding lead-in wire 50, such that it is able to realize the Rimless design of contact panel, simultaneously because be made without hiding, decrease one technique, thus not only improve the qualification rate of product but also decreasing production cost.When making lead-in wire 50 and electrode 40, according to identical transparent conductive material, then lead-in wire 50 and electrode 40 can be made an entirety, reduce manufacturing process further.
Further, the transparent conductive material making lead-in wire 50 is tin indium oxide, it is also possible to for other transparent conductive materials, for instance nano-silver thread, Graphene etc..
It should be noted that, although the embodiment shown in Fig. 1 includes double-deck electrode 40 and double-deck lead-in wire 50 simultaneously, but, in other embodiments, it can also be the combination of the go between combination of 50 or the electrode 40 of single layer structure and the double-deck lead 50 of double-deck electrode 40 and single layer structure, wherein, the lead-in wire 50 of single layer structure refers to lead-in wire 50 and only includes the first straton lead-in wire 50a or only include the second straton lead-in wire 50b, the electrode 40 of single layer structure refers to the conducting block 60 in electrode 40 and only includes ground floor electronic conduction block 60a or only include second layer electronic conduction block 60b.
When lead-in wire 50 employing single layer structure, lead-in wire 50 can adopt metal to make, to reduce the resistance of lead-in wire 50.
Additionally, in the present embodiment, each electrode 40 is connected to a unique lead-in wire 50, and namely lead-in wire 50 is arranged with electrode 40 one_to_one corresponding, such that it is able to reduce the area of the wiring area of contact panel.In other embodiments, the two ends of each electrode 40 can respectively connect a lead-in wire 50, and namely each electrode 40 is connected to two lead-in wires 50.
Further, in the present embodiment, the lead-in wire 50 of all first electrode 40a is respectively positioned on the same side of the first electrode 40a, the lead-in wire 50 of all second electrode 40b is respectively positioned on the same side of the second electrode 40b, can conveniently arrange lead-in wire 50, certainly, in other embodiments, the lead-in wire 50 of part the first electrode 40a can also be arranged on the side of the first electrode 40a, the lead-in wire 50 of other part the first electrode 40a is arranged on the opposite side of the first electrode 40a, the lead-in wire 50 of partial second electrode 40b is arranged on the side of the second electrode 40b, the lead-in wire 50 of other partial second electrode 40b is arranged on the opposite side of the second electrode 40b, such that it is able to the distance expanded between adjacent legs 50, avoid occurring between lead-in wire 50 short circuit.
Fig. 6 is the partial schematic diagram of another kind of contact panel that the embodiment of the present invention provides, as shown in Figure 6, touch panel structure provided essentially identical with shown in Fig. 1 of this contact panel, it is different in that, the electronic conduction block 60a of the contact panel shown in Fig. 6 is rectangle.
It should be noted that, the ground floor electronic conduction block 60a of the first electrode 40a, the second layer electronic conduction block 60b of the first electrode 40a, the second electrode 40b the shape of second layer electronic conduction block 60b of ground floor electronic conduction block 60a and the second electrode 40b identical, shape can be rectangle, square or rhombus, it is conceivable that, in other embodiments, ground floor electronic conduction block 60a and second layer electronic conduction block 60b can also be other shapes, and the present invention is not limited thereto.
Fig. 7 is the partial schematic diagram of another contact panel that the embodiment of the present invention provides, Fig. 8 is B-B in Fig. 7 to sectional view, in conjunction with Fig. 7 and Fig. 8, first electrode 40a of this contact panel includes overlapped two-layer the first sub-electrode 401a, second electrode 40b includes overlapped two-layer the second sub-electrode 401b, the electrode 40 of this contact panel is rectangle, owing to need not arrange jumper 80, it is possible to reduce the difficulty of processing.
It should be noted that in the contact panel shown in Fig. 7, need the insulating barrier (not shown) arranging flood to be insulated by the first electrode 40a and the second electrode 40b between the first electrode 40a and the second electrode 40b.
Preferably, the lead-in wire 50 of the contact panel shown in Fig. 7 is made up of metal material, and metal material is compared the materials such as tin indium oxide and had less resistance.
Additionally, contact panel also includes the glass cover-plate arranged with substrate-parallel, electrode 40 and lead-in wire 50 are between substrate and glass cover-plate.
The embodiment of the present invention additionally provides a kind of contactor control device, and this contactor control device has any one contact panel aforesaid.
The embodiment of the present invention is by being made as double-decker by least one in the electrode of contact panel and lead-in wire, the resistance with double-deck electrode and/or lead-in wire is reduced, such that it is able to the electric current increased when not improving driving voltage on electrode and lead-in wire, therefore, when not improving driving voltage and IC identification ability, even if being done more by the area of contact panel, IC still can normally identify the electric current flowing through electrode and lead-in wire.
Fig. 9 is a kind of method flow diagram preparing contact panel that the embodiment of the present invention provides, as it is shown in figure 9, the method includes:
S10: substrate is provided；
S20: preparing electrode and lead-in wire, electrode and lead-in wire on substrate and connect, electrode includes multiple first electrode and multiple second electrode, the first electrode and the second electrode intersect and setting insulated from each other, and electrode and at least one in lead-in wire are double-decker.
The embodiment of the present invention is by being made as double-decker by least one in the electrode of contact panel and lead-in wire, the resistance with double-deck electrode and/or lead-in wire is reduced, such that it is able to the electric current increased when not improving driving voltage on electrode and lead-in wire, therefore, when not improving driving voltage and IC identification ability, even if being done more by the area of contact panel, IC still can normally identify the electric current flowing through electrode and lead-in wire.
It should be noted that the double-deck material making electrode can be the same or different, the double-deck material making lead-in wire can be the same or different, and for the ease of making, lead-in wire and electrode can select identical material.
Figure 10 is the method flow diagram that the another kind that the embodiment of the present invention provides prepares contact panel, Figure 11～Figure 13 is shown that the process that a kind of making has the contact panel of double-deck electrode and double-deck lead-in wire, and this preparation method may comprise steps of:
S10: substrate is provided；
S21: make the first patterned layer on substrate, the first patterned layer includes the ground floor electronic conduction block of the ground floor electronic conduction block of the first electrode, the jumper of the first electrode and the second electrode, and the jumper of the first electrode connects the ground floor electronic conduction block of the first electrode.
Specifically, as shown in figure 11, substrate makes the ground floor electronic conduction block 60a of the first electrode and the jumper 80 of the ground floor electronic conduction block 60a of the second electrode and the first electrode；
S22: make collets on the jumper of the first electrode；
Specifically, as shown in figure 12, the jumper 80 of the first electrode makes collets 70；
S23: make the second patterned layer in the first patterned layer and collets, second patterned layer includes the jumper of the second layer electronic conduction block of the first electrode, the second layer electronic conduction block of the second electrode and the second electrode, the jumper of the second electrode connects the second layer electronic conduction block of the second electrode, and collets are between the jumper and the jumper of the second electrode of the first electrode；
Specifically, as shown in figure 13, the ground floor electronic conduction block 60a of the first electrode makes the second layer electronic conduction block 60b of the first electrode, on the second layer electronic conduction block 60a of the second electrode, makes the second layer electronic conduction block 60b of the second electrode, collets 70 make the jumper 80 of the second electrode.
It should be noted that, the thickness of the electronic conduction block that the thickness of jumper connects with jumper is consistent, if the thickness of jumper is more than electronic conduction block, then owing to being additionally provided with collets between jumper, so may result in the thickness of the first electrode and the second electrode bridging section excessive, jumper there will be bigger bending, it is possible to there will be the situation of jumper fracture；If the thickness of jumper is less than electronic conduction block, then jumper resistance can be caused to increase, so that the resistance of electrode increases.
It should be noted that when making electrode, electronic conduction block and jumper can make as overall structure.
Refer again to Figure 11 and Figure 13, when preparing the first patterned layer and the second patterned layer, first patterned layer can also include the first straton lead-in wire 50a, and the second patterned layer can also include the second straton lead-in wire 50b, and the first straton lead-in wire 50a and the second straton lead-in wire 50b is overlapped.
It should be noted that when the material of lead-in wire is identical with the material of electrode, sub-lead-in wire can make as overall structure with the electronic conduction block being attached thereto.
Further, it is also possible to after completing the making of electrode and lead-in wire, electrode and lead-in wire add a cover transparent cover plate.
Alternatively, substrate is prepared electrode and lead-in wire, it is possible to including:
Substrate is formed the first straton lead-in wire；
Forming the second straton lead-in wire on the first straton lead-in wire, the first straton lead-in wire and the second straton lead-in wire are overlapped.
By preparing, there is double-deck lead-in wire so that the resistance with double-deck lead-in wire reduces.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610229027.7A CN105718128B (en) | 2016-04-13 | 2016-04-13 | A touch panel, a preparation method thereof, and a touch device |
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| CN201610229027.7A CN105718128B (en) | 2016-04-13 | 2016-04-13 | A touch panel, a preparation method thereof, and a touch device |
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| CN105718128A true CN105718128A (en) | 2016-06-29 |
| CN105718128B CN105718128B (en) | 2019-05-07 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107300436A (en) * | 2017-07-18 | 2017-10-27 | 南昌欧菲光科技有限公司 | Touch control display apparatus and its pressure sensor |
| CN107340941A (en) * | 2017-06-28 | 2017-11-10 | 昆山国显光电有限公司 | A kind of capacitive touch screen and preparation method thereof |
| CN108061985A (en) * | 2017-11-17 | 2018-05-22 | 昆山龙腾光电有限公司 | Color membrane substrates and preparation method thereof and touching display screen |
| WO2018126767A1 (en) * | 2017-01-05 | 2018-07-12 | 京东方科技集团股份有限公司 | Touch panel, fabrication method therefor and display device |
| CN113467639A (en) * | 2021-06-30 | 2021-10-01 | 合肥维信诺科技有限公司 | Touch panel and touch display device |
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| WO2018126767A1 (en) * | 2017-01-05 | 2018-07-12 | 京东方科技集团股份有限公司 | Touch panel, fabrication method therefor and display device |
| CN108885520A (en) * | 2017-01-05 | 2018-11-23 | 京东方科技集团股份有限公司 | Touch panel and preparation method thereof, display device |
| CN108885520B (en) * | 2017-01-05 | 2021-10-15 | 京东方科技集团股份有限公司 | Touch panel, manufacturing method thereof and display device |
| US11537250B2 (en) | 2017-01-05 | 2022-12-27 | Beijing Boe Technology Development Co., Ltd. | Touch panel and manufacturing method thereof, display device |
| CN107340941A (en) * | 2017-06-28 | 2017-11-10 | 昆山国显光电有限公司 | A kind of capacitive touch screen and preparation method thereof |
| CN107300436A (en) * | 2017-07-18 | 2017-10-27 | 南昌欧菲光科技有限公司 | Touch control display apparatus and its pressure sensor |
| CN107300436B (en) * | 2017-07-18 | 2022-08-23 | 安徽精卓光显技术有限责任公司 | Touch display device and pressure sensor thereof |
| CN108061985A (en) * | 2017-11-17 | 2018-05-22 | 昆山龙腾光电有限公司 | Color membrane substrates and preparation method thereof and touching display screen |
| CN113467639A (en) * | 2021-06-30 | 2021-10-01 | 合肥维信诺科技有限公司 | Touch panel and touch display device |
| WO2023273485A1 (en) * | 2021-06-30 | 2023-01-05 | 合肥维信诺科技有限公司 | Touch-control panel and touch-control display apparatus |
| US12124650B2 (en) | 2021-06-30 | 2024-10-22 | Hefei Visionox Technology Co., Ltd. | Touch-control panel and touch-control display apparatus |
| JP7634703B2 (en) | 2021-06-30 | 2025-02-21 | 合肥維信諾科技有限公司 | Touch panel and touch display device |
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| CN105718128B (en) | 2019-05-07 |
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