CN107278037A - The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode - Google Patents
The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode Download PDFInfo
- Publication number
- CN107278037A CN107278037A CN201710517153.7A CN201710517153A CN107278037A CN 107278037 A CN107278037 A CN 107278037A CN 201710517153 A CN201710517153 A CN 201710517153A CN 107278037 A CN107278037 A CN 107278037A
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- CN
- China
- Prior art keywords
- copper
- clad plate
- powder
- hot pressing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to copper-clad plate production field, and in particular to makes the copper-clad plate of 6.5≤Dk≤10 using turning hot pressing mode, comprises the following steps：First, low medium dielectric constant microwave medium powder is lost uniformly to mix with polytetrafluoroethylene (PTFE) powder；2nd, the powder forming and sintering obtained after the mixing in step one is processed into blank；3rd, the blank of forming and sintering in step 2 is lathed plate；The 4th, the plate double-side copper-applying vacuum hotpressing in step 3 be made to 6.5≤Dk ＜ 10 copper-clad plate；Present invention process strengthens copper-clad plate rigidity without using glass fabric；Glass fabric gluing roasting procedure is not used；It is relatively low without using the copper-clad plate product loss that 6.5≤Dk ＜ 10 obtained by glass fabric bigger than normal are lost, 6.5≤Dk ＜ 10 copper-clad plate is made by turning mode and vacuum hotpressing, manufacture craft of the invention is simple, energy-conserving and environment-protective.
Description
Technical field
The present invention relates to copper-clad plate production field, and in particular to makes 6.5≤Dk≤10 using turning hot pressing mode and covers copper
Plate.
Background technology
Prior art, which makes the copper-clad plate of 6.5≤Dk≤10, is adulterated ptfe emulsion tree using medium dielectric constant microwave medium powder
Fat, is mixed into glue by powder and ptfe emulsion, glue is coated uniformly on to dry on glass fabric and glued
Sheeting, the techniques such as bonding sheet double-side copper-applying hot pressing are made, apply and glass fabric bigger than normal is lost so that 6.5≤Dk ＜
The loss of 10 copper-clad plate product is bigger than normal.
The content of the invention
The problem of existing for prior art, the invention provides one kind using turning hot pressing mode make 6.5≤Dk≤
10 copper-clad plates.
Concrete technical scheme is as follows：
The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode, comprised the following steps：
First, low medium dielectric constant microwave medium powder is lost uniformly to mix with polytetrafluoroethylene (PTFE) powder；
2nd, the powder forming and sintering obtained after the mixing in step one is processed into blank；
3rd, the blank of forming and sintering in step 2 is lathed plate；
The 4th, the plate double-side copper-applying vacuum hotpressing in step 3 be made to 6.5≤Dk ＜ 10 copper-clad plate；
It is preferred that, the particle size of the polytetrafluoroethylene (PTFE) powder being capable of the coated medium dielectric constant microwave medium powder；
It is preferred that, the dielectric constant range of the medium dielectric constant microwave medium powder is 30-60；
It is preferred that, pressure when being molded in step 2 is 80kg/cm2, sintering temperature is 380 degree, and sintering time is 50 small
When；
It is preferred that, the equipment used in turning in step 3 is peeler；
It is preferred that, the thickness of the plate in step 3 is 0.5mm-9mm；
It is preferred that, the pressure limit of vacuum hotpressing is in 20kg/cm2-80kg/cm2, vacuum hotpressing temperature is 380 degree, vacuum
Hot pressing time is 6 hours.
Beneficial effect：
Present invention process strengthens copper-clad plate rigidity without using glass fabric；Glass fabric gluing Roaster is not used
Sequence；It is relatively low without using the copper-clad plate product loss that 6.5≤Dk ＜ 10 obtained by glass fabric bigger than normal are lost, pass through turning
6.5≤Dk ＜ 10 copper-clad plate is made with vacuum hotpressing mode, manufacture craft of the invention is simple, energy-conserving and environment-protective.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in the embodiment of the present invention
Technical scheme is clearly and completely described, it is clear that described embodiment is a part of embodiment of the invention, rather than entirely
The embodiment in portion.Based on the embodiment in the present invention, those of ordinary skill in the art are not under the premise of creative work is made
It can not obtain.
Specific embodiment：The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode, comprised the following steps：
First, low medium dielectric constant microwave medium powder is lost uniformly to mix with polytetrafluoroethylene (PTFE) powder；
2nd, the powder forming and sintering obtained after the mixing in step one is processed into blank；
3rd, the blank of forming and sintering in step 2 is lathed plate；
The 4th, the plate double-side copper-applying vacuum hotpressing in step 3 be made to 6.5≤Dk ＜ 10 copper-clad plate.
The particle size of the polytetrafluoroethylene (PTFE) powder being capable of the coated medium dielectric constant microwave medium powder.
The dielectric constant range of the medium dielectric constant microwave medium powder is 30-60.
Pressure when being molded in step 2 is 80kg/cm2, sintering temperature is 380 degree, and sintering time is 50 hours.
The equipment used in turning in step 3 is peeler.
The thickness of the plate in step 3 is 0.5mm-9mm.
The pressure limit of vacuum hotpressing is in 20kg/cm2-80kg/cm2, vacuum hotpressing temperature is 380 degree, vacuum hotpressing time
For 6 hours.
The technology of the present invention mixes low-loss medium dielectric constant microwave medium powder and polytetrafluorethylepowder powder, through forming and sintering rear car
The plate of various thickness is whittled into, thickness of slab can be achieved from 0.5-9mm, and 6.5≤Dk ＜ are made in this plate two-sided deposited copper foil vacuum hot-pressing
10 copper-clad plate.The present invention strengthens copper-clad plate rigidity without using glass fabric；Glass fabric gluing roasting procedure is not used；
It is relatively low without using the copper-clad plate product loss that 6.5≤Dk ＜ 10 obtained by glass fabric bigger than normal are lost, by turning and
6.5≤Dk ＜ 10 copper-clad plate is made in vacuum hotpressing mode, and manufacture craft of the invention is simple, energy-conserving and environment-protective.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
The present invention is described in detail, it will be understood by those within the art that：It still can be to foregoing each implementation
Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic；And these modification or
Replace, the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (7)
1. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode, it is characterised in that：Comprise the following steps：
First, low medium dielectric constant microwave medium powder is lost uniformly to mix with polytetrafluoroethylene (PTFE) powder；
2nd, the powder forming and sintering obtained after the mixing in step one is processed into blank；
3rd, the blank of forming and sintering in step 2 is lathed plate；
The 4th, the plate double-side copper-applying vacuum hotpressing in step 3 be made to 6.5≤Dk ＜ 10 copper-clad plate.
2. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode as claimed in claim 1, it is characterised in that：It is described
The particle size of polytetrafluoroethylene (PTFE) powder being capable of the coated medium dielectric constant microwave medium powder.
3. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode as claimed in claim 1, it is characterised in that：It is described
The dielectric constant range of medium dielectric constant microwave medium powder is 30-60.
4. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode as claimed in claim 1, it is characterised in that：Step
Pressure when being molded in two is 80kg/cm2, sintering temperature is 380 degree, and sintering time is 50 hours.
5. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode as claimed in claim 1, it is characterised in that：Step
The equipment used in turning in three is peeler.
6. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode as claimed in claim 1, it is characterised in that：Step
The thickness of the plate in three is 0.5mm-9mm.
7. the copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode as claimed in claim 1, it is characterised in that：Step
The pressure limit of vacuum hotpressing is in 20kg/cm in four2-80kg/cm2, vacuum hotpressing temperature is 380 degree, and the vacuum hotpressing time is 6
Hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710517153.7A CN107278037A (en) | 2017-06-29 | 2017-06-29 | The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710517153.7A CN107278037A (en) | 2017-06-29 | 2017-06-29 | The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107278037A true CN107278037A (en) | 2017-10-20 |
Family
ID=60070808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710517153.7A Pending CN107278037A (en) | 2017-06-29 | 2017-06-29 | The copper-clad plate of 6.5≤Dk≤10 is made using turning hot pressing mode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107278037A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335180A (en) * | 1978-12-26 | 1982-06-15 | Rogers Corporation | Microwave circuit boards |
| CN102281717A (en) * | 2011-08-06 | 2011-12-14 | 倪新军 | Manufacture method for base plate of high frequency circuit module |
| CN102350825A (en) * | 2011-05-30 | 2012-02-15 | 周涛 | Process for preparing fluorine-containing high polymer high frequency circuit board material by hydrothermal method |
| JP2015034282A (en) * | 2013-08-08 | 2015-02-19 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Composite material for circuit board production, and circuit board ingredient material produced using the same |
| CN106604536A (en) * | 2017-01-26 | 2017-04-26 | 上海逻骅投资管理合伙企业（有限合伙） | Polytetrafluoroethylene composite microwave dielectric material and preparation method thereof |
-
2017
- 2017-06-29 CN CN201710517153.7A patent/CN107278037A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335180A (en) * | 1978-12-26 | 1982-06-15 | Rogers Corporation | Microwave circuit boards |
| CN102350825A (en) * | 2011-05-30 | 2012-02-15 | 周涛 | Process for preparing fluorine-containing high polymer high frequency circuit board material by hydrothermal method |
| CN102281717A (en) * | 2011-08-06 | 2011-12-14 | 倪新军 | Manufacture method for base plate of high frequency circuit module |
| JP2015034282A (en) * | 2013-08-08 | 2015-02-19 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Composite material for circuit board production, and circuit board ingredient material produced using the same |
| CN106604536A (en) * | 2017-01-26 | 2017-04-26 | 上海逻骅投资管理合伙企业（有限合伙） | Polytetrafluoroethylene composite microwave dielectric material and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20171020 |