[go: up one dir, main page]

CN107193338B - Computer host and desktop computer with small space occupation ratio - Google Patents

Computer host and desktop computer with small space occupation ratio Download PDF

Info

Publication number
CN107193338B
CN107193338B CN201710273270.3A CN201710273270A CN107193338B CN 107193338 B CN107193338 B CN 107193338B CN 201710273270 A CN201710273270 A CN 201710273270A CN 107193338 B CN107193338 B CN 107193338B
Authority
CN
China
Prior art keywords
pipe
heat
computer
water
host
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201710273270.3A
Other languages
Chinese (zh)
Other versions
CN107193338A (en
Inventor
罗飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710273270.3A priority Critical patent/CN107193338B/en
Publication of CN107193338A publication Critical patent/CN107193338A/en
Application granted granted Critical
Publication of CN107193338B publication Critical patent/CN107193338B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

空间占比小的电脑主机,所述电脑主机的主板与显卡设置在同一平面且发热器件处于同一侧面,两者连接并通信;在主板上侧设有水冷装置,硬盘固定于主板或水冷装置上,该水冷装置与主板上发热器件之间设有若干导热金属块,在主板同一平面至少一侧设有至少一个排风扇,所述主板及水冷装置外部设有外壳,在该外壳上设有网板,在外壳底部设有支座,在该支座内或主板及水冷装置一侧设有电源,使得电脑主机的厚度减少从而体积被压缩。本发明还提供一种台式电脑,本发明的空间占比小的电脑主机及台式电脑结构新颖替代了传统的机箱,改变了传统的CPU和显卡散热方式,有效减少主机的厚度,使得台式电脑更薄,美观和轻巧的同时没有大幅度额外增加成本。

Figure 201710273270

A computer host with a small space ratio, the motherboard of the computer host and the graphics card are arranged on the same plane and the heating device is on the same side, and the two are connected and communicated; a water cooling device is arranged on the upper side of the motherboard, and the hard disk is fixed on the motherboard or the water cooling device There are several heat-conducting metal blocks between the water-cooling device and the heating device on the main board, and at least one exhaust fan is arranged on at least one side of the same plane of the main board. , A support is arranged at the bottom of the shell, and a power supply is arranged in the support or on one side of the main board and the water cooling device, so that the thickness of the computer host is reduced and the volume is compressed. The present invention also provides a desktop computer. The computer host and the desktop computer of the present invention have a novel structure, which replaces the traditional chassis, changes the traditional heat dissipation method of the CPU and the graphics card, effectively reduces the thickness of the host, and makes the desktop computer more efficient. Thin, beautiful and lightweight without significant additional cost.

Figure 201710273270

Description

空间占比小的电脑主机及台式电脑Computer mainframe and desktop computer with small space

【技术领域】【Technical field】

本发明涉及电脑领域,特别涉及一种空间占比小的电脑主机及台式电脑。The invention relates to the field of computers, in particular to a computer host and a desktop computer with a small space ratio.

【背景技术】【Background technique】

随着电脑的发展,对电脑的使用体验要求越来越高,特别是台式电脑的优缺点都非常突出的情况下,CPU的处理速度越来越快,但功耗也越来越高,自然温度也越来越高,这就需要更大的散热设备散热,但传统的风冷或水冷技术限制下,机箱又高又厚又沉重不美观,为满足用户需求就需要更小更轻更薄的主机。With the development of computers, the requirements for computer experience are getting higher and higher, especially when the advantages and disadvantages of desktop computers are very prominent, the processing speed of CPU is getting faster and faster, but the power consumption is also getting higher and higher, naturally The temperature is also getting higher and higher, which requires larger cooling equipment to dissipate heat. However, under the limitation of traditional air cooling or water cooling technology, the chassis is tall, thick, heavy and unsightly. In order to meet the needs of users, it needs to be smaller, lighter and thinner. host.

市场上的水冷电脑包括水冷头、水管、水泵、水冷排等水冷器件组装成一个电脑水冷系统,需要一个足够大的机箱容纳主板、CPU、内存、硬盘、电源等必须的电脑器件的同时还能容纳水冷系统,尤其在组建复杂的多路水冷系统时,水冷器件会挤占大量机箱内部空间,且市面上的水冷头及水冷排造价都非常昂贵,这就为水冷系统的电脑的普及形成价格壁垒。The water-cooled computers on the market include water-cooled heads, water pipes, water pumps, water-cooled drains and other water-cooled devices assembled into a computer water-cooling system. A chassis large enough to accommodate the motherboard, CPU, memory, hard disk, power supply and other necessary computer devices can also be used. To accommodate a water-cooling system, especially when building a complex multi-channel water-cooling system, the water-cooling device will occupy a large amount of the internal space of the chassis, and the water-cooling head and water-cooling row on the market are very expensive, which creates a price barrier for the popularization of computers with water-cooling systems .

同时市场上也出现了一些比如固态硬盘以及技嘉和华擎都推出了适合一体电脑的显卡横置的主板,在此组合下也提高了传统一体电脑的兼容性和升级维修成本等优点,但是还是传统的散热方法,让这些一体电脑在高配置情况下的稳定性和寿命都严重下降。尤其是内存、南北桥芯片在温度较高、空间小内都不能及时散热。At the same time, some solid-state drives have also appeared in the market, and Gigabyte and ASRock have both launched motherboards with horizontal graphics cards suitable for all-in-one computers. This combination also improves the compatibility of traditional all-in-one computers and the advantages of upgrading and maintenance costs, but it is still traditional Therefore, the stability and lifespan of these all-in-one computers under high configuration are seriously reduced. In particular, the memory and north-south bridge chips cannot dissipate heat in time when the temperature is high and the space is small.

【发明内容】[Content of the invention]

本发明旨在解决上述问题,而提供一种结构简单、散热效果好、体积轻薄的空间占比小的主机。The present invention aims to solve the above problems, and provides a host with a simple structure, good heat dissipation effect, and a light and thin volume with a small space ratio.

为实现上述目的,本发明提供一种空间占比小的电脑主机,包括CPU、内存、硬盘、主板、显卡及电源,所述CPU、内存设在主板上,其特征在于,所述电脑主机的主板与显卡设置在同一平面且发热器件处于同一侧面,两者连接并通信;在主板上侧设有水冷装置,所述硬盘插接于主板上或固定于水冷装置上与主板通信连接,该水冷装置与主板上发热器件之间设有若干导热金属块,在主板同一平面至少一侧设有至少一个排风扇,所述主板及水冷装置外部设有外壳,在该外壳上设有网板,在外壳底部设有支座,在该支座内或主板及水冷装置一侧设有电源,使得电脑主机的厚度减少从而体积被压缩。In order to achieve the above object, the present invention provides a computer host with a small space ratio, including a CPU, a memory, a hard disk, a motherboard, a graphics card and a power supply, the CPU and the memory are arranged on the motherboard, and it is characterized in that the computer host has a The main board and the graphics card are arranged on the same plane and the heating device is on the same side, and the two are connected and communicated; a water cooling device is arranged on the upper side of the main board, and the hard disk is inserted into the main board or fixed on the water cooling device to communicate with the main board. There are several heat-conducting metal blocks between the device and the heating device on the main board, and at least one exhaust fan is arranged on at least one side of the same plane of the main board. A support is arranged at the bottom, and a power supply is arranged in the support or on one side of the main board and the water cooling device, so that the thickness of the computer host is reduced and the volume is compressed.

所述水冷装置包括蛇形水管、水泵、导热片及散热片,所述蛇形水管由直通管及U形管连接而成或由水管一体成形,该蛇形水管与水泵的进水口及出水口连接形成回路,所述导热片包括第一导热片及第二导热片,第二导热片的一面与所述导热金属块贴合,所述第一导热片与第二导热片的结合部设有多个凹槽,多段直通管分别穿过由第一导热片与第二导热片对合而成的凹槽,所述第一导热片、第二导热片分别固定在直通管两侧,所述散热片设有多个通孔,所述直通管的端部置于所述散热片的多个通孔中,所述排风扇设在散热片上。The water cooling device includes a serpentine water pipe, a water pump, a heat conducting fin and a heat sink. The serpentine water pipe is connected by a straight pipe and a U-shaped pipe or is integrally formed by a water pipe. The serpentine water pipe is connected to the water inlet and outlet of the water pump. The connection forms a loop, and the heat-conducting sheet includes a first heat-conducting sheet and a second heat-conducting sheet, one side of the second heat-conducting sheet is attached to the heat-conducting metal block, and the joint part of the first heat-conducting sheet and the second heat-conducting sheet is provided with a plurality of grooves, and the multi-section straight pipes respectively pass through the grooves formed by the combination of the first heat conducting sheet and the second heat conducting sheet, the first heat conducting sheet and the second heat conducting sheet are respectively fixed on both sides of the straight pipe, the The heat sink is provided with a plurality of through holes, the ends of the straight pipes are placed in the plurality of through holes of the heat sink, and the exhaust fan is arranged on the heat sink.

所述蛇形水管是由金属直通管与金属U形管焊接而成。The serpentine water pipe is formed by welding a metal straight-through pipe and a metal U-shaped pipe.

所述蛇形水管是由U形管套在直通管上而形成,在U形管套在直通管的连接部位设有密封圈。The serpentine-shaped water pipe is formed by sheathing a U-shaped pipe on the straight-through pipe, and a sealing ring is provided at the connection part of the U-shaped pipe sheathed on the straight-through pipe.

所述蛇形水管是由金属直通管与硅胶制成的U形管套接并用紧箍圈紧固而成。The serpentine-shaped water pipe is formed by sleeving a metal straight-through pipe and a U-shaped pipe made of silica gel and fastened with a tight hoop.

所述直通管在与导热片结合部位的内部设有多通道管。The straight-through pipe is provided with a multi-channel pipe inside the joint part with the heat-conducting sheet.

所述直通管截面为圆形、椭圆形或方形。The cross section of the straight pipe is circular, oval or square.

所述主板及显卡通过导热金属块及导热片与直通管固定。The main board and the graphics card are fixed with the straight-through pipe through the heat-conducting metal block and the heat-conducting sheet.

所述直通管由分别位于其两侧的固定条对合固定,固定条上设有与供直通管穿过的通孔,所述固定条的下端与所述支座连接。The straight-through pipe is fixed by butt joints with fixing bars located on both sides of the straight-through pipe, the fixing bars are provided with a through hole for the straight-through pipe to pass through, and the lower end of the straight-through pipe is connected with the support.

本发明还提供一种台式电脑,包括主机、显示屏,所述主机上述的空间占比小的电脑主机,显示屏通过螺丝或卡接固定在电脑主机前侧,所述支座上设有圆柱腔体,所述圆柱腔体内整合电源及音响模组。The present invention also provides a desktop computer, including a host computer and a display screen. The host computer has a small space ratio, and the display screen is fixed on the front side of the computer host through screws or clips. The support is provided with a column. A cavity, a power supply and a sound module are integrated in the cylindrical cavity.

本发明的贡献在于,其有效解决了现有电脑水冷系统价格贵,体积大,一体机维修麻烦等问题,本发明将主板跟显卡设置在同一平面,替代了传统的机,在CPU、北桥芯片、显卡等发热器件上设置导热金属块,导热金属块将发热器件的热量传给导热片,导热片将热量传给直通管,通过水冷进行散热,有效提高散热性能,改变了传统的CPU和显卡散热方式,有效减少主机的厚度,本发明的台式电脑,使用本发明的更薄的主机,并将显示器固定在主机上,替代了传统显示器支座,使得台式电脑更薄,美观和轻巧的同时没有大幅度额外增加成本。The contribution of the present invention is that it effectively solves the problems of high price, large volume, and troublesome maintenance of the existing computer water cooling system. The present invention sets the motherboard and the graphics card on the same plane, instead of the traditional computer. The heat-conducting metal block is set on the heating device such as the graphics card, the heat-conducting metal block transfers the heat of the heating device to the heat-conducting sheet, and the heat-conducting sheet transmits the heat to the straight-through pipe, and the heat is dissipated by water cooling, which effectively improves the heat dissipation performance and changes the traditional CPU and graphics card. The heat dissipation method can effectively reduce the thickness of the host computer. The desktop computer of the present invention uses the thinner host computer of the present invention and fixes the display on the host computer instead of the traditional display support, making the desktop computer thinner, beautiful and lightweight at the same time. There are no significant additional costs.

【附图说明】【Description of drawings】

图1是本发明空间占比小的主机第一实施例内部结构示意图;FIG. 1 is a schematic diagram of the internal structure of the first embodiment of the host with a small space ratio according to the present invention;

图2是本发明空间占比小的主机第二实施例内部结构示意图;2 is a schematic diagram of the internal structure of the second embodiment of the host with a small space ratio according to the present invention;

图3是本发明空间占比小的主机第二实施例内部结构爆炸图;3 is an exploded view of the internal structure of the second embodiment of the host with a small space ratio according to the present invention;

图4是本发明空间占比小的主机结构示意图;4 is a schematic diagram of the structure of a host with a small space ratio according to the present invention;

图5是本发明台式电脑外观示意图。5 is a schematic diagram of the appearance of the desktop computer of the present invention.

【具体实施方式】【Detailed ways】

下列实施例是对本发明的进一步解释和说明,对本发明不构成任何限制。The following examples are further explanations and illustrations of the present invention, and do not constitute any limitation to the present invention.

参阅图1至图4,本发明空间占比小的主机,包括所述电脑主机1的主板10、显卡20、水冷装置30、导热金属块40、排风扇50,外壳60,网板61、支座70、电源80。Referring to FIGS. 1 to 4 , the mainframe of the present invention with a small space ratio includes the mainboard 10 of the computer mainframe 1, the graphics card 20, the water cooling device 30, the heat-conducting metal block 40, the exhaust fan 50, the casing 60, the screen plate 61, the support 70. Power 80.

如图3所示,一种空间占比小的电脑主机,包括CPU、内存、硬盘、主板、显卡及电源,所述CPU、内存设在主板10上,硬盘固定于主板10或水冷装置30上,电脑主机1的主板10一端设有转接口,将显卡20插入转接口内,使得主板10与显卡20在同一平面且发热器件处于同一侧面通信连接,从而使得主机厚度减少。As shown in FIG. 3 , a computer host with a small space ratio includes a CPU, a memory, a hard disk, a main board, a graphics card and a power supply. The CPU and memory are arranged on the main board 10 , and the hard disk is fixed on the main board 10 or the water cooling device 30 . One end of the motherboard 10 of the computer host 1 is provided with a transfer interface, and the graphics card 20 is inserted into the transfer port, so that the motherboard 10 and the graphics card 20 are on the same plane and the heating device is on the same side for communication and connection, thereby reducing the thickness of the host.

如图1至图3所示,水冷装置30设置在主板1的上侧,水冷装置30包括蛇形水管31、水泵32、导热片33及散热片34,所述蛇形水管31由直通管311及U形管312连接而成也可一体成形,该蛇形水管31与水泵32的进水口及出水口连接形成回路;导热片包括第一导热片331、第二导热片332,第一导热片331与第二导热片332结合处设有凹槽333,多段直通管311分别穿过由第一导热片331与第二导热片332对合而成的凹槽。第一导热片331、第二导热片332分别固定在直通管311两侧,如在第一导热片及第二导热片相对应位置设有螺孔,用螺丝固定。直通管311为金属管,U形管312为金属管或硅胶管,当U形管为金属管时,与直通管可以焊接而接或将U形管套接在直通管上并在连接处套上硅胶密封圈以使两者连接避免漏水;当U形管为硅胶管时,U形管套接在金属直通管上并用紧箍圈紧固而成,进一步密封,防止漏水。优选的,如图4所示,直通管311截面为圆形或椭圆形,以增加散热面积,也可以在直通管穿过导热片33结合部位在直通管内部套设多通道管3111或设计其它形状增加流体经过面积从而增加散热效果,散热片设有多个通孔,直通管的端部置于所述散热片的多个通孔中,所述排风扇设在散热片上。As shown in FIG. 1 to FIG. 3 , the water cooling device 30 is arranged on the upper side of the main board 1 , and the water cooling device 30 includes a serpentine water pipe 31 , a water pump 32 , a heat conduction fin 33 and a heat sink 34 , and the serpentine water pipe 31 is connected by a straight pipe 311 . The serpentine water pipe 31 is connected with the water inlet and outlet of the water pump 32 to form a loop; the heat conducting sheet includes a first heat conducting sheet 331, a second heat conducting sheet 332, a first heat conducting sheet A groove 333 is formed at the joint of the 331 and the second heat conducting sheet 332 , and the multi-section straight pipes 311 respectively pass through the grooves formed by the merging of the first heat conducting sheet 331 and the second heat conducting sheet 332 . The first heat-conducting sheet 331 and the second heat-conducting sheet 332 are respectively fixed on both sides of the straight pipe 311. For example, screw holes are provided at the corresponding positions of the first heat-conducting sheet and the second heat-conducting sheet, and are fixed with screws. The straight pipe 311 is a metal pipe, and the U-shaped pipe 312 is a metal pipe or a silicone tube. When the U-shaped pipe is a metal pipe, it can be welded to the straight pipe or the U-shaped pipe can be sleeved on the straight pipe and sleeved at the connection. Put on a silicone sealing ring to connect the two to avoid water leakage; when the U-shaped tube is a silicone tube, the U-shaped tube is sleeved on the metal straight-through tube and fastened with a tight hoop to further seal and prevent water leakage. Preferably, as shown in FIG. 4 , the cross-section of the straight pipe 311 is circular or oval to increase the heat dissipation area. It is also possible to set a multi-channel pipe 3111 inside the straight pipe or design other The shape increases the fluid passing area to increase the heat dissipation effect, the heat sink is provided with a plurality of through holes, the end of the straight pipe is placed in the plurality of through holes of the heat sink, and the exhaust fan is arranged on the heat sink.

如图3所示,导热金属块40设在主板10与水冷装置30之间,导热金属块40一面紧贴主板10及显卡20上的发热器件,如CPU、北桥芯片及显卡等发热面,另一面紧贴第二导热片332。发热器件散发出的热量通过导热金属块40将热量传导至第二导热片332,第二导热片332将热量传导至直通管311,蛇形水管31内装有冷却液,通过水泵32,将冷却液进行循环流动,当通过散热34时,进一步散热,从而降低发热器件的温度。As shown in FIG. 3 , the heat-conducting metal block 40 is arranged between the main board 10 and the water cooling device 30 , and one side of the heat-conducting metal block 40 is close to the heat-generating components on the main board 10 and the graphics card 20 , such as the heat-generating surface of the CPU, the north bridge chip and the graphics card, etc. One side is in close contact with the second thermal conductive sheet 332 . The heat radiated by the heating device conducts the heat to the second heat-conducting sheet 332 through the heat-conducting metal block 40, and the second heat-conducting sheet 332 conducts the heat to the straight pipe 311. The serpentine water pipe 31 is filled with cooling liquid. The circulating flow is carried out, and when passing through the heat dissipation 34, the heat is further dissipated, thereby reducing the temperature of the heat-generating device.

如图1至图3所示,排风扇50设置在主板10同一平面的至少一侧,优选地,在主板两侧分别设置一个或多个排风扇50,排风扇50设在散热片34上,排风扇50工作将散热片热量经过网板吹向外界,从而降低冷却液的温度。As shown in FIG. 1 to FIG. 3 , the exhaust fans 50 are arranged on at least one side of the same plane of the main board 10 . Preferably, one or more exhaust fans 50 are respectively arranged on both sides of the main board. The exhaust fans 50 are arranged on the heat sink 34 and the exhaust fans 50 work. The heat of the heat sink is blown to the outside through the stencil, thereby reducing the temperature of the coolant.

如图3所示,外壳60设置在主板10及水冷装置30的外部,在该外壳上装有网板61。排风扇50吹出的热风从网板61排出。直通管311由分别位于其两侧的固定条62对合固定,固定条62上设有与供直通管穿过的通孔,所述固定条62的下端与所述支座70连接,优选采用转轴连接,以便旋转调整角度。利用固定条从而将主板10、显卡20、水冷装置30、支座70固定为一个整体。As shown in FIG. 3 , the casing 60 is disposed outside the main board 10 and the water cooling device 30 , and the mesh plate 61 is mounted on the casing. The hot air blown by the exhaust fan 50 is exhausted from the screen plate 61 . The straight-through pipe 311 is fixed by the fixing bars 62 located on both sides of the straight-through pipe. The fixed-bar 62 is provided with a through hole through which the straight-through pipe passes. The shaft is connected to adjust the angle of rotation. The motherboard 10 , the graphics card 20 , the water cooling device 30 , and the support 70 are fixed as a whole by the fixing strip.

如图3、图5所示,支座70通过转轴与固定条62的下端固定连接,在支座70内设有圆柱腔体,所述圆柱腔体内设有电源80,或如图1所示在主板及水冷装置的一侧设有电源80。电源80整合电脑主机、显示屏及有源音响供电。As shown in FIG. 3 and FIG. 5 , the support 70 is fixedly connected with the lower end of the fixing bar 62 through the rotating shaft, and a cylindrical cavity is arranged in the support 70, and a power supply 80 is arranged in the cylindrical cavity, or as shown in FIG. 1 . A power supply 80 is provided on one side of the main board and the water cooling device. The power supply 80 integrates the power supply of the computer host, the display screen and the active audio.

如图3、图5所示,本发明还提供一种台式电脑,该台式电脑包括主机1、显示屏2,主机1为上述空间占比小的电脑主机,显示屏2通过螺丝或卡接固定在电脑主机1上。支座与主机内的固定件通过转轴连接。将显示屏固定在主机上,有别于电脑一体机,显示屏及主机各元件互相独立,维修方便且费用低。主机厚度薄,显示屏与主机组装在一起达到电脑一体机体积少,外观美观的目的。As shown in FIG. 3 and FIG. 5 , the present invention also provides a desktop computer, which includes a host computer 1 and a display screen 2, the host computer 1 is a computer host with a small proportion of the above-mentioned space, and the display screen 2 is fixed by screws or clamping on the host computer 1. The support is connected with the fixed part in the host through the rotating shaft. The display screen is fixed on the host computer, which is different from the computer all-in-one machine. The components of the display screen and the host computer are independent of each other, and the maintenance is convenient and the cost is low. The thickness of the host is thin, and the display screen and the host are assembled together to achieve the purpose of less volume and beautiful appearance of the computer all-in-one machine.

籍此,本发明的空间占比小的主机利用将主板与显卡设置在同一平面且发热器件处于同一侧面,同时在主板上侧设置水冷装置,对发热器件进行散热,此结构有效减少了主机的厚度,压缩了主机的体积,整合电源为主机、显示屏、音响等统一供电,本发明的台式电脑将显示屏安装在主机上,达到了一体机的整体的外观效果,同时因主机及显示屏的元器件相互独,维护及升级方便及费用低。In this way, the host with a small space ratio of the present invention utilizes that the main board and the graphics card are arranged on the same plane and the heating device is on the same side, and at the same time, a water cooling device is arranged on the upper side of the main board to dissipate heat from the heating device. The thickness of the host is compressed, the volume of the host is compressed, and the power supply is integrated to supply power for the host, the display screen, and the audio system. The components are independent of each other, maintenance and upgrade are convenient and the cost is low.

尽管通过以上实施例对本发明进行了揭示,但是本发明的范围并不局限于此,在不偏离本发明构思的条件下,以上各构件可用所属技术领域人员了解的相似或等同元件来替换。Although the present invention is disclosed through the above embodiments, the scope of the present invention is not limited thereto, and the above components may be replaced by similar or equivalent elements known to those skilled in the art without departing from the concept of the present invention.

Claims (9)

1. A computer host with small space occupation ratio comprises a CPU, an internal memory, a hard disk, a mainboard, a display card and a power supply, wherein the CPU and the internal memory are arranged on the mainboard, and the computer host is characterized in that the mainboard (10) and the display card (20) of the computer host (1) are arranged on the same plane, heating devices are arranged on the same side surface, and the mainboard (10) and the display card are connected and communicated; the water cooling device (30) is arranged on the upper side of the mainboard, the hard disk is inserted on the mainboard (10) or fixed on the water cooling device (30) to be in communication connection with the mainboard, a plurality of heat-conducting metal blocks (40) are arranged between the water cooling device (30) and heating devices on the mainboard (10), at least one exhaust fan (50) is arranged on at least one side of the same plane of the mainboard (10), the water cooling device (30) comprises a serpentine water pipe (31), a water pump (32), heat-conducting fins (33) and radiating fins (34), the serpentine water pipe (31) is formed by connecting a straight pipe (311) and a U-shaped pipe (312) or integrally formed by water pipes, the serpentine water pipe (31) is connected with a water inlet and a water outlet of the water pump (32) to form a loop, the heat-conducting fins comprise a first heat-conducting fin (331) and a second heat-conducting fin (332), one surface of the second heat-conducting fin (332, the computer is characterized in that a plurality of grooves (333) are formed in the joint of the first heat conducting strip (331) and the second heat conducting strip (332), a plurality of sections of straight-through tubes (311) penetrate through the grooves formed by the first heat conducting strip (331) and the second heat conducting strip (332) in a closing mode respectively, the first heat conducting strip (331) and the second heat conducting strip (332) are fixed on the two sides of the straight-through tube (311) respectively, the radiating fin (34) is provided with a plurality of through holes, the end portion of the straight-through tube (311) is arranged in the plurality of through holes of the radiating fin (34), the exhaust fan (50) is arranged on the radiating fin (34), a shell (60) is arranged outside the main board and the water cooling device, a screen plate (61) is arranged on the shell, a support (70) is arranged at the bottom of the shell, and a power supply (80) is arranged in the support or on one side of the.
2. The computer host with small space occupation according to claim 1, wherein the serpentine water pipe (31) is formed by welding a metal straight-through pipe and a metal U-shaped pipe.
3. The computer host with small space occupation ratio according to claim 1, wherein the serpentine water pipe (31) is formed by sleeving a U-shaped pipe (312) on a straight-through pipe (311), and a sealing ring is arranged at the connection part of the U-shaped pipe (312) sleeved on the straight-through pipe (311).
4. The computer host with small space occupation ratio according to claim 1, wherein the serpentine water pipe (31) is formed by sleeving a metal straight-through pipe (311) and a U-shaped pipe (312) made of silica gel and fastening the metal straight-through pipe and the U-shaped pipe by using a clamping ring.
5. The computer mainframe with small space occupation according to any of the claims 1 to 4, wherein the through pipe (311) is provided with a multi-channel pipe (3111) inside a portion where the heat conductive sheet (33) is combined.
6. The computer host with small space occupation according to claim 5, characterized in that the cross section of the through pipe (311) is circular, oval or square.
7. The computer host of claim 1, wherein the motherboard (10) and the graphics card (20) are fixed to the through-tube (311) by a heat-conducting metal block (40) and a heat-conducting sheet.
8. The computer mainframe according to claim 1, wherein the through pipe is fixed by fixing strips (62) respectively located at two sides of the through pipe in an involution manner, a through hole for the through pipe to pass through is formed on the fixing strip (62), and the lower end of the fixing strip (62) is connected with the support (70).
9. The desktop computer comprises a host (1) and a display screen (2), and is characterized in that the host (1) is the computer host with a small space occupation ratio as claimed in any one of claims 1 to 8, the display screen (2) is fixed on the front side of the computer host (1) through a screw or a clamping joint, a cylindrical cavity is arranged on a support (70), and a power supply and a sound module are integrated in the cylindrical cavity.
CN201710273270.3A 2017-04-25 2017-04-25 Computer host and desktop computer with small space occupation ratio Expired - Fee Related CN107193338B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710273270.3A CN107193338B (en) 2017-04-25 2017-04-25 Computer host and desktop computer with small space occupation ratio

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710273270.3A CN107193338B (en) 2017-04-25 2017-04-25 Computer host and desktop computer with small space occupation ratio

Publications (2)

Publication Number Publication Date
CN107193338A CN107193338A (en) 2017-09-22
CN107193338B true CN107193338B (en) 2020-10-23

Family

ID=59872549

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710273270.3A Expired - Fee Related CN107193338B (en) 2017-04-25 2017-04-25 Computer host and desktop computer with small space occupation ratio

Country Status (1)

Country Link
CN (1) CN107193338B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10694640B2 (en) * 2018-01-30 2020-06-23 Quanta Computer Inc. Server water cooling modules prevent water leakage device
CN111414025A (en) * 2020-04-13 2020-07-14 江苏集萃智能光电系统研究所有限公司 Visual sensor autonomous temperature control device and method for outdoor complex environment
CN111538398A (en) * 2020-05-07 2020-08-14 成都心野科技有限公司 Computer power supply based on liquid cooling system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20312962U1 (en) * 2003-08-22 2003-10-16 Richard Wöhr GmbH, 75339 Höfen Housing for low noise stand-alone computer, has integrated or mounted heat-sink with or without cooling fins for removing heat from processor
CN101610661A (en) * 2008-06-20 2009-12-23 沈国忠 Liquid-cooled fully sealed high-efficiency radiating electronic cabinet
CN203882242U (en) * 2014-02-25 2014-10-15 深圳三诺信息科技有限公司 Flat-type connecting structure for graphics card and mainboard
CN204990127U (en) * 2015-08-04 2016-01-20 北京市九州风神科技有限公司 Computer machine case of water -cooled

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20312962U1 (en) * 2003-08-22 2003-10-16 Richard Wöhr GmbH, 75339 Höfen Housing for low noise stand-alone computer, has integrated or mounted heat-sink with or without cooling fins for removing heat from processor
CN101610661A (en) * 2008-06-20 2009-12-23 沈国忠 Liquid-cooled fully sealed high-efficiency radiating electronic cabinet
CN203882242U (en) * 2014-02-25 2014-10-15 深圳三诺信息科技有限公司 Flat-type connecting structure for graphics card and mainboard
CN204990127U (en) * 2015-08-04 2016-01-20 北京市九州风神科技有限公司 Computer machine case of water -cooled

Also Published As

Publication number Publication date
CN107193338A (en) 2017-09-22

Similar Documents

Publication Publication Date Title
TWM550838U (en) Heat dissipating structure of independent graphics card of computer and assembling structure thereof
WO2017202249A1 (en) Partition in computer system unit
CN107943254B (en) A portable computer device and its cooling module
CN107193338B (en) Computer host and desktop computer with small space occupation ratio
WO2017202247A1 (en) Computer system unit power supply unit
CN101001514A (en) Liquid-cooled radiating device and radiating unit
CN203376678U (en) A built-in water cooling heat sink for a notebook computer
CN107977064A (en) The water-cooling heat radiating device and its heat dissipating method of a kind of server
CN115079795A (en) Liquid cooling server and liquid cooling heat dissipation hard disk module thereof
CN204392759U (en) Liquid-cooled heat sink for electronic equipment
US20210212238A1 (en) Server heat dissipation structure
CN201336012Y (en) Combined type heat-radiating shell and embedded computer
CN2410678Y (en) A cooling device for a computer mainframe
CN206133448U (en) An Easy-to-Install Computer Radiator
CN110147151A (en) A cooling device for a computer mainframe
CN216930572U (en) A shell and a vehicle-mounted host
CN2665919Y (en) expandable heat sink
CN201229544Y (en) Computer with improved heat radiating construction
CN210119749U (en) Heat dissipation device and notebook computer
CN1629770A (en) Computer radiating method requiring no fans
TW202131780A (en) A server heat dissipation structure
CN103732038A (en) Heat dissipation structure
CN114546076A (en) A computer cooling system
CN101311879A (en) Heat radiation module and electronic device with same
JP3173802U (en) Heat dissipation module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201023

CF01 Termination of patent right due to non-payment of annual fee