CN107167970A - A kind of display base plate and display device - Google Patents
A kind of display base plate and display device Download PDFInfo
- Publication number
- CN107167970A CN107167970A CN201710404651.0A CN201710404651A CN107167970A CN 107167970 A CN107167970 A CN 107167970A CN 201710404651 A CN201710404651 A CN 201710404651A CN 107167970 A CN107167970 A CN 107167970A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- base plate
- display base
- layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 141
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 112
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000011241 protective layer Substances 0.000 claims abstract description 18
- 238000007789 sealing Methods 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims 6
- 239000000463 material Substances 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
- H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
本发明公开了一种显示基板及显示设备,该显示基板包括信号端子，该信号端子包括多个金属触片，每个金属触片包括第一金属层；设于第一金属层表面上的绝缘层；设于绝缘层表面上的第二金属层；设于所述第二金属层的表面上的保护层；其中，第二金属层在显示基板上的投影位于第一金属层在显示基板上的投影内。本发明可保证保护层与第二金属层密封接触，且可使第二金属层覆盖在绝缘层与第一金属层时不至于断裂。
The invention discloses a display substrate and a display device. The display substrate includes a signal terminal, and the signal terminal includes a plurality of metal contacts, and each metal contact includes a first metal layer; layer; a second metal layer disposed on the surface of the insulating layer; a protective layer disposed on the surface of the second metal layer; wherein, the projection of the second metal layer on the display substrate is located on the display substrate of the first metal layer within the projection. The invention can ensure the sealing contact between the protective layer and the second metal layer, and prevent the second metal layer from breaking when covering the insulating layer and the first metal layer.
Description
技术领域technical field
本发明涉及液晶显示器领域，特别是涉及一种显示基板及显示设备。The invention relates to the field of liquid crystal displays, in particular to a display substrate and a display device.
背景技术Background technique
薄膜晶体管液晶显示器(Thin Film Transistor Liquid Crystal Display,简称TFT-LCD)是一种重要的平板显示设备，它的主体结构为对盒设置的两个显示基板：阵列基板和彩膜基板，以及填充在阵列基板和彩膜基板之间的液晶层。在阵列基板上形成有栅线和数据线以及由栅线和数据线限定的像素单元，每个像素单元包括薄膜晶体管(Thin FilmTransistor,简称TFT)和像素电极。在显示过程中，TFT作为开关控制对液晶施加驱动电场，从而控制液晶的旋转，实现画面的显示。Thin Film Transistor Liquid Crystal Display (TFT-LCD for short) is an important flat panel display device. Its main structure is two display substrates arranged in pairs: an array substrate and a color filter substrate, as well as filling in The liquid crystal layer between the array substrate and the color filter substrate. Gate lines and data lines and pixel units defined by the gate lines and data lines are formed on the array substrate, and each pixel unit includes a thin film transistor (Thin Film Transistor, TFT for short) and a pixel electrode. During the display process, the TFT is used as a switch to control the application of a driving electric field to the liquid crystal, thereby controlling the rotation of the liquid crystal and realizing the display of the screen.
信号端子(Bonding lead)区域是显示基板内，外部信号进入显示基板内的接口区域，外部信号通过覆晶薄膜(COF，chip on film)连接到显示基板的信号端子上。其中，驱动信号和像素数据经由信号端子进入显示基板的显示区域，因此信号端子的设计结构直接关系到信号的供给是否顺畅。现有技术的信号端子的结构剖面图如图7所示，其包括衬底基板1、下金属层2、绝缘层3、上金属层4和保护层5，该上金属层4穿过多个过孔6与下金属层2接触，还有顶层的像素电极通过导线与上金属层4桥接。The signal terminal (Bonding lead) area is the interface area in the display substrate where external signals enter the display substrate, and the external signal is connected to the signal terminal of the display substrate through a chip on film (COF). Among them, the driving signal and pixel data enter the display area of the display substrate through the signal terminal, so the design structure of the signal terminal is directly related to whether the signal supply is smooth or not. The structural cross-sectional view of the signal terminal in the prior art is shown in FIG. 7, which includes a base substrate 1, a lower metal layer 2, an insulating layer 3, an upper metal layer 4, and a protective layer 5. The upper metal layer 4 passes through multiple The via hole 6 is in contact with the lower metal layer 2 , and the pixel electrode on the top layer is bridged with the upper metal layer 4 through wires.
本申请的发明人在长期研发中发现，现有技术的这种信号端子的结构存在以下问题：它的同一侧的上金属层4和下金属层2的边缘在竖直方向上是齐平的，这种齐平的弊端在于造成两层金属层叠加，使得其边缘处的坡度较陡，使得覆盖在上金属层4上的保护层5的覆盖性差，甚至容易脱落。如图8所示，为现有技术的信号端子在制作过孔中，对下金属层上面的绝缘层3进行曝光显影后，留下光刻胶7的结构示意图，去掉光刻胶7后的结构示意图如图9所示。The inventors of the present application have found through long-term research and development that the structure of this signal terminal in the prior art has the following problems: the edges of the upper metal layer 4 and the lower metal layer 2 on the same side are flush in the vertical direction The disadvantage of this leveling is that the two metal layers are superimposed, so that the slope at the edge is relatively steep, so that the protective layer 5 covering the upper metal layer 4 has poor coverage and even falls off easily. As shown in Figure 8, it is a schematic diagram of the structure of the photoresist 7 left after the insulating layer 3 above the lower metal layer is exposed and developed in the via hole of the signal terminal of the prior art, and the photoresist 7 is removed. The schematic diagram of the structure is shown in Figure 9.
另外，如图10所示为现有技术的信号端子的俯视图，沿信号端子的伸展方向，均匀设有多个过孔6，但是相邻两个过孔6之间的间距21较小，在曝光显影下金属层2上的绝缘层3的过程中，容易造成相邻过孔6之间出现衍射等问题，导致曝光显影后，光刻胶7和绝缘层3的坡度比较陡，基本上呈直角状态，不利于上金属层4的爬坡，甚至在涂布时会导致上金属层4的断裂。In addition, as shown in FIG. 10 , it is a top view of a signal terminal in the prior art. Along the extension direction of the signal terminal, a plurality of via holes 6 are uniformly provided, but the distance 21 between two adjacent via holes 6 is relatively small. In the process of exposing and developing the insulating layer 3 on the lower metal layer 2, it is easy to cause problems such as diffraction between adjacent via holes 6, resulting in that after exposure and developing, the slope of the photoresist 7 and the insulating layer 3 is relatively steep, basically in the shape of The right-angled state is not conducive to the climbing of the upper metal layer 4, and may even cause the upper metal layer 4 to break during coating.
发明内容Contents of the invention
本发明主要提供一种显示基板及显示设备，以解决现有技术中，在显示基板的信号端子中，由于同一侧上下两层金属层的边缘齐平，造成两层金属层叠加，使得其边缘处的坡度较陡，使得覆盖在上金属层上的保护层的覆盖性差，甚至容易脱落的问题。The present invention mainly provides a display substrate and a display device to solve the problem in the prior art that in the signal terminals of the display substrate, because the edges of the upper and lower metal layers on the same side are flush, the two layers of metal layers are superimposed, making the edges of the two metal layers The steep slope makes the protective layer covering the upper metal layer poor in coverage and even easy to fall off.
为解决上述技术问题，本发明采用的一技术方案如下：In order to solve the problems of the technologies described above, a technical solution adopted in the present invention is as follows:
一种显示基板，包括多个信号端子，每个所述信号端子包括多个金属触片，每个所述金属触片包括：A display substrate, including a plurality of signal terminals, each of the signal terminals includes a plurality of metal contacts, and each of the metal contacts includes:
第一金属层；绝缘层，设于所述第一金属层表面上；第二金属层，设于所述绝缘层表面上；保护层，设于所述第二金属层的表面上；其中，所述第二金属层在所述显示基板上的投影位于所述第一金属层在所述显示基板上的投影内。The first metal layer; the insulating layer, disposed on the surface of the first metal layer; the second metal layer, disposed on the surface of the insulating layer; the protective layer, disposed on the surface of the second metal layer; wherein, The projection of the second metal layer on the display substrate is located within the projection of the first metal layer on the display substrate.
为解决上述技术问题，本发明采用的另一技术方案如下：In order to solve the problems of the technologies described above, another technical solution adopted in the present invention is as follows:
一种显示设备，其包括驱动电路和上述任一项所述的显示基板，且所述驱动电路通过所述多个所述信号端子分别连接所述显示基板的栅极线与数据线。A display device, which includes a driving circuit and the display substrate described in any one of the above, and the driving circuit is respectively connected to a gate line and a data line of the display substrate through the plurality of signal terminals.
本发明的有益效果是：区别于现有技术的情况，本发明通过使第二金属层在显示基板上的投影位于第一金属层在显示基板上的投影内，不会造成两个金属层边缘对齐的情况叠加，使得其边缘处的坡度较平缓，可保证保护层与第二金属层密封接触，使得覆盖在上金属层上的保护层的覆盖性好，不容易脱落。The beneficial effect of the present invention is: different from the situation of the prior art, the present invention makes the projection of the second metal layer on the display substrate be located within the projection of the first metal layer on the display substrate, so that the edge of the two metal layers will not be caused. The alignment is superimposed, so that the slope at the edge is relatively gentle, which can ensure the sealing contact between the protective layer and the second metal layer, so that the protective layer covering the upper metal layer has good coverage and is not easy to fall off.
附图说明Description of drawings
图1是本发明的显示基板一实施方式的信号端子的部分剖面结构示意图；1 is a partial cross-sectional structural schematic diagram of a signal terminal of an embodiment of a display substrate of the present invention;
图2是本发明的显示基板一实施方式的信号端子在制作过程中，对第一金属层上面的绝缘层进行曝光显影后，留下光刻胶的部分结构示意图；2 is a schematic diagram of a part of the structure of a photoresist left after exposing and developing the insulating layer above the first metal layer during the manufacturing process of the signal terminal in an embodiment of the display substrate of the present invention;
图3是本发明的显示基板一实施方式的信号端子在制作过程中，去掉光刻胶后，留下第一金属层和绝缘层的部分结构示意图；3 is a schematic diagram of a part of the structure of the first metal layer and the insulating layer left after the photoresist is removed during the manufacturing process of the signal terminal in an embodiment of the display substrate of the present invention;
图4是本发明的显示基板一实施方式的信号端子的沿其伸展方向的部分结构俯视图；4 is a top view of the partial structure of the signal terminals along the extending direction of an embodiment of the display substrate of the present invention;
图5是本发明的显示基板一实施方式的部分结构示意图；FIG. 5 is a partial structural schematic diagram of an embodiment of a display substrate of the present invention;
图6是本发明的显示设备的一实施方式的部分结构示意图；Fig. 6 is a partial structural schematic diagram of an embodiment of the display device of the present invention;
图7是现有技术的显示基板的信号端子一实施方式的部分剖面结构示意图；7 is a partial cross-sectional structural schematic diagram of an embodiment of a signal terminal of a display substrate in the prior art;
图8是现有技术的显示基板的信号端子在制作过程中，对第一金属层上面的绝缘层进行曝光显影后，留下光刻胶的部分结构示意图；8 is a schematic diagram of a part of the structure of the photoresist left after exposing and developing the insulating layer on the first metal layer during the manufacturing process of the signal terminal of the display substrate in the prior art;
图9是现有技术的显示基板的信号端子在制作过程中，去掉光刻胶后，留下下金属层和部分绝缘层的部分结构示意图；FIG. 9 is a partial structural schematic view of the lower metal layer and part of the insulating layer left after the photoresist is removed during the manufacturing process of the signal terminal of the display substrate in the prior art;
图10是现有技术的显示基板的信号端子沿其伸展方向的部分结构俯视图。FIG. 10 is a partial structural top view of the signal terminals of the display substrate along the extending direction of the prior art.
具体实施方式detailed description
实施例一Embodiment one
请参阅图1至图5，图1是本发明的显示基板500的信号端子300的部分剖面结构示意图，图2是本发明的显示基板500的信号端子300在制作过程中，对第一金属层20上面的绝缘层30进行曝光显影后，留下光刻胶70的部分结构示意图，图3是本发明的显示基板500的信号端子300在制作过程中，去掉光刻胶70后，留下第一金属层20和绝缘层30的部分结构示意图，图4是本发明的显示基板500的信号端子300的沿其伸展方向的部分结构俯视图，图5是本发明的显示基板500的部分结构示意图。Please refer to FIG. 1 to FIG. 5. FIG. 1 is a partial cross-sectional structural diagram of the signal terminal 300 of the display substrate 500 of the present invention. FIG. After the insulating layer 30 above the insulating layer 30 is exposed and developed, the partial structural diagram of the photoresist 70 is left. FIG. A partial structural diagram of the metal layer 20 and the insulating layer 30, FIG. 4 is a partial structural top view of the signal terminal 300 of the display substrate 500 of the present invention along its extending direction, and FIG. 5 is a partial structural schematic diagram of the display substrate 500 of the present invention.
从图1到图5可以看到，本发明的一种显示基板500，包括多个设在显示区域400周边的信号端子300，外部信号通过覆晶薄膜200连接到显示基板500的信号端子300上。其中，驱动信号和像素数据经由信号端子300进入显示基板500的显示区域400，每个所述信号端子300包括多个金属触片100，每个所述金属触片100包括：It can be seen from FIG. 1 to FIG. 5 that a display substrate 500 of the present invention includes a plurality of signal terminals 300 arranged around the display area 400, and external signals are connected to the signal terminals 300 of the display substrate 500 through the chip-on-chip film 200. . Wherein, the driving signal and pixel data enter the display area 400 of the display substrate 500 through the signal terminal 300, each of the signal terminals 300 includes a plurality of metal contacts 100, and each of the metal contacts 100 includes:
第一金属层20，其制作在衬底基板10的一面上。The first metal layer 20 is fabricated on one side of the base substrate 10 .
绝缘层30，设于所述第一金属层20表面上。The insulating layer 30 is disposed on the surface of the first metal layer 20 .
第二金属层40，设于所述绝缘层30表面上，第一金属层20和第二金属层40将绝缘层30夹在中间。The second metal layer 40 is disposed on the surface of the insulating layer 30 , and the insulating layer 30 is sandwiched between the first metal layer 20 and the second metal layer 40 .
保护层50，设于所述第二金属层40的表面上，用于避免第二金属层40和其它导体发生导通。The protection layer 50 is disposed on the surface of the second metal layer 40 and is used to prevent the second metal layer 40 from conducting with other conductors.
其中，所述第二金属层40在所述显示基板500上的投影位于所述第一金属层20在所述显示基板500上的投影内。Wherein, the projection of the second metal layer 40 on the display substrate 500 is located within the projection of the first metal layer 20 on the display substrate 500 .
在本实施例中，同一侧的所述第一金属层20的边缘与所述第二金属层40的边缘在水平方向上的距离大于或等于第一预设距离12，所述第一预设距离12可保证所述保护层50与所述第二金属层40密封接触。如图1所示，同一侧的所述第二金属层40向里缩进一定距离，该距离大于或等于第一预设距离12，使得保护层50可以有一个平缓坡度，不至于和第二金属层40的接触不好，更不会导致其断裂。In this embodiment, the horizontal distance between the edge of the first metal layer 20 and the edge of the second metal layer 40 on the same side is greater than or equal to a first preset distance 12, the first preset distance The distance 12 ensures that the protective layer 50 is in sealing contact with the second metal layer 40 . As shown in FIG. 1 , the second metal layer 40 on the same side is indented by a certain distance, which is greater than or equal to the first preset distance 12, so that the protective layer 50 can have a gentle slope, so as not to be different from the second metal layer 40. The contact of the metal layer 40 is not good, and it will not cause its breakage.
在本实施例中，可选所述第一预设距离12大于1um。该数值是经过多次试验得出的经验值。第一预设距离12还可以是2um、3um等。In this embodiment, the first preset distance 12 may optionally be greater than 1 um. This value is an empirical value obtained through many tests. The first preset distance 12 can also be 2um, 3um and so on.
在本实施例中，所述第二金属层40通过导线与像素电极连接导通。In this embodiment, the second metal layer 40 is connected to the pixel electrode through a wire.
在本实施例中，其中，每个所述金属触片100沿其伸展方向设有多个过孔60，所述过孔60贯穿所述绝缘层30，所述第二金属层40穿过所述过孔60与所述第一金属层20接触导通，相邻两个所述过孔60的距离大于或等于第二预设距离11，所述第二预设距离11可保证在制作所述过孔60时，对所述绝缘层30进行蚀刻露出所述第一金属层20后，所述绝缘层30的与所述过孔60对应的坡度可使所述第二金属层40覆盖在所述绝缘层30与所述第一金属层20时不至于断裂。以上如图4所示，在本发明中，相邻两个过孔60之间的距离大于或等于第二预设距离11，在曝光显影第一金属层20上的绝缘层30的过程中，不容易造成相邻过孔60之间出现衍射等问题，不会导致曝光显影后，光刻胶70和绝缘层30的坡度比较陡。In this embodiment, each metal contact piece 100 is provided with a plurality of via holes 60 along its extending direction, the via holes 60 penetrate the insulating layer 30, and the second metal layer 40 passes through the The via hole 60 is in contact with the first metal layer 20, and the distance between two adjacent via holes 60 is greater than or equal to the second preset distance 11. The second preset distance 11 can ensure that the When the via hole 60 is described, after the insulating layer 30 is etched to expose the first metal layer 20, the slope of the insulating layer 30 corresponding to the via hole 60 can make the second metal layer 40 cover the The insulating layer 30 and the first metal layer 20 will not be broken. As shown in FIG. 4 above, in the present invention, the distance between two adjacent via holes 60 is greater than or equal to the second preset distance 11. During the process of exposing and developing the insulating layer 30 on the first metal layer 20, It is not easy to cause problems such as diffraction between adjacent via holes 60 , and it will not lead to a relatively steep slope between the photoresist 70 and the insulating layer 30 after exposure and development.
如图2和图3所示，由于相邻两个过孔60之间的距离大于或等于第二预设距离11，对绝缘层30进行曝光显影后，光刻胶70的坡度变得比较平缓，第一金属层20的坡度也变得比较平缓，有利于第二金属层40的爬坡，不会在涂布时会导致第二金属层40的断裂。As shown in FIG. 2 and FIG. 3 , since the distance between two adjacent via holes 60 is greater than or equal to the second preset distance 11, after the insulating layer 30 is exposed and developed, the slope of the photoresist 70 becomes relatively gentle. Therefore, the slope of the first metal layer 20 also becomes relatively gentle, which is beneficial to the climbing of the second metal layer 40 and will not cause breakage of the second metal layer 40 during coating.
在本实施例中，可选所述第二预设距离11大于8um，该数值是经过多次试验得出的经验值。所述第二预设距离11还可以是9um、10um和12um等。In this embodiment, the second preset distance 11 may optionally be greater than 8um, which is an empirical value obtained through multiple tests. The second preset distance 11 can also be 9um, 10um, 12um and so on.
在本实施例中，所述多个金属触片100与所述显示基板500的多条栅极线和数据线一一对应连接。In this embodiment, the plurality of metal contacts 100 are connected to the plurality of gate lines and data lines of the display substrate 500 in a one-to-one correspondence.
在本实施例中，可选所述绝缘层30的制作材料为二氧化硅，所述保护层50的制作材料为氧化铝。In this embodiment, the insulating layer 30 may be made of silicon dioxide, and the protective layer 50 may be made of aluminum oxide.
在本实施例中，可选所述第一金属层20或所述第二金属层40的制作材料均为铜金属材料。In this embodiment, the first metal layer 20 or the second metal layer 40 may be made of copper metal material.
本发明通过使第二金属层40在显示基板500上的投影位于第一金属层20在显示基板500上的投影内，不会造成两个金属层叠加，使得其边缘处的坡度较平缓，可保证保护层50与第二金属层40密封接触，使得覆盖在上金属层上的保护层50的覆盖性好，不容易脱落。本发明另外通过使相邻两个所述过孔60的距离大于或等于第二预设距离11，所述第二预设距离11可保证在制作所述过孔60时，对所述绝缘层30进行蚀刻露出所述第一金属层20后，所述绝缘层30的与所述过孔60对应的坡度可使所述第二金属层40覆盖在所述绝缘层30与所述第一金属层20时不至于断裂。In the present invention, the projection of the second metal layer 40 on the display substrate 500 is located within the projection of the first metal layer 20 on the display substrate 500, so that the two metal layers do not overlap, so that the slope at the edge is relatively gentle, which can Ensure that the protective layer 50 is in sealing contact with the second metal layer 40, so that the protective layer 50 covering the upper metal layer has good coverage and is not easy to fall off. In addition, the present invention makes the distance between two adjacent via holes 60 greater than or equal to the second preset distance 11, and the second preset distance 11 can ensure that the insulation layer is not damaged when making the via holes 60. 30 is etched to expose the first metal layer 20, the slope of the insulating layer 30 corresponding to the via hole 60 can make the second metal layer 40 cover the insulating layer 30 and the first metal layer 40. Layer 20 will not break.
实施例二Embodiment two
请参阅图6，图6是本发明的显示设备800的部分结构示意图。从图6可以看到，本发明的一种显示设备800，其包括驱动电路600和实施例一所述的显示基板500，且所述驱动电路600通过所述多个所述信号端子300分别连接所述显示基板500的栅极线(未标示)与数据线(未标示)，并对所述显示基板500进行驱动。Please refer to FIG. 6 . FIG. 6 is a partial structural diagram of a display device 800 of the present invention. It can be seen from FIG. 6 that a display device 800 of the present invention includes a driving circuit 600 and the display substrate 500 described in Embodiment 1, and the driving circuit 600 is connected to each other through the plurality of signal terminals 300 The gate line (not marked) and the data line (not marked) of the display substrate 500 are used to drive the display substrate 500 .
其中，所述显示基板500已经在实施例一中进行了详细的说明，在此不再重复进行说明。Wherein, the display substrate 500 has been described in detail in Embodiment 1, and will not be repeated here.
本发明的显示设备800，其包括的显示基板500的信号端子300，通过使第二金属层40在显示基板500上的投影位于第一金属层20在显示基板500上的投影内，不会造成两个金属层叠加，使得其边缘处的坡度较平缓，可保证保护层50与第二金属层40密封接触，使得覆盖在上金属层上的保护层50的覆盖性好，不容易脱落。本发明另外通过使相邻两个所述过孔60的距离大于或等于第二预设距离11，所述第二预设距离11可保证在制作所述过孔60时，对所述绝缘层30进行蚀刻露出所述第一金属层20后，所述绝缘层30的与所述过孔60对应的坡度可使所述第二金属层40覆盖在所述绝缘层30与所述第一金属层20时不至于断裂。In the display device 800 of the present invention, the signal terminal 300 of the display substrate 500 included in it, by making the projection of the second metal layer 40 on the display substrate 500 be located within the projection of the first metal layer 20 on the display substrate 500, will not cause The two metal layers are stacked so that the slope at the edge is relatively gentle, which can ensure the sealing contact between the protective layer 50 and the second metal layer 40, so that the protective layer 50 covering the upper metal layer has good coverage and is not easy to fall off. In addition, the present invention makes the distance between two adjacent via holes 60 greater than or equal to the second preset distance 11, and the second preset distance 11 can ensure that the insulation layer is not damaged when making the via holes 60. 30 is etched to expose the first metal layer 20, the slope of the insulating layer 30 corresponding to the via hole 60 can make the second metal layer 40 cover the insulating layer 30 and the first metal layer 40. Layer 20 will not break.
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。The above is only the embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process conversion made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technologies fields, all of which are equally included in the scope of patent protection of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710404651.0A CN107167970B (en) | 2017-06-01 | 2017-06-01 | Display substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710404651.0A CN107167970B (en) | 2017-06-01 | 2017-06-01 | Display substrate and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107167970A true CN107167970A (en) | 2017-09-15 |
| CN107167970B CN107167970B (en) | 2020-06-05 |
Family
ID=59821443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710404651.0A Active CN107167970B (en) | 2017-06-01 | 2017-06-01 | Display substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107167970B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538859A (en) * | 2018-04-24 | 2018-09-14 | 深圳市华星光电技术有限公司 | The production method of array substrate |
| CN109491159A (en) * | 2018-11-21 | 2019-03-19 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN109585459A (en) * | 2018-12-05 | 2019-04-05 | 惠科股份有限公司 | Preparation method of array substrate, display panel and display device |
| CN111509008A (en) * | 2020-04-20 | 2020-08-07 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display panel and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1743927A (en) * | 2005-10-12 | 2006-03-08 | 友达光电股份有限公司 | Fan-Out Wire Structure |
| CN203241671U (en) * | 2013-05-13 | 2013-10-16 | 深圳市华星光电技术有限公司 | Fan-out line structure of array substrate and display panel |
| US20130295701A1 (en) * | 2003-11-04 | 2013-11-07 | Lg Display Co., Ltd. | Liquid crystal display of horizontal electronic field applying type and fabricating method thereof |
| CN103676379A (en) * | 2013-12-24 | 2014-03-26 | 合肥京东方光电科技有限公司 | Array substrate and display device |
| CN105489121A (en) * | 2014-10-02 | 2016-04-13 | 乐金显示有限公司 | Pad structure and display device having the same |
-
2017
- 2017-06-01 CN CN201710404651.0A patent/CN107167970B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130295701A1 (en) * | 2003-11-04 | 2013-11-07 | Lg Display Co., Ltd. | Liquid crystal display of horizontal electronic field applying type and fabricating method thereof |
| CN1743927A (en) * | 2005-10-12 | 2006-03-08 | 友达光电股份有限公司 | Fan-Out Wire Structure |
| CN203241671U (en) * | 2013-05-13 | 2013-10-16 | 深圳市华星光电技术有限公司 | Fan-out line structure of array substrate and display panel |
| CN103676379A (en) * | 2013-12-24 | 2014-03-26 | 合肥京东方光电科技有限公司 | Array substrate and display device |
| CN105489121A (en) * | 2014-10-02 | 2016-04-13 | 乐金显示有限公司 | Pad structure and display device having the same |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108538859A (en) * | 2018-04-24 | 2018-09-14 | 深圳市华星光电技术有限公司 | The production method of array substrate |
| US10790320B2 (en) | 2018-04-24 | 2020-09-29 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Manufacturing method of array substrate |
| CN109491159A (en) * | 2018-11-21 | 2019-03-19 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN109491159B (en) * | 2018-11-21 | 2022-02-08 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN109585459A (en) * | 2018-12-05 | 2019-04-05 | 惠科股份有限公司 | Preparation method of array substrate, display panel and display device |
| US11289516B2 (en) | 2018-12-05 | 2022-03-29 | HKC Corporation Limited | Array substrate fabrication method, array substrate, and display panel |
| CN111509008A (en) * | 2020-04-20 | 2020-08-07 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display panel and display device |
| CN111509008B (en) * | 2020-04-20 | 2023-12-12 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, display panel and display device |
| US12302724B2 (en) | 2020-04-20 | 2025-05-13 | Ordos Yuansheng Optoelectronics Co., Ltd. | Array substrate, method for manufacturing same, display panel, and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107167970B (en) | 2020-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104716144B (en) | Array base palte and preparation method thereof, display device | |
| CN104460070B (en) | Display panel and preparation method thereof, display device | |
| CN103454819B (en) | Array base palte and manufacture method thereof for liquid crystal display | |
| JP5311531B2 (en) | Display panel with semiconductor chip mounted | |
| CN104216182B (en) | Array base palte and its manufacture method and display floater | |
| TWI297095B (en) | Bonding pad structure for a display and fabrication method thereof | |
| CN102593126B (en) | Panel and manufacturing method thereof | |
| CN106057824A (en) | Array substrate, manufacturing method thereof and display device | |
| CN108428705A (en) | A kind of array substrate and preparation method thereof, display panel, display device | |
| CN206470510U (en) | A kind of signal line structure, array base palte and display device | |
| CN104375347B (en) | Array base palte, patch, display panel and the method for repairing array base palte | |
| CN109148485B (en) | Array substrate, manufacturing method thereof and display device | |
| CN106405889A (en) | Display device | |
| CN204964955U (en) | Electricity connection structure , array substrate and display device | |
| CN104064567B (en) | Array substrate, display device and manufacturing method of array substrate | |
| TWI512582B (en) | Touch panel and touch display panel | |
| CN107167970A (en) | A kind of display base plate and display device | |
| CN105093759A (en) | Array substrate, preparing method of array substrate, display panel and display device | |
| CN108010925B (en) | display device | |
| CN105489596A (en) | Array substrate and fabrication method | |
| CN103439844B (en) | The method of array substrate, display unit and making array substrate | |
| CN104460154A (en) | Array substrate and manufacturing method thereof and display device | |
| CN108538859A (en) | The production method of array substrate | |
| CN104090402A (en) | Array substrate and manufacturing method thereof, and display device | |
| CN104617110B (en) | A kind of substrate and preparation method thereof, display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20171013 Address after: 518000 No. 9-2 Ming Avenue, Gongming street, Guangming District, Guangdong, Shenzhen Applicant after: Shenzhen Huaxing photoelectric semiconductor display technology Co., Ltd. Address before: 518006 9-2, Guangming Road, Guangming New District, Guangdong, Shenzhen Applicant before: Shenzhen Huaxing Optoelectronic Technology Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |