CN107093566B - A kind of silicon wafer automatic detection sorting device and its control method - Google Patents
A kind of silicon wafer automatic detection sorting device and its control method Download PDFInfo
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- CN107093566B CN107093566B CN201710293758.2A CN201710293758A CN107093566B CN 107093566 B CN107093566 B CN 107093566B CN 201710293758 A CN201710293758 A CN 201710293758A CN 107093566 B CN107093566 B CN 107093566B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
A kind of silicon wafer automatic detection sorting device, including band to band transfer module, conveyer belt device, automatic sorting device, control processing unit, console, further includes: ultrasonic probe, high-definition camera, shadowless lamp；The band to band transfer module device includes main, second level platform, three-level platform；The conveyer belt device further includes transmission belt, and the transmission belt includes main belt, the second conveyer belt, third conveyer belt, and the conveyer belt device further includes main drive motor, the second driving motor, third driving motor；The automatic sorting device further includes first mechanical arm and second mechanical arm, is also respectively provided with the first suction means and the second suction means in the first mechanical arm and second mechanical arm；Described main is additionally provided with the first testboard and secondary test board, and first testboard is provided with the first ultrasonic probe, and the secondary test board is provided with the second ultrasonic probe, high-definition camera, shadowless lamp；The console shows the operating status of detection device.
Description
Technical field
The present invention relates to silicon wafer detection fields, and in particular to a kind of silicon wafer automatic detection sorting device and its controlling party
Method.
Background technique
In solar monocrystalline silicon slice in large-scale production, silicon chip surface quality testing is an important ring, the appearance of silicon wafer
Quality will have a direct impact on production and transfer efficiency of subsequent solar battery sheet etc..Since the thickness of cutting is very thin and silicon
Physical property it is again highly brittle, so usually generating chipping in production process, silicon is fallen, unfilled corner and chemical residual color spot etc.
Geometry and surface defect in addition, in cutting process due to cutter the problem of usually generate the kerf in regular direction, these kerfs
Lead to the irregularity degree on surface.
Currently, solar silicon wafers detection stage division specifically includes that visual and Computer Image Processing two ways.Silicon
Many defects such as the desk checking of piece there is intensity big, low efficiency, subjective error be big, often result in the shakiness of product quality
It is fixed, due to manually-operated uncertainty, can also secondary damage be caused to silicon wafer.The detection method of Computer Image Processing utilizes
Silicon chip image in camera acquisition transmission belt, which is transmitted in processor, to be analyzed, and point of solar silicon wafers is realized by feeding distribution mechanism
It picks, but Computer Image Processing can not detect the problem inside silicon wafer, can not accurately classify to silicon wafer, and existing skill
Art generally only carries out one-time detection to silicon wafer, and accurately silicon wafer can not be classified, the longer influence production efficiency that one-time detection needs.
Summary of the invention
Goal of the invention: aiming at the problem that mentioning in background technique, the present invention provides a kind of silicon wafer automatic detection classification and sets
Standby and its control method.
Technical solution: a kind of silicon wafer automatic detection sorting device, including band to band transfer module, conveyer belt device, automatic sorting dress
Set, control processing unit, console, further includes: the first ultrasonic probe, the second ultrasonic probe, high-definition camera, without shadow
Lamp；The band to band transfer module device includes main, second level platform, three-level platform, and the second level platform, three-level platform is vertical with main and is respectively positioned on master
Platform side, described main there are also detection entrances and detection to export, and the three-level platform is located at detection inlet side, the main end
End is primes area, and the end of the second level platform is seconds area, and the end of the three-level platform is three-level product area；The transmission belt
Device further includes transmission belt, and the transmission belt is arranged on band to band transfer module, the transmission belt include main belt, the second conveyer belt,
Third conveyer belt, the main belt are set to main, and second conveyer belt is set to second level platform, and the third conveyer belt is set
It is placed in three-level platform, the conveyer belt device further includes main drive motor, the second driving motor, third driving motor, the main drive
Dynamic motor is electrically connected with main belt, second driving motor and the second transmission band connection, the third driving motor
Band connection is transmitted with the third；The main drive motor, the second driving motor, third driving motor and control processing unit electricity
Connection；The automatic sorting device further includes rotatable first mechanical arm and second mechanical arm, the first mechanical arm and the
The first suction means and the second suction means are also respectively provided on two mechanical arms, the automatic sorting device further includes the first machine
Tool arm driving device, second mechanical arm driving device, first draw driving device, the second absorption driving device, first machine
Tool arm driving device is electrically connected with first mechanical arm, and the second mechanical arm driving device is electrically connected with second mechanical arm, described
First absorption driving device is electrically connected with the first suction means, and the second absorption driving device is electrically connected with the second suction means
It connects；The first mechanical arm driving device, second mechanical arm driving device, first draw driving device, the second absorption driving dress
It sets and is electrically connected with control processing unit；Described main is additionally provided with the first testboard and secondary test board, first testboard
It is set to the detection inlet side of main with three-level platform link position, the secondary test board is set to main and connect with second level platform
The detection inlet side of position, first testboard bottom are provided with the first ultrasonic probe, the secondary test board bottom
It is provided with the second ultrasonic probe, high-definition camera, shadowless lamp, first ultrasonic probe, the second ultrasonic probe, high definition
Camera, shadowless lamp are electrically connected with control processing unit；The console is electrically connected with the control processing unit；The control
Platform shows the operating status of detection device, and operates to detection device.
As a kind of preferred embodiment of the invention, the secondary test board is additionally provided with resistivity tester, the resistance
Rate tester is electrically connected with the control processing unit respectively.
As a kind of preferred embodiment of the invention, the transmission belt is isolation material.
As a kind of preferred embodiment of the invention, the suction means is additionally provided with device for controlling sucking force, described to divide automatically
Picking device includes the first device for controlling sucking force connecting with first suction means and connect with the second suction means
Two device for controlling sucking force, the device for controlling sucking force are connect with control processing unit.
As a kind of preferred embodiment of the invention, the end of the band to band transfer module is additionally provided with counting device, the counting dress
It sets including the first counting device, the second counting device, third counting device, first counting device is set to main, described
Second counting device is set to second level platform, and the third counting device is set to three-level platform；The counting device and control are handled
Device electrical connection.
A kind of control method of silicon wafer automatic detection sorting device, comprising the following steps:
S100: control processor is to main drive motor, the second driving motor, third driving motor output services signal, institute
It states main drive motor, the second driving motor, third driving motor and respectively drives main belt, the second conveyer belt, third conveyer belt
Operating, it is described also to be visited to first ultrasonic probe, the second ultrasonic wave by silicon wafer from detection entrance to detection outlet delivery
Head, high-definition camera, shadowless lamp output services signal, first ultrasonic probe, the second ultrasonic probe, high-definition camera
Head, shadowless lamp are opened；
S200: the silicon wafer of first ultrasonic probe downwards issues ultrasonic signal and receives return signal, described
First ultrasonic probe exports returned data to control processor, if control processor judges silicon warp rate and curvature
Beyond the first preset threshold or silicon wafer, there are cracks, then the control processor is inhaled to first mechanical arm driving device with first
Driving device output drive signal is taken, which is drawn from main belt and be placed on third conveyer belt by first mechanical arm；
S201: the silicon wafer of second ultrasonic probe downwards issues ultrasonic signal and receives return signal, described
Returned data output is given control processor by the first ultrasonic probe, and the control processor is according to the letter of the second ultrasonic probe
Breath judges silicon warp rate and curvature beyond the second preset threshold, if so, executing S300；If it is not, then executing S202；
S202: the high-definition camera, which absorbs lower section silicon chip image and transmitted, gives control processor, at the control
Reason device judges silicon wafer with the presence or absence of superficial stain and edge crumbling, if so, executing S300 according to silicon chip image；
S300: the control processor draws driving device output driving letter with second to second mechanical arm driving device
Number, which is drawn from main belt and is placed on the second conveyer belt by second mechanical arm.
As a kind of preferred embodiment of the invention, the S203 further include: if it is not, then executing S203；
S203: the resistivity of the resistivity tester test silicon wafer and control processor, the control processing are given in transmission
When device judges whether resistivity is not less than four preset thresholds, if so, executing S300；
As a kind of preferred embodiment of the invention, the counting device records the quantity of silicon wafer in transmission belt in preset time
And export and give the control processor, the control processor counts the silicon wafer grade ratio and is set to default grade threshold
Value, when level-one grade ratio decrease beyond default grade threshold value, Xiang Suoshu console exports caution signal.
The present invention realize it is following the utility model has the advantages that
1. a pair silicon wafer is detected twice；
2. utilizing the slight crack inside ultrasound examination silicon wafer；
3. detecting the resistivity of silicon wafer；
4. counting silicon wafer grade ratio, given a warning when the decline of primes ratio.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and consistent with the instructions for explaining the principles of this disclosure.
Fig. 1 is a kind of schematic top plan view of silicon wafer automatic detection sorting device provided by the invention；
Fig. 2 is a kind of first testboard schematic diagram of silicon wafer automatic detection sorting device provided by the invention；
Fig. 3 is a kind of testboard schematic diagram of silicon wafer automatic detection sorting device provided by the invention；
Fig. 4 is a kind of block diagram of silicon wafer automatic detection sorting device provided by the invention；
Fig. 5 is a kind of silicon wafer automatic detection sorting device device for controlling sucking force annexation figure provided by the invention；
Fig. 6 is secondary test board's schematic diagram of second of silicon wafer automatic detection sorting device provided by the invention；
Fig. 7 is the block diagram of second of silicon wafer automatic detection sorting device provided by the invention；
Fig. 8 is secondary test board's schematic diagram of the third silicon wafer automatic detection sorting device provided by the invention；
Fig. 9 is the block diagram of the third silicon wafer automatic detection sorting device provided by the invention.
Wherein: 1. band to band transfer module, 2. conveyer belt devices, 21. main, 211. detection entrances, 212. detection outlets, 22. second levels
Platform, 23. three-level platforms, 24. transmission belts, 241. main belts, 242. second conveyer belts, 243. third conveyer belts, 25. main driving electricity
Machine, 26. second driving motors, 27. third driving motors, 3. automatic sorting devices, 31. first mechanical arms, 32. second machinery
Arm, 33. first suction means, 34. second suction means, 35. first mechanical arm driving devices, 36. second mechanical arms driving dress
It sets, 37. first draw driving device, 38. second absorption driving devices, 4. control processing units, 5. consoles, 6. first ultrasounds
Wave probe, 7. second ultrasonic probes, 8. high-definition cameras, 9. shadowless lamps, 10. first testboards, 11. secondary test boards, 12.
Resistivity tester, 13. device for controlling sucking force, 131. first device for controlling sucking force, 132. second device for controlling sucking force, 14. meters
Counting apparatus, 141. first counting devices, 142. second counting devices, 143. third counting devices.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Embodiment one
With reference to Fig. 1-5, Fig. 1 is a kind of schematic top plan view of silicon wafer automatic detection sorting device provided by the invention；Fig. 2
For a kind of first testboard schematic diagram of silicon wafer automatic detection sorting device provided by the invention；Fig. 3 is provided by the invention
A kind of secondary test board's schematic diagram of silicon wafer automatic detection sorting device；Fig. 4 is a kind of silicon wafer automation provided by the invention
Detect the block diagram of sorting device；Fig. 5 is that a kind of silicon wafer automatic detection sorting device device for controlling sucking force provided by the invention connects
Connect relational graph.
A kind of silicon wafer automatic detection sorting device, including band to band transfer module 1,24 device of transmission belt, automatic sorting device 3, control
Processing unit 4 processed, console 5, further includes: the first ultrasonic probe 6, the second ultrasonic probe 7, high-definition camera 8, shadowless lamp
9；1 device of band to band transfer module includes main 21, second level platform 22, three-level platform 23, and the second level platform 22, three-level platform 23 hang down with main 21
Directly and main 21 sides are respectively positioned on, described main 21 there are also detection entrances 211 and detection to export 212, and the three-level platform 23 is located at
211 side of entrance is detected, main 21 end is primes area, and the end of the second level platform 22 is seconds area, described
The end of three-level platform 23 is three-level product area；24 device of transmission belt further includes transmission belt 24, and the setting of transmission belt 24 is passing
On defeated 1, the transmission belt 24 includes main belt 241, the second conveyer belt 242, third conveyer belt 243, the main belt
241 are set to main 21, and second conveyer belt 242 is set to second level platform 22, and the third conveyer belt 243 is set to three-level platform
23,24 device of transmission belt further includes main drive motor 25, the second driving motor 26, third driving motor 27, the main drive
Dynamic motor 25 is electrically connected with main belt 241, and second driving motor 26 is connect with second conveyer belt 242, and described the
Three driving motors 27 are connect with the third conveyer belt 243；The main drive motor 25, the second driving motor 26, third driving
Motor 27 is electrically connected with control processing unit 4；The automatic sorting device 3 further includes rotatable first mechanical arm 31 and second
The first suction means 33 and the second absorption are also respectively provided in mechanical arm 32, the first mechanical arm 31 and second mechanical arm 32
Device 34, the automatic sorting device 3 further include 31 driving device 35 of first mechanical arm, 32 driving device 36 of second mechanical arm,
First, which draws driving device 37, second, draws driving device 38,31 driving device 35 of first mechanical arm and first mechanical arm
31 electrical connections, 32 driving device 36 of second mechanical arm are electrically connected with second mechanical arm 32, and described first draws driving device
37 are electrically connected with the first suction means 33, and the second absorption driving device 38 is electrically connected with the second suction means 34；Described
One mechanical arm, 31 driving device 35,32 driving device 36, first of second mechanical arm draw driving device 37, second and draw driving dress
38 are set to be electrically connected with control processing unit 4；Described main 21 is additionally provided with the first testboard 10 and secondary test board 11, and described the
One testboard 10 is set to 211 side of detection entrance of main 21 Yu 23 link position of three-level platform, and the secondary test board 11 sets
It is placed in 211 side of detection entrance of main 21 Yu 22 link position of second level platform, 10 bottom of the first testboard is provided with first
Ultrasonic probe 6,11 bottom of secondary test board are provided with the second ultrasonic probe 7, high-definition camera 8, shadowless lamp 9, institute
The first ultrasonic probe 6, the second ultrasonic probe 7, high-definition camera 8, shadowless lamp 9 is stated to be electrically connected with control processing unit 4；Institute
Console 5 is stated to be electrically connected with the control processing unit 4；The console 5 shows the operating status of detection device, and to detection
Equipment is operated.
As a kind of preferred embodiment of the invention, the automatic sorting device 3 is additionally provided with device for controlling sucking force 13, described
Device for controlling sucking force 13 includes the first device for controlling sucking force 131 connecting with first suction means 33 and draws with second
The second device for controlling sucking force 132 that device 34 connects, the device for controlling sucking force 13 are connect with control processing unit 4.
Wherein, the control processing unit 4 can be PLC, and it is also defeated that the control processing unit 4 handles the information received
Control signal out, the console 5 connect with control processing unit 4, console 5 can the output of display control processing apparatus 4 letter
Breath or to control 4 output order of processing unit.
1 device of band to band transfer module includes main 21, second level platform 22, three-level platform 23, and 24 device of transmission belt includes main biography
Band 241, the second conveyer belt 242, third conveyer belt 243 are sent, the main belt 241 is set to main 21, second transmission
Band 242 is set to second level platform 22, and the third conveyer belt 243 is set to three-level platform 23, the main drive motor 25 and main transmission
Band 241 is electrically connected, and second driving motor 26 is connect with second conveyer belt 242, the third driving motor 27 and institute
The connection of third conveyer belt 243 is stated, the main drive motor 25, the second driving motor 26, third driving motor 27 and control are handled
Device 4 is electrically connected, and controls processing unit 4 to main drive motor 25, the second driving motor 26,27 output services of third driving motor
Signal, the main drive motor 25, the second driving motor 26, third driving motor 27 respectively drive main belt according to signal
241, the second conveyer belt 242, third conveyer belt 243 work, and transmission belt 24 is by the chip transmission in transmission belt 24 to transmission belt
24 ends.
First sonic probe, the second ultrasonic probe 7 emit ultrasonic wave to assigned direction, and receive reflected
Ultrasonic wave, after by ultrasound information output give control processor.
The ingestible high definition image of the high-definition camera 8, the shadowless lamp 9 is to by the silicon wafer below secondary test board 11
9 light of shadowless lamp is provided, the high-definition camera 8, which absorbs the high definition image of the silicon wafer under shadowless lamp 9 and exports, gives control processor.
Preferably, the automatic sorting device 3 is additionally provided with device for controlling sucking force 13, for adjusting automatic sorting device 3
Suction, due to the characteristic of silicon wafer fragility, the excessively suction of strength can damage silicon wafer, and the device for controlling sucking force 13 wraps
Include the first device for controlling sucking force 131 connecting with first suction means 33 and connect with the second suction means 34 second
Device for controlling sucking force 132, the device for controlling sucking force 13 are connect with control processing unit 4.
Specifically, control processor is to main drive motor 25, the second driving motor 26,27 output services of third driving motor
Signal, the main drive motor 25, the second driving motor 26, third driving motor 27 respectively drive the biography of main belt 241, second
Band 242, third conveyer belt 243 is sent to operate, it is described also to described the by silicon wafer from detection entrance 211 to 212 transmission of detection outlet
One ultrasonic probe 6, the second ultrasonic probe 7, high-definition camera 8,9 output services signal of shadowless lamp, first ultrasonic wave
The 6, second ultrasonic probe 7 of probe, high-definition camera 8, shadowless lamp 9 are opened.The silicon wafer of first ultrasonic probe 6 downwards
It issuing ultrasonic signal and receives return signal, first ultrasonic probe 6 exports returned data to control processor, if
Control processor judges silicon warp rate and curvature, and beyond the first preset threshold or silicon wafer, there are underbead cracks, then described
Control processor draws 37 output drive signal of driving device, first mechanical arm to 31 driving device 35 and first of first mechanical arm
The silicon wafer is drawn from main belt 241 and is placed on third conveyer belt 243 by 31, and first preset threshold can be in 50-80 μ
Between m, it may be configured as 80 μm in the present embodiment.The silicon wafer of second ultrasonic probe 7 downwards issues ultrasonic signal
And return signal is received, returned data output is given control processor, the control processor root by first ultrasonic probe 6
Judge that silicon warp rate and curvature are default beyond the second preset threshold, described second according to the information of the second ultrasonic probe 7
Threshold value can be set as in the present embodiment 50 μm between 30-50 μm, if so, the control processor is to second mechanical arm
32 driving devices 36 and second draw 38 output drive signal of driving device, and second mechanical arm 32 is by the silicon wafer from main belt
241 draw and are placed on the second conveyer belt 242；If it is not, then the high-definition camera 8 absorbs lower section silicon chip image and is passed
Defeated to give control processor, the control processor judges that silicon wafer whether there is superficial stain and edge crumbling according to silicon chip image,
As a kind of judgment mode, the control processor can the qualified silicon chip image of memory one, the silicon wafer that control processor will receive
Image is compared with silicon chip image is prestored, if the silicon chip image is relative to prestoring, silicon chip image has edge line inconsistent or surface has
Abnormal then determine there are superficial stain and edge crumbling, then the control processor is to 32 driving device 36 of second mechanical arm and the
Two draw 38 output drive signals of driving device, which is drawn from main belt 241 and be placed in the by second mechanical arm 32
On two conveyer belts 242.
Device for controlling sucking force 13 is adjusted according further to the silicon chip state of absorption, if silicon wafer is had damage after transfer,
It controls processing unit 4 and is exported to the first device for controlling sucking force 131 and the second device for controlling sucking force 132 and reduce signal, described first
Suction means 33 and the second suction means 34 reduce suction, if silicon wafer can not be drawn or easily fall after drawing, control processing dress
It sets 4 and increases signal, first suction means 33 to the first device for controlling sucking force 131 and the output of the second device for controlling sucking force 132
Increase suction with the second suction means 34.
Embodiment two
With reference to Fig. 6-7, Fig. 6 is that the secondary test board of second of silicon wafer automatic detection sorting device provided by the invention shows
It is intended to；Fig. 7 is the block diagram of second of silicon wafer automatic detection sorting device provided by the invention.
The present embodiment is essentially identical with above-described embodiment, the difference is that, the secondary test board 11 is additionally provided with electricity
Resistance rate tester 12, the resistivity tester 12 are electrically connected with the control processing unit 4 respectively.
As a kind of preferred embodiment of the invention, the transmission belt 24 is isolation material.
The resistivity measurement device can detect that the resistivity of silicon wafer by probe contacts silicon chip surface.
Specifically, being additionally provided with Resistivity testing, 12 test silicon of resistivity tester after the detection of high-definition camera 8
The resistivity of piece and control processor is given in transmission, the control processor judges whether resistivity is not less than the 4th preset threshold
When, if so, the control processor draws 38 output driving of driving device to 32 driving device 36 and second of second mechanical arm
The silicon wafer is drawn from main belt 241 and is placed on the second conveyer belt 242 by signal, second mechanical arm 32, wherein described the
Four threshold values may be disposed between 0.5-3.6 Ω cm, may be configured as 3 Ω cm in the present embodiment.
Embodiment three
With reference to Fig. 8-9, Fig. 8 is that the secondary test board of the third silicon wafer automatic detection sorting device provided by the invention shows
It is intended to；Fig. 9 is the block diagram of the third silicon wafer automatic detection sorting device provided by the invention.
The present embodiment is essentially identical with above-described embodiment, the difference is that, the end of the band to band transfer module 1 is additionally provided with meter
Counting apparatus 14, the counting device 14 include the first counting device 141, the second counting device 142, third counting device 143, institute
It states the first counting device 141 and is set to main 21, second counting device 142 is set to second level platform 22, and the third counts
Device 143 is set to three-level platform 23；The counting device 14 is electrically connected with control processor.
The silicon wafer quantity that the record of counting device 14 passes through, the counting device 14 can be for using infrared sensors as inspection
The counting device 14 of survey means.
The control processing is given in the quantity of silicon wafer and output in transmission belt 24 in the record of counting device 14 preset time
Device, the control processor counts the silicon wafer grade ratio and is set to default grade threshold value, when under level-one grade ratio
When drop is more than default grade threshold value, Xiang Suoshu console 5 exports caution signal.The preset time may be configured as one month to one
Year, the time is more long, and sample data is more, and data are more accurate, may be selected six months in the present embodiment.The default grade threshold value
Accounting for primes, seconds, three-level product in statistics six months illustrates have in manufacturing process if primes accounting declines
Fault process, control processor export caution signal to console 5, and operator is notified to check the problems in production process.
Example IV
A kind of control method of silicon wafer automatic detection sorting device, comprising the following steps:
S100: control processor is believed to main drive motor 25, the second driving motor 26,27 output services of third driving motor
Number, the main drive motor 25, the second driving motor 26, third driving motor 27 respectively drive the transmission of main belt 241, second
Band 242, third conveyer belt 243 operate, described also to described first by silicon wafer from detection entrance 211 to 212 transmission of detection outlet
Ultrasonic probe 6, the second ultrasonic probe 7, high-definition camera 8,9 output services signal of shadowless lamp, first ultrasonic wave are visited
First 6, second ultrasonic probe 7, high-definition camera 8, shadowless lamp 9 are opened；
S200: the silicon wafer of first ultrasonic probe 6 downwards issues ultrasonic signal and receives return signal, described
First ultrasonic probe 6 exports returned data to control processor, if control processor judges silicon warp rate and bending
Degree beyond the first preset threshold or silicon wafer there are crack, then the control processor to 31 driving device 35 of first mechanical arm with
First draws 37 output drive signal of driving device, which is drawn and be placed in from main belt 241 by first mechanical arm 31
On third conveyer belt 243.
S201: the silicon wafer of second ultrasonic probe 7 downwards issues ultrasonic signal and receives return signal, described
Returned data output is given control processor by the first ultrasonic probe 6, and the control processor is according to the second ultrasonic probe 7
Information judges silicon warp rate and curvature beyond the second preset threshold, if so, executing S300；If it is not, then executing S202；
S202: the high-definition camera 8, which absorbs lower section silicon chip image and transmitted, gives control processor, at the control
Reason device judges silicon wafer with the presence or absence of superficial stain and edge crumbling, if so, executing S300 according to silicon chip image；
S300: the control processor draws the output drive of driving device 38 to 32 driving device 36 and second of second mechanical arm
The silicon wafer is drawn from main belt 241 and is placed on the second conveyer belt 242 by dynamic signal, second mechanical arm 32；
As a kind of preferred embodiment of the invention, the S203 further include: if it is not, then executing S203；
S203: control processor is given in the resistivity of 12 test silicon wafer of resistivity tester and transmission, at the control
When reason device judges whether resistivity is not less than four preset thresholds, if so, executing S300；
As a kind of preferred embodiment of the invention, the counting device records the quantity of silicon wafer in transmission belt in preset time
And export and give the control processor, the control processor counts the silicon wafer grade ratio and is set to default grade threshold
Value, when level-one grade ratio decrease beyond default grade threshold value, Xiang Suoshu console exports caution signal.
The present embodiment is the methodology of above-described embodiment, and particular content is essentially identical with above-described embodiment, no longer superfluous herein
It chats.
The above embodiments merely illustrate the technical concept and features of the present invention, and the purpose is to allow the skill for being familiar with the technical field
Art personnel can understand the content of the present invention and implement it accordingly, and can not be limited the scope of the invention with this.All bases
Equivalent changes or modifications made by spirit of the invention, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of silicon wafer automatic detection sorting device, including band to band transfer module (1), transmission belt (24) device (2), automatic sorting device
(3), processing unit (4), console (5) are controlled, which is characterized in that further include: the first ultrasonic probe (6), the second ultrasonic wave
Probe (7), high-definition camera (8), shadowless lamp (9)；Band to band transfer module (1) device includes main (3), second level platform (22), three-level
Platform (23), the second level platform (22), three-level platform (23) is vertical with main (3) and is respectively positioned on main (3) side, described main (3)
There are also entrance (211) and detection outlet (212) are detected, the three-level platform (23), which is located at, detects entrance (211) side, and described main
(3) end is primes area, and the end of the second level platform (22) is seconds area, and the end of the three-level platform (23) is three-level
Product area；Transmission belt (24) device (2) further includes transmission belt (24), and the transmission belt (24) is arranged on band to band transfer module (1), institute
Stating transmission belt (24) includes main belt (241), the second conveyer belt (242), third conveyer belt (243), the main belt
(241) it is set to main (3), second conveyer belt (242) is set to second level platform (22), and the third conveyer belt (243) sets
It is placed in three-level platform (23), transmission belt (24) device (2) further includes main drive motor (25), the second driving motor (26),
Three driving motors (27), the main drive motor (25) are electrically connected with main belt (241), second driving motor (26) with
Second conveyer belt (242) connection, the third driving motor (27) connect with the third conveyer belt (243)；The master
Driving motor (25), the second driving motor (26), third driving motor (27) are electrically connected with control processing unit (4)；It is described from
Dynamic sorting equipment (3) further include rotatable first mechanical arm (31) and second mechanical arm (32), the first mechanical arm (31)
With the first suction means (33) and the second suction means (34), the automatic sorting are also respectively provided on second mechanical arm (32)
Device (3) further includes first mechanical arm (31) driving device, second mechanical arm (32) driving device, the first absorption driving device
(37), second driving device (38) are drawn, first mechanical arm (31) driving device is electrically connected with first mechanical arm (31), institute
It states second mechanical arm (32) driving device to be electrically connected with second mechanical arm (32), described first draws driving device (37) and first
Suction means (33) electrical connection, described second draws driving device (38) is electrically connected with the second suction means (34)；Described first
Mechanical arm (31) driving device, second mechanical arm (32) driving device, first draw driving device (37), the second absorption driving dress
(38) are set to be electrically connected with control processing unit (4)；Main (3) are additionally provided with the first testboard (10) and secondary test board
(11), first testboard (10) is set to detection entrance (211) side of main (3) Yu three-level platform (23) link position,
The secondary test board (11) is set to detection entrance (211) side of main (3) Yu second level platform (22) link position, and described
One testboard (10) bottom is provided with the first ultrasonic probe (6), and secondary test board (11) bottom is provided with the second ultrasound
Wave probe (7), high-definition camera (8), shadowless lamp (9), first ultrasonic probe (6), the second ultrasonic probe (7), height
Clear camera (8), shadowless lamp (9) are electrically connected with control processing unit (4)；The console (5) and the control processing unit
(4) it is electrically connected；The console (5) shows the operating status of detection device, and operates to detection device.
2. a kind of silicon wafer automatic detection sorting device according to claim 1, which is characterized in that the secondary test board
(11) it is additionally provided with resistivity tester (12), the resistivity tester (12) is electric with the control processing unit (4) respectively
Connection.
3. a kind of silicon wafer automatic detection sorting device according to claim 2, which is characterized in that the transmission belt (24)
For isolation material.
4. a kind of silicon wafer automatic detection sorting device according to claim 1, which is characterized in that the automatic sorting dress
It sets (3) to be additionally provided with device for controlling sucking force (13), the device for controlling sucking force (13) includes and first suction means (33)
Connection the first device for controlling sucking force (131) (13) and the second device for controlling sucking force for connecting with the second suction means (34)
(132) (13), the device for controlling sucking force (13) connect with control processing unit (4).
5. a kind of silicon wafer automatic detection sorting device according to claim 1, which is characterized in that the band to band transfer module (1)
End be additionally provided with counting device (14), the counting device (14) include the first counting device (141) (14), second count
Device (142) (14), third counting device (143) (14), first counting device (141) (14) are set to main (3), institute
It states the second counting device (142) (14) to be set to second level platform (22), the third counting device (143) (14) is set to three-level platform
(23)；The counting device (14) is electrically connected with control processor.
6. a kind of control method of silicon wafer automatic detection sorting device described in -5 according to claim 1, which is characterized in that packet
Include following steps:
S100: control processor is to main drive motor (25), the second driving motor (26), third driving motor (27) output services
Signal, the main drive motor (25), the second driving motor (26), third driving motor (27) respectively drive main belt
(241), the second conveyer belt (242), third conveyer belt (243) operating export silicon wafer from detection entrance (211) to detection
(212) transmit, it is described also to first ultrasonic probe (6), the second ultrasonic probe (7), high-definition camera (8), without shadow
Lamp (9) output services signal, first ultrasonic probe (6), the second ultrasonic probe (7), high-definition camera (8), without shadow
Lamp (9) is opened；
S200: first ultrasonic probe (6) silicon wafer downwards issues ultrasonic signal and receives return signal, and described the
One ultrasonic probe (6) exports returned data to control processor, if control processor judges silicon warp rate and bending
Degree beyond the first preset threshold or silicon wafer there are crack, then the control processor to first mechanical arm (31) driving device with
First draws driving device (37) output drive signal, and first mechanical arm (31) draws the silicon wafer simultaneously from main belt (241)
It is placed on third conveyer belt (243)；
S201: second ultrasonic probe (7) silicon wafer downwards issues ultrasonic signal and receives return signal, and described the
Returned data output is given control processor by one ultrasonic probe (6), and the control processor is according to the second ultrasonic probe (7)
Information judge silicon warp rate and curvature beyond the second preset threshold, if so, executing S300；If it is not, then executing
S202；
S202: the high-definition camera (8), which is absorbed lower section silicon chip image and transmitted, gives control processor, the control processing
Device judges silicon wafer with the presence or absence of superficial stain and edge crumbling, if so, executing S300 according to silicon chip image；
S300: the control processor draws driving device (38) output driving with second to second mechanical arm (32) driving device
The silicon wafer is drawn from main belt (241) and is placed on the second conveyer belt (242) by signal, second mechanical arm (32).
7. a kind of control method of silicon wafer automatic detection sorting device according to claim 6, which is characterized in that described
S203 further include: if it is not, then executing S203；
S203: the resistivity of resistivity tester (12) test silicon wafer and control processor, the control processing are given in transmission
When device judges whether resistivity is not less than four preset thresholds, if so, executing S300.
8. a kind of control method of silicon wafer automatic detection sorting device according to claim 6, which is characterized in that described
The quantity of the silicon wafer and control processor, the control are given in output in transmission belt (24) in counting device (14) record preset time
Processor processed counts the silicon wafer grade ratio and is set to default grade threshold value, when level-one grade ratio decrease beyond it is default
When grade threshold value, Xiang Suoshu console (5) exports caution signal.
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| CN109225943B (en) * | 2018-10-30 | 2024-05-24 | 无锡欧龙宇自动化科技有限公司 | Automatic silicon wafer sorting and metering device |
| CN109708592A (en) * | 2018-12-27 | 2019-05-03 | 环球木业(昆山)有限公司 | A kind of plate detects a point equal devices automatically |
| CN110645903A (en) * | 2019-10-17 | 2020-01-03 | 武汉大学 | A method and device for three-dimensional online monitoring of warpage deformation and defects of a packaged module |
| CN112529357A (en) * | 2020-11-03 | 2021-03-19 | 特劢丝软件科技(上海)有限公司 | Silicon wafer grading method, system, electronic device and computer readable storage medium |
| CN113663929A (en) * | 2021-09-24 | 2021-11-19 | 深圳市广利达精密机械有限公司 | Automatic machining part automatic machining sorting equipment and method thereof |
| CN114192423B (en) * | 2021-12-07 | 2023-12-26 | 杭州中欣晶圆半导体股份有限公司 | Detection and correction device for warpage of epitaxial silicon wafer and working method |
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