CN107025427A - Fingerprint identification module - Google Patents

Abstract

The invention discloses a fingerprint identification module, which comprises: a substrate, a plurality of fingerprint sensing units; the substrate is provided with a first side and a second side; the plurality of fingerprint sensing units are respectively arranged on the second side of the substrate and provided with a base layer, the base layer is provided with a first surface, a second surface, an induction layer and a control IC, the induction layer is arranged on the first surface, and the control IC is selectively arranged on the first surface or the second surface; the fingerprint identification module provided by the invention can solve the problems that the large-area palm print identification module is difficult to manufacture and the manufacturing cost is too high.

Description

Fingerprint Recognition Module

technical field

The invention relates to a fingerprint identification module, in particular to a fingerprint identification module which can reduce the manufacturing cost of a large-size fingerprint or palmprint identification module.

Background technique

Existing mobile devices (such as mobile phones and tablet computers) are equipped with fingerprint identification modules. The fingerprint identification module can not only enable the security identification function of mobile phones, but also be used in third-party payment to ensure the security of third-party payment. Now Some fingerprint identification modules are mainly installed in the non-touch area of the mobile device, which is to distinguish the fingerprint identification area from the touch area. The fingerprint identification is mainly performed on a small local area at a time. When more than one fingerprint needs to be identified It cannot be carried out at the same time, but needs to be carried out sequentially. At present, because the recognition area is generally large, it is necessary to expand the identifiable working area, and the fingerprint or palmprint recognition module that can recognize a large range of fingerprints or palmprint areas The manufacturing cost is very high and the yield is relatively poor, so how to reduce the manufacturing cost and improve the manufacturing yield is the main problem to be solved by the present invention.

Contents of the invention

To solve the above problems, the main purpose of the present invention is to provide a fingerprint identification module that can reduce manufacturing costs.

A secondary purpose of the present invention is to provide a fingerprint identification module that can improve the manufacturing yield.

In order to achieve the above object, the present invention provides a fingerprint identification module, which includes: a substrate and a plurality of fingerprint sensing units;

The substrate has a first side and a second side, and the first side and the second side are correspondingly arranged on the upper side and the lower side of the glass substrate.

The plurality of fingerprint sensing units are separately arranged on the second side of the substrate, the plurality of fingerprint sensing units have a base layer, the base layer has a first surface, a second surface, a sensing layer and a control IC, the said The sensing layer is disposed on the first surface, and the control IC is selectively disposed on the first surface or the second surface.

In an embodiment of the present invention, the base layer is a silicon substrate or a silicon dioxide film.

In an embodiment of the present invention, the plurality of fingerprint sensing units are horizontally arranged at intervals.

In an embodiment of the present invention, the sensing layer has a plurality of sensing electrodes and a plurality of wirings, and the plurality of sensing electrodes and the plurality of wirings are electrically connected to the control IC.

In an embodiment of the present invention, the substrate is made of glass or polymethyl methacrylate.

In an embodiment of the invention, there is a gap between the plurality of fingerprint sensing units.

The fingerprint identification module provided by the invention can solve the problems that the large-area palmprint identification module is not easy to manufacture, the pass rate is low, and the manufacturing cost is too high.

Description of drawings

Fig. 1 is a three-dimensional exploded view of the first embodiment of the fingerprint identification module provided by the present invention;

Fig. 2 is a combined side view of the first embodiment of the fingerprint identification module provided by the present invention;

Fig. 3 is a combined side view of the second embodiment of the fingerprint identification module provided by the present invention;

Fig. 4 is a combined side view of the third embodiment of the fingerprint identification module provided by the present invention;

Fig. 5 is a combined side view of the fourth embodiment of the fingerprint identification module provided by the present invention;

Fig. 6 is a schematic diagram of the operation of the fingerprint identification module provided by the present invention.

Explanation of reference numerals: 1-fingerprint identification module; 11-substrate; 111-first side; 112-second side; 12-fingerprint sensing unit; 121-base layer; 1211-first surface; 1212-second surface; 1213-sensing layer; 1214-control IC; 13-gap; 2-palmprint recognition area.

detailed description

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

As shown in Fig. 1 and Fig. 2, they are respectively a three-dimensional exploded view and a combined side view of the first embodiment of the fingerprint identification module provided by the present invention. As shown in the figure, the fingerprint identification module 1 provided by the present invention includes: a substrate 11 and multiple a fingerprint sensing unit 12;

The substrate 11 has a first side 111 and a second side 112, the first side 111 and the second side 112 are correspondingly arranged on the upper side and the lower side of the substrate 11, the material of the substrate 11 is glass or poly Polymethylmethacrylate (Polymethylmethacrylate), this embodiment uses glass material as an illustrative example, but it is not limited thereto.

The plurality of fingerprint sensing units 12 are adjacent to each other and arranged side by side on the second side 112 of the substrate 11 . The plurality of fingerprint sensing units 12 have a base layer 121 , and the base layer 121 is a silicon substrate.

The base layer 121 has a first surface 1211, a second surface 1212, a sensing layer 1213 and a control IC 1214, the sensing layer 1213 is arranged on the first surface 1211, the control IC 1214 is arranged on the first surface 1211 and Adjacent to the sensing layer 1213, the sensing layer 1213 has a plurality of sensing electrodes and a plurality of routings (not shown in the figure), the plurality of sensing electrodes and the plurality of routings are electrically connected to the control IC 1214, the aforementioned The layered structure in the sensing layer 1213 can refer to the wiring structure of the existing fingerprint identification device, which will not be repeated here.

As shown in Figure 3, it is a combined side view of the second embodiment of the fingerprint identification module provided by the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. This embodiment The difference from the aforementioned first embodiment is that the base layer 121 is a silicon dioxide film. When the silicon dioxide film is used as the base layer 121, it must be coated on the second side of the substrate 11 in a layer-by-layer manner. 112 forming the structural layers of the plurality of fingerprint sensing units 12, first coating the aforementioned silicon dioxide film on the second side 112 of the substrate 11 to increase the degree of adhesion, and then the sensing layer 1213 of the fingerprint sensing units 12 And the control IC1214 is arranged on the aforementioned silicon dioxide film coated on the second side 112 of the substrate 11, and then a layer of silicon dioxide film is coated on the aforementioned sensing layer 1213 and the control IC1214 as the fingerprint sensing unit 12 The base layer 121 is used as insulation.

As shown in Figure 4, it is a combined side view of the third embodiment of the fingerprint identification module provided by the present invention. As shown in the figure, the partial structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. This embodiment The difference from the aforementioned first embodiment is that the control IC 1214 is disposed on the second surface 1212 , that is, disposed on the upper side and the lower side of the base layer 121 corresponding to the sensing layer 1213 .

As shown in Figure 5, it is a combined side view of the fourth embodiment of the fingerprint recognition module provided by the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. This embodiment The difference from the aforementioned first embodiment is that the plurality of fingerprint sensing units 12 are arranged at intervals on the second side 112 of the substrate 11, and there is a gap 13 between the plurality of fingerprint sensing units 12, and the plurality of gaps 13 An algorithm can be used to eliminate the identification invalid area caused by the plurality of gaps 13. This algorithm is an existing error correction algorithm, so it will not be described in detail here.

As shown in Figure 6, it is a working diagram of the fingerprint identification module provided by the present invention. As shown in Figures 1 to 5, the fingerprint identification module is mainly provided with a plurality of fingerprint sensing units 12 on the second side 112 of the substrate 11, and The plurality of fingerprint sensing units 12 are arranged in an array to form a palmprint identification area 2. When the user needs fingerprint identification, the plurality of fingerprint sensing units 12 are used for identification alone. If large-scale palmprint identification or When a plurality of fingerprint recognition tasks need to be carried out at the same time, the recognition is carried out through the above-mentioned palmprint recognition area. The plurality of fingerprint sensing units 12 in the present invention are mainly arranged on the second side 112 of the substrate 11. In fact, the user operates At this time, operations are performed corresponding to the first side 111 of the substrate 11 .

The main purpose of the present invention is to solve the problem that the provided fingerprint or palmprint recognition module cannot achieve the purpose of recognition when performing large-size fingerprint or palmprint recognition at present. Fingerprint or palmprint recognition modules can reduce manufacturing costs, because the cost of large-size silicon substrate materials required for the production of existing large-size fingerprint recognition modules is relatively expensive, and it is easy to produce substandard products during production and manufacturing, thereby increasing the failure rate. The fingerprint recognition module 1 disclosed by the present invention can solve the current problem of high manufacturing cost and reduce the defective rate.

Claims (6)

1. A fingerprint identification module, characterized in that, comprising: A base plate has a first side and a second side, and the first side and the second side are correspondingly arranged on the upper side and the lower side of the base plate; A plurality of fingerprint sensing units are separately arranged on the second side of the substrate, the plurality of fingerprint sensing units have a base layer, the base layer has a first surface, a second surface, a sensing layer and a control IC, the The sensing layer is disposed on the first surface, and the control IC is selectively disposed on the first surface or the second surface. 2. The fingerprint recognition module according to claim 1, wherein the base layer is a silicon substrate or a silicon dioxide film. 3. The fingerprint recognition module according to claim 1, wherein the plurality of fingerprint sensing units are horizontally arranged at intervals. 4. The fingerprint identification module according to claim 1, wherein the sensing layer has a plurality of sensing electrodes and a plurality of wirings, and the plurality of sensing electrodes and the plurality of wirings are electrically connected to the control IC . 5. The fingerprint recognition module according to claim 1, wherein the substrate is made of glass or polymethyl methacrylate. 6. The fingerprint identification module according to claim 1, wherein there is a gap between the plurality of fingerprint sensing units.