CN105205483A - Fingerprint sensing device - Google Patents

Abstract

The invention discloses a fingerprint sensing device which comprises a substrate, a sensing layer, a control chip and a protective layer. The sensing layer is disposed on the substrate and has a first side and a second side opposite to each other, wherein the first side is connected to the substrate. The control chip is arranged on the second side surface of the sensing layer. The protective layer is arranged on the second side surface of the sensing layer and is positioned between the sensing layer and the control chip.

Description

Fingerprint Sensing Device

technical field

The invention relates to a sensing device, and in particular to a fingerprint sensing device applied in fingerprint identification technology.

Background technique

The fingerprint identification technology uses a fingerprint sensing device to sense a user's fingerprint to identify an individual. Fingerprint sensing devices can be classified according to the applied technologies, such as optical fingerprint sensing devices, ultrasonic fingerprint sensing devices, pressure fingerprint sensing devices, or capacitive fingerprint sensing devices. Among them, the capacitive fingerprint sensing device has the advantage of small size, which is suitable for application in personal electronic devices, such as smart phones or tablet computers.

As far as capacitive fingerprint sensing devices are concerned, there are mainly two types of existing capacitive fingerprint sensing devices. The first type is a fingerprint sensing device in which the sensing layer and the control chip are arranged on a printed circuit board (PCB). device, and the second type is a fingerprint sensing device in which the sensing layer and the control circuit are integrated into a fingerprint sensing chip. The above-mentioned first type of fingerprint sensing device uses a printed circuit board manufacturing process to form a sensing layer, and the sensing layer is electrically connected to the control chip through the printed circuit board wiring. However, limited by the manufacturing process of the printed circuit board, the resolution of the above-mentioned first fingerprint sensing device cannot be effectively improved. On the other hand, in the above-mentioned second type of fingerprint sensing device, the sensing layer is formed in the chip. Through the chip manufacturing process, the distance between the sensing electrodes in the sensing layer can be reduced, thereby improving the resolution of fingerprint sensing. However, the manufacturing cost of the above-mentioned second type of fingerprint sensing device is relatively high.

Contents of the invention

The object of the present invention is to provide a fingerprint sensing device, which is characterized in that it can simultaneously have the advantages of high fingerprint recognition resolution, low manufacturing cost and large fingerprint sensing area.

According to the above objectives of the present invention, a fingerprint sensing device is proposed. The fingerprint sensing device includes a substrate, a sensing layer, a control chip and a protective layer. The sensing layer is disposed on the substrate and has a first side and a second side opposite to each other, wherein the first side is connected to the substrate. The control chip is disposed on the second side of the sensing layer. The protective layer is disposed on the second side of the sensing layer, and is located between the sensing layer and the control chip.

According to an embodiment of the present invention, the fingerprint sensing device further includes a plurality of metal wires. The metal wires are disposed on the second side surface of the sensing layer, and the metal wires are used to electrically connect the control chip to the sensing layer.

According to yet another embodiment of the present invention, the above-mentioned substrate is a glass substrate.

According to yet another embodiment of the present invention, the sensing layer is a glass type sensing layer or a film type sensing layer.

According to the above object of the present invention, a fingerprint sensing device is also proposed. The fingerprint sensing device includes a substrate, a sensing layer, a control chip and a protective layer. The substrate has a first side and a second side opposite to each other. The sensing layer is disposed on the first side of the substrate. The control chip is disposed on the second side of the substrate. The protective layer is disposed on the second side of the substrate, and is located between the substrate and the control chip.

According to an embodiment of the present invention, the fingerprint sensing device further includes a plurality of metal wires. The metal wires cross the substrate in the thickness direction of the substrate, and the metal wires are used to electrically connect the control chip to the sensing layer.

According to yet another embodiment of the present invention, the above-mentioned substrate is a glass substrate.

According to yet another embodiment of the present invention, the first side surface of the substrate has a contact surface and a non-contact surface. Wherein, the contact surface is directly contacted by fingers, and the above-mentioned control chip is arranged on the non-contact surface.

According to yet another embodiment of the present invention, the fingerprint sensing device further includes a shielding layer. The shielding layer is disposed on the control chip and covers the control chip.

According to another embodiment of the present invention, the above-mentioned sensing layer is a glass-type sensing layer or a film-type sensing layer.

Description of drawings

FIG. 1A is a top view of a fingerprint sensing device according to an embodiment of the present invention;

FIG. 1B is a side view of the fingerprint sensing device in FIG. 1A;

FIG. 2 is a side view of a fingerprint sensing device according to another embodiment of the present invention.

Symbol Description

100, 200: Fingerprint sensing device

110, 210: Substrate

120, 220: sensing layer

120A, 210A: first side

120B, 210B: second side

130, 230: control chip

140, 240: metal wiring

150, 250: protective layer

212: contact surface

214: Non-contact surface

Detailed ways

Embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are illustrative only, and do not limit the scope of the invention.

Please refer to FIG. 1A , which shows a top view of a fingerprint sensing device 100 according to an embodiment of the present invention. The fingerprint sensing device 100 is used to obtain a user's fingerprint signal, which can be applied to electronic devices or systems such as notebook computers, tablet computers, smart phones, digital cameras, access control systems, or car anti-theft systems, but is not limited thereto. .

In FIG. 1A , a fingerprint sensing device 100 includes a substrate 110 , a sensing layer 120 , a control chip 130 and metal wires 140 . The substrate 110 is used for direct contact with the user's fingers. In the present invention, the substrate 110 may be a glass substrate, a resin substrate, or the like. The sensing layer 120 is disposed on the substrate 110 and has a first side 120A and a second side 120B opposite to each other, wherein the first side 120A is connected to the substrate 110 . The sensing layer 120 is used to sense the fingerprint pattern of the user's finger, and the sensing layer 120 performs a corresponding sensing method according to its structure type. For example, if the sensing layer 120 is a capacitive sensing layer, the sensing layer 120 may have a plurality of electrode structures arranged in a matrix, and these electrode structures are respectively connected to the ridges and grooves of the fingers. (valley) function to gather different charges, and these different charges generate sensing signals, and then process the sensing signals through the back-end processing circuit to obtain fingerprint image signals. The sensing layer 120 as a capacitive sensing layer may be a glass type sensing layer or a film type sensing layer, and its related implementation methods are well known to those skilled in the art, so it will not be described in detail here. illustrate. In addition, in the present invention, the sensing layer 120 may also be, for example, a pressure sensing layer or a thermal sensing layer.

The control chip 130 is disposed on the second side 120B of the sensing layer 120 , and is electrically connected to the sensing layer 120 through the metal wiring 140 also disposed on the second side 120B of the sensing layer 120 . The control chip 130 may have multiple pins for connecting the metal wires 140 to receive the sensing signals of the sensing layer 120, and the control circuit inside the control chip 130 may process the sensing signals to obtain fingerprint image signal.

In addition, referring to FIG. 1B at the same time, a protective layer 150 is further disposed on the second side 120B of the sensing layer 120 . As shown in FIG. 2 , the protection layer 150 is disposed between the sensing layer 120 and the control chip 130 to prevent the control chip 130 from directly contacting the sensing layer 120 and causing damage to the control chip 130 . The protective layer 150 may include, for example, non-conductive polymer (NCP) or other viscous insulating materials. In some embodiments, the protective layer 150 may include anisotropic conductive film (ACF), which is used to electrically connect the pins of the control chip 130 to the metal wires 140, and to make the body of the control chip 130 and the sensing layer 120 Electrically insulated.

It should be noted that, in FIG. 1A , the control chip 130 is disposed at the center of the fingerprint sensing device 100 . In practical applications, the control chip 130 is not limited to be located at the center of the fingerprint sensing device 100 . For example, according to the layout of the electrodes and the metal wires 140 in the sensing layer 120 , the control chip 130 can be disposed on the side or corner of the fingerprint sensing device 100 .

The feature of the fingerprint sensing device of the present invention is that it simultaneously has the advantages of high fingerprint recognition resolution, low manufacturing cost and large fingerprint sensing area. In other words, compared with the existing thin-film flip-chip (chiponfilm; COF) or chip direct package (chiponboard; COB) fingerprint sensing devices, the fingerprint sensing device of the present invention will have the sensing layer and the control chip in the thickness direction of the substrate. The upper overlapping arrangement can make more effective use of the planar space on the substrate, and the sensing layer can be arranged on the glass substrate through an appropriate manufacturing process, which can improve the resolution of fingerprint sensing. On the other hand, compared with the existing fingerprint sensing chip, the fingerprint sensing device of the present invention can reduce the manufacturing cost and increase the fingerprint sensing area.

Please refer to FIG. 2 , which shows a side view of a fingerprint sensing device 200 according to another embodiment of the present invention. In FIG. 2 , the fingerprint sensing device 200 includes a substrate 210 , a sensing layer 220 , a control chip 230 , metal wires 240 and a protection layer 250 . The substrate 210 may be a glass substrate, a resin substrate, or other similar substrates. The substrate 210 has a first side 210A and a second side 210B opposite to each other, wherein a sensing layer 220 is disposed on the first side 210A of the substrate 210, and the sensing layer 220 is used to sense the fingerprint pattern of the user's finger, And a corresponding sensing method is performed according to its structure type. The structure type of the sensing layer 220 is the same as that of the sensing layer 120 , so for the description of the sensing layer 220 , please refer to the description of the sensing layer 120 in the previous paragraphs, which will not be repeated here.

The control chip 230 is disposed on the second side surface 210B of the substrate 210 , and is electrically connected to the sensing layer 220 through the metal wiring 240 crossing the substrate 210 in the thickness direction of the substrate 210 . In this embodiment, the second side 210B of the substrate 210 can be divided into a contact surface 212 and a non-contact surface 214, wherein the contact surface 212 is for direct contact with the user's finger, and the non-contact surface 214 is for the control chip 230 to be disposed on it. . The non-contact surface 214 is preferably located on the side of the fingerprint sensing device 200, so that the second side 210B of the substrate 210 has a larger contact surface 212 for direct contact with the user's finger. The control chip 230 may have a plurality of pins for connecting the metal wiring 240 to receive the sensing signal of the sensing layer 220, and the control circuit inside the control chip 230 may process the sensing signal to obtain a fingerprint image signal .

The protection layer 250 is disposed between the substrate 210 and the control chip 230 , and is used to prevent the control chip 230 from directly contacting the substrate 210 to cause damage to the control chip 230 . The protective layer 250 may include, for example, non-conductive glue or other viscous insulating materials. In some embodiments, the protective layer 250 may include anisotropic conductive adhesive to electrically connect the pins of the control chip 230 to the metal traces 240 and electrically insulate the body of the control chip 230 from the substrate 210 .

In addition, in some embodiments, a shielding layer (not shown) may be provided on the control chip 230 of the fingerprint sensing device 200 and/or at the side of the control chip 230 to cover the control chip 230, thereby Prevent the user's fingers from touching the control chip 230 directly.

To sum up, in the fingerprint sensing device of the present invention, the sensing layer and the control chip are overlapped in the thickness direction of the substrate, and the sensing layer is disposed on the glass substrate or the sensing layer through an appropriate manufacturing process. The fingerprint sensing device completed according to the embodiment of the present invention can simultaneously have the advantages of high fingerprint identification resolution, low manufacturing cost, and large fingerprint sensing area.

Although the present invention has been disclosed in conjunction with the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the appended claims.

Claims (10)

1. a fingerprint acquisition apparatus, comprises:

Substrate;

Sensed layer, is arranged on this substrate, and this sensed layer has the first side respect to one another and the second side, and wherein this first side of this sensed layer is connected to this substrate;

Control chip, is arranged on this second side of this sensed layer; And

Protective seam, is arranged on this second side of this sensed layer, and between this sensed layer and this control chip.

2. fingerprint acquisition apparatus as claimed in claim 1, also comprise multiple metal routing, those metal routings are arranged on this second side of this sensed layer, and those metal routings are electrically connected on this sensed layer in order to make this control chip.

3. fingerprint acquisition apparatus as claimed in claim 1, wherein this substrate is a glass substrate.

4. fingerprint acquisition apparatus as claimed in claim 1, wherein this sensed layer is a glass type (glasstype) sensed layer or a diaphragm type (filmtype) sensed layer.

5. a fingerprint acquisition apparatus, comprises:

Substrate, has the first side respect to one another and the second side;

Sensed layer, is arranged on this first side of this substrate;

Control chip, is arranged on this second side of this substrate; And

Protective seam, is arranged on this second side of this substrate, and between this substrate and this control chip.

6. fingerprint acquisition apparatus as claimed in claim 5, also comprises multiple metal routing, and those metal routings are across this substrate on the thickness direction of this substrate, and those metal routings are electrically connected on this sensed layer in order to make this control chip.

7. fingerprint acquisition apparatus as claimed in claim 5, wherein this substrate is a glass substrate.

8. fingerprint acquisition apparatus as claimed in claim 5, wherein this first side of this substrate has surface of contact and noncontact face, and this surface of contact directly contacts for finger, and this control chip is arranged on this noncontact face.

9. fingerprint acquisition apparatus as claimed in claim 8, also comprise shielding layer, this shielding layer is arranged on this control chip, and this shielding layer covers this control chip.

10. fingerprint acquisition apparatus as claimed in claim 5, wherein this sensed layer is glass type (glasstype) sensed layer or diaphragm type (filmtype) sensed layer.