CN106912186A - Rack and miniature data center - Google Patents
Rack and miniature data center Download PDFInfo
- Publication number
- CN106912186A CN106912186A CN201710270316.6A CN201710270316A CN106912186A CN 106912186 A CN106912186 A CN 106912186A CN 201710270316 A CN201710270316 A CN 201710270316A CN 106912186 A CN106912186 A CN 106912186A
- Authority
- CN
- China
- Prior art keywords
- inwall
- rack
- wall
- coolant
- cooling coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of rack, and for data center, the data center includes electronic equipment and heat abstractor, and the rack includes：Outer wall, the outer wall is located at the outside of the heat abstractor, and the outer wall includes main body, and the main body has the unlimited host cavity in top；Inwall, the inwall is installed in the host cavity, and the inwall has the unlimited installation cavity in top, and the installation cavity is used to install the electronic equipment, and the installation cavity is additionally operable to contain the coolant for electronic equipment immersion to be radiated；Cooling component, the cooling component is installed on the inwall and is connected to the heat abstractor and radiated with to the coolant.The present invention also provides a kind of data center.
Description
Technical field
The present invention relates to field of computer technology, more particularly to a kind of rack and miniature data center.
Background technology
With the fast development of internet economy, enterprise increasingly increases for the demand of data analysis and process ability, together
When for its data information attention degree improve constantly.Increasing enterprise starts self-built data center to meet increasingly
The data analysis of growth, the demand of disposal ability simultaneously protect the safety of its data information.But for some enterprises, especially in
Small business, the scale of the data center needed for it is smaller, but auxiliary facility needed for data is the same can not all lack.And it is traditional
Constructing data center mode high cost, cycle are long, it is impossible to meet the demand of such client, and then more medium-sized and small enterprises start
Find new miniature data center's solution.
Information technoloy equipment can operationally send substantial amounts of heat, and conventional data centers are carried out using air-cooled mode to information technoloy equipment
Cooling.Because air heat conduction efficiency is low and specific volume specific heat capacity is small, this requires that cooling information technoloy equipment is needed than larger air quantity,
But fan runs at high speed and not only consumes substantial amounts of energy but also can produce very big noise.This external air cooling system is cooled down to air matter
Amount also has certain requirement, and moisture, dust, nitrogen oxides, oxysulfide for containing in air etc. can all make information technoloy equipment fault rate
Rising, the lost of life.
The content of the invention
In view of the foregoing, it is necessary to which a kind of rack of perfect heat-dissipating, and a kind of miniature data center are provided.
A kind of rack, for miniature data center, the miniature data center includes information technoloy equipment and heat abstractor, described
Rack includes：Outer wall, the outer wall is located at the outside of the heat abstractor, and the outer wall includes main body, and the main body has top
The unlimited host cavity in portion；Inwall, the inwall is installed in the host cavity, and the inwall has the unlimited installation cavity in top,
The installation cavity is used to install the information technoloy equipment, and the installation cavity is additionally operable to contain and immerses to be radiated for the information technoloy equipment
Coolant；Cooling component, the cooling component is installed on the inwall and is connected to the heat abstractor with to the coolant
Radiated.
Further, the cooling component includes cooling coil, the cooling tube be located at the inwall and the outer wall it
Between, the cooling coil abuts the inwall, and the cooling tube enters for being connected to the heat abstractor with to the coolant
Row radiating.
Further, the cooling coil has multigroup, and multigroup cooling coil is uniformly around the inwall.
Further, the cooling component also includes multiple first circulation pumps, and the first circulation pump is installed on the peace
In behaveing affectedly, the first circulation pump is used to drive the coolant.
Further, multigroup cooling coil that the cooling component is included can be replaced by a cooling coil module,
The cooling coil module is installed in the installation cavity, and the alternative first circulation pump of second circulation pump is described for driving
Coolant.
Further, the heat-insulation layer is provided between the outer wall and the inwall with to the cooling coil or cooler pan
Tube module is incubated.
Further, inner frame is provided with the inside of the inwall, the first pipe and the second pipe that the inner frame includes are described
First pipe and described second is managed for supporting the information technoloy equipment.
Further, multiple fins are provided with the inside of the inwall, there is runner, the stream between every two adjacent fins
Road is used to be flowed through for the coolant, and the runner is additionally operable to house the netting twine and power line of the information technoloy equipment.
Further, the data center also includes the power distribution mould of the power line for being connected to the information technoloy equipment
Block, first side of first side higher than the inwall of the outer wall, the first side of the outer wall is used to be positioned at the inwall
On the power distribution module.
Further, it is provided with the net for being connected to the information technoloy equipment in the side of neighbouring its first side on the outer wall
The cable interface of line, and for being connected to the electric source line interface of the power distribution module.
Further, the outer wall also includes cover plate, and the cover plate is used to cover the host cavity, and the cover plate is pivotally
It is connected to the first side of the outer wall.
A kind of miniature data center, including above-mentioned rack.
Compared to prior art, above-mentioned rack and miniature data center, heat abstractor is by cooling down component and coolant pair
Electronic equipment is radiated, and can quickly reduce the temperature of electronic equipment, perfect heat-dissipating.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, below will be to that will make needed for embodiment description
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the three-dimensional assembly diagram of the rack of the embodiment offer of the first aspect of the present invention.
Fig. 2 is the sectional view of the rack of Fig. 1.
Fig. 3 is the schematic diagram of the subelement with heat abstractor of the rack of Fig. 1.
Fig. 4 is the sectional view of the rack of the embodiment offer of the second aspect of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than whole embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
Fig. 1 and Fig. 3 is referred to, the embodiment of the first aspect of the present invention provides a kind of rack 100, in miniature data
The heart, the miniature data center includes information technoloy equipment 107 and heat abstractor.The information technoloy equipment 107 includes server and network exchange
Machine.Further, the miniature data center also includes the power distribution mould of the power line for being connected to the information technoloy equipment 107
Block 110.Further, the heat abstractor includes expansion valve 115, refrigerant tubing 304 and refrigeration outdoor unit 301.The system
Cold outdoor unit 301 includes refrigeration compressor 302 and air-cooled condenser 303.The heat abstractor constitutes one with cooling coil 112
Complete vapor-compression refrigerant cycle, is filled with refrigerant inside it.
The rack 100 includes outer wall 104, inwall 103, and cooling component.
The outer wall 104 is located at the outside of the heat abstractor, and the outer wall 104 includes main body, and the main body has top
The unlimited host cavity in portion.Further, the outer wall 104 has the first side.Further, in adjacent to it on the outer wall 104
The side of the first side is provided with the cable interface 108 of the netting twine for being connected to the information technoloy equipment 107, and described for being connected to
The electric source line interface 109 of the power line of information technoloy equipment 107.Further, the outer wall 104 also includes cover plate 101, the cover plate
101 are used to cover the host cavity.Further, the cover plate 101 is connected pivotally to the first side of the outer wall 104.Enter
One step ground, when cover plate 101 is closed, cover plate 101 makes whole cabinet be in sealing state by compressing strip of paper used for sealing.So
Can prevent in transportation that coolant flows out in rack, interior of equipment cabinet is entered prevented also from foreign.
Fig. 1 and Fig. 2 is referred to, the inwall 103 is installed in the host cavity, the inwall 103 is opened wide with top
Installation cavity, the installation cavity is used to install the information technoloy equipment 107, and the installation cavity is additionally operable to contain and supplies the information technoloy equipment 107
Immerse the coolant 111 to be radiated.Further, the inner side of the inwall 103 is provided with inner frame 102, the inner frame
102 the first pipes 201 and the second relative pipe 202 for including parallel arrangement, first pipe 201 and second pipe 202 are used for
Support the information technoloy equipment 107.Further, the inner side of the inwall 103 is provided with multiple fins 106, every two adjacent fins 106
Between there is runner, the runner is used to flow through for the coolant 111, and the runner is additionally operable to house the information technoloy equipment 107
Netting twine and power line.Further, light current wire casing 105 is additionally provided between the outer wall 104 and the inwall 103, for machine
The wiring of netting twine and pickup wire in cabinet.Further, heat-insulation layer 113 is additionally provided between the outer wall 104 and the inwall 103
It is incubated with to the coolant 111.Further, the first side of the outer wall 104 is higher than the first side of the inwall 103, institute
Stating the first side of outer wall 104 is used to be positioned at the power distribution module 110 on the inwall 103, the power supply point
It is used for for information technoloy equipment is powered in rack, and with having air switch and lightning protection device with module 110.Further, the expansion valve 115
It is arranged at the inside (referring to Fig. 3) of rack 100.
Also referring to Fig. 2 and Fig. 3, the cooling component is installed on the inwall 103 and is connected to the heat abstractor
Radiated with to the coolant 111.Further, the cooling component includes cooling coil 112, the cooling coil
112 are located between the inwall 103 and the outer wall 104, and the cooling coil 112 abuts the inwall 103, the cooler pan
Pipe 112 radiates for being connected to the heat abstractor with to the coolant 111.Further, the cooling coil 112
There is multiple, multiple cooling coils 112 are uniformly around the inwall 103.Further, the cooling coil 112 passes through
The refrigerant tubing 304 is connected to the refrigeration outdoor unit 301 to be radiated.Further, the cooling component is also wrapped
First circulation pump 114 is included, the first circulation pump 114 is installed in the installation cavity and for immersing in the coolant 111,
The first circulation pump 114 is used to drive the coolant 111.The first circulation pump 114 is immersed in the coolant 111
In, therefore its noise and vibration are smaller.
Fig. 1-Fig. 3 is referred to, when using, the main body relative to the outer wall 104 pivots the cover plate 101 of the outer wall 104.
The coolant 111 is poured into the installation cavity of the inwall 103.The information technoloy equipment 107 is immersed in the coolant 111.
The cover plate 101 of the outer wall 104 is covered.Start the first circulation pump 114.Start the heat abstractor.
Now, the first circulation pump 114 drives the coolant 111 to be circulated convection current, absorbs the information technoloy equipment 107
The heat of generation so that the temperature of the coolant 111 is raised.Refrigerant in the cooling coil 112 passes through the inwall
103 and fin 106 absorb the heat of the coolant 111 and lower the temperature with to the coolant 111, the coolant after cooling
111 flow back to the heat for continuing to absorb the generation of information technoloy equipment 107.The heat abstractor and cooling coil 112 constitute one it is complete
Vapor-compression refrigerant cycle, the outside for being distributed the heat that the inner refrigerant of the cooling coil 112 is absorbed by heat abstractor
In environment.
The rack 100 that the embodiment of the first aspect of the present invention is provided, heat abstractor is by cooling down component and coolant 111
Information technoloy equipment 107 is radiated, the temperature of information technoloy equipment 107, perfect heat-dissipating can be quickly reduced.
The embodiment of the second aspect of the present invention provides a kind of rack.Refer to Fig. 4, the rack and above-mentioned rack 100
Difference be：The cooling coil 112 for cooling down component can be by the substitution of a cooling coil module 401, the cooler pan
Pipe die group 401 is installed in the installation cavity, and the cooling coil module 401 is used to be connected to the heat abstractor with to described
Coolant 111 is radiated.Further, the alternative first circulation pump 114 of second circulation pump 402 is described cold for driving
But liquid, the second circulation pump 402 is installed in the installation cavity, and the second circulation pump 402 is used to drive the coolant
111.The second circulation pump 402 is immersed in the coolant 111, so noise is small.
The rack that the embodiment of the second aspect of the present invention is provided, heat abstractor is by cooling down component and coolant 111 pairs
Information technoloy equipment 107 is radiated, and can quickly reduce the temperature of information technoloy equipment 107, perfect heat-dissipating.
The embodiment of the third aspect of the present invention provides a kind of miniature data center.The miniature data center includes above-mentioned
Rack.
The miniature data center that the embodiment of the third aspect of the present invention is provided, heat abstractor is by cooling down component and cooling
Liquid 111 radiates to information technoloy equipment 107, can quickly reduce the temperature of information technoloy equipment 107, perfect heat-dissipating.
It is apparent to those skilled in the art that, for convenience and simplicity of description, the system of foregoing description,
Device and the specific work process of assembling, may be referred to the corresponding process in preceding method embodiment, will not be repeated here.
The above, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (12)
1. a kind of rack, for miniature data center, the miniature data center includes information technoloy equipment and heat abstractor, its feature
It is that the rack includes：
Outer wall, the outer wall is located at the outside of the heat abstractor, and the outer wall includes main body, and the main body is opened wide with top
Host cavity；
Inwall, the inwall is installed in the host cavity, and the inwall has the unlimited installation cavity in top, and the installation cavity is used
In the information technoloy equipment is installed, the installation cavity is additionally operable to contain the coolant for information technoloy equipment immersion to be radiated；
Cooling component, the cooling component is installed on the inwall and is connected to the heat abstractor and carried out with to the coolant
Radiating.
2. rack as claimed in claim 1, it is characterised in that：The cooling component includes cooling coil, the cooling coil
Between the inwall and the outer wall, the cooling coil abuts the inwall, and the cooling tube is described for being connected to
Heat abstractor radiates with to the coolant.
3. rack as claimed in claim 2, it is characterised in that：The cooling coil has multigroup, and multigroup cooling coil is equal
Evenly around the inwall.
4. rack as claimed in claim 2, it is characterised in that：The cooling component also includes multiple first circulation pumps, described
First circulation pump is installed in the installation cavity, and the first circulation pump is used to drive the coolant.
5. the rack as described in claim any one of 2-4, it is characterised in that：Multigroup cooler pan that the cooling component is included
Pipe can be replaced by a cooling coil module, and the cooling coil module is installed in the installation cavity, and second circulation pump can
The first circulation pump is substituted for driving the coolant.
6. the rack as described in any one of claim 5, it is characterised in that：The guarantor is provided between the outer wall and the inwall
Warm layer is incubated with to the cooling coil or cooling coil module.
7. the rack as described in claim any one of 2-4, it is characterised in that：Inner frame is provided with the inside of the inwall, it is described
Inner frame includes the first pipe of parallel arrangement and the second pipe, and first pipe and described second are managed for supporting the information technoloy equipment.
8. the rack as described in claim any one of 2-4, it is characterised in that：Multiple fins are provided with the inside of the inwall, often
There is runner, the runner is used to be flowed through for the coolant, and the runner is additionally operable to house described between two adjacent fins
The netting twine and power line of information technoloy equipment.
9. rack as claimed in claim 8, it is characterised in that：The data center is also included for being connected to the information technoloy equipment
Power line power distribution module, the first side of the outer wall higher than the inwall the first side, the first side of the outer wall
For the power distribution module being positioned on the inwall.
10. rack as claimed in claim 9, it is characterised in that：It is provided with the side of neighbouring its first side on the outer wall
Cable interface for being connected to the netting twine of the information technoloy equipment, and connect for being connected to the power line of the power distribution module
Mouthful.
11. racks as claimed in claim 9, it is characterised in that：The outer wall also includes cover plate, and the cover plate is used to cover institute
Host cavity is stated, the cover plate is connected pivotally to the first side of the outer wall.
A kind of 12. miniature data centers, including the rack as described in claim any one of 1-11.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270316.6A CN106912186A (en) | 2017-04-24 | 2017-04-24 | Rack and miniature data center |
| PCT/CN2017/110957 WO2018196339A1 (en) | 2017-04-24 | 2017-11-14 | Cabinet and micro data center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270316.6A CN106912186A (en) | 2017-04-24 | 2017-04-24 | Rack and miniature data center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106912186A true CN106912186A (en) | 2017-06-30 |
Family
ID=59209624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710270316.6A Pending CN106912186A (en) | 2017-04-24 | 2017-04-24 | Rack and miniature data center |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106912186A (en) |
| WO (1) | WO2018196339A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107690268A (en) * | 2017-09-30 | 2018-02-13 | 深圳绿色云图科技有限公司 | A kind of data center cooling system and data center |
| CN107846822A (en) * | 2017-11-26 | 2018-03-27 | 北京中热能源科技有限公司 | A kind of electronic equipment cooling system |
| CN108551746A (en) * | 2018-04-11 | 2018-09-18 | 安徽凯贝耐特钣金科技有限公司 | A kind of immersion oil cooling cabinet |
| WO2018196339A1 (en) * | 2017-04-24 | 2018-11-01 | 深圳绿色云图科技有限公司 | Cabinet and micro data center |
| WO2019061721A1 (en) * | 2017-09-30 | 2019-04-04 | 深圳绿色云图科技有限公司 | Data center cooling system and data center |
| CN109588018A (en) * | 2018-12-28 | 2019-04-05 | 成都中讯创新科技股份有限公司 | A kind of full immersed type data center architecture |
| TWI816445B (en) * | 2022-04-07 | 2023-09-21 | 緯穎科技服務股份有限公司 | Sealing mechanism and two-phase watercooling heat dissipation device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3941171B1 (en) | 2019-03-13 | 2024-05-15 | Submer Technologies, S.L. | Cooling system for computer components |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104915321A (en) * | 2015-06-04 | 2015-09-16 | 浪潮电子信息产业股份有限公司 | Immersion type phase-change cooling high-density computing system |
| CN106163242A (en) * | 2016-08-31 | 2016-11-23 | 杭州华为数字技术有限公司 | A kind of rack heat-exchange system and server |
| CN106416450A (en) * | 2014-06-30 | 2017-02-15 | 微软技术许可有限责任公司 | Datacenter immersed in cooling liquid |
| CN206879304U (en) * | 2017-04-24 | 2018-01-12 | 深圳绿色云图科技有限公司 | Rack and miniature data center |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205385684U (en) * | 2016-01-26 | 2016-07-13 | 北京创和世纪通讯技术股份有限公司 | Heat radiation cabinet |
| CN106255387B (en) * | 2016-08-31 | 2019-05-03 | 深圳绿色云图科技有限公司 | Cooling system and data center |
| CN106912186A (en) * | 2017-04-24 | 2017-06-30 | 深圳绿色云图科技有限公司 | Rack and miniature data center |
-
2017
- 2017-04-24 CN CN201710270316.6A patent/CN106912186A/en active Pending
- 2017-11-14 WO PCT/CN2017/110957 patent/WO2018196339A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106416450A (en) * | 2014-06-30 | 2017-02-15 | 微软技术许可有限责任公司 | Datacenter immersed in cooling liquid |
| CN104915321A (en) * | 2015-06-04 | 2015-09-16 | 浪潮电子信息产业股份有限公司 | Immersion type phase-change cooling high-density computing system |
| CN106163242A (en) * | 2016-08-31 | 2016-11-23 | 杭州华为数字技术有限公司 | A kind of rack heat-exchange system and server |
| CN206879304U (en) * | 2017-04-24 | 2018-01-12 | 深圳绿色云图科技有限公司 | Rack and miniature data center |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018196339A1 (en) * | 2017-04-24 | 2018-11-01 | 深圳绿色云图科技有限公司 | Cabinet and micro data center |
| CN107690268A (en) * | 2017-09-30 | 2018-02-13 | 深圳绿色云图科技有限公司 | A kind of data center cooling system and data center |
| WO2019061721A1 (en) * | 2017-09-30 | 2019-04-04 | 深圳绿色云图科技有限公司 | Data center cooling system and data center |
| CN107690268B (en) * | 2017-09-30 | 2023-11-28 | 深圳绿色云图科技有限公司 | Data center cooling system and data center |
| CN107846822A (en) * | 2017-11-26 | 2018-03-27 | 北京中热能源科技有限公司 | A kind of electronic equipment cooling system |
| CN108551746A (en) * | 2018-04-11 | 2018-09-18 | 安徽凯贝耐特钣金科技有限公司 | A kind of immersion oil cooling cabinet |
| CN109588018A (en) * | 2018-12-28 | 2019-04-05 | 成都中讯创新科技股份有限公司 | A kind of full immersed type data center architecture |
| TWI816445B (en) * | 2022-04-07 | 2023-09-21 | 緯穎科技服務股份有限公司 | Sealing mechanism and two-phase watercooling heat dissipation device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018196339A1 (en) | 2018-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106912186A (en) | Rack and miniature data center | |
| AU2017213536B2 (en) | Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack | |
| CN104320953B (en) | Secondary water-loop server cabinet cooling system | |
| CN108124408B (en) | Data center's immersion liquid cooling cabinet based on hot pipe technique | |
| CN108811472A (en) | Liquid cooling server apparatus, server and liquid cooling apparatus | |
| CN106533459B (en) | A kind of power amplifier in transmitter unit cooling system and method | |
| CN206348737U (en) | A kind of complete immersion formula cooling device | |
| CN203689428U (en) | Cooling cabinet of datacenter servers | |
| CN210168389U (en) | Liquid cooling system of data center | |
| TWI655895B (en) | Cabinet cooling system | |
| CN104699206A (en) | Cooling cabinet of data center | |
| CN111526694B (en) | Liquid cooling system for server cabinet and server cabinet | |
| CN204425887U (en) | The server radiating system that liquid cooling apparatus and auxiliary radiating device combine | |
| CN206879304U (en) | Rack and miniature data center | |
| CN108227883A (en) | A kind of huge computer servers radiator | |
| CN204425886U (en) | The server cabinet cooling system that gate-type cold water heat-exchanger rig and liquid cooling apparatus combine | |
| CN219016926U (en) | Case for computer | |
| CN217336290U (en) | A cold storage cooling device | |
| CN110730603A (en) | Liquid immersion type server cabinet and cooling system thereof | |
| US20240090170A1 (en) | Liquid immersion cooling apparatus | |
| TW201306454A (en) | Cooling system for electronic device | |
| CN206610248U (en) | A kind of computer efficient radiating apparatus | |
| CN103838337A (en) | Data center server cooling equipment cabinet | |
| CN211090398U (en) | Liquid immersion type server cabinet and cooling system thereof | |
| CN207909065U (en) | A kind of huge computer servers radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170630 |