CN106835011B - A kind of structural member and preparation method thereof with diamond-like array - Google Patents
A kind of structural member and preparation method thereof with diamond-like array Download PDFInfo
- Publication number
- CN106835011B CN106835011B CN201611185457.XA CN201611185457A CN106835011B CN 106835011 B CN106835011 B CN 106835011B CN 201611185457 A CN201611185457 A CN 201611185457A CN 106835011 B CN106835011 B CN 106835011B
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- China
- Prior art keywords
- diamond
- substrate
- carbon
- array
- nano
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 64
- 238000000576 coating method Methods 0.000 claims abstract description 64
- 238000005530 etching Methods 0.000 claims abstract description 43
- 239000011159 matrix material Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 128
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 126
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 94
- 229910052799 carbon Inorganic materials 0.000 claims description 90
- 229910052786 argon Inorganic materials 0.000 claims description 63
- 238000000151 deposition Methods 0.000 claims description 54
- 239000007789 gas Substances 0.000 claims description 45
- 230000008021 deposition Effects 0.000 claims description 41
- 229910052723 transition metal Inorganic materials 0.000 claims description 29
- 150000003624 transition metals Chemical class 0.000 claims description 28
- 238000009616 inductively coupled plasma Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 239000001257 hydrogen Substances 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 238000007781 pre-processing Methods 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 claims 1
- 241000894006 Bacteria Species 0.000 abstract description 6
- 238000003491 array Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 210000002421 cell wall Anatomy 0.000 abstract description 4
- 230000001580 bacterial effect Effects 0.000 abstract description 2
- 230000000845 anti-microbial effect Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 57
- 239000010410 layer Substances 0.000 description 56
- 150000002500 ions Chemical class 0.000 description 33
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 20
- 230000000844 anti-bacterial effect Effects 0.000 description 18
- 238000000992 sputter etching Methods 0.000 description 17
- 239000010936 titanium Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 239000007943 implant Substances 0.000 description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 238000004506 ultrasonic cleaning Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000012495 reaction gas Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229910001069 Ti alloy Inorganic materials 0.000 description 6
- 239000012153 distilled water Substances 0.000 description 6
- 238000010849 ion bombardment Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000010955 niobium Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 241000589517 Pseudomonas aeruginosa Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004050 hot filament vapor deposition Methods 0.000 description 3
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 229910001000 nickel titanium Inorganic materials 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 208000035143 Bacterial infection Diseases 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- WAIPAZQMEIHHTJ-UHFFFAOYSA-N [Cr].[Co] Chemical class [Cr].[Co] WAIPAZQMEIHHTJ-UHFFFAOYSA-N 0.000 description 2
- 208000022362 bacterial infectious disease Diseases 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 210000005260 human cell Anatomy 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000002110 nanocone Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 208000034309 Bacterial disease carrier Diseases 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000002194 amorphous carbon material Substances 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000000747 cardiac effect Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 230000003075 superhydrophobic effect Effects 0.000 description 1
- 230000000451 tissue damage Effects 0.000 description 1
- 231100000827 tissue damage Toxicity 0.000 description 1
- 229910003470 tongbaite Inorganic materials 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 230000002485 urinary effect Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/343—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one DLC or an amorphous carbon based layer, the layer being doped or not
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
技术领域technical field
本发明涉及超疏水材料领域,具体涉及一种具有类金刚石阵列的结构件及其制备方法。The invention relates to the field of superhydrophobic materials, in particular to a structural member with a diamond-like array and a preparation method thereof.
背景技术Background technique
生物材料,特别是用于医用植入体(如自动植入式心脏除颤器,尿导管等)和手术器具上的生物材料,由于直接与人体组织接触,需满足临床使用的各种要求。除具备一般材料的良好物理、化学和力学性能外,还必须具有抗菌性,以免受细菌定植,进而导致在设备表面形成生物膜及感染细菌。生物膜是微生物为应对外界环境变化而自身分泌的胞外聚合物聚集于介质表面所形成的菌落聚集体,生物膜的形成会增加细菌的耐药性,提高临床医疗的难度。因此,一般需要对医用金属、陶瓷材料进行表面改性,以提供其抗菌性。Biomaterials, especially those used in medical implants (such as automatic implantable cardiac defibrillators, urinary catheters, etc.) and surgical instruments, need to meet various requirements for clinical use due to their direct contact with human tissue. In addition to the good physical, chemical and mechanical properties of general materials, they must also be antibacterial to prevent bacterial colonization, which can lead to the formation of biofilms on equipment surfaces and bacterial infection. Biofilms are colony aggregates formed by the extracellular polymers secreted by microorganisms themselves in response to changes in the external environment on the surface of the medium. The formation of biofilms will increase the drug resistance of bacteria and increase the difficulty of clinical treatment. Therefore, surface modification of medical metals and ceramic materials is generally required to provide their antibacterial properties.
类金刚石(diamond-like carbon,DLC)是一种含有sp2和sp3键合特征的非晶碳材料,具有高硬度、低摩擦、高热导率、高透光性、化学惰性强及良好的生物相容性等优异性能,DLC膜在光学窗口、刀具、模具等零部件、生物医疗器件等领域都具有广阔的应用前景。DLC涂层作为医学植入体材料表面改性层,其主要优越性表现在:①DLC涂层机械强度与植入体材料的可适配性不仅保证了涂层与医用植入体材料的牢固结合,而且增强了植入体负载部位的支撑强度;②高致密度DLC涂层其优异的耐磨耐蚀性能不仅提高了生物-力学交互环境下植入体材料的耐腐蚀磨损能力,同时可有效屏蔽金属离子向周围组织和血液的扩散,进而抑制有害金属离子溶入生物组织并阻止其对生物组织产生的毒性反应而引起的组织损伤,延长医用材料服役寿命;③低毒性和高化学稳定性的DLC涂层因其具有可调控表面界面性能而能够适应植入体服役环境,降低人体对医用植入材料的排异性并提高其与生物组织的相容性。但目前还未见单独的DLC涂层就能具有抗菌性的报道。Diamond-like carbon (DLC) is an amorphous carbon material containing sp 2 and sp 3 bonding features, with high hardness, low friction, high thermal conductivity, high light transmittance, strong chemical inertness and good Due to its excellent properties such as biocompatibility, DLC films have broad application prospects in optical windows, tools, molds and other parts, biomedical devices and other fields. As a surface modification layer of medical implant materials, DLC coating has the main advantages as follows: ① The adaptability of DLC coating mechanical strength and implant material not only ensures the firm combination of coating and medical implant material , and enhances the support strength of the implant load part; ② The excellent wear and corrosion resistance of the high-density DLC coating not only improves the corrosion and wear resistance of the implant material in the bio-mechanical interaction environment, but also effectively Shield the diffusion of metal ions to surrounding tissues and blood, thereby inhibiting the dissolution of harmful metal ions into biological tissues and preventing tissue damage caused by their toxic reactions to biological tissues, extending the service life of medical materials; ③ Low toxicity and high chemical stability Because of its tunable surface interface properties, the DLC coating can adapt to the implant service environment, reduce the human body's rejection of medical implant materials and improve its compatibility with biological tissues. However, there is no report that a single DLC coating can have antibacterial properties.
发明内容SUMMARY OF THE INVENTION
有鉴于此,本发明第一方面提供了一种具有类金刚石阵列的结构件,其通过在基体上先沉积一层类金刚石涂层,然后对其进行刻蚀,形成具有针尖状尖端结构的类金刚石纳米针阵列。该具有类金刚石阵列的结构件具有良好的抗菌性能,用以解决现有技术中类金刚石涂层备杀菌性弱或几乎没有抗菌性能的问题。In view of this, the first aspect of the present invention provides a structural member with a diamond-like carbon array, which is formed by depositing a layer of diamond-like carbon coating on a substrate and then etching it to form a diamond-like carbon-like structure Array of diamond nanoneedles. The structural member with the diamond-like carbon array has good antibacterial properties, and is used to solve the problem that the diamond-like carbon coating has weak bactericidal properties or almost no antibacterial properties in the prior art.
第一方面,本发明提供了一种具有类金刚石阵列的结构件,包括基体和设置在所述基体上的具有尖端结构的类金刚石纳米针阵列,所述类金刚石纳米针阵列通过对形成在所述基体上的一类金刚石涂层进行刻蚀得到。In a first aspect, the present invention provides a structural member having a diamond-like carbon array, comprising a substrate and a diamond-like nanoneedle array with a tip structure disposed on the substrate, wherein the diamond-like nanoneedle array is formed on the A type of diamond coating on the substrate is obtained by etching.
优选地,所述基体和类金刚石纳米针阵列之间还设置有残余类金刚石涂层,所述类金刚石纳米针阵列形成在所述残余类金刚石涂层表面。所述残余类金刚石涂层为一完整的涂层,不具有类金刚石纳米针。进一步地,所述残余类金刚石涂层的厚度为100nm~3μm。所述残余类金刚石涂层的存在,更有利于提高基体和类金刚石纳米针阵列的结合力。Preferably, a residual diamond-like carbon coating is further disposed between the matrix and the diamond-like nano-needle array, and the diamond-like carbon nano-needle array is formed on the surface of the residual diamond-like carbon coating. The residual DLC coating is a complete coating without DLC nanoneedles. Further, the thickness of the residual diamond-like carbon coating is 100 nm˜3 μm. The existence of the residual diamond-like carbon coating is more conducive to improving the bonding force between the matrix and the diamond-like nano-needle array.
优选地,所述金刚石纳米针阵列中的类金刚石纳米针为锥状结构,所述类金刚石纳米针的长径比为20~80,尖部直径为10~100nm,底部直径为30nm~2μm,针密度为104~109个·cm-2。Preferably, the diamond-like nano-needles in the diamond nano-needle array have a tapered structure, the diamond-like nano-needles have an aspect ratio of 20-80, a tip diameter is 10-100 nm, and a bottom diameter is 30 nm-2 μm, The needle density is 10 4 to 10 9 ·cm -2 .
其中,所述长径比是指纳米针的高度与所述纳米针高度的一半所对应的直径的比值。显然地,所述底部直径应不小于所述尖部直径。The aspect ratio refers to the ratio of the height of the nanoneedles to the diameter corresponding to half of the height of the nanoneedles. Obviously, the base diameter should not be smaller than the tip diameter.
本申请中,所述类金刚石纳米针阵列中,类金刚石纳米针的高度可以为均一的高度,也可以是高度不一的纳米针,其高度在10nm~10μm之间变化。例如可以同时存在高度在100nm以下的纳米针和高度为0.8-9μm的纳米针。In the present application, in the diamond-like nano-needle array, the height of the diamond-like nano-needles may be a uniform height, or may be nano-needles with different heights, and the heights may vary from 10 nm to 10 μm. For example, nanoneedles with a height of less than 100 nm and nanoneedles with a height of 0.8-9 μm may coexist.
进一步地,所述类金刚石纳米针的高度为400nm~10μm。类金刚石纳米针的高度呈梯度分布。Further, the height of the diamond-like nanoneedles is 400 nm˜10 μm. The height of the diamond-like nanoneedles is distributed in a gradient.
本申请中,所述类金刚石纳米针的尺寸与细菌尺寸相近,长径比较高。所述类金刚石纳米针的尺寸可以完全一样,也可以不完全一致,有一定的高低变化。所述类金刚石纳米针的长径比为30~60(优选为35-55、40-50);尖部直径为10~50nm或60~100nm;底部直径为800nm~2μm或者200~700nm或者30~200nm。所述针密度可以为105~109个·cm-2,例如可以是106~×109个·cm-2,108个·cm-2。可以通过对类金刚石纳米针尺寸和密度的调控,来优化所述抗菌类金刚石阵列材料的抗菌性能和哺乳类生物细胞相容性。In the present application, the size of the diamond-like nanoneedles is similar to that of bacteria, and the aspect ratio is high. The size of the diamond-like nano-needles may be exactly the same, or may not be exactly the same, with certain height changes. The aspect ratio of the diamond-like nanoneedles is 30-60 (preferably 35-55, 40-50); the diameter of the tip is 10-50 nm or 60-100 nm; the diameter of the bottom is 800-2 μm or 200-700 nm or 30 ~200nm. The needle density may be 10 5 to 10 9 ·cm -2 , for example, 10 6 to ×10 9 ·cm -2 , 10 8 ·cm -2 . The antibacterial properties and mammalian biocompatibility of the antibacterial diamond-like carbon array material can be optimized by adjusting the size and density of the diamond-like nano-needles.
优选地,所述基体为金属、金属合金、硬质合金、不锈钢、聚合物、玻璃和硅的一种或多种,但不限于此。特别是常用的植入材料,如钛合金TC4等。Preferably, the substrate is one or more of metal, metal alloy, cemented carbide, stainless steel, polymer, glass and silicon, but not limited thereto. Especially the commonly used implant materials, such as titanium alloy TC4 and so on.
其中,所述金属可以选自钛Ti、镍Ni、钼Mo、铌Nb、钽Ta、钌Ru、铂Pt中的任一种。所述金属合金可以是钛基合金、钴基合金(如钴铬合金)、Ni-Ti合金、镍基合金;所述硬质合金可以是碳化钨基硬质合金、碳化钛基硬质合金、碳氮化钛基硬质合金、碳化铬基硬质合金中的一种。Wherein, the metal can be selected from any one of titanium Ti, nickel Ni, molybdenum Mo, niobium Nb, tantalum Ta, ruthenium Ru, and platinum Pt. The metal alloy can be titanium-based alloy, cobalt-based alloy (such as cobalt-chromium alloy), Ni-Ti alloy, nickel-based alloy; the cemented carbide can be tungsten carbide-based cemented carbide, titanium carbide-based cemented carbide, One of titanium carbonitride-based cemented carbide and chromium carbide-based cemented carbide.
优选地,当所述基体的材质为医用不锈钢、聚合物、钴基金属合金、硬质合金、玻璃和硅时,所述具有类金刚石阵列的结构件还包括一过渡金属层,所述过渡金属层位于所述基体与所述残余类金刚石涂层之间。Preferably, when the material of the substrate is medical stainless steel, polymer, cobalt-based metal alloy, cemented carbide, glass and silicon, the structural member with the diamond-like carbon array further comprises a transition metal layer, the transition metal A layer is located between the substrate and the residual diamond-like coating.
进一步地,所述过渡金属层的厚度为50~500nm。所述过渡金属层中的金属为Cr、Ti、Ni、Zr、W、Mo、Nb、Ta、Ru、Pt等过渡金属元素中的一种。Further, the thickness of the transition metal layer is 50-500 nm. The metal in the transition metal layer is one of transition metal elements such as Cr, Ti, Ni, Zr, W, Mo, Nb, Ta, Ru, and Pt.
本申请中,如果基体的材质本身就是过渡金属或热膨胀系数差异较小的金属合金(如钛Ti、镍Ni、铌Nb、钽Ta;钛基合金、Ni-Ti合金、镍基合金时),直接在基体表面沉积类金刚石涂层,就可使其牢固结合在基体表面,然后再刻蚀得到阵列。如果基体不为过渡金属,则需要在基底上先沉积一层过渡金属层,再在该过渡金属层的基础上沉积类金刚石涂层,以提高类金刚石涂层牢固结合在基体上。In this application, if the material of the substrate itself is a transition metal or a metal alloy with a small difference in thermal expansion coefficient (such as titanium Ti, nickel Ni, niobium Nb, tantalum Ta; titanium-based alloy, Ni-Ti alloy, nickel-based alloy), By depositing a diamond-like coating directly on the surface of the substrate, it can be firmly bonded to the surface of the substrate, and then etched to obtain an array. If the substrate is not a transition metal, a transition metal layer needs to be deposited on the substrate first, and then a diamond-like carbon coating is deposited on the basis of the transition metal layer, so as to improve the firm bonding of the diamond-like carbon coating to the substrate.
本发明第一方面提供的具有类金刚石阵列的结构件包括基体和设置在所述基体表面的具有尖端结构的类金刚石纳米针阵列,所述类金刚石纳米针阵列通过对形成在衬底层表面的类金刚石涂层进行刻蚀得到。所述类金刚石纳米针阵列不仅可以对细菌的细胞壁产生压力,穿刺细菌的细胞壁使其伸展并最终溶解,导致细菌死亡,有效破坏生物膜的形成,赋予类金刚石涂层显著的抗菌性能。此外,所述类金刚石纳米针阵列对于大多数细胞,特别是人体细胞而言,几乎不具有毒性,还可支持人体细胞的粘附,可以应用于各种医用植入体以及手术器具上,防止细菌感染,有利于人体健康。The first aspect of the present invention provides a structural member with a diamond-like carbon array including a substrate and a diamond-like nanoneedle array with a tip structure disposed on the surface of the substrate. The diamond-like nanoneedle array The diamond coating is etched. The diamond-like nanoneedle array can not only generate pressure on the cell wall of bacteria, but also puncture the cell wall of bacteria to stretch and eventually dissolve, leading to bacterial death, effectively destroying the formation of biofilm, and endowing the diamond-like carbon coating with significant antibacterial properties. In addition, the diamond-like nanoneedle array is almost non-toxic to most cells, especially human cells, and can also support the adhesion of human cells, and can be applied to various medical implants and surgical instruments, preventing Bacterial infection is good for human health.
第二方面,本发明提供了一种具有类金刚石阵列的结构件的制备方法,包括以下步骤:In a second aspect, the present invention provides a method for preparing a structural member with a diamond-like carbon array, comprising the following steps:
提供基体,对所述基体进行预处理;providing a substrate, and pre-processing the substrate;
将所述预处理后的基体置于镀膜设备的真空室内,在所述预处理后的基体上沉积类金刚石涂层;placing the pretreated substrate in a vacuum chamber of the coating equipment, and depositing a diamond-like coating on the pretreated substrate;
对所述类金刚石涂层进行刻蚀,得到具有尖端结构的类金刚石纳米针阵列。The diamond-like coating is etched to obtain a diamond-like nanoneedle array with a tip structure.
优选地,所述预处理包括超声清洗、辉光清洗和离子刻蚀清洗中的一种或多种。Preferably, the pretreatment includes one or more of ultrasonic cleaning, glow cleaning and ion etching cleaning.
在本发明一实施方式中,可以先进行超声清洗,之后将超声清洗后的基底置于一沉积设备的真空室内,先进行辉光清洗,再进行离子刻蚀清洗。这样可以更好地保证待处理工件表面的清洁度。In an embodiment of the present invention, ultrasonic cleaning may be performed first, and then the ultrasonically cleaned substrate is placed in a vacuum chamber of a deposition apparatus, and glow cleaning is performed first, followed by ion etching cleaning. This can better ensure the cleanliness of the workpiece surface to be treated.
其中,所述超声清洗是依次在去离子水、丙酮、乙醇中进行超声5-30min。在超声清洗后,需要将基底吹干,再进行其他预处理。Wherein, the ultrasonic cleaning is performed in deionized water, acetone, and ethanol in sequence for 5-30 min. After ultrasonic cleaning, the substrate needs to be dried before other pretreatments.
其中,所述辉光清洗和所述离子刻蚀清洗均需要在真空度为5.0×10-3Pa以下进行。Wherein, both the glow cleaning and the ion etching cleaning need to be performed under a vacuum degree of 5.0×10 −3 Pa or less.
具体地,所述辉光清洗的条件为:向真空室内通入氩气,氩气流量300~500sccm,工作气压为1.0~1.7Pa,基底偏压-500~-800V,所述辉光清洗的时间为10~30min。Specifically, the conditions of the glow cleaning are: feeding argon into the vacuum chamber, the argon flow rate is 300-500 sccm, the working pressure is 1.0-1.7Pa, the substrate bias is -500--800V, and the glow cleaning The time is 10 to 30 minutes.
具体地,所述离子刻蚀清洗的条件为:开启离子源,离子源电压为50~90V;氩气流量为70~300sccm,工作气压为0.5~1.2Pa,基底偏压为-100~-800V;所述离子刻蚀清洗的时间为10~30min。Specifically, the conditions for the ion etching cleaning are: turn on the ion source, the ion source voltage is 50-90V; the argon gas flow is 70-300sccm, the working pressure is 0.5-1.2Pa, and the substrate bias voltage is -100--800V ; The time for the ion etching and cleaning is 10-30 min.
优选地,当所述基体的材质为医用不锈钢、聚合物、钴基合金、硬质合金、玻璃和硅时,在所述预处理之后以及沉积所述类金刚石涂层之前,还包括沉积一过渡金属层。Preferably, when the material of the substrate is medical stainless steel, polymer, cobalt-based alloy, cemented carbide, glass and silicon, after the pretreatment and before depositing the diamond-like coating, it also includes depositing a transition metal layer.
进一步地,所述沉积过渡金属层的步骤包括:向真空室内通入氩气,调节所述真空室的压强为0.2~1.3Pa,开启过渡金属电弧靶,进行电弧沉积金属过渡层,控制靶电流为80~200A,基底偏压为-100~-300V,沉积时间为2~10min。Further, the step of depositing the transition metal layer includes: feeding argon gas into the vacuum chamber, adjusting the pressure of the vacuum chamber to 0.2-1.3 Pa, opening the transition metal arc target, performing arc deposition of the metal transition layer, and controlling the target current is 80-200A, the substrate bias is -100--300V, and the deposition time is 2-10min.
进一步地,所述过渡金属层的厚度为50~500nm。Further, the thickness of the transition metal layer is 50-500 nm.
优选地,所述氩气的流量为50~400sccm。Preferably, the flow rate of the argon gas is 50-400 sccm.
其中,沉积所述类金刚石涂层的方法包括磁控溅射、热丝化学气相沉积(HFCVD)、等离子体增强化学气相沉积,或其他常规的制备类金刚石涂层的方法。Wherein, the method for depositing the diamond-like coating includes magnetron sputtering, hot filament chemical vapor deposition (HFCVD), plasma-enhanced chemical vapor deposition, or other conventional methods for preparing the diamond-like coating.
在本发明一实施方式中,采用磁控溅射的方式来沉积类金刚石涂层,具体地,包括:向真空室中通入氩气并开启碳靶进行沉积,使所述真空室内的压强为0.5~1.0Pa,所述碳靶的靶功率为1~5kW,基底负偏压为-50~-200V,沉积时间为30~600min。In one embodiment of the present invention, the method of magnetron sputtering is used to deposit the diamond-like carbon coating, which specifically includes: feeding argon gas into the vacuum chamber and turning on the carbon target for deposition, so that the pressure in the vacuum chamber is 0.5~1.0Pa, the target power of the carbon target is 1~5kW, the negative bias voltage of the substrate is -50~-200V, and the deposition time is 30~600min.
在本发明一实施方式中,采用等离子体增强化学气相沉积的方式来沉积类金刚石涂层,具体地,包括:向真空室中通入气态碳源进行沉积,使所述真空室内的压强为0.5~1.0Pa,离子源电压为50~100V,基底负偏压为-50~-200V,沉积时间为30~600min。气态碳源包括可以为甲烷、乙炔、丙酮等。此时,所述类金刚石涂层的厚度为500nm-10μm。In an embodiment of the present invention, the plasma-enhanced chemical vapor deposition method is used to deposit the diamond-like carbon coating. Specifically, the method includes: feeding a gaseous carbon source into a vacuum chamber for deposition, so that the pressure in the vacuum chamber is 0.5 ~1.0Pa, the ion source voltage is 50~100V, the negative bias voltage of the substrate is -50~-200V, and the deposition time is 30~600min. The gaseous carbon source may include methane, acetylene, acetone, and the like. At this time, the thickness of the diamond-like coating is 500 nm-10 μm.
其中,所述类金刚石涂层的刻蚀是采用感应耦合等离子体(ICP)刻蚀或者电子回旋共振微波等离子体化学气相沉积(ECR-MWPCVD)刻蚀。此时,所述类金刚石涂层的厚度为500nm-10μm。Wherein, the etching of the diamond-like coating is inductively coupled plasma (ICP) etching or electron cyclotron resonance microwave plasma chemical vapor deposition (ECR-MWPCVD) etching. At this time, the thickness of the diamond-like coating is 500 nm-10 μm.
进一步地,所述ICP刻蚀的条件为:将沉积有类金刚石涂层的基体置于电感耦合等离子体刻蚀(ICP)腔体中,利用氢气、氩气、氧气、氦气、氮气、气态碳源、CF4、C4F8和SF6中的一种或多种为反应气体,反应气体的流量为5~200sccm,反应气压为0.1~10Pa,ICP的电源功率PICP为500~3000W,基片台上射频功率Prf为50~300W,刻蚀时间为10~600min。此时,被刻蚀掉的类金刚石涂层的厚度为400nm~10μm。Further, the conditions of the ICP etching are: placing the substrate on which the diamond-like carbon coating is deposited in an inductively coupled plasma etching (ICP) cavity, using hydrogen, argon, oxygen, helium, nitrogen, gaseous One or more of the carbon source, CF 4 , C 4 F 8 and SF 6 is a reaction gas, the flow rate of the reaction gas is 5~200sccm, the reaction gas pressure is 0.1~10Pa, and the power P ICP of the ICP is 500~3000W , the radio frequency power P rf on the substrate stage is 50-300W, and the etching time is 10-600min. At this time, the thickness of the etched diamond-like carbon coating is 400 nm˜10 μm.
本申请中,所述ICP的电源功率PICP对于气体的离化率起到关键作用;射射频功率Prf是指加载在基片台上(基体)的偏压功率,Prf决定刻蚀过程中物理轰击所占的比重,对于刻蚀取向选择性和速率起到关键作用。主要通过控制PICP和Prf可以实现对最终刻蚀所得结构的形貌的控制。In this application, the power P ICP of the ICP plays a key role in the ionization rate of the gas; the radio frequency power P rf refers to the bias power loaded on the substrate stage (substrate), and P rf determines the etching process The proportion of physical bombardment in the medium plays a key role in the selectivity and rate of etching orientation. The control of the morphology of the final etched structure can be achieved mainly by controlling P ICP and P rf .
进一步地,所述ECR-MWPCVD刻蚀的步骤包括:将沉积有类金刚石涂层的基体置于电子回旋共振微波等离子体化学气相沉积(ECR-MWPCVD)设备中,通入氢气,气态碳源和氩气中的一种或多种作为反应气体,气体压力为5~8mTorr,直流负偏压为75~230V,偏流为40~120mA,刻蚀时间为30分钟~6小时。其中,所述气态碳源可以为甲烷、乙炔、丙酮等气态的碳源,优选为甲烷。此时,此时,被刻蚀掉的类金刚石涂层的厚度为400nm~10μm。Further, the step of the ECR-MWPCVD etching includes: placing the substrate on which the diamond-like carbon coating is deposited into an electron cyclotron resonance microwave plasma chemical vapor deposition (ECR-MWPCVD) equipment, feeding hydrogen, a gaseous carbon source and One or more of the argon gases are used as reactive gases, the gas pressure is 5-8 mTorr, the DC negative bias voltage is 75-230 V, the bias current is 40-120 mA, and the etching time is 30 minutes-6 hours. Wherein, the gaseous carbon source may be a gaseous carbon source such as methane, acetylene, acetone, etc., preferably methane. At this time, the thickness of the diamond-like carbon coating layer etched away is 400 nm to 10 μm.
优选地,所述ECR-MWPCVD刻蚀时,通入的气体为单独的氢气,或者是氢气和气态碳源的混合气体,或者氢气和氩气的混合气体,或者是氢气、气态碳源和氢气构成的混合气体。Preferably, during the ECR-MWPCVD etching, the gas introduced is hydrogen alone, or a mixed gas of hydrogen and gaseous carbon source, or a mixed gas of hydrogen and argon, or hydrogen, gaseous carbon source and hydrogen composed of mixed gases.
此外,还可通过双偏压辅助HFCVD刻蚀方法进行刻蚀类金刚石涂层,形成的类金刚石纳米针阵列。In addition, the diamond-like carbon coating can also be etched by a double bias-assisted HFCVD etching method to form a diamond-like nanoneedle array.
本发明第二方面提供的一种具有类金刚石阵列的结构件的制备方法,通过在基体上先沉积一层类金刚石涂层,然后对其进行刻蚀,形成具有针尖状尖端结构的类金刚石纳米针阵列,所述类金刚石纳米针阵列具有较好的抗细菌黏附、杀灭细菌的功能。所述制备方法简单易操作,可以形成具有尖锐尖端的大面积类金刚石纳米针阵列,便于商业化的应用。The second aspect of the present invention provides a method for preparing a structural member with a diamond-like carbon array. By first depositing a layer of diamond-like carbon coating on a substrate, and then etching it, a diamond-like carbon nanometer with a needle-like tip structure is formed. Needle array, the diamond-like nano-needle array has better anti-bacterial adhesion and killing functions. The preparation method is simple and easy to operate, and a large-area diamond-like nanoneedle array with sharp tips can be formed, which is convenient for commercial application.
本发明的优点将会在下面的说明书中部分阐明,一部分根据说明书是显而易见的,或者可以通过本发明实施例的实施而获知。Advantages of the present invention will be set forth in part in the description which follows, in part will be apparent from the description, or may be learned by practice of embodiments of the invention.
附图说明Description of drawings
图1为本发明实施例1、2制得的具有类金刚石阵列的结构件的结构示意图;1 is a schematic structural diagram of a structural member with a diamond-like carbon array prepared in Embodiments 1 and 2 of the present invention;
图2为本发明实施例3-5制得的具有类金刚石阵列的结构件的结构示意图;2 is a schematic structural diagram of a structural member with a diamond-like carbon array prepared in Example 3-5 of the present invention;
图3为本发明实施例4、5制得的具有类金刚石阵列的结构件与对比实施例1的抗菌性能测试结果。FIG. 3 shows the antibacterial performance test results of the structural members with diamond-like carbon arrays prepared in Examples 4 and 5 of the present invention and Comparative Example 1. FIG.
具体实施方式Detailed ways
以下所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。The following description is the preferred embodiment of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can also be made, and these improvements and modifications are also regarded as It is the protection scope of the present invention.
实施例1:Example 1:
一种具有类金刚石阵列的结构件的制备方法,包括:A preparation method of a structural member with a diamond-like carbon array, comprising:
(1)基体预处理:(1) Matrix pretreatment:
提供钴铬合金作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中100℃烘干;Cobalt-chromium alloy is provided as the substrate. First, the substrate is ultrasonically cleaned with distilled water for 10 minutes, and then ultrasonically cleaned with acetone and absolute ethanol for 20 minutes. Then the substrate is blown dry with nitrogen, and dried at 100 °C in a blast drying oven. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)的真空腔体中,先将真空腔体抽真空至本底真空度为5.0×10-3Pa,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:氩气流量300sccm,工作压强为1.0Pa,基底偏压为-800V,对基底进行辉光清洗,清洗时间为10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为90V,氩气流量300sccm,氩气的工作气压为1.2Pa,基底偏压为-800V;清洗时间为10min;The above-mentioned substrate was placed in the vacuum chamber of the multi-functional ion coating equipment (V-Tech MF610/610), the vacuum chamber was first evacuated to a background vacuum of 5.0×10 -3 Pa, and the main valve of the argon cylinder was opened. , the pressure reducing valve, the ion source valve, the arc valve and the target valve and the mass flow meter pass argon into the vacuum chamber to perform glow cleaning on the substrate, wherein, the conditions of the glow cleaning are: the argon flow rate is 300sccm, and the working pressure is 1.0 Pa, the substrate bias voltage is -800V, the substrate is subjected to glow cleaning, and the cleaning time is 10min; after the glow cleaning is completed, the ion source is turned on to perform ion bombardment cleaning on the sample, and the ion etching cleaning conditions are: the ion source voltage is 90V, The flow rate of argon gas is 300sccm, the working pressure of argon gas is 1.2Pa, the substrate bias voltage is -800V; the cleaning time is 10min;
(2)过渡金属层沉积:在上述离子刻蚀清洗结束后,向真空室内通入氩气,调节氩气流量使真空室的压强为1.3Pa,开启过渡金属电弧靶,靶电流为100A,基底偏压为-300V,以电弧离子镀方式进行金属过渡层的沉积,沉积时间为3min;其中,本实施例中以纯Ti作电弧靶,所得Ti层的厚度为80nm。(2) transition metal layer deposition: after the above-mentioned ion etching and cleaning finishes, feed argon into the vacuum chamber, adjust the argon flow so that the pressure of the vacuum chamber is 1.3Pa, open the transition metal arc target, the target current is 100A, the substrate The bias voltage was -300V, and the metal transition layer was deposited by arc ion plating, and the deposition time was 3 minutes; in this example, pure Ti was used as the arc target, and the thickness of the obtained Ti layer was 80 nm.
(3)类金刚石层(DLC)沉积:在上一步得到的过渡金属层上采用磁控溅射的方式进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为纯石墨靶),调节氩气流量使真空室内的压强为0.6Pa,碳靶功率为5kW,基底负偏压为-30V,沉积时间为1.5h;其中,DLC层的厚度为2.5μm;(3) Diamond-like carbon layer (DLC) deposition: On the transition metal layer obtained in the previous step, the DLC is deposited by magnetron sputtering, and argon gas is introduced into the vacuum chamber and the carbon target (specifically, a pure graphite target) is turned on. , adjust the argon flow so that the pressure in the vacuum chamber is 0.6Pa, the carbon target power is 5kW, the substrate negative bias is -30V, and the deposition time is 1.5h; the thickness of the DLC layer is 2.5μm;
(4)DLC的刻蚀:上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电子回旋共振微波等离子体化学气相沉积系统(ECR-MWPCVD)中,抽真空至10-5Pa,然后重新充氢气至7mTorr,开启ECR微波等离子体模式,外加电磁线圈提供的磁场在ECR区的强度为875高斯,采用如下条件进行反应离子刻蚀:通入氢气和甲烷,甲烷/氢气体积比:3%/97%,总气体流量:20sccm,使气体压力为6.6mTorr,基体台上加载的直流负偏压为-220V,偏流为80mA,刻蚀时间为2小时,刻蚀完毕后关掉偏压、微波电源、电磁线圈电源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即类金刚石纳米针的高度)为2μm,残余的DLC层的厚度为500nm;所述类金刚石纳米针的长径比为50,尖部直径为50nm,底部直径为200nm,针密度为~108cm-2。(4) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, the multifunctional ion coating equipment (V-TechMF610/610) is turned off, and when the temperature of the substrate is lowered to room temperature, the substrate is placed in electron cyclotron resonance microwave plasma chemical vapor deposition In the system (ECR-MWPCVD), the vacuum was evacuated to 10 -5 Pa, and then the hydrogen gas was recharged to 7mTorr, the ECR microwave plasma mode was turned on, and the magnetic field provided by the external electromagnetic coil had a strength of 875 Gauss in the ECR region, and the reaction was carried out under the following conditions Ion etching: hydrogen and methane were introduced, the volume ratio of methane/hydrogen: 3%/97%, the total gas flow: 20sccm, the gas pressure was 6.6mTorr, the negative DC bias loaded on the substrate table was -220V, and the bias current was 80mA, the etching time is 2 hours, turn off the bias voltage, the microwave power supply, the electromagnetic coil power supply after the etching is completed, and turn off the gas to obtain the diamond-like nano-needle array; The height of the needles) was 2 μm, the thickness of the residual DLC layer was 500 nm; the diamond-like nanoneedles had an aspect ratio of 50, a tip diameter of 50 nm, a bottom diameter of 200 nm, and a needle density of ~10 8 cm −2 .
实施例2:Example 2:
一种具有类金刚石阵列的结构件的制备方法,包括:A preparation method of a structural member with a diamond-like carbon array, comprising:
(1)基体预处理:(1) Matrix pretreatment:
提供聚醚醚酮(PEEK)基片作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中80℃烘干;Provide a polyetheretherketone (PEEK) substrate as the substrate, first ultrasonically clean the substrate with distilled water for 10 min, then ultrasonically clean it with acetone and absolute ethanol for 20 min, and then dry the substrate with nitrogen, and put it into blast drying Dry at 80℃ in the box;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,抽真空至5.0×10- 3Pa,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为向真空室内通入氩气,氩气流量400sccm,工作压强为1.4Pa,基底偏压-500V,对基底进行辉光清洗,清洗时间为30min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为50V,氩气流量70sccm,氩气的工作气压为0.5Pa,基底偏压为-100V;清洗时间为30min;The above-mentioned substrate was placed in a multifunctional ion coating equipment (V-Tech MF610/610), evacuated to 5.0×10 - 3 Pa, and the main valve of the argon cylinder, pressure reducing valve, ion source valve, arc valve and target valve were opened. And the mass flow meter feeds argon gas into the vacuum chamber to perform glow cleaning on the substrate, wherein the conditions for glow cleaning are to feed argon gas into the vacuum chamber, the argon gas flow rate is 400sccm, the working pressure is 1.4Pa, and the substrate bias voltage is -500V , perform glow cleaning on the substrate, and the cleaning time is 30min; after the glow cleaning, turn on the ion source to clean the sample by ion bombardment. The working air pressure is 0.5Pa, the substrate bias is -100V; the cleaning time is 30min;
(2)过渡金属层沉积:在上述离子刻蚀清洗结束后,向真空室内通入氩气,调节氩气流量(流量为50~400sccm)使真空室的压强为1.0Pa,开启过渡金属电弧靶,靶电流为150A,基底偏压为-200V,以电弧离子镀方式进行金属过渡层的沉积,沉积时间为10min;其中,本实施例中以纯Ti作电弧靶,所得Ti层的厚度为500nm。(2) Deposition of transition metal layer: after the above-mentioned ion etching and cleaning is completed, argon gas is introduced into the vacuum chamber, the flow rate of argon gas is adjusted (the flow rate is 50~400sccm) so that the pressure of the vacuum chamber is 1.0Pa, and the transition metal arc target is turned on. , the target current is 150A, the substrate bias is -200V, and the metal transition layer is deposited by arc ion plating, and the deposition time is 10min; wherein, in this embodiment, pure Ti is used as the arc target, and the thickness of the obtained Ti layer is 500nm.
(3)类金刚石层(DLC)沉积:在上一步得到的过渡金属层上采用等离子体增强化学气相沉积(PECVD)的方式进行DLC的沉积,向真空室中通入乙炔和氩气,调节真空室内的压强为1.0Pa,离子源电压为100V,基底负偏压为-50V,沉积时间为10h;其中,DLC层的厚度为10μm;(3) Diamond-like carbon layer (DLC) deposition: On the transition metal layer obtained in the previous step, the DLC is deposited by means of plasma enhanced chemical vapor deposition (PECVD), and acetylene and argon are fed into the vacuum chamber to adjust the vacuum The pressure in the chamber is 1.0Pa, the voltage of the ion source is 100V, the negative bias voltage of the substrate is -50V, and the deposition time is 10h; the thickness of the DLC layer is 10μm;
(4)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电感耦合等离子体刻蚀(ICP)设备的腔体中,对基体进行等离子体刻蚀,采用ICP刻蚀的条件为:通入氧气作为反应气体,反应气体的流量为20sccm,工作压强为10Pa,ICP的频率为13.56MHz,ICP的电源功率PICP为1000W,基片台上射频功率Prf为200W,刻蚀时间为90min,刻蚀完毕后关掉ICP源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即类金刚石纳米针的高度)为~9μm,残余的DLC层的厚度为1μm;所述类金刚石纳米针的长径比为~20,尖部直径为60~100nm,底部直径为800nm~1μm,针密度为~104cm-2。(4) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, the multifunctional ion coating equipment (V-TechMF610/610) is turned off, and the substrate is placed in inductively coupled plasma etching (ICP) when the temperature of the substrate drops to room temperature. ) in the cavity of the equipment, plasma etching is performed on the substrate, and the conditions for using ICP etching are as follows: oxygen is introduced as the reaction gas, the flow rate of the reaction gas is 20sccm, the working pressure is 10Pa, the frequency of the ICP is 13.56MHz, the ICP The power supply power P ICP is 1000W, the radio frequency power P rf on the substrate stage is 200W, and the etching time is 90min. After the etching is completed, the ICP source is turned off, and the gas is turned off to obtain a diamond-like nanoneedle array; The thickness of the DLC layer (that is, the height of the diamond-like nanoneedles) is ~9 μm, and the thickness of the residual DLC layer is 1 μm; the aspect ratio of the diamond-like nanoneedles is ~20, the diameter of the tip is 60 to 100 nm, and the diameter of the bottom is 60 to 100 nm. is 800 nm to 1 μm, and the pin density is ~10 4 cm -2 .
图1为本发明实施例1、2制得的抗菌类金刚石阵列材料的结构示意图。图1中101为基体,102为过渡金属层,1031为残余的类金刚石层,1031为类金刚石纳米针阵列,1031和1032的厚度总和为初始沉积的DLC层的厚度。FIG. 1 is a schematic structural diagram of the antibacterial diamond-like carbon array materials prepared in Examples 1 and 2 of the present invention. In FIG. 1 , 101 is the substrate, 102 is the transition metal layer, 1031 is the residual diamond-like carbon layer, 1031 is the diamond-like carbon nanoneedle array, and the sum of the thicknesses of 1031 and 1032 is the thickness of the initially deposited DLC layer.
实施例3:Example 3:
一种具有类金刚石阵列的结构件的制备方法,包括:A preparation method of a structural member with a diamond-like carbon array, comprising:
(1)基体预处理:(1) Matrix pretreatment:
提供Ni-Ti合金作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中于120℃烘干;The Ni-Ti alloy was provided as the substrate. First, the substrate was ultrasonically cleaned with distilled water for 10 min, followed by ultrasonic cleaning with acetone and absolute ethanol for 20 min. Then the substrate was blown dry with nitrogen and placed in a blast drying oven at 120 °C. drying;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量500sccm,工作压强为1.5Pa,基底偏压-600V,对基底进行辉光清洗20min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为70V,氩气流量150sccm,氩气的工作气压为0.9Pa,基底偏压为-550V;清洗时间20min;The above-mentioned substrate was placed in a multifunctional ion coating equipment (V-Tech MF610/610), and the main valve of the argon cylinder, the pressure reducing valve and the ion source valve were opened under the condition of a background vacuum of 5.0×10 -3 Pa. , arc valve and target valve and mass flow meter into the vacuum chamber to pass argon to the substrate to carry out glow cleaning, wherein, the conditions of glow cleaning are: enter argon into the vacuum chamber, the argon flow rate is 500sccm, and the working pressure is 1.5 Pa, the substrate bias voltage is -600V, and the substrate is subjected to glow cleaning for 20 minutes; after the glow cleaning is completed, the ion source is turned on to clean the sample by ion bombardment. The working pressure of argon is 0.9Pa, the substrate bias is -550V; the cleaning time is 20min;
(2)过渡金属沉积:在上述离子刻蚀清洗结束后,向真空室内通入氩气,调节氩气流量(50~400sccm)使真空室的压强为1.0Pa,开启过渡金属电弧靶,靶电流为100A,基底偏压为-300V,以电弧离子镀方式进行金属过渡层的沉积,沉积时间为4min;其中,本实施例中以纯Ti作电弧靶,所得Ti层的厚度为100nm。(2) transition metal deposition: after the above-mentioned ion etching and cleaning is finished, pass argon gas into the vacuum chamber, adjust the argon gas flow (50~400sccm) to make the pressure of the vacuum chamber be 1.0Pa, open the transition metal arc target, the target current is 100A, the substrate bias is -300V, the metal transition layer is deposited by arc ion plating, and the deposition time is 4min; in this embodiment, pure Ti is used as the arc target, and the thickness of the obtained Ti layer is 100nm.
(3)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,将基体置于多功能离子镀膜设备(V-Tech MF610/610)中,采用等离子体增强化学气相沉积(PECVD)的方式在基体表面进行DLC的沉积,向真空室中通入乙炔和氩气,调节真空室内的压强为0.9Pa,离子源电压为80V,基底负偏压为-100V,沉积时间为60min;其中,DLC层的厚度为0.5μm;(3) Deposition of diamond-like carbon layer (DLC): After the above-mentioned ion etching and cleaning, the substrate is placed in a multifunctional ion coating equipment (V-Tech MF610/610), and a plasma-enhanced chemical vapor deposition (PECVD) is used. The DLC deposition was carried out on the surface of the substrate, acetylene and argon were introduced into the vacuum chamber, the pressure in the vacuum chamber was adjusted to 0.9Pa, the voltage of the ion source was 80V, the negative bias voltage of the substrate was -100V, and the deposition time was 60min; among them, The thickness of the DLC layer is 0.5 μm;
(4)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电感耦合等离子体刻蚀(ICP)设备的腔体中,对基体进行等离子体刻蚀,采用ICP刻蚀的条件为:通入CF4或SF6作为反应气体,反应气体的流量为40sccm,工作压强为10Pa,ICP的频率为13.56MHz,ICP的电源功率PICP为2000W,基片台上射频功率Prf为150W,刻蚀时间为50min,刻蚀完毕后关掉ICP源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即类金刚石纳米针的高度)为450nm,残余的DLC层的厚度为50nm;所述类金刚石纳米针的长径比为~10,尖部直径为20nm,底部直径为100nm,针密度为~109cm-2。(4) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, the multifunctional ion coating equipment (V-TechMF610/610) is turned off, and the substrate is placed in inductively coupled plasma etching (ICP) when the temperature of the substrate drops to room temperature. ) in the cavity of the equipment, the substrate is subjected to plasma etching, and the conditions for using ICP etching are as follows: CF4 or SF6 is introduced as the reaction gas, the flow rate of the reaction gas is 40sccm, the working pressure is 10Pa, and the frequency of ICP is 13.56MHz, the power P ICP of the ICP is 2000W, the radio frequency power P rf on the substrate stage is 150W, the etching time is 50min, after the etching is completed, the ICP source is turned off, and the gas is turned off to obtain a diamond-like nanoneedle array; wherein, The thickness of the etched DLC layer (that is, the height of the diamond-like nanoneedles) is 450 nm, and the thickness of the remaining DLC layer is 50 nm; the aspect ratio of the diamond-like nanoneedles is ~10, the diameter of the tip is 20 nm, and the bottom of the The diameter is 100 nm and the pin density is ~ 109 cm -2 .
实施例4:Example 4:
一种具有类金刚石阵列的结构件的制备方法,包括:A preparation method of a structural member with a diamond-like carbon array, comprising:
(1)基体预处理:(1) Matrix pretreatment:
提供钛合金TC4作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中150℃烘干;Titanium alloy TC4 was provided as the substrate. First, the substrate was ultrasonically cleaned with distilled water for 10 min, followed by ultrasonic cleaning with acetone and absolute ethanol for 20 min. Then the substrate was blown dry with nitrogen, and dried at 150 °C in a blast drying oven. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量450sccm,工作压强为1.7Pa,基底偏压-800V,对基底进行辉光清洗,清洗时间10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为80V,氩气流量200sccm,氩气的工作气压为1.0Pa,基底偏压为-450V;清洗时间为20min;The above-mentioned substrate was placed in a multifunctional ion coating equipment (V-Tech MF610/610), and the main valve of the argon cylinder, the pressure reducing valve and the ion source valve were opened under the condition of a background vacuum of 5.0×10 -3 Pa. , arc valve and target valve and mass flow meter into the vacuum chamber to pass argon to the substrate to carry out glow cleaning, wherein, the conditions of the glow cleaning are: enter argon into the vacuum chamber, the argon flow rate is 450sccm, and the working pressure is 1.7 Pa, substrate bias voltage -800V, glow cleaning the substrate, cleaning time 10min; after glow cleaning, turn on the ion source to clean the sample by ion bombardment, ion etching cleaning conditions are: ion source voltage is 80V, argon gas The flow rate is 200sccm, the working pressure of argon is 1.0Pa, the substrate bias is -450V; the cleaning time is 20min;
(2)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,采用磁控溅射的方式在基体表面进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为石墨靶),调节氩气流量使真空室内的压强为0.8Pa,碳靶功率为1kW,基底负偏压为-100V,沉积时间为5小时;其中,DLC层的厚度为5μm;(2) deposition of diamond-like carbon layer (DLC): after the above-mentioned ion etching and cleaning is finished, the deposition of DLC is carried out on the surface of the substrate by means of magnetron sputtering, and argon gas is introduced into the vacuum chamber and the carbon target (specifically, graphite) is turned on. target), adjust the argon flow so that the pressure in the vacuum chamber is 0.8Pa, the carbon target power is 1kW, the substrate negative bias is -100V, and the deposition time is 5 hours; wherein, the thickness of the DLC layer is 5μm;
(3)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电子回旋共振微波等离子体化学气相沉积系统(ECR-MWPCVD)中,抽真空至10-5Pa,然后重新充氢气至7mTorr,开启ECR微波等离子体模式,外加电磁线圈提供的磁场在ECR区的强度为875高斯,采用如下条件进行反应离子刻蚀:通入氢气,气体流量为:20sccm,使气体压力为8mTorr,基体台上加载的直流负偏压为-150V,偏流为40-60mA,刻蚀时间为120min,刻蚀完毕后关掉偏压、微波电源、电磁线圈电源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即锥状类金刚石纳米针的高度)为800nm~2.5μm,残余的DLC层的厚度为2.5μm。本实施例中所得类金刚石纳米针的尖部直径为10~40nm,底部直径为350~750μm,针密度为~4×108cm-2。(3) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, the multifunctional ion coating equipment (V-TechMF610/610) is turned off, and the substrate temperature is lowered to room temperature, and the substrate is placed in the electron cyclotron resonance microwave plasma chemical vapor phase In the deposition system (ECR-MWPCVD), the vacuum was evacuated to 10 -5 Pa, and then the hydrogen gas was recharged to 7 mTorr, the ECR microwave plasma mode was turned on, and the intensity of the magnetic field provided by the external electromagnetic coil in the ECR region was 875 Gauss, and the following conditions were used to carry out Reactive ion etching: Pass in hydrogen, the gas flow is: 20sccm, the gas pressure is 8mTorr, the negative DC bias loaded on the substrate table is -150V, the bias current is 40-60mA, the etching time is 120min, after the etching is completed Turn off the bias voltage, microwave power supply, electromagnetic coil power supply, and turn off the gas to obtain a diamond-like nanoneedle array; wherein, the thickness of the etched DLC layer (that is, the height of the tapered diamond-like nanoneedles) is 800nm~2.5μm, and the residual The thickness of the DLC layer is 2.5 μm. The diameter of the tip of the diamond-like nanoneedles obtained in this example is 10-40 nm, the diameter of the bottom is 350-750 μm, and the needle density is ˜4×10 8 cm −2 .
实施例5:Example 5:
一种具有类金刚石阵列的结构件的制备方法,包括:A preparation method of a structural member with a diamond-like carbon array, comprising:
(1)基体预处理:(1) Matrix pretreatment:
提供钛合金TC4作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中150℃烘干;Titanium alloy TC4 was provided as the substrate. First, the substrate was ultrasonically cleaned with distilled water for 10 min, followed by ultrasonic cleaning with acetone and absolute ethanol for 20 min. Then the substrate was blown dry with nitrogen, and dried at 150 °C in a blast drying oven. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量450sccm,工作压强为1.7Pa,基底偏压-800V,对基底进行辉光清洗,清洗时间10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为80V,氩气流量200sccm,氩气的工作气压为1.0Pa,基底偏压为-450V;清洗时间为20min;The above-mentioned substrate was placed in a multifunctional ion coating equipment (V-Tech MF610/610), and the main valve of the argon cylinder, the pressure reducing valve and the ion source valve were opened under the condition of a background vacuum of 5.0×10 -3 Pa. , arc valve and target valve and mass flow meter into the vacuum chamber to pass argon to the substrate to carry out glow cleaning, wherein, the conditions of the glow cleaning are: enter argon into the vacuum chamber, the argon flow rate is 450sccm, and the working pressure is 1.7 Pa, substrate bias voltage -800V, glow cleaning the substrate, cleaning time 10min; after glow cleaning, turn on the ion source to clean the sample by ion bombardment, ion etching cleaning conditions are: ion source voltage is 80V, argon gas The flow rate is 200sccm, the working pressure of argon is 1.0Pa, the substrate bias is -450V; the cleaning time is 20min;
(2)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,采用磁控溅射的方式在基体表面进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为石墨靶),调节氩气流量使真空室内的压强为0.8Pa,碳靶功率为1kW,基底负偏压为-100V,沉积时间为5小时;其中,DLC层的厚度为5μm;(2) deposition of diamond-like carbon layer (DLC): after the above-mentioned ion etching and cleaning is finished, the deposition of DLC is carried out on the surface of the substrate by means of magnetron sputtering, and argon gas is introduced into the vacuum chamber and the carbon target (specifically, graphite) is turned on. target), adjust the argon flow so that the pressure in the vacuum chamber is 0.8Pa, the carbon target power is 1kW, the substrate negative bias is -100V, and the deposition time is 5 hours; wherein, the thickness of the DLC layer is 5μm;
(3)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电子回旋共振微波等离子体化学气相沉积系统(ECR-MWPCVD)中,抽真空至10-5Pa,然后重新充氢气至7mTorr,开启ECR微波等离子体模式,外加电磁线圈提供的磁场在ECR区的强度为875高斯,采用如下条件进行反应离子刻蚀:通入氢气和氩气,氩气/氢气体积比:45%/55%,总气体流量:20sccm,使气体压力为5mTorr,基体台上加载的直流负偏压为-200V,偏流为40-60mA,刻蚀时间为240min,刻蚀完毕后关掉偏压、微波电源、电磁线圈电源,关闭气体,得到类金刚石纳米针阵列;其中,残余的DLC层的厚度为500nm,所得到的类金刚石纳米针的针密度约为1.7×108cm-2,其分为两个部分,其中小部分类金刚石纳米锥非常小,高度小于100nm,尖部直径为10~40nm,底部直径小于100nm;而大多数纳米锥的高度为3~4.5μm,底部直径为100nm~2μm,尖部直径为10~40nm。(3) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, the multifunctional ion coating equipment (V-TechMF610/610) is turned off, and the substrate temperature is lowered to room temperature, and the substrate is placed in the electron cyclotron resonance microwave plasma chemical vapor phase In the deposition system (ECR-MWPCVD), the vacuum was evacuated to 10 -5 Pa, and then the hydrogen gas was recharged to 7 mTorr, the ECR microwave plasma mode was turned on, and the intensity of the magnetic field provided by the external electromagnetic coil in the ECR region was 875 Gauss, and the following conditions were used to carry out Reactive ion etching: pass hydrogen and argon, argon/hydrogen volume ratio: 45%/55%, total gas flow: 20sccm, make the gas pressure 5mTorr, and the DC negative bias loaded on the substrate table is -200V, The bias current is 40-60mA, and the etching time is 240min. After the etching is completed, the bias voltage, microwave power supply, and electromagnetic coil power supply are turned off, and the gas is turned off to obtain a diamond-like nanoneedle array; wherein, the thickness of the residual DLC layer is 500nm, so The needle density of the obtained diamond-like nanoneedles is about 1.7×10 8 cm -2 , which is divided into two parts, of which a small part of the diamond-like nanocones is very small, the height is less than 100 nm, the diameter of the tip is 10-40 nm, and the diameter of the bottom is 10-40 nm. less than 100 nm; while most nanocones have a height of 3-4.5 μm, a bottom diameter of 100 nm to 2 μm, and a tip diameter of 10 to 40 nm.
图2为本发明实施例3-5制得的抗菌类金刚石阵列材料的结构示意图。图1中201为基体,2021为残余的类金刚石层,2022为类金刚石纳米针阵列,在所述残余类金刚石层与基体之间没有设置过渡金属层。FIG. 2 is a schematic structural diagram of the antibacterial diamond-like carbon array materials prepared in Examples 3-5 of the present invention. In FIG. 1 , 201 is a substrate, 2021 is a residual diamond-like carbon layer, and 2022 is a diamond-like carbon nanoneedle array, and no transition metal layer is provided between the residual diamond-like carbon layer and the substrate.
对比实施例1Comparative Example 1
(1)基体预处理:(1) Matrix pretreatment:
提供钛合金TC4作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中150℃烘干;Titanium alloy TC4 was provided as the substrate. First, the substrate was ultrasonically cleaned with distilled water for 10 min, followed by ultrasonic cleaning with acetone and absolute ethanol for 20 min. Then the substrate was blown dry with nitrogen, and dried at 150 °C in a blast drying oven. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量450sccm,工作压强为1.7Pa,基底偏压-800V,对基底进行辉光清洗,清洗时间10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为80V,氩气流量200sccm,氩气的工作气压为1.0Pa,基底偏压为-450V;清洗时间为20min;The above-mentioned substrate was placed in a multifunctional ion coating equipment (V-Tech MF610/610), and the main valve of the argon cylinder, the pressure reducing valve and the ion source valve were opened under the condition of a background vacuum of 5.0×10 -3 Pa. , arc valve and target valve and mass flow meter into the vacuum chamber to pass argon to the substrate to carry out glow cleaning, wherein, the conditions of the glow cleaning are: enter argon into the vacuum chamber, the argon flow rate is 450sccm, and the working pressure is 1.7 Pa, substrate bias voltage -800V, glow cleaning the substrate, cleaning time 10min; after glow cleaning, turn on the ion source to clean the sample by ion bombardment, ion etching cleaning conditions are: ion source voltage is 80V, argon gas The flow rate is 200sccm, the working pressure of argon is 1.0Pa, the substrate bias is -450V; the cleaning time is 20min;
(2)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,采用磁控溅射的方式在基体表面进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为石墨靶),调节氩气流量使真空室内的压强为0.8Pa,碳靶功率为1kW,基底负偏压为-100V,沉积时间为5小时;其中,DLC层的厚度为5μm;(2) deposition of diamond-like carbon layer (DLC): after the above-mentioned ion etching and cleaning is finished, the deposition of DLC is carried out on the surface of the substrate by means of magnetron sputtering, and argon gas is introduced into the vacuum chamber and the carbon target (specifically, graphite) is turned on. target), adjust the argon flow so that the pressure in the vacuum chamber is 0.8Pa, the carbon target power is 1kW, the substrate negative bias is -100V, and the deposition time is 5 hours; wherein, the thickness of the DLC layer is 5μm;
效果实施例Effect Example
为验证本发明制得的材料具有抗菌性能,本发明还提供了效果实施例。In order to verify that the material prepared by the present invention has antibacterial properties, the present invention also provides effect examples.
将本发明实施例4、5制得的抗菌类金刚石阵列材料分别进行抗菌性能测试,并在钛合金TC4上沉积5μm厚的完整DLC层作为对比实施例1,其结果如图3所示,将绿脓杆菌分别作用在对比实施例1(钛合金TC4+完整DLC层),以及实施例4和实施例5所得类金刚石纳米阵列上,(a)为表面形貌不同的基底附着的绿脓杆菌细菌总数;(b)为1h后死亡的绿脓杆菌所占的百分比。从图3中的(b)中可以看出完整的类金刚石涂层(对比例1)以及实施例4和5所得类金刚石纳米针列都具有一定的抗菌效果,但实施例4和5所得类金刚石纳米针列的杀菌效果明显比普通没有刻蚀的完整类金刚石涂层的杀菌效果好得多。而对比不同条件下刻蚀的纳米针列,可以看出实施例5所制得的类金刚石纳米针列(高度不一的纳米针)的杀菌效果更好一些。The antibacterial diamond-like carbon array materials prepared in Examples 4 and 5 of the present invention were respectively tested for antibacterial performance, and a complete DLC layer with a thickness of 5 μm was deposited on titanium alloy TC4 as Comparative Example 1. The results are shown in Figure 3. Pseudomonas aeruginosa acted on comparative example 1 (titanium alloy TC4+ complete DLC layer), and diamond-like nanoarrays obtained in examples 4 and 5, respectively, (a) Pseudomonas aeruginosa bacteria attached to substrates with different surface topography The total number; (b) is the percentage of Pseudomonas aeruginosa that died after 1 h. It can be seen from (b) in FIG. 3 that the complete diamond-like carbon coating (Comparative Example 1) and the diamond-like nano-needle arrays obtained in Examples 4 and 5 have a certain antibacterial effect, but the The bactericidal effect of diamond nano-needle array is obviously much better than that of ordinary complete diamond-like carbon coating without etching. By comparing the nanoneedle arrays etched under different conditions, it can be seen that the sterilization effect of the diamond-like nanoneedle arrays (nanoneedles with different heights) prepared in Example 5 is better.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the patent of the present invention. It should be pointed out that for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.
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