CN106835011A - A kind of structural member with Diamond-like Carbon array and preparation method thereof - Google Patents
A kind of structural member with Diamond-like Carbon array and preparation method thereof Download PDFInfo
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Abstract
本发明提供了一种具有类金钢石阵列的结构件,包括基体和设置在所述基体上的具有尖端结构的类金刚石纳米针阵列,所述类金刚石纳米针阵列通过对形成在所述基体上的一类金刚石涂层进行刻蚀得到。所述具有类金钢石阵列的结构件可以对细菌的细胞壁产生压力,穿刺细菌的细胞壁使其伸展并最终溶解,导致细菌死亡,有效破坏生物膜的形成,赋予该结构件显著的抗菌性能。本发明还提供了该具有类金钢石阵列的结构件的制备方法。
The invention provides a structure with a diamond-like nanoneedle array, including a substrate and a diamond-like nanoneedle array with a tip structure arranged on the substrate, and the diamond-like nanoneedle array is formed on the substrate by pairing etched on a class of diamond coatings. The structural member with the diamond-like array can generate pressure on the cell wall of the bacteria, pierce the cell wall of the bacteria to stretch and eventually dissolve, leading to the death of the bacteria, effectively destroying the formation of biofilm, and endowing the structural member with significant antibacterial properties. The invention also provides a preparation method of the structural member with the diamond-like matrix.
Description
技术领域technical field
本发明涉及超疏水材料领域,具体涉及一种具有类金钢石阵列的结构件及其制备方法。The invention relates to the field of superhydrophobic materials, in particular to a structural member with a diamond-like array and a preparation method thereof.
背景技术Background technique
生物材料,特别是用于医用植入体(如自动植入式心脏除颤器,尿导管等)和手术器具上的生物材料,由于直接与人体组织接触,需满足临床使用的各种要求。除具备一般材料的良好物理、化学和力学性能外,还必须具有抗菌性,以免受细菌定植,进而导致在设备表面形成生物膜及感染细菌。生物膜是微生物为应对外界环境变化而自身分泌的胞外聚合物聚集于介质表面所形成的菌落聚集体,生物膜的形成会增加细菌的耐药性,提高临床医疗的难度。因此,一般需要对医用金属、陶瓷材料进行表面改性,以提供其抗菌性。Biomaterials, especially biomaterials used in medical implants (such as automatic implantable cardiac defibrillators, urinary catheters, etc.) and surgical instruments, must meet various requirements for clinical use due to their direct contact with human tissues. In addition to having good physical, chemical and mechanical properties of general materials, they must also have antimicrobial properties to avoid bacterial colonization, which can lead to the formation of biofilms on the surface of equipment and bacterial infection. Biofilm is a colony aggregate formed by the extracellular polymers secreted by microorganisms in response to changes in the external environment and aggregated on the surface of the medium. The formation of biofilm will increase the drug resistance of bacteria and increase the difficulty of clinical treatment. Therefore, it is generally necessary to modify the surface of medical metal and ceramic materials to provide their antibacterial properties.
类金刚石(diamond-like carbon,DLC)是一种含有sp2和sp3键合特征的非晶碳材料,具有高硬度、低摩擦、高热导率、高透光性、化学惰性强及良好的生物相容性等优异性能,DLC膜在光学窗口、刀具、模具等零部件、生物医疗器件等领域都具有广阔的应用前景。DLC涂层作为医学植入体材料表面改性层,其主要优越性表现在:①DLC涂层机械强度与植入体材料的可适配性不仅保证了涂层与医用植入体材料的牢固结合,而且增强了植入体负载部位的支撑强度;②高致密度DLC涂层其优异的耐磨耐蚀性能不仅提高了生物-力学交互环境下植入体材料的耐腐蚀磨损能力,同时可有效屏蔽金属离子向周围组织和血液的扩散,进而抑制有害金属离子溶入生物组织并阻止其对生物组织产生的毒性反应而引起的组织损伤,延长医用材料服役寿命;③低毒性和高化学稳定性的DLC涂层因其具有可调控表面界面性能而能够适应植入体服役环境,降低人体对医用植入材料的排异性并提高其与生物组织的相容性。但目前还未见单独的DLC涂层就能具有抗菌性的报道。Diamond-like carbon (DLC) is an amorphous carbon material containing sp 2 and sp 3 bonding characteristics, which has high hardness, low friction, high thermal conductivity, high light transmittance, strong chemical inertness and good With excellent properties such as biocompatibility, DLC films have broad application prospects in optical windows, cutting tools, molds and other parts, biomedical devices and other fields. DLC coating is used as a surface modification layer of medical implant materials, and its main advantages are as follows: ①The adaptability of DLC coating mechanical strength and implant materials not only ensures the firm combination of coatings and medical implant materials , and enhance the support strength of the loading part of the implant; ②The excellent wear and corrosion resistance of the high-density DLC coating not only improves the corrosion and wear resistance of the implant material in the bio-mechanical interactive environment, but also effectively Shield the diffusion of metal ions to surrounding tissues and blood, thereby inhibiting the dissolution of harmful metal ions into biological tissues and preventing tissue damage caused by their toxic reactions to biological tissues, prolonging the service life of medical materials; ③Low toxicity and high chemical stability Due to its adjustable surface and interface properties, the DLC coating can adapt to the implant service environment, reduce the human body's rejection of medical implant materials and improve its compatibility with biological tissues. However, there is no report that a single DLC coating can have antibacterial properties.
发明内容Contents of the invention
有鉴于此,本发明第一方面提供了一种具有类金钢石阵列的结构件,其通过在基体上先沉积一层类金钢石涂层,然后对其进行刻蚀,形成具有针尖状尖端结构的类金钢石纳米针阵列。该具有类金钢石阵列的结构件具有良好的抗菌性能,用以解决现有技术中类金刚石涂层备杀菌性弱或几乎没有抗菌性能的问题。In view of this, the first aspect of the present invention provides a structural member with a diamond-like array, which first deposits a layer of diamond-like coating on the substrate, and then etches it to form a needle-like Diamond-like nanoneedle arrays with tip structures. The structural member with the diamond-like array has good antibacterial performance, and is used to solve the problem of weak or almost no antibacterial performance of the diamond-like coating in the prior art.
第一方面,本发明提供了一种具有类金钢石阵列的结构件,包括基体和设置在所述基体上的具有尖端结构的类金刚石纳米针阵列,所述类金刚石纳米针阵列通过对形成在所述基体上的一类金刚石涂层进行刻蚀得到。In a first aspect, the present invention provides a structure with a diamond-like nanoneedle array, including a substrate and a diamond-like nanoneedle array with a tip structure arranged on the substrate, and the diamond-like nanoneedle array is formed by pairing A type of diamond coating is etched on the substrate.
优选地,所述基体和类金刚石纳米针阵列之间还设置有残余类金钢石涂层,所述类金刚石纳米针阵列形成在所述残余类金钢石涂层表面。所述残余类金钢石涂层为一完整的涂层,不具有类金刚石纳米针。进一步地,所述残余类金钢石涂层的厚度为100nm~3μm。所述残余类金钢石涂层的存在,更有利于提高基体和类金刚石纳米针阵列的结合力。Preferably, a residual diamond-like coating is further provided between the substrate and the array of diamond-like nanoneedles, and the array of diamond-like nano-needles is formed on the surface of the residual diamond-like coating. The residual diamond-like coating is a complete coating without diamond-like nanoneedles. Further, the thickness of the residual diamond-like coating is 100 nm-3 μm. The existence of the residual diamond-like coating is more conducive to improving the bonding force between the substrate and the diamond-like nanoneedle array.
优选地,所述金刚石纳米针阵列中的类金刚石纳米针为锥状结构,所述类金刚石纳米针的长径比为20~80,尖部直径为10~100nm,底部直径为30nm~2μm,针密度为104~109个·cm-2。Preferably, the diamond-like nanoneedles in the diamond nanoneedle array have a cone-shaped structure, the aspect ratio of the diamond-like nanoneedles is 20-80, the diameter of the tip is 10-100 nm, and the diameter of the bottom is 30 nm-2 μm. The needle density is 10 4 to 10 9 ·cm -2 .
其中,所述长径比是指纳米针的高度与所述纳米针高度的一半所对应的直径的比值。显然地,所述底部直径应不小于所述尖部直径。Wherein, the aspect ratio refers to the ratio of the height of the nanoneedle to the diameter corresponding to half the height of the nanoneedle. Obviously, the base diameter should not be smaller than the tip diameter.
本申请中,所述金刚石纳米针阵列中,类金刚石纳米针的高度可以为均一的高度,也可以是高度不一的纳米针,其高度在10nm~10μm之间变化。例如可以同时存在高度在100nm以下的纳米针和高度为0.8-9μm的纳米针。In the present application, in the diamond nanoneedle array, the diamond-like nanoneedles may have a uniform height, or may be nanoneedles with different heights, the height of which varies between 10 nm and 10 μm. For example, nanoneedles with a height of less than 100 nm and nanoneedles with a height of 0.8-9 μm may exist at the same time.
进一步地,所述类金刚石纳米针的高度为400nm~10μm。类金刚石纳米针的高度呈梯度分布。Further, the diamond-like nanoneedles have a height of 400 nm-10 μm. The height of the diamond-like nanoneedles is distributed in a gradient.
本申请中,所述类金刚石纳米针的尺寸与细菌尺寸相近,长径比较高。所述类金刚石纳米针的尺寸可以完全一样,也可以不完全一致,有一定的高低变化。所述类金刚石纳米针的长径比为30~60(优选为35-55、40-50);尖部直径为10~50nm或60~100nm;底部直径为800nm~2μm或者200~700nm或者30~200nm。所述针密度可以为105~109个·cm-2,例如可以是106~×109个·cm-2,108个·cm-2。可以通过对类金刚石纳米针尺寸和密度的调控,来优化所述抗菌类金钢石阵列材料的抗菌性能和哺乳类生物细胞相容性。In the present application, the size of the diamond-like nanoneedles is similar to that of bacteria, and the aspect ratio is high. The size of the diamond-like nanoneedles can be completely the same or not, and there are certain height changes. The aspect ratio of the diamond-like nanoneedle is 30-60 (preferably 35-55, 40-50); the diameter of the tip is 10-50nm or 60-100nm; the diameter of the bottom is 800nm-2μm or 200-700nm or 30 ~200nm. The needle density may be 10 5 to 10 9 ·cm -2 , for example, 10 6 to ×10 9 ·cm -2 , 10 8 ·cm -2 . The antibacterial performance and mammalian biocytocompatibility of the antibacterial diamond-like array material can be optimized by adjusting the size and density of the diamond-like nanoneedles.
优选地,所述基体为金属、金属合金、硬质合金、不锈钢、聚合物、玻璃和硅的一种或多种,但不限于此。特别是常用的植入材料,如钛合金TC4等。Preferably, the substrate is one or more of metal, metal alloy, hard alloy, stainless steel, polymer, glass and silicon, but not limited thereto. Especially commonly used implant materials, such as titanium alloy TC4 and so on.
其中,所述金属可以选自钛Ti、镍Ni、钼Mo、铌Nb、钽Ta、钌Ru、铂Pt中的任一种。所述金属合金可以是钛基合金、钴基合金(如钴铬合金)、Ni-Ti合金、镍基合金;所述硬质合金可以是碳化钨基硬质合金、碳化钛基硬质合金、碳氮化钛基硬质合金、碳化铬基硬质合金中的一种。Wherein, the metal may be selected from any one of titanium Ti, nickel Ni, molybdenum Mo, niobium Nb, tantalum Ta, ruthenium Ru, and platinum Pt. The metal alloy can be a titanium-based alloy, a cobalt-based alloy (such as a cobalt-chromium alloy), a Ni-Ti alloy, a nickel-based alloy; the hard alloy can be a tungsten carbide-based hard alloy, a titanium carbide-based hard alloy, One of titanium carbonitride-based cemented carbide and chromium carbide-based cemented carbide.
优选地,当所述基体的材质为医用不锈钢、聚合物、钴基金属合金、硬质合金、玻璃和硅时,所述抗菌类金钢石阵列材料还包括一过渡金属层,所述过渡金属层位于所述基体与所述残余类金钢石涂层之间。Preferably, when the material of the substrate is medical stainless steel, polymer, cobalt-based metal alloy, hard alloy, glass and silicon, the antibacterial diamond array material also includes a transition metal layer, and the transition metal A layer is located between the substrate and the residual diamond-like coating.
进一步地,所述过渡金属层的厚度为50~500nm。所述过渡金属层中的金属为Cr、Ti、Ni、Zr、W、Mo、Nb、Ta、Ru、Pt等过渡金属元素中的一种。Further, the thickness of the transition metal layer is 50-500 nm. The metal in the transition metal layer is one of transition metal elements such as Cr, Ti, Ni, Zr, W, Mo, Nb, Ta, Ru, and Pt.
本申请中,如果基体的材质本身就是过渡金属或热膨胀系数差异较小的金属合金(如钛Ti、镍Ni、铌Nb、钽Ta;钛基合金、Ni-Ti合金、镍基合金时),直接在基体表面沉积类金钢石涂层,就可使其牢固结合在基体表面,然后再刻蚀得到阵列。如果基体不为过渡金属,则需要在基底上先沉积一层过渡金属层,再在该过渡金属层的基础上沉积类金钢石涂层,以提高类金钢石涂层牢固结合在基体上。In the present application, if the material of the substrate itself is a transition metal or a metal alloy with a small difference in coefficient of thermal expansion (such as titanium Ti, nickel Ni, niobium Nb, tantalum Ta; when titanium-based alloys, Ni-Ti alloys, and nickel-based alloys), Directly depositing a diamond-like coating on the surface of the substrate can make it firmly bonded to the surface of the substrate, and then etch to obtain the array. If the substrate is not a transition metal, it is necessary to deposit a transition metal layer on the substrate first, and then deposit a diamond-like coating on the basis of the transition metal layer to improve the firm bonding of the diamond-like coating to the substrate. .
本发明第一方面提供的具有类金钢石阵列的结构件包括基体和设置在所述基体表面的具有尖端结构的类金刚石纳米针阵列,所述类金刚石纳米针阵列通过对形成在衬底层表面的类金刚石涂层进行刻蚀得到。所述类金钢石纳米针阵列不仅可以对细菌的细胞壁产生压力,穿刺细菌的细胞壁使其伸展并最终溶解,导致细菌死亡,有效破坏生物膜的形成,赋予类金刚石涂层显著的抗菌性能。此外,所述类金钢石纳米针阵列对于大多数细胞,特别是人体细胞而言,几乎不具有毒性,还可支持人体细胞的粘附,可以应用于各种医用植入体以及手术器具上,防止细菌感染,有利于人体健康。The structural member with a diamond-like nanoneedle array provided by the first aspect of the present invention includes a substrate and a diamond-like nanoneedle array with a tip structure arranged on the surface of the substrate, and the diamond-like nanoneedle array is formed on the surface of the substrate layer by pairing The diamond-like carbon coating is obtained by etching. The diamond-like nanoneedle array can not only generate pressure on the cell wall of the bacteria, but also pierce the cell wall of the bacteria to stretch and finally dissolve, leading to the death of the bacteria, effectively destroying the formation of biofilm, and endowing the diamond-like coating with remarkable antibacterial properties. In addition, the diamond-like nanoneedle array is almost non-toxic to most cells, especially human cells, and can also support the adhesion of human cells, and can be applied to various medical implants and surgical instruments , to prevent bacterial infection, beneficial to human health.
第二方面,本发明提供了一种具有类金钢石阵列的结构件的制备方法,包括以下步骤:In a second aspect, the present invention provides a method for preparing a structural member with a diamond-like array, comprising the following steps:
提供基体,对所述基体进行预处理;providing a substrate, and pretreating the substrate;
将所述预处理后的基体置于镀膜设备的真空室内,在所述预处理后的基体上沉积类金刚石涂层;The pretreated substrate is placed in a vacuum chamber of a coating device, and a diamond-like coating is deposited on the pretreated substrate;
对所述类金刚石涂层进行刻蚀,得到具有尖端结构的类金刚石纳米针阵列。The diamond-like coating is etched to obtain a diamond-like nanoneedle array with a pointed structure.
优选地,所述预处理包括超声清洗、辉光清洗和离子刻蚀清洗中的一种或多种。Preferably, the pretreatment includes one or more of ultrasonic cleaning, glow cleaning and ion etching cleaning.
在本发明一实施方式中,可以先进行超声清洗,之后将超声清洗后的基底置于一沉积设备的真空室内,先进行辉光清洗,再进行离子刻蚀清洗。这样可以更好地保证待处理工件表面的清洁度。In one embodiment of the present invention, ultrasonic cleaning may be performed first, and then the ultrasonically cleaned substrate is placed in a vacuum chamber of a deposition device for glow cleaning and then ion etching cleaning. This can better ensure the cleanliness of the workpiece surface to be treated.
其中,所述超声清洗是依次在去离子水、丙酮、乙醇中进行超声5-30min。在超声清洗后,需要将基底吹干,再进行其他预处理。Wherein, the ultrasonic cleaning is performed in deionized water, acetone, and ethanol in sequence for 5-30 minutes. After ultrasonic cleaning, the substrate needs to be blown dry before other pretreatments.
其中,所述辉光清洗和所述离子刻蚀清洗均需要在真空度为5.0×10-3Pa以下进行。Wherein, both the glow cleaning and the ion etching cleaning need to be performed at a vacuum degree below 5.0×10 −3 Pa.
具体地,所述辉光清洗的条件为:向真空室内通入氩气,氩气流量300~500sccm,工作气压为1.0~1.7Pa,基底偏压-500~-800V,所述辉光清洗的时间为10~30min。Specifically, the conditions of the glow cleaning are as follows: argon gas is introduced into the vacuum chamber, the flow rate of the argon gas is 300-500 sccm, the working pressure is 1.0-1.7Pa, and the substrate bias voltage is -500--800V. The time is 10-30 minutes.
具体地,所述离子刻蚀清洗的条件为:开启离子源,离子源电压为50~90V;氩气流量为70~300sccm,工作气压为0.5~1.2Pa,基底偏压为-100~-800V;所述离子刻蚀清洗的时间为10~30min。Specifically, the conditions for ion etching and cleaning are: turn on the ion source, the ion source voltage is 50-90V; the argon gas flow rate is 70-300 sccm, the working pressure is 0.5-1.2Pa, and the substrate bias voltage is -100--800V ; The ion etching cleaning time is 10-30 minutes.
优选地,当所述基体的材质为医用不锈钢、聚合物、钴基合金、硬质合金、玻璃和硅时,在所述预处理之后以及沉积所述类金刚石涂层之前,还包括沉积一过渡金属层。Preferably, when the material of the substrate is medical stainless steel, polymer, cobalt-based alloy, cemented carbide, glass and silicon, after the pretreatment and before depositing the diamond-like coating, a transition process is also included. metal layer.
进一步地,所述沉积过渡金属层的步骤包括:向真空室内通入氩气,调节所述真空室的压强为0.2~1.3Pa,开启过渡金属电弧靶,进行电弧沉积金属过渡层,控制靶电流为80~200A,基底偏压为-100~-300V,沉积时间为2~10min。Further, the step of depositing the transition metal layer includes: introducing argon gas into the vacuum chamber, adjusting the pressure of the vacuum chamber to 0.2-1.3 Pa, turning on the transition metal arc target, performing arc deposition of the metal transition layer, and controlling the target current 80~200A, substrate bias voltage is -100~-300V, deposition time is 2~10min.
进一步地,所述过渡金属层的厚度为50~500nm。Further, the thickness of the transition metal layer is 50-500 nm.
优选地,所述氩气的流量为50~400sccm。Preferably, the flow rate of the argon gas is 50-400 sccm.
其中,沉积所述类金刚石涂层的方法包括磁控溅射、热丝化学气相沉积(HFCVD)、等离子体增强化学气相沉积,或其他常规的制备类金刚石涂层的方法。Wherein, the method for depositing the diamond-like coating includes magnetron sputtering, hot wire chemical vapor deposition (HFCVD), plasma-enhanced chemical vapor deposition, or other conventional methods for preparing the diamond-like coating.
在本发明一实施方式中,采用磁控溅射的方式来沉积类金刚石涂层,具体地,包括:向真空室中通入氩气并开启碳靶进行沉积,使所述真空室内的压强为0.5~1.0Pa,所述碳靶的靶功率为1~5kW,基底负偏压为-50~-200V,沉积时间为30~600min。In one embodiment of the present invention, the diamond-like carbon coating is deposited by means of magnetron sputtering, specifically, including: passing argon gas into the vacuum chamber and opening the carbon target for deposition, so that the pressure in the vacuum chamber is 0.5-1.0Pa, the target power of the carbon target is 1-5kW, the substrate negative bias is -50--200V, and the deposition time is 30-600min.
在本发明一实施方式中,采用等离子体增强化学气相沉积的方式来沉积类金刚石涂层,具体地,包括:向真空室中通入气态碳源进行沉积,使所述真空室内的压强为0.5~1.0Pa,离子源电压为50~100V,基底负偏压为-50~-200V,沉积时间为30~600min。气态碳源包括可以为甲烷、乙炔、丙酮等。此时,所述类金刚石涂层的厚度为500nm-10μm。In one embodiment of the present invention, the diamond-like carbon coating is deposited by means of plasma-enhanced chemical vapor deposition, specifically, including: feeding a gaseous carbon source into a vacuum chamber for deposition, so that the pressure in the vacuum chamber is 0.5 ~1.0Pa, the ion source voltage is 50~100V, the substrate negative bias voltage is -50~-200V, and the deposition time is 30~600min. Gaseous carbon sources include methane, acetylene, acetone and the like. At this time, the thickness of the diamond-like coating is 500 nm-10 μm.
其中,所述类金刚石涂层的刻蚀是采用感应耦合等离子体(ICP)刻蚀或者电子回旋共振微波等离子体化学气相沉积(ECR-MWPCVD)刻蚀。此时,所述类金刚石涂层的厚度为500nm-10μm。Wherein, the etching of the diamond-like coating adopts inductively coupled plasma (ICP) etching or electron cyclotron resonance microwave plasma chemical vapor deposition (ECR-MWPCVD) etching. At this time, the thickness of the diamond-like coating is 500 nm-10 μm.
进一步地,所述ICP刻蚀的条件为:将沉积有类金刚石涂层的基体置于电感耦合等离子体刻蚀(ICP)腔体中,利用氢气、氩气、氧气、氦气、氮气、气态碳源、CF4、C4F8和SF6中的一种或多种为反应气体,反应气体的流量为5~200sccm,反应气压为0.1~10Pa,ICP的电源功率PICP为500~3000W,基片台上射频功率Prf为50~300W,刻蚀时间为10~600min。此时,被刻蚀掉的类金刚石涂层的厚度为400nm~10μm。Further, the conditions of the ICP etching are: the substrate deposited with the diamond-like coating is placed in an inductively coupled plasma etching (ICP) chamber, and hydrogen, argon, oxygen, helium, nitrogen, gaseous One or more of carbon source, CF 4 , C 4 F 8 and SF 6 is the reaction gas, the flow rate of the reaction gas is 5-200sccm, the reaction pressure is 0.1-10Pa, and the power supply P ICP of the ICP is 500-3000W , the radio frequency power P rf on the substrate table is 50-300W, and the etching time is 10-600min. At this time, the thickness of the etched diamond-like carbon coating is 400 nm˜10 μm.
本申请中,所述ICP的电源功率PICP对于气体的离化率起到关键作用;射射频功率Prf是指加载在基片台上(基体)的偏压功率,Prf决定刻蚀过程中物理轰击所占的比重,对于刻蚀取向选择性和速率起到关键作用。主要通过控制PICP和Prf可以实现对最终刻蚀所得结构的形貌的控制。In the present application, the power supply P ICP of the ICP plays a key role in the ionization rate of the gas; the radio frequency power P rf refers to the bias power loaded on the substrate stage (substrate), and P rf determines the etching process The proportion of physical bombardment plays a key role in the etching orientation selectivity and rate. The control of the morphology of the final etched structure can be realized mainly by controlling P ICP and P rf .
进一步地,所述ECR-MWPCVD刻蚀的步骤包括:将沉积有类金刚石涂层的基体置于电子回旋共振微波等离子体化学气相沉积(ECR-MWPCVD)设备中,通入氢气,气态碳源和氩气中的一种或多种作为反应气体,气体压力为5~8mTorr,直流负偏压为75~230V,偏流为40~120mA,刻蚀时间为30分钟~6小时。其中,所述气态碳源可以为甲烷、乙炔、丙酮等气态的碳源,优选为甲烷。此时,此时,被刻蚀掉的类金刚石涂层的厚度为400nm~10μm。Further, the step of ECR-MWPCVD etching includes: placing the substrate deposited with the diamond-like coating in an electron cyclotron resonance microwave plasma chemical vapor deposition (ECR-MWPCVD) device, feeding hydrogen, gaseous carbon source and One or more of argon gas is used as the reaction gas, the gas pressure is 5-8mTorr, the DC negative bias voltage is 75-230V, the bias current is 40-120mA, and the etching time is 30 minutes-6 hours. Wherein, the gaseous carbon source may be a gaseous carbon source such as methane, acetylene, acetone, etc., preferably methane. At this time, at this time, the thickness of the etched away diamond-like coating is 400 nm˜10 μm.
优选地,所述ECR-MWPCVD刻蚀时,通入的气体为单独的氢气,或者是氢气和气态碳源的混合气体,或者氢气和氩气的混合气体,或者是氢气、气态碳源和氢气构成的混合气体。Preferably, during the ECR-MWPCVD etching, the gas fed is hydrogen alone, or a mixed gas of hydrogen and gaseous carbon source, or a mixed gas of hydrogen and argon, or hydrogen, gaseous carbon source and hydrogen formed gas mixture.
此外,还可通过双偏压辅助HFCVD刻蚀方法进行刻蚀类金刚石涂层,形成的类金刚石纳米针阵列。In addition, the diamond-like carbon coating can also be etched by a double-bias assisted HFCVD etching method to form a diamond-like nano-needle array.
本发明第二方面提供的一种具有类金钢石阵列的结构件的制备方法,通过在基体上先沉积一层类金钢石涂层,然后对其进行刻蚀,形成具有针尖状尖端结构的类金钢石纳米针阵列,所述类金钢石纳米针阵列具有较好的抗细菌黏附、杀灭细菌的功能。所述制备方法简单易操作,可以形成具有尖锐尖端的大面积类金钢石纳米针阵列,便于商业化的应用。The second aspect of the present invention provides a method for preparing a structural member with a diamond-like array, by first depositing a layer of diamond-like coating on the substrate, and then etching it to form a needle-like tip structure The diamond-like nanoneedle array has better anti-bacterial adhesion and killing bacteria functions. The preparation method is simple and easy to operate, can form a large-area diamond-like nanoneedle array with sharp tips, and is convenient for commercial application.
本发明的优点将会在下面的说明书中部分阐明,一部分根据说明书是显而易见的,或者可以通过本发明实施例的实施而获知。The advantages of the present invention will be partly clarified in the following description, and part of them will be obvious from the description, or can be known through the implementation of the embodiments of the present invention.
附图说明Description of drawings
图1为本发明实施例1、2制得的具有类金钢石阵列的结构件的结构示意图;Fig. 1 is the structural representation of the structure member that has diamond-like array that the embodiment of the present invention 1, 2 makes;
图2为本发明实施例3-5制得的具有类金钢石阵列的结构件的结构示意图;Fig. 2 is the schematic structural view of the structural member with diamond-like arrays obtained in Example 3-5 of the present invention;
图3为本发明实施例4、5制得的具有类金钢石阵列的结构件与对比实施例1的抗菌性能测试结果。FIG. 3 shows the antibacterial performance test results of the structural members with diamond-like arrays prepared in Examples 4 and 5 of the present invention and Comparative Example 1. FIG.
具体实施方式detailed description
以下所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。The following description is a preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also considered Be the protection scope of the present invention.
实施例1:Example 1:
一种具有类金钢石阵列的结构件的制备方法,包括:A method for preparing a structural member having a diamond-like array, comprising:
(1)基体预处理:(1) Substrate pretreatment:
提供钴铬合金作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中100℃烘干;Cobalt-chromium alloy is provided as the substrate. First, the substrate is ultrasonically cleaned with distilled water for 10 minutes, then ultrasonically cleaned with acetone and absolute ethanol for 20 minutes, and then the substrate is dried with nitrogen and placed in a blast drying oven at 100 ° C. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)的真空腔体中,先将真空腔体抽真空至本底真空度为5.0×10-3Pa,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:氩气流量300sccm,工作压强为1.0Pa,基底偏压为-800V,对基底进行辉光清洗,清洗时间为10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为90V,氩气流量300sccm,氩气的工作气压为1.2Pa,基底偏压为-800V;清洗时间为10min;Place the above substrate in the vacuum chamber of the multifunctional ion coating equipment (V-Tech MF610/610), first evacuate the vacuum chamber to a background vacuum of 5.0×10 -3 Pa, and open the main valve of the argon gas cylinder , pressure reducing valve, ion source valve, arc valve and target valve and mass flowmeter feed argon into vacuum chamber to carry out glow cleaning to substrate, wherein, the condition of glow cleaning is: argon gas flow rate 300sccm, working pressure is 1.0 Pa, the substrate bias is -800V, the substrate is glow-cleaned, and the cleaning time is 10min; after the glow cleaning is completed, the ion source is turned on to perform ion bombardment cleaning on the sample. The flow rate of argon gas is 300sccm, the working pressure of argon gas is 1.2Pa, the base bias voltage is -800V; the cleaning time is 10min;
(2)过渡金属层沉积:在上述离子刻蚀清洗结束后,向真空室内通入氩气,调节氩气流量使真空室的压强为1.3Pa,开启过渡金属电弧靶,靶电流为100A,基底偏压为-300V,以电弧离子镀方式进行金属过渡层的沉积,沉积时间为3min;其中,本实施例中以纯Ti作电弧靶,所得Ti层的厚度为80nm。(2) Deposition of the transition metal layer: After the above-mentioned ion etching cleaning is completed, argon gas is introduced into the vacuum chamber, the flow rate of the argon gas is adjusted so that the pressure of the vacuum chamber is 1.3Pa, the transition metal arc target is turned on, the target current is 100A, the substrate The bias voltage was -300V, and the metal transition layer was deposited by arc ion plating, and the deposition time was 3 minutes; wherein, pure Ti was used as the arc target in this embodiment, and the thickness of the obtained Ti layer was 80 nm.
(3)类金刚石层(DLC)沉积:在上一步得到的过渡金属层上采用磁控溅射的方式进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为纯石墨靶),调节氩气流量使真空室内的压强为0.6Pa,碳靶功率为5kW,基底负偏压为-30V,沉积时间为1.5h;其中,DLC层的厚度为2.5μm;(3) Diamond-like layer (DLC) deposition: On the transition metal layer obtained in the previous step, DLC is deposited by magnetron sputtering, argon gas is introduced into the vacuum chamber and a carbon target (specifically, a pure graphite target) is turned on. , adjust the argon flow to make the pressure in the vacuum chamber 0.6Pa, the carbon target power 5kW, the substrate negative bias voltage -30V, and the deposition time 1.5h; wherein, the thickness of the DLC layer is 2.5μm;
(4)DLC的刻蚀:上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电子回旋共振微波等离子体化学气相沉积系统(ECR-MWPCVD)中,抽真空至10-5Pa,然后重新充氢气至7mTorr,开启ECR微波等离子体模式,外加电磁线圈提供的磁场在ECR区的强度为875高斯,采用如下条件进行反应离子刻蚀:通入氢气和甲烷,甲烷/氢气体积比:3%/97%,总气体流量:20sccm,使气体压力为6.6mTorr,基体台上加载的直流负偏压为-220V,偏流为80mA,刻蚀时间为2小时,刻蚀完毕后关掉偏压、微波电源、电磁线圈电源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即类金刚石纳米针的高度)为2μm,残余的DLC层的厚度为500nm;所述类金刚石纳米针的长径比为50,尖部直径为50nm,底部直径为200nm,针密度为~108cm-2。(4) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, turn off the multifunctional ion coating equipment (V-TechMF610/610), and wait until the temperature of the substrate drops to room temperature, place the substrate in electron cyclotron resonance microwave plasma chemical vapor deposition In the system (ECR-MWPCVD), vacuumize to 10 -5 Pa, then refill hydrogen to 7mTorr, turn on the ECR microwave plasma mode, and the magnetic field provided by the external electromagnetic coil has a strength of 875 gauss in the ECR area, and the reaction is carried out under the following conditions Ion etching: feed hydrogen and methane, methane/hydrogen volume ratio: 3%/97%, total gas flow: 20sccm, make the gas pressure 6.6mTorr, the DC negative bias loaded on the substrate table is -220V, and the bias current is 80mA, the etching time is 2 hours, after the etching is completed, turn off the bias voltage, microwave power supply, electromagnetic coil power supply, and turn off the gas to obtain the diamond-like nanoneedle array; wherein, the thickness of the etched DLC layer (that is, the diamond-like nanometer The needle height) is 2 μm, the thickness of the remaining DLC layer is 500 nm; the diamond-like nanoneedles have an aspect ratio of 50, a tip diameter of 50 nm, a base diameter of 200 nm, and a needle density of ~10 8 cm -2 .
实施例2:Example 2:
一种具有类金钢石阵列的结构件的制备方法,包括:A method for preparing a structural member having a diamond-like array, comprising:
(1)基体预处理:(1) Substrate pretreatment:
提供聚醚醚酮(PEEK)基片作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中80℃烘干;Provide a polyetheretherketone (PEEK) substrate as a substrate. First, use distilled water to ultrasonically clean the substrate for 10 minutes, then use acetone and absolute ethanol to ultrasonically clean it for 20 minutes, and then blow dry the substrate with nitrogen, and put it in the air to dry. Dry in oven at 80°C;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,抽真空至5.0×10- 3Pa,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为向真空室内通入氩气,氩气流量400sccm,工作压强为1.4Pa,基底偏压-500V,对基底进行辉光清洗,清洗时间为30min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为50V,氩气流量70sccm,氩气的工作气压为0.5Pa,基底偏压为-100V;清洗时间为30min;Put the above substrate in the multifunctional ion coating equipment (V-Tech MF610/610), vacuumize to 5.0×10 - 3 Pa, open the main valve of the argon cylinder, pressure reducing valve, ion source valve, arc valve and target valve And the mass flowmeter feeds argon gas into the vacuum chamber to perform glow cleaning on the substrate. The conditions for glow cleaning are to feed argon gas into the vacuum chamber, the flow rate of argon gas is 400 sccm, the working pressure is 1.4Pa, and the substrate bias voltage is -500V. , perform glow cleaning on the substrate, and the cleaning time is 30min; after the glow cleaning is completed, turn on the ion source to perform ion bombardment cleaning on the sample, and the ion etching cleaning conditions are: the ion source voltage is 50V, the flow rate of argon gas is 70 sccm, The working air pressure is 0.5Pa, the base bias voltage is -100V; the cleaning time is 30min;
(2)过渡金属层沉积:在上述离子刻蚀清洗结束后,向真空室内通入氩气,调节氩气流量(流量为50~400sccm)使真空室的压强为1.0Pa,开启过渡金属电弧靶,靶电流为150A,基底偏压为-200V,以电弧离子镀方式进行金属过渡层的沉积,沉积时间为10min;其中,本实施例中以纯Ti作电弧靶,所得Ti层的厚度为500nm。(2) Deposition of transition metal layer: After the above-mentioned ion etching cleaning is completed, argon gas is introduced into the vacuum chamber, the flow rate of argon gas is adjusted (the flow rate is 50-400 sccm) so that the pressure of the vacuum chamber is 1.0 Pa, and the transition metal arc target is turned on , the target current is 150A, the substrate bias is -200V, the metal transition layer is deposited by arc ion plating, and the deposition time is 10min; wherein, in this embodiment, pure Ti is used as the arc target, and the thickness of the obtained Ti layer is 500nm.
(3)类金刚石层(DLC)沉积:在上一步得到的过渡金属层上采用等离子体增强化学气相沉积(PECVD)的方式进行DLC的沉积,向真空室中通入乙炔和氩气,调节真空室内的压强为1.0Pa,离子源电压为100V,基底负偏压为-50V,沉积时间为10h;其中,DLC层的厚度为10μm;(3) Diamond-like layer (DLC) deposition: on the transition metal layer obtained in the previous step, the deposition of DLC is carried out by means of plasma enhanced chemical vapor deposition (PECVD), and acetylene and argon are introduced into the vacuum chamber to adjust the vacuum The pressure in the chamber is 1.0Pa, the ion source voltage is 100V, the substrate negative bias is -50V, and the deposition time is 10h; the thickness of the DLC layer is 10μm;
(4)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电感耦合等离子体刻蚀(ICP)设备的腔体中,对基体进行等离子体刻蚀,采用ICP刻蚀的条件为:通入氧气作为反应气体,反应气体的流量为20sccm,工作压强为10Pa,ICP的频率为13.56MHz,ICP的电源功率PICP为1000W,基片台上射频功率Prf为200W,刻蚀时间为90min,刻蚀完毕后关掉ICP源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即类金刚石纳米针的高度)为~9μm,残余的DLC层的厚度为1μm;所述类金刚石纳米针的长径比为~20,尖部直径为60~100nm,底部直径为800nm~1μm,针密度为~104cm-2。(4) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, turn off the multifunctional ion coating equipment (V-TechMF610/610), and wait for the temperature of the substrate to drop to room temperature, and place the substrate in inductively coupled plasma etching (ICP ) In the cavity of the equipment, plasma etching is performed on the substrate. The conditions for ICP etching are as follows: oxygen is introduced as the reaction gas, the flow rate of the reaction gas is 20sccm, the working pressure is 10Pa, the frequency of ICP is 13.56MHz, and the frequency of ICP is 13.56MHz. The power supply P ICP is 1000W, the radio frequency power P rf on the substrate table is 200W, and the etching time is 90min. After the etching is completed, the ICP source is turned off, the gas is turned off, and the diamond-like nanoneedle array is obtained; wherein, the etched The thickness of the DLC layer (that is, the height of the diamond-like nanoneedle) is ~ 9 μm, and the thickness of the remaining DLC layer is 1 μm; the aspect ratio of the diamond-like nanoneedle is ~ 20, the tip diameter is 60 ~ 100nm, and the bottom diameter It is 800nm~1μm, and the needle density is ~10 4 cm -2 .
图1为本发明实施例1、2制得的抗菌类金钢石阵列材料的结构示意图。图1中101为基体,102为过渡金属层,1031为残余的类金刚石层,1031为类金刚石纳米针阵列,1031和1032的厚度总和为初始沉积的DLC层的厚度。FIG. 1 is a schematic structural view of the antibacterial diamond array material prepared in Examples 1 and 2 of the present invention. In Fig. 1, 101 is a substrate, 102 is a transition metal layer, 1031 is a residual diamond-like layer, 1031 is a diamond-like nanoneedle array, and the sum of the thicknesses of 1031 and 1032 is the thickness of the initially deposited DLC layer.
实施例3:Example 3:
一种具有类金钢石阵列的结构件的制备方法,包括:A method for preparing a structural member having a diamond-like array, comprising:
(1)基体预处理:(1) Substrate pretreatment:
提供Ni-Ti合金作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中于120℃烘干;Provide a Ni-Ti alloy as a substrate. First, use distilled water to ultrasonically clean the substrate for 10 minutes, then use acetone and absolute ethanol to ultrasonically clean it for 20 minutes, then dry the substrate with nitrogen, and put it in a blast drying oven at 120 ° C. drying;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量500sccm,工作压强为1.5Pa,基底偏压-600V,对基底进行辉光清洗20min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为70V,氩气流量150sccm,氩气的工作气压为0.9Pa,基底偏压为-550V;清洗时间20min;Put the above substrate in the multifunctional ion coating equipment (V-Tech MF610/610), under the condition that the background vacuum degree is 5.0×10 -3 Pa, open the main valve of the argon cylinder, the pressure reducing valve and the ion source valve , arc valve, target valve and mass flowmeter feed argon gas into the vacuum chamber to carry out glow cleaning to the substrate, wherein the conditions of glow cleaning are: feed argon gas into the vacuum chamber, the flow rate of argon gas is 500 sccm, and the working pressure is 1.5 Pa, substrate bias -600V, glow cleaning the substrate for 20min; after the glow cleaning, turn on the ion source to perform ion bombardment cleaning on the sample, the ion etching cleaning conditions are: the ion source voltage is 70V, the argon flow rate is 150sccm, The working pressure of argon is 0.9Pa, the substrate bias is -550V; the cleaning time is 20min;
(2)过渡金属沉积:在上述离子刻蚀清洗结束后,向真空室内通入氩气,调节氩气流量(50~400sccm)使真空室的压强为1.0Pa,开启过渡金属电弧靶,靶电流为100A,基底偏压为-300V,以电弧离子镀方式进行金属过渡层的沉积,沉积时间为4min;其中,本实施例中以纯Ti作电弧靶,所得Ti层的厚度为100nm。(2) Transition metal deposition: After the above-mentioned ion etching cleaning is completed, argon gas is introduced into the vacuum chamber, and the flow rate of argon gas (50-400 sccm) is adjusted so that the pressure of the vacuum chamber is 1.0 Pa. The transition metal arc target is turned on, and the target current 100A, the substrate bias is -300V, the metal transition layer is deposited by arc ion plating, and the deposition time is 4min; wherein, in this embodiment, pure Ti is used as the arc target, and the thickness of the obtained Ti layer is 100nm.
(3)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,将基体置于多功能离子镀膜设备(V-Tech MF610/610)中,采用等离子体增强化学气相沉积(PECVD)的方式在基体表面进行DLC的沉积,向真空室中通入乙炔和氩气,调节真空室内的压强为0.9Pa,离子源电压为80V,基底负偏压为-100V,沉积时间为60min;其中,DLC层的厚度为0.5μm;(3) Diamond-like carbon layer (DLC) deposition: After the above-mentioned ion etching and cleaning, the substrate is placed in a multi-functional ion coating equipment (V-Tech MF610/610), and plasma-enhanced chemical vapor deposition (PECVD) is used. The method is to deposit DLC on the surface of the substrate, pass acetylene and argon into the vacuum chamber, adjust the pressure in the vacuum chamber to 0.9Pa, the ion source voltage to 80V, the substrate negative bias to -100V, and the deposition time to 60min; among them, The thickness of the DLC layer is 0.5 μm;
(4)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电感耦合等离子体刻蚀(ICP)设备的腔体中,对基体进行等离子体刻蚀,采用ICP刻蚀的条件为:通入CF4或SF6作为反应气体,反应气体的流量为40sccm,工作压强为10Pa,ICP的频率为13.56MHz,ICP的电源功率PICP为2000W,基片台上射频功率Prf为150W,刻蚀时间为50min,刻蚀完毕后关掉ICP源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即类金刚石纳米针的高度)为450nm,残余的DLC层的厚度为50nm;所述类金刚石纳米针的长径比为~10,尖部直径为20nm,底部直径为100nm,针密度为~109cm-2。(4) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, turn off the multifunctional ion coating equipment (V-TechMF610/610), and wait for the temperature of the substrate to drop to room temperature, and place the substrate in inductively coupled plasma etching (ICP ) In the cavity of the equipment, the substrate is etched by plasma. The conditions for ICP etching are as follows: CF 4 or SF 6 is introduced as the reaction gas, the flow rate of the reaction gas is 40 sccm, the working pressure is 10 Pa, and the frequency of ICP is 13.56MHz, the power supply P ICP of ICP is 2000W, the radio frequency power P rf on the substrate stage is 150W, and the etching time is 50min, after the etching is completed, turn off the ICP source, turn off the gas, and obtain the diamond-like nanoneedle array; wherein, The thickness of the etched DLC layer (i.e. the height of the diamond-like nanoneedle) is 450nm, and the thickness of the remaining DLC layer is 50nm; the aspect ratio of the diamond-like nanoneedle is ~ 10, the tip diameter is 20nm, and the bottom The diameter is 100 nm and the needle density is ~10 9 cm −2 .
实施例4:Example 4:
一种具有类金钢石阵列的结构件的制备方法,包括:A method for preparing a structural member having a diamond-like array, comprising:
(1)基体预处理:(1) Substrate pretreatment:
提供钛合金TC4作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中150℃烘干;Titanium alloy TC4 is provided as the substrate. First, the substrate is ultrasonically cleaned with distilled water for 10 minutes, then ultrasonically cleaned with acetone and absolute ethanol for 20 minutes, and then the substrate is blown dry with nitrogen, and dried in a blast drying oven at 150°C. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量450sccm,工作压强为1.7Pa,基底偏压-800V,对基底进行辉光清洗,清洗时间10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为80V,氩气流量200sccm,氩气的工作气压为1.0Pa,基底偏压为-450V;清洗时间为20min;Put the above substrate in the multifunctional ion coating equipment (V-Tech MF610/610), under the condition that the background vacuum degree is 5.0×10 -3 Pa, open the main valve of the argon cylinder, the pressure reducing valve and the ion source valve , arc valve, target valve and mass flowmeter feed argon gas into the vacuum chamber to carry out glow cleaning to the substrate, wherein the conditions of glow cleaning are: feed argon gas into the vacuum chamber, the flow rate of argon gas is 450 sccm, and the working pressure is 1.7 Pa, substrate bias voltage -800V, glow cleaning the substrate, cleaning time 10min; The flow rate is 200sccm, the working pressure of argon is 1.0Pa, the substrate bias is -450V; the cleaning time is 20min;
(2)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,采用磁控溅射的方式在基体表面进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为石墨靶),调节氩气流量使真空室内的压强为0.8Pa,碳靶功率为1kW,基底负偏压为-100V,沉积时间为5小时;其中,DLC层的厚度为5μm;(2) Deposition of diamond-like carbon layer (DLC): After the above-mentioned ion etching cleaning is completed, DLC is deposited on the surface of the substrate by magnetron sputtering, argon gas is introduced into the vacuum chamber and the carbon target (specifically graphite target), adjust the flow of argon gas so that the pressure in the vacuum chamber is 0.8Pa, the power of the carbon target is 1kW, the negative bias voltage of the substrate is -100V, and the deposition time is 5 hours; wherein, the thickness of the DLC layer is 5 μm;
(3)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电子回旋共振微波等离子体化学气相沉积系统(ECR-MWPCVD)中,抽真空至10-5Pa,然后重新充氢气至7mTorr,开启ECR微波等离子体模式,外加电磁线圈提供的磁场在ECR区的强度为875高斯,采用如下条件进行反应离子刻蚀:通入氢气,气体流量为:20sccm,使气体压力为8mTorr,基体台上加载的直流负偏压为-150V,偏流为40-60mA,刻蚀时间为120min,刻蚀完毕后关掉偏压、微波电源、电磁线圈电源,关闭气体,得到类金刚石纳米针阵列;其中,刻蚀掉的DLC层的厚度(即锥状类金刚石纳米针的高度)为800nm~2.5μm,残余的DLC层的厚度为2.5μm。本实施例中所得类金刚石纳米针的尖部直径为10~40nm,底部直径为350~750μm,针密度为~4×108cm-2。(3) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, turn off the multifunctional ion coating equipment (V-TechMF610/610), and wait until the temperature of the substrate drops to room temperature, and place the substrate in the electron cyclotron resonance microwave plasma chemical vapor phase In the deposition system (ECR-MWPCVD), evacuate to 10 -5 Pa, then refill hydrogen to 7mTorr, turn on the ECR microwave plasma mode, and the magnetic field provided by the external electromagnetic coil has a strength of 875 gauss in the ECR area, using the following conditions Reactive ion etching: feed hydrogen gas, gas flow rate: 20sccm, make the gas pressure 8mTorr, the DC negative bias voltage loaded on the substrate table is -150V, the bias current is 40-60mA, the etching time is 120min, after the etching is completed Turn off the bias voltage, microwave power supply, and electromagnetic coil power supply, and turn off the gas to obtain a diamond-like nanoneedle array; wherein, the thickness of the etched DLC layer (that is, the height of the tapered diamond-like nanoneedle) is 800nm to 2.5μm, and the remaining The thickness of the DLC layer is 2.5 μm. The diamond-like nanoneedles obtained in this example have a tip diameter of 10-40 nm, a bottom diameter of 350-750 μm, and a needle density of ~4×10 8 cm -2 .
实施例5:Example 5:
一种具有类金钢石阵列的结构件的制备方法,包括:A method for preparing a structural member having a diamond-like array, comprising:
(1)基体预处理:(1) Substrate pretreatment:
提供钛合金TC4作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中150℃烘干;Titanium alloy TC4 is provided as the substrate. First, the substrate is ultrasonically cleaned with distilled water for 10 minutes, then ultrasonically cleaned with acetone and absolute ethanol for 20 minutes, and then the substrate is blown dry with nitrogen, and dried in a blast drying oven at 150°C. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量450sccm,工作压强为1.7Pa,基底偏压-800V,对基底进行辉光清洗,清洗时间10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为80V,氩气流量200sccm,氩气的工作气压为1.0Pa,基底偏压为-450V;清洗时间为20min;Put the above substrate in the multifunctional ion coating equipment (V-Tech MF610/610), under the condition that the background vacuum degree is 5.0×10 -3 Pa, open the main valve of the argon cylinder, the pressure reducing valve and the ion source valve , arc valve, target valve and mass flowmeter feed argon gas into the vacuum chamber to carry out glow cleaning to the substrate, wherein the conditions of glow cleaning are: feed argon gas into the vacuum chamber, the flow rate of argon gas is 450 sccm, and the working pressure is 1.7 Pa, substrate bias voltage -800V, glow cleaning the substrate, cleaning time 10min; The flow rate is 200sccm, the working pressure of argon is 1.0Pa, the substrate bias is -450V; the cleaning time is 20min;
(2)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,采用磁控溅射的方式在基体表面进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为石墨靶),调节氩气流量使真空室内的压强为0.8Pa,碳靶功率为1kW,基底负偏压为-100V,沉积时间为5小时;其中,DLC层的厚度为5μm;(2) Deposition of diamond-like carbon layer (DLC): After the above-mentioned ion etching cleaning is completed, DLC is deposited on the surface of the substrate by magnetron sputtering, argon gas is introduced into the vacuum chamber and the carbon target (specifically graphite target), adjust the flow of argon gas so that the pressure in the vacuum chamber is 0.8Pa, the power of the carbon target is 1kW, the negative bias voltage of the substrate is -100V, and the deposition time is 5 hours; wherein, the thickness of the DLC layer is 5 μm;
(3)DLC的刻蚀:待上述DLC层的沉积结束后,关闭多功能离子镀膜设备(V-TechMF610/610),待基体温度降至室温,将基体置于电子回旋共振微波等离子体化学气相沉积系统(ECR-MWPCVD)中,抽真空至10-5Pa,然后重新充氢气至7mTorr,开启ECR微波等离子体模式,外加电磁线圈提供的磁场在ECR区的强度为875高斯,采用如下条件进行反应离子刻蚀:通入氢气和氩气,氩气/氢气体积比:45%/55%,总气体流量:20sccm,使气体压力为5mTorr,基体台上加载的直流负偏压为-200V,偏流为40-60mA,刻蚀时间为240min,刻蚀完毕后关掉偏压、微波电源、电磁线圈电源,关闭气体,得到类金刚石纳米针阵列;其中,残余的DLC层的厚度为500nm,所得到的类金刚石纳米针的针密度约为1.7×108cm-2,其分为两个部分,其中小部分类金刚石纳米锥非常小,高度小于100nm,尖部直径为10~40nm,底部直径小于100nm;而大多数纳米锥的高度为3~4.5μm,底部直径为100nm~2μm,尖部直径为10~40nm。(3) Etching of DLC: After the deposition of the above-mentioned DLC layer is completed, turn off the multifunctional ion coating equipment (V-TechMF610/610), and wait until the temperature of the substrate drops to room temperature, and place the substrate in the electron cyclotron resonance microwave plasma chemical vapor phase In the deposition system (ECR-MWPCVD), evacuate to 10 -5 Pa, then refill hydrogen to 7mTorr, turn on the ECR microwave plasma mode, and the magnetic field provided by the external electromagnetic coil has a strength of 875 gauss in the ECR area, using the following conditions Reactive ion etching: feed hydrogen and argon, argon/hydrogen volume ratio: 45%/55%, total gas flow: 20sccm, make the gas pressure 5mTorr, and the DC negative bias on the substrate table is -200V, The bias current is 40-60mA, and the etching time is 240min. After the etching is completed, turn off the bias voltage, microwave power supply, and electromagnetic coil power supply, and turn off the gas to obtain a diamond-like nanoneedle array; wherein, the thickness of the remaining DLC layer is 500nm. The needle density of the obtained diamond-like nanoneedles is about 1.7×10 8 cm -2 , which is divided into two parts, of which a small part of diamond-like nanocones is very small, with a height of less than 100nm, a tip diameter of 10-40nm, and a bottom diameter of The height of most nanocones is 3-4.5 μm, the diameter of the bottom is 100 nm-2 μm, and the diameter of the tip is 10-40 nm.
图2为本发明实施例3-5制得的抗菌类金钢石阵列材料的结构示意图。图1中201为基体,2021为残余的类金刚石层,2022为类金刚石纳米针阵列,在所述残余类金刚石层与基体之间没有设置过渡金属层。Fig. 2 is a schematic structural view of the antibacterial diamond-like array material prepared in Example 3-5 of the present invention. In FIG. 1 , 201 is a substrate, 2021 is a residual diamond-like layer, and 2022 is a diamond-like nanoneedle array, and no transition metal layer is provided between the residual diamond-like layer and the substrate.
对比实施例1Comparative Example 1
(1)基体预处理:(1) Substrate pretreatment:
提供钛合金TC4作为基体,首先用蒸馏水将将该基体超声清洗10min,再依次用丙酮和无水乙醇超声清洗20min,然后用氮气将基体吹干,并放入鼓风干燥箱中150℃烘干;Titanium alloy TC4 is provided as the substrate. First, the substrate is ultrasonically cleaned with distilled water for 10 minutes, then ultrasonically cleaned with acetone and absolute ethanol for 20 minutes, and then the substrate is blown dry with nitrogen, and dried in a blast drying oven at 150°C. ;
将上述基体置于多功能离子镀膜设备(V-Tech MF610/610)中,在本底真空度为5.0×10-3Pa的条件下,打开氩气瓶主阀,减压阀、离子源阀、弧阀和靶阀以及质量流量计向真空室内通入氩气对基体进行辉光清洗,其中,辉光清洗的条件为:向真空室内通入氩气,氩气流量450sccm,工作压强为1.7Pa,基底偏压-800V,对基底进行辉光清洗,清洗时间10min;辉光清洗结束后,开启离子源对样品进行离子轰击清洗,离子刻蚀清洗条件为:离子源电压为80V,氩气流量200sccm,氩气的工作气压为1.0Pa,基底偏压为-450V;清洗时间为20min;Put the above substrate in the multifunctional ion coating equipment (V-Tech MF610/610), under the condition that the background vacuum degree is 5.0×10 -3 Pa, open the main valve of the argon cylinder, the pressure reducing valve and the ion source valve , arc valve, target valve and mass flowmeter feed argon gas into the vacuum chamber to carry out glow cleaning to the substrate, wherein the conditions of glow cleaning are: feed argon gas into the vacuum chamber, the flow rate of argon gas is 450 sccm, and the working pressure is 1.7 Pa, substrate bias voltage -800V, glow cleaning the substrate, cleaning time 10min; The flow rate is 200sccm, the working pressure of argon is 1.0Pa, the substrate bias is -450V; the cleaning time is 20min;
(2)类金刚石层(DLC)沉积:在上述离子刻蚀清洗结束后,采用磁控溅射的方式在基体表面进行DLC的沉积,向真空室内通入氩气并开启碳靶(具体为石墨靶),调节氩气流量使真空室内的压强为0.8Pa,碳靶功率为1kW,基底负偏压为-100V,沉积时间为5小时;其中,DLC层的厚度为5μm;(2) Deposition of diamond-like carbon layer (DLC): After the above-mentioned ion etching cleaning is completed, DLC is deposited on the surface of the substrate by magnetron sputtering, argon gas is introduced into the vacuum chamber and the carbon target (specifically graphite target), adjust the flow of argon gas so that the pressure in the vacuum chamber is 0.8Pa, the power of the carbon target is 1kW, the negative bias voltage of the substrate is -100V, and the deposition time is 5 hours; wherein, the thickness of the DLC layer is 5 μm;
效果实施例Effect example
为验证本发明制得的材料具有抗菌性能,本发明还提供了效果实施例。将本发明实施例4、5制得的抗菌类金钢石阵列材料分别进行抗菌性能测试,并在钛合金TC4上沉积5μm厚的完整DLC层作为对比实施例1,其结果如图3 所示,将绿脓杆菌分别作用在对比实施例1(钛合金TC4+完整DLC层),以及实施例4和实施例5所得类金刚石纳米阵列上,(a)为表面形貌不同的基底附着的绿脓杆菌细菌总数;(b)为1h后死亡的绿脓杆菌所占的百分比。从图3中的(b)中可以看出完整的类金刚石涂层(对比例1)以及实施例4和5所得类金刚石纳米针列都具有一定的抗菌效果,但实施例4和5所得类金刚石纳米针列的杀菌效果明显比普通没有刻蚀的完整类金刚石涂层的杀菌效果好得多。而对比不同条件下刻蚀的纳米针列,可以看出实施例5所制得的类金刚石纳米针列(高度不一的纳米针)的杀菌效果更好一些。In order to verify that the material prepared by the present invention has antibacterial properties, the present invention also provides effect examples. The antibacterial diamond array materials prepared in Examples 4 and 5 of the present invention were tested for antibacterial performance respectively, and a complete DLC layer with a thickness of 5 μm was deposited on the titanium alloy TC4 as Comparative Example 1, and the results are shown in Figure 3 , Pseudomonas aeruginosa is respectively acted on comparative example 1 (titanium alloy TC4+ complete DLC layer), and on the diamond-like nanoarrays obtained in Example 4 and Example 5, (a) is the Pseudomonas aeruginosa attached to substrates with different surface morphology The total number of bacillus bacteria; (b) is the percentage of dead Pseudomonas aeruginosa after 1 hour. From (b) in Fig. 3, it can be seen that the complete diamond-like coating (comparative example 1) and the obtained diamond-like nanoneedles of Examples 4 and 5 have certain antibacterial effects, but the obtained diamond-like needles of Examples 4 and 5 have certain antibacterial effects. The bactericidal effect of the diamond nanoneedle array is obviously much better than that of the ordinary complete diamond-like coating without etching. Comparing the etched nanoneedle arrays under different conditions, it can be seen that the diamond-like nanoneedle array (nanoneedles with different heights) prepared in Example 5 has a better bactericidal effect.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104553124A (en) * | 2014-12-02 | 2015-04-29 | 中国科学院深圳先进技术研究院 | Diamond nano needle array composite material and preparation method and application thereof |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0681620B2 (en) * | 1989-06-23 | 1994-10-19 | 信越化学工業株式会社 | Dental micro cutter and method of manufacturing the same |
US8865288B2 (en) * | 2006-07-17 | 2014-10-21 | University Of Utah Research Foundation | Micro-needle arrays having non-planar tips and methods of manufacture thereof |
CN101787521B (en) * | 2010-03-24 | 2012-05-02 | 中国地质大学(北京) | A kind of preparation method of metal sulfide diamond-like composite film |
TWI449625B (en) * | 2011-08-24 | 2014-08-21 | Ritedia Corp | Structure having hydrophilicity and oleophobicity and method of fabricating the same |
TW201540428A (en) * | 2014-04-30 | 2015-11-01 | Morrison Opto Electronics Ltd | Polishing pad dresser of chemical mechanical polishing and manufacture method thereof |
CN104073762B (en) * | 2014-06-23 | 2016-09-14 | 中国科学院宁波材料技术与工程研究所 | A kind of method improving radiofrequency ablation therapy wire surface smoothness |
CN105420673A (en) * | 2015-12-09 | 2016-03-23 | 上海应用技术学院 | Diamond-like micro-nano coating for rubber mold and preparation method |
CN106048524B (en) * | 2016-07-11 | 2019-01-15 | 北京大学 | A kind of diamond-like nanostructure and preparation method thereof |
-
2016
- 2016-12-20 CN CN201611185457.XA patent/CN106835011B/en active Active
-
2017
- 2017-01-11 WO PCT/CN2017/070889 patent/WO2018113053A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104553124A (en) * | 2014-12-02 | 2015-04-29 | 中国科学院深圳先进技术研究院 | Diamond nano needle array composite material and preparation method and application thereof |
Non-Patent Citations (2)
Title |
---|
张钧等: "《多弧离子镀技术与应用》", 31 December 2007, 北京:冶金工业出版社 * |
李慧慧: "金刚石、类金刚石纳米线阵列的等离子体干法刻蚀制备与场发射性能的研究", 《中国优秀硕士学位论文全文数据库 基础科学辑》 * |
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