CN106833962A - Cleaning agent and its preparation and application for removing conductor etching cavity ceramic coating part pollutant - Google Patents
Cleaning agent and its preparation and application for removing conductor etching cavity ceramic coating part pollutant Download PDFInfo
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- CN106833962A CN106833962A CN201611215545.XA CN201611215545A CN106833962A CN 106833962 A CN106833962 A CN 106833962A CN 201611215545 A CN201611215545 A CN 201611215545A CN 106833962 A CN106833962 A CN 106833962A
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- cleaning agent
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- etching cavity
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 41
- 238000005524 ceramic coating Methods 0.000 title claims abstract description 28
- 239000003344 environmental pollutant Substances 0.000 title claims abstract description 24
- 231100000719 pollutant Toxicity 0.000 title claims abstract description 24
- 238000005530 etching Methods 0.000 title claims abstract description 18
- 239000004020 conductor Substances 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims description 5
- 239000003960 organic solvent Substances 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 3
- 150000001412 amines Chemical class 0.000 claims abstract description 3
- 239000007853 buffer solution Substances 0.000 claims abstract description 3
- 150000002576 ketones Chemical class 0.000 claims abstract description 3
- 238000003756 stirring Methods 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims abstract 4
- 238000004140 cleaning Methods 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical group CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical group NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- 229960004275 glycolic acid Drugs 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 claims 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 239000013618 particulate matter Substances 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/264—Aldehydes; Ketones; Acetals or ketals
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3263—Amides or imides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The present invention relates to a kind of cleaning agent for removing conductor etching cavity ceramic coating part pollutant, in parts by weight, including following component：5~10 parts of acid buffer agent；5~10 parts of fluoride；30~50 parts of amine organic solvent；10~20 parts of based organic solvent；20~30 parts of organic solvent of ketone；10~30 parts of pure water.It is prepared, including：By above-mentioned weight portion, each component is mixed, in stirring at normal temperature 30min, the cleaning agent of conductor etching cavity ceramic coating part pollutant is obtained.Cleaning agent of the invention can thoroughly remove pollutant, it is ensured that the kind equipment is cleaned up completely, and pollution etch chamber is brought into without particle, in turn ensure that basic material is without prejudice, so as to reduce the risk that ceramic coating comes off.
Description
Technical field
It is more particularly to a kind of for removing semiconductor erosion the invention belongs to semiconductor equipment Cleaning of Parts technical field
Carve cleaning agent of cavity ceramic coating part pollutant and its preparation method and application.
Background technology
Semiconductor integrated circuit manufacturing process technology sustained and rapid development, new technology continues to bring out drive chip integration
Rapid to improve, 28 nanometers have become main flow making technology, while new technology develops to the line width of 16 nanometers, 8 nanometers again.Wherein
Plasma etching and plasma cleaning have become one of flow of its manufacture of semiconductor technique most critical.
With process apparatus high are entered into, etch chamber plasma power is increasing, and plasma is to etching technics chamber
The particle pollution problem that the lesion ribbon of wall is come is also increasing, in order that the particle pollution introduced by plasma etch process is most
Smallization, has been developed for the cell materials of many anti-plasmas bombardment in the market, these plasma materials include by
The ceramic spraying layer of the compositions such as Al2O3, AlN, SiC, Y2O3, this kind of ceramic spraying part runs a period of time in etch chamber
Afterwards, the substantial amounts of CFization product of its adsorption, if do not cleaned to its regular dismounting, will produce a large amount of contaminated ions, influence
Product yield.
Particle pollution, component base (generally anode do not formed thoroughly and there is attachment product cleaning in traditional cleaning method
Aluminum oxide) corrode the problems such as causing ceramic spraying layer to come off.
Therefore, a kind of effective cleaning agent formula is researched and developed, pollutant can be thoroughly removed, but it is (generally positive to base material
Pole aluminum oxide) protect particularly important well.And up to the present, there is not yet the report of the pertinent literature on such cleaning agent.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided one kind is for removing conductor etching cavity ceramics
Cleaning agent of coating component pollutant and its preparation method and application.Cleaning agent of the invention can thoroughly remove pollutant,
Ensure that the kind equipment is cleaned up completely, pollution etch chamber is brought into without particle, in turn ensure that basic material is without prejudice, from
And reduce the risk that ceramic coating comes off.
The purpose of the present invention is achieved through the following technical solutions：
The first object of the present invention is to provide a kind of for removing conductor etching cavity ceramic coating part pollutant
Cleaning agent, in parts by weight, including following component：
Wherein, the pickling buffer solution is selected from one or more in hydroxyacetic acid, formic acid, acetic acid；The fluoride choosing
From ammonium fluoride, one or two mixing of fluoboric acid；The amine organic solvent is selected from monoethanolamine, triethanolamine, N, N-
One or more in dimethylformamide, triethylene tetramine；The based organic solvent is selected from ethyl acetate, butyl acetate
One or two mixing；The organic solvent of ketone be selected from cyclohexanone, 1-METHYLPYRROLIDONE in one or two
Mixing.
Further, the cleaning agent, in parts by weight, including following component：
Further, the cleaning agent, in parts by weight, including following component：
Further, the cleaning agent, in parts by weight, including following component：
The second object of the present invention is to provide a kind of for removing conductor etching cavity ceramic coating part pollutant
Cleaning agent preparation method, including：
By above-mentioned weight portion, each component is mixed, in stirring at normal temperature 30min, conductor etching cavity ceramic coating is obtained
The cleaning agent of part pollutant.
The third object of the present invention is to provide a kind of for removing conductor etching cavity ceramic coating part pollutant
Cleaning agent application, including：Etched parts containing ceramic coating are put into the cleaning agent, cleaning agent temperature is maintained at 30
~40 DEG C, while ultrasonic wave cleaning frequency is 25~48KHZ, 1~10W/inch2 of ultrasonic power density, carry out ultrasonic wave clear
30min is washed, then etched parts are taken out into 3~5min of pure water rinsing, the pollutant adhered on its ceramic coating is removed completely.
Further, the ultrasonic wave cleaning frequency is 45~48KHZ, 5~10W/inch2 of ultrasonic power density.
Compared with prior art, the positive effect of the present invention is as follows：
Cleaning agent of the invention can thoroughly remove pollutant, it is ensured that the kind equipment is cleaned up completely, without particle
Bring pollution etch chamber into, in turn ensure that basic material is without prejudice, so as to reduce the risk that ceramic coating comes off.
Specific embodiment
With reference to specific embodiment, the present invention is expanded on further.It should be understood that these embodiments are merely to illustrate the present invention
Rather than limitation the scope of the present invention.In addition, it is to be understood that after the content for having read instruction of the present invention, people in the art
Member can make various changes or modifications to the present invention, and these equivalent form of values equally fall within the application appended claims and limited
Scope.
The raw material that following examples are used is by commercially available acquisition.
Embodiment 1
By the raw material of following weight portion, cleaning agent is configured：
During above each component raw material sequentially added into flask, mechanical agitation 30min obtains sticky, not stratified transparent liquid
Body, as cleaning agent.
Etched parts containing ceramic coating are put into the cleaning agent of the mixing, and rinse bath TEMPERATURE PURGE liquid temperature degree is maintained at 40
DEG C, while imposing 48KHZ frequency ultrasonic waves in rinse bath, 5~10W/inch2 of ultrasonic power density enters in such circumstances
The ultrasonic wave cleaning of row 30min, then pure water rinsing 5min is drawn off, cleaning performance evaluation is shown in Table 1.
Embodiment 2
By the raw material of following weight portion, cleaning agent is configured：
During above each component raw material sequentially added into flask, mechanical agitation 30min obtains sticky, not stratified transparent liquid
Body, as cleaning agent.
Etched parts containing ceramic coating are put into the cleaning agent of the mixing, and rinse bath TEMPERATURE PURGE liquid temperature degree is maintained at 30
DEG C, while imposing 48KHZ frequency ultrasonic waves in rinse bath, 5~10W/inch2 of ultrasonic power density enters in such circumstances
The ultrasonic wave cleaning of row 30min, then pure water rinsing 5min is drawn off, cleaning performance evaluation is shown in Table 1.
Embodiment 3
By the raw material of following weight portion, cleaning agent is configured：
During above each component raw material sequentially added into flask, mechanical agitation 30min obtains sticky, not stratified transparent liquid
Body, as cleaning agent.
Etched parts containing ceramic coating are put into the cleaning agent of the mixing, and rinse bath TEMPERATURE PURGE liquid temperature degree is maintained at 30
DEG C, while imposing 48KHZ frequency ultrasonic waves in rinse bath, 5~10W/inch2 of ultrasonic power density enters in such circumstances
The ultrasonic wave cleaning of row 30min, then pure water rinsing 5min is drawn off, cleaning performance evaluation is shown in Table 1.
Comparative example 1
Using commercially available SKT-01 cleaning agents, hundred moral chemical companies provide, in 30 DEG C, ultrasonic power density 5W/inch2,
The ultrasonic wave cleaning of 30min is carried out in such circumstances, contrasts cleaning performance.
The cleaning agent cleaning performance evaluation table of table 1
| Evaluating | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 |
| Film clearance | 100% | 100% | 100% | 99% |
| Residual silkgum content | Without cull | Without cull | Without cull | A small amount of residual |
| Ceramic coating dropping situations | Nothing comes off | Nothing comes off | Nothing comes off | Have and come off on a small quantity |
| Substrate damage situation | Without damage | Without damage | Without damage | There is a small amount of corrosion |
General principle of the invention, principal character and advantages of the present invention has been shown and described above.The technology of the industry
Personnel it should be appreciated that the present invention is not limited to the above embodiments, simply explanation described in above-described embodiment and specification this
The principle of invention, various changes and modifications of the present invention are possible without departing from the spirit and scope of the present invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appending claims and its
Equivalent is defined.
Claims (7)
1. a kind of cleaning agent for removing conductor etching cavity ceramic coating part pollutant, it is characterised in that：With weight
Part meter, including following component：
Wherein, the pickling buffer solution is selected from one or more in hydroxyacetic acid, formic acid, acetic acid；The fluoride is selected from fluorine
Change ammonium, one or two mixing of fluoboric acid；The amine organic solvent is selected from monoethanolamine, triethanolamine, N, N- diformazans
One or more in base formamide, triethylene tetramine；The based organic solvent is selected from ethyl acetate, butyl acetate
Kind or two kinds of mixing；The organic solvent of ketone is selected from one or two the mixing in cyclohexanone, 1-METHYLPYRROLIDONE.
2. a kind of cleaning for removing conductor etching cavity ceramic coating part pollutant according to claim 1
Agent, it is characterised in that：The cleaning agent, in parts by weight, including following component：
3. a kind of cleaning for removing conductor etching cavity ceramic coating part pollutant according to claim 1
Agent, it is characterised in that：The cleaning agent, in parts by weight, including following component：
4. a kind of cleaning for removing conductor etching cavity ceramic coating part pollutant according to claim 1
Agent, it is characterised in that：The cleaning agent, in parts by weight, including following component：
5. the one kind according to claim any one of 1-4 is used to remove conductor etching cavity ceramic coating part pollutant
Cleaning agent preparation method, including：
By above-mentioned weight portion, each component is mixed, in stirring at normal temperature 30min, conductor etching cavity ceramic coating part is obtained
The cleaning agent of pollutant.
6. the one kind according to claim any one of 1-4 is used to remove conductor etching cavity ceramic coating part pollutant
Cleaning agent application, including：Etched parts containing ceramic coating are put into the cleaning agent, cleaning agent temperature is maintained at 30
~40 DEG C, while ultrasonic wave cleaning frequency is 25~48KHZ, 1~10W/inch2 of ultrasonic power density, carry out ultrasonic wave clear
30min is washed, then etched parts are taken out into 3~5min of pure water rinsing, the pollutant adhered on its ceramic coating is removed completely.
7. a kind of cleaning agent for removing conductor etching cavity ceramic coating part pollutant according to claim 6
Application, it is characterised in that：The ultrasonic wave cleaning frequency is 45~48KHZ, 5~10W/inch2 of ultrasonic power density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611215545.XA CN106833962A (en) | 2016-12-26 | 2016-12-26 | Cleaning agent and its preparation and application for removing conductor etching cavity ceramic coating part pollutant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611215545.XA CN106833962A (en) | 2016-12-26 | 2016-12-26 | Cleaning agent and its preparation and application for removing conductor etching cavity ceramic coating part pollutant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106833962A true CN106833962A (en) | 2017-06-13 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611215545.XA Pending CN106833962A (en) | 2016-12-26 | 2016-12-26 | Cleaning agent and its preparation and application for removing conductor etching cavity ceramic coating part pollutant |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111112212A (en) * | 2019-11-29 | 2020-05-08 | 上海富乐德智能科技发展有限公司 | Quartz thermal screen plate regeneration method for integrated circuit manufacturing |
| CN113000475A (en) * | 2019-12-20 | 2021-06-22 | 中微半导体设备(上海)股份有限公司 | Cleaning method for plasma processing equipment component |
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| US20060237392A1 (en) * | 2005-03-11 | 2006-10-26 | Rohm And Haas Electronic Materials Llc | Polymer remover |
| WO2007120259A2 (en) * | 2005-11-08 | 2007-10-25 | Advanced Technology Materials, Inc. | Formulations for removing copper-containing post-etch residue from microelectronic devices |
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