CN106825825B - A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device - Google Patents
A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device Download PDFInfo
- Publication number
- CN106825825B CN106825825B CN201710185698.2A CN201710185698A CN106825825B CN 106825825 B CN106825825 B CN 106825825B CN 201710185698 A CN201710185698 A CN 201710185698A CN 106825825 B CN106825825 B CN 106825825B
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- Prior art keywords
- vacuum welding
- vacuum
- welding equipment
- weldment
- solder
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- 238000003466 welding Methods 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000035515 penetration Effects 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 230000001681 protective effect Effects 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000000843 powder Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Abstract
The present invention relates to a kind of high penetration rate welding methods for the assembling of microwave and millimeter wave device, and this approach includes the following steps：Vacuum welding equipment is vacuumized, protective gas is filled with into equipment；Heat weldment and solder.After to-be-welded pieces temperature is increased in certain temperature range, stops heating, vacuum welding equipment is vacuumized, maintains vacuum state T1 seconds；It is filled with protective gas into vacuum welding equipment；To in vacuum welding equipment weldment and solder heat.When to-be-welded pieces temperature is risen on solder melt point, stop heating, vacuum welding equipment is vacuumized, maintains vacuum state T2 seconds；It is filled with protective gas into vacuum welding equipment；When weldment temperature is down to solder melt point or less, stop being filled with gas to vacuum welding equipment, allows weldment natural cooling.The present invention can solve the problems, such as to heat up in the prior art slow with rate of temperature fall, and weldment can be welded together by solder with higher penetration rate.
Description
Technical field
The present invention relates to welding technology fields, and in particular to a kind of high penetration rate weldering for the assembling of microwave and millimeter wave device
Connect method.
Background technology
In microwave and millimeter wave device packaging technology, the welding of the ground connection of printed board and chip is generally required to have relatively high
Penetration rate, to realize preferable device performance, such as lower device noise temperature, no self-excitation phenomena etc..In order to realize printed board
There is relatively high penetration rate, general use to be welded under vacuum conditions for ground connection welding with chip（Call vacuum welding in the following text
It connects）.When using vacuum welding, since the carrier of oxygen that can be reacted with solder and weldment is few, weldment surface wettability is good, and
And the gas in welding region can be discharged in time so that bubble is less, and higher penetration rate can be achieved in this way.
But it needs to carry out under the hot environment higher than solder melt point when vacuum welding, thus need to solder and welding
Part heats so that temperature is higher than solder melt point.Vacuum welding carries out generally in vacuum drying oven, and heating means are generally by fluorescent tube
To graphite heat conduction plate, the weldment being placed on thereon is then transferred heat to using graphite heat conduction plate.Due under vacuum conditions
Air pressure is very low, and gas density is smaller, and is not under normal circumstances that perfect face contacts between weldment and heat-conducting plate, causes to conduct heat
It is relatively slow, it is slower so as to cause the heating and rate of temperature fall of weldment.When heating and rate of temperature fall are slower, it will cause to heat up and cool down
Overlong time, causes that scaling powder volatilization is excessive, intermetallic compound grain is coarse at weld interface, weldment coating excessive dissolution
Phenomena such as, influence welding quality.It is welded according to controlled atmosphere, i.e., enters nitrogen or other protectiveness in vacuum stove evacuation backlash
Gas, reducibility gas, although heating when welding process can be improved and rate of temperature fall；But do not weld under vacuum conditions,
Gas in welding region is not easy to be discharged, and is easy to form cavity, causes in welding region that there are certain cavities.
Invention content
The purpose of the present invention is to provide a kind of high penetration rate welding method for the assembling of microwave and millimeter wave device, the party
Method is applied in microwave and millimeter wave device packaging technology, for printing plate earthing welding and chip welding, can be led to weldment
Solder is crossed to be welded together with higher penetration rate.
To achieve the above object, present invention employs following technical schemes：
A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device, this approach includes the following steps：
（1）One, which takes out one, fills：After weldment and solder are put into vacuum welding equipment and carry out technological preparation, by vacuum welding
Equipment vacuumizes, and vacuum welding is made to set internal air discharge；Then to protective gas is filled in vacuum welding equipment, make vacuum
Air pressure reaches 50000Pa or more in welding equipment；Then again in vacuum welding equipment weldment and solder heat；
（2）Two, which take out two, fills：After to-be-welded pieces temperature is increased in certain temperature range, stops heating, vacuum welding is set
It is standby to be vacuumized for the second time, so that the gas inside vacuum welding equipment is discharged, and maintain vacuum state T1 seconds；Then to vacuum
Protective gas is filled in welding equipment again, air pressure in vacuum welding equipment is made to reach 50000Pa or more；Then again to vacuum welding
The weldment and solder connect in equipment is heated；
（3）Three, which take out three, fills：When to-be-welded pieces temperature is risen on solder melt point, stop heating, to vacuum welding equipment into
Row third time vacuumize process, and maintain vacuum state T2 seconds；Then it is filled with protective gas for the third time into vacuum welding equipment；
When weldment temperature is down to solder melt point or less, stop being filled with gas to vacuum welding equipment, allows weldment natural cooling, it is complete
At welding process.
Further, step（2）The value range of middle T1 is 20 ~ 60.
Further, step（3）The value range of middle T2 is 3 ~ 180.Pass through the time T1 and T2 to maintaining vacuum state
Value range be configured, be in order to which the gas in vacuum chamber or in solder is preferably discharged because only air pressure reduce
First half term shorter time in, the gas in vacuum chamber or in solder cannot be discharged well, have more residual gas
Body.
By above technical scheme it is found that the present invention can not only solve heating and rate of temperature fall in existing vacuum welding technology
Slow problem, effectively shortens weld interval, realizes the welding quality higher than vacuum welding, additionally it is possible to by weldment by solder with
Higher penetration rate is welded together, and high penetration rate is welded in realization than controlled atmosphere.
Description of the drawings
Fig. 1 is the process flow chart of welding method of the present invention.
Specific implementation mode
The present invention will be further described below in conjunction with the accompanying drawings：
A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device as shown in Figure 1, this method include with
Lower step：
（1）One, which takes out one, fills：After weldment and solder are put into vacuum welding equipment and carry out technological preparation, by vacuum welding
Equipment vacuumizes（Vacuum of the present invention refers to that air pressure is less than 1000Pa）, vacuum welding is set into inner air discharge；With
It is filled with nitrogen or other protective gas, reducibility gas in backward vacuum welding equipment, air pressure in vacuum welding equipment is made to reach
To 50000Pa or more, then begin to heat.Oxygen in vacuum welding equipment can be discharged for the step, the nitrogen being filled with or other
Protective gas, reducibility gas can provide anti-oxidation effect or reduction solder surface oxide layer, enhancing profit in the welding process
Wet ability.In addition, relative vacuum welding procedure, into vacuum welding equipment it is filled with protective gas and can be improved in welding process and heat up
And rate of temperature fall, in step（2）And step（3）In to be filled with protective gas be also similarly to act on.
（2）Two, which take out two, fills：After to-be-welded pieces temperature rises in certain temperature range（It is typically maintained in scaling powder or soldering paste
Within the scope of preheating temperature.Different scaling powders or soldering paste preheating temperature are different, need corresponding according to scaling powder used or soldering paste selection
Temperature range）；Then vacuum welding equipment is vacuumized, the gas inside vacuum welding equipment is discharged, and maintain vacuum
State 20~60 seconds.Backward vacuum welding equipment in be filled with nitrogen or other protective gas, reducibility gas, make vacuum welding
It connects air pressure in equipment and reaches 50000Pa or more.Two purposes taken out are the gas for volatilizing scaling powder or soldering paste in warm
Welding equipment is discharged in state substance；Two purposes filled are filled identical with one.During two take out two and fill, continuous heating makes to-be-welded pieces
Temperature maintains within the scope of the preheating temperature of used scaling powder or soldering paste or more.Two, which take out two, fills after the completion of process, continues to heat
So that temperature continues to increase.
（3）Three, which take out three, fills：It is generally 20 DEG C~60 DEG C higher than solder melt point when to-be-welded pieces temperature is risen on solder melt point
（It is 20 DEG C~60 DEG C higher than solder melt point, it is in order to which there are temperature margins）, start to carry out third time pumping very to vacuum welding equipment
Vacancy is managed, and maintains vacuum state 3 seconds~180 seconds.This is vacuumized, and the gas in fusion welding can be discharged, and improve through welding
Rate.Then nitrogen or other protective gas are filled with into vacuum welding equipment, to realize to weldment fast cooling.When temperature drops
It when below to solder melt point, can stop being filled with gas, allow weldment natural cooling, complete welding process.After solder dissolves,
Weldment is by solder connection, and until solder solidification, entire welding process is completed.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
It encloses and is defined, under the premise of not departing from design spirit of the present invention, technical side of the those of ordinary skill in the art to the present invention
The various modifications and improvement that case is made should all be fallen into the protection domain of claims of the present invention determination.
Claims (3)
1. a kind of high penetration rate welding method for the assembling of microwave and millimeter wave device, it is characterised in that：This method includes following
Step：
（1）One, which takes out one, fills：After weldment and solder are put into vacuum welding equipment and carry out technological preparation, by vacuum welding equipment
It vacuumizes, vacuum welding is made to set internal air discharge；Then to protective gas is filled in vacuum welding equipment, make vacuum welding
Air pressure reaches 50000Pa or more in equipment；Then again in vacuum welding equipment weldment and solder heat；
（2）Two, which take out two, fills：After to-be-welded pieces temperature is increased in certain temperature range, stop heating, to vacuum welding equipment into
Row vacuumizes for the second time, so that the gas inside vacuum welding equipment is discharged, and maintain vacuum state T1 seconds；Then to vacuum welding
Protective gas is filled in equipment again, air pressure in vacuum welding equipment is made to reach 50000Pa or more；Then vacuum welding is set again
Weldment and solder in standby are heated；
（3）Three, which take out three, fills：When to-be-welded pieces temperature is risen on solder melt point, stop heating, the is carried out to vacuum welding equipment
Vacuumize process three times, and maintain vacuum state T2 seconds；Then it is filled with protective gas for the third time into vacuum welding equipment；Work as weldering
When fitting temperature is down to solder melt point or less, stop being filled with gas to vacuum welding equipment, weldment natural cooling, completion is allowed to weld
Termination process.
2. a kind of high penetration rate welding method for the assembling of microwave and millimeter wave device according to claim 1, feature
It is：Step（2）The value range of middle T1 is 20 ~ 60.
3. a kind of high penetration rate welding method for the assembling of microwave and millimeter wave device according to claim 1, feature
It is：Step（3）The value range of middle T2 is 3 ~ 180.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710185698.2A CN106825825B (en) | 2017-03-26 | 2017-03-26 | A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710185698.2A CN106825825B (en) | 2017-03-26 | 2017-03-26 | A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106825825A CN106825825A (en) | 2017-06-13 |
| CN106825825B true CN106825825B (en) | 2018-11-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710185698.2A Active CN106825825B (en) | 2017-03-26 | 2017-03-26 | A kind of high penetration rate welding method for the assembling of microwave and millimeter wave device |
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| Country | Link |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107378166B (en) * | 2017-07-28 | 2019-12-10 | 中国振华集团永光电子有限公司（国营第八七三厂） | Fusion sealing process for reducing fusion sealing holes of electronic element cover plate |
| CN113385763B (en) * | 2021-07-14 | 2022-08-26 | 成都共益缘真空设备有限公司 | Vacuum reflow soldering positive and negative pressure combined soldering process |
| CN113600953B (en) * | 2021-08-27 | 2022-08-02 | 上海航天电子通讯设备研究所 | Vacuum vapor phase welding method |
| CN114309854A (en) * | 2021-12-28 | 2022-04-12 | 中国科学院空天信息创新研究院 | Method and tool suitable for integrated brazing of multiple substrates of box body with two-sided open cavity |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321409A (en) * | 1998-10-02 | 2001-11-07 | 艾利森电话股份有限公司 | Soldering of semiconductor chip to substrate |
| CN102371410A (en) * | 2011-09-07 | 2012-03-14 | 中国航天科技集团公司第九研究院第七七一研究所 | Process for making non-void high-reliability convex points in wafer by vacuum brazing |
| CN102497730A (en) * | 2011-12-08 | 2012-06-13 | 无锡华测电子系统有限公司 | Ceramic substrate assembly and grounding welding method thereof |
| JP2016203228A (en) * | 2015-04-27 | 2016-12-08 | 株式会社ケーヒン | Method for manufacturing power conversion device |
-
2017
- 2017-03-26 CN CN201710185698.2A patent/CN106825825B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321409A (en) * | 1998-10-02 | 2001-11-07 | 艾利森电话股份有限公司 | Soldering of semiconductor chip to substrate |
| CN102371410A (en) * | 2011-09-07 | 2012-03-14 | 中国航天科技集团公司第九研究院第七七一研究所 | Process for making non-void high-reliability convex points in wafer by vacuum brazing |
| CN102497730A (en) * | 2011-12-08 | 2012-06-13 | 无锡华测电子系统有限公司 | Ceramic substrate assembly and grounding welding method thereof |
| JP2016203228A (en) * | 2015-04-27 | 2016-12-08 | 株式会社ケーヒン | Method for manufacturing power conversion device |
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| Publication number | Publication date |
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| CN106825825A (en) | 2017-06-13 |
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Address after: 230088 658 Wangjiang West Road, Hefei high tech Zone, Anhui Patentee after: CHINA ELECTRONICS TECHNOLOGY Group CORPORATION NO 16 INSTITUTE Address before: No. 439, Suixi Road, Luyang District, Hefei City, Anhui Province, 230043 Patentee before: CHINA ELECTRONICS TECHNOLOGY Group CORPORATION NO 16 INSTITUTE |