CN111745253B - Soldering device and method with low bubble generation rate for semiconductor packaging - Google Patents
Soldering device and method with low bubble generation rate for semiconductor packaging Download PDFInfo
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- CN111745253B CN111745253B CN202010735952.3A CN202010735952A CN111745253B CN 111745253 B CN111745253 B CN 111745253B CN 202010735952 A CN202010735952 A CN 202010735952A CN 111745253 B CN111745253 B CN 111745253B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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Abstract
本发明公开了一种用于半导体封装的低气泡产生率的焊锡装置及方法，本发明的焊锡装置包括分别位于基板两侧的第一加热部和第二加热部，其在进行锡膏融化时能实现分阶段加热，在第一加热阶段，第二加热部的加热温度小于锡膏的融化温度，第一加热部的加热温度不小于锡膏的融化温度，在第二加热阶段，第一加热部和第二加热部的加热温度均超过锡膏的融化温度。第一加热部为加热板，第二加热部为热风加热部，第二加热部位于基板的设置有待融化的锡膏的一侧。本发明的焊锡装置还包括能对热风加热部的热风进行降温的冷却部。利用本发明的焊锡装置，能使锡膏从底部向外逐步融化，从而将气泡排出焊点外，因而，有效减少了锡膏中的气泡并能形成良好的焊点。
The present invention discloses a soldering device and method with low bubble generation rate for semiconductor packaging. The soldering device of the present invention comprises a first heating part and a second heating part respectively located on both sides of a substrate, which can realize staged heating when melting solder paste. In the first heating stage, the heating temperature of the second heating part is lower than the melting temperature of the solder paste, and the heating temperature of the first heating part is not lower than the melting temperature of the solder paste. In the second heating stage, the heating temperatures of the first heating part and the second heating part both exceed the melting temperature of the solder paste. The first heating part is a heating plate, and the second heating part is a hot air heating part. The second heating part is located on one side of the substrate where the solder paste to be melted is arranged. The soldering device of the present invention also comprises a cooling part capable of cooling the hot air of the hot air heating part. By using the soldering device of the present invention, the solder paste can be gradually melted from the bottom to the outside, so that the bubbles are discharged from the solder joint, thereby effectively reducing the bubbles in the solder paste and forming a good solder joint.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a soldering device and a soldering method with low bubble generation rate for semiconductor packaging.
Background
In packaging a semiconductor device, solder joints are formed by heating solder paste to melt, connecting a solder element to a substrate, and cooling. Then, in the semiconductor packaging process of SMT surface mounting or solder paste technology, more cavities are formed in the welding spots, and the performance of the welding spots is greatly affected.
The bubble is generated because the solder paste is a paste formed by stirring the soldering flux and the solder alloy powder, the soldering flux is prepared by blending an active agent, a solvent, rosin and the like, vaporization temperature points of various components of the soldering flux are different, the soldering flux is vaporized in the heating process, part of the soldering flux overflows from gaps of alloy particles after being gasified before the solder paste is liquefied, when the solder paste is heated to a melting point temperature, surface tension is generated after the surface of the solder paste is liquefied, and part of small bubbles cannot destroy the surface tension due to insufficient pressure, so that the small bubbles are sealed inside a welding spot, and a cavity is formed.
At present, a ① vacuum bubble removal method is generally adopted for reducing bubbles generated in the melting process of the solder paste, wherein the pressure difference between the internal bubbles and the outside is enlarged in a vacuumizing mode in the melting process of the solder paste, so that the bubbles break the surface tension and overflow welding spots to reduce the cavity rate, ② gas phase reflow soldering is carried out, namely a vapor reflow (soldering) area with good heat transfer performance and no oxygen is formed by heating gas phase liquid, so that the gas in the welding spots is fully volatilized in the reflow process, and ③ no soldering flux is added. The vacuum bubble removal method can lengthen the production takt by about 3 times, and the bonding pad with the pin smaller than 0.4p ith is easy to be connected with tin for short circuit, and other two modes have the defects of low production efficiency and high production cost.
Disclosure of Invention
In order to solve the technical problems, the invention provides a soldering device and a soldering method with low bubble generation rate for semiconductor packaging.
The invention relates to a soldering device with low bubble generation rate for semiconductor packaging, which is used for soldering and connecting a welding element and a substrate, and comprises a first heating part and a second heating part which are respectively positioned at two sides of the substrate, wherein the device can realize staged heating when solder paste is melted, the heating temperature of the second heating part is smaller than the melting temperature of the solder paste in the first heating stage, the heating temperature of the first heating part is not smaller than the melting temperature of the solder paste, and the heating temperatures of the first heating part and the second heating part are both higher than the melting temperature of the solder paste in the second heating stage. By using the soldering device, the solder paste is melted by two-stage heating, in the first heating stage, the part of the solder paste, which is close to the first heating part, starts to melt, and the part of the solder paste, which is close to the second heating part, does not melt, and in the second heating stage, the temperature of the second heating part is raised to be higher than the melting point of the solder paste, so that the solder paste is gradually melted from the bottom to the outside, and bubbles are gradually discharged out of a welding spot, thereby effectively reducing the bubbles in the solder paste and forming good welding spots.
Further, at least one of the first heating portion and the second heating portion is heated by hot air, and the hot air can be blown out toward solder paste on the substrate.
Further, the first heating part is a heating plate, the second heating part is a hot air heating part, and the second heating part is positioned at one side of the substrate where the solder paste to be melted is arranged. Therefore, the solder paste can be gradually melted in the direction approaching the second heating portion on the side approaching the first heating portion.
Further, the hot air heating part comprises a plurality of hot air nozzles arranged towards the solder paste, an air chamber connected with the hot air nozzles, and a high-temperature fan connected with the air chamber, wherein at least one heater is arranged in the air chamber.
Further, the hot air cooling device further comprises a cooling part capable of cooling the hot air of the hot air heating part. Therefore, the temperature of the hot air can be quickly adjusted through the cooling part, so that the air temperature can be quickly adjusted to ensure that the surface of the solder paste is finally melted.
Still further, the cooling portion include with the cold wind passageway of plenum intercommunication and with the cooling fan that cold wind passageway is connected be provided with the heat exchanger that is used for the cooling in the cold wind passageway.
Further, at least one return air hole is further formed around each hot air nozzle, and the hot air nozzle further comprises a negative pressure pipeline communicated with the return air holes. Therefore, after the air is blown out from the hot air nozzle to a certain distance, the air can flow back through the return air holes to form small loops, and no transverse air flow is generated, so that better welding spots can be obtained.
The invention also provides a method for reducing solder bubbles in the semiconductor packaging process, which is characterized in that a first heating part and a second heating part are respectively arranged at two sides of a substrate, the heating and melting process of solder paste at least comprises a first heating stage and a second heating stage, the heating temperature of the first heating part in the first heating stage is not less than the melting temperature of the solder paste, the heating temperature of the second heating part in the first heating stage is not more than the melting temperature of the solder paste, and the heating temperatures of the first heating part and the second heating part in the second heating stage are both more than the melting temperature of the solder paste. By using the method provided by the invention, the solder paste can be gradually melted from the bottom to the upper part, so that bubbles are slowly gathered upwards, and the bubbles are rapidly discharged in the second heating stage, so that a good welding spot is formed, and the generation rate of the bubbles in the welding spot is effectively reduced.
Further, the first heating part is a heating plate, and the second heating part heats the solder paste through hot air.
Further, the heating temperature of the second heating portion does not exceed the heating temperature of the first heating portion.
Drawings
FIG. 1 is a schematic diagram of a first embodiment of the present invention;
FIG. 2 is an enlarged schematic view of a portion of FIG. 1 at A;
FIG. 3 is a schematic diagram illustrating a heating principle according to a first embodiment of the present invention;
fig. 4 is a temperature curve of the first heating portion and the second heating portion in the first heating stage and the second heating stage according to the first embodiment of the present invention, T1 is the air temperature of the second heating portion, and T3 is the heating temperature of the first heating portion;
FIG. 5a is a schematic diagram showing bubble distribution in a soldered joint of the prior art;
FIG. 5b is a schematic diagram showing bubble distribution in a soldered joint of the prior art;
FIG. 6a is a schematic diagram of bubble distribution in a solder joint soldered using the apparatus of the present invention;
fig. 6b is a schematic diagram showing the bubble distribution in a solder joint soldered using the apparatus of the present invention.
In the figure:
1-welding element, 2-base plate, 3-solder paste, 4-first heating part, 5-second heating part, 51-hot air nozzle, 52-plenum, 53-high temperature fan, 54-heater, 61-cold air channel, 62-cooling fan, 63-heat exchanger, 64-return air hole, 65-negative pressure pipeline.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Embodiment one:
Referring to fig. 1 and 2, as a preferred embodiment of the low bubble generation solder device for semiconductor package of the present embodiment, it is used for soldering the solder element 1 and the substrate 2, when in use, the solder paste 3 is disposed on the substrate 2, after the solder paste 3 is melted by the device of the present invention, the pins of the solder element 1 are inserted into the melted solder paste 3, and then the solder paste 3 is cooled to complete the soldering process.
The device of the invention comprises a first heating part 4 and a second heating part 5 which are respectively positioned at two sides of a substrate 2, the device of the invention can realize staged heating when the solder paste 3 is melted, the heating temperature of the second heating part 5 is smaller than the melting temperature of the solder paste 3 in a first heating stage S1, the heating temperature of the first heating part 4 is not smaller than the melting temperature of the solder paste 3, and the heating temperatures of the first heating part 4 and the second heating part 5 exceed the melting temperature of the solder paste 3 in a second heating stage S2.
The first heating portion 4 of the present embodiment is a heating plate, the second heating portion 5 is a hot air heating portion, and the second heating portion 5 is located at one side of the substrate 2 where the solder paste 3 to be melted is disposed. Referring to fig. 3, the first heating portion 4 of the present embodiment is located at the lower side of the substrate 2, the solder paste 3 is disposed at the upper side of the substrate 2, and the second heating portion 5 is located above the solder paste 3.
The temperature curves of the first heating portion 4 and the second heating portion 5 in the first heating stage S1 and the second heating stage S2 of the present embodiment are shown with reference to fig. 4. In the first heating stage S1, the heating temperature of the first heating portion 4 is greater than the melting temperature of the solder paste 3, the side, close to the first heating portion 4, of the solder paste 3 begins to melt, but the side, close to the second heating portion 5, of the solder paste 3 is not melted under the action of hot air with a temperature lower than the melting point of the solder paste, preferably, the temperature of the hot air is close to but slightly lower than the melting point of the solder paste, so that bubbles generated in melting of the solder paste 3 can be gradually gathered upwards from the bottom, in the second heating stage S2, the heating temperatures of the first heating portion 4 and the second heating portion 5 are both higher than the melting point of the solder paste 3, and bubbles generated in the solder paste 3 can be discharged from the surface of the melted solder paste 3, and then the temperatures of the first heating portion 4 and the second heating portion 5 are both lowered, so that bubbles in a solder joint formed after cooling can be effectively reduced.
The hot air heating unit (second heating unit 5) of the present embodiment includes a plurality of hot air nozzles 51 provided toward the solder paste 3, an air chamber 52 connected to the hot air nozzles 51, and a high temperature fan 53 connected to the air chamber 52, and at least one heater 54 is provided in the air chamber 52. The hot air cooling device also comprises a cooling part which can cool the hot air of the hot air heating part. The cooling portion includes a cool air passage 61 communicating with the air chamber 52 and a cooling fan 62 connected to the cool air passage 61, and a heat exchanger 63 for cooling is provided in the cool air passage 61. The distance of hot air blowing can be controlled by setting the air quantity of the hot air heating part, so that the aim of layered heating is fulfilled by not interfering the temperature of hot air with the temperature of the bottom plate. The cooling part can quickly adjust the temperature of the hot air at the upper part, thereby realizing the quick adjustment of the air temperature to ensure the final melting of the surface of the solder paste 3.
As a preferred embodiment of the present embodiment, at least one return air hole 64 is further provided around each hot air nozzle 51, the return air hole 64 communicates with the negative pressure pipe 65, and the negative pressure pipe 65 can be maintained in a negative pressure state by being connected to an air suction pump or a vacuum pump, etc., and thus, the air blown out through the hot air nozzle 51 is drawn out from the return air hole 64 to form a small cycle without generating a side-by-side air flow, and thus, a better welding point can be obtained. The substrate 2 of the present embodiment is preferably made of a material having good heat conductivity, such as a copper substrate 2, an aluminum substrate 2, or a ceramic substrate 2.
Referring to fig. 5 and 6, the soldering device of the present invention is used to compare the bubble condition in the soldering spot after soldering with the conventional method. Therefore, the soldering device can effectively reduce the bubble generation in the melting process of the solder paste, and the bubble rate can be reduced from 25% to 10% by using the soldering device.
Embodiment two:
The embodiment is a method for reducing solder bubbles in a semiconductor packaging process, wherein a first heating part and a second heating part are respectively arranged on the upper side and the lower side of a substrate to be soldered, the first heating part is a heating plate, the second heating part is a hot air heating part, and the melting of solder paste is realized by blowing hot air to the solder paste. Preferably, the heating plate is bonded to the lower surface of the substrate.
The method in this embodiment at least includes a first heating stage S1 and a second heating stage S2 in the heating and melting process of the solder paste, where the heating temperature of the first heating portion in the first heating stage S1 is not less than the melting temperature of the solder paste, the heating temperature of the second heating portion in the first heating stage S1 does not exceed the melting temperature of the solder paste but is close to the melting temperature of the solder paste, and the heating temperatures of the first heating portion and the second heating portion in the second heating stage S2 both exceed the melting temperature of the solder paste. The heating temperature of the second heating portion does not exceed the heating temperature of the first heating portion. The curves of the air temperature (T1) of the second heating portion and the heating temperature (T3) of the second heating portion of the present embodiment are shown with reference to fig. 4. Preferably, the heating temperature T3 of the first heating portion is the sum of the melting point (T2) of the solder paste and Tx, which can be set according to the furnace passing temperature curve requirement of the actual product.
By adopting the method of the embodiment, through bottom contact heat transfer, the solder paste is gradually melted from the bottom to the upper part in a hot air heating mode at the upper part, so that bubbles are slowly gathered upwards, and the bubbles are rapidly discharged in a second heating stage S2, so that a good welding spot is formed, and the generation rate of the bubbles in the welding spot is effectively reduced.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and to implement the same, but are not intended to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. A soldering device with low bubble generation rate for soldering a soldering element and a substrate is characterized by comprising a first heating part and a second heating part, wherein the first heating part and the second heating part are respectively positioned at the lower side and the upper side of the substrate, the device can realize staged heating when solder paste is melted, the heating temperature of the second heating part is smaller than the melting temperature of the solder paste in a first heating stage, the heating temperature of the first heating part is not smaller than the melting temperature of the solder paste, the heating temperatures of the first heating part and the second heating part are both higher than the melting temperature of the solder paste in a second heating stage,
The second heating part is a hot air heating part, the hot air heating part comprises a plurality of hot air nozzles arranged towards solder paste, at least one return air hole is arranged around each hot air nozzle, a negative pressure pipeline communicated with the return air holes is also arranged around each hot air nozzle,
The cooling part can cool the hot air of the hot air heating part.
2. The low bubble generation solder device for semiconductor package according to claim 1, wherein at least one of the first heating portion and the second heating portion is heated by hot air, and the hot air can be blown toward solder paste on a substrate.
3. The low bubble generation solder device for semiconductor package according to claim 2, wherein the first heating portion is a heating plate, and the second heating portion is located on a side of the substrate where solder paste to be melted is disposed.
4. The low bubble generating solder device for semiconductor package according to claim 3, wherein the hot air heating part further comprises a plenum connected to the hot air nozzle, and a high temperature fan connected to the plenum, wherein at least one heater is provided in the plenum.
5. The low bubble generation solder device for semiconductor package according to claim 4, wherein the cooling portion comprises a cool air passage communicating with the air chamber and a cooling fan connected to the cool air passage, and a heat exchanger for cooling is provided in the cool air passage.
6. The method is characterized in that a first heating part is arranged at the lower side of a substrate, a second heating part is arranged at the upper side of the substrate, the solder paste is heated and melted, the method at least comprises a first heating stage and a second heating stage, the heating temperature of the first heating part in the first heating stage is not less than the melting temperature of the solder paste, the heating temperature of the second heating part in the first heating stage is less than the melting temperature of the solder paste, the heating temperatures of the first heating part and the second heating part in the second heating stage exceed the melting temperature of the solder paste, the second heating part is a hot air heating part, the hot air heating part comprises a plurality of hot air nozzles arranged towards the solder paste, at least one return air hole is formed around each hot air nozzle, a negative pressure pipeline communicated with the return air holes is further arranged, and the method further comprises a cooling part capable of cooling hot air of the hot air heating part.
7. The method of claim 6, wherein the first heating portion is a heating plate, and the second heating portion heats the solder paste with hot air.
8. The method of claim 7, wherein the second heating portion has a heating temperature not exceeding the heating temperature of the first heating portion.
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| CN202010735952.3A CN111745253B (en) | 2020-07-28 | 2020-07-28 | Soldering device and method with low bubble generation rate for semiconductor packaging |
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| CN202010735952.3A CN111745253B (en) | 2020-07-28 | 2020-07-28 | Soldering device and method with low bubble generation rate for semiconductor packaging |
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| CN111745253B true CN111745253B (en) | 2025-03-28 |
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| CN114289816B (en) * | 2021-12-10 | 2023-06-20 | 重庆宇隆光电科技股份有限公司 | Assembly system for welding patch element |
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| CN212599534U (en) * | 2020-07-28 | 2021-02-26 | 康耐威(苏州)半导体科技有限公司 | Soldering device with low bubble generation rate for semiconductor package |
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| JP2004141907A (en) * | 2002-10-23 | 2004-05-20 | Toyota Motor Corp | Jig for removing molten oxide from molten solder surface, electronic device manufacturing apparatus, and electronic device manufacturing method |
| CN1899740A (en) * | 2005-07-20 | 2007-01-24 | 华硕电脑股份有限公司 | Soldering apparatus and method |
| CN104400167B (en) * | 2014-10-29 | 2016-06-01 | 张楠 | A kind of respond to reflow soldering apparatus and use the circuit board element welding process of this device |
| CN210548715U (en) * | 2019-08-14 | 2020-05-19 | 东莞顺达诚自动化科技有限公司 | Selective wave crest soldering machine nitrogen heating unit |
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| CN212599534U (en) * | 2020-07-28 | 2021-02-26 | 康耐威(苏州)半导体科技有限公司 | Soldering device with low bubble generation rate for semiconductor package |
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