CN106735873B - A kind of transparent plastic engraving device - Google Patents
A kind of transparent plastic engraving device Download PDFInfo
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- CN106735873B CN106735873B CN201710015106.2A CN201710015106A CN106735873B CN 106735873 B CN106735873 B CN 106735873B CN 201710015106 A CN201710015106 A CN 201710015106A CN 106735873 B CN106735873 B CN 106735873B
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- 229920003023 plastic Polymers 0.000 title claims abstract description 87
- 239000004033 plastic Substances 0.000 claims abstract description 47
- 230000003287 optical effect Effects 0.000 claims abstract description 38
- 238000013519 translation Methods 0.000 claims abstract description 7
- 241000931526 Acer campestre Species 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 6
- 238000002310 reflectometry Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 13
- 239000011521 glass Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000012780 transparent material Substances 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 229910052775 Thulium Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000010257 thawing Methods 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to mechanical part fields, disclose a kind of transparent plastic engraving device, including the translation stage for carrying transparent organic plastic sample, computer control system and the laser for being controlled by computer control system, focusing system and optical beam scanning system, it is characterized in that, the wavelength that the laser generates laser is 1.9 microns~2.1 microns, along laser beam exit direction, it successively arranges beam splitting system, focusing system, optical beam scanning system, laser beam is focused control to laser beam by focusing system and optical beam scanning system after beam splitting system is divided, it finally acts on transparent organic plastic sample and realizes the interior carving of transparent plastic.A kind of transparent plastic engraving device provided by the invention can realize that three-dimensional inside engraving is processed in transparent organic plastic, laser stealth printing function is especially realized on flexible or ultrathin transparent plastic material.
Description
Technical field
The invention belongs to manufacture fields, are related to a kind of device for carrying out internal engraving to transparent organic plastic using laser.
Technical background
Currently, it is wide to carry out interior carving to glass-like materials such as quartz glass using the pulse laser that wavelength is 532nm
It is general apply show in 3-D image, the fields such as lighting and high-grade ornament.Since the quality of category of glass material is more crisp, valence
Lattice are also relatively expensive, are not available in many fields such as the device that such as light guide plate, thin material and needs are bent, in industry
It is also difficult to play the advantages of carving in transparent material in.
Organic transparent plastic such as acrylic (PMMA), polypropylene plastics (PC), poly terephthalic acid (PET) etc. packaging,
Display and structuring etc. have highly important purposes, but the inside processing (interior carving) of organic plastics is never suitble to industry
Change the solution of application.Carving processing in realizing inside transparent material, to laser beam, there are two the requirement of aspect, a requirements
That laser beam must can be deep into inside transparent material, another requirement be in specific position, laser beam can and transparent material
Material generates interaction, changes the refractive index of transparent material, realizes so-called interior carving.It is general to can change there are two types of Basic Ways
The refractive index of organic transparent plastic, a kind of method utilizes strong laser field, makes the transient evaporation of organic plastics, so that cavity is generated, shape
At the effect of interior carving.But since the generation of strong laser field depends on femto-second laser, but the expensive of femto-second laser, structure are multiple
It is miscellaneous and difficult in maintenance, it is also difficult in the short time by the popularization and application of large area, this method also only makes in the lab at present
With；Another kind is to make transparent plastic regelation, the modeling of the condensing zone as caused by stress structure and surrounding using the method for heating
Material can generate refractive index difference.For relying on for the organic plastics that fuel factor is processed, the output of common laser at present
Wavelength is generally near 1 micron, such as Nd:YAG laser or ytterbium-doping optical fiber laser, organic transparent plastic absorb very it
It is few, it can not directly process, and CO2The output wavelength of laser near 10 microns, organic transparent plastic it is absorbed it is excessive, only
The surface that organic plastics can be used in processes.
Therefore, for the shortcoming of the existing shell used, it is necessary to which providing one kind may be implemented organic transparent plastic
The processing unit (plant) of inside engraving.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of transparent plastic engraving devices, can be realized to organic plastics
Inside engraving.
The present invention wraps to solve above-mentioned technical problem and the technical solution adopted is that provide a kind of transparent plastic engraving device
It includes the translation stage 9 for carrying transparent organic plastic sample 8, computer control system 5 and is controlled by computer control system 5
Laser 1, focusing system 3, optical beam scanning system 4, which is characterized in that the wavelength for the laser that the laser 1 generates is 1.9
Micron~2.1 microns, along laser beam exit direction, successively arrange beam splitting system 2, focusing system 3, optical beam scanning system 4 swash
Light light beam is focused control to laser beam by focusing system 3 and optical beam scanning system 4 after the light splitting of beam splitting system 2, most
It is acted on transparent organic plastic sample 8 afterwards and realizes the interior carving of transparent plastic.
Further, the laser 1 is continuous thulium-doped fiber laser or pulse thulium-doped fiber laser.
Further, it is additionally provided with colimated light system before the beam splitting system 2, the colimated light system includes from left to right successively
The half a month lens 21 and convex lens 22 of setting, 22 front and rear surfaces of convex lens are coated with anti-reflection film respectively.
Further, the beam splitting system 2 includes the first prism 23 disposed in parallel and the second prism 24, first rib
The front surface of mirror 23 and the second prism 24 is coated with reflectance coating respectively.
Further, the front surface of first prism 23 is coated with the reflectance coating to 50% reflectivity of optical maser wavelength, described
The front surface of second prism 24 is coated with the film that is all-trans of optical maser wavelength.
Further, the focusing system 3 be made of three or more optical lenses be made of Zoom lens or by
Varifocal reflecting mirror composition.
Further, the optical beam scanning system 4 includes two groups of first orthogonal rotation reflecting mirror galvanometers 41 and second turn
Dynamic reflecting mirror galvanometer 42, F-theta mirror 43 and servo controlling card 44.
The present invention, which compares the prior art, following beneficial effect：Transparent plastic engraving device provided by the invention, passes through
Laser generates the laser of 2 microns, and internal engraving can be carried out to transparent plastic；And it is swept by focusing system and light beam
System is retouched, realizes the accurate control of focusing, it is severely deformed to guarantee that the size and shape of focal beam spot will not occur.
Detailed description of the invention
Fig. 1 is the overall structure diagram of carving system in transparent plastic of the present invention；
Fig. 2 is the structural schematic diagram of colimated light system and beam splitting system in carving system in transparent plastic of the present invention；
Fig. 3 is the structural schematic diagram of optical beam scanning system in carving system in transparent plastic of the present invention；
Fig. 4 is the temperature variation of body laser inner carving of the present invention；
Fig. 5 is the overall structure diagram of the preferred embodiment of the present invention one；
Fig. 6 is the optical beam scanning system structural schematic diagram in Fig. 5 embodiment one；
Fig. 7 is the overall structure diagram of the preferred embodiment of the present invention two.
In figure：
1:Laser 2:Beam splitting system 21：Half a month lens 22：Convex lens
23：First prism 24：Second prism 3:Focusing system 31：First convex lens
32：Concave-convex lens 33：Second convex lens 34：Concave mirror 35：Convex reflecting mirror
4:Optical beam scanning system 41：First rotation reflecting mirror galvanometer 42：Second rotation reflecting mirror galvanometer
43：F-theta mirror 44：Servo controlling card 45：Indicate laser 5:Computer control system
6:Refrigeration water tank 7:Integrated data line 8:Transparent organic plastic sample 9:Translation stage
Specific embodiment
Invention is further described in detail with reference to the accompanying drawings and examples.
Carving processing in realizing inside transparent material, to laser beam there are two the requirement of aspect, a requirement is laser beam
It must can be deep into inside transparent material, another requirement is in specific position, and laser beam can generate phase with transparent material
Interaction changes the refractive index of transparent material, realizes so-called interior carving.Basic Ways can change organic transparent there are two types of general
The refractive index of plastics, a kind of method utilizes strong laser field, makes the transient evaporation of organic plastics, to generate cavity, formed in carve
Effect.But since the generation of strong laser field depends on femto-second laser, this method also only uses in the lab at present.It is another
Kind is to make transparent plastic regelation, the plastics of the condensing zone as caused by stress structure and surrounding can produce using the method for heating
Raw refractive index difference.
For relying on for the organic plastics processed of fuel factor, select suitable optical maser wavelength become one it is important
Step.The output wavelength of common laser is generally in 1 micron of (Nd at present:YAG laser or ytterbium-doping optical fiber laser) near,
Organic transparent plastic absorbs it seldom, can not directly process, and CO2The output wavelength of laser is organic near 10 microns
Transparent plastic absorbs the surface processing that can be used only in organic plastics very greatly to it.
According to problems of the prior art, wavelength is too small, and to will lead to organic transparent plastic seldom to the absorption of wavelength,
It can not be processed；Wavelength is excessive, and to will lead to organic transparent plastic excessive to the absorption of wavelength, is only used for the table of organic plastics
Face processing, therefore, selecting suitable optical maser wavelength is a most important step.Based on the laser for mixing Thulium lasers medium,
Including optical fiber laser and solid state laser, output wavelength near 2 microns, it is most of 1.9 microns~2.1 microns it
Between, it is a most suitable selection for processing organic transparent plastic.By taking organic glass (acrylic or PMMA) as an example, 2
Its absorption coefficient of micron waveband is generally in 1.0/mm or so.The laser beam of 2 micron wave lengths passes through the organic glass of 2mm thickness, about
It is absorbed 20% or so, therefore may be used as carrying out organic glass interior carving.
After having chosen suitable optical maser wavelength, it is still necessary to it solves in the case where not interfering with peripheral plastic property,
The problem of organic transparent plastic is heated in specified position.The method that the present invention uses multiple beam (light beam number N) to focus, so that
The light intensity of focus meet is N times of the light intensity of laser beam in single-pathway, and the plastics temperature caused by the light intensity of laser is high
When the glass phase height of plastics (for acrylic plastics, the temperature of glass phase height is 104OC), plastics will melt.When
After turning off laser, plastics regelation again forms refringence dissimilarity, realizes the interior carving to organic transparent plastic.Due to single
Light intensity on the path of light beam only has the 1/N of focal point light intensity, caused by temperature be less than plastics glass phase height, will not
Transparent plastic is had an impact, to still maintain the transparent characteristic of plastics in non-designated position.
The concrete structure schematic diagram of transparent plastic engraving device provided by the invention, as shown in Figure 1, including for carrying
The translation stage 9 of bright organic plastics sample 8, beam splitting system 2, computer control system 5 and it is controlled by computer control system 5
Laser 1, focusing system 3, optical beam scanning system 4, computer control system 5 pass through integrated data line 7 and laser 1, focusing
System 3, optical beam scanning system 4 couple, realize it is synchronous with optical beam scanning system 4 to laser 1, focusing system 3, and can be with
Adjust the output mean power of laser 1.
As shown in Fig. 2, also settable colimated light system before beam splitting system 2, light splitting colimated light system includes successively setting from left to right
Half a month lens 21, convex lens 22 and the prism set；In actual use, 22 front and rear surfaces of convex lens can be coated with respectively to 2 microns
The anti-reflection film of wavelength laser, in the preferred embodiment, prism 23 are two prisms disposed in parallel, the preceding table of the first prism 23
Face is coated with the reflectance coating of optical maser wavelength, and the reflectivity of the reflectance coating is preferably 50%, and the front surface of the second prism 24 is coated with sharp
The film that is all-trans of optical wavelength.
Focusing system is usually made of three or more optical lenses in conventional design, or by Zoom lens (or
Reflecting mirror) composition, the control to laser beam focus condition and focus position may be implemented.
As shown in figure 3, optical beam scanning system 4 includes that two groups of first orthogonal rotation reflecting mirror galvanometers 41 and the second rotation are anti-
Penetrate mirror galvanometer 42, F-theta mirror 43 and servo controlling card 44；F-theta mirror by heavy caliber, wide range scanning focus lens group
At uniform focus point can be formed in the plane of scanning motion.Optical beam scanning system may be implemented to incident beam in X, and Y-axis two
Aspect is scanned with larger angle, even if when scanning angle is very big still good focusing can be kept in same plane,
Therefore the size and shape of focal beam spot will not occur severely deformed.
It is as follows that device provided by the invention carries out the interior process carved：1 output wavelength of laser is 1.9 microns~2.1 microns
Laser, after the laser beam of output collimated system collimation, using being divided into two beam function after the first prism 23 and the second prism 24
The equal beamlet of rate, one of beamlet are reflected downwards, another beamlet after the second prism 24,
It is reflected downwards, the direction of propagation of this two beams laser is identical and parallel, but apart has certain interval, does not have between light beam
There is the part of coincidence.By beam splitting system 2 spread out of Lai two beam laser sequentially enter focusing system 3 and optical beam scanning system 4 again,
It realizes the control to laser beam focus condition and focus position, forms uniform focus point in the plane of scanning motion.Two beam laser beams
It finally converges and focuses on the designated position on transparent organic plastic sample 8.Laser beam will be in the very low range near focus point
Organic plastics be warmed to its glass phase height, start to melt.At this moment it turns off laser or is moved light beam by optical beam scanning system 4
Move next position.The organic plastics of the designated position starts to cool down, since the organic plastics around focus point does not reach
Glass phase height will not melt, therefore due to stress, the microstructures such as crystallization direction of the organic plastics of regelation
Different from the organic plastics of surrounding, lead to the difference of its refractive index, generates the interior effect carved.
Phase transition process inside organic plastics is as shown in Figure 4.Initial stage, laser are opened, and the temperature of plastics inner is rapid
Rising, transparent plastic is heated at laser spot, starts to melt, when transparent plastic has reached glass phase height, laser is turned off,
The temperature of plastics inner is begun to decline, and gradually decreases to room temperature, and transparent plastic solidifies again, generates the refractive index as caused by stress
Change point forms interior carving effect.
The engraving device may also include the groups such as other auxiliary equipment such as refrigeration water tank 6, laser protector, lighting device
At.Other ancillary equipments are used primarily to ensure the operation that whole device can be safe and reliable, some solids or optical fiber are swashed
Light device needs refrigeration water tank 6 to keep working temperature constant, and laser protector is used to protect the safety of operator, lighting device
For observing processing effect etc..
Three specific embodiments are enumerated, below so that those skilled in the art more fully understand the technical solution.
Embodiment one
The overall structure diagram of this preferred embodiment one is as shown in figure 5, laser 1 preferably swashs for continuous thulium doped fiber
Light device, its maximum power output are 100W, and the modulated frequency of highest is 5kHz, laser output wavelength 1940nm, and laser is defeated
Directional light out, output beam diameter are 7mm.It is entered in beam splitting system 2 by the light beam that laser exports.Beam splitting system 2 is by one
To the quartz prism composition for the reflectance coating for being coated with 50% reflectivity.After beam splitting system, laser beam is divided into two beam power phases
Deng laser beam, the spacing between beam center wants sufficiently large, so that two beam directional lights do not overlap, the present embodiment spacing is excellent
It is selected as 17mm.
Two beam parallel lasers enter focusing system 3, as shown in figure 5, focusing system 3 is by the first convex lens 31, concave-convex lens
32 and second convex lens 33 form, the focal length of this three pieces lens is made of infrared grade fused silica, and the focal length of the first convex lens 31 can
Preferably 150mm, concave-convex lens 32 focal length be preferably 300mm, the second convex lens 33 focal length be preferably 450mm；First is convex
Lens 31 and concave-convex lens 32 are at a distance of 5mm, and concave-convex lens 32 and the second convex lens 33 are at a distance of 3mm.Change the opposite of this 3 lens
Distance, thus it is possible to vary the angle of divergence of parallel laser, to realize the accurate control of focusing.
As shown in fig. 6, optical beam scanning system 4 rotates 41 He of reflecting mirror galvanometer by two groups of orthogonal rotation reflecting mirrors i.e. first
Second rotation reflecting mirror galvanometer 42 and F-theta mirror 43 and servo controlling card 44 form, and can increase in optical beam scanning system
Add the red instruction laser 45 being used to indicate.Plating on the eyeglass of first reflecting mirror galvanometer 41 and the second reflecting mirror galvanometer 42
There is the anti-optical film of height to 2 micron wave length wavelength lasers and instruction light, is coated on the eyeglass of F-theta mirror 43 to 2 micron wave lengths
The anti-reflection optical film of laser and instruction light.
The sample 8 of transparent organic plastic is placed on translation stage 9, can be moved forward and backward, to realize to transparent organic modeling
The three-dimensional inside engraving of material.Computer control system 5 is by integrated data line 7 to laser 1, focusing system 2, optical beam scanning system 4
And two-dimension translational platform 9 is controlled, and the synchronization between them is kept, while controlling the switch time of laser, it is ensured that is being moulded
Suitable energy is injected in the focal point of material, and plastics is made to be in glass phase height just；Then, laser, the plastics of thawing are turned off
Again it solidifies, forms stress point, realize the interior carving to plastics.
Embodiment two
The overall structure diagram of this preferred embodiment two is as shown in fig. 7, laser 1 preferably swashs for pulse thulium doped fiber
Light device, laser export mean power 10W, and 10~30kHz of pulse recurrence rate is adjustable, pulse width 30ns, the output of laser
Wavelength is 1980nm, and laser exports diverging light, and the numerical aperture NA for exporting the angle of divergence is 0.1.The light beam exported by laser 1 into
Enter into collimation beam splitting system 2.The structure of beam splitting system 2 is identical as Fig. 2, by a pair of alignment lens and a pair of of plated film quartz prism
Composition.After collimating beam splitting system 2, laser beam is divided into that two beam powers are equal, laser beam of parallel transmission, output beam
Diameter is 7mm, and the spacing between beam center is 17mm.
Two beam parallel lasers enter focusing system 3, focusing system by a pair of of variable curvature 34 He of paraxonic concave mirror
Convex reflecting mirror 35 forms, and the curvature of convex reflecting mirror 35 therein is adjusted by the hydraulic pressure at reflecting mirror rear portion, adjustable range
Precision can be changed by R=200~220mm<0.1mm；Change the curvature of this convex reflecting mirror, thus it is possible to vary parallel laser
The angle of divergence, to realize the accurate control of focusing.
Optical beam scanning system 4 is by two groups of orthogonal rotation reflecting mirrors i.e. the first reflecting mirror galvanometer 41 and the second reflecting mirror galvanometer
42 and F-theta mirror 43 and servo controlling card 44 form, can increase in optical beam scanning system one be used to indicate it is red
Color indicates laser 45.Being coated with to 2 micron wave length wavelength on the eyeglass of the first reflecting mirror galvanometer 41 and the second reflecting mirror galvanometer 42
The height anti-optical film of laser and instruction light is coated on the eyeglass of F-theta mirror 43 to the anti-reflection of 2 micron wave length laser and instruction light
Optical film.
The sample 8 of transparent organic plastic is placed on translation stage 9, can be moved forward and backward, to realize to transparent organic modeling
The three-dimensional inside engraving of material.Computer control system 5 is by integrated data line 7 to laser 1, focusing system 2, optical beam scanning system 4
And two-dimension translational platform 9 is controlled, and the synchronization between them is kept, while controlling the switch time of laser, it is ensured that is being moulded
Suitable energy is injected in the focal point of material, and plastics is made to be in glass phase height just；Then, laser, the plastics of thawing are turned off
Again it solidifies, forms stress point, realize the interior carving to plastics.
Embodiment three
This preferred embodiment three, it is essentially identical with embodiment two, the difference is that the laser 1 used is preferably that holmium is mixed in pulse
Solid state laser, laser export mean power 10W, and 100~500Hz of pulse recurrence rate is adjustable, pulse width 100us, swash
The output wavelength of light is 2100nm, and the beam diameter for exporting laser is 3mm.Other parameters are identical as embodiment two.
Compared with the prior art, the advantages of the present invention are as follows：The body laser inner carving for realizing organic transparent plastic, reduces
The processing cost carved in bright material meets the big specification of body laser inner carving, it can be achieved that body laser inner carving on flexible material and thin material
The demand of industrial applications.
Although the present invention is disclosed as above with preferred embodiment, however, it is not to limit the invention, any this field skill
Art personnel, without departing from the spirit and scope of the present invention, when can make a little modification and perfect therefore of the invention protection model
It encloses to work as and subject to the definition of the claims.
Claims (5)
1. a kind of transparent plastic engraving device, including the translation stage (9) for carrying transparent organic plastic sample (8), computer
Control system (5) and it is controlled by the laser (1) of computer control system (5), focusing system (3), optical beam scanning system
(4), which is characterized in that the laser (1) is continuous thulium-doped fiber laser or pulse thulium-doped fiber laser, is generated
The wavelength of laser be 1.9 microns~2.1 microns, along laser beam exit direction, successively arrange beam splitting system (2), focusing system
System (3), optical beam scanning system (4), the focusing system (3) are made of three or more optical lenses or by Zoom lens group
It is formed at or by varifocal reflecting mirror, laser beam passes through focusing system (3) and light beam scanning system after beam splitting system (2) are divided
System (4) is focused control to laser beam, finally acts on and realizes the interior of transparent plastic on transparent organic plastic sample (8)
Carving.
2. a kind of transparent plastic engraving device according to claim 1, which is characterized in that before the beam splitting system (2) also
It is provided with colimated light system, the colimated light system includes the half a month lens (21) and convex lens (22) set gradually from left to right, institute
It states convex lens (22) front and rear surfaces and is coated with anti-reflection film respectively.
3. a kind of transparent plastic engraving device according to claim 1, which is characterized in that the beam splitting system (2) includes
The front surface of first prism (23) disposed in parallel and the second prism (24), first prism (23) and the second prism (24) point
Reflectance coating is not coated with it.
4. a kind of transparent plastic engraving device according to claim 3, which is characterized in that before first prism (23)
Surface is coated with the reflectance coating to 50% reflectivity of optical maser wavelength, and the front surface of second prism (24) is coated with the complete of optical maser wavelength
Anti- film.
5. a kind of transparent plastic engraving device according to claim 1, which is characterized in that the optical beam scanning system (4)
Including two groups of orthogonal first rotations reflecting mirror galvanometer (41) and second rotate reflecting mirror galvanometer (42), F-theta mirror (43) and
Servo controlling card (44).
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| CN201710015106.2A CN106735873B (en) | 2017-01-09 | 2017-01-09 | A kind of transparent plastic engraving device |
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| CN201710015106.2A CN106735873B (en) | 2017-01-09 | 2017-01-09 | A kind of transparent plastic engraving device |
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| CN106735873A CN106735873A (en) | 2017-05-31 |
| CN106735873B true CN106735873B (en) | 2018-11-16 |
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| CN201710015106.2A Expired - Fee Related CN106735873B (en) | 2017-01-09 | 2017-01-09 | A kind of transparent plastic engraving device |
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| CN112570896A (en) * | 2020-07-01 | 2021-03-30 | 广宁县广顺塑料有限责任公司 | Method for engraving colored plastics by using laser machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10105979A1 (en) * | 2001-02-09 | 2002-08-14 | Heidelberger Druckmasch Ag | Material engraving using laser engraving method, involves focusing laser beam on material to be engraved following expansion of its diameter and reduction of its angular separation |
| CN2585770Y (en) * | 2002-12-20 | 2003-11-12 | 陈亭 | Fine internal carving machine for transparent body |
| CN101152819B (en) * | 2006-09-28 | 2010-07-21 | 深圳市大族激光科技股份有限公司 | Device with internal laser carving |
| CN101776790B (en) * | 2009-12-10 | 2012-07-18 | 深圳市大族激光科技股份有限公司 | Laser engraving focusing optical lens and using method thereof |
| CN101866044B (en) * | 2010-05-27 | 2011-12-07 | 深圳市大族激光科技股份有限公司 | Optical lens |
| CN102122118A (en) * | 2011-02-23 | 2011-07-13 | 中国科学院上海光学精密机械研究所 | Laser direct writing device |
| CN202291845U (en) * | 2011-10-31 | 2012-07-04 | 东莞宏威数码机械有限公司 | Multi-level equal-energy spectroscopic device |
| US8911658B2 (en) * | 2012-04-18 | 2014-12-16 | Advalue Photonics, Inc. | Laser marking of polymer materials |
| CN103521926B (en) * | 2013-09-26 | 2015-09-02 | 深圳市创益科技发展有限公司 | A kind of silicon-based film solar cells laser grooving and scribing equipment |
| CN206536126U (en) * | 2017-01-09 | 2017-10-03 | 中电科天之星激光技术（上海）有限公司 | A kind of transparent plastic engraving device |
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