CN106714518B - Wide temperature thermal control device - Google Patents
Wide temperature thermal control device Download PDFInfo
- Publication number
- CN106714518B CN106714518B CN201710005625.0A CN201710005625A CN106714518B CN 106714518 B CN106714518 B CN 106714518B CN 201710005625 A CN201710005625 A CN 201710005625A CN 106714518 B CN106714518 B CN 106714518B
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- heat
- inner shell
- control device
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- organic phase
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a wide-temperature thermal control device, and belongs to the technical field of electrical equipment. The device adopts the combination of phase change materials and heat transfer technology. The heat-conducting material mainly comprises an outer shell, a heat-insulating layer, an inner shell, a phase-change heat-conducting pad, a heat-conducting block, a composite organic phase-change material, a thermal diode and a radiating fin. The device carries out heat control in a pure physical mode, does not need to add extra equipment (fans, hot wires and the like) and does not need to add extra energy, and the problem of non-forced heat dissipation of electronic equipment in a wide-temperature environment can be solved. The wide temperature control device is typically applied to an explosive environment, forced temperature control measures such as an axial flow fan and a hot wire are not suitable to be adopted in the explosive environment, and potential safety hazards can be generated under the fault condition, and the wide temperature control device has the advantages of no extra heat load, high reliability and no potential safety hazards, and can resist the influence of high and low temperatures in a large-space environment on electronic equipment.
Description
Technical Field
The invention relates to a wide-temperature thermal control device, in particular to a thermodynamic structural design for realizing safety production monitoring and monitoring equipment (a gas infrared leak detector, a spark detector, a camera and the like) under a wide-temperature working condition through photoelectric conversion, and belongs to the technical field of general electrical equipment.
Background
It is well known that electronic devices are extremely sensitive to the temperature requirements of the operating environment, and that too high or too low an ambient temperature can affect the proper operation of the electronic device and even damage the electronic device. At present, one or a combination of a plurality of modes such as radiating fin radiating, hot wire heating, fan forced convection refrigerating, liquid cooling and the like are adopted as the most common mode for heating or radiating electronic equipment. However, in most applications, there are requirements on cost, structure, volume, etc. of the apparatus, and even some special applications (such as explosive environments) require no additional energy, so that the above-mentioned methods are difficult to meet the field requirements. Therefore, the wide temperature control device which has no extra heat load, high reliability and no potential safety hazard, can resist the influence of high and low temperatures in a large-space environment on the electronic equipment and can ensure the normal operation of the electronic equipment is developed and has practical significance.
Disclosure of Invention
The invention aims to provide a wide-temperature control device, which is designed to be capable of adjusting the internal temperature of equipment without force on the basis of meeting the intrinsic safety technical requirements of data acquisition electronic equipment so as to enable electronic components such as chips to work normally.
The invention provides a wide temperature control device which comprises an outer shell, an inner shell, a phase change heat conduction pad, a heat conduction block, a composite organic phase change material box, a thermal diode and a radiating fin, wherein the outer shell is provided with a plurality of heat conducting pads; the inner shell, the phase-change heat conducting pad, the heat conducting block, the composite organic phase-change material box and the thermal diode are arranged in the outer shell; the electronic equipment to be protected is arranged in the inner shell, and heat transfer is realized between the electronic equipment to be protected and the inner shell through a heat conduction belt; the heat conducting block is arranged at the lower part of the inner shell, a phase-change heat conducting pad is arranged between the heat conducting block and the outer wall of the lower part of the inner shell, the upper working face of the heat conducting block is attached to the phase-change heat conducting pad, the lower working face of the heat conducting block is respectively connected with the composite organic phase-change material box and the hot end of the thermal diode, the composite organic phase-change material box is internally provided with the composite organic phase-change material, the condensing end of the thermal diode is provided with a radiating fin, and a protective cover is arranged outside the radiating fin.
The invention provides a wide temperature control device, which has the advantages that: the wide temperature control device combines phase change materials and heat transfer technology and can dynamically adjust the temperature. When the ambient temperature is lower than the working temperature of the protected electronic equipment, unidirectional heat dissipation can be performed from inside to outside; when the ambient temperature is higher than the operating temperature of the protected electronic device, the internal heat can be stored in the phase change material first, and when the ambient temperature is low, the stored heat is released. Thereby ensuring that the protected electronic equipment works normally in a large space environment at the temperature of between 40 ℃ below zero and 60 ℃. The device is typically applied to an explosive environment, and forced heat control measures such as an axial flow fan, a hot wire and the like are not suitable to be adopted in the explosive environment, so that potential safety hazards can be generated under the fault condition. The wide-temperature heat control device has the advantages of no extra heat load, high reliability and no potential safety hazard, and can resist the influence of high and low temperatures in a large-space environment on electronic equipment.
Drawings
Fig. 1 is a schematic structural diagram of a wide temperature control device according to the present invention.
In fig. 1, 1 is an outer case, 2 is a heat insulating layer, 3 is an inner case, 4 is a glass window, 5 is a heat conduction tape, 6 is a phase change heat conduction pad, 7 is a heat conduction block, 8 is a composite organic phase change material box, 9 is a composite organic phase change material, 10 is a thermal diode, 11 is a heat sink, 12 is a shield, and 13 is an electronic device to be protected.
Detailed Description
The structure of the wide temperature control device provided by the invention is shown in fig. 1, and the wide temperature control device comprises an outer shell 1, an inner shell 3, a phase change heat conduction pad 6, a heat conduction block 7, a composite organic phase change material box 8, a thermal diode 10 and a radiating fin 11. The inner shell 3, the phase-change heat conduction pad 6, the heat conduction block 7, the composite organic phase-change material box 8 and the thermal diode 10 are arranged in the outer shell 1. The inner shell 3 is arranged at the upper part in the outer shell, a heat insulation layer 2 is arranged between the outer shell 1 and the inner shell 3, a glass window 4 is arranged on the frame at one side of the inner shell 3, and the glass window 4 extends out of the outer shell 1. The electronic equipment 13 to be protected is arranged in the inner shell 3, and heat transfer is realized between the electronic equipment 13 to be protected and the inner shell 3 through the heat conducting belt 5. The heat conduction block 7 is arranged at the lower part of the inner shell 3, a phase change heat conduction pad 6 is arranged between the heat conduction block 7 and the outer wall of the lower part of the inner shell, the upper working surface of the heat conduction block 7 is attached to the phase change heat conduction pad 6, the lower working surface of the heat conduction block 7 is respectively connected with the composite organic phase change material box 8 and the hot end of the thermal diode 10, the composite organic phase change material box 8 is internally provided with a composite organic phase change material 9, the condensation end of the thermal diode 10 is provided with a radiating fin 11, and a shield 12 is arranged outside the radiating fin 11.
The working principle of the wide temperature control device provided by the invention is described in detail below with reference to the accompanying drawings:
generally, when the electronic equipment or the electronic power element works, the surface temperature is 40-50 ℃, and the electronic equipment or the electronic power element continuously generates heat, and other electronic elements work at 4-50 ℃, so that the electronic equipment or the electronic power element can work normally in a large space temperature range of-40-60 ℃. When the temperature of the large space is lower than the phase change temperature (33-35 ℃) of the phase change heat conducting pad 6, a gap is formed between the phase change heat conducting pad 6 and the heat conducting block 7, a heat transfer channel is cut off, heat is generated when the electronic equipment to be protected works, the required working temperature inside the inner shell 3 is maintained, and the heat insulation enclosure formed by the heat insulation layer 2 and the double window glass 4 ensures that the low temperature of the large space environment can not interfere the work of the movement 13. And when the temperature of the large space is higher than the phase transition temperature of the phase transition heat conduction pad 6 and lower than the cut-off temperature of the thermal diode 10, the heat transfer channel is opened, and the heat dissipation plate 11 transfers heat through free convection diffusion. When the large space temperature is higher than the cutoff temperature of the thermal diode 10, the composite organic phase change material 9 stores heat with a thermal cycle of 8 hours or more. The above process is dynamic. With the lower temperature period, the composite organic phase change material 9 releases heat.
In one embodiment of the wide temperature control device of the present invention, the outer housing is used for structural support and external heat protection enclosure. The heat insulating layer is filled with heat insulating material with heat conductivity coefficient lambda less than or equal to 0.03W/m.K. The inner shell is used for installing electronic equipment, a double-layer glass window is arranged at the front end of the inner shell, the whole inner cavity is of a closed structure, and heat generated by the electronic equipment during operation is conducted to the inner wall surface. The phase change temperature of the phase change heat conduction pad is 33-35 ℃, the phase change heat conduction pad is arranged between the outer wall of the inner shell and the heat conduction block, and the heat switch function is realized through the change of thermal resistance during phase change. The heat conducting block conducts heat generated by dissipating power of the electronic equipment. The composite organic phase change material (phase change temperature is 45-48 ℃, phase change enthalpy delta Hm is more than or equal to 195J/g, and relative density is more than or equal to 1.45) is arranged in the composite organic phase change material box for heat storage. The thermal diode is used for unidirectional heat conduction.
The outer shell 1 is made of materials with lambda less than or equal to 0.25W/m.K (such as antistatic ABS), is used as a main structural member and a surrounding, is of an upper layer and a lower layer of box body structure, the upper layer is provided with the inner shell 3, and the lower layer is provided with the composite organic phase change material box 8, the thermal diode 10 and the like.
The flexible heat conduction tape 5 for electronic equipment protected by the present invention is attached to the inner wall of the inner case 3 and transfers heat to the outer wall.
According to the invention, the outer wall of the inner shell 3 is connected with the phase-change heat-conducting pad 6, the phase-change heat-conducting pad 6 is solid when the phase-change temperature is lower than the phase-change temperature, a gap is formed between the phase-change heat-conducting pad 6 and the heat-conducting block 7, a large thermal resistance is generated, the phase-change heat-conducting pad 6 becomes soft when reaching the phase-change temperature and is in a melting state, and the gap is completely filled to form heat conduction.
The heat conducting block 7 is mechanically connected with the composite organic phase change material box 8 and the thermal diode 10 in parallel to form two heat transfer paths, when the temperature is lower than the phase change temperature of the composite organic phase change material 9, the thermal diode 10 convect heat through the cooling fin 11 positioned at the condensation end, the composite organic phase change material 9 does not store heat, and otherwise, the composite organic phase change material 9 stores heat.
The thermal cycle Tn of the composite organic phase change material 9 is more than or equal to 8 hours.
The shield 12 of the present invention is made of a high thermal resistance material, and the outer surface is coated with a reflective insulation material to stabilize the convective heat transfer.
Claims (1)
1. The wide temperature control device is characterized by comprising an outer shell, an inner shell, a phase-change heat conduction pad, a heat conduction block, a composite organic phase-change material box, a thermal diode and a radiating fin; the inner shell, the phase-change heat conducting pad, the heat conducting block, the composite organic phase-change material box and the thermal diode are arranged in the outer shell; the electronic equipment to be protected is arranged in the inner shell, and heat transfer is realized between the electronic equipment to be protected and the inner shell through a heat conduction belt; the heat conducting block is arranged at the lower part of the inner shell, a phase-change heat conducting pad is arranged between the heat conducting block and the outer wall of the lower part of the inner shell, the upper working face of the heat conducting block is attached to the phase-change heat conducting pad, the lower working face of the heat conducting block is respectively connected with the composite organic phase-change material box and the hot end of the thermal diode, the composite organic phase-change material box is internally provided with the composite organic phase-change material, the condensing end of the thermal diode is provided with a radiating fin, and a protective cover is arranged outside the radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710005625.0A CN106714518B (en) | 2017-01-04 | 2017-01-04 | Wide temperature thermal control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710005625.0A CN106714518B (en) | 2017-01-04 | 2017-01-04 | Wide temperature thermal control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106714518A CN106714518A (en) | 2017-05-24 |
| CN106714518B true CN106714518B (en) | 2023-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710005625.0A Active CN106714518B (en) | 2017-01-04 | 2017-01-04 | Wide temperature thermal control device |
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| CN (1) | CN106714518B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106993399A (en) * | 2017-05-26 | 2017-07-28 | 北京小米移动软件有限公司 | Heat-transfer device |
| CN108801309A (en) * | 2017-06-30 | 2018-11-13 | 摩瑞尔电器（昆山）有限公司 | Environmental monitoring system based on thermoelectric material and phase-change material |
| CN110167318B (en) * | 2019-04-29 | 2021-01-15 | 中国科学院西安光学精密机械研究所 | Temperature control system and electronics box |
| CN110113900B (en) * | 2019-05-22 | 2020-11-10 | 温州乐控节能科技有限公司 | Super servo controller |
| CN112802808A (en) * | 2019-11-14 | 2021-05-14 | 承奕科技股份有限公司 | Composite heat sink with plug-in port for heating element and heat sink with the same |
| CN111322895A (en) * | 2020-04-03 | 2020-06-23 | 北京市市政工程设计研究总院有限公司 | PCM-based passive zero-energy-consumption anti-freezing device for equipment |
| CN111447343B (en) * | 2020-04-09 | 2021-07-23 | 北华航天工业学院 | A special cryogenic protection device for cameras |
| CN115996330B (en) * | 2023-03-23 | 2023-05-16 | 深圳市振兴光通信股份有限公司 | Industrial grade router |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104611A (en) * | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
| CN103325964A (en) * | 2013-06-20 | 2013-09-25 | 华南理工大学 | Air cooled electric automobile battery thermal-management device containing phase change material |
| CN106033827A (en) * | 2015-03-18 | 2016-10-19 | 广东万锦科技股份有限公司 | Power battery thermal management system with functions of efficient heat dissipation and efficient heating |
| CN206332972U (en) * | 2017-01-04 | 2017-07-14 | 北京中安科创科技发展有限公司 | A kind of wide warm thermal controls apparatus |
-
2017
- 2017-01-04 CN CN201710005625.0A patent/CN106714518B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104611A (en) * | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
| CN103325964A (en) * | 2013-06-20 | 2013-09-25 | 华南理工大学 | Air cooled electric automobile battery thermal-management device containing phase change material |
| CN106033827A (en) * | 2015-03-18 | 2016-10-19 | 广东万锦科技股份有限公司 | Power battery thermal management system with functions of efficient heat dissipation and efficient heating |
| CN206332972U (en) * | 2017-01-04 | 2017-07-14 | 北京中安科创科技发展有限公司 | A kind of wide warm thermal controls apparatus |
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| CN106714518A (en) | 2017-05-24 |
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