CN106686954B - Heat dissipation structure, electronic equipment and assembling method thereof - Google Patents
Heat dissipation structure, electronic equipment and assembling method thereof Download PDFInfo
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- CN106686954B CN106686954B CN201710074435.4A CN201710074435A CN106686954B CN 106686954 B CN106686954 B CN 106686954B CN 201710074435 A CN201710074435 A CN 201710074435A CN 106686954 B CN106686954 B CN 106686954B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 111
- 238000000034 method Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 149
- 239000002184 metal Substances 0.000 claims abstract description 149
- 239000007788 liquid Substances 0.000 claims abstract description 71
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 101100134058 Caenorhabditis elegans nth-1 gene Proteins 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a heat dissipation structure, electronic equipment and an assembling method thereof, wherein the heat dissipation structure comprises: the flexible metal pipe is used for filling heat dissipation liquid, at least one surface of the flexible metal pipe is in contact with the heat-generating component, and the flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid so as to be attached to the outer surface of the heat-generating component; and the metal radiator is connected with the flexible metal pipe and is used for transferring the heat absorbed by the heat dissipation liquid.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to a heat dissipation structure, an electronic device, and an assembling method thereof.
Background
Fig. 1 shows a heat dissipation structure, in which a thermal pad is required between different heat generating components and a heat dissipation component to fill the gap. On the one hand, the heat on the surface of the heat-generating component can be indirectly conducted into the heat-dissipating liquid to dissipate heat through the arrangement of the heat-conducting pad, so that the heat dissipation efficiency is low. On the other hand, due to the non-specific shape of the outer surface of the heat-generating component, the heat-conducting pad may not be well attached to the heat-generating component, which may result in low heat dissipation efficiency. Meanwhile, an additional heat conducting pad is introduced into the heat dissipation assembly, which leads to a problem of high hardware cost of the heat dissipation structure.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to a heat dissipation structure, an electronic device and an assembling method thereof, so as to improve the heat dissipation capability of the heat dissipation structure and/or reduce the heat dissipation cost.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
an embodiment of the present invention provides a heat dissipation structure, including:
the flexible metal pipe is used for filling heat dissipation liquid, at least one surface of the flexible metal pipe is in contact with the heat-generating component, and the flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid so as to be attached to the outer surface of the heat-generating component;
and the metal radiator is connected with the flexible metal pipe and is used for transferring the heat absorbed by the heat dissipation liquid.
Based on the scheme, the heat-generating component comprises one or more memory banks.
Based on the scheme, the metal radiator comprises a first metal radiating plate, a second metal radiating plate and a third metal radiating plate; the first metal heat dissipation plate and the second metal heat dissipation plate are connected with different ends of the third metal heat dissipation plate;
the number of the flexible metal tubes is N, and N is an integer not less than 2;
the N flexible metal pipes are in contact with the third metal heat dissipation plate;
the 1 st flexible metal pipe is in contact with the first metal heat dissipation plate;
the Nth flexible metal tube is in contact with the second metal heat dissipation plate.
A second aspect of an embodiment of the present invention provides an electronic device, including:
any one or more of the aforementioned heat dissipating structures;
a heat generating component disposed adjacent to the at least one flexible metal tube in the heat dissipating structure.
Based on the scheme, the heat-generating component is one or more memory banks.
A third aspect of the embodiments of the present invention provides an assembling method for an electronic device, including:
a flexible metal pipe of a heat dissipation structure is arranged at the adjacent position of the heat generating component;
after the flexible metal pipe is installed, heat dissipation liquid is filled into the flexible metal pipe, so that the flexible metal pipe deforms under the hydraulic pressure of the heat dissipation liquid and is attached to the outer surface of the heat generating component.
According to the heat dissipation structure, the electronic equipment and the assembling method of the electronic equipment, the flexible metal pipe is introduced, and the heat dissipation liquid is directly filled in the hollow part in the flexible metal pipe, so that heat generated by the heat generating component can be transferred to the heat dissipation liquid as early as possible, and the heat dissipation efficiency and the heat dissipation capacity can be improved. Meanwhile, the heat dissipation structure provided by the embodiment of the invention has the advantages that the heat conducting pad is removed, the number of parts of the heat dissipation structure is reduced, and the heat dissipation structure is simplified.
Drawings
Fig. 1 is a schematic structural view of a conventional heat dissipation structure;
fig. 2 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present invention;
fig. 3 is a schematic view of the combination of a heat dissipation structure and a heat generating component according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 5 is a flowchart illustrating an assembling method of an electronic device according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further described in detail with reference to the drawings and the specific embodiments of the specification.
As shown in fig. 2, the present embodiment provides a heat dissipation structure, including:
a flexible metal tube 110 filled with a heat dissipating liquid, at least one surface of which is in contact with a heat generating component and is deformable according to a hydraulic pressure of the heat dissipating liquid to be attached to an outer surface of the heat generating component;
and a metal radiator 120 connected to the flexible metal tube for transferring heat absorbed by the heat dissipating liquid.
In the present embodiment, the heat dissipation structure is provided with a flexible metal tube 110, and the flexible metal tube 110 is hollow, and the hollow position can be used for filling heat dissipation liquid. The heat dissipating liquid may be any liquid having a specific heat capacity greater than a preset threshold. In this embodiment the heat sink liquid may be water. The specific heat capacity of the heat dissipation liquid is larger than a preset threshold value, so that the heat absorption capacity of the heat dissipation liquid can meet the preset requirement, and rapid heat dissipation is realized.
The flexible metal tube 110 may be made of various metals or alloys with good ductility, for example, the flexible metal tube 110 in this embodiment may be made of a flexible metal or alloy.
The hollow volume of the flexible metal tube 110 may be a first volume when the flexible metal tube 110 is empty; after the heat dissipation liquid is filled in the hollow of the flexible metal tube 110, the hollow volume of the flexible metal tube 110 is a second volume. Typically, the first volume is smaller than the second volume. After a second volume of heat-dissipating fluid is filled into the flexible metal tube 110, the flexible metal tube 110 is deformed by the hydraulic pressure of the heat-dissipating fluid. Where deformation includes at least expansion in one or more directions. In this embodiment, the flexible metal tube 110 is deformed in at least a direction toward the heat generating component.
In some embodiments, the flexible metal tube 110 is made of a flexible metal or alloy that is deformable and can be deformed in various directions. In other embodiments, portions of the flexible metal tube 110 may be made of a deformable flexible metal or alloy, and the portions made of the deformable flexible metal or alloy are adjacent to or at least partially in contact with the heat generating components. In this way, after the heat dissipation liquid is filled in the flexible metal tube 110, the flexible metal tube 110 at least expands towards the heat generating component, so as to be attached to the heat generating component or increase the attachment area of the heat generating component, so that the heat absorption area of the heat dissipation liquid acting on the heat generating component is increased, thereby better absorbing heat and improving the heat dissipation efficiency.
In the present embodiment, the flexible metal tube 110 is used to contain the heat dissipating liquid and is made of metal or alloy. The metal or alloy has a large thermal conductivity, so that it can quickly absorb the heat on the surface of the heat-generating component and transfer the heat to the heat-dissipating liquid. In this embodiment, the thermal conductivity of the metal or alloy of at least the surface of the flexible metal tube 110 abutting against the heat generating component is greater than the threshold value of the thermal conductivity, so as to ensure the heat dissipation efficiency and the heat dissipation capability of the heat dissipation structure.
In this embodiment, the metal heat sink 120 may include one or more metal sheets, the metal sheets may be made of elemental metal or alloy, and the metal heat sink 120 may rapidly dissipate heat by using the characteristic of high thermal conductivity of metal, which may rapidly transfer heat. In the present embodiment, the metal radiator 120 is connected to the flexible metal tube 110; the workflow of the flexible metal tube 110 may include: the wall of the flexible metal tube 110 absorbs the heat on the surface of the heat-generating component and conducts the heat to the heat-dissipating liquid, and the heat-dissipating liquid absorbs a large amount of heat due to the increase of the specific heat capacity, but the temperature rise amplitude is very small, so that the high-temperature effect caused by the heat accumulation on the surface of the heat-generating component can be reduced. Meanwhile, the heat absorbed by the heat dissipation liquid can be conducted to the metal heat sink 120 with high thermal conductivity, and the heat is exchanged between the metal heat sink 120 and the heat dissipation medium in the heat dissipation environment, so that heat dissipation is realized. For example, it is briefly described that the heat sink 120 exchanges heat with air in a heat dissipation environment, the low-temperature air raises the temperature through heat interaction, and then the heat of the high-temperature air after heat absorption is conducted to the low-temperature air by using the fluidity of the air, so as to achieve heat dissipation.
In the present embodiment, the heat dissipation area of the metal heat sink 120 is larger than the area threshold, so as to achieve rapid heat dissipation.
In this embodiment, the heat-generating component includes one or more memory banks. Of course, the heat generating component is not limited to the memory bank, and may be various other circuits or chips that generate heat.
In electronic devices, memory banks generate a large amount of heat due to the high speed at which memory is read and written by a processor or processing circuitry. Generally, one or a plurality of memory banks are arranged in parallel in one electronic device, and heat dissipation is required to avoid failure or short service life of the memory banks due to high temperature. In this embodiment, the flexible metal tube 110 is attached to the outer surface of the memory bank to rapidly absorb heat generated by the memory bank and dissipate the heat of the memory bank.
In some embodiments, the metal heat sink 120 surrounds the periphery of all heat generating components, and the flexible metal tubes 110 are interspersed between multiple heat generating components. Due to the structural design, the metal heat sink 120 can obtain as large a heat dissipation area as possible and exchange heat with a heat dissipation environment, so as to improve the heat dissipation efficiency. And the flexible metal tube 110 is inserted between a plurality of heat generating components, so that the contact area between the flexible metal tube 110 and the heat generating components can be increased as much as possible, and the heat absorption efficiency of the flexible metal tube 110 to the heat generating components is improved. For example, as shown in fig. 3 or 4, flexible metal tubes 110 are interposed between a plurality of memory banks. Different sides of a flexible metal tube 110 may be attached to the outer surface of different memory sticks.
FIG. 3 is a schematic view of the combination of the flexible metal tube 110 with heat-generating components when it is not filled with heat-dissipating liquid; fig. 4 is a schematic diagram of the flexible metal tube 110 directly connected to the heat generating component after being filled with the heat dissipating liquid and deformed. As can be seen from comparing fig. 3 and 4, the flexible metal tube 110 is largely deformed before and after being filled with the heat dissipating liquid.
As shown in fig. 2, the metal heat sink 120 includes a first metal heat sink plate 121, a second metal heat sink plate 122, and a third metal heat sink plate 123; the first metal heat sink 121 and the second metal heat sink 122 are connected to different ends of the third metal heat sink 123;
the number of the flexible metal tubes 110 is N, where N is an integer not less than 2;
the N flexible metal tubes 110 are all in contact with the third metal heat dissipation plate 123;
the 1 st flexible metal tube 110 is in contact with the first metal heat dissipation plate 121;
the nth flexible metal tube contacts 110 the second metal heat sink plate 122.
In some embodiments, nth flexible metal tube 110 is attached to nth-1 and nth heat generating components. The N is an integer not less than 2 and less than the N.
In some embodiments, to increase the area of the flexible metal tube 110 that conforms to the heat generating component. The flexible metal tube 110 may be an annular tube; the annular pipe comprises an inner ring and an outer ring, the ring diameter of the inner ring is smaller than that of the outer ring, a hollow cavity is arranged between the inner ring and the outer ring and used for filling the heat dissipation liquid, and the heat production assembly is sleeved in the inner ring. At least the inner ring is made by deformable metal or alloy among the annular tube, can be better with the laminating of a plurality of faces of heat production subassembly, increase laminating area promotes the heat absorption ability.
In this embodiment, the flexible metal tube 110 is provided with a liquid hole and a packaging component for sealing the liquid hole, and the liquid hole can be used for filling and discharging the heat dissipating liquid. The packaging assembly is used for packaging the heat dissipation liquid after the heat dissipation liquid is poured, and the sealing performance between the packaging assembly and the liquid hole at least meets the liquid sealing effect, and preferably achieves the gas sealing effect. The effect of gas sealing is achieved, so that molecules formed by gasification can not leak when the heat dissipation liquid is gasified, and the amount of the heat dissipation liquid in the flexible metal pipe 110 is stably maintained.
As shown in fig. 3 or fig. 4, an embodiment of the present invention provides an electronic device, including:
any one of the above technical solutions provides the heat dissipation structure 210;
a heat generating component 220 disposed adjacent to the at least one flexible metal tube in the heat dissipating structure 210.
The flexible metal tubes in heat-generating component 220 and heat-dissipating structure 210 are attached to each other and adjacently disposed, and when the flexible metal tubes are under the hydraulic pressure of the heat-dissipating liquid, the flexible metal tubes are expanded to be attached to heat-generating component 220, so that rapid heat dissipation is achieved.
For example, the heat-generating component is one or more memory banks. Of course, in specific implementations, the heat generating component is not limited to the memory bank, and may be a hard disk, a printed circuit, or a processor, or other components that may generate a large amount of heat.
The electronic device provided by the embodiment can be various types of mobile terminals or fixed terminals. The mobile terminal may include a laptop, a tablet, a cell phone, or a wearable device. The fixed terminal can comprise a desktop computer, a network television or other information processing devices needing heat dissipation.
As shown in fig. 5, the present embodiment provides an assembling method of an electronic device, including:
step S110: a flexible metal pipe of a heat dissipation structure is arranged at the adjacent position of the heat generating component;
step S120: after the flexible metal pipe is installed, heat dissipation liquid is filled into the flexible metal pipe, so that the flexible metal pipe deforms under the hydraulic pressure of the heat dissipation liquid and is attached to the outer surface of the heat generating component.
In this embodiment, the flexible metal tube not filled with the heat dissipation liquid is installed at the adjacent position of the heat-generating component, and after the installation, the heat dissipation liquid is filled in the flexible metal tube with the installed number, so that the flexible metal tube expands through the filling of the heat dissipation liquid, and then is well attached to the heat-generating component, thereby ensuring the heat dissipation effect.
The flexible metal pipe which is not filled with the heat dissipation liquid is installed well, and the flexible metal pipe is convenient to install due to the fact that the diameter of the flexible metal pipe is small at the moment. After the heat dissipation liquid is installed, the flexible metal pipe can be expanded by the hydraulic pressure of the heat dissipation liquid, and the fitting degree of the flexible metal pipe and the heat-generating component can be ensured by controlling the capacity of the heat dissipation liquid.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all the functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may be separately used as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (6)
1. A heat dissipation structure, comprising:
the flexible metal pipe is used for filling heat dissipation liquid, at least one surface of the flexible metal pipe is in contact with the heat-generating component, and the flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid so as to be attached to the outer surface of the heat-generating component;
the number of the flexible metal tubes is N, and N is an integer not less than 2; the nth flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid to be attached to the nth-1 and nth heat generating components; n is an integer not less than 2 and less than N;
the metal radiator is connected with the flexible metal pipe and used for transferring heat absorbed by the radiating liquid;
the flexible metal pipe is provided with a liquid hole and a packaging assembly for sealing the liquid hole, and the liquid hole can be used for filling and leading out the heat dissipation liquid; the packaging assembly is used for packaging the heat dissipation liquid after the heat dissipation liquid is filled.
2. The heat dissipation structure according to claim 1,
the heat-generating component includes one or more memory banks.
3. The heat dissipation structure according to claim 1 or 2,
the metal radiator comprises a first metal radiating plate, a second metal radiating plate and a third metal radiating plate; the first metal heat dissipation plate and the second metal heat dissipation plate are connected with different ends of the third metal heat dissipation plate;
the N flexible metal pipes are in contact with the third metal heat dissipation plate;
the 1 st flexible metal pipe is in contact with the first metal heat dissipation plate;
the Nth flexible metal tube is in contact with the second metal heat dissipation plate.
4. An electronic device, comprising:
the heat dissipation structure of any one of claims 1 to 3;
a heat generating component disposed adjacent to the at least one flexible metal tube in the heat dissipating structure.
5. The electronic device of claim 4,
the heat generating component is one or more memory banks.
6. A method of assembling an electronic device, comprising:
a flexible metal pipe of a heat dissipation structure is arranged at the adjacent position of the heat generating component; the number of the flexible metal tubes is N, and N is an integer not less than 2; the nth flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid to be attached to the nth-1 and nth heat generating components; n is an integer not less than 2 and less than N;
after the flexible metal pipe is installed, filling heat dissipation liquid into the flexible metal pipe, so that the flexible metal pipe deforms under the hydraulic pressure of the heat dissipation liquid and is attached to the outer surface of the heat generating component;
the flexible metal pipe is provided with a liquid hole and a packaging assembly for sealing the liquid hole, and the liquid hole can be used for filling and leading out the heat dissipation liquid; the packaging assembly is used for packaging the heat dissipation liquid after the heat dissipation liquid is filled.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710074435.4A CN106686954B (en) | 2017-02-10 | 2017-02-10 | Heat dissipation structure, electronic equipment and assembling method thereof |
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| CN201710074435.4A CN106686954B (en) | 2017-02-10 | 2017-02-10 | Heat dissipation structure, electronic equipment and assembling method thereof |
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| CN106686954A CN106686954A (en) | 2017-05-17 |
| CN106686954B true CN106686954B (en) | 2020-09-25 |
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| CN113615326B (en) * | 2021-06-29 | 2023-03-24 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
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| CN101179920A (en) * | 2006-11-10 | 2008-05-14 | 国际商业机器公司 | Apparatus and method for cooling heat generating equipment |
| CN203165947U (en) * | 2013-02-19 | 2013-08-28 | 杭州龙尚光电有限公司 | Novel LED heat radiation structure |
| CN104754925A (en) * | 2015-03-31 | 2015-07-01 | 联想(北京)有限公司 | Electronic device |
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| CN205693973U (en) * | 2016-06-28 | 2016-11-16 | 广州市博声电子科技开发有限公司 | A kind of pcb board assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105458935B (en) * | 2015-12-28 | 2017-10-13 | 宁波鑫晟工具有限公司 | The convenient sanding machine of one kind radiating |
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- 2017-02-10 CN CN201710074435.4A patent/CN106686954B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101179920A (en) * | 2006-11-10 | 2008-05-14 | 国际商业机器公司 | Apparatus and method for cooling heat generating equipment |
| CN203165947U (en) * | 2013-02-19 | 2013-08-28 | 杭州龙尚光电有限公司 | Novel LED heat radiation structure |
| CN104754925A (en) * | 2015-03-31 | 2015-07-01 | 联想(北京)有限公司 | Electronic device |
| CN205693973U (en) * | 2016-06-28 | 2016-11-16 | 广州市博声电子科技开发有限公司 | A kind of pcb board assembly |
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