CN110446398B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- CN110446398B CN110446398B CN201910655949.8A CN201910655949A CN110446398B CN 110446398 B CN110446398 B CN 110446398B CN 201910655949 A CN201910655949 A CN 201910655949A CN 110446398 B CN110446398 B CN 110446398B
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- 230000017525 heat dissipation Effects 0.000 title claims description 39
- 239000012530 fluid Substances 0.000 claims abstract description 59
- 230000005514 two-phase flow Effects 0.000 claims abstract description 31
- 238000000926 separation method Methods 0.000 claims abstract description 26
- 238000012545 processing Methods 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000004512 die casting Methods 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 description 10
- 239000012071 phase Substances 0.000 description 9
- 238000005192 partition Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipating device, which comprises a base, wherein the base is provided with a first chamber, the first chamber is provided with a plurality of separation parts for separating the first chamber into a plurality of separation chambers, the plurality of separation chambers are not communicated with each other, the plurality of separation chambers are provided with a first working fluid, the upper side of the base is provided with a plurality of two-phase flow heat dissipating fins, the interiors of the plurality of two-phase flow heat dissipating fins are respectively provided with a second chamber, and the plurality of separation chambers and the plurality of second chambers are selected to be communicated with each other or not communicated with each other, so that a better heat dissipating effect can be achieved.
Description
Technical Field
The invention relates to a heat dissipating device, in particular to a heat dissipating device with good heat dissipating effect, wherein heat dissipating chambers are arranged inside heat dissipating fins and a base for working fluid to circulate.
Background
With the progress of technology, the operation function and efficiency of the existing mobile device, personal computer, server, communication chassis, base station or other systems or devices are gradually strong, and the internal heating elements (such as but not limited to chips and various power elements) generate high heat during operation, so that the heat of the heating elements must be dissipated first, in order to prevent the heating elements from overheating and causing the heating elements to fail, a heat dissipating device is usually installed on the heating elements, so as to increase the service life of the heating elements.
The existing heat dissipating device is provided with solid heat dissipating fins on the upper side of the temperature equalizing plate, and the heat dissipating effect is increased by enlarging the heat dissipating area by the solid heat dissipating fins, or a fan is further arranged to generate larger air flow to dissipate heat, however, the existing mobile equipment, personal computer, server, communication case, base station or other systems or devices are not suitable for being provided with fans because of small internal space, and the solid heat dissipating fins can be affected by the heat conductivity coefficient of the material, so that the existing heat dissipating device provided with the solid heat dissipating fins on the upper side of the temperature equalizing plate is not in accordance with the technical requirements of future industries.
Therefore, how to solve the above problems is the direction of force required by those skilled in the art.
Disclosure of Invention
An object of the present invention is to provide a heat dissipating device that does not affect the heat dissipating effect due to the thermal conductivity of the material itself in a small space and a low wind flow environment.
In order to achieve the above object, the present invention provides a heat dissipating device, comprising:
The base is provided with a first chamber, the first chamber is provided with a plurality of separation parts for separating the first chamber into a plurality of separation chambers, the plurality of separation chambers are not communicated with each other, the plurality of separation chambers are provided with a first working fluid, the upper side of the base is provided with a plurality of two-phase flow heat dissipation fins, the inside of each of the plurality of two-phase flow heat dissipation fins is provided with a second chamber, and the plurality of separation chambers and the plurality of second chambers are selected to be communicated with each other and are not communicated with each other.
The heat dissipation device comprises: the base is provided with an upper plate, a lower plate and a concave part, the upper plate and the lower plate are correspondingly covered, the concave part is selectively arranged on any one of the upper plate and the lower plate in a concave mode, the upper plate, the lower plate and the concave part jointly define the first cavity, and the plurality of separation parts are selectively formed on any one of the upper plate and the lower plate.
The heat dissipation device comprises: the substrate and the plurality of two-phase flow heat dissipation fins are integrally formed.
The heat dissipation device comprises: the first chamber is provided with a first capillary structure which is selected from any one or any combination of a grid body or a fiber body or a structure body or a groove with porous property.
The heat dissipation device comprises: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one or any combination of a grid body, a fiber body, a structure body with porous property or a groove.
The heat dissipation device comprises: the device also comprises a coating film which is correspondingly arranged on the inner walls of the first chamber and the second chamber or any one of the first capillary structure and the second capillary structure or the inner walls of the first chamber and the second chamber and the first capillary structure and the second capillary structure.
The heat dissipation device comprises: the first working fluid is selected as any one of gas-phase fluid and gas-liquid two-phase change fluid.
The heat dissipation device comprises: the plurality of separation chambers are not communicated with the plurality of second chambers, and the plurality of second chambers are provided with a second working fluid.
The heat dissipation device comprises: the second working fluid is selected as any one of gas-phase fluid and gas-liquid two-phase change fluid.
The heat dissipation device comprises: the plural two-phase flow radiating fins are formed by a mechanical processing mode, wherein the mechanical processing mode is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation processing.
The heat dissipation device comprises: the base and the plural two-phase flow radiating fins are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.
In order to achieve the above object, the present invention further provides a heat dissipating device, comprising:
The base is provided with a first chamber, the first chamber is a single independent chamber, the first chamber is provided with a first working fluid, the upper side of the base is provided with a plurality of two-phase flow radiating fins, the inside of each of the plurality of two-phase flow radiating fins is respectively provided with a second chamber, each of the plurality of second chambers is provided with a second working fluid, and the single independent chamber and the plurality of second chambers are not communicated with each other.
The heat dissipation device comprises: the base is provided with an upper plate, a lower plate and a concave part, wherein the upper plate and the lower plate are correspondingly covered, the concave part is selectively arranged on any one of the upper plate and the lower plate in a concave mode, and the upper plate, the lower plate and the concave part jointly define the first chamber.
The heat dissipation device comprises: the substrate and the plurality of heat sinks are integrally formed.
The heat dissipation device comprises: the first chamber is provided with a first capillary structure which is selected from any one or any combination of a grid body or a fiber body or a structure body or a groove with porous property.
The heat dissipation device comprises: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one or any combination of a grid body, a fiber body, a structure body with porous property or a groove.
The heat dissipation device comprises: the device also comprises a coating film which is correspondingly arranged on the inner walls of the first chamber and the second chamber or any one of the first capillary structure and the second capillary structure or the inner walls of the first chamber and the second chamber and the first capillary structure and the second capillary structure.
The heat dissipation device comprises: the first working fluid and the second working fluid are selected as any one of gas-phase fluid and gas-liquid two-phase change fluid.
The heat dissipation device comprises: the plurality of heat dissipation elements are formed by a mechanical processing mode, wherein the mechanical processing mode is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation processing.
The heat dissipation device comprises: the base and the plurality of heat dissipation elements are respectively made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.
By means of the design, compared with the existing solid radiating fins, the heat-conducting fin can not be influenced by the heat conductivity coefficient of the material in the environment with small space and low wind flow, and the effect of better radiating effect is achieved.
The following drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. Specific embodiments of the present invention will be described in detail herein with reference to the accompanying drawings and by way of illustration of the principles of the invention.
Drawings
FIG. 1 is a perspective view of a first embodiment of a heat dissipating device according to the present invention;
FIG. 2 is a combined cross-sectional view of a first embodiment of the heat sink of the present invention;
FIG. 3 is a combined cross-sectional view of a second embodiment of the heat dissipating device of the present invention;
FIG. 4 is a combined cross-sectional view of a third embodiment of the heat sink of the present invention;
FIG. 5 is a combined cross-sectional view of a fourth embodiment of the heat dissipating device of the present invention;
FIG. 6 is a combined cross-sectional view of a fourth embodiment of the heat dissipating device of the present invention;
Fig. 7 is a combined cross-sectional view of a fourth embodiment of the heat dissipating device of the present invention.
Reference numerals illustrate: a heat dissipating device 1; a base 11; an upper plate 111; a lower plate 112; a recess 113; a first chamber 114; a partition 115; dividing the chamber 116; a single independent chamber 117; a first capillary structure 118; two-phase flow heat sink fins 12; a second chamber 121; a second working fluid 122; a second capillary structure 123; the first working fluid 13.
Detailed Description
The above objects of the present invention, as well as the structural and functional characteristics thereof, will be described in terms of the preferred embodiments of the present invention as illustrated in the accompanying drawings.
Please refer to fig. 1 and 2, which are a perspective combination diagram and a sectional view of a first embodiment of a heat dissipating device according to the present invention, as shown in the drawings, the heat dissipating device 1 according to the present invention is applied to a heat source of an electronic device to be dissipated, and the heat dissipating device 1 according to the present embodiment is contacted and attached to one or a plurality of heat generating elements (not shown) disposed on a board (e.g. a circuit board or a motherboard) of the electronic device to dissipate heat from the heat generating elements. The heating element is not limited to the cpu and the display processing chip, and in the implementation, the heating element may be selected from transistors or power devices on a north-south bridge chip or a circuit board or other electronic devices requiring heat dissipation.
The heat dissipation device 1 comprises a base 11, a plurality of two-phase flow heat dissipation fins 12 and a first working fluid 13, wherein the base 11 has an upper plate 111, a lower plate 112, a recess 113 and a first chamber 114.
The upper plate 111 and the lower plate 112 are correspondingly covered, the upper plate 111 on the upper side of the base 11 is provided with the plurality of two-phase flow heat dissipation fins 12, and the lower side of the lower plate 112 is used for being attached to the heating element to absorb heat. In this embodiment, the recess 113 is selected to be recessed in the lower plate 112, and in other embodiments, the recess 113 may be selected to be recessed in the upper plate 111, and the first chamber 114 may be defined by the upper plate 111, the lower plate 111, 112, and the recess 113. The first chamber 114 has a plurality of partitions 115 to divide the first chamber 114 into a plurality of partitioned chambers 116, and in this embodiment, the plurality of partitions 115 are selectively formed on the lower plate 112, and in other embodiments, the plurality of partitions 115 may be selectively formed on the upper plate 111. The plurality of separation chambers 116 are not communicated with each other, and the plurality of separation chambers 116 are provided with the first working fluid 13, and the first working fluid 13 is selected to be either a gas phase fluid or a gas-liquid two-phase change fluid.
The two-phase flow heat dissipation fins 12 are respectively formed with a second chamber 121 therein, and the plurality of separation chambers 116 are mutually communicated with the plurality of second chambers 121. The plural two-phase flow heat sink fins 12 are formed by machining, which is any one of aluminum extrusion, stamping, die casting, drawing, injection, and inflation. The base 11 and the plural two-phase flow radiating fins 12 are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel. In the present embodiment, the plurality of two-phase flow fins 12 are shown to be bonded to the upper plate 111, and the plurality of two-phase flow fins 12 are bonded to the upper plate 111 by, for example, but not limited to, welding, caulking, clamping, gluing, or fastening, and in other embodiments, the substrate 11 and the plurality of two-phase flow fins 12 are integrally formed by 3D printing.
By virtue of the design of the invention, after the lower side of the base 11 absorbs heat, the first working fluid 13 absorbs the heat of the base 11 in the plurality of separation chambers 116, the first working fluid 13 rapidly transfers the heat to the horizontal direction to achieve the effect of uniform temperature, meanwhile, the first working fluid 13 enters the plurality of second chambers 121, the first working fluid 13 entering the plurality of second chambers 121 rapidly transfers the heat to the vertical direction, and the plurality of two-phase flow heat dissipation fins 12 absorb the heat of the first working fluid 13 and radiate the heat to the outside, so that the heat dissipation device 1 of the invention can not be influenced by the heat conductivity coefficient of the material in the environment with small space and low wind flow rate to achieve the effect of better heat dissipation effect.
Please refer to fig. 3, which is a sectional view of a second embodiment of the heat dissipating device of the present invention, and is supplemented with fig. 1 to 2, as shown in the drawings, the structure and function of a portion of the present embodiment are the same as those of the first embodiment, so that the description will not be repeated herein, but the difference between the present embodiment and the first embodiment is that the plurality of separating chambers 116 are not communicated with the plurality of second chambers 121, the plurality of second chambers 121 are provided with a second working fluid 122, and the second working fluid 122 is selected to be either a gas phase fluid or a gas-liquid phase fluid.
After the heat is absorbed by the lower side of the base 11, the first working fluid 13 absorbs the heat of the base 11 in the plurality of separation chambers 116, and at the same time, the lower side of the plurality of two-phase flow heat dissipation fins 12 absorbs the heat of the base 11, the second working fluid 122 rapidly transfers the heat to the vertical direction, and the plurality of two-phase flow heat dissipation fins 12 absorb the heat of the second working fluid 122 and radiate the heat to the outside, because the plurality of separation chambers 116 are not communicated with the plurality of second chambers 122, the first working fluid 13 rapidly transfers the heat to the horizontal direction to achieve the effect of uniform temperature, and the distance that the first working fluid 13 condenses and flows back to the lower plate 112 from the upper plate 111 is shorter, so that the first working fluid 13 with a lower temperature of the heating element can rapidly provide heat absorption.
Please refer to fig. 4, which is a cross-sectional view of a third embodiment of the heat dissipating device of the present invention, and is aided with fig. 3, and as shown in the drawings, part of the structure and functions of the present embodiment are the same as those of the second embodiment, so that the description will not be repeated herein, but the difference between the present embodiment and the second embodiment is that the first chamber 114 is a single independent chamber 117 without a partition 116, and the single independent chamber 117 and the plurality of second chambers 121 are not communicated with each other.
The first working fluid 13 can rapidly transfer heat to the surrounding horizontal direction in the single independent chamber 116 to achieve the effect of uniform temperature.
Referring to fig. 5 to fig. 7, which are sectional views of a fourth embodiment of the heat dissipating device of the present invention, and are supplemented with fig. 1 to fig. 4, as shown in the drawings, the partial structures and functions of the present embodiment are the same as those of the first, second and third embodiments, respectively, so that the description will not be repeated herein, but the difference between the present embodiment and the first, second and third embodiments is that the first chamber 114 is provided with a first capillary structure 118, the plurality of second chambers 121 are respectively provided with a second capillary structure 123, and the first and second capillary structures 118, 123 are respectively selected as any one or any combination of a mesh body, a fiber body, a porous structure or a groove.
When the plurality of separation chambers 116 and the plurality of second chambers 121 are in communication with each other, the first capillary structure and the second capillary structure 118, 123 are connected to each other by capillary (as shown in fig. 5), so that the first working fluid 13 condensed in the plurality of second chambers 121 can be quickly returned to the plurality of separation chambers 116 by the first capillary structure and the second capillary structure 118, 123. When the plurality of separate chambers 116 (as shown in fig. 6) or the single independent chamber 117 (as shown in fig. 7) is not in communication with the plurality of second chambers 121, the first capillary structure 118 can quickly return the first working fluid 13 condensed on the upper plate 111 to the lower plate 112, and the second capillary structure 123 can quickly return the second working fluid 122 condensed on the second chamber 121 to the lower portion of the second chamber 121.
The term "capillary connection" refers to the connection between the porous structure of the first capillary structure 118 and the porous structure of the second capillary structure 123, so that capillary force can be transferred from the first capillary structure 118 or extend to the two capillary structures 123.
In an alternative embodiment, the second capillary structure 123 may be omitted, and the first and second working fluids 13, 122 may be returned by gravity.
In another alternative embodiment, a plating film (not shown) is correspondingly disposed on the inner walls of the first chamber, the second chamber 114, 121 or on any one of the first capillary structure, the second capillary structure 118, 123 or on both the inner walls of the first chamber, the second chamber 114, 121 and the first capillary structure, the second capillary structure 118, 123, so as to increase the hydrophilicity of the inner walls of the first chamber, the second chamber 114, 121 and the first capillary structure, the second capillary structure 118, 123, thereby achieving the effect of fast concentrated backflow of the first working fluid, the second working fluid 13, 122.
The above description is illustrative of the invention and is not to be construed as limiting, and it will be understood by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (20)
1. A heat sink, comprising:
The base is provided with a first chamber, the first chamber is provided with a plurality of separation parts for separating the first chamber into a plurality of separation chambers, the plurality of separation chambers are not communicated with each other, the plurality of separation chambers are provided with a first working fluid, the upper side of the base is provided with a plurality of two-phase flow heat dissipation fins, the inside of each of the plurality of two-phase flow heat dissipation fins is provided with a second chamber, and the plurality of separation chambers and the plurality of second chambers are selected to be not communicated with each other.
2. The heat sink as recited in claim 1, wherein: the base is provided with an upper plate, a lower plate and a concave part, the upper plate and the lower plate are correspondingly covered, the concave part is selectively arranged on any one of the upper plate and the lower plate in a concave mode, the upper plate, the lower plate and the concave part jointly define the first cavity, and the plurality of separation parts are selectively formed on any one of the upper plate and the lower plate.
3. The heat sink as recited in claim 1, wherein: the base and the plurality of two-phase flow heat dissipation fins are integrally formed.
4. The heat sink as recited in claim 1, wherein: the first chamber is provided with a first capillary structure which is selected from any one or any combination of a grid body or a fiber body or a structure body or a groove with porous property.
5. The heat sink as recited in claim 4, wherein: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one or any combination of a grid body, a fiber body, a structure body with porous property or a groove.
6. The heat sink as recited in claim 5, wherein: the device also comprises a coating film which is correspondingly arranged on the inner walls of the first chamber and the second chamber or any one of the first capillary structure and the second capillary structure or the inner walls of the first chamber and the second chamber and the first capillary structure and the second capillary structure.
7. The heat sink as recited in claim 1, wherein: the first working fluid is selected as any one of gas-phase fluid and gas-liquid two-phase change fluid.
8. The heat sink as recited in claim 1, wherein: the plurality of second chambers are provided with a second working fluid.
9. The heat sink as recited in claim 8, wherein: the second working fluid is selected as any one of gas-phase fluid and gas-liquid two-phase change fluid.
10. The heat sink as recited in claim 1, wherein: the plural two-phase flow radiating fins are formed by a mechanical processing mode, wherein the mechanical processing mode is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation processing.
11. The heat sink as recited in claim 1, wherein: the base and the plural two-phase flow radiating fins are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.
12. A heat sink, comprising:
The base is provided with a first chamber, the first chamber is a single independent chamber, the first chamber is provided with a first working fluid, the upper side of the base is provided with a plurality of two-phase flow radiating fins, the inside of each of the plurality of two-phase flow radiating fins is respectively provided with a second chamber, each of the plurality of second chambers is provided with a second working fluid, and the single independent chamber and the plurality of second chambers are not communicated with each other.
13. The heat sink as recited in claim 12, wherein: the base is provided with an upper plate, a lower plate and a concave part, wherein the upper plate and the lower plate are correspondingly covered, the concave part is selectively arranged on any one of the upper plate and the lower plate in a concave mode, and the upper plate, the lower plate and the concave part jointly define the first chamber.
14. The heat sink as recited in claim 12, wherein: the base and the plurality of two-phase flow heat dissipation fins are integrally formed.
15. The heat sink as recited in claim 12, wherein: the first chamber is provided with a first capillary structure which is selected from any one or any combination of a grid body or a fiber body or a structure body or a groove with porous property.
16. The heat sink as recited in claim 15, wherein: the plurality of second chambers are respectively provided with a second capillary structure, and the second capillary structure is selected from any one or any combination of a grid body, a fiber body, a structure body with porous property or a groove.
17. The heat sink as recited in claim 16, wherein: the device also comprises a coating film which is correspondingly arranged on the inner walls of the first chamber and the second chamber or any one of the first capillary structure and the second capillary structure or the inner walls of the first chamber and the second chamber and the first capillary structure and the second capillary structure.
18. The heat sink as recited in claim 12, wherein: the first working fluid and the second working fluid are selected as any one of gas-phase fluid and gas-liquid two-phase change fluid.
19. The heat sink as recited in claim 12, wherein: the plural two-phase flow radiating fins are formed by a mechanical processing mode, wherein the mechanical processing mode is any one of aluminum extrusion, stamping, die casting, drawing, injection and inflation processing.
20. The heat sink as recited in claim 12, wherein: the base and the plural two-phase flow radiating fins are made of any one of gold, silver, copper alloy, aluminum alloy, commercial pure titanium, titanium alloy and stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910655949.8A CN110446398B (en) | 2019-07-19 | 2019-07-19 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910655949.8A CN110446398B (en) | 2019-07-19 | 2019-07-19 | Heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110446398A CN110446398A (en) | 2019-11-12 |
| CN110446398B true CN110446398B (en) | 2024-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910655949.8A Active CN110446398B (en) | 2019-07-19 | 2019-07-19 | Heat dissipation device |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240008214A1 (en) * | 2021-01-04 | 2024-01-04 | Telefonaktiebolaget Lm Ericsson (Publ) | Heatsink and Communication Device having the Heatsink |
| CN114760803A (en) * | 2021-01-08 | 2022-07-15 | 华为技术有限公司 | Radiator and communication equipment |
| CN113543597A (en) * | 2021-07-15 | 2021-10-22 | 奇鋐科技股份有限公司 | cooling module |
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| TWM394501U (en) * | 2010-07-21 | 2010-12-11 | Asia Vital Components Co Ltd | Improvement on heat dissipation structure |
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