CN106675003B - A thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for a laminated busbar, and a preparation method of the insulating adhesive film - Google Patents
A thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for a laminated busbar, and a preparation method of the insulating adhesive film Download PDFInfo
- Publication number
- CN106675003B CN106675003B CN201611246836.5A CN201611246836A CN106675003B CN 106675003 B CN106675003 B CN 106675003B CN 201611246836 A CN201611246836 A CN 201611246836A CN 106675003 B CN106675003 B CN 106675003B
- Authority
- CN
- China
- Prior art keywords
- bus bar
- insulated rubber
- stack bus
- film
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 81
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 81
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 76
- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title abstract description 23
- 239000002313 adhesive film Substances 0.000 title 2
- 229920001971 elastomer Polymers 0.000 claims abstract description 84
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 63
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920001225 polyester resin Polymers 0.000 claims abstract description 45
- 239000004645 polyester resin Substances 0.000 claims abstract description 45
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 32
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 20
- 239000003063 flame retardant Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 31
- 239000007787 solid Substances 0.000 claims description 30
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 27
- 238000009413 insulation Methods 0.000 claims description 26
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 22
- 229910000410 antimony oxide Inorganic materials 0.000 claims description 22
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical group [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims description 22
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 21
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 16
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 16
- 238000004804 winding Methods 0.000 claims description 15
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 14
- 238000004026 adhesive bonding Methods 0.000 claims description 14
- 230000004044 response Effects 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 13
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 13
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 13
- 239000000347 magnesium hydroxide Substances 0.000 claims description 13
- 239000007800 oxidant agent Substances 0.000 claims description 13
- 230000001590 oxidative effect Effects 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 10
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 10
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 10
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 10
- 235000019441 ethanol Nutrition 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 8
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- 229920006290 polyethylene naphthalate film Polymers 0.000 claims description 7
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 claims description 6
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 229960004063 propylene glycol Drugs 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- -1 glycol ester Chemical class 0.000 claims description 4
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 4
- 150000004692 metal hydroxides Chemical class 0.000 claims description 4
- 230000000979 retarding effect Effects 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- 150000008301 phosphite esters Chemical class 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 2
- 229920001400 block copolymer Polymers 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- 150000004985 diamines Chemical class 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- WLLGXSLBOPFWQV-UHFFFAOYSA-N MGK 264 Chemical compound C1=CC2CC1C1C2C(=O)N(CC(CC)CCCC)C1=O WLLGXSLBOPFWQV-UHFFFAOYSA-N 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 150000002576 ketones Chemical group 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 16
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 229920006254 polymer film Polymers 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 114
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 22
- 229920000728 polyester Polymers 0.000 description 21
- 239000010410 layer Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 239000006185 dispersion Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000003292 glue Substances 0.000 description 10
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 230000032683 aging Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 150000003440 styrenes Chemical class 0.000 description 7
- 238000005336 cracking Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 239000011112 polyethylene naphthalate Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 238000012797 qualification Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229920000784 Nomex Polymers 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000004087 circulation Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004763 nomex Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000005909 ethyl alcohol group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000006263 metalation reaction Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XXFKYQVWZOJMRR-UHFFFAOYSA-N OC1=CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O.[Br] Chemical compound OC1=CC=C(C=C1)C(C)(C)C1=CC=C(C=C1)O.[Br] XXFKYQVWZOJMRR-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000001246 bromo group Chemical class Br* 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 125000005543 phthalimide group Chemical class 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
Abstract
The present invention provides a kind of thermoplastic resin composition, and according to mass fraction meter, thermoplastic resin composition includes 40~80 parts of copolyamide resin, 5~35 parts of saturated polyester resin, 1~10 part of compatilizer, 20~100 parts of fire retardant and 0.1~1 part of antioxidant.Copolyamide resin has very highly polar, and intermolecular force is strong, can form part crystalline texture, has higher melt, good with metal adhesive performance, but poor with thin polymer film cementability；And saturated polyester resin fusing point is lower, polarity is relatively weak, has preferable cementability with thin polymer film；The compatibility between copolyamide resin and saturated polyester resin can be improved in compatilizer, improves the cohesive strength of thermoplastic resin composition.The thermoplastic resin composition is free of curing agent, and temperature flowing is good, can low temperature pressing.The present invention also provides the preparation methods of a kind of adhesive using above-mentioned thermoplastic resin composition production and stack bus bar insulated rubber film and stack bus bar insulated rubber film.
Description
Technical field
The present invention relates to stack bus bar insulated rubber film field more particularly to a kind of thermoplastic resin composition and its preparations
Adhesive, stack bus bar insulated rubber film, the preparation method of the insulated rubber film.
Background technique
Stack bus bar is also referred to as composite bus bar, laminated bus bars, composite copper bar, composite bus etc., English name
Laminated Busbar.It is mainly based upon electromagnetic theory, and not only wide but also thin copper bar and very thin insulating materials are hot pressed into
It integrally forms, by opposite electric current in adjacent wires, magnetic field is cancelled out each other, and parasitic inductance can be made to reduce.As lamination mother
The insulated rubber film of bonding and insulating materials in row between conductor, performance quality have the safety and reliability of stack bus bar
Vital influence.Insulated rubber film is mainly made of insulation film with the adhesive coated in its surface.Currently, it is used for
The adhesive of stack bus bar insulated rubber film is mainly epoxies adhesive and polyester-class adhesive.Epoxies adhesive is a kind of heat
Solidity adhesive has many advantages, such as that good adhesive property, Good Heat-resistance, electrical insulation capability is good, dielectric properties are excellent, but
There are Storage periods it is short, pressing time is long, pressing-in temp is high the disadvantages of so that its in stack bus bar insulated rubber film application by
To limitation.Saturated polyester class adhesive is a kind of thermoplastic adhesive, although it is excellent to have that storage time is long, pressing time is short etc.
Point, but the high temperature bonding performance of saturated polyester class adhesive is generally poor, it is also difficult to meet stack bus bar insulated rubber film
Application requirement.
In order to improve the high temperature bonding performance of saturated polyester class adhesive, generally use at present with epoxy blend or
The mode for adding a small amount of curing agent forms it into interpenetrating polymer networks structure or generates partial cross-linked to improve saturated polyester
The high temperature resistance of class adhesive.As Chinese patent CN104178044A discloses a kind of epoxy-modified saturated polyester resin gluing
Agent is prepared by each component of following mass percent: saturated polyester resin A20-50%, saturated polyester resin B5-30%,
Epoxy resin 2-20%, isocyanates 1-10%, fire retardant 20-70%, dispersing agent 0.05-5%, being scattered in by said ratio has
In solvent, stack bus bar is obtained with epoxy-modified saturated polyester adhesive.But epoxy resin open loop and isocyanates is anti-
It answers temperature usually above 200 DEG C, is difficult to form interpenetrating polymer networks structure with saturated polyester resin to improve at relatively low temperatures
The high-temperature behavior of saturated polyester adhesive system；And epoxy resin modification is added in saturated polyester resin, it may cause modified adhesive
Stick becomes fragile, and storge quality declines.For another example Chinese patent CN105176468A and CN105199649A then discloses one kind and adopts
Saturated polyester resin is formed with the method for addition anhydride curing agent partial cross-linked, but totally still keep thermoplasticity, it can be significant
Improve the high temperature bonding performance of saturated polyester adhesive.Addition curing agent makes saturated polyester resin form part cross-linked network knot
Structure can no doubt be such that the high temperature bonding performance of saturated polyester adhesive is improved, but saturated polyester adhesive is before pressing
With regard to forming part cross-linked network structure, although overall keep thermoplasticity, it has formed certain three-dimensional net structure, has not had
Sharp melting point, mobility and wellability under high temperature are greatly reduced, and generally need to be just able to achieve in 150 DEG C or more pressings and effectively be glued
It connects.Pressing-in temp increases, and not only energy consumption is brought to rise, but also pressing will lead under polymer thin film properties for a long time under high temperature
Drop.In addition, need multiple high temp pressing that could form in many cases as the structure of stack bus bar becomes to become increasingly complex,
Excessively high pressing-in temp will lead to product qualified rate reduction.
Therefore, how to realize is not reducing the high-temperature behavior of thermoplastic resin composition and stack bus bar insulated rubber film
Under the premise of, reducing pressing-in temp, reducing pressing time is one of critical issue urgently to be resolved in industry.
Summary of the invention
One of the objects of the present invention is to provide a kind of thermoplastic resin compositions；The second object of the present invention is to provide
A kind of adhesive made of above-mentioned thermoplastic resin composition；The third object of the present invention is to provide a kind of using above-mentioned
The stack bus bar insulated rubber film of thermoplastic resin composition's production；The fourth object of the present invention is to provide the stack bus bar
With the preparation method of insulated rubber film.Stack bus bar insulated rubber film uses above-mentioned thermoplastic resin composition, pressing temperature
It spends that low, pressing time is short, and there is excellent high temperature peel strength, processing performance and cooling thermal impact performance, low temperature pressure can be met
Close the application requirement of stack bus bar.
To realize that the purpose, the present invention provide a kind of thermoplastic resin composition, according to mass fraction meter, the thermoplasticity
Resin combination includes 40~80 parts of copolyamide resin, such as 45 parts, 50 parts, 55 parts, 58 parts, 60 parts, 65 parts, 70 parts, 75
Part or 79 parts；5~35 parts of saturated polyester resin, for example, 6 parts, 8 parts, 10 parts, 15 parts, 18 parts, 20 parts, 25 parts, 30 parts or 34
Part；1~10 part of compatilizer, for example, 2 parts, 3 parts, 5 parts, 6 parts, 7 parts, 8 parts or 9 parts；And 20~100 parts of fire retardant, such as
It is 21 parts, 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts or 99 parts.
Thermoplastic resin composition of the invention is using copolyamide as matrix resin, cooperation saturated polyester resin, compatible
Agent and fire retardant composition, wherein copolyamide resin has very highly polar, and intermolecular force is strong, can form partially crystallizable knot
Structure has higher melt, good with metal adhesive performance, but poor with thin polymer film cementability；And saturated polyester resin is molten
Point is lower, and polarity is relatively weak, has preferable cementability with thin polymer film；Compatilizer can be improved copolyamide resin and satisfy
Compatibility between polyester resin improves the cohesive strength of thermoplastic resin composition.With saturated polyester resin and copolyamide
The thermoplastic resin composition that resin is obtained as matrix resin, be free of curing agent, temperature flowing is good, can low temperature pressing, can
For stack bus bar adhesive, there is excellent high temperature peel strength, cooling thermal impact performance and processing performance.
Preferably, the number-average molecular weight Mn of the copolyamide resin be 10000~30000, fusing point Tm be 110 DEG C~
130 DEG C, such as 115 DEG C, 120 DEG C, 125 or 129 DEG C.Glass transition temperature Tg is -30 DEG C~40 DEG C, such as -30 DEG C, -20
DEG C, -10 DEG C, 0 DEG C, 10 DEG C, 20 DEG C, 30 DEG C or 39 DEG C, acid value be 2~15mgKOH/g, such as 3mgKOH/g, 5mgKOH/g,
10mgKOH/g, 12mgKOH/g or 14mgKOH/g；Amine value be 3~10mgKOH/g, such as 3mgKOH/g, 5mgKOH/g,
10mgKOH/g。
Preferably, the number-average molecular weight Mn of the saturated polyester resin is 8000~30000, glass transition temperature Tg
Between -30 DEG C~110 DEG C, such as -30 DEG C, -20 DEG C, -10 DEG C, 0 DEG C, 10 DEG C, 20 DEG C, 30 DEG C, 50 DEG C, 65 DEG C, 70 DEG C, 80
DEG C, 90 DEG C or 109 DEG C；Hydroxyl value is 2~10mgKOH/g, such as 2.5mgKOH/g, 3mgKOH/g, 5mgKOH/g, 10mgKOH/g.
The saturated polyester resin can preferably SK Chemical, South Korea manufacture ES450, ES850, ES750, ES901, ES600, ES120
Deng also S1611, S1426, S1313, L952, L912 etc. of Evonik company, Germany manufacture.
Preferably, the compatilizer is selected from one or both of response type compatilizer or non-reactive compatilizer.It is described
Response type compatilizer is low molecular weight carboxy blocking copolyamide resin, low molecular weight carboxy-terminated polyester resin, isocyanates
Graft copolymerization amide resin, isocyanates are grafted the mixture of any one or at least two in saturated polyester resin；It is described
Non-reactive compatilizer is the block copolymer that binary acid, dihydric alcohol and diamine copolyreaction obtain.
Preferably, the fire retardant include halogenated flame retardant, it is halogen system fire retarding synergist, any one in metal hydroxides
Kind or at least two mixture；The halogenated flame retardant is decabromodiphenylethane, brominated styrene, brominated epoxy resin, four
In the double tetrabromo phthalimides of bromine bisphenol-A, hexabromocyclododecane, ethylene any one or at least two mixture；
The halogen system fire retarding synergist be antimony oxide, in antimony pentoxide any one or at least two mixture；It is described
Metal hydroxides is the mixture of magnesium hydroxide, any one or two kinds in aluminium hydroxide.
Preferably, the thermoplastic resin composition further includes antioxidant, according to mass fraction meter, the antioxidant adds
Dosage is 0.1~1 part, such as 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part.It can extend folded
Layer busbar insulated rubber film service life, the progress of adhesive ageing process when slowing down or inhibits hot pressing, it is of the invention in preferably make
With Hinered phenols antioxidant 1010,1076,1098,2246 and phosphite ester antioxidant 168,618.
It is described the present invention also provides a kind of adhesive, including thermoplastic resin composition as described above and organic solvent
The solid content of adhesive is 30wt%~60wt%, preferably 35wt%~60wt%, can get suitable viscosity, provides good
Processability guarantees visual defects do not occur during using (as coated).
Preferably, the organic solvent is ethyl alcohol, propyl alcohol, isopropanol, butanol, n-amyl alcohol, cyclohexanol, isoamyl alcohol, second two
Alcohol, 1,2- propylene glycol, 1,3- propylene glycol, butanone, acetone, cyclohexanone, toluene, dimethylbenzene, glycol monoethyl ether, propylene glycol list first
Ether, propylene glycol monomethyl ether acetate, in ethyl acetate any one or at least two mixture.
The present invention also provides a kind of stack bus bar insulated rubber films, including insulation film and single or double are coated on described
Adhesive as described above on insulation film is formed by gluing oxidant layer.
Preferably, the insulation film is pet film (PET), polybutylene terephthalate
Ester film (PBT), polyethylene naphthalate film (PEN), Kapton (PI) or it is poly- between phenyl-diformyl isophthalic two
Amine film (NOMEX).
Preferably, the insulation film with a thickness of 100~250 μm, such as: 105 μm, 110 μm, 120 μm, 130 μm,
140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm or 249 μm；It is described
Gluing oxidant layer with a thickness of 10~50 μm, such as: 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.
The present invention also provides a kind of methods for preparing stack bus bar insulated rubber film as described above, which is characterized in that packet
Include step:
(1) copolyamide resin, saturated polyester resin, compatilizer, antioxidant and fire-retardant are weighed according to the mass fraction
Agent, is used cooperatively high shear and is dispersed with stirring equipment and mix it with organic solvent simultaneously using ball mill, jar mill or sand mill,
Adhesive is made；And
(2) the adhesive single or double is coated on insulating substrate, online drying oven is sent into, 80~160
DEG C heating 2~10 minutes, to remove the organic solvent, form solid gluing oxidant layer, winding obtains the stack bus bar and uses
Insulated rubber film.
Preferably, the organic solvent is ethyl alcohol, propyl alcohol, isopropanol, butanol, n-amyl alcohol, cyclohexanol, isoamyl alcohol, second two
Alcohol, 1,2- propylene glycol, 1,3- propylene glycol, butanone, acetone, cyclohexanone, toluene, dimethylbenzene, glycol monoethyl ether, propylene glycol list first
Ether, propylene glycol monomethyl ether acetate, in ethyl acetate any one or at least two mixture.
The prior art is compared, the invention has the following beneficial effects:
Contain copolyamide resin and saturated polyester resin, copolyamide resin in thermoplastic resin composition of the invention
With more highly polar, intermolecular force is strong, can form part crystalline texture, has higher melt, the adhesive property with metal
It is excellent, but it is poor with the adhesive property of insulation film；A small amount of saturated polyester resin is blended, and add a small amount of compatible
Agent, can be obtained the good thermoplastic resin composition of compatibility, which all has metal and insulation film
There is excellent adhesive property.In addition, the resin combination is free of curing agent, it is pure thermoplastic resin composition, using the thermoplastic
Property resin combination preparation insulated rubber film anti-flammability up to UL94VTM-0 grades, and pressing-in temp is low, adhesive property is good, together
When with excellent high temperature peel strength, dimensional stability and processability, can meet the needs of low temperature pressing stack bus bar.
Figure of description
Fig. 1 is the schematic diagram of stack bus bar insulated rubber film first embodiment of the present invention.
Fig. 2 is the schematic diagram of stack bus bar insulated rubber film second embodiment of the present invention.
Specific embodiment
The technical scheme of the invention is further explained by means of specific implementation.
Embodiment 1
A kind of thermoplastic resin composition, including 45 parts of copolyamide resin, the saturated polyester calculated according to mass fraction
30 parts of resin (ES450), 2 parts of non-reactive compatilizer, 10 parts of antimony oxide, 5 parts of aluminium hydroxide, decabromodiphenylethane 30
Part, 0.1 part of antioxidant.
The thermoplastic resin composition is applied to stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with butanone by described
Copolyamide resin, non-reactive compatilizer, antimony oxide, aluminium hydroxide, decabromodiphenylethane, resists saturated polyester resin
The liquid dispersion (solid content 45%) of oxygen agent composition, is blended into adhesive.
As shown in Figure 1, being again coated in the adhesive on the PET insulation film 10 with a thickness of 100 μm with coating machine single side, apply
Glue is with a thickness of 20 μm；
Then it is handled 5 minutes at 100 DEG C, so that butanone volatilizees, forms solid gluing oxidant layer on PET insulating film
20；
Finally winding obtains the stack bus bar insulated rubber film 1 of the thermoplastic resin composition.
Embodiment 2
A kind of thermoplastic resin composition, including 54 parts of copolyamide resin, the saturated polyester calculated according to mass fraction
The double tetrabromo-phthalic diformazans of 25 parts of resin (L912), 3 parts of response type compatilizer, 15 parts of antimony pentoxide, 5 parts of magnesium hydroxide, ethylene
35 parts of acid imide, 0.5 part of antioxidant.
The thermoplastic resin composition is applied to stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with acetone by described
The double tetrabromo-phthalic diformazans of copolyamide resin, saturated polyester resin, response type compatilizer, antimony pentoxide, magnesium hydroxide, ethylene
The liquid dispersion (solid content 40%) of acid imide, antioxidant composition, is blended into adhesive.
As shown in Fig. 2, be coated in the adhesive coating machine is two-sided on the PET insulation film 10 ' with a thickness of 188 μm again,
Rubberization thickness is 30 μm；
Then it is handled 8 minutes at 110 DEG C, so that acetone volatilizees, forms solid gluing oxidant layer on PET insulating film
20'；
Finally winding obtains the stack bus bar insulated rubber film 1 ' of the thermoplastic resin composition.
Embodiment 3
A kind of thermoplastic resin composition, including calculate according to the mass fraction 70 parts of copolyamide resin, saturated polyester tree
15 parts of rouge (S1426), 3 parts of response type compatilizer, 12 parts of antimony oxide, 10 parts of magnesium hydroxide, 40 parts of tetrabromobisphenol A, antioxygen
0.8 part of agent.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with cyclohexanone by institute
State copolyamide resin, saturated polyester resin, response type compatilizer, antimony oxide, magnesium hydroxide, tetrabromobisphenol A, antioxidant
The liquid dispersion (solid content 50%) of composition, is blended into adhesive.
The adhesive is coated on the PEN insulation film with a thickness of 100 μm with coating machine single side again, rubberization thickness is 40 μ
m；
Then it is handled 10 minutes at 160 DEG C, so that cyclohexanone volatilizees, forms solid adhesive on PEN insulating film
Layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 4
A kind of thermoplastic resin composition, including calculate according to the mass fraction 75 parts of copolyamide resin, saturated polyester tree
8 parts of rouge (ES120), 15 parts of antimony oxide, 10 parts of aluminium hydroxide, 26 parts of brominated styrene, resists 6 parts of non-reactive compatilizer
0.8 part of oxygen agent.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: first with ethyl acetate adjust by
The copolyamide resin, saturated polyester resin, non-reactive compatilizer, antimony oxide, aluminium hydroxide, brominated styrene,
The liquid dispersion (solid content 35%) of antioxidant composition, is blended into adhesive.
The adhesive is coated on the PBT insulation film with a thickness of 150 μm with coating machine single side again, rubberization thickness is 45 μ
m；
Then it is handled 4 minutes at 100 DEG C, so that ethyl acetate volatilizees, forms solid adhesive on PBT insulating film
Layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 5
A kind of thermoplastic resin composition, including calculate according to the mass fraction 50 parts of copolyamide resin, saturated polyester tree
6 parts of rouge (ES450), 1.8 parts of response type compatilizer, 7 parts of antimony oxide, 15 parts of brominated styrene, 5 parts of aluminium hydroxide, antioxygen
0.9 part of agent.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with ethyl alcohol and toluene
By the copolyamide resin, saturated polyester resin, response type compatilizer, antimony oxide, brominated styrene, aluminium hydroxide,
The liquid dispersion (solid content 60%) of antioxidant composition, is blended into adhesive.
The adhesive is coated on the PI insulation film with a thickness of 110 μm with coating machine single side again, rubberization thickness is 12 μm；
Then it is handled 9 minutes at 110 DEG C, so that ethyl alcohol and toluene volatilization, form solid gluing on PI insulating film
Oxidant layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 6
A kind of thermoplastic resin composition, including calculate according to the mass fraction 78 parts of copolyamide resin, saturated polyester tree
19 parts of rouge (ES850), 5.9 parts of non-reactive compatilizer, 14 parts of antimony pentoxide, 30 parts of brominated epoxy resin, magnesium hydroxide 10
Part, 0.4 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with propyl alcohol and toluene
By the copolyamide resin, saturated polyester resin, non-reactive compatilizer, antimony pentoxide, brominated epoxy resin, hydroxide
The liquid dispersion (solid content 45%) of magnesium, antioxidant composition, is blended into adhesive.
The adhesive is coated on the NOMEX insulation film with a thickness of 130 μm with coating machine single side again, rubberization thickness 17
μm；
Then it is handled 7 minutes at 165 DEG C, so that propyl alcohol and toluene volatilization, form solid glue on NOMEX insulating film
Adhesive layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 7
A kind of thermoplastic resin composition, including calculate according to the mass fraction 53 parts of copolyamide resin, saturated polyester tree
10 parts of rouge (ES750), 3.4 parts of response type compatilizer, 12 parts of antimony oxide, 42 parts of hexabromocyclododecane, 12 parts of aluminium hydroxide,
1.0 parts of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: butanol and dimethylbenzene tune are first used
Section is by the copolyamide resin, saturated polyester resin, response type compatilizer, antimony oxide, hexabromocyclododecane, hydroxide
The liquid dispersion (solid content 57%) of aluminium, antioxidant composition, is blended into adhesive.
The adhesive is coated on the PET insulation film with a thickness of 150 μm with coating machine single side again, rubberization thickness is 20 μ
m；
Then it is handled 6 minutes at 170 DEG C, so that butanol and dimethylbenzene volatilization, form solid glue on PET insulating film
Adhesive layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 8
A kind of thermoplastic resin composition, including calculate according to the mass fraction 74 parts of copolyamide resin, saturated polyester tree
12 parts of rouge (ES901), 6.2 parts of non-reactive compatilizer, 9 parts of antimony oxide, 10 parts of antimony pentoxide, decabromodiphenylethane 35
Part, 8 parts of aluminium hydroxide, 3 parts of magnesium hydroxide, 0.5 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: n-amyl alcohol and butanone tune are first used
Section is by the copolyamide resin, saturated polyester resin, non-reactive compatilizer, antimony oxide, antimony pentoxide, ten bromines two
The liquid dispersion (solid content 53%) of vinylbenzene, aluminium hydroxide, magnesium hydroxide, antioxidant composition, is blended into adhesive.
The adhesive is coated on the PBT insulation film with a thickness of 140 μm with coating machine single side again, rubberization thickness is 31 μ
m；
Then it is handled 7 minutes at 140 DEG C, so that n-amyl alcohol and butanone volatilization, form solid glue on PBT insulating film
Adhesive layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 9
A kind of thermoplastic resin composition, including calculate according to the mass fraction 59 parts of copolyamide resin, saturated polyester tree
15 parts of rouge (ES600), 4.9 parts of response type compatilizer, 11 parts of antimony oxide, 12 parts of antimony pentoxide, 50 parts of brominated styrene,
13 parts of aluminium hydroxide, 0.7 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with toluene by described
Copolyamide resin, saturated polyester resin, response type compatilizer, antimony oxide, antimony pentoxide, brominated styrene, hydrogen-oxygen
The liquid dispersion (solid content 41%) for changing aluminium, antioxidant composition, is blended into adhesive.
The adhesive is coated on the PEN insulation film with a thickness of 160 μm with coating machine single side again, rubberization thickness is 38 μ
m；
Then it is handled 6 minutes at 130 DEG C, so that toluene volatilizees, forms solid gluing oxidant layer on PEN insulating film；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Embodiment 10
A kind of thermoplastic resin composition, including calculate according to the mass fraction 79 parts of copolyamide resin, saturated polyester tree
18 parts of rouge (S1426), 7.1 parts of non-reactive compatilizer, 31 parts of antimony oxide, 57 parts of brominated epoxy resin, aluminium hydroxide 8
Part, 1 part of magnesium hydroxide, 0.2 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with dimethylbenzene by institute
State copolyamide resin, saturated polyester resin, non-reactive compatilizer, antimony oxide, brominated epoxy resin, aluminium hydroxide,
The liquid dispersion (solid content 37%) of magnesium hydroxide, antioxidant composition, is blended into adhesive.
The adhesive is coated on the PI insulation film with a thickness of 175 μm with coating machine single side again, rubberization thickness is 42 μm；
Then it is handled 4 minutes at 140 DEG C, so that dimethylbenzene volatilizees, forms solid gluing oxidant layer on PI insulating film；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Comparative example 1
A kind of thermoplastic resin composition, including calculate according to the mass fraction 70 parts of copolyamide resin, saturated polyester tree
10 parts of rouge (S1426), 10 parts of antimony oxide, 15 parts of aluminium hydroxide, 30 parts of hexabromocyclododecane, 0.4 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with butanone by described
Copolyamide resin, saturated polyester resin, antimony oxide, aluminium hydroxide, hexabromocyclododecane, the liquid point of antioxidant composition
Granular media (solid content 40%), is blended into adhesive.
The adhesive is coated on the PET insulation film with a thickness of 125 μm with coating machine single side again, rubberization thickness is 35 μ
m；
Then it is handled 2 minutes at 110 DEG C, so that butanone volatilizees, forms solid gluing oxidant layer on PET insulating film；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Comparative example 2
A kind of thermoplastic resin composition, including 75 parts of copolyamide resin, the antimony oxide calculated according to the mass fraction
15 parts, 10 parts of magnesium hydroxide, 30 parts of brominated epoxy resin, 0.7 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: first with ethyl acetate adjust by
Liquid dispersion (the solid that the copolyamide resin, antimony oxide, magnesium hydroxide, brominated epoxy resin, antioxidant form
Content is 45%), to be blended into adhesive.
The adhesive is coated on the PBT insulation film with a thickness of 175 μm with coating machine single side again, rubberization thickness is 40 μ
m；
Then it is handled 5 minutes at 120 DEG C, so that ethyl acetate volatilizees, forms solid adhesive on PBT insulating film
Layer；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
Comparative example 3
A kind of thermoplastic resin composition, including 30 parts of saturated polyester resin, the antimony pentoxide 5 calculated according to the mass fraction
Part, 15 parts of decabromodiphenylethane, 0.3 part of antioxidant.
The thermoplastic resin composition is used for stack bus bar insulated rubber film.
The preparation method of stack bus bar insulated rubber film containing thermoplastic resin composition: it is first adjusted with butanone by described
Saturated polyester resin, antimony pentoxide, decabromodiphenylethane, the liquid dispersion (solid content 40%) of antioxidant composition,
It is blended into adhesive.
The adhesive is coated on the PET insulation film with a thickness of 125 μm with coating machine single side again, rubberization thickness is 45 μ
m；
Then it is handled 3 minutes at 100 DEG C, so that butanone volatilizees, forms solid gluing oxidant layer on PET insulating film；
Finally winding obtains the stack bus bar insulated rubber film of the thermoplastic resin composition.
The stack bus bar of Examples 1 to 10, comparative example 1~3 and existing product is tested for the property with insulated rubber film, respectively
The test method of test item is as follows:
(1) low temperature pressing property
Insulated rubber film and tin-coated copper bar are pressed at 130 DEG C, and no blistering, delamination, cracking are then qualification, otherwise unqualified.
(2) peel strength
The cohesive force of insulated rubber film and copper foil, 90 ° of disbonded tests；Wherein, A state peel strength is aerial test knot
Fruit, high temperature peel strength are the test result in the silicone oil of relevant temperature.
(3) electrical strength
After insulated rubber film connects equipment, making alive, frequency 50Hz calculates electrical strength when breakdown.
(4) elongation percentage
By ASTM D-882 standard, test to obtain using material stretch test machine.
(5) dimensional stability
125 DEG C of insulated rubber film are handled 4 hours, and 150 DEG C are handled 2 hours, then measure its direction MD and TD before and after the processing
Change in size；Wherein, MD is radial, and TD is broadwise.
(6) cooling thermal impact performance
By insulated rubber film and tin-coated copper bar high-temperature laminating, cold shock testing is then carried out.Cold shock testing condition
Are as follows: -40 DEG C~105 DEG C/200 times circulations, -40 DEG C/constant temperature 0.5 hour, -40 DEG C were warming up to 105 DEG C/1 minute, 105 DEG C/constant temperature
0.5 hour, 105 DEG C were cooled to -40 DEG C/1 minute, the above circulation about 1 hour.
After cooling thermal impact between glue film and tin-coated copper bar without blistering, without cracking then for qualification, it is otherwise unqualified.
(7) hydrothermal aging performance
By insulated rubber film and tin-coated copper bar high-temperature laminating, hydrothermal aging test is then carried out.Hydrothermal aging experimental condition are as follows:
85 DEG C × 85%RH/1000 hours.
After hydrothermal aging between glue film and tin-coated copper bar without blistering, delamination, cracking then for qualification, it is otherwise unqualified.
(8) processability (bending test)
By with a thickness of being cooled to room temperature after the tin-coated copper bar of 3mm and glue film high-temperature laminating, folding test, bending angle are carried out
It is 90 °.It is otherwise unqualified without blistering, delamination, cracking then to be qualified between glue film and tin-coated copper bar after bending.
(9) high temperature test
The sample of Bending Processing is placed in 105 DEG C of baking ovens to toast 240 hours, between glue film and tin-coated copper bar without blistering, delamination,
Cracking is then qualification, otherwise unqualified.
(10) anti-flammability
It is measured according to 94 vertical combustion of UL.
It is specific that test result is as follows shown in table 1.
From table 1 it follows that not adding compatilizer in comparative example 1, copolyamide resin and saturated polyester resin are total
Compatibility is poor after mixed, and cohesive strength is lower, causes peel strength relatively low；And in comparative example 2, individually use copolyamide tree
Rouge is not added with saturated polyester resin, bad with the adhesive property of thin polymer film since its polarity is larger, therefore the removing of its A state is strong
Degree is less than 1.0N/mm, but since copolyamide high temperature resistance is preferable, 105 DEG C of peel strengths are still greater than 1.0N/mm；Comparison
In example 3, saturated polyester resin is individually used, since its high temperature resistance is poor, therefore 105 DEG C of peel strengths are only 0.12N/mm.
High temperature resistance, processing performance and cooling thermal impact performance, the hydrothermal aging performance of insulated rubber film in comparative example are unqualified.It is real
The compatibility applied using copolyamide resin and saturated polyester resin blending and modifying in example, and add compatilizer both to improve,
It can get the good thermoplastic resin composition of compatibility, prepared stack bus bar insulated rubber film, which can meet low temperature pressing, to be wanted
It asks, and adhesive property, high temperature resistance, processability, cooling thermal impact performance, hydrothermal aging performance are both with respect to comparative example and existing
Product improves a lot, and A state peel strength is greater than 2.0N/mm, 105 DEG C of peel strengths are greater than 1.0N/mm, -40 DEG C of experience/
85 DEG C of 30min~105 DEG C/circulation of 30min cooling thermal impact 200, temperature humidity 85% descend aging 1000 hours, 105 DEG C of high temperature to dry
After 240 hours roasting, do not occur cracking foaming phenomena yet.With copolyamide resin and saturated polyester blending and modifying, effectively comprehensive two
The advantages of person, has excellent heat resistance and high/low temperature peel strength, and can meet low temperature pressing and require.
In conclusion the electric property of the stack bus bar insulated rubber film of resin combination and its preparation of the invention, resistance to
Environmental testing is up to standard, and anti-flammability reaches UL94VTM-0 grades, reduces by 20 DEG C or more than existing product pressing-in temp, and have excellent
Different high/low temperature peel strength, good processing performance.
Compared with prior art, the invention has the following beneficial effects:
Contain copolyamide resin and saturated polyester resin, copolyamide resin in thermoplastic resin composition of the invention
With more highly polar, intermolecular force is strong, can form part crystalline texture, has higher melt, the adhesive property with metal
It is excellent, but it is poor with the adhesive property of insulation film；A small amount of saturated polyester resin is blended, and add a small amount of compatible
Agent, can be obtained the good thermoplastic resin composition of compatibility, which all has metal and insulation film
There is excellent adhesive property.In addition, the resin combination is free of curing agent, it is pure thermoplastic resin composition, using the thermoplastic
Property resin combination preparation insulated rubber film anti-flammability up to UL94VTM-0 grades, and pressing-in temp is low, adhesive property is good, together
When with excellent high/low temperature peel strength, dimensional stability and processability, can meet the needs of low temperature pressing stack bus bar.
More than, only presently preferred embodiments of the present invention for those of ordinary skill in the art can be according to this hair
Bright technical solution and technical concept makes other various corresponding changes and modifications, and all these change and modification should all belong to
In the range of the claims in the present invention.
Method detailed of the invention that the present invention is explained by the above embodiments, but the invention is not limited to it is above-mentioned in detail
Method, that is, do not mean that the invention must rely on the above detailed methods to implement.Person of ordinary skill in the field should
It is illustrated, any improvement in the present invention, addition, the concrete mode of equivalence replacement and auxiliary element to each raw material of product of the present invention
Selection etc., all of which fall within the scope of protection and disclosure of the present invention.
Claims (11)
1. a kind of stack bus bar insulated rubber film, which is characterized in that be coated on including insulation film and single or double described exhausted
Adhesive on edge film is formed by gluing oxidant layer, and the adhesive includes thermoplastic resin composition and organic solvent, institute
The solid content for stating adhesive is 30wt%~60wt%,
Wherein, according to mass fraction meter, the thermoplastic resin composition is composed of the following components:
Or the thermoplastic resin composition is composed of the following components:
2. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the number of the copolyamide resin is divided equally
Son amount be 10000~30000, fusing point be 110 DEG C~130 DEG C, glass transition temperature be -30 DEG C~40 DEG C, acid value be 2~
15mgKOH/g, amine value are 3~10mgKOH/g.
3. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the number of the saturated polyester resin is divided equally
Son amount is 8000~30000, and glass transition temperature is between -30 DEG C~110 DEG C, and hydroxyl value is 2~10mgKOH/g.
4. stack bus bar insulated rubber film as described in claim 1, which is characterized in that it is compatible that the compatilizer is selected from response type
One or both of agent or non-reactive compatilizer.
5. stack bus bar insulated rubber film as claimed in claim 4, which is characterized in that the response type compatilizer is low molecule
Measure carboxy blocking copolyamide resin, low molecular weight carboxy-terminated polyester resin, isocyanates graft copolymerization amide resin, isocyanide
Acid esters is grafted the mixture of any one or at least two in saturated polyester resin；The non-reactive compatilizer is binary
The block copolymer that acid, dihydric alcohol and diamine copolyreaction obtain.
6. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the fire retardant includes that halogen system is fire-retardant
Agent, halogen system fire retarding synergist, in metal hydroxides any one or at least two mixture；The halogenated flame retardant is
The double tetrabromo-phthalics two of decabromodiphenylethane, brominated styrene, brominated epoxy resin, tetrabromobisphenol A, hexabromocyclododecane, ethylene
In carboximide any one or at least two mixture；The halogen system fire retarding synergist is antimony oxide, five oxidations
The mixture of any one or two kinds in two antimony；The metal hydroxides is magnesium hydroxide, any one in aluminium hydroxide
Kind or two kinds of mixture.
7. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the antioxidant is Hinered phenols antioxygen
The composition of any one or two kinds in agent and phosphite ester antioxidant；The Hinered phenols antioxidant includes model
1010, any one in 1076,1098 and 2246 or at least two composition；The phosphite ester antioxidant includes type
The composition of any one or two kinds in numbers 168 and 618.
8. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the organic solvent be ethyl alcohol, propyl alcohol,
Isopropanol, butanol, n-amyl alcohol, cyclohexanol, isoamyl alcohol, ethylene glycol, 1,2- propylene glycol, 1,3- propylene glycol, butanone, acetone, hexamethylene
It is ketone, toluene, dimethylbenzene, glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, any in ethyl acetate
It is a kind of or at least two mixture.
9. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the insulation film is poly- terephthaldehyde
Sour glycol ester film, polybutylene terephthalate (PBT) film, polyethylene naphthalate film, Kapton or
Poly film.
10. stack bus bar insulated rubber film as described in claim 1, which is characterized in that the insulation film with a thickness of 100
~250 μm；The gluing oxidant layer with a thickness of 10~50 μm.
11. a kind of prepare the method such as the described in any item stack bus bar insulated rubber films of claim 1~10, feature exists
In, comprising steps of
(1) copolyamide resin, saturated polyester resin, compatilizer and fire retardant are weighed according to the mass fraction, and it is organic molten
Agent is mixed to prepare adhesive；And
(2) the adhesive single or double is coated on insulating substrate, is sent into baking oven to remove the organic solvent, is formed
Solid gluing oxidant layer, winding obtain the stack bus bar insulated rubber film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611246836.5A CN106675003B (en) | 2016-12-29 | 2016-12-29 | A thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for a laminated busbar, and a preparation method of the insulating adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611246836.5A CN106675003B (en) | 2016-12-29 | 2016-12-29 | A thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for a laminated busbar, and a preparation method of the insulating adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106675003A CN106675003A (en) | 2017-05-17 |
| CN106675003B true CN106675003B (en) | 2019-04-30 |
Family
ID=58872495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611246836.5A Expired - Fee Related CN106675003B (en) | 2016-12-29 | 2016-12-29 | A thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for a laminated busbar, and a preparation method of the insulating adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106675003B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115011283A (en) * | 2022-07-13 | 2022-09-06 | 新纶电子材料(常州)有限公司 | Hot melt adhesive particles, laminated busbar insulating film and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4219460A (en) * | 1978-10-04 | 1980-08-26 | Monsanto Company | Block copolymer hot melt adhesive composition |
| CA2017350A1 (en) * | 1989-08-16 | 1991-02-16 | Michael Kopietz | Flame-resistant thermoplastic molding compositions based on polyamides and polyester elastomers |
| CN103304985A (en) * | 2012-03-07 | 2013-09-18 | 金发科技股份有限公司 | High-strength and high-toughness polyamide/polyester alloy, preparation method and application thereof |
-
2016
- 2016-12-29 CN CN201611246836.5A patent/CN106675003B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4219460A (en) * | 1978-10-04 | 1980-08-26 | Monsanto Company | Block copolymer hot melt adhesive composition |
| CA2017350A1 (en) * | 1989-08-16 | 1991-02-16 | Michael Kopietz | Flame-resistant thermoplastic molding compositions based on polyamides and polyester elastomers |
| CN103304985A (en) * | 2012-03-07 | 2013-09-18 | 金发科技股份有限公司 | High-strength and high-toughness polyamide/polyester alloy, preparation method and application thereof |
Non-Patent Citations (1)
| Title |
|---|
| 叠层母排用改性饱和聚酯胶黏剂的制备及性能研究;左陈 等;《绝缘材料》;20160720;第49卷(第7期);第27-30页 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106675003A (en) | 2017-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022179375A1 (en) | Insulated wire, manufacturing method therefor, coil, and electronic and electrical equipment | |
| WO2013133333A1 (en) | Insulated electric wire having bubble layer therein, electric device, and method for producing insulated electric wire having bubble layer therein | |
| CN106700428A (en) | A halogen-free resin composition and the adhesive prepared therefrom, an insulating adhesive film for laminated busbars, and a method for preparing the insulating adhesive film | |
| US8263202B2 (en) | Film based heating device and methods relating thereto | |
| CN106700509B (en) | Halogen-free thermoplastic resin composition, adhesive prepared from same, insulating adhesive film for laminated busbar and preparation method of insulating adhesive film | |
| CN105199649B (en) | Insulated rubber film prepared by adhesive, the adhesive and preparation method thereof and stack bus bar | |
| TW201529729A (en) | Polyimide film and preparation method thereof | |
| CN106674916A (en) | A flame-retardant resin composition and the adhesive prepared therefrom, an insulating adhesive film for laminated busbars, and a method for preparing the insulating adhesive film | |
| CN106700498A (en) | A thermoplastic resin composition and the adhesive prepared therefrom, an insulating adhesive film for laminated busbars, and a method for preparing the insulating adhesive film | |
| CN101017714A (en) | Insulated electric wire with partial discharge resistance and composition for manufacturing the same | |
| CN106675003B (en) | A thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for a laminated busbar, and a preparation method of the insulating adhesive film | |
| CN104804404B (en) | Resin combination and its application | |
| CN105176468A (en) | Resin composition, adhesive containing the resin composition, insulating adhesive film for laminated busbar using the adhesive, and preparation method thereof | |
| US8809684B2 (en) | Insulated wire | |
| TWI558740B (en) | Thermal conductive resin and thermal interface material containing the same | |
| CN106751744A (en) | The adhesive of Halogen thermoplastic resin composition and its preparation, stack bus bar insulated rubber film, the preparation method of the insulated rubber film | |
| CN108753167A (en) | A kind of resin combination, the stack bus bar insulated rubber film and preparation method thereof comprising it | |
| CN106751538A (en) | A kind of flame-retardant resin composition and its prepared adhesive, laminated busbar insulating adhesive film, and the preparation method of the insulating adhesive film | |
| CN109266297A (en) | A kind of high-temperature Resistance Adhesives and its preparation method and application | |
| CN110862653B (en) | Halogen-free resin composition, RCC, adhesive film and metal foil-clad laminate | |
| TWI748769B (en) | Polymer dispersion, method for manufacturing the polymer dispersion, and polymer composite film and its application | |
| CN109666445B (en) | A resin composition, an insulating adhesive film for a laminated busbar including the same, and a preparation method thereof | |
| JP5832735B2 (en) | Heat-resistant self-bonding paint and heat-resistant self-bonding enameled wire | |
| JP2016225046A (en) | Insulated wire | |
| CN103694548B (en) | 150 DEG C of cross-linking radiation antiblocking halogen-free flame retardant insulation materials and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190430 |