CN106675003A - Thermoplastic resin composition and adhesive prepared from composition, insulation adhesive film for laminated bus bars, and preparation method of insulation adhesive film - Google Patents
Thermoplastic resin composition and adhesive prepared from composition, insulation adhesive film for laminated bus bars, and preparation method of insulation adhesive film Download PDFInfo
- Publication number
- CN106675003A CN106675003A CN201611246836.5A CN201611246836A CN106675003A CN 106675003 A CN106675003 A CN 106675003A CN 201611246836 A CN201611246836 A CN 201611246836A CN 106675003 A CN106675003 A CN 106675003A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- parts
- thermoplastic resin
- adhesive
- saturated polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 92
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 89
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 64
- 239000000853 adhesive Substances 0.000 title claims abstract description 62
- 239000000203 mixture Substances 0.000 title claims description 21
- 238000009413 insulation Methods 0.000 title claims description 9
- 239000002313 adhesive film Substances 0.000 title abstract description 67
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 64
- 229920001225 polyester resin Polymers 0.000 claims abstract description 55
- 239000004645 polyester resin Substances 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 38
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 37
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000003063 flame retardant Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 56
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 29
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 23
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 17
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 14
- 239000000347 magnesium hydroxide Substances 0.000 claims description 14
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 14
- 238000004804 winding Methods 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 10
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 10
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical group O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- -1 Formic acid glycol ester Chemical class 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 5
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 claims description 4
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 claims description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- 229920001400 block copolymer Polymers 0.000 claims description 2
- 238000007334 copolymerization reaction Methods 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims 5
- 239000010409 thin film Substances 0.000 claims 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 238000004026 adhesive bonding Methods 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 3
- 230000001590 oxidative effect Effects 0.000 claims 3
- 229910052736 halogen Inorganic materials 0.000 claims 2
- 150000002367 halogens Chemical class 0.000 claims 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 2
- 150000002989 phenols Chemical class 0.000 claims 2
- 150000008301 phosphite esters Chemical class 0.000 claims 2
- 230000000979 retarding effect Effects 0.000 claims 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims 1
- MVDXHIJBNLVYIZ-UHFFFAOYSA-N [Br].CC(c1ccccc1)c1ccccc1 Chemical compound [Br].CC(c1ccccc1)c1ccccc1 MVDXHIJBNLVYIZ-UHFFFAOYSA-N 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 229910000410 antimony oxide Inorganic materials 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 235000019253 formic acid Nutrition 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 150000003949 imides Chemical class 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical group [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims 1
- 229960004063 propylene glycol Drugs 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 8
- 230000008018 melting Effects 0.000 abstract description 8
- 229920006254 polymer film Polymers 0.000 abstract description 6
- 239000013078 crystal Substances 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 42
- 239000011248 coating agent Substances 0.000 description 28
- 238000000576 coating method Methods 0.000 description 28
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 22
- 239000012790 adhesive layer Substances 0.000 description 16
- 238000003825 pressing Methods 0.000 description 16
- 239000006185 dispersion Substances 0.000 description 13
- 239000007788 liquid Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 12
- 229920000728 polyester Polymers 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 230000035939 shock Effects 0.000 description 9
- 230000032683 aging Effects 0.000 description 8
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 238000005336 cracking Methods 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 6
- 229920006122 polyamide resin Polymers 0.000 description 6
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229920000784 Nomex Polymers 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004763 nomex Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- SHRRVNVEOIKVSG-UHFFFAOYSA-N 1,1,2,2,3,3-hexabromocyclododecane Chemical group BrC1(Br)CCCCCCCCCC(Br)(Br)C1(Br)Br SHRRVNVEOIKVSG-UHFFFAOYSA-N 0.000 description 1
- BSZXAFXFTLXUFV-UHFFFAOYSA-N 1-phenylethylbenzene Chemical compound C=1C=CC=CC=1C(C)C1=CC=CC=C1 BSZXAFXFTLXUFV-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- ULKGULQGPBMIJU-UHFFFAOYSA-N benzene;hydron;bromide Chemical compound Br.C1=CC=CC=C1 ULKGULQGPBMIJU-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- DDTBPAQBQHZRDW-UHFFFAOYSA-N cyclododecane Chemical compound C1CCCCCCCCCCC1 DDTBPAQBQHZRDW-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
本发明提供一种热塑性树脂组合物,按照质量份数计,热塑性树脂组合物包括共聚酰胺树脂40~80份、饱和聚酯树脂5~35份、相容剂1~10份、阻燃剂20~100份及抗氧剂0.1~1份。共聚酰胺树脂具有很强极性,分子间作用力强,可形成部分结晶结构,具有较高熔点,与金属粘接性能好,但是与聚合物薄膜粘接性较差;而饱和聚酯树脂熔点较低,极性相对较弱,与聚合物薄膜具有较好的粘接性;相容剂可提高共聚酰胺树脂与饱和聚酯树脂间的相容性,提高热塑性树脂组合物的内聚强度。该热塑性树脂组合物不含固化剂,高温流动性佳,可低温压合。本发明还提供一种采用上述热塑性树脂组合物制作的胶粘剂及叠层母排用绝缘胶膜,以及叠层母排用绝缘胶膜的制备方法。
The invention provides a thermoplastic resin composition, which comprises 40-80 parts of copolyamide resin, 5-35 parts of saturated polyester resin, 1-10 parts of compatibilizer and 20 parts of flame retardant in terms of parts by mass. ~100 parts and 0.1~1 part of antioxidant. Copolyamide resin has strong polarity, strong intermolecular force, can form a partial crystal structure, has a high melting point, and has good adhesion to metals, but poor adhesion to polymer films; while saturated polyester resin has a melting point of It has low polarity and relatively weak polarity, and has good adhesion to polymer films; the compatibilizer can improve the compatibility between the copolyamide resin and the saturated polyester resin, and improve the cohesive strength of the thermoplastic resin composition. The thermoplastic resin composition does not contain curing agent, has good fluidity at high temperature and can be pressed at low temperature. The present invention also provides an adhesive made of the above thermoplastic resin composition, an insulating adhesive film for laminated busbars, and a preparation method for the insulating adhesive film for laminated busbars.
Description
技术领域technical field
本发明涉及叠层母排用绝缘胶膜领域,尤其涉及一种热塑性树脂组合物及其制备的胶粘剂、叠层母排用绝缘胶膜,该绝缘胶膜的制备方法。The invention relates to the field of insulating adhesive films for laminated busbars, in particular to a thermoplastic resin composition and an adhesive prepared therefrom, an insulating adhesive film for laminated busbars, and a method for preparing the insulating adhesive film.
背景技术Background technique
叠层母排也被称作复合母排、叠层母线排、复合铜排、复合母线等,英文名叫Laminated Busbar。它主要是基于电磁理论,将又宽又薄的铜排与很薄的绝缘材料热压成一体而成,相邻导线内通过相反的电流,其磁场相互抵消,可使寄生电感减小。作为叠层母排中导体间的粘结和绝缘材料的绝缘胶膜,其性能好坏对于叠层母排的安全性和可靠性有着至关重要的影响。绝缘胶膜主要由绝缘薄膜和涂覆在其表面的胶粘剂所构成。当前,用于叠层母排绝缘胶膜的胶粘剂主要为环氧类胶粘剂和聚酯类胶粘剂。环氧类胶粘剂是一类热固性胶粘剂,具有粘接性能好、耐热性能优异、电绝缘性能好、介电性能优异等优点,但是也存在储存期短、压合时间长、压合温度高等缺点,使得其在叠层母排用绝缘胶膜中的应用受到限制。饱和聚酯类胶粘剂是一类热塑性胶粘剂,虽然具有储存时间长、压合时间短等优点,但是饱和聚酯类胶粘剂的高温粘接性能一般较差,也很难满足叠层母排用绝缘胶膜的应用要求。Laminated busbars are also called composite busbars, laminated busbars, composite copper bars, composite busbars, etc., and the English name is Laminated Busbar. It is mainly based on the electromagnetic theory, and the wide and thin copper bar is hot-pressed with a very thin insulating material. The opposite current passes through the adjacent wires, and the magnetic fields cancel each other, which can reduce the parasitic inductance. As the bonding between the conductors in the laminated busbar and the insulating film of the insulating material, its performance has a crucial impact on the safety and reliability of the laminated busbar. The insulating film is mainly composed of an insulating film and an adhesive coated on its surface. At present, the adhesives used for laminated busbar insulation films are mainly epoxy adhesives and polyester adhesives. Epoxy adhesive is a kind of thermosetting adhesive, which has the advantages of good bonding performance, excellent heat resistance, good electrical insulation performance, excellent dielectric performance, etc., but there are also disadvantages such as short storage period, long pressing time, and high pressing temperature. , so that its application in the insulating adhesive film for laminated busbars is limited. Saturated polyester adhesive is a kind of thermoplastic adhesive. Although it has the advantages of long storage time and short pressing time, the high-temperature bonding performance of saturated polyester adhesive is generally poor, and it is difficult to meet the requirements of insulating adhesive for laminated busbars. Membrane application requirements.
为了改善饱和聚酯类胶粘剂的高温粘接性能,目前通常采用与环氧树脂共混或者添加少量固化剂的方式,使其形成互穿聚合物网络结构或者产生部分交联以提高饱和聚酯类胶粘剂的耐高温性能。如中国专利CN104178044A公开了一种环氧改性饱和聚酯树脂胶粘剂,由以下质量百分数的各组分制备而成:饱和聚酯树脂A20-50%,饱和聚酯树脂B5-30%,环氧树脂2-20%,异氰酸酯1-10%,阻燃剂20-70%,分散剂0.05-5%,按上述配比分散于有机溶剂中,得到叠层母排用环氧改性饱和聚酯胶粘剂。但是环氧树脂开环与异氰酸酯的反应温度通常高于200℃,在较低温下很难与饱和聚酯树脂形成互穿聚合物网络结构以提高饱和聚酯胶粘剂体系的高温性能;且饱和聚酯树脂中添加环氧树脂改性,可能导致改性胶粘剂变脆,且储存性能下降。又如中国专利CN105176468A及CN105199649A则公开了一种采用添加酸酐固化剂的办法使饱和聚酯树脂形成部分交联,但是总体仍保持热塑性,可显著改善饱和聚酯胶粘剂的高温粘接性能。添加固化剂使饱和聚酯树脂形成部分交联网络结构,固然可使饱和聚酯胶粘剂的高温粘接性能得以提高,但是饱和聚酯胶粘剂在压合之前就形成部分交联网络结构,虽然总体保持热塑性,但是其已形成一定的三维网络结构,没有明显熔点,高温下的流动性和浸润性也大大降低,一般需在150℃以上压合才能实现有效粘接。压合温度升高,不仅带来能耗上升,而且高温下长时间压合将导致聚合物薄膜性能下降。此外,随着叠层母排的结构变得越来越复杂,很多情况下需要多次高温压合才能成型,过高的压合温度将导致成品合格率降低。In order to improve the high-temperature bonding performance of saturated polyester adhesives, blending with epoxy resin or adding a small amount of curing agent is usually used to form an interpenetrating polymer network structure or produce partial crosslinking to improve the performance of saturated polyester adhesives. Adhesive high temperature performance. For example, Chinese patent CN104178044A discloses an epoxy-modified saturated polyester resin adhesive, which is prepared from the following components in mass percentage: saturated polyester resin A20-50%, saturated polyester resin B5-30%, epoxy 2-20% resin, 1-10% isocyanate, 20-70% flame retardant, 0.05-5% dispersant, dispersed in organic solvent according to the above ratio, to obtain epoxy-modified saturated polyester for laminated busbar adhesive. However, the reaction temperature of epoxy resin ring-opening and isocyanate is usually higher than 200 °C, and it is difficult to form an interpenetrating polymer network structure with saturated polyester resin at lower temperatures to improve the high-temperature performance of saturated polyester adhesive systems; and saturated polyester Adding epoxy resin modification to the resin may cause the modified adhesive to become brittle and reduce storage performance. Another example is Chinese patents CN105176468A and CN105199649A which disclose a method of adding an acid anhydride curing agent to partially crosslink the saturated polyester resin, but still maintain thermoplasticity overall, which can significantly improve the high-temperature bonding performance of the saturated polyester adhesive. Adding a curing agent makes the saturated polyester resin form a partially cross-linked network structure, which can certainly improve the high-temperature bonding performance of the saturated polyester adhesive, but the saturated polyester adhesive forms a partially cross-linked network structure before pressing, although the overall retention Thermoplastic, but it has formed a certain three-dimensional network structure, has no obvious melting point, and its fluidity and wettability are greatly reduced at high temperatures. Generally, it needs to be pressed above 150°C to achieve effective bonding. The increase of pressing temperature will not only bring about an increase in energy consumption, but also long-term pressing at high temperature will lead to a decrease in the performance of the polymer film. In addition, as the structure of laminated busbars becomes more and more complex, in many cases multiple high-temperature pressing is required to form, and excessively high pressing temperatures will lead to a decrease in the yield of finished products.
因此,如何实现在不降低热塑性树脂组合物及叠层母排用绝缘胶膜的高温性能的前提下,降低压合温度、减少压合时间是行业内亟待解决的关键问题之一。Therefore, how to reduce the pressing temperature and the pressing time without reducing the high-temperature performance of the thermoplastic resin composition and the insulating adhesive film for laminated busbars is one of the key problems to be solved in the industry.
发明内容Contents of the invention
本发明的目的之一在于提供一种热塑性树脂组合物;本发明的目的之二在于提供一种采用上述热塑性树脂组合物制作的胶粘剂;本发明的目的之三在于提供一种采用上述热塑性树脂组合物制作的叠层母排用绝缘胶膜;本发明的目的之四在于提供所述叠层母排用绝缘胶膜的制备方法。所述叠层母排用绝缘胶膜采用上述热塑性树脂组合物,其压合温度低、压合时间短,且具有优异的高温剥离强度、加工性能和冷热冲击性能,可满足低温压合叠层母排的应用要求。One of the purposes of the present invention is to provide a thermoplastic resin composition; the second purpose of the present invention is to provide an adhesive made of the above-mentioned thermoplastic resin composition; the third purpose of the present invention is to provide a The insulating adhesive film for laminated busbars made of objects; the fourth object of the present invention is to provide a preparation method for the insulating adhesive film for laminated busbars. The insulating adhesive film for laminated busbars adopts the above-mentioned thermoplastic resin composition, which has a low pressing temperature and a short pressing time, and has excellent high-temperature peel strength, processability and thermal shock performance, and can meet the requirements of low-temperature pressing and lamination. Application requirements for layer busbars.
为实现该目的,本发明提供一种热塑性树脂组合物,按照质量份数计,所述热塑性树脂组合物包括共聚酰胺树脂40~80份,例如45份、50份、55份、58份、60份、65份、70份、75份或79份;饱和聚酯树脂5~35份,例如为6份、8份、10份、15份、18份、20份、25份、30份或34份;相容剂1~10份,例如为2份、3份、5份、6份、7份、8份或9份;以及阻燃剂20~100份,例如为21份、30份、40份、50份、60份、70份、80份、90份或99份。To achieve this purpose, the present invention provides a thermoplastic resin composition, which comprises 40 to 80 parts of copolyamide resin, such as 45 parts, 50 parts, 55 parts, 58 parts, 60 parts in parts by mass. Parts, 65 parts, 70 parts, 75 parts or 79 parts; 5 to 35 parts of saturated polyester resin, such as 6 parts, 8 parts, 10 parts, 15 parts, 18 parts, 20 parts, 25 parts, 30 parts or 34 parts 1-10 parts of compatibilizer, such as 2 parts, 3 parts, 5 parts, 6 parts, 7 parts, 8 parts or 9 parts; and 20-100 parts of flame retardant, such as 21 parts, 30 parts, 40, 50, 60, 70, 80, 90 or 99 servings.
本发明的热塑性树脂组合物以共聚酰胺作为主体树脂,配合饱和聚酯树脂、相容剂及阻燃剂组成,其中共聚酰胺树脂具有很强极性,分子间作用力强,可形成部分结晶结构,具有较高熔点,与金属粘接性能好,但是与聚合物薄膜粘接性较差;而饱和聚酯树脂熔点较低,极性相对较弱,与聚合物薄膜具有较好的粘接性;相容剂可提高共聚酰胺树脂与饱和聚酯树脂间的相容性,提高热塑性树脂组合物的内聚强度。以饱和聚酯树脂与共聚酰胺树脂作为主体树脂得到的热塑性树脂组合物,不含固化剂,高温流动性佳,可低温压合,可用于叠层母排用胶粘剂,具有优异的高温剥离强度、冷热冲击性能和加工性能。The thermoplastic resin composition of the present invention is composed of copolyamide as the main resin, combined with saturated polyester resin, compatibilizer and flame retardant, wherein the copolyamide resin has strong polarity, strong intermolecular force, and can form a partial crystal structure , has a high melting point, good adhesion to metals, but poor adhesion to polymer films; while saturated polyester resin has a low melting point, relatively weak polarity, and good adhesion to polymer films ; The compatibilizer can improve the compatibility between the copolyamide resin and the saturated polyester resin, and improve the cohesive strength of the thermoplastic resin composition. The thermoplastic resin composition obtained by using saturated polyester resin and copolyamide resin as the main resin does not contain curing agent, has good high-temperature fluidity, can be pressed at low temperature, and can be used as an adhesive for laminated busbars. It has excellent high-temperature peel strength, Thermal shock performance and processing performance.
较佳地,所述共聚酰胺树脂的数均分子量Mn为10000~30000,熔点Tm为110℃~130℃,例如115℃、120℃、125或129℃。玻璃化转变温度Tg为-30℃~40℃,例如-30℃、-20℃、-10℃、0℃、10℃、20℃、30℃或39℃,酸值为2~15mgKOH/g,例如3mgKOH/g、5mgKOH/g、10mgKOH/g、12mgKOH/g或14mgKOH/g;胺值为3~10mgKOH/g,例如3mgKOH/g、5mgKOH/g、10mgKOH/g。Preferably, the number average molecular weight Mn of the copolyamide resin is 10000-30000, and the melting point Tm is 110°C-130°C, such as 115°C, 120°C, 125 or 129°C. The glass transition temperature Tg is -30°C to 40°C, such as -30°C, -20°C, -10°C, 0°C, 10°C, 20°C, 30°C or 39°C, and the acid value is 2 to 15mgKOH/g, For example, 3mgKOH/g, 5mgKOH/g, 10mgKOH/g, 12mgKOH/g or 14mgKOH/g; the amine value is 3~10mgKOH/g, such as 3mgKOH/g, 5mgKOH/g, 10mgKOH/g.
较佳地,所述饱和聚酯树脂的数均分子量Mn为8000~30000,玻璃化转变温度Tg为-30℃~110℃之间,例如-30℃、-20℃、-10℃、0℃、10℃、20℃、30℃、50℃、65℃、70℃、80℃、90℃或109℃;羟值为2~10mgKOH/g,例如2.5mgKOH/g、3mgKOH/g、5mgKOH/g、10mgKOH/g。所述饱和聚酯树脂可以优选韩国SK化学制造的ES450、ES850、ES750、ES901、ES600、ES120等,还有德国Evonik公司制造的S1611、S1426、S1313、L952、L912等。Preferably, the number-average molecular weight Mn of the saturated polyester resin is 8000-30000, and the glass transition temperature Tg is between -30°C and 110°C, such as -30°C, -20°C, -10°C, 0°C , 10°C, 20°C, 30°C, 50°C, 65°C, 70°C, 80°C, 90°C or 109°C; the hydroxyl value is 2-10mgKOH/g, such as 2.5mgKOH/g, 3mgKOH/g, 5mgKOH/g , 10mgKOH/g. The saturated polyester resin can be preferably ES450, ES850, ES750, ES901, ES600, ES120, etc. manufactured by SK Chemicals in Korea, and S1611, S1426, S1313, L952, L912, etc. manufactured by Evonik Company in Germany.
较佳地,所述相容剂选自反应型相容剂或非反应型相容剂中的一种或两种。所述反应型相容剂为低分子量羧基封端共聚酰胺树脂、低分子量羧基封端聚酯树脂、异氰酸酯接枝共聚酰胺树脂、异氰酸酯接枝饱和聚酯树脂中的任意一种或至少两种的混合物;所述非反应型相容剂为二元酸、二元醇及二元胺共聚反应得到的嵌段共聚物。Preferably, the compatibilizer is selected from one or both of reactive compatibilizers and non-reactive compatibilizers. The reactive compatibilizer is any one or at least two of low molecular weight carboxyl-terminated copolyamide resins, low molecular weight carboxyl-terminated polyester resins, isocyanate grafted copolyamide resins, and isocyanate grafted saturated polyester resins. Mixture; the non-reactive compatibilizer is a block copolymer obtained by the copolymerization reaction of dibasic acid, dibasic alcohol and dibasic amine.
较佳地,所述阻燃剂包括卤系阻燃剂、卤系阻燃协效剂、金属氢氧化物中的任意一种或至少两种的混合物;所述卤系阻燃剂为十溴二苯乙烷、溴化苯乙烯、溴化环氧树脂、四溴双酚A、六溴环十二烷、乙撑双四溴邻苯二甲酰亚胺中的任意一种或至少两种的混合物;所述卤系阻燃协效剂为三氧化二锑、五氧化二锑中的任意一种或至少两种的混合物;所述金属氢氧化物为氢氧化镁、氢氧化铝中的任意一种或两种的混合物。Preferably, the flame retardant includes any one or a mixture of at least two of halogenated flame retardants, halogenated flame retardant synergists, and metal hydroxides; the halogenated flame retardant is decabromo Any one or at least two of diphenylethane, brominated styrene, brominated epoxy resin, tetrabromobisphenol A, hexabromocyclododecane, and ethylene bistetrabromophthalimide mixture; the halogenated flame retardant synergist is any one or a mixture of at least two of antimony trioxide and antimony pentoxide; the metal hydroxide is magnesium hydroxide, aluminum hydroxide Either or a mixture of both.
较佳地,所述热塑性树脂组合物还包括抗氧剂,按照质量份数计,所述抗氧剂的添加量为0.1~1份,例如0.2份、0.3份、0.4份、0.5份、0.6份、0.7份、0.8份、0.9份。。可延长叠层母排用绝缘胶膜使用寿命,减缓或抑制热压时胶粘剂老化过程的进行,本发明中优选使用受阻酚类抗氧剂1010、1076、1098、2246以及亚磷酸酯类抗氧剂168、618。Preferably, the thermoplastic resin composition further includes an antioxidant, and the addition amount of the antioxidant is 0.1 to 1 part by mass, such as 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part parts, 0.7 parts, 0.8 parts, 0.9 parts. . It can prolong the service life of the insulating adhesive film for laminated busbars, slow down or inhibit the aging process of the adhesive during hot pressing, and the hindered phenolic antioxidants 1010, 1076, 1098, 2246 and phosphite antioxidants are preferably used in the present invention Agents 168, 618.
本发明还提供一种胶粘剂,包括如上所述的热塑性树脂组合物和有机溶剂,所述胶粘剂的固含量为30wt%~60wt%,优选35wt%~60wt%,可获得适宜的粘度,提供良好的加工性,保证使用(如涂覆)过程中不出现表观缺陷。The present invention also provides an adhesive, comprising the above-mentioned thermoplastic resin composition and an organic solvent, the solid content of the adhesive is 30wt% to 60wt%, preferably 35wt% to 60wt%, which can obtain a suitable viscosity and provide a good Processability, to ensure that there will be no apparent defects during use (such as coating).
较佳地,所述有机溶剂为乙醇、丙醇、异丙醇、丁醇、正戊醇、环己醇、异戊醇、乙二醇、1,2-丙二醇、1,3-丙二醇、丁酮、丙酮、环己酮、甲苯、二甲苯、乙二醇单甲醚、丙二醇单甲醚、丙二醇单甲醚醋酸酯、乙酸乙酯中的任意一种或至少两种的混合物。Preferably, the organic solvent is ethanol, propanol, isopropanol, butanol, n-pentanol, cyclohexanol, isoamyl alcohol, ethylene glycol, 1,2-propanediol, 1,3-propanediol, butanol Any one or a mixture of at least two of ketone, acetone, cyclohexanone, toluene, xylene, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and ethyl acetate.
本发明还提供一种叠层母排用绝缘胶膜,包括绝缘薄膜及单面或双面涂覆于所述绝缘薄膜上的如上所述的胶粘剂所形成的胶粘剂层。The present invention also provides an insulating adhesive film for laminated busbars, comprising an insulating film and an adhesive layer formed by the above-mentioned adhesive coated on one or both sides of the insulating film.
较佳地,所述绝缘薄膜为聚对苯二甲酸乙二醇酯薄膜(PET)、聚对苯二甲酸丁二醇酯薄膜(PBT)、聚萘二甲酸乙二醇酯薄膜(PEN)、聚酰亚胺薄膜(PI)或聚间苯二甲酰间苯二胺薄膜(NOMEX)。Preferably, the insulating film is polyethylene terephthalate film (PET), polybutylene terephthalate film (PBT), polyethylene naphthalate film (PEN), Polyimide film (PI) or polym-phenylene isophthalamide film (NOMEX).
较佳地,所述绝缘薄膜的厚度为100~250μm,例如:105μm、110μm、120μm、130μm、140μm、150μm、160μm、170μm、180μm、190μm、200μm、210μm、220μm、230μm、240μm或249μm;所述胶粘剂层的厚度为10~50μm,例如:10μm、20μm、30μm、40μm或50μm。Preferably, the thickness of the insulating film is 100-250 μm, for example: 105 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm or 249 μm; The thickness of the adhesive layer is 10-50 μm, for example: 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.
本发明还提供一种制备如上所述的叠层母排用绝缘胶膜的方法,其特征在于,包括步骤:The present invention also provides a method for preparing the above-mentioned insulating adhesive film for laminated busbars, which is characterized in that it includes the steps of:
(1)按照所述质量份数称取共聚酰胺树脂、饱和聚酯树脂、相容剂、抗氧剂及阻燃剂,使用球磨机、罐磨机或砂磨机同时配合使用高剪切搅拌分散设备将其与有机溶剂混合,制得胶粘剂;以及(1) Weigh the copolyamide resin, saturated polyester resin, compatibilizer, antioxidant and flame retardant according to the stated parts by mass, and use a ball mill, pot mill or sand mill to simultaneously use high-shear stirring to disperse Equipment mixes it with organic solvents to make adhesives; and
(2)将所述胶粘剂单面或双面涂覆于绝缘基材上,送入在线干燥烘箱,在80~160℃加热2~10分钟以去除所述有机溶剂,形成固态的胶粘剂层,收卷即得到所述叠层母排用绝缘胶膜。(2) Coat the adhesive on one or both sides of the insulating substrate, put it into an online drying oven, and heat it at 80-160° C. for 2-10 minutes to remove the organic solvent, form a solid adhesive layer, and collect roll to obtain the insulating adhesive film for the laminated busbar.
较佳地,所述有机溶剂为乙醇、丙醇、异丙醇、丁醇、正戊醇、环己醇、异戊醇、乙二醇、1,2-丙二醇、1,3-丙二醇、丁酮、丙酮、环己酮、甲苯、二甲苯、乙二醇单甲醚、丙二醇单甲醚、丙二醇单甲醚醋酸酯、乙酸乙酯中的任意一种或至少两种的混合物。Preferably, the organic solvent is ethanol, propanol, isopropanol, butanol, n-pentanol, cyclohexanol, isoamyl alcohol, ethylene glycol, 1,2-propanediol, 1,3-propanediol, butanol Any one or a mixture of at least two of ketone, acetone, cyclohexanone, toluene, xylene, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, and ethyl acetate.
现有技术相比,本发明具有如下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
本发明的热塑性树脂组合物中含有共聚酰胺树脂及饱和聚酯树脂,共聚酰胺树脂具有较强极性,分子间作用力强,可形成部分结晶结构,具有较高熔点,与金属的粘接性能优异,但是与绝缘薄膜的粘接性能较差;将少量饱和聚酯树脂与其共混,并添加少量相容剂,可得到相容性良好的热塑性树脂组合物,该热塑性树脂组合物对金属和绝缘薄膜都具有优异的粘接性能。此外,该树脂组合物不含固化剂,为纯热塑性树脂组合物,采用该热塑性树脂组合物制备的绝缘胶膜的阻燃性可达UL94VTM-0级,且压合温度低、粘接性能好,同时具有优异的高温剥离强度、尺寸稳定性及加工性,可满足低温压合叠层母排的需求。The thermoplastic resin composition of the present invention contains a copolyamide resin and a saturated polyester resin, the copolyamide resin has strong polarity, strong intermolecular force, can form a partial crystal structure, has a relatively high melting point, and has good adhesion properties with metals Excellent, but poor adhesion to insulating film; blending a small amount of saturated polyester resin with it, and adding a small amount of compatibilizer, can get a thermoplastic resin composition with good compatibility, the thermoplastic resin composition is on metal and Insulating films all have excellent adhesive properties. In addition, the resin composition does not contain a curing agent and is a pure thermoplastic resin composition. The flame retardancy of the insulating adhesive film prepared by using the thermoplastic resin composition can reach UL94VTM-0 level, and the pressing temperature is low and the bonding performance is good. , At the same time, it has excellent high-temperature peel strength, dimensional stability and processability, which can meet the needs of low-temperature pressure-bonded laminated busbars.
说明书附图Instructions attached
图1为本发明叠层母排用绝缘胶膜第一实施例的示意图。FIG. 1 is a schematic diagram of a first embodiment of an insulating adhesive film for laminated busbars according to the present invention.
图2为本发明叠层母排用绝缘胶膜第二实施例的示意图。Fig. 2 is a schematic diagram of a second embodiment of the insulating adhesive film for laminated busbars of the present invention.
具体实施方式detailed description
下面通过具体实施方式来进一步说明本发明的技术方案。The technical solutions of the present invention will be further described below through specific embodiments.
实施例1Example 1
一种热塑性树脂组合物,包括按照质量份数计算的共聚酰胺树脂45份、饱和聚酯树脂(ES450)30份、非反应型相容剂2份、三氧化二锑10份、氢氧化铝5份、十溴二苯乙烷30份、抗氧剂0.1份。A thermoplastic resin composition, comprising 45 parts of copolyamide resin calculated in parts by mass, 30 parts of saturated polyester resin (ES450), 2 parts of non-reactive compatibilizer, 10 parts of antimony trioxide, 5 parts of aluminum hydroxide 30 parts, 30 parts of decabromodiphenylethane, 0.1 part of antioxidant.
将所述的热塑性树脂组合物应用于叠层母排用绝缘胶膜。The thermoplastic resin composition is applied to an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用丁酮调节由所述共聚酰胺树脂、饱和聚酯树脂、非反应型相容剂、三氧化二锑、氢氧化铝、十溴二苯乙烷、抗氧剂组成的液态分散体(固体含量45%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first adjust the polyamide resin, saturated polyester resin, non-reactive compatibilizer, antimony trioxide and aluminum hydroxide with methyl ethyl ketone , decabromodiphenylethane, and antioxidant liquid dispersion (solid content 45%), mixed into an adhesive.
如图1所示,再将该胶粘剂用涂覆机单面涂在厚度为100μm的PET绝缘薄膜10上,涂胶厚度为20μm;As shown in Figure 1, the adhesive is coated on one side with a coating machine on a PET insulating film 10 with a thickness of 100 μm, and the coating thickness is 20 μm;
接着在100℃下处理5分钟,以使丁酮挥发,在PET绝缘膜上形成固态的胶粘剂层20;Then treat at 100° C. for 5 minutes to volatilize methyl ethyl ketone and form a solid adhesive layer 20 on the PET insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜1。Finally, the insulating adhesive film 1 for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例2Example 2
一种热塑性树脂组合物,包括按照质量份数计算的共聚酰胺树脂54份、饱和聚酯树脂(L912)25份、反应型相容剂3份、五氧化二锑15份、氢氧化镁5份、乙撑双四溴邻苯二甲酰亚胺35份、抗氧剂0.5份。A thermoplastic resin composition, comprising 54 parts of copolyamide resin calculated in parts by mass, 25 parts of saturated polyester resin (L912), 3 parts of reactive compatibilizer, 15 parts of antimony pentoxide, and 5 parts of magnesium hydroxide , 35 parts of ethylene bis-tetrabromophthalimide, 0.5 part of antioxidant.
将所述的热塑性树脂组合物应用于叠层母排绝缘胶膜。The thermoplastic resin composition is applied to the laminated busbar insulation adhesive film.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用丙酮调节由所述共聚酰胺树脂、饱和聚酯树脂、反应型相容剂、五氧化二锑、氢氧化镁、乙撑双四溴邻苯二甲酰亚胺、抗氧剂组成的液态分散体(固体含量40%),混制成胶粘剂。A method for preparing an insulating adhesive film for laminated busbars containing a thermoplastic resin composition: first use acetone to adjust the composition of the copolyamide resin, saturated polyester resin, reactive compatibilizer, antimony pentoxide, magnesium hydroxide, ethyl alcohol, etc. A liquid dispersion (solid content: 40%) composed of bis-tetrabromophthalimide and an antioxidant is mixed into an adhesive.
如图2所示,再将该胶粘剂用涂覆机双面涂在厚度为188μm的PET绝缘薄膜10’上,涂胶厚度为30μm;As shown in Figure 2, the double-sided coating of this adhesive with a coating machine is on the PET insulating film 10' of 188 μm in thickness, and the coating thickness is 30 μm;
接着在110℃下处理8分钟,以使丙酮挥发,在PET绝缘膜上形成固态的胶粘剂层20’;Then treat at 110°C for 8 minutes to volatilize the acetone and form a solid adhesive layer 20' on the PET insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜1’。Finally, the insulating adhesive film 1' for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例3Example 3
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂70份、饱和聚酯树脂(S1426)15份、反应型相容剂3份、三氧化二锑12份、氢氧化镁10份、四溴双酚A 40份、抗氧剂0.8份。A thermoplastic resin composition, comprising 70 parts by mass of copolyamide resin, 15 parts of saturated polyester resin (S1426), 3 parts of reactive compatibilizer, 12 parts of antimony trioxide, and 10 parts of magnesium hydroxide , 40 parts of tetrabromobisphenol A, 0.8 parts of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用环己酮调节由所述共聚酰胺树脂、饱和聚酯树脂、反应型相容剂、三氧化二锑、氢氧化镁、四溴双酚A、抗氧剂组成的液态分散体(固体含量为50%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first use cyclohexanone to adjust the composition of the copolyamide resin, saturated polyester resin, reactive compatibilizer, antimony trioxide, magnesium hydroxide , Tetrabromobisphenol A, and an antioxidant liquid dispersion (solid content is 50%), mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为100μm的PEN绝缘薄膜上,涂胶厚度为40μm;Then use a coating machine to coat the adhesive on a PEN insulating film with a thickness of 100 μm on one side, and the coating thickness is 40 μm;
接着在160℃下处理10分钟,以使环己酮挥发,在PEN绝缘膜上形成固态的胶粘剂层;Then treat at 160°C for 10 minutes to volatilize cyclohexanone and form a solid adhesive layer on the PEN insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例4Example 4
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂75份、饱和聚酯树脂(ES120)8份、非反应型相容剂6份、三氧化二锑15份、氢氧化铝10份、溴化苯乙烯26份、抗氧剂0.8份。A thermoplastic resin composition comprising 75 parts by mass of copolyamide resin, 8 parts of saturated polyester resin (ES120), 6 parts of non-reactive compatibilizer, 15 parts of antimony trioxide, and 10 parts of aluminum hydroxide 26 parts, 26 parts of brominated styrene, 0.8 parts of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用乙酸乙酯调节由所述共聚酰胺树脂、饱和聚酯树脂、非反应型相容剂、三氧化二锑、氢氧化铝、溴化苯乙烯、抗氧剂组成的液态分散体(固体含量为35%),混制成胶粘剂。The preparation method of the insulating adhesive film for laminated busbars containing thermoplastic resin composition: first use ethyl acetate to adjust the composition of the copolyamide resin, saturated polyester resin, non-reactive compatibilizer, antimony trioxide, hydroxide A liquid dispersion (35% solid content) composed of aluminum, brominated styrene, and an antioxidant is mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为150μm的PBT绝缘薄膜上,涂胶厚度为45μm;Then apply the adhesive on a PBT insulating film with a thickness of 150 μm on one side with a coating machine, and the coating thickness is 45 μm;
接着在100℃下处理4分钟,以使乙酸乙酯挥发,在PBT绝缘膜上形成固态的胶粘剂层;Then treat at 100°C for 4 minutes to volatilize ethyl acetate and form a solid adhesive layer on the PBT insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例5Example 5
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂50份、饱和聚酯树脂(ES450)6份、反应型相容剂1.8份、三氧化二锑7份、溴化苯乙烯15份、氢氧化铝5份、抗氧剂0.9份。A thermoplastic resin composition, comprising 50 parts by mass of copolyamide resin, 6 parts of saturated polyester resin (ES450), 1.8 parts of reactive compatibilizer, 7 parts of antimony trioxide, 15 parts of brominated styrene 5 parts, 5 parts of aluminum hydroxide, 0.9 part of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用乙醇和甲苯调节由所述共聚酰胺树脂、饱和聚酯树脂、反应型相容剂、三氧化二锑、溴化苯乙烯、氢氧化铝、抗氧剂组成的液态分散体(固体含量为60%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first adjust the polyamide resin, saturated polyester resin, reactive compatibilizer, antimony trioxide and benzene bromide with ethanol and toluene A liquid dispersion (60% solid content) composed of ethylene, aluminum hydroxide and antioxidant is mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为110μm的PI绝缘薄膜上,涂胶厚度为12μm;Then use a coating machine to coat the adhesive on a PI insulating film with a thickness of 110 μm on one side, and the coating thickness is 12 μm;
接着在110℃下处理9分钟,以使乙醇和甲苯挥发,在PI绝缘膜上形成固态的胶粘剂层;Then treat at 110°C for 9 minutes to volatilize ethanol and toluene, and form a solid adhesive layer on the PI insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例6Example 6
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂78份、饱和聚酯树脂(ES850)19份、非反应型相容剂5.9份、五氧化二锑14份、溴化环氧树脂30份、氢氧化镁10份、抗氧剂0.4份。A thermoplastic resin composition comprising 78 parts by mass of copolyamide resin, 19 parts of saturated polyester resin (ES850), 5.9 parts of non-reactive compatibilizer, 14 parts of antimony pentoxide, brominated epoxy 30 parts of resin, 10 parts of magnesium hydroxide, 0.4 parts of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用丙醇和甲苯调节由所述共聚酰胺树脂、饱和聚酯树脂、非反应型相容剂、五氧化二锑、溴化环氧树脂、氢氧化镁、抗氧剂组成的液态分散体(固体含量为45%),混制成胶粘剂。The preparation method of the insulating adhesive film for laminated busbars containing thermoplastic resin composition: first use propanol and toluene to adjust the polyamide resin, saturated polyester resin, non-reactive compatibilizer, antimony pentoxide, bromide A liquid dispersion (solid content of 45%) composed of epoxy resin, magnesium hydroxide, and antioxidant is mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为130μm的NOMEX绝缘薄膜上,涂胶厚度为17μm;Then use the coating machine to coat the adhesive on the NOMEX insulating film with a thickness of 130 μm on one side, and the coating thickness is 17 μm;
接着在165℃下处理7分钟,以使丙醇和甲苯挥发,在NOMEX绝缘膜上形成固态的胶粘剂层;Then treat at 165°C for 7 minutes to volatilize propanol and toluene and form a solid adhesive layer on the NOMEX insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例7Example 7
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂53份、饱和聚酯树脂(ES750)10份、反应型相容剂3.4份、三氧化二锑12份、六溴环十二烷42份、氢氧化铝12份、抗氧剂1.0份。A thermoplastic resin composition, comprising 53 parts by mass of copolyamide resin, 10 parts of saturated polyester resin (ES750), 3.4 parts of reactive compatibilizer, 12 parts of antimony trioxide, hexabromocyclododecane 42 parts of alkane, 12 parts of aluminum hydroxide, and 1.0 part of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用丁醇和二甲苯调节由所述共聚酰胺树脂、饱和聚酯树脂、反应型相容剂、三氧化二锑、六溴环十二烷、氢氧化铝、抗氧剂组成的液态分散体(固体含量为57%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first use butanol and xylene to adjust the polyamide resin, saturated polyester resin, reactive compatibilizer, antimony trioxide, hexabromo A liquid dispersion (solid content of 57%) composed of cyclododecane, aluminum hydroxide and an antioxidant is mixed to form an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为150μm的PET绝缘薄膜上,涂胶厚度为20μm;Then use a coating machine to coat the adhesive on a PET insulating film with a thickness of 150 μm on one side, and the coating thickness is 20 μm;
接着在170℃下处理6分钟,以使丁醇和二甲苯挥发,在PET绝缘膜上形成固态的胶粘剂层;Then treat at 170°C for 6 minutes to volatilize butanol and xylene to form a solid adhesive layer on the PET insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例8Example 8
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂74份、饱和聚酯树脂(ES901)12份、非反应型相容剂6.2份、三氧化二锑9份、五氧化二锑10份、十溴二苯乙烷35份、氢氧化铝8份、氢氧化镁3份、抗氧剂0.5份。A thermoplastic resin composition, comprising 74 parts by mass of copolyamide resin, 12 parts of saturated polyester resin (ES901), 6.2 parts of non-reactive compatibilizer, 9 parts of antimony trioxide, antimony pentoxide 10 parts, 35 parts of decabromodiphenylethane, 8 parts of aluminum hydroxide, 3 parts of magnesium hydroxide, 0.5 parts of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用正戊醇和丁酮调节由所述共聚酰胺树脂、饱和聚酯树脂、非反应型相容剂、三氧化二锑、五氧化二锑、十溴二苯乙烷、氢氧化铝、氢氧化镁、抗氧剂组成的液态分散体(固体含量为53%),混制成胶粘剂。The preparation method of the insulating adhesive film for laminated busbars containing thermoplastic resin composition: first use n-amyl alcohol and methyl ethyl ketone to adjust the composition of the copolyamide resin, saturated polyester resin, non-reactive compatibilizer, antimony trioxide, Liquid dispersion (53% solid content) composed of antimony pentoxide, decabromodiphenylethane, aluminum hydroxide, magnesium hydroxide and antioxidant is mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为140μm的PBT绝缘薄膜上,涂胶厚度为31μm;Then use a coating machine to coat the adhesive on a PBT insulating film with a thickness of 140 μm on one side, and the coating thickness is 31 μm;
接着在140℃下处理7分钟,以使正戊醇和丁酮挥发,在PBT绝缘膜上形成固态的胶粘剂层;Then treat at 140°C for 7 minutes to volatilize n-amyl alcohol and butanone, and form a solid adhesive layer on the PBT insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例9Example 9
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂59份、饱和聚酯树脂(ES600)15份、反应型相容剂4.9份、三氧化二锑11份、五氧化二锑12份、溴化苯乙烯50份、氢氧化铝13份、抗氧剂0.7份。A thermoplastic resin composition, comprising 59 parts by mass of copolyamide resin, 15 parts of saturated polyester resin (ES600), 4.9 parts of reactive compatibilizer, 11 parts of antimony trioxide, 12 parts of antimony pentoxide 50 parts, 50 parts of brominated styrene, 13 parts of aluminum hydroxide, 0.7 parts of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用甲苯调节由所述共聚酰胺树脂、饱和聚酯树脂、反应型相容剂、三氧化二锑、五氧化二锑、溴化苯乙烯、氢氧化铝、抗氧剂组成的液态分散体(固体含量为41%),混制成胶粘剂。The preparation method of the insulating adhesive film for laminated busbars containing thermoplastic resin composition: first use toluene to adjust the composition of the copolyamide resin, saturated polyester resin, reactive compatibilizer, antimony trioxide, antimony pentoxide, A liquid dispersion (solid content of 41%) composed of brominated styrene, aluminum hydroxide, and an antioxidant is mixed to form an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为160μm的PEN绝缘薄膜上,涂胶厚度为38μm;Then use a coating machine to coat the adhesive on a PEN insulating film with a thickness of 160 μm on one side, and the coating thickness is 38 μm;
接着在130℃下处理6分钟,以使甲苯挥发,在PEN绝缘膜上形成固态的胶粘剂层;Then treat at 130°C for 6 minutes to volatilize the toluene and form a solid adhesive layer on the PEN insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
实施例10Example 10
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂79份、饱和聚酯树脂(S1426)18份、非反应型相容剂7.1份、三氧化二锑31份、溴化环氧树脂57份、氢氧化铝8份、氢氧化镁1份、抗氧剂0.2份。A thermoplastic resin composition, comprising 79 parts by mass of copolyamide resin, 18 parts of saturated polyester resin (S1426), 7.1 parts of non-reactive compatibilizer, 31 parts of antimony trioxide, brominated epoxy 57 parts of resin, 8 parts of aluminum hydroxide, 1 part of magnesium hydroxide, 0.2 part of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用二甲苯调节由所述共聚酰胺树脂、饱和聚酯树脂、非反应型相容剂、三氧化二锑、溴化环氧树脂、氢氧化铝、氢氧化镁、抗氧剂组成的液态分散体(固体含量为37%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first adjust the polyamide resin, the saturated polyester resin, the non-reactive compatibilizer, the antimony trioxide, and the brominated ring with xylene. A liquid dispersion (solid content of 37%) composed of oxygen resin, aluminum hydroxide, magnesium hydroxide, and antioxidant is mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为175μm的PI绝缘薄膜上,涂胶厚度为42μm;Then apply the adhesive on one side of the PI insulation film with a thickness of 175 μm with a coating machine, and the coating thickness is 42 μm;
接着在140℃下处理4分钟,以使二甲苯挥发,在PI绝缘膜上形成固态的胶粘剂层;Then treat at 140°C for 4 minutes to volatilize the xylene and form a solid adhesive layer on the PI insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
对比例1Comparative example 1
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂70份、饱和聚酯树脂(S1426)10份、三氧化二锑10份、氢氧化铝15份、六溴环十二烷30份、抗氧剂0.4份。A thermoplastic resin composition, comprising 70 parts by mass of copolyamide resin, 10 parts of saturated polyester resin (S1426), 10 parts of antimony trioxide, 15 parts of aluminum hydroxide, 30 parts of hexabromocyclododecane part, 0.4 part of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用丁酮调节由所述共聚酰胺树脂、饱和聚酯树脂、三氧化二锑、氢氧化铝、六溴环十二烷、抗氧剂组成的液态分散体(固体含量为40%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first adjust the polyamide resin, saturated polyester resin, antimony trioxide, aluminum hydroxide, hexabromocyclododecane with methyl ethyl ketone , Antioxidant composition liquid dispersion (solid content is 40%), mixed into adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为125μm的PET绝缘薄膜上,涂胶厚度为35μm;Then apply the adhesive on one side with a coating machine on a PET insulating film with a thickness of 125 μm, and the coating thickness is 35 μm;
接着在110℃下处理2分钟,以使丁酮挥发,在PET绝缘膜上形成固态的胶粘剂层;Then treat at 110°C for 2 minutes to volatilize butanone and form a solid adhesive layer on the PET insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
对比例2Comparative example 2
一种热塑性树脂组合物,包括按质量份数计算的共聚酰胺树脂75份、三氧化二锑15份、氢氧化镁10份、溴化环氧树脂30份、抗氧剂0.7份。A thermoplastic resin composition, comprising 75 parts of copolyamide resin, 15 parts of antimony trioxide, 10 parts of magnesium hydroxide, 30 parts of brominated epoxy resin and 0.7 parts of antioxidant in parts by mass.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用乙酸乙酯调节由所述共聚酰胺树脂、三氧化二锑、氢氧化镁、溴化环氧树脂、抗氧剂组成的液态分散体(固体含量为45%),混制成胶粘剂。The preparation method of the insulating adhesive film for laminated busbar containing thermoplastic resin composition: first use ethyl acetate to adjust the composition of the copolyamide resin, antimony trioxide, magnesium hydroxide, brominated epoxy resin, and antioxidant The liquid dispersion (solid content is 45%), mixed into adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为175μm的PBT绝缘薄膜上,涂胶厚度为40μm;Then apply the adhesive on a PBT insulating film with a thickness of 175 μm on one side with a coating machine, and the coating thickness is 40 μm;
接着在120℃下处理5分钟,以使乙酸乙酯挥发,在PBT绝缘膜上形成固态的胶粘剂层;Then treat at 120°C for 5 minutes to volatilize ethyl acetate and form a solid adhesive layer on the PBT insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
对比例3Comparative example 3
一种热塑性树脂组合物,包括按质量份数计算的饱和聚酯树脂30份、五氧化二锑5份、十溴二苯乙烷15份、抗氧剂0.3份。A thermoplastic resin composition, comprising 30 parts by mass of saturated polyester resin, 5 parts of antimony pentoxide, 15 parts of decabromodiphenylethane, and 0.3 parts of antioxidant.
将所述热塑性树脂组合物用于叠层母排用绝缘胶膜。The thermoplastic resin composition is used for an insulating adhesive film for a laminated busbar.
含有热塑性树脂组合物的叠层母排用绝缘胶膜的制备方法:先用丁酮调节由所述饱和聚酯树脂、五氧化二锑、十溴二苯乙烷、抗氧剂组成的液态分散体(固体含量为40%),混制成胶粘剂。The preparation method of the insulating adhesive film for the laminated busbar containing the thermoplastic resin composition: first adjust the liquid dispersion composed of the saturated polyester resin, antimony pentoxide, decabromodiphenylethane and antioxidant with methyl ethyl ketone body (40% solids content), mixed into an adhesive.
再将该胶粘剂用涂覆机单面涂在厚度为125μm的PET绝缘薄膜上,涂胶厚度为45μm;Then use a coating machine to coat the adhesive on a PET insulating film with a thickness of 125 μm on one side, and the coating thickness is 45 μm;
接着在100℃下处理3分钟,以使丁酮挥发,在PET绝缘膜上形成固态的胶粘剂层;Then treat at 100°C for 3 minutes to volatilize butanone and form a solid adhesive layer on the PET insulating film;
最后收卷即得到所述热塑性树脂组合物的叠层母排用绝缘胶膜。Finally, the insulating adhesive film for laminated busbars of the thermoplastic resin composition is obtained by winding.
对实施例1~10、对比例1~3及现有产品的叠层母排用绝缘胶膜进行性能测试,各测试项目的测试方法如下:Perform performance tests on the insulating adhesive films for laminated busbars of Examples 1 to 10, Comparative Examples 1 to 3 and existing products, and the test methods for each test item are as follows:
(1)低温压合性(1) Low temperature lamination
绝缘胶膜与镀锡铜排在130℃压合,无起泡、脱层、开裂,则为合格,否则不合格。The insulation film and the tinned copper bar are pressed together at 130°C, and if there is no blistering, delamination, or cracking, it is qualified, otherwise it is unqualified.
(2)剥离强度(2) Peel strength
绝缘胶膜与铜箔的粘结力,90°剥离试验;其中,A态剥离强度为在空气中的测试结果,高温剥离强度为在相应温度的硅油中的测试结果。Adhesion between insulating film and copper foil, 90°peel test; Among them, the A-state peel strength is the test result in air, and the high-temperature peel strength is the test result in silicone oil at the corresponding temperature.
(3)电气强度(3) Electric strength
绝缘胶膜连接设备后,加电压,频率为50Hz,计算击穿时的电气强度。After the insulating film is connected to the equipment, apply a voltage with a frequency of 50 Hz, and calculate the electric strength at the time of breakdown.
(4)延伸率(4) Elongation
按ASTM D-882标准,采用材料拉伸试验机测试得到。According to the standard of ASTM D-882, it is tested by material tensile testing machine.
(5)尺寸稳定性(5) Dimensional stability
绝缘胶膜125℃处理4小时,150℃处理2小时,然后测量其处理前后MD和TD方向的尺寸变化;其中,MD为径向,TD为纬向。The insulating film was treated at 125°C for 4 hours, and at 150°C for 2 hours, and then the dimensional changes in the MD and TD directions before and after the treatment were measured; where MD is the radial direction and TD is the weft direction.
(6)冷热冲击性能(6) Thermal shock performance
将绝缘胶膜与镀锡铜排高温压合,然后进行冷热冲击试验。冷热冲击试验条件为:-40℃~105℃/200次循环,-40℃/恒温0.5小时,-40℃升温至105℃/1分钟,105℃/恒温0.5小时,105℃降温至-40℃/1分钟,以上一个循环约为1小时。The insulating film and the tinned copper bar are pressed together at high temperature, and then subjected to the thermal shock test. The thermal shock test conditions are: -40°C to 105°C/200 cycles, -40°C/constant temperature for 0.5 hours, -40°C to 105°C/1 minute, 105°C/constant temperature for 0.5 hours, 105°C to -40 ℃/1 minute, the above cycle is about 1 hour.
冷热冲击后胶膜与镀锡铜排之间无起泡、无开裂则为合格,否则不合格。If there is no blistering or cracking between the adhesive film and the tinned copper bar after thermal shock, it is qualified, otherwise it is unqualified.
(7)湿热老化性能(7) Damp heat aging performance
将绝缘胶膜与镀锡铜排高温压合,然后进行湿热老化试验。湿热老化试验条件为:85℃×85%RH/1000小时。The insulating film and the tinned copper bar are pressed together at high temperature, and then subjected to a damp heat aging test. The conditions of the damp heat aging test are: 85°C×85%RH/1000 hours.
湿热老化后胶膜与镀锡铜排间无起泡、脱层、开裂则为合格,否则不合格。If there is no blistering, delamination or cracking between the adhesive film and the tinned copper bar after damp heat aging, it is qualified, otherwise it is unqualified.
(8)加工性(折弯测试)(8) Processability (bending test)
将厚度为3mm的镀锡铜排与胶膜高温压合后冷却至室温,进行折弯试验,弯折角度为90°。折弯后,胶膜与镀锡铜排间无起泡、脱层、开裂则为合格,否则不合格。The tin-plated copper bar with a thickness of 3mm and the adhesive film were pressed together at high temperature, cooled to room temperature, and subjected to a bending test. The bending angle was 90°. After bending, if there is no blistering, delamination, or cracking between the adhesive film and the tinned copper bar, it is qualified, otherwise it is unqualified.
(9)高温测试(9) High temperature test
将折弯加工的样品置于105℃烘箱烘烤240小时,胶膜与镀锡铜排间无起泡、脱层、开裂则为合格,否则不合格。Place the bent sample in an oven at 105°C and bake for 240 hours. If there is no blistering, delamination, or cracking between the film and the tinned copper bar, it is qualified, otherwise it is unqualified.
(10)阻燃性(10) Flame retardancy
依据UL 94垂直燃烧法测定。Measured according to UL 94 vertical combustion method.
具体测试结果如下表1所示。The specific test results are shown in Table 1 below.
从表1中可以看出,对比例1中,没有添加相容剂,共聚酰胺树脂与饱和聚酯树脂共混后相容性较差,内聚强度较低,导致剥离强度也较低;而对比例2中,单独采用共聚酰胺树脂,未添加饱和聚酯树脂,由于其极性较大,与聚合物薄膜的粘接性能不佳,故其A态剥离强度小于1.0N/mm,但是由于共聚酰胺耐高温性能较好,105℃剥离强度仍大于1.0N/mm;对比例3中,单独采用饱和聚酯树脂,由于其耐高温性能较差,故105℃剥离强度仅为0.12N/mm。对比例中的绝缘胶膜的耐高温性能、加工性能及冷热冲击性能、湿热老化性能均不合格。实施例中采用共聚酰胺树脂与饱和聚酯树脂共混改性,并添加相容剂以改善两者的相容性,可获得相容性良好的热塑性树脂组合物,所制备的叠层母排用绝缘胶膜可满足低温压合要求,且粘接性能、耐高温性能、加工性、冷热冲击性能、湿热老化性能均相对于对比例及现有产品有很大提高,A态剥离强度大于2.0N/mm、105℃剥离强度大于1.0N/mm,在经历-40℃/30min~105℃/30min冷热冲击200循环、温度85℃湿度85%下老化1000小时、105℃高温烘烤240小时后,仍未出现开裂起泡现象。以共聚酰胺树脂和饱和聚酯共混改性,有效综合两者的优点,具有优异的耐热性和高低温剥离强度,且可满足低温压合要求。As can be seen from Table 1, in Comparative Example 1, no compatibilizer is added, the compatibility of the copolyamide resin and the saturated polyester resin is poor after blending, and the cohesive strength is low, resulting in low peel strength; and In Comparative Example 2, the copolyamide resin was used alone without adding saturated polyester resin. Due to its large polarity, the bonding performance with the polymer film was not good, so its A-state peel strength was less than 1.0N/mm, but due to Copolyamide has good high temperature resistance, and its peel strength at 105°C is still greater than 1.0N/mm; in Comparative Example 3, saturated polyester resin is used alone, and its peel strength at 105°C is only 0.12N/mm due to its poor high temperature resistance . The high temperature resistance, processability, cold and heat shock performance, and damp heat aging performance of the insulating adhesive film in the comparative example are all unqualified. In the examples, copolyamide resin and saturated polyester resin are blended and modified, and a compatibilizer is added to improve the compatibility of the two, so that a thermoplastic resin composition with good compatibility can be obtained, and the prepared laminated busbar The use of insulating adhesive film can meet the requirements of low-temperature lamination, and the adhesive performance, high-temperature resistance, processability, thermal shock performance, and damp-heat aging performance are all greatly improved compared with the comparative example and existing products, and the A-state peel strength is greater than 2.0N/mm, peel strength at 105°C greater than 1.0N/mm, after 200 cycles of cold and heat shock at -40°C/30min~105°C/30min, aging at 85°C and humidity 85% for 1000 hours, high temperature baking at 105°C for 240 Hours later, there is still no cracking and foaming phenomenon. Copolyamide resin and saturated polyester are blended and modified to effectively integrate the advantages of the two. It has excellent heat resistance and high and low temperature peel strength, and can meet the requirements of low temperature lamination.
综上所述,本发明的树脂组合物及其制备的叠层母排用绝缘胶膜的电气性能、耐环境测试均达标,阻燃性达到UL94VTM-0级,比现有产品压合温度降低20℃以上,且具有优异的高低温剥离强度、良好的加工性能。In summary, the electrical properties and environmental resistance tests of the resin composition of the present invention and the insulating adhesive film for laminated busbars prepared by it all meet the standards, and the flame retardancy reaches the UL94VTM-0 level, which is lower than the pressing temperature of existing products. Above 20°C, and has excellent high and low temperature peel strength and good processing performance.
与现有技术相比,本发明具有如下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
本发明的热塑性树脂组合物中含有共聚酰胺树脂及饱和聚酯树脂,共聚酰胺树脂具有较强极性,分子间作用力强,可形成部分结晶结构,具有较高熔点,与金属的粘接性能优异,但是与绝缘薄膜的粘接性能较差;将少量饱和聚酯树脂与其共混,并添加少量相容剂,可得到相容性良好的热塑性树脂组合物,该热塑性树脂组合物对金属和绝缘薄膜都具有优异的粘接性能。此外,该树脂组合物不含固化剂,为纯热塑性树脂组合物,采用该热塑性树脂组合物制备的绝缘胶膜的阻燃性可达UL94VTM-0级,且压合温度低、粘接性能好,同时具有优异的高低温剥离强度、尺寸稳定性及加工性,可满足低温压合叠层母排的需求。The thermoplastic resin composition of the present invention contains a copolyamide resin and a saturated polyester resin, the copolyamide resin has strong polarity, strong intermolecular force, can form a partial crystal structure, has a relatively high melting point, and has good adhesion properties with metals Excellent, but poor adhesion to insulating film; blending a small amount of saturated polyester resin with it, and adding a small amount of compatibilizer, can get a thermoplastic resin composition with good compatibility, the thermoplastic resin composition is on metal and Insulating films all have excellent adhesive properties. In addition, the resin composition does not contain a curing agent and is a pure thermoplastic resin composition. The flame retardancy of the insulating adhesive film prepared by using the thermoplastic resin composition can reach UL94VTM-0 level, and the pressing temperature is low and the bonding performance is good. , At the same time, it has excellent high and low temperature peel strength, dimensional stability and processability, which can meet the needs of low temperature laminated busbars.
以上,仅为本发明的较佳实施例,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思做出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的范围。The above are only preferred embodiments of the present invention, and for those skilled in the art, various other corresponding changes and modifications can be made according to the technical scheme and technical concept of the present invention, and all these changes and modifications are Should belong to the scope of the claims of the present invention.
本发明通过上述实施例来说明本发明的详细方法,但本发明并不局限于上述详细方法,即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。The present invention illustrates the detailed methods of the present invention through the above examples, but the present invention is not limited to the above detailed methods, that is, it does not mean that the present invention must rely on the above detailed methods to be implemented. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, the selection of specific methods, etc., all fall within the scope of protection and disclosure of the present invention.
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