CN106670645B - A kind of laser processing device and laser processing - Google Patents
A kind of laser processing device and laser processing Download PDFInfo
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- CN106670645B CN106670645B CN201710086751.3A CN201710086751A CN106670645B CN 106670645 B CN106670645 B CN 106670645B CN 201710086751 A CN201710086751 A CN 201710086751A CN 106670645 B CN106670645 B CN 106670645B
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- laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser processing device and laser processings, parallel with the extending direction of moving lever by the shoot laser direction of propagation that lasing light emitter is arranged；Each prism is installed to predetermined order on moving lever, wherein the prism farthest apart from lasing light emitter is total reflection prism, remaining prism has reflectivity and transmittance simultaneously；When being laser machined, the shoot laser of lasing light emitter is incident to each prism successively, forms multiple laser after the reflection of each prism and is incident to machine table.Since the single beam laser of the outgoing of single lasing light emitter is divided into multiple laser to machine table incidence by prism, it is carried out at the same time processing so as to the plurality of positions to the material in machine table, the utilization rate of laser is improved while also improving material and carry out laser processing efficiency.
Description
Technical Field
The invention relates to the technical field of laser, in particular to a laser processing device and a laser processing method.
Background
The laser has single frequency, phase and polarization direction, so that the laser has the characteristics of good directivity, good monochromaticity, good coherence, high brightness and the like, and plays an important role in the processing field. The laser processing belongs to non-contact processing, and a cutting tool is not required, so that the problems of mechanical stress, tool abrasion, disassembly and replacement and the like are avoided during cutting. In addition, the laser has higher power density, so that most materials can be processed; the processing speed is high, the efficiency is high, the heat affected zone is small, and the fine processing can be carried out.
At present, the laser processing industry generally adopts a single laser source and a single laser beam processing mode to process materials. The laser processing method has long processing time and increases the cost of monomer products. Because the service life of the laser source is related to the duration of power-on, the problems of low utilization rate of laser, low processing efficiency and the like can be caused by adopting the existing laser processing mode.
Disclosure of Invention
The embodiment of the invention provides a laser processing device and a laser processing method, which are used for improving the utilization rate of laser and the laser processing efficiency.
In a first aspect, an embodiment of the present invention provides a laser processing apparatus, including: the laser processing device comprises a laser source, at least two prisms, a moving rod and a processing table; wherein,
the outgoing laser propagation direction of the laser source is parallel to the extending direction of the moving rod; each prism is arranged on the moving rod in a predetermined sequence, the prism farthest away from the laser source is a total reflection prism, and the rest prisms have reflectivity and transmissivity at the same time;
when laser processing is performed, the laser beams emitted from the laser source sequentially enter the prisms, are reflected by the prisms, and form a plurality of laser beams to enter the processing table.
In a possible implementation manner, in the above apparatus provided by the embodiment of the present invention, the incident surfaces of the laser light incident to the prisms are parallel to each other, and the incident angles of the outgoing laser light from the laser light source incident to the incident surfaces of the prisms are the same.
In a possible implementation manner, in the above apparatus provided by the embodiment of the present invention, the transmittance of each of the prisms decreases with an increase in distance from the laser source, and the reflectance of each of the prisms increases with an increase in distance from the laser source.
In a possible implementation manner, in the above apparatus provided by the embodiment of the present invention, the difference of the energy of each laser beam incident to the processing table is within a preset range.
In a possible implementation manner, in the above apparatus provided by the embodiment of the present invention, a plurality of sliding portions that slide along the moving rod in a one-to-one correspondence with the prisms, and each of the prisms is mounted on the sliding portion corresponding to the prism.
In a possible implementation manner, in the apparatus provided in an embodiment of the present invention, the apparatus further includes: and the shutter component is positioned between two adjacent prisms and used for controlling laser transmission and cutting off.
In a possible implementation manner, in the apparatus provided in an embodiment of the present invention, the apparatus further includes: the energy meters are positioned outside the processing table and correspond to the positions of the prisms one by one; the energy meter is used for measuring the laser energy reflected by the corresponding prism.
In a possible implementation manner, in the above-mentioned device provided by the embodiment of the present invention, each of the energy meters is arranged to be parallel to the motion rod in a straight line.
In a second aspect, an embodiment of the present invention provides a laser processing method based on any one of the above laser processing apparatuses, including:
adjusting the position of each prism right above each set position according to the set position of the material to be processed, which needs to be subjected to laser processing;
determining the reflectivity and the transmissivity of each prism according to the laser energy required by the material to be processed for laser processing;
and starting the laser source to enable the emergent laser to enter each prism, and enabling the reflected laser of each prism to enter the set position of the material to be processed by the laser energy required by the material to be processed.
In a possible implementation manner, in the method provided by the embodiment of the present invention, after adjusting, according to a set position of a material to be processed, at which laser processing is required, that each of the prisms is located right above each of the set positions, the method further includes:
adjusting the position of each energy meter to correspond to the adjusted position of each prism;
after the moving rod is moved to move the prisms to be right above the energy meters, the laser source is started, and whether the energy of the reflected laser of each prism meets the energy requirement of the set position of the material to be processed is measured;
the starting of the laser source enables the emergent laser to enter each prism, and at least two beams of reflected laser enter the set position of the material to be processed with laser energy required by the material to be processed, and the laser processing method comprises the following steps:
when the measured reflected laser energy of each prism meets the energy requirement of the set position of the material to be processed, the moving rod is moved to move each prism to return to the set position, then the laser source is started to enable the emergent laser to enter each prism, and at least two beams of reflected laser enter the set position of the material to be processed according to the laser energy required by the material to be processed.
The invention has the following beneficial effects:
according to the laser processing device and the laser processing method provided by the embodiment of the invention, the transmission direction of the emergent laser of the laser source is parallel to the extending direction of the moving rod; each prism is arranged on the moving rod in a predetermined sequence, wherein the prism farthest from the laser source is a total reflection prism, and the rest prisms have reflectivity and transmissivity at the same time; when laser processing is performed, laser light emitted from a laser source sequentially enters each prism, is reflected by each prism, and then forms a plurality of laser beams which enter a processing table. Because the single laser beam emitted by the single laser source is divided into a plurality of laser beams by the prism to be incident to the processing table, a plurality of positions of the material on the processing table can be processed simultaneously, the utilization rate of the laser is improved, and the laser processing efficiency of the material is also improved.
Drawings
Fig. 1 is a schematic structural diagram of a laser processing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic top view of a laser processing apparatus according to an embodiment of the present invention;
fig. 3a is a second schematic structural diagram of a laser processing apparatus according to an embodiment of the present invention;
fig. 3b is a third schematic structural diagram of a laser processing apparatus according to an embodiment of the present invention;
fig. 4 is a second schematic top view of a laser processing apparatus according to an embodiment of the present invention;
fig. 5 is a flowchart of a laser processing method according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention provides a laser processing device and a laser processing method, which are used for improving the utilization rate of laser and the laser processing efficiency.
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The laser processing apparatus and the laser processing method according to the embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a laser processing apparatus according to an embodiment of the present invention includes: a laser source 11, at least two prisms 12, a motion bar 13, and a processing table 14; wherein, the outgoing laser propagation direction of the laser source 11 is parallel to the extending direction of the moving rod 13; each prism 12 is mounted on the moving rod 13 in a predetermined order, the prism 12 farthest from the laser source 11 is a total reflection prism 12, and the remaining prisms 12 have both reflectivity and transmissivity; in laser processing, laser light emitted from the laser light source 11 is sequentially incident on each prism 12, and is reflected by each prism 12 to form a plurality of laser beams, which are incident on the processing table 14.
In specific implementation, a material to be processed is placed on the processing table 14, corresponding prisms 12 are installed according to positions where the material to be processed needs to be subjected to laser processing, incident surfaces of the prisms 12 face the laser source 11, and the transmission direction of outgoing laser light of the laser source 11 is parallel to the moving rod 13, so that the outgoing laser light of the laser source 11 can be incident on the incident surfaces of the prisms 12, and light reflection and light transmission effects can be generated. In the laser processing apparatus according to the embodiment of the present invention, the prism 12 farthest from the laser source 11 is a total reflection prism, and reflects all the received laser beams in the direction of the processing table, so as to avoid the risk of the laser beams being transmitted from the prism to the outside of the apparatus. The other prisms 12 have reflectivity and transmissivity, and the latter prism 12 receives the transmitted light of the former prism 12, so that the emergent laser of the laser source 11 can be incident on the incident surface of each prism, which is a precondition for forming a plurality of laser beams; each prism 12 reflects the laser light incident on each incident surface in the direction of the processing table to form a plurality of laser beams and simultaneously processes the material on the processing table. Therefore, multiple positions of the material on the processing table are processed simultaneously, the utilization rate of laser is improved, and the laser processing efficiency of the material is improved.
Further, as shown in fig. 2, in the above-mentioned laser processing apparatus provided in the embodiment of the present invention, the laser source 11 and the moving rod 13 may be moved simultaneously along the first direction, and in actual operation, the laser source 11 and the moving rod 13 may be moved along the first direction, so that the reflected laser light of each prism 12 is incident to a desired position, and the material on the processing table is subjected to laser processing. The machining table 14 may be moved in the first direction and the second direction in the drawing, and the laser machining position may be adjusted while the prism is kept still.
As a preferred embodiment, as shown in fig. 1 and 2, each prism 12 has an incident surface (i.e., a slope surface as shown in fig. 1) for receiving the laser light, and when each prism 12 is mounted on the movable rod 13, the mounting direction of each prism 12 is ensured to be the same, and as shown in fig. 1, the incident surface of each prism 12 is disposed facing the laser light source 11. Further, the incident surfaces of the prisms 12 should be parallel to each other so that the incident angles of the laser beams emitted from the laser source 11 when they are incident on the incident surfaces of the prisms 12 are the same, thereby making the laser beams reflected toward the processing table parallel to each other. In practical applications, the prism 12 may be a right-angle prism, and the incident surface and the processing table form an angle of 45 degrees, so that when the laser beam enters the incident surface of each prism 12 at an incident angle of 45 degrees, the laser beam reflected by each prism 12 vertically enters the processing table 14, and at this time, the intensity of the laser beam is the maximum compared with the case of oblique incidence, and the laser beam processing method is beneficial to adjusting the emitting position of each laser beam, and avoids the complex situations of laser beam crossing and the like.
In concrete implementation, in the laser processing apparatus provided in the embodiment of the present invention, the transmittance of each prism 12 decreases with an increase in distance from the laser light source 11, and the reflectance of each prism 12 increases with an increase in distance from the laser light. In practical applications, when laser processing is performed on materials, the laser energy required by the same material is basically consistent, so that if the energy of the reflected laser beam of each prism 12 is consistent, the reflectivity is smaller as the transmittance of the prism 12 closer to the laser source 11 is larger, and the reflectivity is larger as the transmittance of the prism 12 farther from the laser source 11 is smaller; the prism 12 farthest from the laser light source 11 has a transmittance of 0 and a reflectance of 100%.
For example, when the laser processing apparatus includes only two prisms, the prisms are numbered at a distance from the laser source 11, and the reflectivity of the prism 1 is 50% and the transmittance is 50%; the prism 2 has a reflectance of 100% and a transmittance of 0. When the laser processing device includes three prisms, the reflectivity of the prism 1 is 33%, and the transmittance is 67%; the prism 2 has a reflectance of 50% and a transmittance of 50%; the prism 3 has a reflectance of 100% and a transmittance of 0.
Thus, the energy of the laser beams incident on the processing table 14 can be equalized by the above-described arrangement. Of course, different materials are simultaneously processed on the processing table, and when laser beams with different energies are needed, the reflectivity and the transmittance of each prism can be adjusted to meet the processing requirements.
Further, as shown in fig. 3a and 3b, the laser processing apparatus according to an embodiment of the present invention further includes: a plurality of sliding portions 15 that slide along the moving rod 13 in one-to-one correspondence with the prisms 12, and the prisms 12 are attached to the sliding portions 15 corresponding thereto. Each prism 12 is attached to the corresponding slide portion 15, and the prism 12 can be slid in the extending direction of the movement bar, so that the position of the prism can be adjusted in two directions. Specifically, as shown in fig. 4, the moving bar 13 is movable in the first direction in fig. 4, and each prism 12 is movable in the second direction on the moving bar, whereby the position of each prism 12 can be adjusted in the first direction and the second direction at the same time so that the position where the reflected laser light enters the processing table 14 becomes the position where the laser processing is required.
As shown in fig. 3a and 3b, the laser processing apparatus according to an embodiment of the present invention further includes: a shutter member 16 for controlling the transmission and cut-off of the laser light between two adjacent prisms 12, as shown in fig. 3a and 3b, the shutter member 16 may be provided on the corresponding sliding portion 15 together with one prism 12 located in front of the optical path for opening or closing the optical path after using the prism on one sliding portion 15. When the shutter member 16 is in the closed state, the laser beam propagation behind the shutter member 16 can be cut off (see fig. 3a), and when the shutter member 16 is in the open state, the emission beam of the laser source can sequentially transmit through the prisms until the laser beam is incident on the prism at the farthest distance (see fig. 3 b). By adopting the shutter part 16, the multi-beam laser can be cut off quickly under the condition of not closing the laser source 11, the installation is convenient and fast, and the efficiency is improved.
In practical applications, as shown in fig. 4, the laser processing apparatus provided in the embodiment of the present invention further includes: an energy meter 17 located outside the processing table 14 and corresponding to the position of each prism 12; the energy meter is used to measure the laser energy reflected by the corresponding prism 12. During specific operation, before laser processing, the movable rod 13 and the laser source 11 can be moved to the outside of the edge of the processing table along the first direction at the same time, then each energy meter 17 is adjusted to be positioned on the light path of the laser reflected by each prism 12, after the position of each energy meter 17 is adjusted, the laser source 11 is started and the emission intensity of the laser source is adjusted, so that whether the energy of each beam of reflected laser meets the use requirement or not is measured, and when the energy meets the use requirement, the movable rod 13 and the laser source can be moved back to the preset position where laser processing is needed at the same time, so that the material to be processed on the processing table is processed; when the laser energy of the reflected light does not meet the requirement, the emergent light intensity of the laser source and the reflectivity and the transmissivity of each prism are reset according to the required laser energy until the required laser energy meets the use requirement.
Since each prism 12 is mounted on the moving rod 13, the energy meters 17 can be arranged side by side in a line parallel to the moving rod 13. For example, each energy meter 17 may be slidably attached to a fixed bar that is parallel to the moving bar 13, whereby the position of each energy meter 17 can be adjusted to correspond to each prism 12 by simply sliding each energy meter 17 along the fixed bar.
In actual laser processing, the position of laser processing needs to be strictly aligned to ensure the processing accuracy of the material. Therefore, the alignment mark may be provided at a set distance in the vicinity of the position where the material needs to be processed, for example, the alignment mark may be sequentially added to the position where the material needs to be processed along the second direction in fig. 4, and an image pickup device such as a CCD may be added at a position before or after each prism, where the distance between the image pickup device and the prism is equal to the set distance and corresponds to the position of the alignment mark, and after the image pickup device is aligned with the alignment mark marked on the material to be processed, the laser source 11 is turned on to laser process the material.
Based on the same inventive concept, the embodiment of the invention also provides a laser processing method based on any one of the laser processing devices. As shown in fig. 5, the laser processing method provided in the embodiment of the present invention specifically includes the following steps:
s501, adjusting the position of each prism right above each set position according to the set position of the material to be processed, which needs to be subjected to laser processing;
s502, determining the reflectivity and the transmissivity of each prism according to the laser energy required by the material to be processed for laser processing;
and S503, starting the laser source to enable the emergent laser to enter each prism, and enabling the reflected laser of each prism to enter the set position of the material to be processed by the laser energy required by the material to be processed.
The embodiment of the invention provides the laser processing method based on the situation that the laser processing device vertically inputs the laser beams into the processing table. Specifically, after the set position of the material to be processed, which needs to be processed by laser processing, is determined, the moving rod is moved, and the prisms are moved along the moving rod to adjust the positions of the prisms, so that the reflected light of the prisms can be just incident to the set positions. When the same material is subjected to laser processing, the required laser energy is consistent, so that the reflectivity of a prism which is closer to a laser source is smaller, and the transmittance is higher; the farther the prism is from the laser source, the larger the reflectivity is, the smaller the transmittance is; the reflection of the prism farthest from the laser source was 100%, and the transmittance was 0. Specifically, the reflectivity and the transmittance are calculated according to the number of the prisms, and the energy of the laser reflected by each prism is equal through reasonable setting of the reflectivity and the transmittance. Therefore, multiple positions of the material on the processing table can be processed simultaneously, the utilization rate of laser is improved, and the laser processing efficiency of the material is improved.
In practical implementation, after the step S501, the following steps (not shown in the figure) are further included:
adjusting the position of each energy meter to correspond to the adjusted position of each prism;
and after the movable moving rod moves each prism to be right above each energy meter, starting the laser source, and measuring whether the reflected laser energy of each prism meets the energy requirement of the set position of the material to be processed.
Accordingly, the step S503 specifically includes:
when the measured reflected laser energy of each prism meets the energy requirement of the set position of the material to be processed, the movable rod moves each prism to return to the set position, then the laser source is started to enable the emergent laser to enter each prism, and at least two beams of reflected laser enter the set position of the material to be processed according to the laser energy required by the material to be processed.
When the energy of each beam of reflected laser is measured, each prism and the corresponding energy meter can be numbered, each energy meter is connected with the processor, the processor judges whether the energy of each beam of reflected laser meets the actual use requirement or not according to each energy meter, and when the energy of each beam of reflected laser does not meet the requirement, prompt is carried out, so that the laser source or the prism with the corresponding number is adjusted, and laser processing operation is carried out when the laser energy measured by each energy meter meets the requirement.
According to the laser processing device and the laser processing method provided by the embodiment of the invention, the transmission direction of the emergent laser of the laser source is parallel to the extending direction of the moving rod; each prism is arranged on the moving rod in a predetermined sequence, wherein the prism farthest from the laser source is a total reflection prism, and the rest prisms have reflectivity and transmissivity at the same time; when laser processing is performed, laser light emitted from a laser source sequentially enters each prism, is reflected by each prism, and then forms a plurality of laser beams which enter a processing table. Because the single laser beam emitted by the single laser source is divided into a plurality of laser beams by the prism to be incident to the processing table, a plurality of positions of the material on the processing table can be processed simultaneously, the utilization rate of the laser is improved, and the laser processing efficiency of the material is also improved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A laser processing apparatus, comprising: the laser processing device comprises a laser source, at least two prisms, a moving rod and a processing table; wherein,
the outgoing laser propagation direction of the laser source is parallel to the extending direction of the moving rod; each prism is arranged on the moving rod in a predetermined sequence, the prism farthest away from the laser source is a total reflection prism, and the rest prisms have reflectivity and transmissivity at the same time;
during laser processing, outgoing laser of the laser source sequentially enters each prism, and forms a plurality of laser beams after being reflected by each prism and enters the processing table;
the laser processing apparatus further includes: the energy meters are positioned outside the processing table and correspond to the positions of the prisms one by one; the energy meter is used for measuring the laser energy reflected by the corresponding prism.
2. The laser processing apparatus of claim 1, wherein the incident surfaces of the laser light incident on the prisms are parallel to each other, and the incident angles of the laser light emitted from the laser light source incident on the incident surfaces of the prisms are the same.
3. The laser processing apparatus according to claim 1, wherein the transmittance of each of the prisms decreases with increasing distance from the laser light source, and the reflectance of each of the prisms increases with increasing distance from the laser light source.
4. The laser processing apparatus according to claim 3, wherein the difference in energy of the respective laser beams incident to the processing stage is within a predetermined range.
5. The laser processing apparatus according to any one of claims 1 to 4, further comprising a plurality of sliding portions that slide along the moving rod in one-to-one correspondence with the respective prisms, each of the prisms being mounted on the sliding portion corresponding thereto.
6. The laser processing apparatus according to any one of claims 1 to 4, further comprising: and the shutter component is positioned between two adjacent prisms and used for controlling laser transmission and cutting off.
7. The laser processing apparatus of claim 1, wherein each of the energy meters is disposed in a line parallel to the moving bar.
8. A laser processing method based on the laser processing apparatus according to any one of claims 1 to 7, comprising:
adjusting the position of each prism right above each set position according to the set position of the material to be processed, which needs to be subjected to laser processing;
determining the reflectivity and the transmissivity of each prism according to the laser energy required by the material to be processed for laser processing;
starting the laser source to enable the emergent laser to enter each prism, and enabling the reflected laser of each prism to enter the set position of the material to be processed according to the laser energy required by the material to be processed;
after adjusting each prism to be located right above each set position according to the set position of the material to be processed, which needs to be processed by laser, the method further comprises the following steps:
adjusting the position of each energy meter to correspond to the adjusted position of each prism;
after the moving rod is moved to move the prisms to be right above the energy meters, the laser source is started, and whether the energy of the reflected laser of each prism meets the energy requirement of the set position of the material to be processed is measured;
the starting of the laser source enables the emergent laser to enter each prism, and at least two beams of reflected laser enter the set position of the material to be processed with laser energy required by the material to be processed, and the laser processing method comprises the following steps:
when the measured reflected laser energy of each prism meets the energy requirement of the set position of the material to be processed, the moving rod is moved to move each prism to return to the set position, then the laser source is started to enable the emergent laser to enter each prism, and at least two beams of reflected laser enter the set position of the material to be processed according to the laser energy required by the material to be processed.
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| CN111014977A (en) * | 2019-12-23 | 2020-04-17 | 深圳光韵达光电科技股份有限公司 | Femtosecond laser cutting device and method for SMT laser steel mesh |
| CN111215744B (en) * | 2020-01-10 | 2020-11-06 | 深圳市大德激光技术有限公司 | Laser energy light splitting method and device |
| CN112157294B (en) * | 2020-08-13 | 2023-08-01 | 北京机械设备研究所 | Device and method for punching mounting holes in equipment cabin |
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| CN103387335A (en) * | 2012-05-11 | 2013-11-13 | 灿美工程股份有限公司 | Substrate cutting device and substrate cutting method |
| CN203817634U (en) * | 2014-03-27 | 2014-09-10 | 深圳市大族激光科技股份有限公司 | Multihead efficient laser processing system |
| CN203951033U (en) * | 2014-05-16 | 2014-11-19 | 天津纳正科技有限公司 | A kind of micro-processing laser |
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