CN106653724A - Packaged assembly structure - Google Patents
Packaged assembly structure Download PDFInfo
- Publication number
- CN106653724A CN106653724A CN201510727407.9A CN201510727407A CN106653724A CN 106653724 A CN106653724 A CN 106653724A CN 201510727407 A CN201510727407 A CN 201510727407A CN 106653724 A CN106653724 A CN 106653724A
- Authority
- CN
- China
- Prior art keywords
- pad
- lead frame
- tube core
- intermediate substrate
- package assembling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 8
- 238000010168 coupling process Methods 0.000 claims 8
- 238000005859 coupling reaction Methods 0.000 claims 8
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000005728 strengthening Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 3
- 238000005538 encapsulation Methods 0.000 description 9
- 239000012778 molding material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention provides a packaged assembly structure. The packaged assembly structure comprises a lead wire frame which is provided with an upper side surface and a lower side surface which faces the upper side surface. The lead wire frame comprises a tube core connecting pad, wherein a tube core connecting area is defined on the lower side surface which faces the upper side surface. Pad cushions surround the pipe core connecting area. A plurality of pins are arranged at preset positions at periphery of the tube core connecting pad on the upper side surface. A plurality of lock pins are integrally formed on the lead wire frame and upwards projects from the upper side surface.
Description
Technical field
The present invention relates to have the lead frame of passive element intermediate structure.Especially, lead frame is modified to strengthen
The mechanical anchor of intermediate structure, the intermediate structure is placed with thereon passive element.
Background technology
Must be able to run in harsh environments for the electronic component and system in automobile application.In engine room
Portion, the possible scope of operating temperature is from -40 DEG C to more than 125 DEG C.Element on contact ground, such as dust, grease, salt
Deng causing deleterious effect to mechanically and electrically subcomponent.Substantial amounts of these elements are the combinations of discrete passive element, passive element
For example it is attached to capacitor, the inductor of IDE, and resistor.
As increasing automobile mechanical element is replaced by electronic product, exist for designing and set up element and electronics
Subsystem (i.e. engine control system, anti-lock braking system, control system of safety air bag, security system, etc.) has
The various demands of conflict, it is not only durable but also cost-effective so as to realize.Electronic product is even when exposed to more under severe operating environment
Year all must be reliable.The failure of these elements is possibly catastrophic.
A kind of encapsulation technology that passive element is combined with integrated circuit, this encapsulation technology is needed to need enough robustness
To bear harsh automotive environment.
The content of the invention
The application is found to be useful in assembly element, can stand strict automotive environment.Integrated circuit quilt
It is arranged on the first surface of lead frame and is electrically connected to first surface.Other passive element is arranged on Intermediate substrate
On.Intermediate substrate is arranged on the surface relative with first surface.In some applications, passive element is arranged on Intermediate substrate
On, it is possibly connected to by the mechanical interlocking connector on Intermediate substrate and on the surface of the opposite side of lead frame integrated
On circuit on selected pad.Locking connector in lead frame or in Intermediate substrate is probably lock pin or receives lock pin
Locking bed.These locking connectors provide mechanical strengths by the Intermediate substrate being implanted into by passive element and lead frame and appended
The integrated circuit for connecing is combined together.The component of lead frame, Intermediate substrate and integrated circuit is generally sealed in encapsulating structure
In system in molding material in.In a specific example, sealed in unit is a part for automobile burglar control system.
In the embodiment of an example, package assembling structure include lead frame, lead frame have uper side surface and
Relative downside surface.Lead frame includes that tube core connects pad, wherein defining tube core bonding pad on relative downside surface；
Pad pad surrounds tube core bonding pad.Multiple lock pins are arranged in the pre-position around uper side surface tube core connection pad.This
The characteristics of individual embodiment is that multiple lock pins may be integrally formed in lead frame.
In another embodiment, electronic equipment includes the lead frame with uper side surface and relative downside surface,
Lead frame includes that tube core connects pad, and wherein tube core bonding pad is defined on relative downside surface, and pad pad surrounds tube core
Bonding pad；And the pre-position around tube core of the multiple locking coupled arrangements of same nature on uper side surface.It is middle
There is substrate the locking that the locking of opposite nature corresponding with precalculated position is coupled to frictionally receive lead frame to couple simultaneously
Mechanical connection between lead frame and Intermediate substrate is provided；Intermediate substrate is arranged on the uper side surface of lead frame.In
Between substrate have definition for passive circuit region.Active device tube core is attached to the relative downside table of lead frame
Tube core bonding pad on face, the pad of active device tube core is electrically connected to pad pad by conductive interconnection.
Above brief summary is not intended to that each embodiment of the interior present invention, or each aspect is presented.It is in figure and following
Detailed description in provide further embodiment.
Description of the drawings
The application is by the detailed description of following various embodiments and combines accompanying drawing and may be better understood, wherein：
Figure 1A -1C show the passive element group on the single lead frame in prior art in electric theft-proof system encapsulation
Part and IDE.
Fig. 2A -2D show the side view of component according to embodiments of the present invention；
Fig. 3 A-3D show the side view of component according to embodiments of the present invention；
Fig. 4 A-4C show the top view of the embodiment of automotive components component of the invention；
Fig. 5 A-5B show the lead frame with lock pin of the invention and the Intermediate substrate being attached thereon；
Fig. 6 shows the lead frame that Intermediate substrate is attached via lock pin of the invention；
Fig. 7 A-7B show the lead frame with Intermediate substrate assembling of the invention, passive element implantation intermediate base
Plate；
Fig. 8 shows the assembling flow path figure of equipment of the invention.
When the application can be changed to various modifications and alternative forms, what is be shown in which in an illustrative manner in the accompanying drawings is thin
Save and will be described in.It should be appreciated, however, that it is not intended to limiting the invention to specific described
Embodiment.Conversely, its purpose is to cover to fall all of in the scope of the present invention and thought that claim is limited
Modification, equivalent and its replacement.
Specific embodiment
Disclosed embodiment is useful in terms of the reliability of assembly element is increased, and assembly element includes being connected to tool
There is integrated circuit (IC) equipment of the structure of passive element, such as resistor, capacitor and inductor.In the enforcement of an example
In example, on the front side surface of lead frame substrate, it is located on front side surface with the IC of lead frame substrate attachment, active equipment
Pad is wirebonded to defined region on lead frame.Other passive element is set (typically via attachment two
Technique) on detached Intermediate substrate.Intermediate substrate is attached to into the relative back surface of lead frame via locking connector.
Locking connector includes lead frame or the hole in Intermediate substrate or lock pin, and with contrary property.In lead frame
Predefined conductive trace specific IC equipment pin is bonded via IC fixture wires and locking connector is connected to
Predetermined trace is connected to selected passive element.Component is encapsulated in molding material.In the embodiment of example, used
Specific encapsulation is electric theft-proof system encapsulation, and it is similar to plastics dual-inline package (PDIP).In these embodiments,
Other element outside integrated circuit is grouped together to set up the circuit subsystem for adapting to single package.
With reference to Figure 1A -1C, on the uper side surface of lead frame assembly 5, with for arranging the pad of passive element, nothing
Source element is, for example, chip capacitor 15, with the contact 20 for coil 10.Passive element is bonded and is welded to lead frame
On component 5.On the relative downside surface of lead frame 5, equipment tube core 25 is soldered to tube core attachment regions 30 (such as dotted line frame
It is shown), pipe core welding disc 35 is electrically connected to leadframe pad pad (" finger ") 40 by wire bonding area 45.Circuit unit 55 is close
In being enclosed in appropriate molding material 50, cause LSP encapsulation 60.
Existing LSP package assemblings can suffer from the viscose glue that element is attached on lead frame and cause drawing for failure
Stripping between wire frame.Additionally, during manufacturing process, due to connecting in element between the flowing of conducting resinl may cause
Be short-circuited circuit between passive element.Process from production, gluing element may be removed from lead frame.
According to the application, passive element is integrated on Intermediate substrate, for example printed circuit board (PCB) (PCB), so as to become nothing
Source element unit.In one embodiment, lead frame has multiple lock pins for defining thereon.These lock pins take passive unit
Position defined in part unit；Lock pin improves the mechanical engagement of passive element and lead frame.In one embodiment, lock pin rubs
Wiping is engaged on the hole defined in passive element unit；Optionally after their friction engagement, lock pin may be soldered
To provide electrical connection.Lead frame has tube core bonding pad, and IC equipment is soldered on the tube core bonding pad.Tube core bonding pad quilt
Pad pad is surrounded, and pipe core welding disc is wirebonded on the pad pad.According to design requirement, appropriate pin quilt on IC equipment
It is connected on passive element.Lead frame, middle passive element unit, and the component of equipment tube core are sealed in molding material.
With reference to Fig. 2A -2D, in one embodiment, in component 100, during coil and other passive elements 105 are attached to
Between substrate 110.Intermediate substrate 105 has lock pin 115.On the uper side surface of lead frame 120, Intermediate substrate 105 is inserted into
To in lead frame 120, lead frame 120 has locking bed 125 to receive the lock pin 115 of Intermediate substrate 110.Form these locks
Pin 115 is so as to when being engaged in locking bed 125, they may be by frictional constraint.Fig. 2 B are described with coil and other nothings
The structure 130 of source element 105 and lead frame 120, coil and other passive elements 105 are assembled in intermediate structure 110,.
On the downside surface of lead frame 120, the appropriate die bond material 135 of equipment tube core 140 is come die bonding.Tube core is welded
It is probably to use viscose glue, solder, ultrasonic bonding, etc. to connect 135.Wire bonding 145 is set with the connection of corresponding lead frame finger
The tube core terminal pad 142 of standby tube core 140, so as to provide equipment tube core 140 is electrically connected to.The predetermined position on lead frame 120
Offer electrical connection is provided and travels to and fro between passive element and equipment tube core 140.Generally, lock pin 115 is soldered on lead frame 120 and makes a reservation for
Position forming electrical connection.By assembling all of element, equipment tube core 140, Intermediate substrate 110 and passive element 105
Component 150, in being sealed to molding material 160.The complete equipment 170 of Fig. 2 D experiences additional process steps to prepare for final
The equipment of user.
With reference to Fig. 3 A-3D, in another embodiment, coil and other passive elements 205 are attached to intermediate structure 210
In.Locking bed 225 is defined thereon.Lead frame 220 has lock pin 215, when intermediate structure 210 is arranged on lead frame 220
Side on when, lock pin 215 is engaged with the locking bed 225 of intermediate structure 210.In one embodiment, these lock pins 215 can
To be welded on locking bed 225 being electrically connected between the passive element to strengthen lead frame 220 and be arranged in intermediate structure 210
Connect.Fig. 3 B show the equipment 230 of members.With reference to Fig. 3 C.On the relative downside surface of lead frame 220, equipment
Tube core 240 is the tube core that lead frame 220 is attached to appropriate die bond material 235.Wire bonding area 245 will be corresponding
Lead frame finger is connected pad 242 and connects with the tube core of equipment tube core 240, and so as to provide equipment tube core 240 is electrically connected to.Group
Part 250 is sealed in molding material 260.The complete equipment 270 of Fig. 3 D experiences other processing step to prepare for final
The equipment of user.
With reference to Fig. 4 A-4C, in one embodiment, lead frame 300 has uper side surface and relative downside surface.
On the uper side surface of lead frame 300, dashed region 310 defines and surrounds complete active circuit/Passive Module component
The region of lead frame.On the relative downside surface of lead frame 300, tube core bonding pad 315 is defined by dotted line.Lock pin
320 are defined within five positions (320a-e).In further embodiments it is possible to only one of which lock pin.Put down to define geometry
Face and raising rigidity, distribute in the plane three lock pins.The welding equipment tube core on the relative downside surface of lead frame 300
350.Pad 345 is electrically connected to pad pad 335 via bonding wire 340.The region defined by dotted line 310 is in equipment tube core and passive
By the lead frame of rib cutting after the assembling of apparatus assembly 350.On inactive component component (intermediate structure) 350, five positions
(325a-e) engagement of corresponding hole (i.e. locking bed) 325 lock pin 320 in.It is passive comprising coil 330 and chip capacitor 335
Equipment is soldered on the substrate of intermediate structure 350.After with the engagement lock pin 320 of locking bed 325, lock pin 320 may pass through
Friction is adhered or welded to these locking bed positions and is mechanically protected.Position 325 may have metal throuth hole to electroplate simultaneously
Various passive elements 330,335 are connected to into specific equipment pad, these specific equipment pads are connected to specific weldering
Plate mat 335.With reference to Fig. 4 C, complete component 375 is sealed in appropriate molding material.After the sealing, cut at border 310
Muscle lead frame.
With reference to Fig. 5 A-5C, in one embodiment, lead frame 400 has three (A- of lock pin 420 being integrally formed
C), lead frame 400 receives the intermediate structure with corresponding locking bed.Tube core bonding pad 415 is in the downside of lead frame 400
On surface.Pad pad 425 surrounds tube core bonding pad.Dotted line X, X ' and Y, Y ' definition region, in this region, according to the present invention
Rib cutting lead frame 400 after electronic building brick assembling.Fig. 5 B show the close-up view of the lock pin 420a on lead frame 400.
Note in figure 5b, lock pin 420a-420c is bent up and vertical with the plane surface of lead frame 400.Vertical lock pin
420a-420c engagements are located at the locking bed position in the Intermediate substrate being attached thereon.
With reference to Fig. 6, in one embodiment, the lead frame 500 with Intermediate substrate 525 is attached via lock pin 510 and 520
It is connected to lead frame 500.
With reference to Fig. 7 A-7B, in one embodiment, component 700 has lead frame 710, and lead frame 710 has lock pin
720, Intermediate substrate 715 is attached to lock pin 720.Passive element 720 and coil 730 are soldered on Intermediate substrate 715.At some
Using in, lock pin 710 may frictionally engage Intermediate substrate 715, or be engaged by welding or combining.Some other
Using in, the through hole in Intermediate substrate 715 may be electroplated to promote electrical connection or may simply be mechanically connected with by intermediate base
Plate 715 is fixed to the lock pin 720 of lead frame 710.Be mechanically connected is probably hole and lock pin is sized so as to lock pin rubs
Wipe engaging hole.
With reference to Fig. 8, in the technique of step 810 example, the particular element with charging classification, charging includes lead frame
And passive element.Lead frame may have device location array.In step 820, at predetermined position, in lead frame
Upper formation lock pin.Return to Fig. 5 A-5B, the overall lock pin 420A-420C of lead frame 400, may be bent up and perpendicular to
The plane of lead frame 400.Then in step 830, passive element unit is attached on the first side of lead frame.In step
In rapid 840, IC equipment is attached on the second relative side of lead frame.In step 850, IC equipment is wire-bonded.Connect
In step 860, manufacture all of electrical connection, component is sealed in molding material.In step 870, the unit battle array of assembling
Row are by rib cutting and formed in each equipment.Then in step 880, each equipment experiences before end user is transported to
" final electricity " test 880.
According to the application, the encapsulated type of other components may be used.Lead frame may be modified to accommodate suitably matches somebody with somebody
The intermediate structure put.In addition, embodiments herein is applied to encapsulation in system in all of common encapsulation, and encapsulation.
The tool of production of correlation can be designed to promote assembling.
Each embodiment is described with reference to specific illustrative example.The example of example is selected to help the common skill of this area
Art personnel form and are apparent from, and implement each embodiment.However, the system with one or more embodiments, structure,
With the scope of equipment, and the scope of the method implemented according to one or more embodiments, be not limited to be proposed completely is specific
Embodiment.Conversely, those of ordinary skill in the art based on the description can with it is well recognized that, may implement according to each reality
Apply many other structures, arrangement and the method for example.
Used in the description of the present application with regard to positional representation such as upside, downside, above, following, can be with
It is understood by these expressions to be given with reference to corresponding figure, and if the direction of equipment becomes during manufacture or operation
Change, other positions relation may be applied alternatively.As described above, the description of these position relationships is for the sake of clarity, and not
It is to limit.
The application with regard to specific embodiment and certain figures description, but the invention is not restricted to this, but by right will
Ask proposition.Described figure is simply illustrated, rather than limits.In these figures, for illustrative purposes, the chi of each element
It is very little to be exaggerated and not amplify according to a specific ratio.Its objective is that the application covers the property in relative tolerance, element
With the unessential change in operator scheme.Its purpose is to cover faulty enforcement of the invention.
The term " including " for being used in the specification and in the claims, is not intended to exclude other elements or step
Suddenly.Therefore, term " including " should not be limited to items listed thereafter；It excludes other elements or step, therefore for
Scope " a kind of equipment includes A and B " described below, the equipment of being not limited to only includes element A and element B.This expression table
Show, according to the application, device-dependent element is A and B.
In the thought of the invention and scope limited without departing from claim, many other embodiment pair of the application
In those skilled in the art be clearly.
Claims (13)
1. a kind of package assembling structure, it is characterised in that include：
Lead frame with uper side surface and relative downside surface, lead frame includes：
Tube core connects pad, wherein defining tube core bonding pad on relative downside surface；
Surround the pad pad of tube core bonding pad；With
On uper side surface, multiple lock pins of the pre-position being disposed in around tube core connection pad.
2. package assembling structure according to claim 1, it is characterised in that plurality of lock pin is integrally formed into lead
It is on framework and protruding upward from uper side surface.
3. package assembling structure according to claim 1, it is characterised in that multiple lock pins are at least.
4. package assembling structure according to claim 3, it is characterised in that multiple lock pins are at least two.
5. package assembling structure according to claim 4, it is characterised in that one or more lock pins be electrically connected to one or
Multiple corresponding pad pads.
6. package assembling structure according to claim 5, it is characterised in that also include,
With the Intermediate substrate through the hole of plate, this some holes is defined within position corresponding with the precalculated position on lead frame,
Hole through plate frictionally accommodates lock pin on the lead frame, and Intermediate substrate has conductive trace for via through plate
Passive element is connected to each other and is connected to selected pad pad by hole；With
Wherein at least selects passive element from the next one：Inductor, capacitor, resistor.
7. package assembling structure according to claim 6, it is characterised in that welding is through the hole of plate strengthening Intermediate substrate
Electrical connection and lead frame between.
8. package assembling structure according to claim 6, it is characterised in that also include,
Integrated circuit (IC) equipment tube core, IDE tube core has the pad around active circuit；
The IC equipment tube core and pad for being wherein welded to tube core bonding pad is electrically coupled to pad pad by conductive interconnection；With
Wherein package assembling is besieged in the encapsulant.
9. package assembling structure according to claim 8, it is characterised in that wherein conductive interconnection selects as follows：Wire bonding, band
Weldering, ball bonding.
10. a kind of electronic equipment, it is characterised in that include：
Lead frame with uper side surface and relative downside surface, lead frame includes that tube core connects pad, wherein tube core
Bonding pad is defined within relative downside surface, and pad pad surrounds tube core bonding pad；On uper side surface, same nature it is many
Individual locking coupling is disposed in the pre-position around tube core connection pad；
Intermediate substrate, the coupling of the locking with opposite nature, the lock that lead frame is received for friction corresponding with precalculated position
Close coupling, and the mechanical connection between lead frame and Intermediate substrate is provided, Intermediate substrate is arranged on the upside of lead frame
On surface；Wherein Intermediate substrate has region of the definition for passive circuit；With
The active device tube core of the tube core bonding pad being attached on the relative downside surface of lead frame, wherein active device pipe
The pad of core is electrically connected to the pad pad of lead frame by conductive interconnection.
11. electronic equipments according to claim 10, it is characterised in that on the lead frames, lock tightly coupled property class
Type selects as follows：The positive, it is negative；
If wherein property type is positive, locking coupling is pin, and the locking coupling of opposite nature is hole；With
If wherein property type is negative, locking coupling is hole, and the locking coupling of opposite nature is pin.
12. electronic equipments according to claim 11, it is characterised in that on the lead frames, selected pad pad electricity
It is connected to the locking positioned at pre-position to couple, providing to be electrically connected to from the selected region of Intermediate substrate selected has
The pad of source component pipe core, connected with passive element is to active device tube core.
13. electronic equipments according to claim 12, it is characterised in that Intermediate substrate has the passive unit being disposed thereon
Part, passive element is electrically connected to locking coupling, and locking is coupling-connected to selected pad pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510727407.9A CN106653724B (en) | 2015-10-30 | 2015-10-30 | Packaging assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510727407.9A CN106653724B (en) | 2015-10-30 | 2015-10-30 | Packaging assembly structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106653724A true CN106653724A (en) | 2017-05-10 |
| CN106653724B CN106653724B (en) | 2020-04-10 |
Family
ID=58810701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510727407.9A Active CN106653724B (en) | 2015-10-30 | 2015-10-30 | Packaging assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106653724B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6108212A (en) * | 1998-06-05 | 2000-08-22 | Motorola, Inc. | Surface-mount device package having an integral passive component |
| US20070145563A1 (en) * | 2005-12-28 | 2007-06-28 | Punzalan Nelson V | Stacked packages with interconnecting pins |
| US20090289336A1 (en) * | 2007-10-25 | 2009-11-26 | Meghro Kouichi | Semiconductor device and method for manufacturing thereof |
| US20130181332A1 (en) * | 2012-01-18 | 2013-07-18 | Intersil Americas LLC | Package leadframe for dual side assembly |
-
2015
- 2015-10-30 CN CN201510727407.9A patent/CN106653724B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6108212A (en) * | 1998-06-05 | 2000-08-22 | Motorola, Inc. | Surface-mount device package having an integral passive component |
| US20070145563A1 (en) * | 2005-12-28 | 2007-06-28 | Punzalan Nelson V | Stacked packages with interconnecting pins |
| US20090289336A1 (en) * | 2007-10-25 | 2009-11-26 | Meghro Kouichi | Semiconductor device and method for manufacturing thereof |
| US20130181332A1 (en) * | 2012-01-18 | 2013-07-18 | Intersil Americas LLC | Package leadframe for dual side assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106653724B (en) | 2020-04-10 |
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