CN106596716A - Array ultrasonic sensor and manufacturing method - Google Patents

Abstract

The invention relates to an array ultrasonic sensor and a manufacturing method thereof, wherein the array ultrasonic sensor comprises: first piezoelectric vibrating plate, first backup pad, base plate and apron. The first supporting plate is provided with a through hole or a blind hole which is correspondingly arranged with the first vibration area, and the first supporting plate is connected with the first piezoelectric vibration plate. The ultrasonic wave radiation holes and the first vibration areas are arranged correspondingly one by one. The apron inside wall is equipped with a plurality of division board that is located between the adjacent first vibration district. The base plate is connected with the first supporting plate and is provided with more than two control units which are arranged corresponding to the first electrodes one by one. The control unit forms independent ultrasonic wave receiving and dispatching array element with first piezoelectricity vibration board, first electrode, first backup pad, can realize array ultrasonic sensor's integration for the interval of adjacent first vibration district can be less than half wavelength of ultrasonic emission signal, just can avoid producing other bars phenomenon, convenient operation through ultrasonic emission array element time delay transmission ultrasonic signal.

Description

Array ultrasonic sensor and manufacturing method

technical field

The invention relates to an ultrasonic sensor, in particular to an array ultrasonic sensor and a manufacturing method.

Background technique

The traditional array ultrasonic sensor is formed by arranging multiple independent ultrasonic transducer wafers in an array. However, due to the volume of the ultrasonic probe itself, when adjacent ultrasonic transducer chip units are arranged side by side, the distance between the ultrasonic transducer chip units cannot be reduced to half the emission signal wavelength of the transmitting unit. Side grid phenomenon is easy to occur between wafer units. In order to avoid the side grid phenomenon, it is often necessary to control the emission angle of the ultrasonic emission unit, but this operation is more troublesome.

Contents of the invention

Based on this, it is necessary to overcome the defects of the prior art, and provide an array ultrasonic sensor and a manufacturing method, which can reduce the distance between the ultrasonic transducer chip units, so as to avoid the occurrence of side grid phenomenon.

Its technical solution is as follows: an array ultrasonic sensor, including: a first piezoelectric vibration plate, the first piezoelectric vibration plate has more than two first vibration regions, and the first vibration regions are provided with first electrodes; A support plate, the first support plate is provided with through holes or blind holes corresponding to the first vibration area, the first support plate is connected to the first piezoelectric vibration plate; the substrate, the substrate Connected to the first support plate, the substrate has more than two control units, the control units are arranged corresponding to the first electrodes one by one, and the control units are electrically connected to the first electrodes; and A cover plate, the cover plate is set outside the first piezoelectric vibration plate, and the cover plate is provided with more than two ultrasonic radiation holes, and the ultrasonic radiation holes are set corresponding to the first vibration area one by one, There are several partition plates on the inner side wall of the cover plate, and the partition plates are located between adjacent first vibration zones.

In the above-mentioned array ultrasonic sensor, the control unit and the corresponding first electrode, the first piezoelectric vibration plate, and the through holes of the first support plate can form an independent ultrasonic transceiver array element, and the control unit, the first electrode, and the first support plate There are more than two through holes, and they are arranged correspondingly one by one, so that a plurality of independent ultrasonic transceiver array elements can be formed, and the integration of array ultrasonic sensors can be realized. In this way, this embodiment will not be limited by the volume of the ultrasonic probe as the arrangement spacing of the array ultrasonic sensor in the prior art, and the distance between adjacent first vibration regions in the array ultrasonic sensor of this embodiment can be reduced to be less than or equal to the ultrasonic transmission signal half of the wavelength, so that when the array ultrasonic sensor is in use, the ultrasonic emitting element can avoid the generation of the side grid phenomenon by delaying the emission of the ultrasonic signal, and it is not necessary to solve it by adjusting the emission angle of the ultrasonic emitting element as in the prior art. The operation is more convenient.

In one of the embodiments, the array ultrasonic sensor further includes a second piezoelectric vibrating plate arranged between the first supporting plate and the substrate; the second piezoelectric vibrating plate has more than two second The vibration area, the second vibration area is provided with a second electrode, and the second electrode is electrically connected to the control unit.

In one of the embodiments, the array ultrasonic sensor further includes a second support plate arranged between the second piezoelectric vibration plate and the substrate, the second support plate is provided with the second vibration Through holes or blind holes set accordingly in the area. Of course, in other embodiments, a blind hole with an opening facing the second vibration area may also be provided on the substrate, so that during the vibration of the substrate, the blind hole is equivalent to an avoidance position for avoiding the second piezoelectric vibration plate expanding outward. In this embodiment, both the first piezoelectric vibration plate and the second piezoelectric vibration plate are piezoelectric ceramic plates.

In one of the embodiments, the substrate is provided with more than two pad electrodes, the pad electrodes are arranged corresponding to the first electrodes one by one, and the pad electrodes are connected to the first electrodes, The second electrodes are electrically connected. In this embodiment, the conductive member can be a wire or a conductive film layer sintered from conductive Ag/Pt paste, and a wiring hole or a conductive film layer through which the wire passes is provided on the first vibration plate or the second vibration plate Through the through hole, the pad electrode can be electrically connected to the conductive element through the conductive adhesive.

In one of the embodiments, there are more than two first electrodes provided in the first vibration area, and the first electrodes are distributed in the first piezoelectric vibration plate at intervals up and down; There are more than two second electrodes, and the second electrodes are distributed in the second piezoelectric vibration plate at intervals up and down.

The present invention also provides a method for manufacturing an array ultrasonic sensor, comprising the following steps:

Provide more than one first piezoelectric ceramic prepreg, second piezoelectric ceramic prepreg, more than one third piezoelectric ceramic prepreg, substrate and cover plate, and print on the first piezoelectric ceramic prepreg For more than two first electrodes, two or more through holes corresponding to the positions of the first electrodes are processed on the second piezoelectric ceramic prepreg, and printed on the third piezoelectric ceramic prepreg. More than two second electrodes corresponding to the positions of the through holes;

The first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg are stacked and pressed together, and then jointly fired and solidified to obtain an ultrasonic vibration mechanism;

Assemble the ultrasonic vibration mechanism, the base plate and the cover plate together.

In the manufacturing method of the above-mentioned array ultrasonic sensor, the first piezoelectric ceramic prepreg is equivalent to the first piezoelectric vibrating plate after being fired, the second piezoelectric ceramic prepreg is equivalent to the first supporting plate after being fired, and the second piezoelectric ceramic prepreg is equivalent to the first support plate after being fired. The three piezoelectric ceramic prepregs are equivalent to the second piezoelectric vibrating plate after firing. The array ultrasonic sensor obtained by the above manufacturing method can realize the integration of the array ultrasonic sensor; in addition, the distance between the adjacent first electrodes printed on the first piezoelectric ceramic prepreg and the distance between the first piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg can be realized. The distance between the adjacent second electrodes printed on the surface is less than or equal to half the wavelength of the ultrasonic transmission signal, that is, the distance between the adjacent first vibration area and the adjacent second vibration area can be controlled, and there will be no such thing as the existing technology. The arrangement spacing of the array ultrasonic sensor is limited by the defect of the volume of the ultrasonic probe, so that when the array ultrasonic sensor is in use, the ultrasonic transmitting array element can avoid the occurrence of the side grid phenomenon by delaying the transmission of the ultrasonic signal, without adjusting the ultrasonic wave as in the prior art. It is solved by the launch angle of the launch array element, and the operation is more convenient.

In one of the embodiments, before the second piezoelectric ceramic prepreg is co-fired with the first piezoelectric ceramic prepreg and the second piezoelectric ceramic prepreg, the step of: An exhaust channel communicating with the through hole is processed on the second piezoelectric ceramic prepreg; the through hole is filled with carbon crystals or volatile particles.

In one of the embodiments, wherein there are two first piezoelectric ceramic prepregs, first electrodes are printed on both sides of one of the first piezoelectric ceramic prepregs, and the first electrode is printed on the other one. The first electrode is printed on one side of the first piezoelectric ceramic prepreg, and the two first piezoelectric ceramic prepregs are stacked and pressed together; the third piezoelectric ceramic prepreg There are two plates, the second electrode is printed on both sides of one of the third piezoelectric ceramic prepregs, and the second electrode is printed on one side of the third piezoelectric ceramic prepreg. For electrodes, two third piezoelectric ceramic prepregs are stacked and pressed together.

In one of the embodiments, the pressure for pressing the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg together, and the pressure for pressing the two piezoelectric ceramic prepregs together The pressure at which the first piezoelectric ceramic prepreg or the two third piezoelectric ceramic prepregs are pressed together is above 10 MPa. In this embodiment, the pressure for pressing the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg together, and the pressure for pressing the two first piezoelectric ceramic prepregs The pressure under which the plates or the two third piezoelectric ceramic prepregs are pressed together is preferably 20 MPa.

In one of the embodiments, the thicknesses of the first piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg are 40-80 μm, and the first piezoelectric ceramic prepreg, the The temperature for co-firing and curing the second piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg is 900-1000° C., and the time is 24-48 hours.

Description of drawings

Fig. 1 is a schematic structural diagram of an array ultrasonic sensor described in an embodiment of the present invention;

Fig. 2 is a cross-sectional view of one of the embodiments at A-A place in Fig. 1;

Fig. 3 is the sectional view of another embodiment at A-A place among Fig. 1;

Fig. 4 is an exploded schematic diagram of an array ultrasonic sensor according to an embodiment of the present invention.

10. First piezoelectric vibration plate, 11. First electrode, 20. First support plate, 21. Through hole, 22. Channel, 30. Substrate, 31. Pad electrode, 40. Cover plate, 41. Ultrasonic radiation Hole, 42, partition plate, 50, second piezoelectric vibrating plate, 51, second electrode, 60, second supporting plate, 61, through hole.

detailed description

Embodiments of the present invention are described in detail below:

As shown in FIG. 1 and FIG. 2 , an array ultrasonic sensor according to an embodiment of the present invention includes: a first piezoelectric vibration plate 10 , a first support plate 20 , a base plate 30 and a cover plate 40 .

The first piezoelectric vibration plate 10 has more than two first vibration regions. The first vibration area is provided with a first electrode 11 . The first support plate 20 is provided with a through hole 21 or a blind hole corresponding to the first vibration area, and the first support plate 20 is connected with the first piezoelectric vibration plate 10 . When a voltage is applied to the first piezoelectric vibration plate 10 through the first electrode 11, the first vibration region of the first piezoelectric vibration plate 10 vibrates, and the through hole 21 or blind hole provided on the first support plate 20 is equivalent to It is used to avoid the first piezoelectric vibration plate 10 expanding outward.

The cover plate 40 is arranged outside the first piezoelectric vibrating plate 10 , and the cover plate 40 is provided with more than two ultrasonic radiation holes 41 . The ultrasonic radiation holes 41 are set corresponding to the first vibration zones one by one. The inner wall of the cover plate 40 is provided with several partition plates 42 . The partition plate 42 is located between the adjacent first vibration zones. In this way, the partition plate 42 separates the first vibration zone on the first piezoelectric vibrating plate 10, and the ultrasonic signal generated by the vibration of the first vibration zone is radiated through the ultrasonic radiation hole 41, between adjacent first vibration zones After the generated ultrasonic signals are separated by the partition plate 42, they will not interfere with each other.

The base plate 30 is connected to the first support plate 20, and the base plate 30 has more than two control units. The control unit is arranged corresponding to the first electrodes 11 one by one, and the control unit is electrically connected to the first electrodes 11 . The control unit controls the applied voltage and the applied voltage frequency of the corresponding first electrode 11, that is, the ultrasonic signals generated by each first vibration zone are controlled by the corresponding control unit of the first vibration zone, so that the control unit and the corresponding first electrode 11, The first piezoelectric vibration plate 10 and the through hole 21 of the first support plate 20 form an independent ultrasonic transceiver element. In this way, a plurality of independent ultrasonic transceiver array elements are combined to form an integrated body, and the distance between adjacent first vibration regions can be reduced to less than half the wavelength of the ultrasonic transmitting signal. Therefore, when the object under test is detected, ultrasonic signals can be transmitted with a delay by the ultrasonic transmitting array element, so that the transmitting array grating lobes and the receiving array zeros can cancel each other out to avoid side grid phenomenon.

The above-mentioned array ultrasonic sensor, the control unit and the corresponding first electrode 11, the first piezoelectric vibrating plate 10, and the through hole 21 of the first support plate 20 can form an independent ultrasonic transceiver array element, and the control unit, the first electrode 11 1. There are more than two through holes 21 in the first supporting plate 20, and they are arranged correspondingly one by one, so that a plurality of independent ultrasonic transmitting and receiving array elements can be formed, and the integration of the arrayed ultrasonic sensor can be realized. In this way, this embodiment will not be limited by the volume of the ultrasonic probe as the arrangement spacing of the array ultrasonic sensor in the prior art, and the distance between adjacent first vibration regions in the array ultrasonic sensor of this embodiment can be reduced to be less than or equal to the ultrasonic transmission signal half of the wavelength, so that when the array ultrasonic sensor is in use, the ultrasonic emitting element can avoid the generation of the side grid phenomenon by delaying the emission of the ultrasonic signal, and it is not necessary to solve it by adjusting the emission angle of the ultrasonic emitting element as in the prior art. The operation is more convenient.

Referring to FIG. 3 and FIG. 4 , in another embodiment, the array ultrasonic sensor further includes a second piezoelectric vibrating plate 50 disposed between the first support plate 20 and the substrate 30 . The second piezoelectric vibration plate 50 has more than two second vibration regions. The second vibration area is provided with a second electrode 51 . The second electrode 51 is electrically connected to the control unit. In this embodiment, the voltage applied by the second electrode 51 to the first vibration region is the same as the voltage applied by the first electrode 11 to the second vibration region, but opposite in polarity. In this way, the first vibration zone and the second vibration zone vibrate synchronously in opposite directions or in opposite directions, so that the vibration amplitude is larger and the vibration effect is stronger.

The array ultrasonic sensor further includes a second support plate 60 disposed between the second piezoelectric vibration plate 50 and the substrate 30 . The second support plate 60 is provided with a through hole 61 or a blind hole corresponding to the second vibration zone. Of course, in other embodiments, a blind hole with an opening facing the second vibration area may also be provided on the substrate 30, so that during the vibration of the substrate 30, the blind hole is equivalent to the second piezoelectric vibration plate 50 for avoiding outward expansion. the avoidance position. In this embodiment, both the first piezoelectric vibration plate 10 and the second piezoelectric vibration plate 50 are piezoelectric ceramic plates.

Please refer to FIG. 4 , the substrate 30 is provided with more than two pad electrodes 31 . The pad electrodes 31 are arranged corresponding to the first electrodes 11 one by one, and the pad electrodes 31 are electrically connected to the first electrodes 11 and the second electrodes 51 through conductive elements. In this embodiment, the conductive member can be a wire or a conductive film layer sintered from conductive Ag/Pt paste, and a wiring hole or a conductive film layer through which the wire passes is provided on the first vibration plate or the second vibration plate Through the through hole, the pad electrode 31 can be electrically connected to the conductive element through the conductive adhesive.

There are more than two first electrodes 11 provided in the first vibration region. The first electrodes 11 are distributed vertically in the first piezoelectric vibration plate 10 . There are more than two second electrodes 51 provided in the second vibration region. The second electrodes 51 are distributed vertically in the second piezoelectric vibration plate 50 . In this embodiment, there are three first electrodes 11 and three second electrodes 51 in the same vibrating region. In addition, the three first electrodes 11 are distributed vertically in the first piezoelectric vibration plate 10 , and the three second electrodes 51 are vertically distributed in the second piezoelectric vibration plate 50 . In this way, the same vibration region of the first piezoelectric vibration plate 10 or the second piezoelectric vibration plate 50 is synchronously excited by a plurality of electrodes arranged at intervals up and down to vibrate, and the vibration effect is better.

The embodiment of the present invention also provides a method for manufacturing an array ultrasonic sensor, including the following steps:

Provide more than one first piezoelectric ceramic prepreg, second piezoelectric ceramic prepreg, more than one third piezoelectric ceramic prepreg, substrate 30 and cover plate 40, in the first piezoelectric ceramic prepreg Two or more first electrodes 11 are printed on the upper surface, two or more through holes 61 corresponding to the positions of the first electrodes 11 are processed on the second piezoelectric ceramic prepreg, and more than two through holes 61 are processed on the third piezoelectric ceramic prepreg. More than two second electrodes 51 corresponding to the positions of the through holes 61 are printed on the prepreg;

The first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg are stacked and pressed together, and then jointly fired and solidified to obtain an ultrasonic vibration mechanism;

The ultrasonic vibration mechanism, the base plate 30 and the cover plate 40 are assembled together.

In the manufacturing method of the above-mentioned array ultrasonic sensor, the first piezoelectric ceramic prepreg is equivalent to the first piezoelectric vibrating plate 10 after being fired, and the second piezoelectric ceramic prepreg is equivalent to the first support plate 20 after being fired. , the third piezoelectric ceramic prepreg is equivalent to the second piezoelectric vibration plate 50 after firing. The array ultrasonic sensor obtained by the above manufacturing method can realize the integration of the array ultrasonic sensor; in addition, it can realize the spacing between the adjacent first electrodes 11 printed on the first piezoelectric ceramic prepreg plate and the distance between the third piezoelectric ceramic prepreg The distance between the adjacent second electrodes 51 printed on the board is less than half the wavelength of the ultrasonic transmission signal, that is, the distance between the adjacent first vibration area and the adjacent second vibration area can be controlled, and there will be no such thing as the prior art The arrangement spacing of the array ultrasonic sensor is limited by the defect of the volume of the ultrasonic probe, so that when the array ultrasonic sensor is in use, the ultrasonic transmitting array element can avoid the occurrence of the side grid phenomenon by delaying the transmission of the ultrasonic signal, and it is not necessary to adjust the ultrasonic wave as in the prior art. It is solved by the launch angle of the launch array element, and the operation is more convenient.

Wherein, the second piezoelectric ceramic prepreg further includes the step of co-firing with the first piezoelectric ceramic prepreg and the second piezoelectric ceramic prepreg: An exhaust passage 22 communicating with the through hole 21 is processed on the electroceramic prepreg; the through hole 21 is filled with carbon crystals or volatile particles. In this way, during the co-firing process of the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg, since carbon crystals or volatile particles are filled in the through holes 21, it is possible to The initial shape of the through hole 21 is guaranteed. And as the firing time gets longer and the firing temperature gets higher and higher, the piezoelectric ceramic prepreg is gradually solidified and formed. The carbon crystals or volatile particles in the through hole 21 will be gradually converted into gas when the temperature is higher than 600 degrees, and will be discharged to the external environment through the exhaust channel 22 without affecting the product. The final shape of the through hole 21 of the ultrasonic sensor is The maintenance is good, and there is no crack, and the product qualification rate is high.

Wherein, there are two first piezoelectric ceramic prepregs, first electrodes 11 are printed on both sides of one of the first piezoelectric ceramic prepregs, and on the other first piezoelectric ceramics The first electrode 11 is printed on one side of the prepreg, and the two first piezoelectric ceramic prepregs are stacked and pressed together; the third piezoelectric ceramic prepreg is two, Both sides of one of the third piezoelectric ceramic prepregs are printed with second electrodes 51, and one side of the third piezoelectric ceramic prepregs is printed with second electrodes 51. The two third piezoelectric ceramic prepregs are stacked and pressed together.

In this embodiment, the pressure for pressing the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg together, and the pressure for pressing the two first piezoelectric ceramic prepregs The pressing pressure of one piezoelectric ceramic prepreg or the two third piezoelectric ceramic prepregs is above 10Mpa. In this embodiment, the pressure for pressing the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg together, and the pressure for pressing the two first piezoelectric ceramic prepregs The pressure under which the plates or the two third piezoelectric ceramic prepregs are pressed together is preferably 20 MPa.

In this embodiment, the thicknesses of the first piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg are 40-80 μm, and the first piezoelectric ceramic prepreg and the second piezoelectric ceramic prepreg are The temperature for co-firing and curing the piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg is 900-1000° C. and the time is 24-48 hours.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. An array ultrasonic sensor, characterized in that, comprising: A first piezoelectric vibration plate, the first piezoelectric vibration plate has more than two first vibration regions, and the first vibration regions are provided with first electrodes; A first support plate, the first support plate is provided with through holes or blind holes corresponding to the first vibration zone, and the first support plate is connected to the first piezoelectric vibration plate; A substrate, the substrate is connected to the first support plate, the substrate has more than two control units, the control units are set corresponding to the first electrodes one by one, and the control units and the first electrodes electrical connection; and A cover plate, the cover plate is set outside the first piezoelectric vibration plate, and the cover plate is provided with more than two ultrasonic radiation holes, and the ultrasonic radiation holes are set corresponding to the first vibration area one by one, The inner side wall of the cover plate is provided with several partition plates, and the partition plates are located between the adjacent first vibration zones. 2. The array ultrasonic sensor according to claim 1, further comprising a second piezoelectric vibrating plate arranged between the first support plate and the substrate; the second piezoelectric vibrating plate has More than two second vibrating areas, the second vibrating areas are provided with second electrodes, and the second electrodes are electrically connected to the control unit. 3. The array ultrasonic sensor according to claim 2, further comprising a second support plate arranged between the second piezoelectric vibration plate and the substrate, the second support plate is provided with Through holes or blind holes are correspondingly provided in the second vibration zone. 4. The array ultrasonic sensor according to claim 2, characterized in that, the substrate is provided with more than two pad electrodes, the pad electrodes are set corresponding to the first electrodes one by one, and the pad electrodes It is electrically connected with the first electrode and the second electrode through a conductive member. 5. The array ultrasonic sensor according to claim 2, characterized in that there are more than two first electrodes arranged in the first vibration area, and the first electrodes are distributed on the first piezoelectric vibration plate at intervals up and down. In the middle; there are more than two second electrodes provided in the second vibration region, and the second electrodes are distributed vertically and vertically in the second piezoelectric vibration plate. 6. A method for manufacturing an array ultrasonic sensor, comprising the steps of: Provide more than one first piezoelectric ceramic prepreg, second piezoelectric ceramic prepreg, more than one third piezoelectric ceramic prepreg, substrate and cover plate, and print on the first piezoelectric ceramic prepreg For more than two first electrodes, two or more through holes corresponding to the positions of the first electrodes are processed on the second piezoelectric ceramic prepreg, and printed on the third piezoelectric ceramic prepreg. More than two second electrodes corresponding to the positions of the through holes; The first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg, and the third piezoelectric ceramic prepreg are stacked and pressed together, and then jointly fired and solidified to obtain an ultrasonic vibration mechanism; Assemble the ultrasonic vibration mechanism, the base plate and the cover plate together. 7. The manufacturing method of the array ultrasonic sensor according to claim 6, characterized in that, the second piezoelectric ceramic prepreg is in contact with the first piezoelectric ceramic prepreg, the second piezoelectric ceramic Before the step of co-firing the prepreg, it also includes the steps of: processing an exhaust channel connected with the through hole on the second piezoelectric ceramic prepreg; filling the through hole with carbon crystal or easy Volatile particulate matter. 8. The manufacturing method of the array ultrasonic sensor according to claim 6, wherein, the first piezoelectric ceramic prepreg is two, and one of the first piezoelectric ceramic prepregs The first electrode is printed on both sides of the first piezoelectric ceramic prepreg, and the first electrode is printed on one side of the other first piezoelectric ceramic prepreg, and the two first piezoelectric ceramic prepregs are stacked and pressed. tightly together; the third piezoelectric ceramic prepreg is two pieces, and second electrodes are printed on both sides of one of the third piezoelectric ceramic prepregs, and on the other third piezoelectric ceramic prepreg The second electrode is printed on one side of the ceramic prepreg, and the two third piezoelectric ceramic prepregs are stacked and pressed together. 9. The manufacturing method of the array ultrasonic sensor according to claim 8, characterized in that, the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg are The pressure for pressing the plates together and the pressure for pressing the two first piezoelectric ceramic prepregs or the two third piezoelectric ceramic prepregs together are all above 10 MPa. 10. The manufacturing method of the array ultrasonic sensor according to claim 6, characterized in that, the thicknesses of the first piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg are 40-80 μm, and The temperature of the first piezoelectric ceramic prepreg, the second piezoelectric ceramic prepreg and the third piezoelectric ceramic prepreg are fired and solidified at a temperature of 900-1000° C. and a time of 24-48 hours.