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CN106585069A - 柔性基板、面板及丝网印刷机制作柔性基板、面板的方法 - Google Patents

柔性基板、面板及丝网印刷机制作柔性基板、面板的方法 Download PDF

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Publication number
CN106585069A
CN106585069A CN201611207481.9A CN201611207481A CN106585069A CN 106585069 A CN106585069 A CN 106585069A CN 201611207481 A CN201611207481 A CN 201611207481A CN 106585069 A CN106585069 A CN 106585069A
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CN
China
Prior art keywords
flexible substrate
printing machine
screen printing
scraper
ink return
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611207481.9A
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English (en)
Inventor
李想
余威
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to CN201611207481.9A priority Critical patent/CN106585069A/zh
Priority to US15/327,796 priority patent/US20180213650A1/en
Priority to PCT/CN2017/071070 priority patent/WO2018113056A1/zh
Publication of CN106585069A publication Critical patent/CN106585069A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0831—Machines for printing webs
    • B41F15/0845—Machines for printing webs with flat screens
    • B41F15/085—Machines for printing webs with flat screens with a stationary screen and a moving squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0881—Machines for printing on polyhedral articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B41F15/46—Squeegees or doctors with two or more operative parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B41M1/125—Stencil printing; Silk-screen printing using a field of force, e.g. an electrostatic field, or an electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
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    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/16—Curved printing plates, especially cylinders
    • B41N1/22—Curved printing plates, especially cylinders made of other substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
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    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
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    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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Abstract

本发明提供一种柔性基板、面板及用丝网印刷机制作柔性基板、面板的方法，该丝网印刷机包括具有开口的网板、设于网板上侧的回墨刀、刮刀以及胶材材料，网板的下侧设有玻璃基板；该方法包括：移动回墨刀和刮刀，刮刀在回墨刀的上方，回墨刀将胶材材料涂覆在开口；反向移动回墨刀和刮刀，刮刀下降至回墨刀的下方，刮刀将胶材材料从开口印刷至玻璃基板上，以在玻璃基板上形成与开口对应的柔性基板薄膜；对柔性基板薄膜进行烘烤，以得到固化的柔性基板。本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。

Description

柔性基板、面板及丝网印刷机制作柔性基板、面板的方法
技术领域
本发明涉及显示技术领域，具体是指一种柔性基板、面板及用丝网印刷机制作柔性基板、面板的方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，简称“OLED”)在显示技术具有自发光、广视角、对比度高、低耗电、反应速度快等优点，使其在显示技术领域中得到广泛应用，并且已经被逐渐应用到我们的日常生活中。
近几年，随着柔性OLED得到了快速的发展，柔性可弯曲变形的显示器从屏幕尺寸到显示质量都得到大大提升。而目前，主流的柔性OLED器件的制程方法为首先将聚酰亚胺整面涂布覆盖在载体玻璃上形成柔性衬底，然后在柔性衬底上做电学器件、光学器件以及薄膜封装，然后用镭射切割机(Laser Cutting)将整片载体玻璃连同柔性衬底切成面板，最后用激光剥离机(LLO)将柔性OLED器件从载体玻璃上剥离下来，形成我们所要的柔性OLED器件。上述的制程方法中将聚酰亚胺整面涂布的制作成本高，且工艺复杂，而镭射切割机(Laser Cutting)设备价格昂贵，增加加工成本。
发明内容
本发明提供一种柔性基板、面板及用丝网印刷机制作柔性基板、面板的方法，以解决现有技术中柔性OLED器件的制程方式中将聚酰亚胺整面涂布的制作成本高，且工艺复杂，而镭射切割机(Laser Cutting)设备价格昂贵，增加加工成本的技术问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种用丝网印刷机制作柔性基板的方法，所述丝网印刷机包括具有开口的网板、设于所述网板上侧的回墨刀、刮刀以及胶材材料，所述网板的下侧设有玻璃基板，所述方法包括：
移动所述回墨刀和所述刮刀，所述刮刀在所述回墨刀的上方，所述回墨刀将所述胶材材料涂覆在所述开口；
反向移动所述回墨刀和所述刮刀，所述刮刀下降至所述回墨刀的下方，所述刮刀将所述胶材材料从所述开口印刷至所述玻璃基板上，以在所述玻璃基板上形成与所述开口对应的柔性基板薄膜；
对所述柔性基板薄膜进行烘烤，以得到固化的柔性基板。
根据本发明一实施例，所述烘烤的温度范围为350～500℃，所述烘烤的时间范围为2-4小时。
根据本发明一实施例，所述烘烤的温度范围为400～450℃，所述烘烤的时间范围为2.5-3.5小时。
根据本发明一实施例，所述胶材材料为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种。
根据本发明一实施例，所述柔性基板的厚度范围为20-400微米。
根据本发明一实施例，所述开口区的面积为6-10000平方厘米。
根据本发明一实施例，相邻两个所述开口区之间的间隔为5-100毫米。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性基板，所述柔性基板采用上述所述的方法制成。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种用丝网印刷机制作柔性面板的方法，所述方法包括：
由上述所述的方法制成的柔性基板；
在所述柔性基板的上方依次制作薄膜晶体管、发光器件以及封装薄膜；
通过激光剥离工艺将所述柔性基板和所述玻璃基板分离。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性面板，所述柔性面板采用上述所述的方法制成。
本发明的有益效果是：区别于现有技术的情况，本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1是本发明提供的用丝网印刷机制作柔性基板的方法一实施方式的流程示意图；
图2是本发明第一实施方式中丝网印刷机的结构示意图；
图2a是本发明第一实施方式中丝网印刷机移动时的结构示意图；
图2b是本发明第一实施方式中丝网印刷机反向移动时的结构示意图；
图3是本发明提供的柔性基板一实施例的结构示意图；
图4是本发明提供的用丝网印刷机制作柔性面板的方法一实施方式的流程示意图；
图5是本发明提供的柔性面板一实施例的剖面结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请一并参阅图1至图2b，图1是本发明提供的用丝网印刷机制作柔性基板的方法第一实施方式的流程示意图，图2、图2a、图2b分别是本发明第一实施方式中丝网印刷机、丝网印刷机移动时和丝网印刷机反向移动时的结构示意图。
如图2所示，丝网印刷机100包括具有开口112的网板110、设于网板110上侧的回墨刀120、刮刀130以及胶材材料140，网板110的下侧设有玻璃基板150，玻璃基板150放置在承载台面101上。
其中，丝网印刷机是用丝网印版施印的机器，属于印刷机的一种，对承印物的材料、形状、大幅面印刷具有良好的适应性。丝网印刷机是印刷文字和图像的机器，是用于生产印刷品的机器或设备的总称。丝网印刷机属于孔版印刷机中较有代表性的印刷设备，制作丝网的材料除真丝外，还可用尼龙丝、铜丝、钢丝或不锈钢丝等，还可分为平面丝网印刷机、曲面丝网印刷机、转式丝网印刷机等。本实施例中，采用不锈钢丝平面的丝网印刷机。
参阅图1，图1是本发明用丝网印刷机100制作柔性基板的一实施方式，具体来说，包括以下步骤：
步骤S11：移动回墨刀和刮刀，刮刀在回墨刀的上方，回墨刀将胶材材料涂覆在开口。
如图2a所示，从右向左移动回墨刀120和刮刀130时，刮刀130在回墨刀120的上方，回墨刀120将位于回墨刀120侧边的胶材材料140涂覆在开口112处。
丝网印刷机100的网板110包括开口区112和闭口区114，开口区112和闭口区114间隔设置合成一整平面的网板，网板的尺寸大小范围为300毫米*300毫米至2000毫米*3000毫米；进一步的，网板的尺寸大小范围为650毫米*650毫米至1000毫米*1000毫米，且网板110的尺寸须大于玻璃基板150的尺寸。其中，闭口区114是将对应的网板印刷有感光浆，感光浆在紫外线的照射下，通过敏化剂的作用，发生交联固化，将闭口区114封闭起来。而开口区112是没有印刷感光浆的部份，遇水膨胀溶解，经显影得到与预设的柔性基板图案一致。
胶材材料140为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种；其中，聚酰亚胺是综合性能最佳的有机高分子材料之一，耐高温达400℃以上，长期使用温度范围-200～300℃，无明显熔点，具有优越机械性能、高绝缘性能，使得其为制作柔性基板最常用的材料。
步骤S12：反向移动回墨刀和刮刀，刮刀下降至回墨刀的下方，刮刀将胶材材料从开口印刷至玻璃基板上，以在玻璃基板上形成与开口对应的柔性基板薄膜。
如图2b所示，从左向右反向移动回墨刀120和刮刀130时，刮刀130下降至回墨刀120的下方，对网板产生一定的压力，刮刀130将胶材材料140从开口112印刷至玻璃基板150上，以在玻璃基板150上形成与开口112对应的柔性基板薄膜。
步骤S13：对柔性基板薄膜进行烘烤，以得到固化的柔性基板。
本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。
具体来说，烘烤的温度范围为350～500℃，烘烤的时间范围为2-4小时；进一步的，烘烤的温度范围为400～450℃，烘烤的时间范围为2.5-3.5小时。进行烘烤后的柔性基板的厚度范围为20-400微米，进一步的，进行烘烤后的柔性基板的厚度范围为50-100微米。
开口区112的面积为6-10000平方厘米，进一步的，开口区112的面积为50-2500平方厘米，进一步，开口区112的面积为100平方厘米，开口区112的形状为长方形或者正方形时，其长或者宽的尺寸为1-50寸，优选为4-10寸，进一步优选为6寸。其中，相邻两个开口区112之间的间隔为5-100毫米，优选为10-40毫米，进一步为30毫米。
参阅图3，图3是本发明提供的柔性基板一实施例的结构示意图。
如图3所示，该柔性基板10采用上述的方法制成，包括玻璃基板150和柔性基板140，其中，柔性基板140以图样化设置在玻璃基板150上。
柔性基板140的制作方法见上文，此处不再赘述。
参阅图4，图4是本发明用丝网印刷机100制作柔性面板的一实施方式，具体来说，包括以下步骤：
步骤S21-S23与用丝网印刷机100制作柔性基板的步骤S11-S13基本一致，在此不再赘述。本实施例是在柔性基板上增加了制作电学器件和发光器件。具体来说，增加步骤S24和步骤S25。
步骤S24：在柔性基板的上方依次制作薄膜晶体管、发光器件以及封装薄膜。
在柔性基板140的上方依次制作薄膜晶体管、发光器件以及封装薄膜，与目前主流的制作工艺相同，不是本发明的重点，在此不再详述。
步骤S25：通过激光剥离工艺将柔性基板和玻璃基板分离。
本发明提供的用丝网印刷机制作柔性面板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，再在柔性基板上制作薄膜晶体管、发光器件以及封装薄膜，减少用镭射切割机(Laser Cutting)将整片载体玻璃连同柔性衬底切成面板的步骤，简化生产流程、节省生产成本。
参阅图5，图5是本发明提供的柔性面板一实施例的剖面结构示意图。
如图5所示，为了方便理解，以剖面结构示意图为参考。该柔性面板20采用上述的方法制成，包括柔性基板10以及在柔性基板10的上方依次形成的薄膜晶体管21、发光器件22以及封装薄膜23。其中，柔性基板10的制作方法和结构见上文，此处不再赘述。
综上所述，本领域技术人员容易理解，本发明提供的用丝网印刷机制作柔性基板的方法由于设有丝网印刷机，形成与丝网印刷机开口对应的柔性基板薄膜，直接得到想要的柔性基板尺寸，从而简化生产流程、节省生产成本。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

1.一种用丝网印刷机制作柔性基板的方法，其特征在于，所述丝网印刷机包括具有开口的网板、设于所述网板上侧的回墨刀、刮刀以及胶材材料，所述网板的下侧设有玻璃基板，所述方法包括：
移动所述回墨刀和所述刮刀，所述刮刀在所述回墨刀的上方，所述回墨刀将所述胶材材料涂覆在所述开口；
反向移动所述回墨刀和所述刮刀，所述刮刀下降至所述回墨刀的下方，所述刮刀将所述胶材材料从所述开口印刷至所述玻璃基板上，以在所述玻璃基板上形成与所述开口对应的柔性基板薄膜；
对所述柔性基板薄膜进行烘烤，以得到固化的柔性基板。
2.根据权利要求1所述的用丝网印刷机制作柔性基板的方法，其特征在于，所述烘烤的温度范围为350～500℃，所述烘烤的时间范围为2-4小时。
3.根据权利要求2所述的用丝网印刷机制作柔性基板的方法，其特征在于，所述烘烤的温度范围为400～450℃，所述烘烤的时间范围为2.5-3.5小时。
4.根据权利要求1-3中任一项所述的用丝网印刷机制作柔性基板的方法，其特征在于，所述胶材材料为聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇、聚对萘二甲酸乙二醇脂、聚酰亚胺中的一种。
5.根据权利要求1-3中任一项所述的用丝网印刷机制作柔性基板的方法，其特征在于，所述柔性基板的厚度范围为20-400微米。
6.根据权利要求1所述的用丝网印刷机制作柔性基板的方法，其特征在于，所述开口区的面积为6-10000平方厘米。
7.根据权利要求1所述的用丝网印刷机制作柔性基板的方法，其特征在于，相邻两个所述开口区之间的间隔为5-100毫米。
8.一种柔性基板，其特征在于，所述柔性基板采用权利要求1-3中任一项所述的方法制成。
9.一种用丝网印刷机制作柔性面板的方法，其特征在于，所述方法包括：
由权利要求1-3中任一项所述的方法制成的柔性基板；
在所述柔性基板的上方依次制作薄膜晶体管、发光器件以及封装薄膜；
通过激光剥离工艺将所述柔性基板和所述玻璃基板分离。
10.一种柔性面板，其特征在于，所述柔性面板采用权利要求9所述的方法制成。
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