CN106527042B - A kind of mask plate and preparation method thereof - Google Patents
A kind of mask plate and preparation method thereof Download PDFInfo
- Publication number
- CN106527042B CN106527042B CN201710011050.3A CN201710011050A CN106527042B CN 106527042 B CN106527042 B CN 106527042B CN 201710011050 A CN201710011050 A CN 201710011050A CN 106527042 B CN106527042 B CN 106527042B
- Authority
- CN
- China
- Prior art keywords
- foreboard
- mask
- back plate
- substrate
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000011521 glass Substances 0.000 claims abstract description 37
- 239000000565 sealant Substances 0.000 claims abstract description 25
- 238000000926 separation method Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000001259 photo etching Methods 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000003670 easy-to-clean Effects 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000006227 byproduct Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The present invention relates to field of display technology, a kind of mask plate and preparation method thereof is disclosed, mask plate includes foreboard, foreboard includes substrate and mask graph formed on substrate, it further include the back plate being oppositely arranged with foreboard, it seals and is fixedly connected by sealant between back plate and foreboard, back plate includes the separation material of glass substrate and formation on the glass substrate, surface opposite with foreboard in back plate is arranged in separation material, and the position opposite with mask graph periphery is uniformly arranged in back plate, is used to support foreboard;The periphery of mask graph is arranged in support foreboard that can reduce pollution of the foreign object to mask graph in separation material, protects mask graph, and extend mask plate uses the time; simultaneously; it is easy to clean, the damage to mask graph is reduced in the process of cleaning, and it is bad to reduce repeatability; improve loss brought by product quality and mask plate maintenance; therefore mask graph can be protected, and it is easy to clean, it is bad to reduce repeatability; product yield is improved, cost is reduced.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of mask plate and preparation method thereof.
Background technique
Photoetching technique is now widely used for semiconductor display field, needs to use exposure mask in the exposure process of photoetching technique
Version, light is exposed light-sensitive material through mask plate, and mask plate is figure mother matrix used in photoetching process processing procedure,
Mask pattern is formed on transparent glass substrate by lighttight shading film, and product substrate is transferred the graphic to by exposure
On.
Currently, the manufacture craft of mask plate is chromium plating on the glass substrate, then by gluing, exposure, development, baking,
The processes such as etching, removing stick protective film finally after forming figure to protect mask pattern;This mask plate has the disadvantage that:
1. dust granule is easily stained on protective film surface, it is bad to generate Repeat (repetition) property;2. if dust is stained on protective film surface
Particle not easy cleaning (cannot wash, cannot wipe) under present condition, can only utilize air gun or IPA (isopropanol) soaking and washing
The back side of mask plate, mask plate post can not impregnating on one side for protective film, if it is easy to purge cleaning dust granule with air gun
It scratches or is easily blown brokenly when air gun is purged and cleaned;There is problem above and only return factory's re-posted, higher cost, and influences life
It produces.Therefore it provides a kind of mask plate easy to clean seems particularly necessary.
Summary of the invention
The present invention provides a kind of mask plate and preparation method thereof, which uses glass protection mask graph, convenient clear
It washes, reduction repeatability is bad, improves product yield, reduces cost.
In order to achieve the above objectives, the present invention the following technical schemes are provided:
A kind of mask plate, including foreboard, the foreboard include substrate and the mask graph that is formed on the substrate, also
Including the back plate being oppositely arranged with the foreboard, seals and be fixedly connected by sealant between the back plate and foreboard, it is described
Back plate includes glass substrate and the separation material that is formed on the glass substrate, the separation material be arranged in the back plate with
The opposite surface of the foreboard, and opposite with mask graph periphery position in the back plate is uniformly arranged, for branch
Support the foreboard.
In above-mentioned mask plate, mask graph leads between substrate and glass substrate, and between substrate and glass substrate
Sealant sealing is crossed, the periphery of mask graph is arranged in support foreboard that can reduce dirt of the foreign object to mask graph in separation material
Dye protects mask graph, extends the time that uses of mask plate, meanwhile, film in the prior art, side are replaced using glass substrate
Just it cleans, reduces the damage to mask graph in the process of cleaning, reduce repeated bad, raising product quality and exposure mask
Loss brought by version maintenance.
Therefore, above-mentioned mask plate uses glass protection mask graph, easy to clean, reduces repeated bad, raising product
Yield reduces cost.
Preferably, the material of the separation material is photoresist.
Preferably, the sealing material is sealant, and the sealant is coated in the periphery of the glass substrate.
Preferably, the material of the mask graph is chromium.
Preferably, by being fixedly connected after sealing glue solidifying between the back plate and foreboard.
A kind of preparation method of such as described in any item mask plates of above-mentioned technical proposal, comprising:
Mask graph is formed on the substrate to constitute foreboard;
Form separation material on the glass substrate to constitute back plate;
Sealant is coated on the periphery of the back plate;
The front and rear panels are made into sealing glue solidifying to merging to bond the front and rear panels.
Preferably, described that mask pattern is formed on underlay substrate when the material of the mask graph is metal material
Include: to constitute foreboard
Layer of metal film is sputtered on the surface of substrate;
Photoresist is coated on the metal film, and forms mask pattern by patterning processes.
Preferably, the separation material of formation on the glass substrate includes: to constitute back plate
Photoresist is coated on the glass substrate, and separation material is formed by photoetching process.
Preferably, described that the front and rear panels are made into sealing glue solidifying to merging to bond the front and rear panels packet
It includes:
Front and rear panels described in pairing;
Sealant described in high-temperature baking;
Sealing glue solidifying is to bond the front and rear panels.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of mask plate provided by the invention;
Fig. 2 is a kind of structural schematic diagram of the foreboard of mask plate provided by the invention;
Fig. 3 is a kind of structural schematic diagram of the back plate of mask plate provided by the invention;
Fig. 4 is a kind of flow chart of the preparation method of mask plate provided by the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, Figure 2 and shown in Fig. 3, a kind of mask plate, including foreboard, foreboard includes substrate 5 and is formed in substrate 5
On mask graph 1, further include the back plate being oppositely arranged with foreboard, pass through sealant sealing between back plate and foreboard and fixed connect
It connects, back plate includes glass substrate 4 and the separation material being formed on glass substrate 43, and separation material 3 is arranged in back plate and foreboard
Opposite surface, and opposite with 1 periphery of mask graph position in back plate is uniformly arranged, and is used to support foreboard.
In above-mentioned mask plate, mask graph 1 between substrate 5 and glass substrate 4, and substrate 5 and glass substrate 4 it
Between sealed by sealant, the periphery of mask graph 1 is arranged in support foreboard that can reduce foreign object to mask graph in separation material 3
Mask graph 1 is protected in 1 pollution, extends the time that uses of mask plate, meanwhile, it is replaced using glass substrate 4 in the prior art
Film, it is easy to clean, the damage to mask graph 1 is reduced in the process of cleaning, reduces repeated bad, raising product quality
And loss brought by mask plate maintenance.
Therefore, above-mentioned mask plate uses glass protection mask graph 1, easy to clean, reduces repeated bad, raising product
Yield reduces cost.
In a kind of preferred embodiment, the material of separation material 3 can be photoresist.According to the specific practical feelings of mask plate
Condition selects suitable spacer material, and common spacer can choose photoresist, and one layer of photoresist is coated in back plate,
Then spacer is formed to support foreboard by photoetching process.
In a kind of preferred embodiment, sealing material can be sealant 2, and sealant 2 is coated in the week of glass substrate 4
Side.Suitable sealing material is selected according to the specific actual conditions of mask plate, common sealing material can choose sealant 2,
To seal front and rear panels, one layer of sealant 2 is coated on the periphery of glass substrate 4 and is passed through then by front and rear panels pairing
High-temperature baking solidifies sealant 2 so that front and rear panel is bonded together, and then can reduce dirt of the foreign object to mask graph 1
Dye protects mask graph 1, extends the time that uses of mask plate, meanwhile, film in the prior art is replaced using glass substrate 4,
It is easy to clean, reduce the damage to mask graph 1 in the process of cleaning, reduce repeatability it is bad, improve product quality and
Loss brought by mask plate maintenance.
In a kind of preferred embodiment, the material of mask graph 1 can be chromium, and the material of mask graph 1 is metal material,
According to the specific actual conditions of mask plate, the material of mask graph 1 can be chromium, or other metal materials.
In a kind of preferred embodiment, by being fixedly connected after sealing glue solidifying between back plate and foreboard, by foreboard and
After back plate pairing, the epoxy resin in sealant is solidified under the effect of the catalyst by high-temperature baking, thus by front and back
Plate is bonded together.
As shown in figure 4, a kind of preparation method of the mask plate of any one of such as above-mentioned technical proposal, comprising:
Step S201 forms mask graph 1 on substrate 5 to constitute foreboard;
Step S202 forms separation material 3 on glass substrate 4 to constitute back plate;
Step S203 coats sealant on the periphery of back plate;
Front and rear panels are made sealing glue solidifying to merging to bond front and rear panels by step S204.
In the preparation method of above-mentioned mask plate, foreboard is formed by step S201, is formed with mask graph 1 on foreboard;
Back plate is formed by step S202, is formed with separation material 3 in back plate;By step S203 and step S204 by front and rear panels
Sealing is fixed, so that mask graph 1 is located in the sealing space that substrate 5 and glass substrate 4 are formed, to reduce foreign object to mask artwork
Mask graph 1 is protected in the pollution of shape 1, extends the time that uses of mask plate, meanwhile, it is replaced in the prior art using glass substrate 4
Film, it is easy to clean, reduce the damage to mask graph 1 in the process of cleaning, reduce repeatability it is bad, improve product product
Loss brought by matter and mask plate maintenance.
In a kind of preferred embodiment, when the material of mask graph 1 is metal material, is formed and covered on 5 substrate of substrate
Film pattern includes: to constitute foreboard
Layer of metal film is sputtered on the surface of substrate 5;
Photoresist is coated on metal film, and forms mask pattern by patterning processes.
The surface of substrate 5 is sputtered into layer of metal film, above-mentioned metal film can be chromium film, or other metal films,
Then the mask graph 1 of needs is produced on substrate surface by patterning processes such as photoetching, baking, etching, removings.
In a kind of preferred embodiment, forming separation material 3 on glass substrate 4 to constitute back plate includes:
Photoresist is coated on glass substrate 4, and separation material 3 is formed by photoetching process.
Photoresist is coated on glass substrate 4, and separation material 3 is then fabricated to guarantee in front and rear panel pair by photoetching process
Foreboard is supported when conjunction.
In a kind of preferred embodiment, front and rear panels are made into sealing glue solidifying to merging to bond front and rear panels packet
It includes:
Pairing front and rear panels;
High-temperature baking sealant;
Sealing glue solidifying is to bond front and rear panels.
On glass surface periphery, one circle sealant of coating will be in sealant by high-temperature baking then by front and rear panel pairing
Epoxy resin solidify under the effect of the catalyst, so that front and rear panel is bonded together.
Obviously, those skilled in the art can carry out various modification and variations without departing from this hair to the embodiment of the present invention
Bright spirit and scope.In this way, if these modifications and changes of the present invention belongs to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of mask plate, which is characterized in that including foreboard, the foreboard includes substrate and is formed in covering on the substrate
Mould figure further includes the back plate being oppositely arranged with the foreboard, seals and fixes by sealant between the back plate and foreboard
Connection, the back plate include glass substrate and the separation material that is formed on the glass substrate, and the separation material is arranged in institute
Surface opposite with the foreboard in back plate is stated, and opposite with mask graph periphery position in the back plate is uniformly set
It sets, is used to support the foreboard;
The sealant is sealant, and the sealant is coated in the periphery of the glass substrate.
2. mask plate according to claim 1, which is characterized in that the material of the separation material is photoresist.
3. mask plate according to claim 1, which is characterized in that the material of the mask graph is chromium.
4. mask plate according to claim 1, which is characterized in that by after sealing glue solidifying between the back plate and foreboard
It is fixedly connected.
5. a kind of preparation method of mask plate according to any one of claims 1-4 characterized by comprising
Mask graph is formed on the substrate to constitute foreboard;
Form separation material on the glass substrate to constitute back plate;
Sealant is coated on the periphery of the back plate;
The front and rear panels are made into sealing glue solidifying to merging to bond the front and rear panels.
6. preparation method according to claim 5, which is characterized in that when the material of the mask graph is metal material
When, the formation mask pattern on underlay substrate includes: to constitute foreboard
Layer of metal film is sputtered on the surface of substrate;
Photoresist is coated on the metal film, and forms mask pattern by patterning processes.
7. preparation method according to claim 5, which is characterized in that the separation material that formed on the glass substrate is to constitute
Back plate includes:
Photoresist is coated on the glass substrate, and separation material is formed by photoetching process.
8. preparation method according to claim 5, which is characterized in that described to make to seal to merging by the front and rear panels
Adhesive curing includes: to bond the front and rear panels
Front and rear panels described in pairing;
Sealant described in high-temperature baking;
Sealing glue solidifying is to bond the front and rear panels.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710011050.3A CN106527042B (en) | 2017-01-06 | 2017-01-06 | A kind of mask plate and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710011050.3A CN106527042B (en) | 2017-01-06 | 2017-01-06 | A kind of mask plate and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
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CN106527042A CN106527042A (en) | 2017-03-22 |
CN106527042B true CN106527042B (en) | 2019-12-03 |
Family
ID=58335272
Family Applications (1)
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CN201710011050.3A Expired - Fee Related CN106527042B (en) | 2017-01-06 | 2017-01-06 | A kind of mask plate and preparation method thereof |
Country Status (1)
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CN (1) | CN106527042B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109491200A (en) * | 2018-11-28 | 2019-03-19 | 南京中电熊猫液晶显示科技有限公司 | A kind of mask plate, manufacturing method and equipment |
CN116162892A (en) * | 2023-02-22 | 2023-05-26 | 马鞍山市槟城电子有限公司 | Metal deposition method, equipment and semiconductor device manufacturing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1658007A (en) * | 2005-01-13 | 2005-08-24 | 友达光电股份有限公司 | MEMS Optical Display Components |
CN202886836U (en) * | 2012-11-14 | 2013-04-17 | 京东方科技集团股份有限公司 | Mask |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050238964A1 (en) * | 2004-04-26 | 2005-10-27 | Chao-Yung Chu | Photomask |
US7767985B2 (en) * | 2006-12-26 | 2010-08-03 | Globalfoundries Inc. | EUV pellicle and method for fabricating semiconductor dies using same |
CN101435990B (en) * | 2007-11-15 | 2012-12-26 | 北京京东方光电科技有限公司 | Mask plate and manufacturing method thereof |
-
2017
- 2017-01-06 CN CN201710011050.3A patent/CN106527042B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1658007A (en) * | 2005-01-13 | 2005-08-24 | 友达光电股份有限公司 | MEMS Optical Display Components |
CN202886836U (en) * | 2012-11-14 | 2013-04-17 | 京东方科技集团股份有限公司 | Mask |
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Publication number | Publication date |
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CN106527042A (en) | 2017-03-22 |
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