CN106514041A - Low-Ag Cu-based medium-temperature solder - Google Patents
Low-Ag Cu-based medium-temperature solder Download PDFInfo
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- CN106514041A CN106514041A CN201611083171.0A CN201611083171A CN106514041A CN 106514041 A CN106514041 A CN 106514041A CN 201611083171 A CN201611083171 A CN 201611083171A CN 106514041 A CN106514041 A CN 106514041A
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- copper
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- naf
- solder
- brazing filler
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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Abstract
The invention provides low-Ag Cu-based medium-temperature solder. The solder is prepared from raw materials in percentage by weight as follows: 1.2%-2.0% of Ag, 6.5%-7.2% of P, 1%-3% of Ni, 1.5%-4% of Sn, 1.4%-3.6% of NaF, 0.5%-2.4% of mixed rare-earth elements and the balance of Cu; mixed rare-earth comprises components in percentage by weight as follows: 30%-40% of Nd, 20%-30% of Pr and 30%-40% of La. According to the solder, the Ag content is low, the melting temperature of the solder is relatively low, the wettability and the corrosion resistance are good, the surface of a soldered joint is bright and clean, the mechanical strength is high, and the soldering process performance is excellent.
Description
Technical field
The invention belongs to technical field of soldering materials, and in particular to a kind of low silver copper base medium temperature brazing filler.
Background technology
In recent years, the household electrical appliance demand with air-conditioning, refrigerator etc. as representative is gradually increasing, valve pipe fitting and compressor pipe
The brazing material demand on road is also increasing.BAg25CuZnSn silver solders be widely used in the industries such as air-conditioning, refrigeration copper with
The welding of copper alloy, copper and Bundy tube, property indices reach higher level.But the silver solder need to use noble metal silver 25%
Left and right, with the more and more higher of the prices of raw materials, compels to be used in refrigeration, machinery, electromechanics, electrical equipment, instrument and meter, valve pipe fitting etc.
The manufacturer of industry soldering has to seek that performance is constant, the lower brazing material of price.
And the copper base solder of routine such as BCu89PAg, BCu91PAg etc., although price is relatively low, but fusion temperature is higher,
In the welding of copper and copper alloy, copper and Bundy tube, brazing property is not as good as silver solder, therefore cannot replace BAg25CuZnSn silver prickers
Material.
The content of the invention
The present invention proposes a kind of low silver copper base medium temperature brazing filler, and the low silver copper base medium temperature brazing filler silver content is low, brazing filler metal melts temperature
Degree is relatively low, wettability and good corrosion resistance, and soldered fitting any surface finish, high mechanical strength, soldering processes performance are excellent.
The technical scheme is that what is be achieved in that：
A kind of low silver copper base medium temperature brazing filler, calculates according to percetage by weight, makes including following raw material：
Ag 1.2～2.0%, P 6.5～7.2%, Ni 1～3%, Sn 1.5～4%, NaF 1.4～3.6% with mix
Rare earth element 0.5～2.4%, balance of copper；Wherein in mischmetal each component weight percent content be Nd 30～40%,
Pr20～30% and La 30～40%.
Further, calculate according to percetage by weight, make including following raw material：
Ag 1.4～1.9%, P 6.8～7.2%, Ni 1.2～2.8%, Sn 1.5～2.5%, NaF 1.8～3.6%
With mixed rare-earth elements 0.8～2.4%, balance of copper.
Further, calculate according to percetage by weight, make including following raw material：
Ag 1.6%, P 7.0%, Ni 2%, Sn 2%, NaF 2.4% and mixed rare-earth elements 1.6%, balance of copper.
Further, calculate according to percetage by weight, make including following raw material：
Ag 1.2%, P 7.2%, Ni 3%, Sn 3.5%, NaF 3.4% and mixed rare-earth elements 2.4%, it is balance of
Copper.
Further, calculate according to percetage by weight, make including following raw material：
Ag 2.0%, P 6.5%, Ni 1%, Sn 1.5%, NaF 1.4% and mixed rare-earth elements 0.8%, it is balance of
Copper.
A kind of preparation method of low silver copper base medium temperature brazing filler, comprises the following steps：
1) raw material is configured by said ratio, dust, mix, send into smelting furnace and smelted；
2) cooling, hydrostatic profile；3) extrude；4) wire drawing；5) cut off.
Preferably, the present invention can need chemical element P and Ni advance melting to make in Cu-P and Cu-Ni according to production
Between alloy, be subsequently adding Ag, Cu, Sn, NaF and mixed rare-earth elements alloy carry out melting, then by cast, extruding, drawing, into
Type, cleaning obtain brazing material.
Beneficial effects of the present invention：
1st, the addition of chemical element Sn can reduce the fusion temperature of solder, while reduce can brazing filler metal melts temperature range
Wettability with solder is improved, and improves the plasticity of copper base solder；The addition of chemical element Ni increased solder intensity,
The resistance to corrosion of toughness and soldered fitting, improves the soldering processes performance of solder.
2nd, present invention addition norium, reduces the use of noble silver in solder by adding norium
Amount, while reduces cost, improves the oxidation resistance and wettability of cold, and the mechanical mechanics property and electricity of solder joint
Performance.Due to rare earth element, very vivaciously its simple substance is not easy to maintain, and its alloy or compound are very stable, so present invention addition shape
Formula is norium, the lead-free brazing obtained with norium and Sn, Ag, Cu melting, its stable chemical nature, is resisted
Oxidisability is good.Rare earth element is famous alterant in metal material.Norium of the present invention is with common rare earth in unit
There is larger difference in terms of plain Pr, Nd content：The Pr weight percent contents of common rare earth are about 0.44%, Nd percentage by weights
Content is about 0.5%.Mixed rare-earth elements of the present invention are weight percentage content for Nd 30～40%, Pr 20～30% and La
30～40%.
3rd, present invention face on the basis of low silver copper base medium temperature brazing filler adds NaF and P reduce fusing point, improves
The decay resistance of solder, corrosion electric current density are 1.813～2.246 μ Acm-2.Low silver copper base medium temperature brazing filler fusion temperature is
630 DEG C～700 DEG C, hence it is evident that less than silver solder and conventional Cu-P-Ag solder, brazing temperature can be reduced during soldering, mother metal is prevented
Overheated or burning；And plasticity is preferably, can be processed into all size, the weld-ring of model, welding rod, welding wire and strip.
Specific embodiment
Embodiment 1
A kind of low silver copper base medium temperature brazing filler, calculates according to percetage by weight, makes including following raw material：
Ag 1.6%, P 7.0%, Ni 2%, Sn 2%, NaF 2.4% and mixed rare-earth elements 1.6%, balance of copper.
Wherein in mischmetal, each component weight percent content is Nd 40%, Pr 20% and La 40%.
Low silver copper base medium temperature brazing filler solidus temperature, can be drawn at 690 DEG C or so in 630 DEG C or so, liquidus temperature
The silk material of a diameter of more than Φ 0.5mm, plasticity are preferable；Wettability on copper and copper alloy, carbon steel is good, good fluidity, moistening
At 2 °～4 °, tensile strength reaches 560MPa at angle.
Embodiment 2
A kind of low silver copper base medium temperature brazing filler, calculates according to percetage by weight, makes including following raw material：
Ag 1.2%, P 7.2%, Ni 3%, Sn 3.5%, NaF 3.4% and mixed rare-earth elements 2.4%, it is balance of
Copper.Wherein in mischmetal, each component weight percent content is Nd 32%, Pr 28% and La 40%.
Low silver copper base medium temperature brazing filler solidus temperature, can be drawn at 692 DEG C or so in 630 DEG C or so, liquidus temperature
The silk material of a diameter of more than Φ 0.5mm, plasticity are preferable；Wettability on copper and copper alloy, carbon steel is good, good fluidity, moistening
At 2 °～4 °, tensile strength reaches 555MPa at angle.
Embodiment 3
A kind of low silver copper base medium temperature brazing filler, calculates according to percetage by weight, makes including following raw material：
Ag 2.0%, P 6.5%, Ni 1%, Sn 1.5%, NaF 1.4% and mixed rare-earth elements 0.8%, it is balance of
Copper.Wherein in mischmetal, each component weight percent content is Nd 40%, Pr 27% and La 33%.
Low silver copper base medium temperature brazing filler solidus temperature, can be drawn at 700 DEG C or so in 645 DEG C or so, liquidus temperature
The silk material of a diameter of more than Φ 0.5mm, plasticity are preferable；Wettability on copper and copper alloy, carbon steel is good, good fluidity, moistening
At 2 °～4 °, tensile strength reaches 542MPa at angle.
Embodiment 4
A kind of low silver copper base medium temperature brazing filler, calculates according to percetage by weight, makes including following raw material：
Ag 1.8%, P 6.6%, Ni 1.2%, Sn 4%, NaF 3.6% and mixed rare-earth elements 2.1%, it is balance of
Copper；Wherein in mischmetal, each component weight percent content is Nd 35%, Pr 25% and La 40%.
Low silver copper base medium temperature brazing filler solidus temperature, can be drawn at 700 DEG C or so in 646 DEG C or so, liquidus temperature
The silk material of a diameter of more than Φ 0.5mm, plasticity are preferable；Wettability on copper and copper alloy, carbon steel is good, good fluidity, moistening
At 2 °～4 °, tensile strength reaches 540MPa at angle.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (5)
1. a kind of low silver copper base medium temperature brazing filler, it is characterised in that calculate according to percetage by weight, make including following raw material：
Ag 1.2～2.0%, P 6.5～7.2%, Ni 1～3%, Sn 1.5～4%, NaF 1.4～3.6% and mischmetal
Element 0.5～2.4%, balance of copper；Wherein in mischmetal, each component weight percent content is Nd 30～40%, Pr 20
～30% and La 30～40%.
2. low silver copper base medium temperature brazing filler according to claim 1, it is characterised in that calculate according to percetage by weight, including
Following raw material is made：
Ag 1.4～1.9%, P 6.8～7.2%, Ni 1.2～2.8%, Sn 1.5～2.5%, NaF 1.8～3.6% with it is mixed
Rare-earth elements 0.8～2.4%, balance of copper.
3. low silver copper base medium temperature brazing filler according to claim 1 and 2, it is characterised in that calculate according to percetage by weight, bag
Include following raw material to make：
Ag 1.6%, P 7.0%, Ni 2%, Sn 2%, NaF 2.4% and mixed rare-earth elements 1.6%, balance of copper.
4. low silver copper base medium temperature brazing filler according to claim 1, it is characterised in that calculate according to percetage by weight, including
Following raw material is made：
Ag 1.2%, P 7.2%, Ni 3%, Sn 3.5%, NaF 3.4% and mixed rare-earth elements 2.4%, balance of copper.
5. low silver copper base medium temperature brazing filler according to claim 1, it is characterised in that calculate according to percetage by weight, including
Following raw material is made：
Ag 2.0%, P 6.5%, Ni 1%, Sn 1.5%, NaF 1.4% and mixed rare-earth elements 0.8%, balance of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611083171.0A CN106514041A (en) | 2016-11-30 | 2016-11-30 | Low-Ag Cu-based medium-temperature solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611083171.0A CN106514041A (en) | 2016-11-30 | 2016-11-30 | Low-Ag Cu-based medium-temperature solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106514041A true CN106514041A (en) | 2017-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611083171.0A Pending CN106514041A (en) | 2016-11-30 | 2016-11-30 | Low-Ag Cu-based medium-temperature solder |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108465974A (en) * | 2018-02-27 | 2018-08-31 | 江苏远方动力科技有限公司 | A kind of low-silver copper-base high-performance solder and preparation method thereof |
| CN109048118A (en) * | 2018-08-28 | 2018-12-21 | 广东美的制冷设备有限公司 | Copper solder, workpiece, heat exchanger, air-conditioning and refrigeration equipment |
| CN109304560A (en) * | 2017-07-29 | 2019-02-05 | 安徽华众焊业有限公司 | A kind of low-silver solder |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
| CN114055012A (en) * | 2021-11-05 | 2022-02-18 | 安徽工业大学 | A kind of multicomponent copper-based alloy brazing filler metal containing rare earth element, preparation method and brazing method thereof |
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| JP2009082986A (en) * | 2007-09-13 | 2009-04-23 | Topy Ind Ltd | Lead-free solder alloy for manual soldering |
| CN101524798A (en) * | 2009-04-02 | 2009-09-09 | 杭州华光焊料有限公司 | Low silver copper base medium temperature brazing filler metal |
| CN101700606A (en) * | 2009-11-27 | 2010-05-05 | 浙江一远电子科技有限公司 | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN103624418A (en) * | 2013-12-12 | 2014-03-12 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-based brazing filler metal and preparation method thereof |
| CN105081598A (en) * | 2014-05-06 | 2015-11-25 | 烟台市固光焊接材料有限责任公司 | Solder paste and application thereof |
| CN106041355A (en) * | 2016-07-20 | 2016-10-26 | 安徽华众焊业有限公司 | Copper-based soldering paste |
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2016
- 2016-11-30 CN CN201611083171.0A patent/CN106514041A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009082986A (en) * | 2007-09-13 | 2009-04-23 | Topy Ind Ltd | Lead-free solder alloy for manual soldering |
| CN101524798A (en) * | 2009-04-02 | 2009-09-09 | 杭州华光焊料有限公司 | Low silver copper base medium temperature brazing filler metal |
| CN101700606A (en) * | 2009-11-27 | 2010-05-05 | 浙江一远电子科技有限公司 | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN103624418A (en) * | 2013-12-12 | 2014-03-12 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-based brazing filler metal and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109304560A (en) * | 2017-07-29 | 2019-02-05 | 安徽华众焊业有限公司 | A kind of low-silver solder |
| CN108465974A (en) * | 2018-02-27 | 2018-08-31 | 江苏远方动力科技有限公司 | A kind of low-silver copper-base high-performance solder and preparation method thereof |
| CN109048118A (en) * | 2018-08-28 | 2018-12-21 | 广东美的制冷设备有限公司 | Copper solder, workpiece, heat exchanger, air-conditioning and refrigeration equipment |
| CN113843546A (en) * | 2021-09-23 | 2021-12-28 | 金华市金钟焊接材料有限公司 | CuPSnAg Ni-Re ultra-silver solder, preparation method and application |
| CN114055012A (en) * | 2021-11-05 | 2022-02-18 | 安徽工业大学 | A kind of multicomponent copper-based alloy brazing filler metal containing rare earth element, preparation method and brazing method thereof |
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| C06 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |
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| RJ01 | Rejection of invention patent application after publication |