CN106112306A - A kind of medicated core solder with moistening leading role and preparation method thereof - Google Patents
A kind of medicated core solder with moistening leading role and preparation method thereof Download PDFInfo
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- CN106112306A CN106112306A CN201610749012.3A CN201610749012A CN106112306A CN 106112306 A CN106112306 A CN 106112306A CN 201610749012 A CN201610749012 A CN 201610749012A CN 106112306 A CN106112306 A CN 106112306A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 169
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 57
- 230000004907 flux Effects 0.000 claims abstract description 49
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 45
- 239000000956 alloy Substances 0.000 claims abstract description 45
- 238000005096 rolling process Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000009736 wetting Methods 0.000 claims abstract description 18
- 230000000694 effects Effects 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims description 50
- 229910052709 silver Inorganic materials 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000005219 brazing Methods 0.000 abstract description 33
- 239000000463 material Substances 0.000 abstract description 14
- 229910000975 Carbon steel Inorganic materials 0.000 description 10
- 239000010962 carbon steel Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- 229910052793 cadmium Inorganic materials 0.000 description 4
- 229910001338 liquidmetal Inorganic materials 0.000 description 4
- 238000003723 Smelting Methods 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910002535 CuZn Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 231100000701 toxic element Toxicity 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0277—Rods, electrodes, wires of non-circular cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metal Rolling (AREA)
Abstract
本发明公开了一种具有润湿先导作用的药芯钎料，包括钎剂内芯，钎剂内芯的外表面依次包覆有锡层和基体钎料层，成型后的药芯钎料的横截面呈圆形或多边形。钎剂内芯的直径为0.01～20mm，锡层的厚度为0.01～20mm，基体钎料层的厚度为0.01～20mm。制备时将一定尺寸的锡带和钎料合金带放入精密轧机中进行复合轧制，使钎料合金表面形成厚度均匀的锡层，然后将钎料合金带的锡面朝上，经过多道U型轧制、送粉、拉拔、校直等工序将其制成内含钎剂和锡层的药芯钎料。本发明制备方法节能环保，制备的钎料锡含量高且锡层厚度均匀一致，成型美观，锡的利用率高；同时本药芯钎料自带钎剂，钎焊过程中实现了钎剂的自动、精确、定量添加。
The invention discloses a flux-cored solder with a wetting leading effect, which comprises a flux inner core, the outer surface of the flux inner core is coated with a tin layer and a base solder layer in turn, and the flux-cored solder after forming The cross section is circular or polygonal. The diameter of the flux inner core is 0.01-20mm, the thickness of the tin layer is 0.01-20mm, and the thickness of the matrix solder layer is 0.01-20mm. When preparing, put a certain size of tin strip and solder alloy strip into a precision rolling mill for compound rolling, so that a tin layer with uniform thickness is formed on the surface of the solder alloy, and then the tin side of the solder alloy strip faces upwards, and passes through multiple passes. U-shaped rolling, powder feeding, drawing, straightening and other processes make it into flux-cored solder containing flux and tin layer. The preparation method of the present invention is energy-saving and environment-friendly, the brazing material prepared has high tin content and uniform tin layer thickness, beautiful shape, and high utilization rate of tin; at the same time, the flux-cored brazing material has its own brazing flux, and the brazing flux is achieved during the brazing process. Automatic, precise and quantitative addition.
Description
技术领域technical field
本发明涉及焊接用钎料，尤其是涉及一种具有润湿先导作用的药芯钎料，本发明还涉及该药芯钎料的制备方法。The invention relates to brazing material for welding, in particular to a flux-cored brazing material with a wetting leading effect, and also relates to a preparation method of the flux-cored brazing material.
背景技术Background technique
液态金属均属粘性液体，其流动性能可用液态金属的粘度来衡量。液态金属粘度越大，则其流动性越差。而粘度与液态金属的过热度成反比。因此，当钎焊温度一定时，钎料的熔化温度越低，则液态钎料的过热度越大，从而引起液态钎料的粘度降低，流动性增强。钎料的熔化温升高时，过热度减小，粘度增大，流动性减弱。Liquid metals are all viscous liquids, and their fluidity can be measured by the viscosity of liquid metals. The more viscous a liquid metal is, the less fluid it is. The viscosity is inversely proportional to the superheat of the liquid metal. Therefore, when the brazing temperature is constant, the lower the melting temperature of the solder, the greater the superheat of the liquid solder, which will cause the viscosity of the liquid solder to decrease and the fluidity to increase. When the melting temperature of the solder increases, the degree of superheat decreases, the viscosity increases, and the fluidity decreases.
银基钎料熔点适中、钎焊工艺性能优越，具有良好的连接强度、导电性和耐腐蚀性，在机械、家电、工具等行业得到了广泛的应用。银钎料的主要合金元素是Ag、Cu、Zn，为满足不同性能要求，通常还加入Sn、Cd等低熔点元素。含镉银基钎料与无镉银基钎料相比，具有更低的固-液相线温度、良好的钎焊工艺性能，在很长一段时间里得到了广泛应用，但镉是有毒元素，对人类具有巨大危害性。银基钎料中加入Sn元素，可以显著降低钎料熔点，改善其润湿性能，再加上锡元素无毒，逐渐成为含镉银基钎料的替代钎料。而传统AgCuZnSn钎料，通过配料方法在AgCuZn合金钎料中加入Sn元素，然后采用熔炼、浇铸、轧制、挤压、拉拔等工序进行生产，加工的钎料主要有BAg25CuZnSn，BAg30CuZnSn，BAg40CuZnSn，BAg45CuZnSn，BAg56CuZnSn等，符合RoHs和WEEE指令要求。但上述方法生产的AgCuZnSn钎料中的Sn含量低，否则其塑性会显著降低，容易变脆，难以通过常规的加工方法成型。Silver-based solder has a moderate melting point, superior brazing process performance, good connection strength, electrical conductivity and corrosion resistance, and has been widely used in machinery, household appliances, tools and other industries. The main alloying elements of silver solder are Ag, Cu, and Zn. In order to meet different performance requirements, low melting point elements such as Sn and Cd are usually added. Compared with cadmium-free silver-based solder, cadmium-containing silver-based solder has lower solid-liquidus temperature and good brazing process performance, and has been widely used for a long time, but cadmium is a toxic element , is extremely harmful to humans. The addition of Sn element to silver-based solder can significantly reduce the melting point of the solder and improve its wettability. In addition, the tin element is non-toxic, and has gradually become a substitute for cadmium-containing silver-based solder. And the traditional AgCuZnSn solder, add Sn element in AgCuZn alloy solder by batching method, and then adopt processes such as smelting, casting, rolling, extruding, drawing to carry out production, the solder of processing mainly has BAg25CuZnSn, BAg30CuZnSn, BAg40CuZnSn, BAg45CuZnSn, BAg56CuZnSn, etc., meet the requirements of RoHs and WEEE directives. However, the Sn content in the AgCuZnSn solder produced by the above method is low, otherwise its plasticity will be significantly reduced, it will easily become brittle, and it will be difficult to shape it by conventional processing methods.
铜基钎料主要合金元素是Cu，满足不同性能要求，通常还加入Zn、Sn、P等元素，熔点较高，在铜基钎料中加入Sn元素可显著降低钎料熔点，改善其润湿性能。与银基钎料一样，传统CuZnSn钎料，通过配料方法在CuZn合金钎料中加入Sn元素，然后采用熔炼、浇铸、轧制、挤压、拉拔等工序进行生产，这种方法生产的CuZnSn钎料中的Sn含量低，如HS221，锡含量只有1%，否则其塑性会降低，钎料难以成形。The main alloying element of copper-based solder is Cu, which meets different performance requirements. Elements such as Zn, Sn, and P are usually added, and the melting point is high. Adding Sn element to copper-based solder can significantly reduce the melting point of the solder and improve its wetting. performance. Like silver-based brazing filler metals, traditional CuZnSn brazing filler metals add Sn elements to CuZn alloy brazing filler metals through the batching method, and then produce them by smelting, casting, rolling, extrusion, drawing and other processes. CuZnSn produced by this method The Sn content in the solder is low, such as HS221, the tin content is only 1%, otherwise its plasticity will be reduced, and the solder is difficult to form.
发明内容Contents of the invention
本发明的目的在于提供一种填缝性、成形性优异且自带钎剂的具有润湿先导作用的药芯钎料，本发明还提供该药芯钎料的制备方法。The object of the present invention is to provide a flux-cored solder with excellent gap-filling and formability and self-contained flux with a wetting pilot effect. The present invention also provides a preparation method of the flux-cored solder.
为实现上述目的，本发明可采取下述技术方案：To achieve the above object, the present invention can take the following technical solutions:
本发明所述的具有润湿先导作用的药芯钎料，包括钎剂内芯，所述钎剂内芯的外表面依次包覆有锡层和基体钎料层，成型后的药芯钎料的横截面呈圆形或多边形。The flux-cored solder with a wetting pilot effect according to the present invention includes a flux inner core, the outer surface of the flux core is coated with a tin layer and a matrix solder layer in turn, and the formed flux-cored solder The cross-section is circular or polygonal.
所述钎剂内芯的直径为0.01～20mm，所述锡层的厚度为0.01～20mm，所述基体钎料层的厚度为0.01～20mm。The diameter of the inner core of the brazing flux is 0.01-20 mm, the thickness of the tin layer is 0.01-20 mm, and the thickness of the base solder layer is 0.01-20 mm.
所述钎剂内芯占药芯钎料总重量的0.001~50%。The inner flux core accounts for 0.001-50% of the total weight of the flux core solder.
所述基体钎料层为银基钎料或铜基钎料。The base solder layer is silver-based solder or copper-based solder.
本发明具有润湿先导作用的药芯钎料的制备方法如下：The preparation method of the flux-core solder with wetting leading effect of the present invention is as follows:
将一定尺寸的锡带和钎料合金带放入精密轧机中进行复合轧制，使钎料合金表面形成厚度均匀的锡层，然后将钎料合金带的锡面朝上，经过多道U型轧制、送粉、拉拔、校直等工序将其制成内含钎剂和锡层的药芯钎料。Put a certain size of tin strip and solder alloy strip into a precision rolling mill for composite rolling, so that a tin layer with uniform thickness is formed on the surface of the solder alloy, and then the tin side of the solder alloy strip faces upwards, and passes through multiple U-shaped Rolling, powder feeding, drawing, straightening and other processes make it into flux-cored solder containing flux and tin layer.
本发明的优点在于：The advantages of the present invention are:
相对于传统熔炼、浇铸、轧制、挤压、拉拔等工序生产的银基或铜基含锡钎料，本发明的药芯钎料锡含量高且可精确控制，钎焊过程中，该药芯钎料中钎剂首先熔化，随之低熔点锡迅速铺展开来，待高熔点钎料合金完全熔化即能完全填充低熔点锡铺展的区域，并与锡发生固溶结合。与传统的钎料相比，该钎料润湿、填缝性能大大提高；本发明采用复合轧制的方法在机体钎料表面沉积一层锡，相对于钎料合金表面采用电镀、热浸镀、热喷涂、化学镀等传统方式沉积锡层，更加节能环保，制备的钎料锡含量高且锡层厚度均匀一致，成型美观，锡的利用率较高；同时本药芯钎料自带钎剂，钎焊过程中实现了钎剂的自动、精确、定量添加。Compared with silver-based or copper-based tin-containing solders produced by traditional smelting, casting, rolling, extrusion, drawing and other processes, the flux-cored solder of the present invention has a high tin content and can be precisely controlled. During the brazing process, the The flux in the flux-cored solder melts first, and then the low-melting-point tin spreads out rapidly. After the high-melting-point solder alloy is completely melted, the area where the low-melting-point tin is spread can be completely filled and solid-solution bonded with tin. Compared with the traditional brazing material, the wetting and seam filling performance of the brazing material is greatly improved; the present invention adopts the composite rolling method to deposit a layer of tin on the surface of the brazing material of the machine body, and adopts electroplating and hot-dip plating on the surface of the brazing material alloy. , thermal spraying, electroless plating and other traditional ways to deposit tin layer, more energy-saving and environmentally friendly, the prepared solder has high tin content and uniform tin layer thickness, beautiful shape, high utilization rate of tin; at the same time, the flux core solder comes with brazing During the brazing process, the automatic, precise and quantitative addition of flux is realized.
附图说明Description of drawings
图1是本发明的结构示意图。Fig. 1 is a structural schematic diagram of the present invention.
具体实施方式detailed description
如图1所示，本发明所述的具有润湿先导作用的药芯钎料，包括钎剂内芯1，钎剂内芯1的外表面依次包覆有锡层2和基体钎料层3，成型后的药芯钎料的横截面呈圆形或多边形。本发明的钎剂内芯1的直径为0.01～20mm，锡层2的厚度为0.01～20mm，基体钎料层3的厚度为0.01～20mm。As shown in Figure 1, the flux-cored solder with a wetting leading effect according to the present invention includes a flux inner core 1, and the outer surface of the flux inner core 1 is coated with a tin layer 2 and a matrix solder layer 3 in sequence , the cross-section of the formed flux core solder is circular or polygonal. The diameter of the flux inner core 1 of the present invention is 0.01-20 mm, the thickness of the tin layer 2 is 0.01-20 mm, and the thickness of the base solder layer 3 is 0.01-20 mm.
钎剂内芯的直径决定药芯钎料中钎剂的含量,在钎焊铜及铜合金、铁等氧化膜容易去除的金属时，钎剂内芯直径较小，可为0.01～4mm；在钎焊不锈钢、硬质合金等氧化膜不易去除的金属时，钎剂内芯直径较大，可为1～20mm。锡层的厚度决定着钎料的填缝性，对于管状结构的钎焊，锡层较厚，可为0.1～20mm；对于平面结构的钎焊，锡层较薄，可为0.01～2mm。基体钎料层的厚度与填缝大小有关。The diameter of the inner core of the flux determines the content of the flux in the cored solder. When brazing copper, copper alloys, iron and other metals whose oxide film is easily removed, the diameter of the inner core of the flux is small, which can be 0.01-4mm; When brazing stainless steel, hard alloy and other metals whose oxide film is not easy to remove, the diameter of the inner core of the flux is relatively large, which can be 1-20mm. The thickness of the tin layer determines the filling performance of the solder. For the brazing of the tubular structure, the tin layer is thicker, which can be 0.1-20mm; for the brazing of the planar structure, the tin layer is thinner, which can be 0.01-2mm. The thickness of the base solder layer is related to the size of the filler.
制备时，将一定尺寸的锡带和钎料合金带放入精密轧机中进行复合轧制，使钎料合金表面形成厚度均匀的锡层，然后将钎料合金带的锡面朝上，经过多道U型轧制、送粉、拉拔、校直等工序将其制成内含钎剂和锡层的药芯钎料。During preparation, a certain size of tin strip and solder alloy strip is put into a precision rolling mill for compound rolling, so that a tin layer with uniform thickness is formed on the surface of the solder alloy, and then the tin side of the solder alloy strip faces upwards, and after many U-shaped rolling, powder feeding, drawing, straightening and other processes to make it into a flux-cored solder containing flux and tin layer.
基体钎料可采用银基钎料或铜基钎料，钎剂为通用钎剂。The base solder can be silver-based solder or copper-based solder, and the solder is a general-purpose solder.
下面通过具体实施例来进一步说明本发明药芯钎料的制备方法和其技术效果。The preparation method and technical effect of the flux core solder of the present invention will be further illustrated below through specific examples.
实施例1Example 1
基体钎料合金可选用厚度0.2mm的BAg25CuZn合金带，锡带厚度为0.1mm，经精密轧机多道轧制形成锡层厚度0.02mm、基体钎料层3厚度0.18mm的BAgCuZnSn钎料合金带，药芯钎剂选择FB102，然后按常规方法（带状钎料合金经多道轧制、送粉、拉拔、校直等工序）将表面覆锡的钎料合金带制成直径2mm的药芯钎料。根据国家标准GB/T 11364-2008《钎料润湿性试验方法》，基体钎料和制备的钎料进行润湿性对比试验。将制备的钎料200mg置于40mm×40mm、厚度为2mm的Q235碳钢板中央，采用与制备钎料相同质量的FB102钎剂覆盖基体钎料，钎剂加上基体钎料重量为200mg，置于40mm×40mm、厚度为2mm的Q235碳钢板中央。将其分别放入RSL-5润湿炉中加热，待钎料熔化后保温40～50 s，室温自然冷却后清洗干净，经过计算制备的钎料润湿面积几乎是基体钎料的2倍。结果表面本发明制备的药芯钎料相比基体钎料润湿面积大幅增加。The base solder alloy can be BAg25CuZn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. The BAgCuZnSn solder alloy strip with a tin layer thickness of 0.02mm and a base solder layer 3 thickness of 0.18mm is formed by multi-pass rolling in a precision rolling mill. Choose FB102 as the flux core flux, and then make the flux core with a diameter of 2mm from the tin-coated solder alloy strip according to the conventional method (multi-pass rolling, powder feeding, drawing, straightening and other processes) Solder. According to the national standard GB/T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with FB102 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively. After the solder is melted, keep it warm for 40-50 s. After cooling at room temperature naturally, it is cleaned. The wetted area of the prepared solder is almost twice that of the base solder. The results show that the wetted area of the flux core solder prepared by the present invention is greatly increased compared with that of the base solder.
实施例2Example 2
基体钎料合金选用厚度为0.2mm的BAg30CuZn合金带，锡带厚度为0.1mm，经精密轧机多道轧制形成锡层厚度为0.01mm、钎料合金层厚度为0.18mm的BAgCuZnSn钎料合金带，然后按常规方法（带状钎料合金经多道轧制、送粉、拉拔、校直等工序）将表面覆锡的钎料合金带制成直径为2mm的药芯钎料，药芯钎剂选择FB102。根据国家标准GB/T 11364-2008《钎料润湿性试验方法》，基体钎料和制备的钎料进行润湿性对比试验。将制备的钎料200mg置于40mm×40mm、厚度为2mm的Q235碳钢板中央，采用与制备钎料相同质量的FB102钎剂覆盖基体钎料，钎剂加上基体钎料重量为200mg，置于40mm×40mm、厚度为2mm的Q235碳钢板中央。将其分别放入RSL-5润湿炉中加热，待钎料熔化后保温40～50 s，室温自然冷却后清洗干净，经过计算制备的钎料润湿面积几乎是基体钎料的1.8倍。结果表面本发明制备的药芯钎料相比基体钎料润湿面积大幅增加。The base solder alloy is BAg30CuZn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BAgCuZnSn solder alloy strip with a tin layer thickness of 0.01mm and a solder alloy layer thickness of 0.18mm is formed. , and then according to the conventional method (the strip-shaped solder alloy undergoes multi-pass rolling, powder feeding, drawing, straightening and other processes) to make the tin-coated solder alloy strip on the surface into a flux-cored solder with a diameter of 2mm. Flux selection FB102. According to the national standard GB/T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with FB102 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively. After the brazing filler metal melts, keep it warm for 40-50 s, and then clean it after natural cooling at room temperature. The wetted area of the brazing filler metal prepared by calculation is almost 1.8 times that of the base filler metal. The results show that the wetted area of the flux core solder prepared by the present invention is greatly increased compared with that of the base solder.
实施例3Example 3
基体钎料合金选用厚度为0.2mm的BAg45CuZn合金带，锡带厚度为0.1mm，经精密轧机多道轧制形成锡层厚度为0.03mm、钎料合金层厚度为0.18mm的BAgCuZnSn钎料合金带，然后按常规方法（带状钎料合金经多道轧制、送粉、拉拔、校直等工序）将表面覆锡的钎料合金带制成直径为2mm的药芯钎料，药芯钎剂选择FB102。根据国家标准GB/T 11364-2008《钎料润湿性试验方法》，基体钎料和制备的钎料进行润湿性对比试验。将制备的钎料200mg置于40mm×40mm、厚度为2mm的Q235碳钢板中央，采用与制备钎料相同质量的FB102钎剂覆盖基体钎料，钎剂加上基体钎料重量为200mg，置于40mm×40mm、厚度为2mm的Q235碳钢板中央。将其分别放入RSL-5润湿炉中加热，待钎料熔化后保温40～50 s，室温自然冷却后清洗干净，经过计算制备的钎料润湿面积几乎是基体钎料的1.7倍。结果表面本发明制备的药芯钎料相比基体钎料润湿面积明显增加。The base solder alloy is BAg45CuZn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BAgCuZnSn solder alloy strip with a tin layer thickness of 0.03mm and a solder alloy layer thickness of 0.18mm is formed. , and then according to the conventional method (the strip-shaped solder alloy undergoes multi-pass rolling, powder feeding, drawing, straightening and other processes) to make the tin-coated solder alloy strip on the surface into a flux-cored solder with a diameter of 2mm. Flux selection FB102. According to the national standard GB/T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with FB102 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively. After the solder is melted, keep it warm for 40-50 s. After cooling at room temperature naturally, it is cleaned. The wetted area of the prepared solder is almost 1.7 times that of the base solder. The results show that the wetted area of the flux core solder prepared by the present invention is significantly increased compared with that of the base solder.
实施例4Example 4
基体钎料合金选用厚度为0.2mm的BCu62Zn合金带，锡带厚度为0.1mm，经精密轧机多道轧制形成锡层厚度为0.04mm、钎料合金层厚度为0.18mm的BCuZnSn钎料合金带，然后按常规方法（带状钎料合金经多道轧制、送粉、拉拔、校直等工序）将表面覆锡的钎料合金带制成直径为2mm的药芯钎料，药芯钎剂选择YJ2。根据国家标准GB/T 11364-2008《钎料润湿性试验方法》，基体钎料和制备的钎料进行润湿性对比试验。将制备的钎料200mg置于40mm×40mm、厚度为2mm的Q235碳钢板中央，采用与制备钎料相同质量的YJ2钎剂覆盖基体钎料，钎剂加上基体钎料重量为200mg，置于40mm×40mm、厚度为2mm的Q235碳钢板中央。将其分别放入RSL-5润湿炉中加热，待钎料熔化后保温40～50 s，室温自然冷却后清洗干净，经过计算，制备的钎料润湿面积几乎是基体钎料的1.5倍。结果表面本发明制备的药芯钎料相比基体钎料润湿面积大幅增加。The base solder alloy is BCu62Zn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BCuZnSn solder alloy strip with a tin layer thickness of 0.04mm and a solder alloy layer thickness of 0.18mm is formed. , and then according to the conventional method (the strip-shaped solder alloy undergoes multi-pass rolling, powder feeding, drawing, straightening and other processes) to make the tin-coated solder alloy strip on the surface into a flux-cored solder with a diameter of 2mm. Flux selection YJ2. According to the national standard GB/T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with YJ2 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively. After the solder is melted, keep it warm for 40-50 s, and then clean it after natural cooling at room temperature. After calculation, the wetted area of the prepared solder is almost 1.5 times that of the base solder . The results show that the wetted area of the flux core solder prepared by the present invention is greatly increased compared with that of the base solder.
实施例5Example 5
基体钎料合金选用厚度为0.2mm的BCu60Zn合金带，锡带厚度为0.1mm，经精密轧机多道轧制形成锡层厚度为0.05mm、钎料合金层厚度为0.18mm的BCuZnSn钎料合金带，然后按常规方法（带状钎料合金经多道轧制、送粉、拉拔、校直等工序）将表面覆锡的钎料合金带制成直径为2mm的药芯钎料，药芯钎剂选择YJ2。根据国家标准GB/T 11364-2008《钎料润湿性试验方法》，基体钎料和制备的钎料进行润湿性对比试验。将制备的钎料200mg置于40mm×40mm、厚度为2mm的Q235碳钢板中央，采用与制备钎料相同质量的YJ2钎剂覆盖基体钎料，钎剂加上基体钎料重量为200mg，置于40mm×40mm、厚度为2mm的Q235碳钢板中央。将其分别放入RSL-5润湿炉中加热，待钎料熔化后保温40～50 s，室温自然冷却后清洗干净，经过计算，制备的钎料润湿面积几乎是基体钎料的1.3倍。结果表面本发明制备的药芯钎料相比基体钎料润湿面积大幅增加。The base solder alloy is BCu60Zn alloy strip with a thickness of 0.2mm, and the thickness of the tin strip is 0.1mm. After multi-pass rolling by a precision rolling mill, a BCuZnSn solder alloy strip with a tin layer thickness of 0.05mm and a solder alloy layer thickness of 0.18mm is formed. , and then according to the conventional method (the strip-shaped solder alloy undergoes multi-pass rolling, powder feeding, drawing, straightening and other processes) to make the tin-coated solder alloy strip on the surface into a flux-cored solder with a diameter of 2mm. Flux selection YJ2. According to the national standard GB/T 11364-2008 "Solder Wettability Test Method", the matrix solder and the prepared solder were subjected to a wettability comparison test. Place 200 mg of the prepared brazing material in the center of a Q235 carbon steel plate with a thickness of 40 mm × 40 mm and a thickness of 2 mm, and cover the base solder with YJ2 flux of the same quality as the prepared solder. The weight of the solder plus the base solder is 200 mg. 40mm×40mm, the center of Q235 carbon steel plate with a thickness of 2mm. Put them into the RSL-5 wetting furnace and heat them respectively. After the solder is melted, keep it warm for 40-50 s. After natural cooling at room temperature, clean it. After calculation, the wetted area of the prepared solder is almost 1.3 times that of the base solder. . The results show that the wetted area of the flux core solder prepared by the present invention is greatly increased compared with that of the base solder.
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