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CN106505059B - 基板结构 - Google Patents

基板结构 Download PDF

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CN106505059B
CN106505059B CN201510652194.8A CN201510652194A CN106505059B CN 106505059 B CN106505059 B CN 106505059B CN 201510652194 A CN201510652194 A CN 201510652194A CN 106505059 B CN106505059 B CN 106505059B
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electric contact
contact mat
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CN106505059A (zh
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潘嘉伟
高迺澔
张宏达
姜亦震
江东昇
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Siliconware Precision Industries Co Ltd
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    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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Abstract

一种基板结构，包括：一基板本体、以及设于该基板本体上的电性接触垫，且该电性接触垫具有至少一镂空部，以令该基板本体的部分表面外露于该镂空部，使该电性接触垫的刚性变小，故当该基板结构受力时，该电性接触垫所产生相抗衡的力矩大幅减小，以避免该基板本体破裂的问题。

Description

基板结构
技术领域
本发明涉及一种基板结构，特别是涉及一种具有改良的电性接触垫的基板结构。
背景技术
随着半导体封装技术的演进，半导体装置(Semiconductor device)已开发出不同的封装型态。其中，球栅数组式(Ball grid array,BGA)，例如PBGA、EBGA、FCBGA等，为一种先进的半导体封装技术，其特点在于采用一封装基板来安置半导体组件，并于该封装基板背面植置多数个成栅状数组排列的锡球(Solder ball)，使相同单位面积的承载件上可容纳更多输入/输出连接端(I/O connection)以符合高度集积化(Integration)的半导体芯片的需求，并藉该些锡球将整个封装单元焊结并电性连接至外部电子装置。
此外，为了符合半导体封装件轻薄短小、多功能、高速度及高频化的开发方向，半导体芯片已朝向细线路及小孔径发展。
图1为现有半导体芯片1的剖视示意图。如图1所示，提供一具有多个电性接触垫100与导电迹线101的本体10，该本体10具有一基底10a及设于该基底10a上的一线路结构10b，且该电性接触垫100与导电迹线101设于该线路结构10b上。接着，形成一绝缘保护层11于该芯片本体10上，再于该绝缘保护层11上形成多个开孔110，使各该电性接触垫100对应外露于各该开孔110。之后，通过凸块底下金属层130形成多个如焊球的导电组件13于该电性接触垫100上，使该导电组件13电性连接该电性接触垫100，以完成现有覆晶封装(FlipChip Package)用的半导体芯片1。
于封装制造方法中，该半导体芯片1通过回焊该些导电组件13以结合至封装基板(图略)上，此时，该半导体芯片1需承受外力，例如，回焊炉会对该半导体芯片1的内部产生热应力。
但是，当该半导体芯片1的内部产生热应力时，该电性接触垫100因其形状为实心圆片(如图1’所示)而具有极强的刚性，故该电性接触垫100会对该热应力产生相抗衡的力矩，特别在该电性接触垫100的边缘处所产生的相抗衡的力矩最大，造成位于该电性接触垫100的边缘处附近的线路结构10b因承受过大应力而碎裂(Crack)，如图1所示的碎裂处K。
因此，如何克服上述现有技术的问题，实已成目前亟欲解决的问题。
发明内容
鉴于上述现有技术的种种缺点，本发明提供一种基板结构，以避免该基板本体破裂的问题。
本发明的基板结构包括：基板本体；以及电性接触垫，其设于该基板本体上且具有至少一镂空部，以令该基板本体的部分表面外露于该镂空部。
前述的基板结构中，该基板本体为线路结构。
前述的基板结构中，该基板本体包含有基底及设于该基底上的线路结构，且该电性接触垫设于该线路结构上。
前述的基板结构中，该基板本体上还具有至少一电性连接该电性接触垫的导电迹线。
前述的基板结构中，该电性接触垫的上视平面形状为圆形或多边形。
前述的基板结构中，该镂空部位于该电性接触垫的边缘。
前述的基板结构中，且该镂空部的侧面形状对应该电性接触垫的侧面形状。例如，该镂空部的外侧面平行该电性接触垫的侧面；或者，该镂空部的平面形状为具缺口的环状或至少二间隔的扇形；或者，该电性接触垫的上视平面形状为圆形或多边形。
前述的基板结构中，还包括绝缘保护层，设于该基板本体上，且该绝缘保护层具有开孔，使该电性接触垫外露于该开孔。
前述的基板结构中，还包括设于该电性接触垫上的导电组件。
前述的基板结构中，还包括设于该电性接触垫上的凸块底下金属层。
由上可知，本发明的基板结构，通过该镂空部的设计，使该电性接触垫的刚性变小，故相比于现有技术，当该基板结构受力时，该电性接触垫不会因刚性过强而产生过大的相抗衡的力矩于该基板本体上，故能避免该基板本体破裂的问题。
附图说明
图1为现有半导体芯片的剖视示意图；
图1’为现有电性接触垫的上视平面图；
图2为本发明的基板结构的剖视示意图；
图2’为图2的另一实施例的剖视示意图；
图2A至图2I为本发明的基板结构的电性接触垫的第一实施例的各种实施例的上视平面图；以及
图3A至图3C为本发明的基板结构的电性接触垫的第二实施例的各种实施例的上视平面图。
附图标记说明：
1 半导体芯片
10 本体
10a,20a 基底
10b,20b 线路结构
100,200,300 电性接触垫
101,201 导电迹线
11,21 绝缘保护层
110,210 开孔
13,23 导电组件
130,230 凸块底下金属层
2 基板结构
20,20’ 基板本体
200a,300a 镂空部
K 碎裂处
R 侧面
S 外侧面。
具体实施方式
以下通过特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供本领域技术人员的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”及“一”等的用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2为本发明的基板结构2的剖视示意图。如图2所示，该基板结构2包括：一基板本体20、设于该基板本体20上的多个电性接触垫200、多个导电迹线201以及一绝缘保护层21。
所述的基板本体20包含有线路结构，例如为线路板，其具有多个介电层及多个线路层，且该电性接触垫200与该导电迹线201设于最外层的介电层上并电性连接该线路层。
于另一实施例中，如图2’所示，该基板本体20’包含有一基底20a及设于该基底20a上的一线路结构20b，且该电性接触垫200设于该线路结构20b上。例如，该基底20a为半导体基材，如晶圆、芯片、具有硅穿孔(Through-Silicon Via，简称TSV)的中介板等，且该线路结构20b具有多个介电层(图略)及多个线路重布层(redistribution layer，简称RDL)(图略)，且该电性接触垫200与该导电迹线201设于最外层的介电层上并电性连接该线路重布层、或者该电性接触垫200与该导电迹线201作为线路重布层的一部分。
所述的电性接触垫200电性连接该导电迹线201，且该电性接触垫200具有至少一镂空部200a，以令该基板本体20(或该线路结构20b)的部分表面外露于该镂空部200a。
于本实施例中，该镂空部200a位于该电性接触垫200的边缘，但并未连通该电性接触垫200的侧面R(如图2A所示)。
此外，该镂空部200a的成型方法为蚀刻或雷射该电性接触垫200；或者，可直接电镀或涂布形成具有该镂空部200a的电性接触垫200。
另外，由于各该电性接触垫200与导电迹线201的周围及其上的结构均相同，故于图式中仅绘示单一电性接触垫200与导电迹线201以作说明，特此述明。
所述的绝缘保护层21具有对应外露该电性接触垫200的开孔210。例如，该绝缘保护层21的材质为防焊材或介电材，例如聚亚酰胺(Polyimide，简称PI)、苯并环丁烯(Benezocy-clobutene，简称BCB)或聚对二唑苯(Polybenzoxazole，简称PBO)。
另外，所述的基板结构2还包括设于该开孔210中的导电组件23，其电性连接该电性接触垫200。
于本实施例中，该导电组件23为焊球、金属块等，使该基板结构2通过该些导电组件23结合其它电子组件(图略)，例如，半导体晶圆、芯片、具有硅穿孔的中介板、或线路板。
此外，于该导电组件23的底下可先形成一凸块底下金属层(Under BumpMetallurgy，简称UBM)230，使该导电组件23更牢固地结合于该电性接触垫200上。
本发明的基板结构2通过形成该镂空部200a于该电性接触垫200上，使该电性接触垫200的刚性变小，当该基板结构2受力时，特别是受热压力而发生翘曲时，该电性接触垫200不会因刚性过强而产生过大的相抗衡的力矩于该基板本体20,20’上，故能避免该基板本体20,20’的线路层或RDL断裂的问题。
此外，该镂空部200a的面积越大，则该电性接触垫200的应力改善的效果越好，即该电性接触垫200具有较佳的弹性与柔软性。如图2A至图2H所示，当该电性接触垫200的上视平面形状为圆形时，该镂空部200a的侧面形状(即弧状)对应该电性接触垫200的侧面形状(即弧状)，以令该镂空部200a的平面形状形成如至少二间隔的扇形或类似扇形，且较佳地，该镂空部200a的外侧面S平行该电性接触垫200的侧面R，藉以得到最大面积的镂空部200a。
较佳地，相比于现有电性接触垫，图2E所示的镂空部200a的面积较大，致使其所产生的力矩较小，约仅现有电性接触垫所产生的力矩的92％。
又，该镂空部200a的平面形状也可形成具缺口的环形，如图2I所示，其所产生的力矩约仅现有电性接触垫所产生的力矩的92％。
另外，该电性接触垫300的上视平面形状可为其它几何形状，如图3A至图3C所示的多边形，且该镂空部200a的侧面形状(即平直状)对应该电性接触垫200的侧面形状(即平直状)，以得到最大面积的镂空部300a。
因此，有关该电性接触垫与镂空部的形状态样繁多，并不限于上述。
综上所述，本发明的基板结构，主要通过在该电性接触垫上形成镂空部，且该镂空部的侧面形状对应该电性接触垫的侧面形状，以减小该电性接触垫的刚性，故于该基板结构受力时，该电性接触垫所产生相抗衡的力矩大幅减小，因而该基板本体不会发生碎裂的问题。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (12)

1.一种基板结构，其特征为，该基板结构包括：
一基板本体；
多个电性接触垫，各该电性接触垫设于该基板本体上且为具有至少一镂空部的单一结构，以令该基板本体的部分表面外露于该镂空部；以及
多个导电组件，设于各该电性接触垫上，
其中，该至少一镂空部位于该导电组件下。
2.一种基板结构，其特征为，该基板结构包括：
一基板本体，且该基板本体为线路结构；
多个电性接触垫，各该电性接触垫直接接触且设于该线路结构上，且各该电性接触垫为具有至少一镂空部的单一结构，以令该基板本体的部分表面外露于该镂空部；以及
多个导电组件，设于各该电性接触垫上，
其中，该至少一镂空部位于该导电组件下。
3.一种基板结构，其特征为，该基板结构包括：
一基板本体，该基板本体包含有基底及设于该基底上的线路结构；
多个电性接触垫，各该电性接触垫直接接触且设于该线路结构上，且各该电性接触垫为具有至少一镂空部的单一结构，以令该基板本体的部分表面外露于该镂空部，且该电性接触垫；以及
多个导电组件，设于各该电性接触垫上，
其中，该至少一镂空部位于该导电组件下。
4.如根据权利要求1或2所述的基板结构，其特征为，该基板本体上还具有至少一电性连接该电性接触垫的导电迹线。
5.如根据权利要求1或2所述的基板结构，其特征为，该电性接触垫的上视平面形状为圆形或多边形。
6.如根据权利要求1或2所述的基板结构，其特征为，该镂空部位于该电性接触垫的边缘。
7.如根据权利要求1或2所述的基板结构，其特征为，该镂空部的侧面形状对应该电性接触垫的侧面形状。
8.如根据权利要求7所述的基板结构，其特征为，该镂空部的外侧面平行该电性接触垫的侧面。
9.如根据权利要求7所述的基板结构，其特征为，该镂空部的平面形状为具缺口的环状或至少二间隔的扇形。
10.如根据权利要求7所述的基板结构，其特征为，该电性接触垫的上视平面形状为圆形或多边形。
11.如根据权利要求1或2所述的基板结构，其特征为，还包括绝缘保护层，其设于该基板本体上，且该绝缘保护层具有开孔，使该电性接触垫外露于该开孔。
12.如根据权利要求1或2所述的基板结构，其特征为，该基板结构还包括设于该电性接触垫上的凸块底下金属层。
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