CN106449480A - Backflow tool, semiconductor encapsulation method, semiconductor encapsulating piece and air conditioner - Google Patents
Backflow tool, semiconductor encapsulation method, semiconductor encapsulating piece and air conditioner Download PDFInfo
- Publication number
- CN106449480A CN106449480A CN201610917060.9A CN201610917060A CN106449480A CN 106449480 A CN106449480 A CN 106449480A CN 201610917060 A CN201610917060 A CN 201610917060A CN 106449480 A CN106449480 A CN 106449480A
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- Prior art keywords
- lead frame
- carrier
- substrate
- backflow
- press strip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H01L2224/83815—Reflow soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/858—Bonding techniques
- H01L2224/85801—Soldering or alloying
- H01L2224/85815—Reflow soldering
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a backflow tool, a semiconductor encapsulation method, a semiconductor encapsulating piece and an air conditioner. The backflow tool comprises a carrier and a pressing strip; the carrier is used for bearing substrates adhered with wafers and lead frames, and a first connecting portion is arranged on the carrier; a second connecting portion is arranged on the pressing strip, and the pressing strip is detachably connected with the carrier through matching of the first connecting portion and the second connecting portion and is used for pressing the lead frames on the carrier and the substrates. During semiconductor encapsulation, the substrates brushed with solder paste and adhered with the wafers and the tin-plated lead frames are fixed on the tool prior to backflow, tin material on the substrates is molten and solidified again so as to fix the wafers and pins of the lead frames on the corresponding substrates, and accordingly the procedure of thermocompression bonding of the lead frames and the substrates is omitted. Besides, the substrates and the lead frames are fixed through the tool during backflow, accuracy in relative position of the substrates and the lead frames is assured, and accordingly quality of products is guaranteed.
Description
Technical field
The present invention relates to field of semiconductor package, more specifically, it is related to a kind of backflow frock, a kind of semiconductor packages side
Method, a kind of semiconductor package part being manufactured by above-mentioned method for packaging semiconductor, and a kind of there is above-mentioned semiconductor package part
Air-conditioner.
Background technology
At present, in semiconductor packaging industry, substrate is generally mutually welded by hot pressing Welding with lead frame, and encapsulation produces
When need first the substrate brushing tin cream, gluing wafer to be flowed back, then use hot pressing soldering method by not tin plating lead frame
Substrate welding with after backflow, completes lead frame to be carried out after plastic packaging procedure tin plating, packaging process is more after product again
Loaded down with trivial details.And when carrying out thermocompression bonding operation, the relative position of lead frame and substrate, it may happen that change, leads to lead frame
With substrate dislocation, the quality of impact product.
Content of the invention
Present invention seek to address that at least one technical problem present in prior art.
For this reason, the first of the present invention purpose is, provide a kind of backflow frock.
Second object of the present invention is, provides a kind of method for packaging semiconductor.
Third object of the present invention is, provides a kind of semiconductor package part, is manufactured by above-mentioned method for packaging semiconductor
Form.
Fourth object of the present invention is, provides a kind of air-conditioner, including above-mentioned semiconductor package part.
For achieving the above object, the embodiment of first aspect present invention provides a kind of backflow frock, for semiconductor package
Dress, including：Carrier, described carrier is used for carrying substrate and the lead frame posting wafer, and described carrier is provided with the first connection
Portion；Press strip, described press strip is provided with second connecting portion, and described press strip is joined by described first connecting portion and described second connecting portion
Close the connection that can dismantle with described carrier, described press strip is used for for described lead frame being pressed on described carrier and described substrate
Upper.
Present solution provides a kind of backflow frock, when carrying out semiconductor packages, first will brush tin cream, post the substrate of wafer
It is placed on relevant position on carrier, then the lead frame having plated stannum is placed relevant position drawing lead frame on carrier
Foot is pasted onto on substrate, then press strip is assembled on carrier, now lead frame is pressed on carrier press strip, and lead frame
Substrate is pressed on carrier the pin of frame, thus substrate and lead frame are fixed, then flows back in frock to being fixed on
Substrate and lead frame are flowed back, and so that the stannum material on substrate is melted again, solidify, thus drawing wafer and lead frame
Foot is fixed on substrate, so just eliminates the operation of lead frame and substrate thermocompression bonding, simplifies the operation of semiconductor packages,
Thus the production efficiency of improving product.And, substrate and the backflow frock that provided by this programme of lead frame are fixed when flowing back,
Ensureing the accuracy of substrate and lead frame relative position, preventing lead frame from misplacing with substrate, thus ensureing the quality of product.
Wherein, when substrate and lead frame are fixed in backflow frock, press strip compresses lead frame but does not cover lead frame
The pin of frame and substrate connection and substrate, it is to avoid press strip affects reflowing result.Carrier and press strip are by high temperature resistant, low Heat Conduction Material
Make, for example compound stone, typically require carrier and press strip can bear the temperature of 300 DEG C of even more highs.
It is preferable that described first fixed part includes the first magnet being fixed on described carrier in technique scheme,
Described second fixed part includes the second magnet being fixed on described press strip, and described press strip passes through described first magnet and described the
The connection that two magnet adhesives and described carrier can be dismantled.
In this programme, carrier and press strip be respectively provided with the first magnet and the second magnet, carrier and press strip relative to when, first
Magnet and the second magnet polarity are contrary, make press strip and the dismountable connection of carrier by the first magnet and the second magnet adhesive, this
Sample design press strip and carrier easy accessibility, substrate and lead frame are fixed in backflow frock or take off required from frock
Time-consuming short, thus can improving product production efficiency.
It should be noted that carrier and press strip realize dismountable connection also by other fit systems, such as in carrier
With the jack being adapted and inserting column are respectively provided with press strip.
It is preferable that being provided with board positioning part on described carrier in any of the above-described technical scheme, described board positioning part is used
In restriction placement location on described carrier for the described substrate.
The accuracy of substrate and carrier relative position can be ensured by the design of board positioning part, it is to avoid substrate puts inclined impact
Backflow frock is to the fixed effect of substrate and follow-up reflowing result.
It is preferable that described board positioning part includes the holding tank being adapted to described substrate in any of the above-described technical scheme.
In this programme, board positioning part is the holding tank being adapted to substrate, and substrate is placed in holding tank, is positioned such that effect
Really good, substrate can be prevented effectively from and put inclined problem generation.
In any of the above-described technical scheme it is preferable that in described holding tank and/or described holding tank edge be provided with logical
Hole.
It is so that substrate is preferably heated it is ensured that the effect that flows back accommodating groove location and arranging the purpose of through hole
Really, thus the pin of wafer and lead frame is fixed on substrate.
It is preferable that lead frame location division, described lead frame are provided with described carrier in any of the above-described technical scheme
Location division is used for limiting placement location on described carrier for the described lead frame.
The accuracy of lead frame and carrier relative position can be ensured by the design of board positioning part, thus ensureing lead
Framework and the accuracy of basic relative position, it is to avoid lead frame is misplaced with basic, is that subsequent reflow is prepared.
It is preferable that being provided with location hole on described lead frame in any of the above-described technical scheme, lead frame location division is wrapped
Include convex pin, when described substrate and described lead frame are placed on described carrier, described convex pin and described location hole
Cooperation.
This programme arrange on carrier with lead frame on location hole cooperation convex pin, with ensure lead frame with
The accuracy of carrier relative position, the structure of so design lead frame location division is simple, and the difficulty of processing of backflow frock is low.
It is preferable that being provided with locating slot on described press strip in any of the above-described technical scheme, described press strip is assembled to described load
When on tool, described locating slot is coordinated with described convex pin, to limit the relative position of described press strip and described carrier.
In this programme, press strip relevant position is provided with locating slot, and when press strip is assembled on carrier, locating slot is joined with convex pin
Close, to ensure the accuracy of press strip and carrier relative position, so that it is guaranteed that press strip effectively compresses lead frame, and prevent press strip from putting
Partially cover pin and the substrate of lead frame.
It is preferable that described locating slot is groove in any of the above-described technical scheme, described groove is relative with its kerve wall
Opening is located at the edge of the first end of described press strip.
Locating slot is designed as groove, makes convex pin be easier to enter locating slot, reduce the difficulty of press strip and carrier,
Thus can shorten that the time-consuming of backflow frock is fixed on for substrate and lead frame, lift packaging efficiency.
It is preferable that being provided with one of the second end of described press strip and described carrier in any of the above-described technical scheme
Spacing block set, another is provided with stopper slot, when described press strip is assembled on described carrier, described stopper slot and described limit convex
Block coordinates.
In first end setting locating slot and the convex pin of press strip and carrier in this programme, at the second end of press strip and carrier
Setting stopper slot and spacing block set, press strip and carrier are carried out spacing it is ensured that the accuracy of press strip and carrier relative position, it is to avoid
There is problem of misalignment, thus preventing lead frame from misplacing with substrate when carrying out reflow process, to protect after press strip and carrier adhesive
Card package quality.
The embodiment of second aspect present invention provides a kind of method for packaging semiconductor, including：There is provided substrate, in described base
Brush tin cream, stickup wafer on plate；Lead frame is provided, tin plating on described lead frame；Described substrate is placed on as this
On the carrier of backflow frock described in bright first aspect any embodiment；Described lead frame is placed on described carrier, and
The pin of described lead frame is pasted on the substrate；The press strip of described backflow frock is assembled on described carrier, with
Fixing described lead frame and described substrate；The described substrate and described lead frame being fixed in described backflow frock is carried out
Backflow, so that described substrate mutually welds with described lead frame.
It should be noted that in above-mentioned method for packaging semiconductor, provide substrate brush tin cream, the work of patch wafer thereon
Sequence, and provides lead frame operation tin plating thereon in no particular order, and the two position can exchange.
When semiconductor packages is carried out by the method for packing that this programme provides, first brush tin cream, patch wafer on substrate, and
Tin plating on lead frame, then the substrate brushing tin cream, posting wafer is placed on relevant position on carrier, then will plate stannum
Lead frame place the relevant position pin of lead frame is pasted onto on substrate on carrier, then press strip is assembled to load
On tool, now lead frame is pressed on carrier press strip, and substrate is pressed on carrier the pin of lead frame, thus will
Substrate and lead frame are fixed, and then the substrate and lead frame being fixed in backflow frock are flowed back, make on substrate
Stannum material melts again, solidifies, thus the pin of wafer and lead frame is fixed on substrate, so just eliminates lead frame
Frame and the operation of substrate thermocompression bonding, simplify the operation of semiconductor packages, thus the production efficiency of improving product.And substrate and
During lead frame backflow, the backflow frock that provided by this programme is fixed it is ensured that the accuracy of substrate and lead frame relative position,
Prevent lead frame from misplacing with substrate, thus ensureing the quality of product.
Its lead frame tin coating of product that the method for packaging semiconductor being provided by this programme is produced has and melts again
Vestige.
In technique scheme, method for packaging semiconductor also includes：To the described substrate after backflow and described lead frame
Frame is carried out；Wiring is carried out to described wafer and described substrate, so that described wafer is electrically connected with described substrate；To described substrate
Carry out plastic packaging with described lead frame；Cutting is carried out to the device after plastic packaging, and shaping is carried out to lead frame.
The embodiment of third aspect present invention provides a kind of semiconductor package part, arbitrary by such as second aspect present invention
The method for packaging semiconductor that embodiment provides is fabricated by.
This programme provide semiconductor package part be fabricated by by the method for packaging semiconductor after simplifying, its production process with
Existing product is compared more simply, and the production efficiency of therefore product is higher, production cost is lower.And, product carries out reflow process
When fixed by above-mentioned backflow frock, prevent lead frame and substrate from misplacing, thus can improving product qualification rate.In addition, this
Its lead frame tin coating of semiconductor package part that scheme provides has the vestige melting again.
The embodiment of fourth aspect present invention provides a kind of air-conditioner, including such as third aspect present invention any embodiment
The semiconductor package part providing.
The air-conditioner that fourth aspect present invention embodiment provides, has the half of the offer of third aspect present invention any embodiment
Conductor packaging part, therefore this air-conditioner have whole beneficial effects of the semiconductor package part that any of the above-described embodiment provides,
This repeats no more.
The additional aspect of the present invention and advantage will become obvious in following description section, or by the practice of the present invention
Recognize.
Brief description
The above-mentioned and/or additional aspect of the present invention and advantage will become from reference to the description to embodiment for the accompanying drawings below
Substantially and easy to understand, wherein：
Fig. 1 is the structural representation being in decomposing state of the backflow frock that one embodiment of the present of invention provides；
Fig. 2 is the structural representation of backflow another angle of frock shown in Fig. 2；
Fig. 3 is the structural representation being in confined state of backflow frock shown in Fig. 1；
Fig. 4 is structural representation when carrier bearing substrate shown in Fig. 1 and lead frame；
Fig. 5 is structural representation when the fixing substrate of backflow frock shown in Fig. 1 and lead frame；
Fig. 6 is the schematic flow sheet of the method for packaging semiconductor that one embodiment of the present of invention provides；
Fig. 7 is the schematic flow sheet of the method for packaging semiconductor that an alternative embodiment of the invention provides.
Wherein, the corresponding relation between the reference in Fig. 1 to Fig. 5 and component names is：
1 carrier, 11 first magnets, 12 holding tanks, 13 through holes, 14 convex pins, 15 spacing block sets, 2 press strips, 21 second magnetic
Body, 22 locating slots, 23 stopper slots, 3 substrates, 4 wafers, 5 lead frames.
Specific embodiment
In order to be more clearly understood that the above objects, features and advantages of the present invention, below in conjunction with the accompanying drawings and specifically real
Mode of applying is further described in detail to the present invention.It should be noted that in the case of not conflicting, the enforcement of the application
Feature in example and embodiment can be mutually combined.
Elaborate a lot of details in the following description in order to fully understand the present invention, but, the present invention also may be used
To be implemented different from mode described here using other, therefore, protection scope of the present invention is not subject to following public tool
The restriction of body embodiment.
As shown in Figures 1 to 5, the embodiment of first aspect present invention provides a kind of backflow work for semiconductor packages
Dress, frock includes：Carrier 1 and press strip 2.Wherein, carrier 1 is used for carrying substrate 3 and the lead frame 5 posting wafer 4, carrier 1
It is provided with first connecting portion.Press strip 2 is provided with second connecting portion, press strip 2 pass through first connecting portion and second connecting portion coordinate with
The connection that carrier 1 can be dismantled, press strip 2 is used for for lead frame 5 being pressed on carrier 1 and substrate 3 exists.
Present solution provides a kind of backflow frock, when carrying out semiconductor packages, first will brush tin cream, post the base of wafer 4
Plate 3 is placed on relevant position on carrier 1, then the lead frame 5 having plated stannum is placed on carrier 1 relevant position and by lead frame
The pin of frame 5 is pasted on the substrate 3, then press strip 2 is assembled on carrier 1, now lead frame 5 is pressed on load by press strip 2
On tool 1, and substrate 3 is pressed on carrier 1 pin of lead frame 5, thus will be fixing to substrate 3 and lead frame 5, then right
The substrate 3 being fixed in backflow frock and lead frame 5 are flowed back, and so that the stannum material on substrate 3 is melted again, solidify, thus
The pin of wafer 4 and lead frame 5 is fixed on the substrate 3, so just eliminates lead frame 5 and substrate 3 thermocompression bonding
Operation, simplifies the operation of semiconductor packages, thus the production efficiency of improving product.And, substrate 3 and lead frame when flowing back
The backflow frock that 5 are provided by this programme is fixed it is ensured that the accuracy of substrate 3 and lead frame 5 relative position, prevents lead frame
5 are misplaced with substrate 3, thus ensureing the quality of product.
Wherein, when substrate 3 and lead frame 5 are fixed in backflow frock, press strip 2 compresses lead frame 5 but does not cover and draw
Pin and substrate 3 that wire frame 5 is connected with substrate 3, it is to avoid press strip 2 affects reflowing result.Carrier 1 and press strip 2 by high temperature resistant,
Low Heat Conduction Material is made, for example compound stone, typically requires carrier 1 and press strip 2 can bear the temperature of 300 DEG C of even more highs.Logical
Its lead frame 5 tin coating of product crossing above-mentioned packaging technology production has the vestige melting again.
As depicted in figs. 1 and 2, it is preferable that the first fixed part includes being fixed on carrier 1 in technique scheme
First magnet 11, the second fixed part includes the second magnet 21 being fixed on press strip 2, and press strip 2 passes through the first magnet 11 and second
The connection that magnet 21 adhesive and carrier 1 can be dismantled.
In this programme, carrier 1 and press strip 2 are respectively provided with the first magnet 11 and the second magnet 21, carrier 1 and press strip 2 phase
Pair when, the first magnet 11 and the second magnet 21 opposite polarity, make press strip 2 and carry by the first magnet 11 and the second magnet 21 adhesive
Have 1 dismountable connection, so design press strip 2 and carrier 1 easy accessibility, substrate 3 and lead frame 5 are fixed on backflow frock
Upper or take off required time-consuming short from frock, thus can improving product production efficiency.
Specifically, the multiple magnets of setting can be respectively separated on carrier 1 and press strip 2, to lift the reliability of connection.
It should be noted that carrier 1 and press strip 2 realize dismountable connection also by other fit systems, for example, carrying
It is respectively provided with the jack being adapted and inserting column on tool 1 and press strip 2.
It is preferable that being provided with board positioning part on carrier 1 in any of the above-described technical scheme, board positioning part is used for limiting
Placement location on carrier 1 for the substrate 3.
The accuracy of substrate 3 and carrier 1 relative position can be ensured by the design of board positioning part, it is to avoid substrate 3 is put partially
Impact backflow frock is to the fixed effect of substrate 3 and follow-up reflowing result.
It is preferable that substrate 3 fixed part includes the holding tank 12 being adapted to substrate 3 in any of the above-described technical scheme.
In this programme, substrate 3 fixed part is the holding tank 12 being adapted to substrate 3, and substrate 3 is placed in holding tank 12, this
Sample good positioning effect, can be prevented effectively from substrate 3 and put inclined problem generation.
In any of the above-described technical scheme it is preferable that in the holding tank 12 and/or edge of holding tank 12 is provided with through hole.
The purpose arranging through hole in holding tank 12 position is so that substrate 3 is preferably heated it is ensured that flowing back during in reflow process
Effect, thus the pin of wafer 4 and lead frame 5 is fixed on the substrate 3.
It is preferable that lead frame location division, lead frame location division are provided with carrier 1 in any of the above-described technical scheme
For limiting placement location on carrier 1 for the lead frame 5.
The accuracy of lead frame 5 and carrier 1 relative position can be ensured by the design of board positioning part, thus ensureing to draw
Wire frame 5 and the accuracy of basic relative position, it is to avoid lead frame 5 is misplaced with basic, is that subsequent reflow is prepared.
Specifically, multiple board positioning part and multiple lead frame location division can be arranged on carrier 1, make work same
When fixing many group substrates 3 and lead frame 5, so just can many group substrates 3 and lead frame 5 be flowed back, thus carrying simultaneously
Rise the efficiency that semiconductor packages produces.
As shown in figure 4, it is preferable that location hole, lead frame are provided with lead frame 5 in any of the above-described technical scheme
Location division includes convex pin 14, and when substrate 3 and lead frame 5 are placed on carrier 1, convex pin 14 is coordinated with location hole.
This programme arranges the convex pin 14 with the location hole cooperation on lead frame 5 on carrier 1, to ensure lead frame
Frame 5 and the accuracy of carrier 1 relative position, so design the structure of lead frame location division simply, the difficult processing of backflow frock
Degree is low.
Preferably, lead frame location division includes multiple convex pins 14 of interval setting and word order, multiple positioning
Convex pin 14 inserts the location hole of lead frame 5 relevant position respectively, and such Design Orientation effect is good, can prevent lead frame 5 phase
Carrier 1 is rotated.
It is preferable that locating slot 22 is provided with press strip 2 in any of the above-described technical scheme, when press strip 2 is assembled on carrier 1,
Locating slot 22 is coordinated with convex pin 14, to limit the relative position of press strip 2 and carrier 1.
In this programme, press strip 2 relevant position is provided with locating slot 22, when press strip 2 is assembled on carrier 1, locating slot 22 with fixed
The convex pin 14 in position coordinates, to ensure the accuracy of press strip 2 and carrier 1 relative position, so that it is guaranteed that press strip 2 effectively compresses lead frame
5, and prevent press strip 2 from putting the inclined pin covering lead frame 5 and substrate 3.
It is preferable that locating slot 22 is groove in any of the above-described technical scheme, the groove opening position relative with its kerve wall
Edge in the first end of press strip 2.
Locating slot 22 is designed as groove, makes convex pin 14 be easier to enter locating slot 22, reduce press strip 2 and carrier
1 difficulty, thus can shorten for substrate 3 and lead frame 5 the time-consuming of backflow frock to be fixed on, lifts packaging efficiency.
As shown in Figures 1 to 5, in any of the above-described technical scheme it is preferable that in second end and carrier 1 of press strip 2
Individual be provided with spacing block set 15, another is provided with stopper slot 23, when press strip 2 is assembled on carrier 1, stopper slot 23 and limit convex
Block 15 coordinates.
In first end setting locating slot 22 and the convex pin 14 of press strip 2 and carrier 1 in this programme, in press strip 2 and carrier 1
The second end setting stopper slot 23 and spacing block set 15, press strip 2 is carried out spacing with carrier 1 it is ensured that press strip 2 is relative with carrier 1
The accuracy of position, it is to avoid after press strip 2 and carrier 1 adhesive, problem of misalignment occurs, thus preventing lead when carrying out reflow process
Framework 5 is misplaced with substrate 3, to ensure package quality.
As shown in fig. 6, the embodiment of second aspect present invention provides a kind of method for packaging semiconductor, including：Step 102
There is provided substrate, brush tin cream, stickup wafer on substrate；Step 104 provides lead frame, tin plating on the lead frames；Step 106
Place a substrate in as on the carrier of the backflow frock of first aspect present invention any embodiment；Lead frame is put by step 108
Put on carrier, and the pin of lead frame is pasted onto on substrate；The press strip of the frock that flows back is assembled to carrier by step 110
On, with anchor leg framework and substrate；Step 112 flows back to the substrate being fixed in backflow frock and lead frame, with
Substrate is made mutually to weld with lead frame.
It should be noted that in above-mentioned method for packaging semiconductor, in no particular order, the two position can for step 102 and step 104
To exchange.
When semiconductor packages is carried out by the method for packing that this programme provides, first brush tin cream, patch wafer on substrate, and
Tin plating on lead frame, then the substrate brushing tin cream, posting wafer is placed on relevant position on carrier, then will plate stannum
Lead frame place the relevant position pin of lead frame is pasted onto on substrate on carrier, then press strip is assembled to load
On tool, now lead frame is pressed on carrier press strip, and substrate is pressed on carrier the pin of lead frame, thus will
Substrate and lead frame are fixed, and then the substrate and lead frame being fixed in backflow frock are flowed back, make on substrate
Stannum material melts again, solidifies, thus the pin of wafer and lead frame is fixed on substrate, so just eliminates lead frame
Frame and the operation of substrate thermocompression bonding, simplify the operation of semiconductor packages, thus the production efficiency of improving product.And substrate and
During lead frame backflow, the backflow frock that provided by this programme is fixed it is ensured that the accuracy of substrate and lead frame relative position,
Prevent lead frame from misplacing with substrate, thus ensureing the quality of product.
Its lead frame tin coating of product that the method for packaging semiconductor being provided by this programme is produced has and melts again
Vestige.
As shown in fig. 7, in technique scheme, method for packaging semiconductor also includes：Step 114 is to the substrate after backflow
It is carried out with lead frame；Step 116 carries out wiring to wafer and substrate, so that wafer is electrically connected with substrate；Step 118 is to base
Plate and lead frame carry out plastic packaging；Step 120 carries out cutting to the device after plastic packaging, and carries out shaping to lead frame.
The embodiment of third aspect present invention provides a kind of semiconductor package part, arbitrary by such as second aspect present invention
The method for packaging semiconductor that embodiment provides is fabricated by.
The semiconductor package part that third aspect present invention embodiment provides, by such as second aspect present invention any embodiment
The method for packaging semiconductor providing is fabricated by, and therefore this semiconductor package part has the quasiconductor that any of the above-described embodiment provides
Whole beneficial effects of method for packing, will not be described here.
The embodiment of fourth aspect present invention provides a kind of air-conditioner, including such as third aspect present invention any embodiment
The semiconductor package part providing.
The air-conditioner that fourth aspect present invention embodiment provides, has the half of the offer of third aspect present invention any embodiment
Conductor packaging part, therefore this air-conditioner have whole beneficial effects of the semiconductor package part that any of the above-described embodiment provides,
This repeats no more.
In describing the invention, term " first ", " second " are only used for the purpose describing, and it is not intended that instruction or
Hint relative importance, unless otherwise clearly defined and limited.
In the description of this specification, the description of term " embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that the specific features with reference to this embodiment or example description, structure, material or feature are contained at least one reality of the present invention
Apply in example or example.In this manual, identical embodiment or reality are not necessarily referring to the schematic representation of above-mentioned term
Example.And, the specific features of description, structure, material or feature can in any one or more embodiments or example with
Suitable mode combines.Term " connection ", " installation ", " fixation " etc. all should be interpreted broadly, and for example, " connection " can be fixing
Connect or be detachably connected, or be integrally connected；Can be to be joined directly together it is also possible to pass through the indirect phase of intermediary
Even.For the ordinary skill in the art, above-mentioned term in the present invention concrete can be understood as the case may be
Implication.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (14)
1. a kind of backflow frock, for semiconductor packages it is characterised in that including：
Carrier, described carrier is used for carrying substrate and the lead frame posting wafer, and described carrier is provided with first connecting portion；
Press strip, described press strip is provided with second connecting portion, and described press strip is by described first connecting portion and described second connecting portion
The connection that cooperation and described carrier can be dismantled, described press strip is used for for described lead frame being pressed on described carrier and described base
Plate is upper.
2. according to claim 1 backflow frock it is characterised in that
Described first fixed part includes the first magnet being fixed on described carrier, and described second fixed part includes being fixed on described
The second magnet on press strip, described press strip can be dismantled with described carrier by described first magnet and described second magnet adhesive
Connection.
3. according to claim 1 backflow frock it is characterised in that
Described carrier is provided with board positioning part, and described board positioning part is used for limiting placement on described carrier for the described substrate
Position.
4. according to claim 3 backflow frock it is characterised in that
Described board positioning part includes the holding tank being adapted to described substrate.
5. according to claim 4 backflow frock it is characterised in that
In the described holding tank and/or edge of described holding tank is provided with through hole.
6. according to claim 1 backflow frock it is characterised in that
Described carrier is provided with lead frame location division, and described lead frame location division is used for limiting described lead frame described
Placement location on carrier.
7. according to claim 6 backflow frock it is characterised in that
Described lead frame is provided with location hole, and lead frame location division includes convex pin, described substrate and described lead frame
When frame is placed on described carrier, described convex pin is coordinated with described location hole.
8. according to claim 7 backflow frock it is characterised in that
Described press strip is provided with locating slot, when described press strip is assembled on described carrier, described locating slot and described convex pin
Cooperation, to limit the relative position of described press strip and described carrier.
9. according to claim 8 backflow frock it is characterised in that
Described locating slot is groove, and the described groove opening relative with its kerve wall is located at the edge of the first end of described press strip.
10. according to claim 9 backflow frock it is characterised in that
One of second end of described press strip and described carrier are provided with spacing block set, and another is provided with stopper slot, described
When press strip is assembled on described carrier, described stopper slot is coordinated with described spacing block set.
A kind of 11. method for packaging semiconductor are it is characterised in that include：
There is provided substrate, on the substrate brush tin cream, stickup wafer；
Lead frame is provided, tin plating on described lead frame；
Described substrate is placed on the carrier of the backflow frock as any one of claim 1 to 10；
Described lead frame is placed on described carrier, and the pin of described lead frame is pasted on the substrate；
The press strip of described backflow frock is assembled on described carrier, with fixing described lead frame and described substrate；
The described substrate and described lead frame being fixed in described backflow frock is flowed back, so that described substrate and described
Lead frame phase is welded.
12. want the method for packaging semiconductor described in 11 it is characterised in that also including according to right：
Described substrate after backflow and described lead frame are carried out；
Wiring is carried out to described wafer and described substrate, so that described wafer is electrically connected with described substrate；
Plastic packaging is carried out to described substrate and described lead frame；
Cutting is carried out to the device after plastic packaging, and shaping is carried out to described lead frame.
A kind of 13. semiconductor package parts are it is characterised in that described semiconductor package part passes through as described in claim 11 or 12
Method for packaging semiconductor is fabricated by.
A kind of 14. air-conditioners are it is characterised in that include semiconductor package part as claimed in claim 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917060.9A CN106449480B (en) | 2016-10-20 | 2016-10-20 | Reflow tool, semiconductor packaging method, semiconductor packaging piece and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917060.9A CN106449480B (en) | 2016-10-20 | 2016-10-20 | Reflow tool, semiconductor packaging method, semiconductor packaging piece and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449480A true CN106449480A (en) | 2017-02-22 |
| CN106449480B CN106449480B (en) | 2019-12-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610917060.9A Expired - Fee Related CN106449480B (en) | 2016-10-20 | 2016-10-20 | Reflow tool, semiconductor packaging method, semiconductor packaging piece and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449480B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979971A (en) * | 2017-11-22 | 2018-05-01 | 浙江东和电子科技有限公司 | The packaging technology of thin support plate integrated circuit |
| CN108161160A (en) * | 2018-03-07 | 2018-06-15 | 莆田市涵江永德兴电子石英有限公司 | A kind of resonant member automates tin assembly line |
| CN108480816A (en) * | 2018-05-31 | 2018-09-04 | 郑州云海信息技术有限公司 | A kind of movable internal memory connector pallet |
| CN111940863A (en) * | 2020-06-24 | 2020-11-17 | 华羿微电子股份有限公司 | Backflow carrier |
| CN112289754A (en) * | 2019-07-23 | 2021-01-29 | 珠海格力电器股份有限公司 | Power module and packaging method |
| CN114068431A (en) * | 2021-11-16 | 2022-02-18 | 芜湖启迪半导体有限公司 | A silicon carbide module structure and its manufacturing method |
| CN114644203A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Reflow method of processing tool, reflow device and processing system |
| CN115319227A (en) * | 2022-08-18 | 2022-11-11 | 瑞能半导体科技股份有限公司 | Carrier and method for realizing internal insulation power devices with different frame materials |
| CN116072646A (en) * | 2023-02-24 | 2023-05-05 | 海信家电集团股份有限公司 | Manufacturing method of vehicle and power module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241141B1 (en) * | 1995-09-20 | 2001-06-05 | Unitek | Reflow soldering self-aligning fixture |
| CN103887188A (en) * | 2014-03-28 | 2014-06-25 | 福建福顺半导体制造有限公司 | Packaging technology for large-current semiconductor device |
| CN203912363U (en) * | 2014-05-26 | 2014-10-29 | 美的集团股份有限公司 | Reflow soldering fixing device |
-
2016
- 2016-10-20 CN CN201610917060.9A patent/CN106449480B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241141B1 (en) * | 1995-09-20 | 2001-06-05 | Unitek | Reflow soldering self-aligning fixture |
| CN103887188A (en) * | 2014-03-28 | 2014-06-25 | 福建福顺半导体制造有限公司 | Packaging technology for large-current semiconductor device |
| CN203912363U (en) * | 2014-05-26 | 2014-10-29 | 美的集团股份有限公司 | Reflow soldering fixing device |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979971A (en) * | 2017-11-22 | 2018-05-01 | 浙江东和电子科技有限公司 | The packaging technology of thin support plate integrated circuit |
| CN108161160A (en) * | 2018-03-07 | 2018-06-15 | 莆田市涵江永德兴电子石英有限公司 | A kind of resonant member automates tin assembly line |
| CN108480816A (en) * | 2018-05-31 | 2018-09-04 | 郑州云海信息技术有限公司 | A kind of movable internal memory connector pallet |
| CN112289754B (en) * | 2019-07-23 | 2023-09-12 | 珠海格力电器股份有限公司 | Power module and packaging method |
| CN112289754A (en) * | 2019-07-23 | 2021-01-29 | 珠海格力电器股份有限公司 | Power module and packaging method |
| CN111940863B (en) * | 2020-06-24 | 2022-02-25 | 华羿微电子股份有限公司 | Backflow carrier |
| CN111940863A (en) * | 2020-06-24 | 2020-11-17 | 华羿微电子股份有限公司 | Backflow carrier |
| CN114644203A (en) * | 2020-12-18 | 2022-06-21 | 北京小米移动软件有限公司 | Reflow method of processing tool, reflow device and processing system |
| CN114644203B (en) * | 2020-12-18 | 2023-08-04 | 北京小米移动软件有限公司 | Reflow method, reflow apparatus and processing system for processing tool |
| CN114068431A (en) * | 2021-11-16 | 2022-02-18 | 芜湖启迪半导体有限公司 | A silicon carbide module structure and its manufacturing method |
| CN115319227A (en) * | 2022-08-18 | 2022-11-11 | 瑞能半导体科技股份有限公司 | Carrier and method for realizing internal insulation power devices with different frame materials |
| CN116072646A (en) * | 2023-02-24 | 2023-05-05 | 海信家电集团股份有限公司 | Manufacturing method of vehicle and power module |
| CN116072646B (en) * | 2023-02-24 | 2024-02-13 | 海信家电集团股份有限公司 | Carrier and manufacturing method of power module |
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