CN102299079B - Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip - Google Patents
Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip Download PDFInfo
- Publication number
- CN102299079B CN102299079B CN201110173760.9A CN201110173760A CN102299079B CN 102299079 B CN102299079 B CN 102299079B CN 201110173760 A CN201110173760 A CN 201110173760A CN 102299079 B CN102299079 B CN 102299079B
- Authority
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- China
- Prior art keywords
- resin
- module
- packaging body
- resin molded
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 150
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 229920005989 resin Polymers 0.000 claims abstract description 264
- 239000011347 resin Substances 0.000 claims abstract description 264
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 97
- 239000002826 coolant Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims description 149
- 229920005992 thermoplastic resin Polymers 0.000 claims description 91
- 230000009477 glass transition Effects 0.000 claims description 15
- -1 polybutylene terephthalate Polymers 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 8
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 239000004677 Nylon Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 229920005749 polyurethane resin Polymers 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 abstract description 7
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 7
- 230000005611 electricity Effects 0.000 description 32
- 239000002184 metal Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 230000001771 impaired effect Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
Classifications
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- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A method of producing a semiconductor module which includes a resin molded package and a coolant passage is provided. The resin molded package is made up of a thermosetting resin-made mold and a thermoplastic resin-made mold. The resin molded package is formed by making the thermoplastic resin-made mold, placing the thermoplastic resin-made mold and a semiconductor sub-assembly made up of a power semiconductor chip, heat spreaders, terminals, etc., and then forming the thermosetting resin-made mold. Specifically, the thermosetting resin-made mold is made after the thermoplastic resin-made mold, thereby creating a high degree of adhesion of the thermosetting resin-made mold to the thermoplastic resin-made mold before the thermosetting resin-made mold is hardened completely, thereby forming firmly an adhered interface between the thermosetting resin-made mold and the thermoplastic resin-made mold. This minimizes the risk of occurrence of air gaps at the adhered interface and avoids the leakage of the coolant outside the resin molded package.
Description
Technical field
Generality of the present invention relates to the method for manufacturing semiconductor module, described semiconductor module is equipped with the resin molded packaging body of power semiconductor chip and radiator, described radiator is in order to dispel the heat from power semiconductor chip, it can have a combined structure of being made by resin mold as for example IGBT of single power semiconductor chip of one of inverter upper arm (being high side device) or underarm (being downside device) or power MOSFET, or has two two-in-one structures that power semiconductor chip is made by resin mold that are used separately as upper arm and underarm.
Background technology
A kind of common semiconductor module is equipped with resin molded packaging body, the radiator that is wherein provided with semiconductor chip and distributes for the heat that semiconductor chip is produced.As the resin material for this moulded parts, conventionally use thermosetting resin if epoxy resin is to improve the thermal endurance of packaging body.
But thermosetting resin is difficult to break after sclerosis.Therefore,, in the time that any part of thermosetting resin is damaged, expensive semiconductor chip also must be discarded.
In recent years, along with the growing interest to environmental problem, reuse need to day by day increasing of semiconductor chip.
Japan Patent discloses first 2006-165534 and has instructed a kind of semiconductor module, and it is made up of stacking resin molded packaging body and coolant channel.In each resin molded packaging body, imbed power semiconductor chip and radiator.In the time that a resin molded packaging body becomes defectiveness, semiconductor module is detachable only defective packaging body is removed and by being replaced to new reusing.
But when remove resin molded packaging body from semiconductor module time, the surface of packaging body is easy to impaired.Do not wish to replace this resin molded packaging body itself.This impaired moulded parts quality badness that makes, even and if cause imbedding the operation of power semiconductor chip in packaging body and normally also need packaging body to abandon.
As above-mentioned open in the semiconductor module of instruction can be by replacing damage with a new resin molded packaging body resin molded packaging body to reuse.But working properly when the power semiconductor chip of a resin molded packaging body, and its resin module is scratched in the time splitting resin molded packaging body stacking, conventionally need to change resin molded packaging body.But even if its power semiconductor chip is working properly, this resin molded packaging body also will remove.This is disadvantageous for the utilization ratio of limited resources.
In order to address the above problem, present inventor is devoted to study the semiconductor module block structure that can also reuse power semiconductor chip in the time that any one resin molded packaging body is scratched.Particularly, resin molded packaging body is made up of thermosetting resin main body processed and thermoplastic resin shell processed.Thermosetting resin main body processed has the assembly parts of imbedding wherein as power semiconductor chip etc.Thermoplastic resin shell processed is enclosed in the periphery of thermosetting resin main body processed and has the coolant channel being formed at wherein.If this structure is scratched a resin molded packaging body, it can be separated from semiconductor module so and thermoplastic to remove thermoplastic resin shell processed, only the main body processed thermosetting resin that is wherein provided with power semiconductor chip is taken out from resin molded packaging body thus.By main body processed thermosetting resin being placed in to mould and thermoplastic resin being injected to mould again to form thermoplastic resin shell processed around thermosetting resin main body processed, can rebuild resin molded packaging body.This makes can also reuse power semiconductor chip while being scratched on the surface of resin molded packaging body.This is for to decompose the situation that semiconductor module is scratched with resin molded packaging body in taking out the process of another defective resin molded packaging body very useful.
But we find the said structure of the resin molded packaging body of being made up of two kinds of resin molds: thermosetting resin main body processed and thermoplastic resin shell processed exist problem below.
After making thermosetting resin main body processed, form thermoplastic resin shell processed and make to lack between the two adhesiveness, may cause the interface between thermoplastic resin shell processed and thermosetting resin main body processed to occur air gap, thereby cause refrigerant leaks to the power semiconductor chip in thermosetting resin main body processed.
Figure 10 (a) and 10 (b) have illustrated the example by this refrigerant leaks in the stacking semiconductor module of making of resin molded packaging body 10.
Each resin molded packaging body 10 is equipped with the positive electricity terminal 15 being connected with the collector electrode of IGBT, the negative electricity terminal 16 being connected with the emitter of IGBT and the signal terminal 17 for sensing given parameters.Positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17 are partly exposed to resin molded packaging body 10 outsides.In the time there is air gap between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed, as shown in solid line in Figure 10 (b), can cause cooling agent leak into air gap and flow out resin molded packaging body and arrive the expose portion of lead-in wire 15 and 16 and signal terminal 17 from coolant channel.As shown in solid line in Figure 10 (a), this can cause the electric leakage between positive electricity terminal 15 and negative electricity terminal 16 or in signal terminal 17.
Summary of the invention
Therefore, an object is to provide the semiconductor module that improves structure, it is equipped with resin molded packaging body, and be designed to make the power semiconductor chip of imbedding resin molded packaging body to reuse, and the minimizing possibility that also makes the air gap that causes mobile refrigerant leaks in semiconductor module produce.
According to embodiment aspect, a kind of method of manufacturing semiconductor module is provided, described semiconductor module can with together with inverter for motor, apply and comprise resin molded packaging body and coolant channel.Described manufacture method comprises: (a) first step, prepare the semiconductor sublayer assembly parts of power semiconductor chip, the first radiator, the second radiator and electric terminal, described power semiconductor chip has reciprocal the first and second surfaces and is equipped with the semiconductor power device being connected with electric terminal, (b) second step, the module that the thermoplastic resin of the resin molded packaging body shell of formation restriction is made, (c) third step, the module that described thermoplastic resin is made and described semiconductor sublayer assembly parts are placed in to fixed mold, then in the module of making at thermoplastic resin, form the module that thermosetting resin is made, to manufacture the resin molded assembly parts as resin molded packaging body, in described assembly parts, form the coolant channel of the path that limits cooling agent, described the first radiator is set to be connected with the described first surface of described power semiconductor chip, described the second radiator is set to be connected with the described second surface of described power semiconductor chip, each described electric terminal has the part exposing from described resin molded assembly parts, the glass transition temperature of the material of the module that the glass transition temperature of the material of the module of making for described thermosetting resin is made higher than described thermoplastic resin, (e) the 4th step, keeps described resin molded packaging body to complete described semiconductor module by lid.
Particularly, after the module of making at thermoplastic resin, manufacture the module that thermosetting resin is made.This height that produces the module that module that thermosetting resin makes makes thermoplastic resin before module that causes making at thermosetting resin is hardened is completely bonding, thereby between the module that the module of making at thermosetting resin and thermoplastic resin are made, firmly forms adhesive interface.This makes produce the risk minimization of air gap and avoided refrigerant leaks to arrive outside resin molded packaging body at adhesive interface.
In the optimal way of embodiment, third step is injected into thermosetting resin the module of making to form described thermosetting resin in the described mould that has wherein been provided with module that described thermoplastic resin makes and described semiconductor sublayer assembly parts.
The module that third step is made thermoplastic resin is placed in the electric terminal away from the semiconductor sublayer assembly parts in mould, and thermosetting resin is also injected to the air gap between module and the electric terminal that thermoplastic resin makes.This also causes the height adhesiveness between terminal and resin molded assembly parts.
Thermosetting resin can be the one in epoxy resin, phenolic resins, silicones and polyurethane resin.
Thermoplastic resin can be the one in polyphenylene sulfide, polybutylene terephthalate (PBT), nylon, polyethylene and polypropylene.
According to a further aspect in the invention, provide a kind of method of manufacturing semiconductor module, described semiconductor module comprises resin molded packaging body and coolant channel.Described manufacture method comprises: (a) first step, prepare the semiconductor sublayer assembly parts of power semiconductor chip, the first radiator, the second radiator and electric terminal, described power semiconductor chip has reciprocal the first and second surfaces and is equipped with the semiconductor power device being connected with electric terminal, (b) second step, the module that the thermoplastic resin of the shell of the resin molded packaging body of formation restriction is made, (c) third step, the module that described thermoplastic resin is made and described semiconductor sublayer assembly parts are placed in to fixed mold, then in the module of making at thermoplastic resin, form the module that thermosetting resin is made, to manufacture the resin molded assembly parts as a resin molded packaging body, in described assembly parts, form the coolant channel of the path that limits cooling agent, described the first radiator is set to be connected with the described first surface of described power semiconductor chip, described the second radiator is set to be connected with the described second surface of described power semiconductor chip, each described electric terminal has the part being exposed to outside described resin molded assembly parts, the glass transition temperature of the material of the module that the glass transition temperature of the material of the module of making for described thermosetting resin is made higher than described thermoplastic resin, (d) the 4th step, carries out first, second, and third step to manufacture another resin molded packaging body, (e) the 5th step, manufacture resin molded packaging body stacking as packaging body heap, superimposition keeps described packaging body stacking to complete described semiconductor module by lid.
Particularly, after the module of making at thermoplastic resin, manufacture the module that thermosetting resin is made in each resin molded packaging body.This height that produces the module that module that thermosetting resin makes makes thermoplastic resin before module that causes making at thermosetting resin is hardened is completely bonding, thereby between the module that the module of making at thermosetting resin and thermoplastic resin are made, firmly forms adhesive interface.This makes produce the risk minimization of air gap and avoided refrigerant leaks to arrive outside resin molded packaging body at adhesive interface.
In the optimal way of embodiment, third step is injected into thermosetting resin the module of making to form thermosetting resin in the mould that has wherein been provided with module that described thermoplastic resin makes and semiconductor sublayer assembly parts.
The module that third step is made thermoplastic resin is placed in the electric terminal away from the semiconductor sublayer assembly parts in mould, and thermosetting resin is also injected in the air gap between module and the electric terminal that thermoplastic resin makes.
Thermosetting resin can be the one in epoxy resin, phenolic resins, silicones and polyurethane resin.
Thermoplastic resin can be the one in polyphenylene sulfide, polybutylene terephthalate (PBT), nylon, polyethylene and polypropylene.
Brief description of the drawings
By following detailed description and the accompanying drawing by the preferred embodiment of the invention by complete understanding the present invention more, but, can not think that the present invention is limited to specific embodiment, the embodiment object that just use lays down a definition and understands.
In the accompanying drawings:
Fig. 1 (a) is the vertical cross-section diagram of getting along Fig. 1 (b) center line B-B ', and it illustrates according to the semiconductor module of the first embodiment;
Fig. 1 (b) is the vertical cross-section diagram of getting along Fig. 1 (a) center line A-A ';
Fig. 2 (a) is the plane graph that a resin molded packaging body in the semiconductor module that is built in Fig. 1 is shown;
Fig. 2 (b) is the sectional view of getting along Fig. 2 (a) center line C-C ';
Fig. 2 (c) is the sectional view of getting along Fig. 2 (a) center line D-D ';
Fig. 3 (a), 3 (b), 3 (c) and 3 (d) are the sectional view of explanation shop drawings 2 (a) to the series of steps of the resin molded packaging body shown in 2 (c);
Fig. 4 (a), 4 (b) and 4 (c) are the sectional views of the series of steps of the module made to the thermosetting resin of the resin molded packaging body shown in 2 (c) of explanation shop drawings 2 (a);
Fig. 5 (a), 5 (b) and 5 (c) are that the sectional view of the series of steps of semiconductor module is as shown in Figure 1 assembled in explanation;
Fig. 6 is the sectional view that adhesive interface between the module that module that Fig. 2 (a) makes to the thermosetting resin of the resin molded packaging body of 2 (c) and thermoplastic resin make is shown;
Fig. 7 illustrates the cross-sectional view of Fig. 2 (a) to the change programme of the resin molded packaging body of 2 (c)
Fig. 8 is the sectional view illustrating according to the resin molded packaging body of the second embodiment;
Fig. 9 is the sectional view illustrating according to the resin molded packaging body of the 3rd embodiment;
Figure 10 (a) is the plane graph that conventional resin molded packaging body is shown; With
Figure 10 (b) is the vertical cross-section diagram that the conventional semiconductor module of the resin molded packaging body that is equipped with Figure 10 (a) is shown.
Embodiment
With reference to accompanying drawing, the wherein identical parts of the identical reference numbers designate in several views, illustrate by according to the semiconductor module with cooling body 1 of the manufacture method manufacture of the first embodiment.
Fig. 1 (a) and 1 (b) illustrate vertical cross-section front view and the end view of semiconductor module 1.Fig. 1 (a) is along Fig. 1 (b) center line B-B ' intercepting.Fig. 1 (b) is along the line A-A ' intercepting of Fig. 1 (a).
Semiconductor module 1 comprises the stacking of resin molded packaging body 10.Each resin molded packaging body 10 is equipped with power semiconductor chip 11.Structure is identical substantially each other for resin molded packaging body 10, and for disclosed simple and clear, discussion below will only relate to a resin molded packaging body 10.
Fig. 2 (a) illustrates the structure of resin molded package body 10 to 2 (c).Fig. 2 (a) is the front view of resin molded packaging body 10.Fig. 2 (b) is the sectional view of getting along Fig. 2 (a) center line C-C '.Fig. 2 (c) is the sectional view of getting along Fig. 2 (a) center line D-D '.
Resin molded packaging body 10 also comprises metal derby 12, radiator 13 and 14, positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17.It is that single resin molded assembly parts 20 are as resin molded packaging body 10 that power semiconductor chip 11, metal derby 12, radiator 13 and 14, positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17 pass through resin molded.Resin molded packaging body 10 is to be equipped with 1 of single power semiconductor chip 11 to close 1 structure, but as selection scheme, also can be designed to have two or more power semiconductor chips 11.
In this embodiment, power semiconductor chip 11 is equipped with such as IGBT of semiconductor power device, and it is vertical-type, and wherein electric current flows at its thickness direction.Power semiconductor chip 11 has the pad of some types that are positioned at its first surface and second surface.Particularly, pad is formed on the first surface of the power semiconductor chip 11 being electrically connected with grid and the emitter of IGBT, and pad is formed on the whole region of second surface of the power semiconductor chip 11 being electrically connected with the collector electrode of IGBT simultaneously.
Power semiconductor chip 11 be wherein electric current in the mobile horizontal type of the horizontal direction of its substrate.
Metal derby 12 is made up as copper or aluminium of the high metal material of thermal conductivity.Metal derby 12 glueds joint or machinery welding and electric welding are received on the pad of the first surface that is formed at power semiconductor chip 11 and be connected with the emitter of IGBT.Metal derby 12 is placed on the first surface of power semiconductor chip 11 gap between first surface and the radiator 14 to guarantee power semiconductor chip 11.
The heat that each radiator 13 and 14 produces power semiconductor chip 11 is distributed.Radiator 13 also machinery joins the pad on power semiconductor chip 11 second surfaces to electricity, and in addition as the electrical lead engaging with the collector electrode of IGBT.Radiator 14 machineries and electricity are fixed on metal derby 12, and in addition as the electrical lead engaging with the emitter of IGBT.Each radiator 13 and 14 is to be made of such as copper and to be formed by the square metal plate of appointed thickness by the metal material of high heat conductance.Surface away from each radiator 13 and 14 of power semiconductor chip 11 is exposed to cooling agent from resin molded assembly parts 20, below will describe in detail.On the surface of this each radiator 13 and 14, be provided with insulating component (not shown), for make radiator 13 and 14 and cooling water isolate to avoid electric current to leak into cooling agent from radiator 13 and 14.
Positive electricity terminal 15 and the integrated formation of radiator 13 as its part or welding or seam on it, thereby it is electrically connected and the collector electrode of the IGBT that leads with the pad that is fixed to power semiconductor chip 11 second surfaces.The end of positive electricity terminal 15 exposes for being electrically connected with external device (ED) from resin molded assembly parts 20.
Negative electricity terminal 16 and the integrated formation of radiator 14 as its part or welding or seam on it, thereby it is electrically connected and the emitter of the IGBT that leads with the pad that is fixed to power semiconductor chip 11 first surfaces.Negative electricity terminal 16 exposes for being electrically connected with external device (ED) from resin molded assembly parts 20 away from an end of radiator 14.
Signal terminal 17 is crossed the lead-in wire that is connected with the grid of IGBT and the electric current of IGBT itself for monitoring stream, and the temperature of monitoring power semiconductor chip 11.Signal terminal 17 is electrically connected with the pad that is formed at power semiconductor chip 11 first surfaces by connecting wire 18 at its end, and its other end is also exposed to outside resin molded assembly parts 20 for being electrically connected with external device (ED).As mentioned above, space between the first surface of power semiconductor chip 11 and radiator 18 is produced by metal derby 12, therefore can guarantee that power semiconductor chip 11 can not make to be connected wire 18 and have physics and electrical interference with radiator 14 with the electrical connection of signal terminal 17.
Form resin molded assembly parts 20 according to following steps.Be that power semiconductor chip 11 and metal terminal are assembled into (Fig. 3 (a)) on the radiator 13 with negative electricity terminal 16 by scolder by parts.Then, by wire 18, the signal pad on the first surface of power semiconductor chip 11 is connected with signal terminal.Then the radiator 14 that, has a positive electricity terminal 15 connects (Fig. 3 (b)) by scolder.Then form the first module by transfer moIding machine.Resin molded assembly parts 20 are made up of two kinds of modules: thermosetting resin main body 21 processed (i.e. the first module) and thermoplastic resin shell 22 processed (i.e. the second module).Thermosetting resin main body 21 processed has the above-mentioned parts of imbedding wherein.Thermoplastic resin shell 22 processed as frame around the periphery of thermosetting resin main body 21 processed or as the wall of the periphery of thermosetting resin main body 21 processed.
Thermosetting resin main body 21 processed is the parts of being made and surrounding or being isolated resin molded packaging body 10 by for example epoxy resin, phenolic resins, silicones or polyurethane resin.Thermosetting resin main body 21 processed is also shaped so that the end of positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17 extends to outside outside and the main surface of radiator 13 and 14 be also exposed to.In the parts of resin molded assembly parts 20, only thermosetting resin main body 21 processed is with the parts isolation of waterproof form and resin molded packaging body 10.Thermosetting resin main body 21 processed is for rectangle and have two long side surfaces, and positive electricity terminal 15 and negative electricity terminal 16 extend from one of them, and signal terminal 16 is from another extension.The thermosetting resin main body 21 processed that the parts of resin molded packaging body 10 are wherein set is commonly referred to reusable power card (power card).
Thermoplastic resin shell 22 processed is by for example polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), nylon, polyethylene or polypropylene is made and the periphery of cover heating thermosetting resin main body 21 processed, so that the end of positive terminal 15, negative electricity terminal 16 and signal terminal 17 and the surface of radiator 13 and 14 are exposed to outside it.As shown in Fig. 2 (b) and 2 (c), thermoplastic resin shell processed 22 forms by the two parts that separate: upper slice 221 and lower 222.Upper slice 221 and lower 222 periphery wall that surrounds thermosetting resin main body 22 processed around.In thermoplastic resin shell 22 processed, form rectangular window 22a and 22b, by described window, the surface of radiator 13 and 14 is exposed to outside resin molded packaging body 10.
As shown in Figure 1, the part that thermoplastic resin shell processed 22 limits as the coolant channel 30 of cooling body work, by described cooling body coolant or flow of refrigerant with cooling semiconductor module 1.Particularly, thermoplastic resin shell 22 processed is made up of occluded ellipse shape plate, and the long side surface of its long side surface and thermosetting resin main body 21 processed extends in parallel.Thermoplastic resin shell 22 processed has the elliptical aperture 22c and the depression 22d that are formed at wherein.Hole 22c is arranged in the part of thermoplastic resin shell 22 processed, and as shown in Fig. 2 (a) is clear, it is positioned at the outside of the end opposite of thermosetting resin main body 21 processed, and limits the part of coolant channel 30.Depression 22d is formed in the first type surface of contrary thermoplastic resin shell 22 processed.As seen from Figure 1, depression 22d also can qualifying part coolant channel 30.Particularly, when resin molded packaging body 10 is stacked as while overlapping each other as shown in Figure 1, the hole 22c of thermoplastic resin clamp dog 22 and depression 22d complete coolant channel 30.
Thermoplastic resin shell 22 processed forms sealing mounting groove 22e in its neighboring, it extends around depression 22d, as Fig. 1, shown in 2 (b) and 2 (c), is wherein provided with O type ring 42.When resin molded packaging body 10 is stacked as while overlapping each other as shown in Figure 1, the O type ring 42 of each resin molded packaging body 10 will be placed in the direct adjacency of adjacent resin molded packaging body to produce betwixt airtight sealing, to prevent that cooling water flow from leaking into outside resin module 20 through coolant channel 30.
As shown in Figure 1, semiconductor module 1 also comprises upper cover 40, lower cover 41 and clip 43.
As shown in Figure 1, upper cover 40 and lower cover 41 are placed in the stacking end opposite of resin molded packaging body 10.Lid 40 is made up of the consistent plate of resin molded assembly parts 20 profiles of the resin molded packaging body 10 of profile and each.In the time that lid 40 is placed on stacking one end of resin molded packaging body 10, between the depression 22d of the resin molded packaging body 10 of second surface and the top of lid 40, produce air gap.Two pipe 41a and 41b are made and be equipped with to lower cover 41 by the consistent plate of profile of the resin molded assembly parts 20 of the resin molded packaging body 10 of profile and each.Pipe 41a and 41b are substantially perpendicular to lower cover 41 and extend, and are communicated with the hole 22c that aligns the resin molded packaging body 10 that limits coolant channel 30.Pipe 41a is as coolant inlet, and pipe 41b is as coolant outlet.In lower cover 41, be also formed with the sealing mounting groove 41c that is wherein provided with O type ring 42.
O type ring 42 is arranged in the sealing installing hole 22e of resin molded packaging body 10 and the sealing installing hole 41c of lower cover 41, with between every adjacent two resin molded packaging bodies 10 and produce airtight sealing between resin molded packaging body 10 and upper cover 40 and lower cover 41.
Clip 43 as securing member with by upper cover 40 and lower cover 41 and stacking tight connection that is wherein provided with the resin molded packaging body 10 of O type ring 42 in groove 22e and 41c, to complete semiconductor module 1.Particularly, as shown in Figure 1, each clip 43 is clamped upper cover 40 and lower cover 41, so that upper cover 40 and lower cover 41 are tightly kept with the stacking assembly parts of resin molded packaging body 10, thereby completes coolant channel 30 in semiconductor module 1.This assembly parts are below also referred to as module assembly part.Clip 43 is dismountable for splitting upper cover 40 and lower cover 41 and resin molded packaging body 10.Each clip 43 has hook at its end.Gap between hook is less than the thickness of the stacking module assembly part of upper cover 40 and lower cover 41 and resin molded packaging body 10, and therefore the hook of each clip 43 can flexibly be clamped upper cover 40 and lower cover 41.Each clip 43 can optional design keep module assembly part for substituting hook with screw.
As mentioned above, in the semiconductor module 1 building, use O type ring 42 to produce airtight sealing between resin molded packaging body 10, upper cover 40 and lower cover 41, thereby avoid cooling agent leak and guarantee that the power semiconductor chip 11 of resin molded packaging body 10 is cooled to required degree from coolant channel 30.Particularly, as shown in Figure 1, one of the pipe 41a of each resin molded packaging body 10 and two hole 22c limit import circulation flow path 31, and the pipe 41b of each resin molded packaging body 10 and another hole 22c limit outlet circulation flow path 32.The depression 22c forming in the surface of each resin molded packaging body 10 limits tributary circuit 33.Cooling water enters pipe 41a, and the import circulation flow path 31 of flowing through, is branched to tributary circuit 33, then discharges from outlet circulation flow path 32 by pipe 41b.Cooling water in tributary circuit 33 with radiator 13 and 14 direct contact flow and cooling they, the heat that therefore power semiconductor chip 11 produces will be absorbed by cooling water.
The manufacture method of semiconductor module 1 is described to 6 (c) below with reference to Fig. 3 (a).
Step in Fig. 3 (a)
Preparation has the radiator 13 of lead frame, and in lead frame, positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17 are placed into position.On it, manufacture is soldered on the surface of radiator 13 just like the power semiconductor chip 11 of the semiconductor power device of IGBT and/or FWD.Signal terminal 17 is connected to and is formed on the lip-deep pad of power semiconductor chip 11, for example, by connecting the lead grid of semiconductor device of wire 18.Metal derby 12 is welded to the surface of power semiconductor chip 11.
Step in Fig. 3 (b)
Scolder is placed in to the surface of metal derby 12 and negative electricity terminal 16.The radiator 14 with lead frame is placed on scolder and is then connected with metal derby 12.The step of Fig. 3 (a) and 3 (b) forms by power semiconductor chip 11, radiator 13 and 14, metal derby 12,, the semiconductor sublayer assembly parts that form of positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17.
Step in Fig. 3 (c)
Prepare thermoplastic resin shell 22 processed upper slice 221 and lower 222.Upper slice 221 and lower 222 manufacture with mould respectively.
Step in Fig. 3 (d)
Preparation example is as the bottom template 50 of the mould of transfer moIding machine.In lower bolster 51, form the profile cavity 51a consistent with the profile of lower 222.Be placed in cavity 51a for lower 222.As manufactured in Fig. 3 (a) and 3 (b) step, as the subassembly of the semiconductor device of preparing in above-mentioned steps (be power semiconductor chip 11, metal derby 12, have radiator 13 and 14, the signal terminal 17 etc. of lead frame) is placed in lower 222.
Step in Fig. 4 (a)
Upper slice 221 be placed on lower 222 and there is to each other given interval.Upper slice 221 and lower 222 nail and the hole (not shown) having respectively in formed thereon or its part, it does not disturb lead frame and signal terminal 17.Nail insert in the hole by upper slice 221 and lower 222 mutually location.
Step in Fig. 4 (b)
Prepare the cope match-plate pattern 52 of mould.Cope match-plate pattern 52 is placed on lower bolster 51, on lower bolster 51 or among be provided with lower 222 and other parts.On cope match-plate pattern 52 is placed in lower bolster 51 time, as visible in Fig. 4 (b), form the profile cavity consistent with the profile of thermosetting resin main body 21 processed.
Step in Fig. 4 (c)
By the resin inlet (not shown) forming, thermosetting resin is injected to cavity as epoxy resin in mould 50, thus molded thermoset resin main body 21.Then, split cope match-plate pattern 52 and lower bolster 51 to complete resin molded packaging body 10.The lead frame of removable radiator 13 and 14 in this step.
Obvious from above-mentioned discussion, thermosetting resin main body 21 processed forms after manufacturing thermoplastic resin shell 22 processed.This produced the height adhesiveness of thermosetting resin main body 21 processed to thermoplastic resin shell 22 processed by causing before thermosetting resin main body 21 processed is hardened, thereby formed close adhesion interface between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed.Fig. 6 illustrates the adhesive interface 23 between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed.Adhesive interface 23 as shown in solid line in Fig. 6 entirety on the contrary outer surface of thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed is extended, thereby guarantees close physical therebetween to link and without any gap.
By thermosetting resin main body 21 processed, thermoplastic resin shell 22 processed is away from positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17, in other words, positive electricity terminal 15, negative electricity terminal 16 and signal terminal 17 do not occupy the interface between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed, thereby guarantee between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed highly bonding.
Step in Fig. 5 (a)
Prepare multiple resin molded packaging bodies 10 of all preparing to the step of 4 (c) according to Fig. 3 (a).For example, three resin molded packaging bodies 10 of preparation.O type ring 42 is arranged in the groove 22e of thermoplastic resin shell 22 processed of each resin molded packaging body 10.
Step in Fig. 5 (b)
Prepare upper cover 40 and lower cover 41.O type ring 42 is arranged in the sealing mounting groove 41c of lower cover 41.It is upper that upper cover 40 is placed in one of stacking end opposite of packaging body, and lower cover 41 is placed on the stacking other end of packaging body.Such assembly parts are hereinafter also referred to as module assembly part.
Step in Fig. 5 (c)
Make by clip 43 that the packaging body assembled in above-mentioned steps is stacking has closely kept semiconductor module 1 with upper cover 40 and lower cover 41, as shown in Figure 1.
If a resin molded packaging body 10 of semiconductor module 1 damages or destroys in its manufacture and use procedure, it can be replaced in the following way.
The module assembly part stacking from upper cover 40 and lower cover 41 and packaging body removes clip 43.For example, remove by making its hook generation strain realize clip 43.Be the in the situation that of being fixed on module assembly part by screw at clip 43, realize clip 43 and remove by unclamping screw.
If the resin molded assembly parts 20 of a resin molded packaging body 10 damage or scratch, operator identifies it, splits upper cover 40, resin molded packaging body 10 and lower cover 41 and removes the resin molded packaging body 10 of scuffing.
Impaired resin molded packaging body 10 is put into heat-treating machine as heating furnace, then select based on glass transition temperature, heat for example, greater than or equal to the glass transition temperature (being softening temperature) of thermoplastic resin shell 22 processed the temperature lower than the glass transition temperature of thermosetting resin main body 21 processed (at this temperature, resin is heated and causes its hardness and the unexpected decline of viscosity and make it have flowable) at.Be made up be made up of epoxy resin with thermosetting resin main body 21 processed in the situation that of polyphenylene sulfide at thermoplastic resin shell 22 processed, impaired resin molded packaging body 10 is at the glass transition temperature greater than or equal to polyphenylene sulfide with lower than 120 DEG C of heating of temperature of the glass transition temperature of epoxy resin.Glass transition temperature depends on the amount of resin and filler conventionally.Therefore expect the amount by selecting its resin and filler, determine the value of the glass transition temperature of thermoplastic resin shell 22 processed or thermosetting resin main body 21 processed.
Impaired resin molded packaging body 10 continues to heat in heat-treating machine, makes only thermoplastic resin main body 22 processed soften and remove from resin molded packaging body 10, and only leaves power card (being thermosetting resin main body 21 processed).Note thermoplastic resin intermediateness between solid and liquid under said temperature, therefore can Lock-out, but can main body 22 processed thermoplastic resin easily be removed from resin molded packaging body 10 by pushing away or drawing.
The power card of being made up of thermosetting resin main body 21 processed by its encapsulation assembly parts is placed in and forms thermoplastic resin shell 22 processed same mould used.Thermoplastic resin is injected to mould and carry out the periphery of coverage power card to form thermoplastic resin shell 22 processed, thereby rebuild resin molded packaging body 10.
Resin molded packaging body 10 and the above-mentioned remaining resin molded packaging body 10 use same way as above of rebuilding are stacking.Upper cover 40 and lower cover 41 are placed in the stacking opposite end of packaging body and clamp to rebuild semiconductor module 1 with clip 43.
This resin molded packaging body 10 parts except thermoplastic resin shell 22 processed are reused and the parts that do not abandon resin molded packaging body 10 as power semiconductor chip 11, radiator 13 and 14 etc.
As mentioned above, the reconstruction of resin molded packaging body 10 is by injecting thermoplastic resin the mould that power card (being thermosetting resin main body 21 processed) has wherein been set, to form thermoplastic resin shell 22 processed, this can cause adhesiveness between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed to lack, and causes the problem that especially cooling agent leaks from coolant channel 30 in the time that coolant pressure is high.In this case, as Fig. 3 (a) can replace impaired resin molded packaging body 10 for rebuilding semiconductor module 1 to the resin molded packaging body 10 of the step manufacture of 4 (c).Impaired resin molded packaging body 10 can be used as the power card of other type products.
Obvious from above-mentioned discussion, the parts (such as power semiconductor chip 11 etc.) of resin molded packaging body 10 encapsulate to guarantee that by thermosetting resin main body 21 processed it has required heat resistance.In addition, the periphery of thermosetting resin main body 21 processed is covered by thermoplastic resin shell 22 processed.Thermoplastic resin shell 22 processed defines a part for coolant channel 30.Resin molded packaging body 10 be assembled into semiconductor module 1 and as cooling body when from resin molded packaging body 10 dissipation heat, complete coolant channel 30.
If resin molded packaging body 10 breakages, the structure of semiconductor module 1 allows it to be replaced by another, thereby can reuse semiconductor module 1.If only thermoplastic resin shell 22 processed is impaired, can makes its thermal softening and remove to retain thermosetting resin main body 21 processed (being power card) from resin molded packaging body 10.Can reuse thermosetting resin main body 12 processed to rebuild resin molded packaging body 10.This makes without the parts that abandon resin molded packaging body 10 as power semiconductor chip 11 etc.
If resin molded packaging body 10 breakages, and the surface of another resin molded packaging body 10 being splitting impaired when semiconductor module 1 or scratch, the structure of resin molded packaging body 10 makes its parts can be used for the utilization again of resource as power semiconductor chip 11 grades.
As mentioned above, after manufacturing thermoplastic resin shell 22 processed, form thermosetting resin main body 21 processed.This is bonding to the height of thermoplastic resin shell 22 processed by causing producing thermosetting resin main body 21 processed before thermosetting resin main body 21 processed is hardened, and closely links and betwixt without any air gap thereby form between thermosetting resin main body 21 processed and thermoplastic resin shell 22 processed.This is avoided refrigerant leaks to thermosetting resin main body 21 processed.
Fig. 7 illustrates the change programme of resin molded package body 10.As seen from Figure 6, the outer surface that the resin molded packaging body 10 in above-mentioned embodiment is designed to thermosetting resin main body 21 processed flushes thereby is easy to impaired with the outer surface of thermoplastic resin shell 22 processed.The structure of Fig. 7 minimizes this problem.Particularly, the outer surface of thermosetting resin main body 21 processed is positioned at the radially inner side of the outer surface of thermoplastic resin shell 22 processed, thereby makes the impaired risk minimization of physics.
To describe according to the semiconductor module 1 of the second embodiment below, wherein radiator 13 is different from the first embodiment with 14 structure.Other layout is identical, so description is omitted herein.
Fig. 8 is the cross-sectional view that explanation forms a resin molded packaging body 10 of the semiconductor module 1 of the second embodiment.
Resin molded packaging body 10 comprises respectively the dielectric film 13a and the 14a that in the outer first type surface of radiator 13 and 14 and periphery, extend.In other words, dielectric film 13a and 14a surround the peripheral region of radiator 13 and 14, thereby radiator 13 and 14 is not electrically connected with the parts of resin molded packaging body 10.
Each radiator 13 and 14 has away from power semiconductor chip 11 and is exposed to the first type surface of coolant flow with the cooling capacity of enhancing radiator 13 and 14.When the water of conduction is when the cooling agent, can cause from radiator 13 and 14 electric leakages, cause short circuit between the radiator 13 and 14 of adjacent two resin molded packaging bodies 10.For fear of this problem, dielectric film 13a and 14a are fixed on to the region that is exposed to the radiator 13 and 14 outside thermosetting resin main body 21 processed.The formation of dielectric film 13a and 14a can be by utilizing spraying technology to realize.
Dielectric film 13a and 14a can optionally only form in the outer major surface of radiator 13 and 14.
To describe according to the semiconductor module 1 of the 3rd embodiment below, wherein the structure of cooling body is different from the second embodiment.Other layout is identical, and therefore description is omitted herein.
Fig. 9 is the cross-sectional view that explanation forms a resin molded packaging body 10 of the semiconductor module 1 of the 3rd embodiment.
Resin molded packaging body 10 comprises the lip-deep metal fin radiator 61 that is separately positioned on dielectric film 13a and 14a by metal film 60.Fin radiator 61 is exposed to the cooling agent of the coolant channel 30 of flowing through being delivered to cooling agent from the heat of radiator 13 and 14.
Metal film 60 is made up of for example aluminium.Fin radiator 61 is also made up of for example aluminium.Each fin radiator 61 can be the nail type with multiple nails (pin), has the straight type of multiple plates, or has enlarging (or wave) type of multiple enlarging plates.
Fin radiator 61 increases with the contact surface area of the cooling agent of the coolant channel 30 of flowing through and for generation of the turbulent flow of cooling agent, thereby strengthens the ability of cooling resin molded packaging body 10.
Similar the second embodiment, resin molded packaging body 10 has dielectric film 13a and the 14a in the outer first type surface of radiator 13 and 14 and outer surface encirclement, thereby avoids from radiator 13 and 14 electric leakages.
Fin radiator 61 can directly be connected with dielectric film 13a and 14a by conductive bonding material.But fin radiator 61 depends on the shape of fin radiator 61 and declines with the strength of connection of dielectric film 13a and 14a.Use metal film 60 to guarantee the bonding of fin radiator 61 and dielectric film 13a and the required degree of 14a.Fin radiator 61 can be fixed on metal film 60 with ultrasonic wave joining technique.Metal film 60 has flat surface and can utilize conductive bonding material directly to adhere on the dielectric film 13a and 14a of radiator 13 and 14.
Although the present invention has carried out from preferred embodiment aspect open it better being understood promoting, it should be understood that the present invention can implement in many ways and do not deviate from principle of the present invention.Therefore, the scheme that the present invention is understood to include all possible embodiment and embodiment shown in can specializing is changed, and do not deviate from the principle by claims of the present invention.
For example, semiconductor module 1 is described as the inverter for driving threephase motor, but can be selected to the electrical devices of other type.
The cooling agent of the coolant channel of flowing through 30 can be the coolant of water or other type.
Semiconductor module 1 can be fabricated to and only comprise that one closely remains on the resin molded packaging body 10 between upper cover 40 and lower cover 41 with clip 43.
Claims (10)
1. manufacture comprises a method for the semiconductor module of resin molded packaging body and coolant channel, comprising:
First step, prepare the semiconductor sublayer assembly parts of power semiconductor chip, the first radiator, the second radiator and electric terminal, described power semiconductor chip has reciprocal the first and second surfaces and is equipped with the semiconductor power device being connected with described electric terminal;
Second step, the module that the thermoplastic resin of the shell of the described resin molded packaging body of formation restriction is made;
Third step, the module that described thermoplastic resin is made and described semiconductor sublayer assembly parts are placed in to fixed mold, then in the module of making at described thermoplastic resin, form the module that thermosetting resin is made, to manufacture the resin molded assembly parts as resin molded packaging body, in described assembly parts, form the coolant channel of the path that limits described cooling agent, described the first radiator is set to be connected with the first surface of described power semiconductor chip, described the second radiator is set to be connected with the second surface of described power semiconductor chip, each described electric terminal has the part exposing from described resin molded assembly parts, the glass transition temperature of the material of the module of making for described thermosetting resin is higher than the glass transition temperature of the material of the module of making for described thermoplastic resin, with
The 4th step, keeps described resin molded packaging body to complete described semiconductor module by lid.
2. the method for claim 1, wherein said third step injects thermosetting resin in it, to be provided with the module that the described mould of module that described thermoplastic resin makes and described semiconductor sublayer assembly parts is made to form described thermosetting resin.
3. the method for claim 1, the module that the described thermoplastic resin of wherein said third step is made is set to the described electric terminal away from the described semiconductor sublayer assembly parts in described mould, and thermosetting resin is also injected in the air gap between module and the described electric terminal that described thermoplastic resin makes.
4. method as claimed in claim 2, wherein said thermosetting resin is the one in epoxy resin, phenolic resins, silicones and polyurethane resin.
5. method as claimed in claim 3, wherein said thermoplastic resin is the one in polyphenylene sulfide, polybutylene terephthalate (PBT), nylon, polyethylene and polypropylene.
6. manufacture comprises a method for the semiconductor module of resin molded packaging body and coolant channel, comprising:
First step, prepare the semiconductor sublayer assembly parts of power semiconductor chip, the first radiator, the second radiator and electric terminal, described power semiconductor chip has reciprocal the first and second surfaces and is equipped with the semiconductor power device being connected with described electric terminal;
Second step, the module that the thermoplastic resin of the shell of the described resin molded packaging body of formation restriction is made;
Third step, the module that described thermoplastic resin is made and described semiconductor sublayer assembly parts are placed in to fixed mold, then in the module of making at described thermoplastic resin, form the module that thermosetting resin is made, to manufacture the resin molded assembly parts as a described resin molded packaging body, in described assembly parts, form the coolant channel of the path that limits described cooling agent, described the first radiator is set to be connected with the first surface of described resin molded packaging body, described the second radiator is set to be connected with the second surface of described power semiconductor chip, each described electric terminal all has the part being exposed to outside described resin molded assembly parts, the glass transition temperature of the material of the module of making for described thermosetting resin is higher than the glass transition temperature of the material of the module of making for described thermoplastic resin,
The 4th step, carries out described first step, described second step and described third step to manufacture resin molded packaging body described in another; With
The 5th step, manufacture described resin molded packaging body stacking as packaging body heap, superimposition keeps described packaging body stacking to complete described semiconductor module by lid.
7. method as claimed in claim 6, wherein said third step injects thermosetting resin in it, to be provided with the module that the described mould of module that described thermoplastic resin makes and described semiconductor sublayer assembly parts is made to form described thermosetting resin.
8. method as claimed in claim 6, the module that the described thermoplastic resin of wherein said third step is made is set to the described electric terminal away from the described semiconductor sublayer assembly parts in described mould, and thermosetting resin is also injected in the air gap between module and the described electric terminal that described thermoplastic resin makes.
9. method as claimed in claim 7, wherein said thermosetting resin is the one in epoxy resin, phenolic resins, silicones and polyurethane resin.
10. method as claimed in claim 8, wherein said thermoplastic resin is the one in polyphenylene sulfide, polybutylene terephthalate (PBT), nylon, polyethylene and polypropylene.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-143059 | 2010-06-23 | ||
| JP2010143059A JP5115595B2 (en) | 2010-06-23 | 2010-06-23 | Manufacturing method of semiconductor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102299079A CN102299079A (en) | 2011-12-28 |
| CN102299079B true CN102299079B (en) | 2014-08-20 |
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| CN201110173760.9A Expired - Fee Related CN102299079B (en) | 2010-06-23 | 2011-06-23 | Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip |
Country Status (3)
| Country | Link |
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| US (1) | US8530281B2 (en) |
| JP (1) | JP5115595B2 (en) |
| CN (1) | CN102299079B (en) |
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| US9420722B2 (en) * | 2012-12-06 | 2016-08-16 | Gerald Ho Kim | Composite heat sink device for cooling of multiple heat sources in close proximity |
| JP6044559B2 (en) * | 2014-02-05 | 2016-12-14 | 株式会社デンソー | Power converter |
| JP2015153932A (en) * | 2014-02-17 | 2015-08-24 | トヨタ自動車株式会社 | Semiconductor module |
| DE112015000446B4 (en) | 2014-02-25 | 2023-05-04 | Hitachi Astemo, Ltd. | Waterproof electronic device and method for its manufacture |
| JP6233257B2 (en) * | 2014-04-15 | 2017-11-22 | トヨタ自動車株式会社 | Power converter |
| US9613885B2 (en) * | 2015-03-03 | 2017-04-04 | Infineon Technologies Ag | Plastic cooler for semiconductor modules |
| US10262912B2 (en) * | 2015-04-15 | 2019-04-16 | Mitsubishi Electric Corporation | Semiconductor device |
| US10123465B2 (en) * | 2015-04-15 | 2018-11-06 | Ford Global Technologies, Llc | Power-module assembly |
| JP6641161B2 (en) * | 2015-11-18 | 2020-02-05 | 株式会社 日立パワーデバイス | Semiconductor device and alternator using the same |
| US9961808B2 (en) | 2016-03-09 | 2018-05-01 | Ford Global Technologies, Llc | Power electronics system |
| US9950628B2 (en) | 2016-03-09 | 2018-04-24 | Ford Global Technologies, Llc | Power-module assembly with dummy module |
| US10017073B2 (en) * | 2016-03-09 | 2018-07-10 | Ford Global Technologies, Llc | Coolant channels for power module assemblies |
| ITUA20163423A1 (en) * | 2016-05-13 | 2017-11-13 | Eltek Spa | Electromagnetic device and relative manufacturing process |
| DE102016117843A1 (en) | 2016-09-21 | 2018-03-22 | Infineon Technologies Ag | With cooling fluid cooled and a shielding comprehensive package |
| FR3061602B1 (en) * | 2017-01-02 | 2019-05-31 | Stmicroelectronics (Crolles 2) Sas | SYSTEM FOR IDENTIFYING A 3D CHIP |
| US10607919B2 (en) | 2017-04-28 | 2020-03-31 | Semiconductor Components Industries, Llc | Semiconductor package having junction cooling pipes embedded in substrates |
| JP6801605B2 (en) * | 2017-08-11 | 2020-12-16 | 株式会社デンソー | Power converter |
| JP6899784B2 (en) * | 2018-01-17 | 2021-07-07 | 日立Astemo株式会社 | Power semiconductor device |
| US11317546B2 (en) | 2018-06-26 | 2022-04-26 | Ford Global Technologies, Llc | Vehicle power module assembly |
| BR102019021642A2 (en) * | 2018-10-22 | 2020-05-05 | Deere & Co | semiconductor device |
| CN109801899B (en) * | 2018-12-27 | 2021-04-23 | 全球能源互联网研究院有限公司 | A power semiconductor module |
| CN112066114A (en) * | 2020-09-14 | 2020-12-11 | 深圳比特微电子科技有限公司 | Pipe fitting adapter, liquid cooling plate radiator and computing equipment |
| CN112530887A (en) * | 2020-12-08 | 2021-03-19 | 上海大郡动力控制技术有限公司 | Double-sided cooling structure for power semiconductor module |
| CN112635419A (en) * | 2020-12-22 | 2021-04-09 | 国网智慧能源交通技术创新中心(苏州)有限公司 | Packaging structure of inverter IGBT module |
| JP7593839B2 (en) * | 2021-03-15 | 2024-12-03 | 株式会社デンソー | Semiconductor Device |
| WO2023249976A1 (en) * | 2022-06-22 | 2023-12-28 | American Axle & Manufacturing, Inc. | Array of heat-sinked power semiconductors |
| CN115565893A (en) * | 2022-12-06 | 2023-01-03 | 深圳宏芯宇电子股份有限公司 | Packaging method, packaging equipment and plastic package element |
| CN118785649A (en) * | 2023-04-06 | 2024-10-15 | 台达电子工业股份有限公司 | Power module heat dissipation assembly structure |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110318884A1 (en) | 2011-12-29 |
| JP5115595B2 (en) | 2013-01-09 |
| JP2012009569A (en) | 2012-01-12 |
| US8530281B2 (en) | 2013-09-10 |
| CN102299079A (en) | 2011-12-28 |
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