CN112635419A - Packaging structure of inverter IGBT module - Google Patents
Packaging structure of inverter IGBT module Download PDFInfo
- Publication number
- CN112635419A CN112635419A CN202011527556.8A CN202011527556A CN112635419A CN 112635419 A CN112635419 A CN 112635419A CN 202011527556 A CN202011527556 A CN 202011527556A CN 112635419 A CN112635419 A CN 112635419A
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- igbt module
- cooling plate
- heat dissipation
- packaging structure
- inverter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
本发明公开了一种逆变器IGBT模块的封装结构，包括IGBT模块，所述IGBT模块的底部电性连接有引脚，IGBT模块的上端和下端设有陶瓷基板，上端的陶瓷基板的上方设有上冷却板，下端的陶瓷基板的下端设有下冷却板，在上冷却板与下冷却板之间均设置有散热组件，散热组件能对内部的IGBT模块进行散热，在上冷却板与下冷却板的两侧分别设置封装板，封装板的中间均设置通孔，通孔供线缆穿过并与引脚连接。通过在散热组件内侧安装的温度传感器，智能化监测内部温度，温度过高，自动散热，使用寿命长；而且通过在封装板粘接的橡胶密封垫，使得封装的密封性高，紧固度高，防水防尘，通过在封装板中间开设的通孔，方便连接出线缆，使用方便。
The invention discloses a packaging structure of an inverter IGBT module, comprising an IGBT module, the bottom of the IGBT module is electrically connected with pins, the upper end and the lower end of the IGBT module are provided with ceramic substrates, and the upper part of the ceramic substrate at the upper end is provided with a ceramic substrate. There is an upper cooling plate, a lower cooling plate is arranged at the lower end of the ceramic substrate at the lower end, and a heat dissipation component is arranged between the upper cooling plate and the lower cooling plate. Encapsulation plates are respectively arranged on both sides of the cooling plate, and through holes are arranged in the middle of the encapsulation plates, and the through holes allow cables to pass through and be connected with pins. Through the temperature sensor installed on the inside of the heat dissipation component, the internal temperature is monitored intelligently, the temperature is too high, the heat dissipation is automatic, and the service life is long; and the rubber gasket bonded to the package board makes the package high sealing and tightness. , Waterproof and dustproof, through the through hole opened in the middle of the package board, it is convenient to connect the cable and easy to use.
Description
Technical Field
The invention relates to the field of charger inverter equipment, in particular to an inverter IGBT module packaging structure.
Background
The inverter is a converter which converts direct current electric energy (batteries and storage batteries) into constant-frequency constant-voltage or frequency-modulation voltage-regulation alternating current (generally 220V,50Hz sine wave). It is composed of inverter bridge, control logic and filter circuit. The multifunctional electric grinding wheel is widely applicable to air conditioners, home theaters, electric grinding wheels, electric tools, sewing machines, DVDs (digital video disks), VCDs (video recorders), computers, televisions, washing machines, range hoods, refrigerators, video recorders, massagers, fans, lighting and the like. In foreign countries, due to the higher popularization rate of automobiles, the inverter can be used for connecting the storage battery to drive electric appliances and various tools to work when going out for work or traveling. The IGBT and the insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices composed of BJTs (bipolar transistors) and MOS (insulated gate field effect transistors), and have the advantages of both high input impedance of the MOSFET and low conduction voltage drop of GTR. The GTR saturation voltage is reduced, the current carrying density is high, but the driving current is large; the MOSFET has small driving power, high switching speed, large conduction voltage drop and small current carrying density. The IGBT integrates the advantages of the two devices, and has small driving power and reduced saturation voltage. The method is very suitable for being applied to the fields of current transformation systems with direct-current voltage of 600V or more, such as alternating-current motors, frequency converters, switching power supplies, lighting circuits, traction transmission and the like.
The existing inverter IGBT module packaging structure cannot resist high and low temperature, is not durable, poor in heat dissipation effect, short in service life, inconvenient to directly position and package, inconvenient to use, complex in structure, insufficient in sealing performance of package, inconvenient for threading connection and low in safety performance.
Therefore, the present inventors have aimed to invent a package structure of an inverter IGBT module, aiming at the above technical problems.
Disclosure of Invention
In order to overcome the above disadvantages, the present invention provides a package structure of an inverter IGBT module.
In order to achieve the above purposes, the invention adopts the technical scheme that: the utility model provides an inverter IGBT module's packaging structure, includes the IGBT module, the bottom electric connection of IGBT module has the pin, the upper end and the lower extreme of IGBT module are equipped with ceramic substrate, and the upper end ceramic substrate's top is equipped with the cooling plate, and the lower extreme of ceramic substrate is equipped with down the cooling plate, just go up the cooling plate and all be provided with radiator unit down between the cooling plate, just radiator unit can dispel the heat to inside IGBT module go up the cooling plate and set up the encapsulation board respectively with the both sides of cooling plate down simultaneously, just the centre of encapsulation board all sets up the through-hole, just the through-hole supplies the cable to pass and is connected with the pin.
Preferably, the heat dissipation assembly comprises a brushless motor, a fixed shaft is connected to the outer side end of the brushless motor, and fan blades are connected and distributed to the outer end of the fixed shaft. Namely, the fan blades are driven by the motor to dissipate heat.
Preferably, the heat dissipation assembly further comprises a metal net frame fixedly arranged at the outer side end. Ensuring that sundries cannot enter the interior.
Preferably, the heat dissipation assembly further comprises temperature sensors, the temperature sensors are respectively arranged on the inner sides of the upper cooling plate and the lower cooling plate, and the temperature sensors are connected with the brushless motor. Temperature sensor is ntc temperature sensor generally, and the inside temperature of intelligent monitoring, the high temperature then starts brushless motor and begins the heat dissipation, and the temperature meets the requirements.
Preferably, rubber sealing gaskets are bonded to the top and the bottom of the packaging plate, positioning holes are distributed in the top and the bottom of the packaging plate, and the upper cooling plate and the lower cooling plate are connected through positioning bolts through the positioning holes.
Preferably, a polytetrafluoroethylene coating is plated on the periphery of the inner side wall of the through hole, and the diameter of the through hole is 55 mm.
Preferably, gaskets are inlaid at the upper end and the lower end of the IGBT modules, and capacitors are electrically connected between the IGBT modules.
The packaging structure of the inverter IGBT module has the advantages that the packaging structure of the inverter IGBT module is resistant to high and low temperatures, firm, durable, high in strength, safe and reliable through the ceramic substrates arranged at the upper end and the lower end of the IGBT module, the heat dissipation assembly arranged between the upper cooling plate and the lower cooling plate drives the fan blades to rotate to dissipate heat efficiently through the internal brushless motor, the metal net rack fixedly arranged at the outer side end of the heat dissipation assembly is used for safety protection, the ntc temperature sensor arranged at the inner side of the heat dissipation assembly is used for intelligently monitoring the internal temperature, the temperature is too high, heat dissipation is automatic, and the service life is long; and this packaging structure of dc-to-ac converter IGBT module through the encapsulation board that sets up in the both sides of last cooling plate with cooling plate down, is convenient for directly through the positioning bolt fixed connection at the top in the locating hole encapsulation, through the rubber packing pad that bonds at the top of encapsulation board and bottom for the sealing performance of encapsulation is high, and the fastening degree is high, and is waterproof dustproof, through the through-hole of seting up in the middle of the encapsulation board, conveniently connects out the cable, convenient to use.
Drawings
Fig. 1 is a schematic structural diagram of a packaging structure of an inverter IGBT module.
Fig. 2 is a schematic structural view of the cooling plate of the present invention.
Fig. 3 is a schematic partial structure diagram of the heat dissipation assembly of the present invention.
FIG. 4 is a schematic diagram of a package structure according to the present invention.
In the figure:
1-IGBT module, 2-pins, 3-ceramic substrate, 4-upper cooling plate, 5-lower cooling plate, 6-heat dissipation component, 7-packaging plate, 8-rubber sealing gasket, 9-gasket, 10-capacitor,
61-brushless motor, 62-fixed shaft, 63-fan blade, 64-metal net frame, 65-temperature sensor,
71-through hole, 72-positioning hole.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Referring to fig. 1-4, the package structure of the inverter IGBT module in the present embodiment includes an IGBT module 1, pins 2 are electrically connected to the bottom of the IGBT module 1, ceramic substrates 3 are disposed on the upper end and the lower end of the IGBT module 1, an upper cooling plate 4 is disposed above the upper ceramic substrate 3, a lower cooling plate 5 is disposed at the lower end of the lower ceramic substrate 3, heat dissipation assemblies 6 are disposed between the upper cooling plate 4 and the lower cooling plate 5, the heat dissipation assemblies 6 can dissipate heat of the internal IGBT module 1, package plates 7 are disposed on two sides of the upper cooling plate 4 and the lower cooling plate 5, through holes 71 are disposed in the middle of the package plates 7, and the through holes 71 are used for cables to pass through and connect with the pins 2.
The heat dissipation assembly 6 comprises a brushless motor 61, a fixed shaft 62 is connected to the outer side end of the brushless motor 61, and fan blades 63 are connected and distributed to the outer end of the fixed shaft 62. Namely, the fan 63 is driven by the motor to dissipate heat.
The heat sink assembly 6 further includes a metal net frame 64 fixed at the outer end. Ensuring that sundries cannot enter the interior.
The heat dissipating assembly 6 further includes temperature sensors 65, and the temperature sensors 65 are respectively disposed at the inner sides of the upper cooling plate 4 and the lower cooling plate 5, and the temperature sensors 65 are connected to the brushless motor 61. The temperature sensor 65 is generally an ntc temperature sensor 65, the internal temperature is intelligently monitored, and if the temperature is too high, the brushless motor 61 is started to start radiating until the temperature meets the requirement.
The top and the bottom of the packaging plate 7 are both bonded with rubber sealing gaskets 8, the top and the bottom of the packaging plate 7 are both provided with positioning holes 72, and the positioning holes 72 are used for connecting the upper cooling plate 4 and the lower cooling plate 5 through positioning bolts.
A polytetrafluoroethylene coating is plated on the periphery of the inner side wall of the through hole 71, and the diameter of the through hole 71 is 55 mm.
Gasket 9 is all inlayed to the upper end and the lower extreme of IGBT module 1, and electric connection has electric capacity 10 between the IGBT module 1.
According to the packaging structure of the inverter IGBT module 1, the ceramic substrates 3 are arranged at the upper end and the lower end of the IGBT module 1, the packaging structure is resistant to high and low temperatures, firm and durable, high in strength, safe and reliable, the heat dissipation assembly 6 is arranged between the upper cooling plate 4 and the lower cooling plate 5, the internal brushless motor 61 is used for driving the fan blades 63 to rotate and dissipate heat efficiently, the metal net rack 64 is fixedly arranged at the outer side end of the heat dissipation assembly 6 for safety protection, the ntc temperature sensor 65 is arranged at the inner side of the heat dissipation assembly 6, the internal temperature is intelligently monitored, the temperature is overhigh, heat dissipation is automatic, and the service life is long; and this packaging structure of inverter IGBT module 1, through the packaging board 7 that sets up in the both sides of last cooling plate 4 with cooling plate 5 down, be convenient for directly encapsulate in locating hole 72 through the positioning bolt fixed connection at top, through the rubber packing pad 8 that bonds at the top of packaging board 7 and bottom for the sealing performance of encapsulation is high, and the tightness is high, and is waterproof dustproof, through the through-hole 71 of seting up in the middle of packaging board 7, conveniently connects out the cable, convenient to use.
The working principle is as follows: the IGBT module 1 is connected with a lead through a bottom pin 2 and penetrates out of a through hole 71 in the middle of a packaging plate 7, the ceramic substrate 3 at the upper end and the lower end of the IGBT module 1 is resistant to high and low temperature, firm, durable, high in strength, safe and reliable, the heat dissipation assembly 6 between the upper cooling plate 4 and the lower cooling plate 5 efficiently utilizes the internal brushless motor 61 to drive the fan blade 63 to rotate for heat dissipation, the metal net rack 64 fixed at the outer side end of the heat dissipation assembly 6 is used for safety protection, the ntc temperature sensor 65 installed at the inner side of the heat dissipation assembly 6 is used for intelligently monitoring the internal temperature, automatic heat dissipation is realized when the temperature is too high, the service life is long, the packaging plates 7 at the two sides of the upper cooling plate 4 and the lower cooling plate 5 are directly fixedly connected into the positioning hole 72 through positioning bolts at the tops for packaging, the sealing performance of the, waterproof and dustproof.
The invention relates to an IGBT module 1, a ceramic substrate 3, pins 2, a gasket 9, a capacitor 10, an upper cooling plate 4, a lower cooling plate 5, a packaging plate 7, a positioning bolt, a heat dissipation component 6, a metal net frame 64, fan blades 63, a brushless motor 61, a fixed shaft 62, a temperature sensor 65, a through hole 71, a rubber sealing gasket 8 and a positioning hole 72, wherein the components are all universal standard components or components known by technicians in the field, and the structure and the principle of the components can be known by technical manuals or conventional experimental methods, and the invention solves the problems that the packaging structure of the existing inverter IGBT module 1 can not resist high and low temperature, is not durable, has poor heat dissipation effect, short service life, inconvenient direct positioning and packaging, inconvenient use, complex structure, insufficient sealing performance of packaging, inconvenient threading connection and low safety performance, high and low temperature resistance, sturdy and durable, intensity is high, safe and reliable, safety protection, intelligent monitoring inside temperature, the high temperature, automatic heat dissipation, long service life, the positioning bolt fixed connection who is convenient for directly pass through the top encapsulates in locating hole 72 for the sealing performance of encapsulation is high, and the tightness is high, and is waterproof dustproof, conveniently connects out cable, convenient to use.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011527556.8A CN112635419A (en) | 2020-12-22 | 2020-12-22 | Packaging structure of inverter IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011527556.8A CN112635419A (en) | 2020-12-22 | 2020-12-22 | Packaging structure of inverter IGBT module |
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| Publication Number | Publication Date |
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| CN112635419A true CN112635419A (en) | 2021-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011527556.8A Pending CN112635419A (en) | 2020-12-22 | 2020-12-22 | Packaging structure of inverter IGBT module |
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| CN207603467U (en) * | 2017-12-22 | 2018-07-10 | 江西三晶电气有限公司 | A kind of box photovoltaic DC-to-AC converter |
| CN109003952A (en) * | 2018-07-12 | 2018-12-14 | 合肥甘来智能科技有限公司 | A kind of inverter IGBT encapsulating structure of standing balance |
| CN211700253U (en) * | 2020-03-31 | 2020-10-16 | 盐城芯丰微电子有限公司 | DFN device packaging structure for surface mounting |
| CN111987051A (en) * | 2020-07-10 | 2020-11-24 | 浙江天毅半导体科技有限公司 | New IGBT packaging structure and packaging method with temperature measurement function |
-
2020
- 2020-12-22 CN CN202011527556.8A patent/CN112635419A/en active Pending
Patent Citations (16)
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| US20070253164A1 (en) * | 2006-04-27 | 2007-11-01 | Takeshi Matsuo | Power inverter |
| CN201343447Y (en) * | 2008-09-18 | 2009-11-11 | 邢升阳 | Modular ozone generator |
| JP2011142124A (en) * | 2010-01-05 | 2011-07-21 | Fuji Electric Co Ltd | Semiconductor device |
| CN102299079A (en) * | 2010-06-23 | 2011-12-28 | 株式会社电装 | Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip |
| CN202167490U (en) * | 2011-08-03 | 2012-03-14 | 重庆瑜欣平瑞电子有限公司 | Plug-in type mounting structure for split type IGBT transistor and control plate |
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Application publication date: 20210409 |