CN106405167A - Probe card for integrated circuit detection - Google Patents
Probe card for integrated circuit detection Download PDFInfo
- Publication number
- CN106405167A CN106405167A CN201610708292.3A CN201610708292A CN106405167A CN 106405167 A CN106405167 A CN 106405167A CN 201610708292 A CN201610708292 A CN 201610708292A CN 106405167 A CN106405167 A CN 106405167A
- Authority
- CN
- China
- Prior art keywords
- probe
- side wall
- flexible bag
- probe card
- stopper section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 137
- 238000001514 detection method Methods 0.000 title claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 238000012360 testing method Methods 0.000 claims description 51
- 238000005452 bending Methods 0.000 claims description 5
- 230000035515 penetration Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims 1
- 238000009423 ventilation Methods 0.000 abstract 5
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610708292.3A CN106405167B (en) | 2016-08-23 | 2016-08-23 | A kind of probe card for testing integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610708292.3A CN106405167B (en) | 2016-08-23 | 2016-08-23 | A kind of probe card for testing integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106405167A true CN106405167A (en) | 2017-02-15 |
CN106405167B CN106405167B (en) | 2018-11-02 |
Family
ID=58004268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610708292.3A Active CN106405167B (en) | 2016-08-23 | 2016-08-23 | A kind of probe card for testing integrated circuit |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106405167B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109839522A (en) * | 2017-11-24 | 2019-06-04 | 中华精测科技股份有限公司 | Probe card device and its signal converting module |
TWI666455B (en) * | 2017-10-02 | 2019-07-21 | 美商弗姆費特比佛頓公司 | Probe systems for testing a device under test |
CN111122925A (en) * | 2019-12-24 | 2020-05-08 | 杭州易正科技有限公司 | Easy maintenance's test probe seat |
CN111624375A (en) * | 2020-07-01 | 2020-09-04 | 强一半导体(苏州)有限公司 | Probe card for high-temperature and high-pressure test of power device and key structure thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2723871B2 (en) * | 1995-12-21 | 1998-03-09 | 山形日本電気株式会社 | Electrical connection unit |
JP2001083178A (en) * | 1999-09-13 | 2001-03-30 | Nec Corp | Contact probe and probe device |
CN101788576A (en) * | 2009-01-22 | 2010-07-28 | 恩益禧电子股份有限公司 | Electrical testing devices and electrical testing methods for electronic devices |
TW201107758A (en) * | 2009-03-12 | 2011-03-01 | Tokyo Electron Ltd | Probe card |
CN105929208A (en) * | 2016-06-20 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | Test probe card used for detecting integrated circuit |
-
2016
- 2016-08-23 CN CN201610708292.3A patent/CN106405167B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2723871B2 (en) * | 1995-12-21 | 1998-03-09 | 山形日本電気株式会社 | Electrical connection unit |
JP2001083178A (en) * | 1999-09-13 | 2001-03-30 | Nec Corp | Contact probe and probe device |
CN101788576A (en) * | 2009-01-22 | 2010-07-28 | 恩益禧电子股份有限公司 | Electrical testing devices and electrical testing methods for electronic devices |
TW201107758A (en) * | 2009-03-12 | 2011-03-01 | Tokyo Electron Ltd | Probe card |
CN105929208A (en) * | 2016-06-20 | 2016-09-07 | 东莞市联洲知识产权运营管理有限公司 | Test probe card used for detecting integrated circuit |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI666455B (en) * | 2017-10-02 | 2019-07-21 | 美商弗姆費特比佛頓公司 | Probe systems for testing a device under test |
CN109839522A (en) * | 2017-11-24 | 2019-06-04 | 中华精测科技股份有限公司 | Probe card device and its signal converting module |
CN111122925A (en) * | 2019-12-24 | 2020-05-08 | 杭州易正科技有限公司 | Easy maintenance's test probe seat |
CN111624375A (en) * | 2020-07-01 | 2020-09-04 | 强一半导体(苏州)有限公司 | Probe card for high-temperature and high-pressure test of power device and key structure thereof |
Also Published As
Publication number | Publication date |
---|---|
CN106405167B (en) | 2018-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180921 Address after: 362000 22 Qianjie street, Guan Qiao Town, Nanan City, Quanzhou, Fujian Applicant after: NANAN YICHENG MACHINERY TECHNOLOGY Co.,Ltd. Address before: 523000 A1112, Huai Kai square, Yuan Mei Road, Nancheng District, Dongguan, Guangdong Applicant before: Wang Wenqing |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191025 Address after: 314500 censhan village, zhouquan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Tongxiang Hengda Warp Knitting Co.,Ltd. Address before: 362000 22 Qianjie street, Guan Qiao Town, Nanan City, Quanzhou, Fujian Patentee before: NANAN YICHENG MACHINERY TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240625 Address after: Building 1, 3rd Floor, Light Textile Industrial Park, Tudian Town, Tongxiang City, Jiaxing City, Zhejiang Province, 314503 Patentee after: Jiaxing Runshangdi Electronic Technology Co.,Ltd. Country or region after: China Address before: 314500 censhan village, zhouquan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: Tongxiang Hengda Warp Knitting Co.,Ltd. Country or region before: China |