CN106369470A - A kind of LED lighting equipment - Google Patents

Abstract

The invention discloses LED lighting equipment, wherein two sides of the upper end of a supporting base are respectively provided with a connecting rod, an LED lamp device is arranged between the connecting rods, the connecting rods are provided with adjusting bolts capable of fixing the LED lamp device, the LED lamp device comprises a radiator, a hemisphere mounting seat is integrally formed at the upper end of the radiator, the central axis of the hemisphere mounting seat is superposed with the central axis of the radiator, a hemisphere notch is arranged inside the hemisphere mounting seat, a plurality of arc-shaped PCB boards are uniformly distributed on the hemisphere mounting seat, LED lamp beads are arranged on the arc-shaped PCB boards, air holes capable of communicating the hemisphere notch with the outside of the hemisphere mounting seat are arranged on the hemisphere mounting seat between the adjacent LED lamp beads, a lamp shade is sleeved at the upper end of the radiator, a plurality of air guide holes capable of communicating the inner side and the outer side of the lamp shade are arranged on the side wall of the lower end of. The invention aims to provide an LED lighting device.

Description

A kind of LED lighting equipment

technical field

The invention relates to an LED lighting device.

Background technique

The irradiation angle of the existing lamps is generally fixed, which cannot meet the needs of users. Existing LED lamps generally use fixed-shaped radiators to dissipate heat. In order to increase the heat dissipation area, heat dissipation fins are generally densely distributed on the outer wall of the radiator. Thereby seriously affecting its service life.

In addition, existing radiators used for LED lamps are relatively large in size, require a large storage space, and increase transportation costs.

Therefore, the existing LED lights need to be further improved.

Contents of the invention

The object of the present invention is to provide an LED lamp with good heat dissipation effect and long service life in order to overcome the shortcomings in the prior art.

In order to achieve the above object, the present invention adopts the following scheme:

An LED lighting device, comprising a supporting base, connecting rods are arranged on both sides of the upper end of the supporting base, and an LED lamp device capable of swinging relative to the connecting rods so as to adjust the light emitting angle is arranged between the connecting rods. The connecting rod is provided with an adjusting bolt that can fix the LED lamp device. The LED lamp device includes a radiator, and a hemispherical mounting seat is integrally formed on the upper end of the radiator. The central axis of the hemispherical mounting seat and the heat dissipation The central axis of the device coincides, and a hemispherical slot is provided inside the hemispherical mounting seat, and a plurality of arc-shaped PCB boards are uniformly distributed on the hemispherical mounting seat, and LED lights are arranged on the arc-shaped PCB board Beads, on the hemispherical mounting seat between adjacent LED lamp beads, there is a vent hole that can make the hemispherical notch communicate with the outside of the hemispherical mounting seat, and a lampshade is set on the upper end of the radiator, and the arc The PCB board and LED lamp beads are arranged in the lampshade, and several air guide holes that can communicate with the inside and outside of the lampshade are provided on the lower side wall of the lampshade. A number of heat dissipation fins are arranged on the top, and a radiator main body that can rotate relative to the heat dissipation cylinder is provided in the heat dissipation cylinder. A cavity is provided in the radiator main body, and the inner wall of the radiator main body is evenly distributed. There are heat dissipation fins, and a plurality of heat dissipation sheets that can be curled on the heat sink body are provided on the outer wall of the heat sink body, and a plurality of guide grooves are provided on the heat dissipation cylinder, and the heat dissipation sheets are arranged on the In the guide groove, an exhaust fan device is arranged in the hemispherical slot.

The above-mentioned LED lighting equipment is characterized in that the exhaust fan device includes a ventilating mounting seat, and the venting mounting seat is connected to the main body of the radiator through connecting screws. exhaust fan.

The above-mentioned LED lighting equipment is characterized in that a connection concave platform is provided on the inner wall of the upper end of the heat dissipation cylinder, and a connecting convex platform is provided on the upper end of the radiator main body, and the connecting convex platform is movably arranged on the connecting concave platform. Taiwan.

The above-mentioned LED lighting equipment is characterized in that the lampshade includes a cover body, and a snap-fit ring is provided at the lower end of the cover body, and the snap-fit ring is snap-fitted on the bottom surface of the outer edge of the connecting boss.

The above-mentioned LED lighting device is characterized in that a knob portion capable of driving the radiator main body to rotate is provided at the end of the radiator main body.

The above-mentioned LED lighting equipment is characterized in that heat dissipation holes communicating with the inside and outside of the heat dissipation cylinder are provided on the outer wall of the heat dissipation cylinder.

The above-mentioned LED lighting device is characterized in that the guide groove runs through the upper end of the heat dissipation cylinder.

The above-mentioned LED lighting device is characterized in that the heat dissipation sheet is integrally formed with the heat sink main body.

The above-mentioned LED lighting device is characterized in that a bearing is sheathed on the outer wall of the connecting boss.

The present invention is provided with a suction cup on the bottom surface of the support base.

In summary, the present invention has the beneficial effects relative to the prior art as follows:

The invention has a simple structure, and the radiating fins on the main body of the radiator can be stretched to effectively increase the radiating area and transfer heat away from the expandable radiator, thus greatly improving the radiating effect. In the present invention, the radiating sheet can be crimped on the outer wall of the main body of the radiator, thereby reducing the volume and facilitating storage and transportation.

Description of drawings

Fig. 1 is a schematic sectional view of the present invention;

Fig. 2 is the schematic diagram of supporting base and connecting rod of the present invention;

Fig. 3 is the three-dimensional schematic view of radiator of the present invention;

Fig. 4 is a schematic cross-sectional view of the radiator of the present invention.

detailed description

The present invention will be further described below in conjunction with specific embodiment:

As shown in Figures 1 to 4, an LED lighting device includes a supporting base 300, connecting rods 3001 are respectively arranged on both sides of the upper end of the supporting base 300, and connecting rods capable of opposing each other are arranged between the connecting rods 3001. 3001 swings to adjust the light angle of the LED lamp device 800, the connecting rod 3001 is provided with an adjustment bolt 3002 that can fix the LED lamp device 800, and an adjustment hole is provided on the LED lamp device 800, and the adjustment bolt 3002 is set In the adjustment hole, after the LED lamp device 800 is adjusted to the required light emitting angle, the LED lamp device 800 can be fixed on the connecting rod 3001 at the required angle by twisting the adjusting bolt 3002. The LED lamp device 800 includes The radiator 100 is integrally formed with a hemispherical mount 101 at the upper end of the radiator 100, the central axis of the hemispherical mount 101 coincides with the central axis of the radiator 100, and inside the hemispherical mount 101 is provided Hemispherical slot 102, a plurality of arc-shaped PCB boards are evenly distributed on the hemispherical body mounting seat 101, LED lamp beads 103 are arranged on the arc-shaped PCB board, and the hemisphere between adjacent LED lamp beads 103 The body mounting base 101 is provided with a ventilation hole 104 that enables the hemispherical slot 102 to communicate with the outside of the hemispherical mounting base 101, and a lampshade 105 is set on the upper end of the radiator 100, and the arc-shaped PCB board and LED lamp beads 103 is set in the lampshade 105, on the side wall of the lower end of the lampshade 105, there are several air guide holes 106 that can communicate with the inner and outer sides of the lampshade 105, the radiator 100 includes a heat dissipation cylinder 1, and in the heat dissipation cylinder 1 There are a number of cooling fins 11 on the outer wall, a radiator main body 2 that can rotate relative to the cooling cylinder 1 is provided in the heat dissipation cylinder 1, and a cavity 21 is provided in the radiator main body 2. The inner wall of the radiator main body 2 is evenly distributed with cooling fins 11, and the outer wall of the radiator main body 2 is provided with a plurality of cooling fins 3 that can be crimped on the radiator main body 2. A plurality of guide grooves 4 are arranged on it, and the heat dissipation sheet 3 is arranged in the guide grooves 4 , and an exhaust fan device 107 is arranged in the hemispherical slot 102 .

The exhaust fan device 107 of the present invention includes a ventilation installation seat 1071, the ventilation installation seat 1071 is connected to the radiator main body 2 through connecting screws, and an exhaust fan 1072 is arranged in the ventilation installation seat 1071.

The lampshade 105 of the present invention includes a cover body 1051 , and a snap ring 1052 is provided at the lower end of the cover body 1051 , and the snap ring 1052 is snapped on the bottom surface of the outer edge of the connecting boss 6 .

In the present invention, a connection concave platform 5 is provided on the inner wall of the upper end of the heat dissipation cylinder 1 , and a connecting convex platform 6 is provided on the upper end of the radiator main body 2 , and the connecting convex platform 6 is movably arranged in the connecting concave platform 5 . Part of the heat from the radiator main body 2 is transferred to the heat dissipation cylinder 1 through the connecting boss 6, thereby enhancing the heat dissipation effect.

In the present invention, a knob portion 7 capable of driving the radiator main body 2 to rotate is provided at the end of the radiator main body 2 . In the present invention, the expansion and contraction of the heat dissipation sheet 3 can be controlled by rotating the knob part 7 .

In the present invention, heat dissipation holes 8 communicating with the inside and outside of the heat dissipation cylinder 1 are provided on the outer wall of the heat dissipation cylinder 1 . The heat dissipation holes 8 are beneficial to the heat exchange between the inside and outside of the heat dissipation cylinder 1 and improve the heat dissipation effect.

The guide groove 4 described in the present invention runs through the upper end of the heat dissipation cylinder 1 . When the heat dissipation cylinder 1 and the heat dissipation sheet 3 are installed, it is only necessary to place the heat dissipation sheet 3 in the guide groove 4 in sequence, and then rotate the radiator main body 2 so that the heat dissipation sheet 3 is curled and stored on the radiator main body 2. In the present invention, the Limiting blocks may be provided at the ends of the heat dissipation sheet 3 to prevent excessive crimping of the heat dissipation sheet 3 .

In the present invention, a connection portion 9 is provided at the lower end of the heat dissipation cylinder 1 , and in the present invention, a heat dissipation hole 8 is provided on the connection portion 9 . Good cooling effect.

In the present invention, the heat dissipation sheet 3 is integrally formed with the radiator main body 2 .

In the present invention, a bearing is sheathed on the outer wall of the connecting boss 6 .

The present invention is provided with a suction cup 1600 on the bottom surface of the support base.

In one of the implementation methods of the present invention, the radiator main body 2 and the heat dissipation sheet 3 are both made of foamed aluminum alloy material, and the foamed aluminum alloy material is composed of the following components by weight percentage:

Aluminum oxide 10-45%

Zinc Oxide 15-30%

Magnesium powder 5-35%

Graphite 8-30%.

Example 1

The foamed aluminum alloy material of the present invention consists of the following components by weight percentage:

Aluminum oxide 10%

Zinc Oxide 30%

Magnesium powder 35%

Graphite 25%.

Example 2

The foamed aluminum alloy material of the present invention consists of the following components by weight percentage:

Aluminum oxide 10%

Zinc Oxide 25%

Magnesium powder 35%

Graphite 30%.

Example 3

The foamed aluminum alloy material of the present invention consists of the following components by weight percentage:

Aluminum oxide 45%

Zinc Oxide 15%

Magnesium powder 10%

Graphite 30%.

Example 4

The foamed aluminum alloy material of the present invention consists of the following components by weight percentage:

Aluminum oxide 45%

Zinc Oxide 25%

Magnesium powder 5%

Graphite 25%.

The radiator main body 2 and the heat dissipation fins 3 described in the present invention can also be made of aluminum alloy or copper.

In the present invention, a heat dissipation coating is sprayed on the outer wall of the radiator to effectively enhance the heat dissipation effect of the radiator. The heat dissipation coating of the present invention comprises the following components by weight:

Further describe heat-dissipating coating of the present invention below by embodiment:

Example 1

The heat dissipation coating of the present invention comprises the following components by weight:

The silicone resin with modified nanoparticles is prepared by the following method:

A. Take 40 parts by weight of methyltriethoxysilane, add 600 parts of water, add 0.06 parts by weight of formic acid catalyst, hydrolyze at 0°C for 1 hour, heat up to 70°C for polymerization reaction, and carry out vacuum distillation after the reaction , to obtain silicone resin;

B. Mix the silicone resin in step A, 8 parts by weight of 1-trifluoromethyl-1,3 butadiene, 0.1 parts by weight of titanate catalyst and 10 parts by weight of ethyl acetate, and mix them uniformly under the protection of argon. , heated to 100°C for dehydration condensation reaction for 1 hour to obtain modified silicone resin;

C. Raise the temperature of the modified silicone resin in step B to 75°C, add 2 parts of ethyl silicate to react for 1 hour, cool down after the reaction, and distill off the solvent under reduced pressure to obtain the silicone resin containing modified nanoparticles .

Wherein said polyether modified amino silicone oil is prepared according to the following method, comprising the steps of:

S1: Add 300 parts by weight of octamethylcyclotetrasiloxane to a three-necked flask equipped with a stirrer, condenser, and thermometer, stir, heat up to 100°C, add 0.15 parts by weight of catalyst tetramethylammonium hydroxide, and keep warm After 20 minutes, 18 parts by weight of coupling agent N-β(aminoethyl)-γ-aminopropylmethyldimethoxysilane was added, and the temperature was controlled at 100°C for 6 hours to obtain amino silicone oil;

S2: Add 180 parts by weight of the amino silicone oil synthesized in step A, 130 parts by weight of active polyether, and 90 parts by weight of isopropanol into a three-necked flask equipped with a stirrer, a condenser, and a thermometer, and carry out a reflux reaction at 70°C until After the reactant is transparent, continue to keep warm for 4 hours, and finally lower the temperature and reduce the pressure under the condition of 0.005MPa to remove the isopropanol.

The carbon nanotubes of the surface hydroxylation are prepared by the following method:

Mix multi-walled carbon nanotubes and potassium hydroxide in a ball mill tank at a ratio of 1:20 by weight, add an appropriate amount of ethanol, and after ball milling for 12 hours, wash to neutrality with deionized water to obtain a mixture. Put it in a vacuum oven and dry it at 100°C for 12 hours to obtain it.

The solvent is a mixture of xylene and methyl isobutyl ketone in a weight ratio of 2:1.

The preparation method of heat dissipation coating of the present invention:

After mixing epoxy resin, acrylic resin, silicone resin containing modified nanoparticles, and solvent, heat up to 40°C and stir evenly, then add surface hydroxylated carbon nanotubes, polyether modified amino silicone oil, aluminum-magnesium alloy powder, Aluminum nitride, stirred evenly to obtain a mixture, put the mixture into a paint grinder and grind to 30-50 μm, ultrasonically disperse evenly, add polyvinyl acetate and stir evenly.

Example 2

The heat dissipation coating of the present invention comprises the following components by weight:

The silicone resin with modified nanoparticles is prepared by the following method:

A. Take 60 parts by weight of methyltriethoxysilane, add 900 parts of water, add 0.8 parts by weight of formic acid catalyst, hydrolyze at 5°C for 5 hours, heat up to 90°C for polymerization reaction, and carry out vacuum distillation after the reaction , to obtain silicone resin;

B. Mix the silicone resin in step A, 18 parts by weight of 1-trifluoromethyl-1,3 butadiene, 0.6 parts by weight of titanate catalyst and 25 parts by weight of ethyl acetate, and mix them uniformly under the protection of argon. , heated to 120°C for dehydration and condensation reaction for 3 hours to obtain modified silicone resin;

C. Raise the temperature of the modified silicone resin in step B to 95°C, add 14 parts of ethyl silicate to react for 2 hours, cool down after the reaction, and distill off the solvent under reduced pressure to obtain the silicone resin containing modified nanoparticles .

Wherein said polyether modified amino silicone oil is prepared according to the following method, comprising the steps of:

S1: Add 500 parts by weight of octamethylcyclotetrasiloxane to a three-necked flask equipped with a stirrer, condenser, and thermometer, stir, heat up to 125°C, add 0.35 parts by weight of catalyst tetramethylammonium hydroxide, and keep warm After 40 minutes, 22 parts by weight of coupling agent N-β(aminoethyl)-γ-aminopropylmethyldimethoxysilane was added, and the temperature was controlled at 125°C for 6 hours to obtain amino silicone oil;

S2: Add 220 parts by weight of the amino silicone oil synthesized in step A, 180 parts by weight of active polyether, and 120 parts by weight of isopropanol into a three-necked flask equipped with a stirrer, a condenser, and a thermometer, and carry out a reflux reaction at 95°C until After the reactant is transparent, continue to keep warm for 6 hours, and finally lower the temperature and reduce the pressure under the condition of 0.01MPa to remove the isopropanol.

The carbon nanotubes of the surface hydroxylation are prepared by the following method:

Mix multi-walled carbon nanotubes and potassium hydroxide in a ball mill tank at a ratio of 1:30 by weight, add an appropriate amount of ethanol, and after ball milling for 24 hours, wash to neutrality with deionized water to obtain a mixture. Put it in a vacuum oven and dry it at 130°C for 16 hours to obtain it.

The solvent is a mixture of xylene and methyl isobutyl ketone in a weight ratio of 2:1.

The preparation method of heat dissipation coating of the present invention:

After mixing epoxy resin, acrylic resin, silicone resin containing modified nanoparticles, and solvent, heat up to 50°C and stir evenly, then add surface hydroxylated carbon nanotubes, polyether modified amino silicone oil, aluminum-magnesium alloy powder, Aluminum nitride, stirred evenly to obtain a mixture, put the mixture into a paint grinder and grind to 30-50 μm, ultrasonically disperse evenly, add polyvinyl acetate and stir evenly.

Example 3

The heat dissipation coating of the present invention comprises the following components by weight:

The silicone resin with modified nanoparticles is prepared by the following method:

A. Take 50 parts by weight of methyltriethoxysilane, add 750 parts of water, add 0.3 parts by weight of formic acid catalyst, hydrolyze at 2°C for 3 hours, heat up to 80°C for polymerization reaction, and carry out vacuum distillation after the reaction , to obtain silicone resin;

B. Mix the silicone resin in step A, 12 parts by weight of 1-trifluoromethyl-1,3 butadiene, 0.3 parts by weight of titanate catalyst and 15 parts by weight of ethyl acetate. , heated to 110°C for dehydration and condensation reaction for 2 hours to obtain modified silicone resin;

C. Raise the temperature of the modified silicone resin in step B to 85°C, add 6 parts of ethyl silicate to react for 1.5 hours, cool down after the reaction, and distill off the solvent under reduced pressure to obtain the silicone resin containing modified nanoparticles .

Wherein said polyether modified amino silicone oil is prepared according to the following method, comprising the steps of:

S1: Add 400 parts by weight of octamethylcyclotetrasiloxane to a three-necked flask equipped with a stirrer, condenser, and thermometer, stir, heat up to 110°C, add 0.25 parts by weight of catalyst tetramethylammonium hydroxide, and keep warm After 30 minutes, 20 parts by weight of coupling agent N-β(aminoethyl)-γ-aminopropylmethyldimethoxysilane was added, and the temperature was controlled at 110°C for 6 hours to obtain amino silicone oil;

S2: Add 180-220 parts by weight of the amino silicone oil synthesized in step A, 130-180 parts by weight of active polyether, and 90-120 parts by weight of isopropanol into a three-necked flask equipped with a stirrer, a condenser, and a thermometer. Reflux reaction at 95°C until the reactant is transparent, then continue to keep warm for 4-6 hours, and finally lower the temperature at 0.005-0.01MPa to remove isopropanol under reduced pressure to obtain the product.

The carbon nanotubes of the surface hydroxylation are prepared by the following method:

Mix multi-walled carbon nanotubes and potassium hydroxide in a ball mill tank at a ratio of 1:25 by weight, add an appropriate amount of ethanol, and after ball milling for 18 hours, wash to neutrality with deionized water to obtain a mixture. Put it in a vacuum oven and dry it at 120°C for 14 hours to obtain it.

The solvent is a mixture of xylene and methyl isobutyl ketone in a weight ratio of 2:1.

The preparation method of heat dissipation coating of the present invention:

After mixing epoxy resin, acrylic resin, silicone resin containing modified nanoparticles, and solvent, heat up to 45°C and stir evenly, add surface hydroxylated carbon nanotubes, polyether modified amino silicone oil, aluminum-magnesium alloy powder, Aluminum nitride, stirred evenly to obtain a mixture, put the mixture into a paint grinder and grind to 30-50 μm, ultrasonically disperse evenly, add polyvinyl acetate and stir evenly.

Example 4

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 5

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 6

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 7

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 8

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 9

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 10

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 11

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 12

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

Example 13

The heat dissipation coating of the present invention comprises the following components by weight:

The preparation method of the organosilicon resin, polyether-modified amino silicone oil, solvent and heat-dissipating coating of the present invention are all the same as those in Example 3.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments. What are described in the above-mentioned embodiments and the description only illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will also have Variations and improvements all fall within the scope of the claimed invention. The protection scope of the present invention is defined by the appended claims and their equivalents.

Claims (8)

1. A LED lighting device, comprising a supporting base (300), connecting rods (3001) are respectively arranged on both sides of the upper end of the supporting base (300), and connecting rods (3001) are arranged between the connecting rods (3001). The connecting rod (3001) swings to adjust the LED lamp device (800) of the light emitting angle. The connecting rod (3001) is provided with an adjusting bolt (3002) that can fix the LED lamp device (800). The LED lamp device (800) includes a radiator (100), and a hemispherical mounting seat (101) is integrally formed on the upper end of the radiator (100), the central axis of the hemispherical mounting seat (101) and the radiator (100) The central axes coincide, and a hemispherical slot (102) is provided inside the hemispherical mount (101), and a plurality of arc-shaped PCB boards are uniformly distributed on the hemispherical mount (101). LED lamp beads (103) are arranged on the PCB, and the hemispherical body mounting seat (101) between adjacent LED lamp beads (103) is provided with a hemispherical notch (102) and a hemispherical body mounting seat (101) ) vent holes (104) connected to the outside, a lampshade (105) is set on the upper end of the radiator (100), and the arc-shaped PCB board and LED lamp beads (103) are arranged in the lampshade (105). The side wall of the lower end of the lampshade (105) is provided with several air guide holes (106) that can communicate with the inside and outside of the lampshade (105). The radiator (100) includes a heat dissipation cylinder (1). A plurality of cooling fins (11) are arranged on the outer wall of the body (1), and a radiator main body (2) capable of rotating relative to the cooling cylinder (1) is arranged inside the cooling cylinder (1). A cavity (21) is provided in the radiator main body (2), radiating fins (11) are evenly distributed on the inner wall of the radiator main body (2), and a plurality of The heat dissipation sheet (3) that can be crimped on the radiator main body (2) is provided with a plurality of guide grooves (4) on the heat dissipation cylinder (1), and the heat dissipation sheet (3) is arranged on the guide In the groove (4), an exhaust fan device (107) is arranged in the hemispherical slot (102). 2. A LED lighting device according to claim 1, characterized in that the exhaust fan device (107) includes a ventilating mounting seat (1071), and the venting mounting seat (1071) is connected to the On the radiator main body (2), an exhaust fan (1072) is arranged in the air-permeable mounting seat (1071). 3. A LED lighting device according to claim 1, characterized in that a connection concave platform (5) is provided on the inner wall of the upper end of the heat dissipation cylinder (1), and a connecting concave platform (5) is provided on the upper end of the radiator main body (2). A connection boss (6), the connection boss (6) is movably arranged in the connection recess (5). 4. The LED lighting device according to claim 1, characterized in that the lamp shade (105) includes a cover body (1051), and a snap ring (1052) is provided at the lower end of the cover body (1051), The snap ring (1052) is clipped on the bottom surface of the outer edge of the connecting boss (6). 5. The LED lighting device according to claim 1, characterized in that a knob portion (7) capable of driving the radiator main body (2) to rotate is provided at the end of the radiator main body (2). 6. The LED lighting device according to claim 1, characterized in that a heat dissipation hole (8) communicating with the inside and outside of the heat dissipation cylinder (1) is provided on the outer wall of the heat dissipation cylinder (1). 7. The LED lighting device according to claim 1, characterized in that the guide groove (4) runs through the upper end of the heat dissipation cylinder (1). 8. The LED lighting device according to claim 1, characterized in that the heat dissipation sheet (3) is integrally formed with the radiator main body (2).