CN106287264B - High-efficient radiating LED lamp - Google Patents
High-efficient radiating LED lamp Download PDFInfo
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- CN106287264B CN106287264B CN201610633909.XA CN201610633909A CN106287264B CN 106287264 B CN106287264 B CN 106287264B CN 201610633909 A CN201610633909 A CN 201610633909A CN 106287264 B CN106287264 B CN 106287264B
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- 238000001816 cooling Methods 0.000 claims abstract description 34
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 10
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 10
- 239000002270 dispersing agent Substances 0.000 claims description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 28
- 239000002105 nanoparticle Substances 0.000 claims description 22
- 239000004417 polycarbonate Substances 0.000 claims description 22
- 229920000515 polycarbonate Polymers 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 19
- 239000012752 auxiliary agent Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000011049 filling Methods 0.000 claims description 15
- 239000004814 polyurethane Substances 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 9
- 241000258971 Brachiopoda Species 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 31
- 239000003795 chemical substances by application Substances 0.000 description 25
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 21
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 21
- 239000002041 carbon nanotube Substances 0.000 description 21
- 229910021393 carbon nanotube Inorganic materials 0.000 description 21
- 238000003756 stirring Methods 0.000 description 21
- 238000010792 warming Methods 0.000 description 21
- 239000000203 mixture Substances 0.000 description 18
- 239000006185 dispersion Substances 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 14
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 14
- 230000018044 dehydration Effects 0.000 description 14
- 238000006297 dehydration reaction Methods 0.000 description 14
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 14
- 229920002050 silicone resin Polymers 0.000 description 14
- 238000005292 vacuum distillation Methods 0.000 description 14
- -1 exhaust fan device Substances 0.000 description 13
- 239000000080 wetting agent Substances 0.000 description 13
- 239000002518 antifoaming agent Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- OXHNLMTVIGZXSG-UHFFFAOYSA-N 1-Methylpyrrole Chemical compound CN1C=CC=C1 OXHNLMTVIGZXSG-UHFFFAOYSA-N 0.000 description 7
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 7
- 229910017083 AlN Inorganic materials 0.000 description 7
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 7
- 229910002601 GaN Inorganic materials 0.000 description 7
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 7
- 239000005058 Isophorone diisocyanate Substances 0.000 description 7
- 229910000545 Nickel–aluminium alloy Inorganic materials 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical class OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 235000019253 formic acid Nutrition 0.000 description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 7
- 238000006386 neutralization reaction Methods 0.000 description 7
- 238000006396 nitration reaction Methods 0.000 description 7
- 229910017604 nitric acid Inorganic materials 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 230000020477 pH reduction Effects 0.000 description 7
- 239000003973 paint Substances 0.000 description 7
- 229920000570 polyether Polymers 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 4
- 238000012856 packing Methods 0.000 description 3
- 229910000165 zinc phosphate Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 235000016768 molybdenum Nutrition 0.000 description 1
- OXHXATNDTXVKAU-UHFFFAOYSA-N phosphoric acid zinc Chemical compound [Zn].OP(O)(O)=O OXHXATNDTXVKAU-UHFFFAOYSA-N 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/57—Cooling arrangements using liquid coolants characterised by control arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
- F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses an LED lamp with high-efficiency heat dissipation, which comprises a lamp shell, wherein a mounting substrate is arranged on the lamp shell, and the LED lamp is characterized in that: the LED lamp is characterized in that a groove is formed in the mounting substrate, a mounting hole penetrating through the mounting substrate is formed in the bottom of the groove, an LED chip assembly is arranged in the mounting hole, a heat-conducting graphite sheet capable of sealing the groove is arranged at the position of an opening of the groove, cooling oil is filled in a cavity enclosed by the groove and the heat-conducting graphite sheet, a radiator is arranged in the lamp housing, a cooling oil pipe is arranged in the radiator, two ends of the cooling oil pipe are connected with the cavity to form a loop, an oil pump is arranged on the cooling oil pipe, an exhaust mounting hole is formed in the lamp housing, and an exhaust fan device is arranged in the exhaust mounting hole. The invention aims to overcome the defects in the prior art and provide the LED lamp with simple structure, good heat dissipation effect and long service life and capable of dissipating heat efficiently.
Description
Technical field
The present invention relates to a kind of LED light of high efficiency and heat radiation.
Background technique
High-power and high-luminance white LED light source gradually replaces conventional light source at present, but not due to the high problem of LED junction temperature
It can effectively solve, lead to the decline of LED chip luminous efficiency, light decay, aging, shorten the working life, make always high-power
LED lamp cannot be applied illumination is high, use environment is severe, the longer field of street lamp lighting of life requirements.
So existing LED light needs to be further improved.
Summary of the invention
Place that purpose of the invention is to overcome the shortcomings in the prior art, it is simple to provide a kind of structure, heat dissipation effect
It is good, the LED light for the high efficiency and heat radiation that can effectively prolong the service life.
In order to achieve the above object, the present invention uses following scheme:
A kind of LED light of high efficiency and heat radiation, including lamp housing are equipped with installation base plate, it is characterised in that: in institute on the lamp housing
It states and is equipped with groove in installation base plate, be equipped with the mounting hole through installation base plate in the bottom portion of groove, set in the mounting hole
Have LED chip component, the heat conductive graphite piece of the groove can be closed by being equipped at the slot opening, the groove with it is thermally conductive
It is filled with cooling oil in the cavity that graphite flake surrounds, radiator is equipped in the lamp housing, cooling is equipped in the radiator
Oil pipe, the both ends of the oil cooling service pipe are connected to constitute primary Ioops with cavity, and oil pump is equipped on the oil cooling service pipe,
The lamp housing is equipped with exhaust mounting hole, and exhaust fan device is equipped in the exhaust mounting hole.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that on the radiator and oil cooling service pipe outer wall
It is respectively equipped with thermal dispersant coatings.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that the lamp housing along its length opposite two
Exhaust fan device is respectively equipped on end.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that in the two sides of the lamp housing along its length
On be respectively equipped with radiator.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that temp probe is equipped in the groove, in institute
It states and is equipped with controller in lamp housing, the temp probe, exhaust fan device, oil pump are connected with controller respectively.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that the radiator includes radiator body,
The radiator body inner vertical is arranged at intervals with several radiating fins in lamp housing length direction, and the oil cooling service pipe is along lamp housing
Length direction runs through the radiating fin.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that the LED chip component includes aluminum substrate,
LED chip is welded on described aluminum substrate one end, the aluminum substrate other end is arranged in groove.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that exhaust fan device includes cylinder-shaped mounting base,
It is equipped with several ventilative slots on the cylinder-shaped mounting base outer wall, is equipped with motor on described cylinder-shaped mounting base one end and pacifies
Seat is filled, motor is equipped on the motor mount, Vane wheel is equipped on the motor shaft of the motor.
A kind of LED light of high efficiency and heat radiation as described above, it is characterised in that the thermal dispersant coatings include following by weight
Component:
In conclusion the present invention compared with the existing technology the beneficial effect is that:
The configuration of the present invention is simple, good heat dissipation effect can be effectively ensured the light efficiency of LED light, prolong its service life.
Detailed description of the invention
Fig. 1 is stereoscopic schematic diagram of the invention；
Fig. 2 is diagrammatic cross-section of the invention；
Fig. 3 is the schematic diagram of oil cooling service pipe of the present invention and radiator assembly.
Specific embodiment
The invention will be further described with specific embodiment for explanation with reference to the accompanying drawing:
A kind of LED light of high efficiency and heat radiation as shown in Figures 1 to 3, including lamp housing 1 are equipped with installation base plate on the lamp housing 1
2, it is equipped with groove 3 in the installation base plate 2, the mounting hole 4 through installation base plate 2 is equipped in 3 bottom of groove, described
It is equipped with LED chip component 5 in mounting hole 4, the heat conductive graphite piece 6 that can close the groove 3 is equipped in 3 opening of groove,
It is filled with cooling oil 7 in the cavity that the groove 3 is surrounded with heat conductive graphite piece 6, radiator 8 is equipped in the lamp housing 1,
Oil cooling service pipe 9 is equipped in the radiator 8, the both ends of the oil cooling service pipe 9 are connected to constitute primary Ioops with cavity, in institute
Oil cooling service pipe 9 is stated equipped with oil pump 10, exhaust mounting hole 4 is equipped on the lamp housing 1, is equipped in the exhaust mounting hole 4
It is vented fan device 11.
The cooling oil in heat and groove 3 generated in 5 course of work of LED chip component in the present invention quickly carries out hot friendship
It changes, heat conductive graphite piece 6 is provided on the outside of groove 3, the heat in cooling oil is by heat conductive graphite piece 6, by being vented fan device
11 effect is discharged into the external world；Cooling oil is under the driving of oil pump 10, and in 9 internal circulation flow of oil cooling service pipe, oil cooling service pipe 9 is arranged
In radiator 8, since the pipeline of oil cooling service pipe 9 is relatively long, when the heat in cyclic process in cooling oil can have enough
Between be transmitted on radiator 8, in the effect of exhaust fan device 11, the heat that radiator 8 distributes can effectively be discharged into the external world.Heat dissipation
Effect is good, and the light efficiency of LED light can be effectively ensured, and postpones service life.
Exhaust fan device 11 is respectively equipped in the present invention on the lamp housing 1 opposite end along its length.
Radiator 8 is respectively equipped on the lamp housing 1 two sides along its length in the present invention.
Temp probe 13 is equipped in the present invention in the groove 3, controller 14, the temperature are equipped in the lamp housing 1
Degree probe 13, exhaust fan device 11, oil pump 10 are connected with controller 14 respectively.When temp probe 13 detects in use process
When cooling oil temperature is more than predetermined value in groove 3, controller 14 issues control signal to exhaust fan device 11, oil pump 10, makes to arrange
Gas fan device 11, oil pump 10 work, to guarantee the heat dissipation of LED light.
Heretofore described radiator 8 includes radiator body 81, in 81 inner vertical of radiator body in lamp
Shell length direction is arranged at intervals with several radiating fins 82, and the oil cooling service pipe 9 runs through the radiating fin along 1 length direction of lamp housing
Piece 82.The heat exchanger time of oil cooling service pipe 9 and radiating fin 82 of the present invention in order to further increase, the oil cooling service pipe 9 are dissipating
Detour runs through on hot fin 82, and the oil cooling service pipe 9 in the radiator 8 of the two sides of lamp housing 1 along its length constitutes primary Ioops.
Heretofore described LED chip component 5 includes aluminum substrate 51, is welded with LED on described 51 one end of aluminum substrate
Chip 52,51 other end of aluminum substrate are arranged in groove 3.
It includes cylinder-shaped mounting base 111 that fan device 11 is vented in the present invention, on 111 outer wall of the cylinder-shaped mounting base
Equipped with several slots 112 of breathing freely, it is equipped with motor mount 113 on 111 one end of the cylinder-shaped mounting base, in the motor
Mounting base 113 is equipped with motor 114, and Vane wheel 115 is equipped on the motor shaft of the motor 114.
Thermal dispersant coatings are respectively equipped on 9 outer wall of the radiator 8 and oil cooling service pipe in the present invention.
It is further described below by way of composition of the specific embodiment to thermal dispersant coatings of the invention: embodiment 1
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 50 parts by weight of methyltriethoxysilane are taken, are added in 650- parts of water, the Catalyzed by Formic Acid of 0.05 parts by weight is added
Agent hydrolyzes 1 hour at 0 DEG C, is warming up to 70 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon
Resin；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 10 parts by weight, titanate catalyst 0.2
Parts by weight and 12 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 110 DEG C of dehydration condensations 1 hour,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 80 DEG C, 3 parts of silester is added and react 1 hour, reaction knot
Cool down after beam, vacuum distillation removes solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.02% carbon nanotube, 10% Nickel Aluminium Alloy Powder,
2% silver powder, 20% gallium nitride and 67.98% aluminium nitride composition.Wherein the carbon nanotube is handled by following methods:
Carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaning is to neutrality after 80 DEG C of acidification 2h
And it is dried in vacuo.
The auxiliary agent is 270 polyether silicone of wetting agent Digao.
Embodiment 2
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 80 parts by weight of methyltriethoxysilane are taken, are added in 950 parts of water, the Catalyzed by Formic Acid agent of 0.4 parts by weight is added,
It hydrolyzes 5 hours at 5 DEG C, is warming up to 90 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon tree
Rouge；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 20 parts by weight, titanate catalyst 0.8
Parts by weight and 22 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 120 DEG C of dehydration condensations 3 hours,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 90 DEG C, 12 parts of silester is added and react 2 hours, reaction
After cool down, vacuum distillation remove solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.2% carbon nanotube, 30% Nickel Aluminium Alloy Powder,
1.8% silver powder, 20% gallium nitride and 48% aluminium nitride composition.Wherein the carbon nanotube is handled by following methods:
Carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaning is to neutrality after 80 DEG C of acidification 2h
And it is dried in vacuo.
Wherein auxiliary agent described in 4 parts by weight includes 0.2 parts by weight wetting agent, 1 parts per weight dispersing agent, 2.8 parts by weight film forming
Auxiliary agent.The wetting agent is 270 polyether silicone of Digao, and the dispersing agent is BYK-190 dispersing agent, and the coalescing agent is
Lauryl Alcohol ester.
Embodiment 3
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 65 parts by weight of methyltriethoxysilane are taken, are added in 800 parts of water, the Catalyzed by Formic Acid agent of 0.2 parts by weight is added,
It is hydrolyzed 2 hours at 2 DEG C, is warming up to 80 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon tree
Rouge；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 15 parts by weight, titanate catalyst 0.5
Parts by weight and 16 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 115 DEG C of dehydration condensations 2 hours,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 85 DEG C, 5 parts of silester is added and react 1.5 hours, reaction
After cool down, vacuum distillation remove solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.1% carbon nanotube, 20% Nickel Aluminium Alloy Powder,
1% silver powder, 15% gallium nitride and 63.9% aluminium nitride composition.Wherein the carbon nanotube is handled by following methods:
Carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaning is to neutrality after 80 DEG C of acidification 2h
And it is dried in vacuo.
Wherein auxiliary agent described in 2 parts by weight includes 0.2 parts by weight wetting agent, 0.3 parts per weight dispersing agent, 1 parts by weight film forming
Auxiliary agent, 0.1 parts by weight defoaming agent, 0.4 parts by weight rheological agent.The wetting agent is 270 polyether silicone of Digao, the dispersion
Agent is BYK-190 dispersing agent, and the coalescing agent is Lauryl Alcohol ester, and the defoaming agent is BYK-014 defoaming agent, the rheology
Agent is 450 levelling agent of Digao.
Embodiment 4
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 50 parts by weight of methyltriethoxysilane are taken, are added in 950 parts of water, the Catalyzed by Formic Acid of 0.05 parts by weight is added
Agent hydrolyzes 1 hour at 0 DEG C, is warming up to 90 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon
Resin；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 10 parts by weight, titanate catalyst 0.2
Parts by weight and 15 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 110 DEG C of dehydration condensations 1 hour,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 80 DEG C, 3 parts of silester is added and react 1 hour, reaction knot
Cool down after beam, vacuum distillation removes solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.05% carbon nanotube, 30% Nickel Aluminium Alloy Powder,
0.55% silver powder, 10% gallium nitride and 59.4% aluminium nitride composition.Wherein the carbon nanotube is by following methods
Reason: carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaned after 80 DEG C of acidification 2h to
Neutrality is simultaneously dried in vacuo.
Wherein auxiliary agent described in 0.2 parts by weight is 0.05 wetting agent, 0.15 coalescing agent.The wetting agent is Digao
270 polyether silicones, the coalescing agent are Lauryl Alcohol ester.
Embodiment 5
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 60 parts by weight of methyltriethoxysilane are taken, are added in 700 parts of water, the Catalyzed by Formic Acid agent of 0.1 parts by weight is added,
It is hydrolyzed 2 hours at 1 DEG C, is warming up to 75 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon tree
Rouge；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 18 parts by weight, titanate catalyst 0.3
Parts by weight and 14 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 115 DEG C of dehydration condensations 2 hours,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 85 DEG C, 6 parts of silester is added and react 1.5 hours, reaction
After cool down, vacuum distillation remove solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.15% carbon nanotube, 30% Nickel Aluminium Alloy Powder,
0.5% silver powder, 5% gallium nitride and 64.35% aluminium nitride composition.Wherein the carbon nanotube is by following methods
Reason: carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaned after 80 DEG C of acidification 2h to
Neutrality is simultaneously dried in vacuo.
Wherein auxiliary agent described in 4 parts by weight be include 0.1 parts by weight wetting agent, 0.2 parts per weight dispersing agent, 2 parts by weight at
Film auxiliary agent, 0.3 parts by weight defoaming agent and 1.4 parts by weight rheological agents.The wetting agent is 270 polyether silicone of Digao, described
Dispersing agent is BYK-190 dispersing agent, and the coalescing agent is Lauryl Alcohol ester, and the defoaming agent is BYK-014 defoaming agent, described
Rheological agent is 450 levelling agent of Digao.
The anticorrosive packing is trbasic zinc phosphate.
Embodiment 6
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 70 parts by weight of methyltriethoxysilane are taken, are added in 800 parts of water, the Catalyzed by Formic Acid agent of 0.3 parts by weight is added,
It is hydrolyzed 3 hours at 3 DEG C, is warming up to 80 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon tree
Rouge；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 13 parts by weight, titanate catalyst 0.4
Parts by weight and 20 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 110 DEG C of dehydration condensations 1 hour,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 80 DEG C, 3 parts of silester is added and react 1 hour, reaction knot
Cool down after beam, vacuum distillation removes solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.2% carbon nanotube, 25% Nickel Aluminium Alloy Powder,
1% silver powder, 16% gallium nitride and 57.8% aluminium nitride composition.Wherein the carbon nanotube is handled by following methods:
Carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaning is to neutrality after 80 DEG C of acidification 2h
And it is dried in vacuo.
Wherein auxiliary agent described in 0.2 parts by weight is 0.1 parts by weight wetting agent, 0.1 parts per weight dispersing agent.The wetting agent
For 270 polyether silicone of Digao, the dispersing agent is BYK-190 dispersing agent.
The anticorrosive packing is the mixture of trbasic zinc phosphate, modified zinc phosphate.
Embodiment 7
Thermal dispersant coatings of the present invention include following components by weight:
Thermal dispersant coatings of the present invention are prepared by the following method, and are included the following steps:
A, by water-based acrylic resin, polycarbonate waterborne polyurethane, the organic siliconresin comprising modified Nano particle,
Silica solution and water are mixed evenly；
B, heat filling, auxiliary agent are added while stirring, stirs evenly, resulting dispersion system；
C, the dispersion in step B is added in paint grinder mill and is ground to 30-50 μm, ultrasonic disperse is uniform.
Wherein the polycarbonate waterborne polyurethane is prepared by the following method:
The polycarbonate glycol of 1000 parts by weight is added in the container of belt stirrer, is warming up to 90 DEG C, vacuum distillation 0.5
Hour, 70 DEG C are cooled to, 280 parts by weight 2 are added, 4- toluene di-isocyanate(TDI) vacuum dehydration 0.5 hour, is passed through nitrogen, adds
400 parts by weight enter isophorone diisocyanate, react 2 hours at 80 DEG C, and the acetone of 75 parts by weight is added, is cooled to 30 DEG C,
The triethylamine neutralization reaction of 85 parts by weight 15 minutes is added, 25 parts by weight N- methyl pyrrole network alkanones are added, react 0.5 at 50 DEG C
Hour, 80 parts by weight butanone and 145 parts by weight 1,4- butanediol are added, react 1 hour, be added 1000 parts by weight of deionized water and
95 parts by weight trifluoroacetic acids are dispersed with stirring uniformly.
Wherein the organic siliconresin comprising modified Nano particle is prepared by the following method:
A, 60 parts by weight of methyltriethoxysilane are taken, are added in 750 parts of water, the Catalyzed by Formic Acid agent of 0.2 parts by weight is added,
It is hydrolyzed 3 hours at 2 DEG C, is warming up to 75 DEG C of progress polymerization reactions, is evaporated under reduced pressure after reaction, obtains organosilicon tree
Rouge；
B, by organic siliconresin, the 1- Trifluoromethyl-1 in step A, 3 butadiene, 13 parts by weight, titanate catalyst 0.3
Parts by weight and 18 parts by weight of ethyl acetate are uniformly mixed, and under the protection of argon gas, are heated to 120 DEG C of dehydration condensations 3 hours,
Obtain modified organic silicone resin；
C, the modified organic silicone resin in step B is warming up to 90 DEG C, 12 parts of silester is added and react 2 hours, reaction
After cool down, vacuum distillation remove solvent to get the organic siliconresin comprising modified Nano particle.
Heretofore described heat filling by weight percentage by 0.02% carbon nanotube, 28% Nickel Aluminium Alloy Powder,
0.8% silver powder, 15% gallium nitride and 56.18% aluminium nitride composition.Wherein the carbon nanotube is by following methods
Reason: carbon nanotube is added to appropriate, the dense H of volume ratio 3: 12SO4With dense HNO3Nitration mixture in, cleaned after 80 DEG C of acidification 2h to
Neutrality is simultaneously dried in vacuo.
Wherein auxiliary agent described in 2 parts by weight is 0.2 parts by weight wetting agent, 0.1 parts per weight dispersing agent, 1 parts by weight film forming help
Agent, 0.2 parts by weight defoaming agent and 0.5 parts by weight rheological agent.The wetting agent is 270 polyether silicone of Digao, the dispersion
Agent is BYK-190 dispersing agent, and the coalescing agent is Lauryl Alcohol ester, and the defoaming agent is BYK-014 defoaming agent, the rheology
Agent is 450 levelling agent of Digao.
Wherein anticorrosive packing described in 6 parts by weight includes 2 parts by weight of phosphoric acid zinc, 1 part by weight modified trbasic zinc phosphate and 3 parts by weight molybdenums
The mixture of sour zinc.
The heat dissipation performance of thermal dispersant coatings of the present invention is further verified by following tests:
8 pieces of aluminum substrates are taken to mark respectively, plate 1, plate 2, plate 3, plate 4, plate 5, plate 6, plate 7, plate 8；Wherein plate 1 is not coated with heat-radiation coating
Layer, the surface plate 2-8 successively apply the thermal dispersant coatings in 1-7 of the embodiment of the present invention respectively, detect after solidification to its performance；By plate
1 is placed in heating plate to plate 8, is sequentially adjusted in temperature 50 C, 80 DEG C, 100 DEG C, 150 DEG C, 200 DEG C, 250 DEG C, and 300 DEG C, every time
After temperature adjustment, balance is further continued for being heated to next temperature for 60 minutes, records temperature using temperature measurer, the results are shown in Table 1, room temperature 25
℃。
Table 1
| Initial temperature DEG C | 50 | 80 | 100 | 150 | 200 | 250 | 300 |
| Plate 1 balances after sixty minutes | 38 | 65 | 78 | 121 | 155 | 198 | 243 |
| Plate 2 balances after sixty minutes | 26 | 50 | 58 | 83 | 110 | 160 | 201 |
| Plate 3 balances after sixty minutes | 22 | 48 | 56 | 80 | 105 | 149 | 190 |
| Plate 4 balances after sixty minutes | 23 | 45 | 55 | 81 | 103 | 148 | 188 |
| Plate 5 balances after sixty minutes | 20 | 41 | 48 | 76 | 98 | 130 | 175 |
| Plate 6 balances after sixty minutes | 21 | 42 | 49 | 77 | 99 | 132 | 176 |
| Plate 7 balances after sixty minutes | 23 | 49 | 52 | 80 | 100 | 135 | 185 |
| Plate 8 balances after sixty minutes | 24 | 47 | 54 | 81 | 103 | 141 | 188 |
It can clearly show that the aluminium base plate temperature for being coated with thermal dispersant coatings of the present invention is far below from table 1 and be not coated with thermal dispersant coatings
Aluminum substrate, illustrate thermal dispersant coatings of the present invention have good heat dissipation effect.
Thermal dispersant coatings of the present invention combine, proportion is reasonable, good heat dissipation effect；Radiate filler in thermal dispersant coatings formula of the present invention
Composition and ratio is reasonable, the effective heat dissipation area for increasing the film layer to be formed, to make the heat dissipation effect of thermal dispersant coatings of the present invention
It is obviously improved.
Basic principles and main features and advantages of the present invention of the invention have been shown and described above.The skill of the industry
Art personnel it should be appreciated that the present invention is not limited to the above embodiments, the above embodiments and description only describe
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (6)
1. a kind of LED light of high efficiency and heat radiation, including lamp housing (1) are equipped with installation base plate (2) on the lamp housing (1), feature exists
In: equipped with groove (3) in the installation base plate (2), the installation through installation base plate (2) is equipped in the groove (3) bottom
Hole (4) is equipped with LED chip component (5) in the mounting hole (4), described recessed equipped with that can close in the groove (3) opening
The heat conductive graphite piece (6) of slot (3) is filled with cooling oil (7) in the cavity that the groove (3) and heat conductive graphite piece surround,
Radiator (8) are equipped in the lamp housing (1), are equipped with oil cooling service pipe (9) in the radiator (8), the oil cooling service pipe (9)
Both ends are connected to constitute primary Ioops with cavity, oil pump (10) are equipped on the oil cooling service pipe (9), in the lamp housing (1)
It is equipped with exhaust mounting hole (4), exhaust fan device (11) is equipped in the exhaust mounting hole (4), in the lamp housing (1) along length
It spends on the opposite end in direction and is respectively equipped with exhaust fan device (11), divide on the two sides of the lamp housing (1) along its length
Not She You radiator (8), the radiator (8) includes radiator body (81), is hung down on the inside of the radiator body (81)
It is directly arranged at intervals with several radiating fins (82) in lamp housing length direction, the oil cooling service pipe (9) is passed through along lamp housing (1) length direction
Wear the radiating fin (82).
2. a kind of LED light of high efficiency and heat radiation according to claim 1, it is characterised in that be equipped with temperature in the groove (3)
Degree probe (13) is equipped with controller (14) in the lamp housing (1), the temp probe (13), exhaust fan device (11), oil pump
It is connected respectively with controller (14).
3. a kind of LED light of high efficiency and heat radiation according to claim 1, it is characterised in that the LED chip component (5) includes
There are aluminum substrate (51), is welded with LED chip (52) on the aluminum substrate (51) one end, aluminum substrate (51) other end setting
In groove (3).
4. a kind of LED light of high efficiency and heat radiation according to claim 1, it is characterised in that exhaust fan device (11) includes circle
Tubular mounting base (111) is equipped with several ventilative slot (112) on described cylinder-shaped mounting base (111) outer wall, in the circle
Tubular mounting base (111) one end is equipped with motor mount (113), and motor is equipped on the motor mount (113)
(114), Vane wheel (115) are equipped on the motor shaft of the motor (114).
5. a kind of LED light of high efficiency and heat radiation according to claim 1, it is characterised in that in the radiator (8) and cooling
Thermal dispersant coatings are respectively equipped on oil pipe (9) outer wall.
6. a kind of LED light of high efficiency and heat radiation according to claim 5, it is characterised in that the thermal dispersant coatings, by weight
Including following components:
Water-based acrylic resin 10-35
Polycarbonate waterborne polyurethane 5-10
Organic siliconresin 8-12 comprising modified Nano particle
Silica solution 3-10
Heat filling 10-25
Water 25-50
Auxiliary agent 0.2-4.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401295A (en) * | 2011-11-18 | 2012-04-04 | 林勇 | Water-cooled radiating light emitting diode (LED) street lamp |
| CN105043150A (en) * | 2015-08-28 | 2015-11-11 | 中山市绿涛电子科技有限公司 | An expandable radiator |
| CN205372479U (en) * | 2015-11-27 | 2016-07-06 | 重庆众恒电器有限公司 | Heat radiator for large -scale LED lamp |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7755901B2 (en) * | 2008-01-08 | 2010-07-13 | Asia Vital Components Co., Ltd. | Heat dissipating structure for light emitting diodes |
| TW201413163A (en) * | 2012-09-18 | 2014-04-01 | Cpumate Inc | Active heat dissipation LED illumination lamp |
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2016
- 2016-08-03 CN CN201610633909.XA patent/CN106287264B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401295A (en) * | 2011-11-18 | 2012-04-04 | 林勇 | Water-cooled radiating light emitting diode (LED) street lamp |
| CN105043150A (en) * | 2015-08-28 | 2015-11-11 | 中山市绿涛电子科技有限公司 | An expandable radiator |
| CN205372479U (en) * | 2015-11-27 | 2016-07-06 | 重庆众恒电器有限公司 | Heat radiator for large -scale LED lamp |
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Effective date of registration: 20201120 Address after: 239300 No. 188 Tianchuxin Road, Chajian Industrial Park, Tianchang City, Chuzhou City, Anhui Province Patentee after: ANHUI FUSHI PHOTOELECTRIC TECHNOLOGY Co.,Ltd. Address before: 528400 Guangdong City, Zhongshan Province town of Yongxing Road, No. 2, the first layer of the 11 Patentee before: ZHONGSHAN FENGHUA XINING LIGHTING DESIGN Co.,Ltd. |