CN106304661A - A kind of processing technique of wiring board - Google Patents
A kind of processing technique of wiring board Download PDFInfo
- Publication number
- CN106304661A CN106304661A CN201610859848.9A CN201610859848A CN106304661A CN 106304661 A CN106304661 A CN 106304661A CN 201610859848 A CN201610859848 A CN 201610859848A CN 106304661 A CN106304661 A CN 106304661A
- Authority
- CN
- China
- Prior art keywords
- insulated substrate
- line
- virgin rubber
- wiring board
- reduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The processing technique of a kind of wiring board, comprises the following steps: chooses insulated substrate sawing sheet, and holes on this insulated substrate；By the insulated substrate surface-coated also virgin rubber after Drilling operation；Vibration of ultrasonic wave coating is utilized to go back the insulated substrate of virgin rubber；Virgin rubber is gone back in solidification, forms reduction glue-line；Use mechanical machine milling to carve and remove the reduction glue-line of logicalnot circuit part on insulated substrate, form circuit pack；The reduction glue-line forming circuit pack is reduced into layers of copper；Welding resistance processes.The invention have the benefit that will go back virgin rubber is coated on insulated substrate surface；Solidification reduction glue-line；Use mechanical machine milling to carve and remove the reduction glue-line of logicalnot circuit part on insulated substrate, form circuit pack, finally remaining reduction glue-line is reduced into copper, solidify after only needing primary coating also virgin rubber, milling is carved, reduction i.e. can get copper-plated wiring board, relative to conventional machining process flow process, improve working (machining) efficiency, decrease artificial, equipment, the input of environmental protection fund, saved cost.
Description
Technical field
The present invention relates to wiring board techniques field, be specifically related to a kind of more environmentally friendly, simple relative to the making of traditional circuit plate
Processing technology.
Background technology
Wiring board is the fundamental parts that all electronic products are indispensable, is the carrier of all electronic devices and components, the most also
It is information age indispensable necessary, now as the fast development of China's information electronic industries, for printed circuit board (PCB) row
The fast development of industry provides good market environment.
Along with the continuous growth of level of modernization, the electronic product such as electronics, electronic computer, household electrical appliance
Yield also in sustainable growth, provides strong impetus for quickly increasing of wiring board industry, also exacerbates the valency of circuit board simultaneously
Lattice are competed, and each company is because of the reason of price competition, it is impossible to the factor of cost increase is imputed to user, so self can only be leaned on
Factor goes digestion.
Traditional wiring board work flow is, blanking → boring → hole metallization → figure transfer → circuit plating → demoulding
→ etching → deleading/stannum → solder mask → hot air leveling → character → profile (punching/milling) → test-based examinations etc., according to above-mentioned stream
Primary raw material needed for journey had both confirmed printed circuit board (PCB) production includes: copper-clad plate, Copper Foil, prepreg, chemical medicinal liquid, anode
Copper/stannum/nickel, dry film, ink etc., additionally, also need to the wet process sequence in more than up to eight roads, and to wet system in the course of processing
Cleaning after program, also needs to consume electric power energy, noble metal and the basic energy resource such as oil, coal and substantial amounts of manpower simultaneously
Resource so that the production of printed circuit board (PCB) becomes the industry of high pollution, high energy consumption, high cost, therefore manufacture and during,
If the process of garbage is not reaching to environmental protection standard, empty gas and water and surrounding enviroment will be caused serious pollution.
For the problems referred to above, patent CN103596371A discloses the manufacture method of a kind of wiring board, first to insulation base
Plate is holed；Then the insulated substrate cleaning after boring is processed；Utilize location to go back virgin rubber and carry out grout so that hole wall is formed
One location reduction glue-line；Insulated substrate after grout is carried out drying and processing；Location is utilized to go back virgin rubber on described insulated substrate
Printed wiring；Circuit is carried out drying and processing；At described circuit surface and hole wall also native copper, so that circuit surface and hole wall are formed
Conductive copper layer；Wiring board is carried out welding resistance process.The process step of the method is: blanking → boring → grout → drying → printing
Circuit → drying → reduction → welding resistance, utilizes location to go back virgin rubber grout and printed wiring on insulated substrate in the method, then
One layer of copper of reduction on circuit and hole wall, to realize arranging circuit on insulated substrate.Have an advantage in that, by utilizing location reduction
Glue grout and printed wiring, eliminate the water-washing process in traditional handicraft, decreases the wet works processed such as substantial amounts of washing, spray
Sequence, it is to avoid the pollution of water resource, to avoid the process of follow-up environmental protection garbage, decreases pad pasting, para-position, exposure simultaneously
The steps such as development, etching, striping, save artificial, improve working (machining) efficiency；But its shortcoming, virgin rubber is gone back by: resin breast in its location
Liquid 40%-60%, aluminium powder 10%-35%, macromolecule naphtha 1%-15% and silicon dioxide 5%-20% make, because location
Also virgin rubber composition so that location goes back virgin rubber needs 5-10min to carry out drying and processing, and, in procedure of processing, grout and print
It is required to drying and processing after circuit processed, well imagines, use twice drying, extend the production time making circuit board, and
The drying and processing time of 5-10min adds the use of electric energy, also have impact on working (machining) efficiency.
In sum, how to enter one simplify step and ensure that environmental protection, efficient wiring board processing process are mesh
Front those skilled in the art's urgent problem.
Summary of the invention
The deficiency existed for prior art, it is an object of the invention to provide the processing technique of a kind of wiring board, and it reduces
Procedure of processing, improve process velocity, and environmental protection, simple.
For reaching above-mentioned purpose, the present invention is achieved through the following technical solutions.
The processing technique of a kind of wiring board, comprises the following steps:
Step (1): choose insulated substrate sawing sheet, and hole on this insulated substrate；
Step (2): the insulated substrate surface-coated also virgin rubber after processing through step (1)；
Step (3): utilize the insulated substrate of vibration of ultrasonic wave step (2), make to go back virgin rubber uniform fold in insulated substrate surface with
And hole wall；
Step (4): curing schedule (3) go back virgin rubber, make to go back virgin rubber bonding with insulated substrate surface, formed reduction glue-line；
Step (5): using mechanical machine milling to carve the reduction glue-line of logicalnot circuit part on removal step (4) insulated substrate, milling is stayed after carving
Under reduction glue-line, formed circuit pack；
Step (6): the reduction glue-line that step (5) is formed circuit pack is reduced into layers of copper；
Step (7): welding resistance processes.
Preferably, insulated substrate is set to aluminium silicon carbide substrate.
Preferably, going back virgin rubber and be set to the UV light-cured resin solution containing aluminium powder, step (4) uses UV light solid
Gasifying device injects row solidification by ultraviolet lighting.
Preferably, UV light curring unit power is 100～180W/cm, and ultraviolet light irradiation time is 10S～80S.
Preferably, UV light curring unit solidification process arranges argon shield insulated substrate.
Preferably, step (6) reduction step specifically includes: be positioned in copper ion solution by insulated substrate, logical
Cross the aluminum of reduction glue-line in insulated substrate upper surface and hole wall and, as reducing agent, the aluminum of reduction glue-line is converted into copper.
The invention has the beneficial effects as follows:
The first, go back the insulated substrate after virgin rubber coating boring by setting, solidify after utilizing vibration of ultrasonic wave, make to go back virgin rubber with exhausted
Edge substrate surface is bonding forms reduction glue-line, recycle mechanical machine milling carve remove logicalnot circuit part on insulated substrate go back virgin rubber
Layer, is finally reduced into copper by remaining reduction glue-line, it is only necessary to solidify after primary coating also virgin rubber, milling is carved, reduction is the most available
Copper-plated wiring board, relative to conventional machining process flow process, the hole metallization eliminated, heavy copper, pad pasting, exposure imaging, etching,
Striping and the wet operation processed such as washing, spray, improve working (machining) efficiency, decreases artificial, equipment, the input of environmental protection fund, protects
Protect environment；
The second, by being set to the UV light-cured resin solution containing aluminium powder by going back virgin rubber, use UV light curring unit by purple
Outer illumination injects row solidification, only needs 10S～80S, adds work efficiency, improve speed of production hardening time.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, the most in conjunction with the embodiments, to the present invention
Further describe.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to limit
The present invention.
Embodiment one, the processing technique of a kind of wiring board, comprise the following steps:
Step (1): choose insulated substrate sawing sheet, and hole on this insulated substrate；
Wherein, in this step, insulated substrate is set to aluminium silicon carbide substrate, is different from the copper-clad base plate in existing technique, this insulation
Substrate is set to not cover the substrate of copper；
In this step, bore process is identical with existing technique.
Step (2): the insulated substrate surface-coated also virgin rubber after processing through step (1)；
Wherein, this step uses and goes back virgin rubber as printing material, print one layer on the surface of insulated substrate and go back virgin rubber, now one
Partial reduction glue can be attached to insulation board upper surface, and another part also virgin rubber can be because the existence of tension force be attached to insulated substrate
The top holed, forms one layer with this and goes back virgin rubber.
Step (3): utilize the insulated substrate of vibration of ultrasonic wave step (2), makes to go back virgin rubber uniform fold in insulated substrate table
Face and hole wall；
Wherein, in this step, utilize vibration of ultrasonic wave can make reduction glue-line mix homogeneously, and can destroy and be attached to the base that insulate
The tension force of the top reduction glue-line that plate is holed, makes the reduction glue-line above boring be covered in hole wall along hole wall flowing, makes also
Virgin rubber layer uniform fold is in insulated substrate surface and hole wall.
Step (4): curing schedule (3) go back virgin rubber, make to go back virgin rubber bonding with insulated substrate surface, formed reduction glue-line；
Wherein, because going back virgin rubber to be set to the UV light-cured resin solution containing aluminium powder, so, solidification can use UV light curring unit
Row solidification is injected, wherein for ensureing that the UV light-cured resin solution containing aluminium powder is with insulated substrate solidification even by ultraviolet lighting
Connect, when the UV light-cured resin solution containing aluminium powder being solidified using UV light curring unit to be irradiated by ultraviolet light, need
Adjust UV cure lamp power so that it is UV radiancy is in 130mw/cm2, and, adjusting ultraviolet light irradiation time is 40s～60s,
After reaching irradiation time, the UV light-cured resin solution containing aluminium powder can be connected with insulated substrate solidification, and in UV curing process
Argon shield insulated substrate is set, can be to avoid going back virgin rubber surface quilt when the UV light-cured resin containing aluminium powder is solution cured
Oxidation.
Step (5): using mechanical machine milling to carve the reduction glue-line of logicalnot circuit part on removal step (4) insulated substrate, milling is carved
After the reduction glue-line that stays, form circuit pack；
Wherein, in this step, circuit board, by shop bolt and coordinating of positioning hole, is fixed on the work of mechanical machine flat by mechanical machine
On platform, by mechanical machine is inputted mechanical figure, mechanical machine by automatically exchanging corresponding cutter for, and can regulate cutter deeply to line
Road plate milling is carved, and peels off the reduction glue-line of logicalnot circuit part so that the reduction glue-line stayed forms circuit pack.
Step (6): the reduction glue-line that step (5) is formed circuit pack is reduced into layers of copper；
Wherein, in this step, insulated substrate is positioned in straight feeding machine, straight feeding machine has copper ion solution and holds
Region, when the reduction glue-line of insulated substrate is held in region by copper ion solution, because in insulated substrate surface and hole wall
The aluminum of reduction glue-line can be as reducing agent so that copper ion and aluminum generation displacement reaction, aluminium reducing is become copper, is i.e. going back virgin rubber
The surface reduction of layer becomes one layer of layers of copper, and this layers of copper is conductive copper.
Step (7): welding resistance processes.
Embodiment two, is with the difference of embodiment one, in the present embodiment:
In step (4): for ensureing that the UV light-cured resin solution containing aluminium powder is connected with insulated substrate solidification, using UV light
Solidification equipment is irradiated by ultraviolet light when solidifying the UV light-cured resin solution containing aluminium powder, need to adjust UV cure lamp merit
Rate so that it is UV radiancy is in 100mw/cm2, and, adjusting ultraviolet light irradiation time is 60s～80s, after reaching irradiation time
UV light-cured resin solution containing aluminium powder can be connected with insulated substrate solidification；
Remaining content is identical with embodiment one, therefore repeats no more.
Embodiment three, is with the difference of embodiment one, in the present embodiment:
In step (4): for ensureing that the UV light-cured resin solution containing aluminium powder is connected with insulated substrate solidification, using UV light
Solidification equipment is irradiated by ultraviolet light when solidifying the UV light-cured resin solution containing aluminium powder, need to adjust UV cure lamp merit
Rate so that it is UV radiancy is in 180mw/cm2, and, adjusting ultraviolet light irradiation time is 10S～40S, after reaching irradiation time
UV light-cured resin solution containing aluminium powder can be connected with insulated substrate solidification；
Remaining content is identical with embodiment one, therefore repeats no more.
The processing technique of the copper base circuit board of the present invention is: sawing sheet → boring → printing reduction glue-line → drying → mechanical
→ go back native copper → welding resistance → word print → packaging, in this technique, go back the insulated substrate after virgin rubber coating boring by setting, utilize super
Acoustic wave vibrations and drying, make reduction glue-line bonding with insulated substrate surface, recycles mechanical machine milling and carves, and finally goes back remaining
Virgin rubber layer is reduced into copper, it is only necessary to solidify after primary coating also virgin rubber, milling is carved, reduction i.e. can get copper-plated wiring board, relatively
In conventional machining process flow process, the hole metallization eliminated, heavy copper, pad pasting, exposure imaging, etching, striping and washing, spray
Etc. wet operation processed, improve working (machining) efficiency, decrease artificial, equipment, the input of environmental protection fund, protect environment；And pass through
It is set to the UV light-cured resin solution containing aluminium powder by going back virgin rubber, uses UV light curring unit to inject row by ultraviolet lighting solid
Change, only need 10S～80S, add work efficiency, improve speed of production hardening time.
Above-described embodiment is only that the ultimate principle of the present invention, principal character and advantage have been shown and described.The skill of the industry
The art personnel simply explanation it should be appreciated that the present invention is not restricted to the described embodiments, described in above-described embodiment and description
The principle of the present invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these
Changes and improvements both fall within scope of the claimed invention.
Claims (6)
1. the processing technique of a wiring board, it is characterised in that comprise the following steps:
Step (1): choose insulated substrate sawing sheet, and hole on this insulated substrate；
Step (2): the insulated substrate surface-coated also virgin rubber after processing through step (1)；
Step (3): utilize the insulated substrate of vibration of ultrasonic wave step (2), make to go back virgin rubber uniform fold in insulated substrate surface with
And hole wall；
Step (4): curing schedule (3) go back virgin rubber, make to go back virgin rubber bonding with insulated substrate surface, formed reduction glue-line；
Step (5): using mechanical machine milling to carve the reduction glue-line of logicalnot circuit part on removal step (4) insulated substrate, milling is stayed after carving
Under reduction glue-line, formed circuit pack；
Step (6): the reduction glue-line that step (5) is formed circuit pack is reduced into layers of copper；
Step (7): welding resistance processes.
The processing technique of a kind of wiring board the most according to claim 1, it is characterised in that: described insulated substrate is set to aluminum
Silicon carbide substrate.
The processing technique of a kind of wiring board the most according to claim 1, it is characterised in that go back virgin rubber described in: for containing aluminium powder
UV light-cured resin solution, described step (4) use UV light curring unit by ultraviolet lighting inject row solidify.
The processing technique of a kind of wiring board the most according to claim 3, it is characterised in that: described UV light curring unit power
Being 100～180W/cm, ultraviolet light irradiation time is 10S～80S.
The processing technique of a kind of wiring board the most according to claim 3, it is characterised in that: described UV light curring unit solidifies
During argon shield insulated substrate is set.
The processing technique of a kind of wiring board the most according to claim 1, it is characterised in that: described step (6) reduction step
Specifically include: insulated substrate is positioned in copper ion solution, by reducing glue-line in insulated substrate upper surface and hole wall
The aluminum of reduction glue-line, as reducing agent, is converted into copper by aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610859848.9A CN106304661A (en) | 2016-09-28 | 2016-09-28 | A kind of processing technique of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610859848.9A CN106304661A (en) | 2016-09-28 | 2016-09-28 | A kind of processing technique of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304661A true CN106304661A (en) | 2017-01-04 |
Family
ID=57715832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610859848.9A Pending CN106304661A (en) | 2016-09-28 | 2016-09-28 | A kind of processing technique of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304661A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6776826B1 (en) * | 2001-07-27 | 2004-08-17 | Gbn Technologies, Inc. | Composition and method for electroless plating of non-conductive substrates |
| CN101359601A (en) * | 2008-09-19 | 2009-02-04 | 上海美维科技有限公司 | Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package |
| CN103596371A (en) * | 2013-11-29 | 2014-02-19 | 丁保美 | Method for manufacturing circuit board |
| CN103596372A (en) * | 2013-11-29 | 2014-02-19 | 丁保美 | PCB ultrasonic hole-filling method |
| CN104010446A (en) * | 2014-05-30 | 2014-08-27 | 西安工程大学 | Method and device for preparing flexible conductive circuit by droplet spraying and chemical deposition technology |
| CN104349585A (en) * | 2013-08-01 | 2015-02-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
-
2016
- 2016-09-28 CN CN201610859848.9A patent/CN106304661A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6776826B1 (en) * | 2001-07-27 | 2004-08-17 | Gbn Technologies, Inc. | Composition and method for electroless plating of non-conductive substrates |
| CN101359601A (en) * | 2008-09-19 | 2009-02-04 | 上海美维科技有限公司 | Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package |
| CN104349585A (en) * | 2013-08-01 | 2015-02-11 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN103596371A (en) * | 2013-11-29 | 2014-02-19 | 丁保美 | Method for manufacturing circuit board |
| CN103596372A (en) * | 2013-11-29 | 2014-02-19 | 丁保美 | PCB ultrasonic hole-filling method |
| CN104010446A (en) * | 2014-05-30 | 2014-08-27 | 西安工程大学 | Method and device for preparing flexible conductive circuit by droplet spraying and chemical deposition technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104411122B (en) | A kind of 3D printing method of multi-layer flexible circuit board | |
| CN102300414B (en) | Addition preparation method of printed circuit | |
| CN101951727B (en) | A kind of production method of circuit board electroplating board edge | |
| CN103781285B (en) | The making of ceramic base plate surface conducting wire and restorative procedure | |
| CN101951728A (en) | A production method of hard circuit board instead of flexible circuit board | |
| CN104105353B (en) | A kind of manufacturing method of high-precision ceramic circuit board | |
| CN102612269B (en) | All-printed circuit board | |
| CN107846790A (en) | The preparation method of multi-layer flexible circuit board | |
| CN101146407A (en) | Graph transfer shaping technology for carrier board circuit of printed circuit board | |
| CN103491710A (en) | Process for processing two-sided and multilayer circuit board | |
| CN102933036B (en) | Method for producing circuit board | |
| CN102065651A (en) | Production method of high-density laminated printed circuit board of high-frequency material | |
| CN104320909B (en) | Ladder copper circuit board high and preparation method thereof | |
| CN103929890B (en) | Method for manufacturing inner layer circuit of circuit board | |
| CN102905472A (en) | Method for manufacturing conducting circuits and conducting circuit board | |
| CN107993833A (en) | A kind of high charge rate FPC flexibilities wireless charging transmission coil manufacture craft | |
| CN110169210A (en) | It is integrated using the IC wafer of catalysis layered product or adhesive | |
| CN101699931A (en) | Production method of high-thermal-conductivity ceramic circuit board | |
| CN109769350A (en) | A kind of single-sided circuit board and preparation method of thermally conductive insulating adhesive film | |
| CN102833941B (en) | A kind of Novel slide and preparation method thereof | |
| CN108040438A (en) | A kind of manufacture craft of circuit board metallization half bore | |
| CN105131897B (en) | High heat conductive insulating Adhesive composition, high thermal conductivity aluminum matrix plate and its preparation technology | |
| CN105517359A (en) | A production process for improving the utilization rate of copper substrate | |
| CN101699932A (en) | Production method of high-thermal-conductivity ceramic circuit board | |
| CN106851994A (en) | A kind of preparation method of high heat-conducting ceramic printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
|
| RJ01 | Rejection of invention patent application after publication |