CN109769350A - A kind of single-sided circuit board and preparation method of thermally conductive insulating adhesive film - Google Patents
A kind of single-sided circuit board and preparation method of thermally conductive insulating adhesive film Download PDFInfo
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- CN109769350A CN109769350A CN201910195285.1A CN201910195285A CN109769350A CN 109769350 A CN109769350 A CN 109769350A CN 201910195285 A CN201910195285 A CN 201910195285A CN 109769350 A CN109769350 A CN 109769350A
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- circuit board
- copper foil
- conductive insulating
- sided circuit
- thermally conductive
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000002313 adhesive film Substances 0.000 title claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000011889 copper foil Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 39
- 239000000843 powder Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 238000010330 laser marking Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- -1 polysiloxane Polymers 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 238000003490 calendering Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000003085 diluting agent Substances 0.000 claims description 4
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 claims description 3
- HZEOUPCNUWSUFL-UHFFFAOYSA-N 4,5,5-trimethyl-4-pentan-3-yl-1H-imidazole Chemical compound C(C)C(C1(N=CNC1(C)C)C)CC HZEOUPCNUWSUFL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000003756 stirring Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 239000004411 aluminium Substances 0.000 abstract description 9
- 238000005530 etching Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 5
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- 238000003698 laser cutting Methods 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 238000003486 chemical etching Methods 0.000 abstract description 2
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 2
- 238000011161 development Methods 0.000 abstract description 2
- 230000036541 health Effects 0.000 abstract description 2
- 238000000053 physical method Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 30
- 230000008569 process Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
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- 238000003786 synthesis reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
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- 239000005416 organic matter Substances 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses the preparation method of a kind of one-sided circuit board and heat conductive insulating glue film, include the following steps: that S1. cuts line pattern on copper foil；S2 overlay film on metallic substrates；S3. copper foil circuit figure obtained in S1 is posted in S2 on precoated metal substrate obtained；S4. after the completion of being posted, hot baking processing is carried out, solidification is completed, obtains one-sided circuit board.The present invention not only reduces many and diverse production process of copper-clad plate, while aluminium sheet does not need to aoxidize, and protects environment, solves the pain spot of industry, promote industry environmentally protective.The invention avoids corrode in etching liquid, no longer circuit is formed with chemical etching, pure physical method, without chemical reagent, non-environmental-pollution, copper foil can recycle after laser cutting, utilize again, production cost is saved, provides new production method while providing the working environment of health for staff for the Green Development of industry.
Description
Technical field
The present invention relates to wiring board preparation fields, and in particular to the preparation side of a kind of one-sided circuit board and heat conductive insulating glue film
Method.
Background technique
It needs to portray circuit using copper foil on the space of a whole page of printed circuit board, therefore, copper foil is widely used in printed circuit board and answers
With field, but now, mainstream is still deduction method, wherein removing extra part using copper foil and by etching to form electricity
The existing technology of preparing of circuit on the plate of road:
Method one:
Step 1: production copper-clad plate
1. applying one layer of heat conductive insulating glue film on the metal substrate of oxidation
(oxygroup processing: main function is that layer protecting film is formed on aluminium face, is passivated aluminium face, increases pressing binding force)
2. applying one layer of copper foil on insulating substrate, copper-clad plate or laminate are formed by hot pressing.
(pressing: temperature rise rate controls within the scope of the C/min of 2 C/min ~ 2.5, and different press equipments can assign material temperature line
The temperature profile of monitoring material temperature line passback makes fine tuning)
Step 2: etching method forms circuit
1 prints out the first displacement ink traces layer using displacement ink；
2. copper-clad plate is immersed in acid copper ions solution or acid copper plating mortise liquid, the first displacement ink from above
The first thin copper layer is displaced on line layer；
3. the electro-coppering on first thin copper layer, to form the first copper wire layer, the temperature of the baking-curing is
60~160 DEG C, the time is 50~90 minutes, and the acid copper ions solution is the copper ion for being 1~100g/l containing concentration
Acid solution.
Method two: such as disclosure of the invention patent (108323025 A of publication number CN)
Step 1: placing copper foil: copper foil be placed on carrier, and compound using stickum progress；
Step 2: laser cutting: copper foil is cut by laser according to the circuit diagram pattern of circuit board；
Step 3: selective detachment: photoresists are coated on aluminum substrate, and place the exposure mask with circuit diagram, according to circuit diagram
Pattern selective exposure is carried out to aluminum substrate, so that the inverter circuit part of circuit diagram is lost viscosity；
Step 4: the preparation of printed circuit board: the copper foil being placed on carrier and aluminum substrate are carried out accurately using alignment device
Contraposition is completely coincident the circuit diagram of the two, and the copper foil of circuit part bonds completely with aluminum substrate, and to the copper of inverter circuit part
Foil is removed, the printed circuit board needed.
Step 5: baking toasts the printed circuit board that step 4 obtains, solidifies photoresists.
In the prior art, the manufacturing process for the wide wiring board of LED thick line is lost on aluminum-based copper-clad plate using subtractive process
Carve circuit, subtractive process, which prepares thick line wide wiring board production process, tens procedures, and every procedure has a chemical substance, copper,
Organic matter, ammonia nitrogen, acid, alkali etc. can enter waste water, and this method is that energy consumption is big, big with water, and there are complex process, and environmental pollution is serious
Etc. technical problems.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of one-sided circuit board and heat conductive insulating glue films
Preparation method.The wide metal base circuit board of thick line is prepared using a kind of addition process, good pressure is had based on heat conductive insulating medium glue film
Quick property, good initial bonding strength, and solidification after and metal have good adhesion strength, using laser or cross cutting copper foil institute is made
Line pattern is needed, is shifted on copper foil circuit figure to heat conductive insulating medium glue film by sucker, with leading for copper foil circuit figure
The hot compress of thermal insulation medium glue film on metallic substrates, finally by substrate in drying tunnel baking-curing, be just prepared into for LED thick line
Wide wiring board, this simple process, waste copper foil recycling is simple, and production efficiency is current 10 times, save the cost, non-environmental-pollution,
The process for solving the environmental problem of industry and falling behind, it will extension applies to the wide wiring board art of various thick lines.
The purpose of the present invention is achieved through the following technical solutions: a kind of preparation method of one-sided circuit board, including
Following steps:
S1. line pattern is cut on copper foil；
S2 overlay film on metallic substrates；
S3. copper foil circuit figure obtained in S1 is posted in S2 on precoated metal substrate obtained；
S4. after the completion of being posted, hot baking processing is carried out, solidification is completed, obtains one-sided circuit board.
Preferably, in the S1, line pattern needed for being cut directly on copper foil using laser marking machine or die-cutting machine.
Laser cutting or cross cutting circuit diagram process are simple, and inverter circuit part copper foil can be with recycling and reusing.Meanwhile using laser marking
Machine or die-cutting machine cut required line pattern directly on copper foil, break conventional method, avoid etched circuit, not only avoid work
Personnel work in toxic environment, while avoiding pollution environment and complicated process, save the money such as water, electricity in etching process
Source.
Preferably, in the S1, the line width route for the copper foil circuit figure prepared is greater than 0.8mm.
Preferably, in the S2, the direct hot compress heat conductive insulating glue film on metal substrate sheet, and heat conductive insulating glue film with
The adhesion strength of metal substrate reaches 0.6N/mm or more；The metal substrate sheet uses non-oxide aluminium sheet.Simplify the system of copper-clad plate
Standby technique, copper-clad plate prepares metal aluminum sheet oxidation stain environment, while process is less, saves cost.
Preferably, in the S2, pass through the direct hot compress heat conductive insulating glue film of laminating machine, laminating machine on metal substrate sheet
Temperature is 60-70 DEG C, temperature 3min.
Preferably, in the S3, copper foil circuit figure obtained in S1 is posted with vacuum chuck heat conductive insulating
On the metal substrate of glue film, adhesion strength reaches 0.5N/mm or more.
Preferably, it in the S4, after completion circuit is posted, is put into 160-190 DEG C of drying tunnel and is toasted, complete solid
Change.Less curing process, is directly toasted in drying tunnel, and 5-8min is only needed.
A kind of preparation method of heat conductive insulating glue film, includes the following steps:
Step 1. is raw material using 1,2- epoxy -4- vinyl cyclohexane and end hydrogen silicone oil, and platinum complex is catalyst, synthesis
Polysiloxanes epoxy resin；
AlN powder is added in coupling agent dilution and dries after mixing evenly by step 2., obtains Modification on Al N powder；
Step 3. will be made in epoxy active diluent AGE, polysiloxanes epoxy resin, curing agent, promotor and step 2
Modification on Al N powder be uniformly mixed, obtain glue；
Step 4. carries out extrusion calendaring molding to glue obtained in step 3 using extrusion calendaring machine, finally obtains heat conductive insulating
Glue film.
Preferably, in step 3, curing agent selects dicyandiamide, and the promotor selects diethyl tetramethyl imidazoles.
The beneficial effects of the present invention are:
1. the present invention not only reduces many and diverse production process of copper-clad plate, while aluminium sheet does not need to aoxidize, and protects environment, solves
The pain spot of industry promotes industry environmentally protective.
2. the invention avoids corroding in etching liquid, circuit no longer is formed with chemical etching, pure physical method,
Without chemical reagent, non-environmental-pollution, copper foil can be recycled after laser cutting, utilized again, saved production cost, for the people that works
New production method is provided while member provides the working environment of health for the Green Development of industry.
3. the present invention avoids stripper circuit, the technology that there is now coats photoresists on aluminum substrate, and placing has circuit diagram
Exposure mask carries out selective exposure to aluminum substrate according to the pattern of circuit diagram, so that the inverter circuit part of circuit diagram is lost viscosity, this work
Sequence coats photoresists meeting generation environment pollution, while placing cover film and carrying out selective exposure-processed, complex procedures again, it is difficult to high
The industrialized production of efficiency；The present invention is directly posted deposited insulating film using high-precision sucker using circuit is laser-cut into
On plate, process is simple, can a large amount of, industrialized production, greatly improve working efficiency.
4. not only reducing production cost, while meeting the developmental principle to economize on resources, uses more simple production
Technique, it will be able to obtain circuit board, reduce Production Time and human cost.
5. the method for preparing wiring board of the invention can continuous work, rather than to existing engraving method and apply sense
Optical cement exposes selective exposure method and goes to complete step by step；Continuous production reduces processing cost without more exchange device, breaks
The technical barrier of the industry.
Specific embodiment
Technical solution of the present invention is detailed further below, but protection scope of the present invention is not limited to following institute
It states.
A kind of preparation method of one-sided circuit board, includes the following steps:
S1. line pattern needed for being cut directly on copper foil using laser marking machine or die-cutting machine；Wherein, copper foil circuit figure
Line width route be greater than 0.8mm.
A. laser marking machine patterning method: required circuitous pattern is drawn on computers, is cut using laser marking machine, in laser
High-precision sucker is put on table top, the complete circuit being cut into batches is directly on sucker.
B. die-cutting machine patterning method: according to circuit diagram needs, custom mold knife is cut using die-cutting machine, can be directly cut to
Required circuit diagram.
S2 passes through the direct hot compress heat conductive insulating glue film of laminating machine, and heat conductive insulating glue film and Metal Substrate on metal substrate sheet
The adhesion strength of plate reaches 0.6N/mm or more；Wherein, laminating machine temperature is 60-70 DEG C, temperature 3min.Metal substrate sheet uses
Non-oxide aluminium sheet, i.e., by the hot compress of heat conductive insulating glue film on unoxidized aluminium sheet.
The preparation method of heat conductive insulating glue film, includes the following steps:
Step 1. is raw material using 1,2- epoxy -4- vinyl cyclohexane and end hydrogen silicone oil, and platinum complex is catalyst, synthesis
Polysiloxanes epoxy resin；
AlN powder is added in coupling agent dilution and dries after mixing evenly by step 2., obtains Modification on Al N powder；
Step 3. is by epoxy active diluent AGE, polysiloxanes epoxy resin, dicyandiamide, diethyl tetramethyl imidazoles and step
Modification on Al N powder obtained is uniformly mixed in rapid 2, obtains glue；
Step 4. carries out extrusion calendaring molding to glue obtained in step 3 using extrusion calendaring machine, finally obtains heat conductive insulating
Glue film.
The heat conductive insulating glue film of preparation has preferable heat-resisting quantity, and pressure-sensitive is good, fine heat radiation property, and adhesion strength is high,
The good excellent properties such as insulating properties.
S3. copper foil circuit figure obtained in S1 is posted with vacuum chuck in the metal substrate for having heat conductive insulating glue film
On, adhesion strength reaches 0.5N/mm or more；
Specifically, the circuit being cut into S1 has been undertaken on vacuum chuck, meanwhile, the thermal conductive insulation glue of hot compress in S2
Film has pressure-sensitive, and the circuit diagram automation on sucker is directly quickly posted on the applying film plate in S2, because just by initial bonding strength
Glue film of the hot compress on aluminium sheet is tightly attached on aluminium sheet on one side, and there is another side initial bonding strength ensure that copper foil circuit is posted by sucker
On it, it does not fall out, sucker quickly carries out next circuit and is posted, and the initial bonding strength of film can be according to the process system tune of S2
Section, fast and easy work.
S4. it after the completion of being posted, is put into 170 DEG C of drying tunnels and carries out hot baking processing, complete solidification, obtain one-sided circuit board.
Heat baking is on the one hand in order to which circuit can be tightly attached on heat conductive insulating glue film, on another aspect tin soldering liquid welding circuit
Electric elements, because of 170-190 DEG C of temperature of tin soldering liquid general work, 6-8min, Yao Jinhang large-scale industrial production, using baking
Road is toasted, and temperature is regulated and is directly toasted, and tin soldering liquid is avoided to solidify, and has solidified glue film in this process.
One-sided circuit board obtained in the present embodiment is tested for the property, test result is breakdown voltage 2.5KV, removing
Intensity: 1.1N/mm, resistance to dip solderability: 11min meets the wide wiring board processability requirement of thick line.The present embodiment prepares circuit board
Time relative to existing etching method, painting photoresists, covers film exposure method and shortens 40% or more, production cost reduces 30%
More than, human cost reduces 35% or more, while avoiding the infringement for the noxious material that work man-hour is faced.
The above is only a preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form should not be regarded as an exclusion of other examples, and can be used for other combinations, modifications, and environments, and can be at this
In the text contemplated scope, modifications can be made through the above teachings or related fields of technology or knowledge.And those skilled in the art institute into
Capable modifications and changes do not depart from the spirit and scope of the present invention, then all should be in the protection scope of appended claims of the present invention
It is interior.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910195285.1A CN109769350A (en) | 2019-03-14 | 2019-03-14 | A kind of single-sided circuit board and preparation method of thermally conductive insulating adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910195285.1A CN109769350A (en) | 2019-03-14 | 2019-03-14 | A kind of single-sided circuit board and preparation method of thermally conductive insulating adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109769350A true CN109769350A (en) | 2019-05-17 |
Family
ID=66458369
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910195285.1A Pending CN109769350A (en) | 2019-03-14 | 2019-03-14 | A kind of single-sided circuit board and preparation method of thermally conductive insulating adhesive film |
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Cited By (4)
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| CN112312663A (en) * | 2020-10-26 | 2021-02-02 | 广东合通建业科技股份有限公司 | High-precision and high-density circuit board production process |
| CN114449776A (en) * | 2022-01-25 | 2022-05-06 | 铜川光速芯材科技有限公司 | Metal-based circuit board and preparation method thereof |
| CN114516204A (en) * | 2022-01-25 | 2022-05-20 | 铜川光速芯材科技有限公司 | LED transparent circuit board and preparation method thereof |
| CN118413943A (en) * | 2024-05-28 | 2024-07-30 | 深圳市基石新材料技术有限公司 | Preparation method of thick copper circuit board |
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| CN114449776B (en) * | 2022-01-25 | 2024-08-06 | 铜川光速芯材科技有限公司 | Metal-based circuit board and preparation method thereof |
| CN114516204B (en) * | 2022-01-25 | 2024-11-15 | 铜川光速芯材科技有限公司 | A kind of LED transparent circuit board and preparation method thereof |
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Effective date of registration: 20210518 Address after: Room 402, block B, Tianwei electronics, 158 West Avenue, high tech Zone, Xi'an, Shaanxi 710000 Applicant after: Xi'an tianhejia membrane Industrial Materials Co.,Ltd. Address before: No.58, middle Yanta Road, Xi'an City, Shaanxi Province, 710000 Applicant before: XI'AN University OF SCIENCE AND TECHNOLOGY |
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Application publication date: 20190517 |