CN106304626A - A kind of nonmetal flexible wiring board and preparation method thereof - Google Patents
A kind of nonmetal flexible wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN106304626A CN106304626A CN201610932352.XA CN201610932352A CN106304626A CN 106304626 A CN106304626 A CN 106304626A CN 201610932352 A CN201610932352 A CN 201610932352A CN 106304626 A CN106304626 A CN 106304626A
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- Prior art keywords
- conductive carbon
- carbon film
- film circuit
- wiring board
- flexible wiring
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- 229910052755 nonmetal Inorganic materials 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 title abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 125
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 113
- 239000000463 material Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 41
- 239000012528 membrane Substances 0.000 claims abstract description 28
- 238000002955 isolation Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000004698 Polyethylene Substances 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004917 carbon fiber Substances 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 2
- 239000012994 photoredox catalyst Substances 0.000 claims 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 2
- 239000004417 polycarbonate Substances 0.000 claims 2
- 239000002071 nanotube Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 11
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- -1 polyethylene terephthalate Polymers 0.000 description 12
- LLYXJBROWQDVMI-UHFFFAOYSA-N 2-chloro-4-nitrotoluene Chemical compound CC1=CC=C([N+]([O-])=O)C=C1Cl LLYXJBROWQDVMI-UHFFFAOYSA-N 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 239000002238 carbon nanotube film Substances 0.000 description 2
- 150000004651 carbonic acid esters Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention discloses a kind of nonmetal flexible wiring board and preparation method thereof.Described nonmetal flexible wiring board includes conductive carbon film circuit, support membrane and coverlay, described conductive carbon film circuit is made up of material with carbon element, described support membrane is positioned at below conductive carbon film circuit and supports with thinking that conductive carbon film circuit provides, and described coverlay is positioned at above conductive carbon film circuit and in order to by conductive carbon film circuit isolation.The present invention utilizes electric conductivity and the chemical stability of material with carbon element excellence, the cleaved conductive carbon film circuit formed of conductive carbon film prepared by material with carbon element processes through double-sided insulation and obtains novel nonmetal flexible wiring board, it has electric conductivity, pliability and the chemical stability of excellence, can widen flexible circuitry panel products range of application under extreme chemical environmental conditions.
Description
Technical field
The invention belongs to electronic circuit technology field, particularly to a kind of nonmetal flexible wiring board and preparation method thereof.
Background technology
The printing that flexible PCB (FPC, Flexible Printed Circuit) is made with flexible insulating substrate
Circuit, its can free bend, wind, fold, the dynamic bending of millions of times can be born and not damage wire, can be according to space
Layout requirements arbitrarily arranges, and arbitrarily moves at three dimensions and stretch, thus reaches components and parts assembling and the one of wire connection
Body.Flexible PCB can be substantially reduced the volume and weight of electronic product, is suitable for electronic product to high density, miniaturization, height
The needs of reliable direction development, therefore at space flight, military affairs, bio-sensing, mobile communication, computer, medical apparatus and instruments, digital camera etc.
It is widely used on field or product.
The base material that at present FPC is used based on polyimide copper clad lamination, this kind of material thermal resistance height, dimensional stability
Good, form final products with the coverlay having mechanical protection and good electrical insulating properties concurrently by compacting.But copper cash is also in FPC
There are disadvantages that, as there is the shortcoming of poor chemical stability under certain humidity and/or some specific chemical environment, causing
Certain interference is there is in FPC circuit to the signal of telecommunication.But, there is no suitable FPC product currently for this type of special applications.
Summary of the invention
Present invention is primarily targeted at a kind of nonmetal flexible wiring board of offer and preparation method thereof, to overcome existing skill
Deficiency in art.
For realizing aforementioned invention purpose, the technical solution used in the present invention includes:
Embodiments providing a kind of nonmetal flexible wiring board, described nonmetal flexible wiring board includes conductive carbon
Film circuit, support membrane and coverlay, described conductive carbon film circuit is made up of material with carbon element, and described support membrane is positioned at conductive carbon film circuit
Lower section also supports with thinking that conductive carbon film circuit provides, and described coverlay is positioned at above conductive carbon film circuit and in order to by conductive carbon
Film circuit isolation.
Further, any one or more during described material with carbon element includes CNT, graphite, Graphene and carbon fiber
Combination, and it is not limited to this.
Further, any one or more system during described material with carbon element includes CNT, graphite, Graphene and carbon fiber
The two-dimentional film material become.
Further, described material with carbon element preferably is selected from being assembled, by CNT, the two-dimentional planar material formed.
Further, at least selection area at described nonmetal flexible wiring board has also deposited metal level, described metal
Layer is electrically combined with described conductive carbon film circuit.
Embodiments of the invention additionally provide the manufacture method of a kind of nonmetal flexible wiring board, comprising:
Conductive carbon film is carried out cutting formed conductive carbon film circuit, described conductive carbon film circuit have back to the first table
Face and second surface；
First surface para-position laminating by support membrane with described conductive carbon film circuit；
Second surface on described conductive carbon film circuit fits over film, and suppresses and solidify, and is formed described non-
Metal flexible wiring board.
Further, the pressure of described compacting is 1Mpa～20Mpa, preferably 5～10Mpa；Described solidification temperature is
120～300 DEG C, hardening time is 20s～2min, preferably 120 DEG C～150 DEG C or 200 DEG C～300 DEG C, and hardening time is
20s～1min.
In some preferred embodiments, described manufacture method includes: first fitted with low viscous protecting film by conductive carbon film,
Afterwards use machine cuts mode conductive carbon film is cut and forms conductive carbon film circuit, thereafter by conductive carbon film circuit with
Low viscous protecting film separates.
In some embodiments, the cutting mode used in manufacture method described in described manufacture method includes that laser is cut
Cut, plasma cutting or cutting die cross cutting etc., it is preferred to use cutting die cross cutting mode, and be not limited to this.
Compared with prior art, the present invention utilizes electric conductivity and the chemical stability of material with carbon element excellence, material with carbon element prepare
The conductive carbon film circuit that formed of conductive carbon film cleaved (such as cross cutting) through double-sided insulation process obtain novel nonmetal soft
Property wiring board, its have excellence electric conductivity, pliability and chemical stability, flexible circuitry panel products can be widened in extreme change
Learning the range of application under environmental condition, and the manufacture method of described nonmetal flexible wiring board product is easy, production cost is low, can
Realize the batch production of nonmetal flexible wiring board.
Accompanying drawing explanation
Fig. 1 a is the top view of nonmetal flexible wiring board in the present invention one specific embodiment；
Fig. 1 b is the sectional view of nonmetal flexible wiring board in the present invention one specific embodiment；
Fig. 2 is the fabrication processing figure of nonmetal flexible wiring board in the present invention one specific embodiment.
Detailed description of the invention
In view of deficiency of the prior art, inventor, through studying for a long period of time and putting into practice in a large number, is proposed the present invention's
Technical scheme, will be further explained this technical scheme, its implementation process and principle etc. as follows.
Embodiments providing a kind of nonmetal flexible wiring board, described nonmetal flexible wiring board includes conductive carbon
Film circuit, support membrane and coverlay, described conductive carbon film circuit is made up of material with carbon element, and described support membrane is positioned at conductive carbon film circuit
Lower section also supports with thinking that conductive carbon film circuit provides, and described coverlay is positioned at above conductive carbon film circuit and in order to by conductive carbon
Film circuit isolation.
Further, any one or more during described material with carbon element includes CNT, graphite, Graphene and carbon fiber
Combination, and it is not limited to this.
Further, any one or more system during described material with carbon element includes CNT, graphite, Graphene and carbon fiber
The two-dimentional film material become.
The present invention uses has sp2Wire in the material with carbon element composition FPC of hybrid structure, because its electron cloud being conjugated is tied
Structure, has satisfactory electrical conductivity and superior chemical stability, is beneficial to expand the range of application of FPC product.
Further, the thickness of described conductive carbon film circuit is 1～1000 μm, preferably 1 μm～10 μm, 50 μm～200 μ
M or 500 μm～1000 μm, live width is 50 μm～2mm, preferably 50～200um or 1～2mm.
Further, the sheet resistance value of described conductive carbon film circuit is 0.01～5ohm/sq, 0.01～0.1ohm/sq,
0.5～1ohm/sq or 2～5ohm/sq.
Further, described material with carbon element selects free CNT to assemble the two-dimentional planar material formed.
The thickness of described two dimension planar material is 1～1000 μm, preferably 1 μm～10 μm, 50 μm～200 μm or 500 μm
～1000 μm；Preferably, the density of described two dimension planar material is 0.5g/cm3～2g/cm3, especially preferably 1g/cm3～2g/
cm3；Preferably, the sheet resistance of described two dimension planar material is 0.01～5ohm/sq, preferably 0.01～0.1ohm/sq,
0.5～1ohm/sq or 2～5ohm/sq.
Wherein, if the described two dimension thickness of planar material, density are too small, it will be caused cannot to present excellent conductive performance,
If but its thickness, density are excessive, will be unfavorable for it is carried out cutting processing, and particularly be unfavorable for carrying out machine cuts.Such as, when
When described two dimension planar material being carried out cutting processing in cutting die cross cutting mode, because CNT itself has the anti-shearing of excellence
On the one hand performance, if the thickness of described two dimension planar material is excessive, then can strengthen cutting difficulty, extend clipping time, and reduction is cut
Cut efficiency, be on the other hand also possible to cause its of two dimension planar material because of the big shearing force being applied on two dimension planar material
The structure that remaining part is divided involved involve and by a certain degree of destruction, and then make two dimension the electric conductivity of planar material, mechanics
Performances etc. cannot be protected.
Preferably, the sheet resistance of described two dimension planar material is 0.01～5ohm/sq, preferably 0.01～0.1ohm/
Sq, 0.5～1ohm/sq or 2～5ohm/sq.
Further, the material of described support membrane include PET (polyethylene terephthalate), PI (polyimides),
PDMS (polydimethylsiloxane), PMMA (polymethyl methacrylate), PE (polyethylene), PP (polypropylene) and PC (poly-carbonic acid
Ester) in the combination of any one or more, and be not limited to this.
Further, the thickness of described support membrane is 10 μm～200 μm, preferably 10～50um or 100～200um..
Further, the material of described coverlay include PET (polyethylene terephthalate), PI (polyimides),
PDMS (polydimethylsiloxane), PMMA (polymethyl methacrylate), PE (polyethylene), PP (polypropylene) and PC (poly-carbonic acid
Ester) in the combination of any one or more.
Further, the thickness of described coverlay is 10 μm～200 μm, preferably 10～50um or 100～200um..
Further, described coverlay is selected from the viscous protecting film of height or the base material of band PUR, and the stripping of described coverlay
Power is 100gf/ inch～2kgf/ inch, preferably 1kgf/ inch～2kgf/ inch.
Further, at least selection area at described nonmetal flexible wiring board has also deposited metal level, described metal
Layer is electrically combined with described conductive carbon film circuit.
Embodiments of the invention additionally provide a kind of method preparing foregoing non-metal flexible circuit board, comprising:
Conductive carbon film is carried out cutting formed conductive carbon film circuit, described conductive carbon film circuit have back to the first table
Face and second surface；
First surface para-position laminating by support membrane with described conductive carbon film circuit；
Second surface on described conductive carbon film circuit fits over film, and suppresses and solidify, and is formed described non-
Metal flexible wiring board.
The pressure of described compacting is 1Mpa～20Mpa, preferably 5～10Mpa；Described solidification temperature is 120～300
DEG C, hardening time is 20s～2min, preferably 120 DEG C～150 DEG C or 200 DEG C～300 DEG C, hardening time be 20s～
1min。
In some preferred embodiments, described manufacture method includes: first fitted with low viscous protecting film by conductive carbon film,
Afterwards use machine cuts mode conductive carbon film is cut and forms conductive carbon film circuit, thereafter by conductive carbon film circuit with
Low viscous protecting film separates.
Further, the viscosity of described low viscous protecting film is 1～50gf/ inch, preferably 5～15gf/ inch, and thickness is
25～180 μm, preferably 50～100 μm.
In some embodiments, described manufacture method includes: support membrane is carried out Drilling operation, in order to will conduct electricity merit
By the first surface para-position laminating of support membrane with described conductive carbon film circuit after partly exposing.
In some embodiments, described manufacture method also includes: in the selected district of described nonmetal flexible wiring board
Area deposition metal, carries out following process according to presupposed solution to described nonmetal flexible circuit board afterwards.
In some embodiments, described manufacture method also includes: spatter at least through plating, ald or magnetic control
Any one mode hit described nonmetal flexible wiring board selection area deposit metal, described metal include nickel and/or
Gold, and it is not limited to this.
In some embodiments, described following process includes: use lettering symbol, cutting, electrical measurement and clicking technique pair
Described nonmetal flexible circuit board is identified, processes.
In some embodiments, the cutting mode used in described manufacture method includes cut, plasma cutting
Or cutting die cross cutting etc., and it is not limited to this.
Preferably, described cutting mode uses cutting die cross cutting mode, and it is than other cutting mode, has operation letter
Single convenient, remaining region in addition to the region to be cut of conductive carbon film will not be undermined, thus can effective guarantee conductive carbon film electricity
The performance on road.
In some more specific embodiment, the manufacture method of described nonmetal flexible wiring board specifically includes
S1, low viscous protecting film that conductive carbon film is fitted；
S2, conductive carbon film is carried out cross cutting formed conductive carbon film circuit；
S3, by support membrane hole, and with conductive carbon film circuit para-position fit；
S4, opposite side on conductive carbon film circuit fit over film, and suppress and solidify；
S5, on nonmetal flexible wiring board deposit metal；
S6, nonmetal flexible circuit board is identified according to default drawing, processes.
Below in conjunction with some embodiments and accompanying drawing, technical scheme is further described.
Refer to shown in Fig. 1 a-Fig. 1 b, a kind of nonmetal flexible wiring board (FPC) bag in the present invention one specific embodiment
Include conductive carbon film circuit 1, support membrane 2 and coverlay 3.Support membrane 2 is positioned at below conductive carbon film circuit 1 and with thinking conductive carbon film
Circuit provides and supports.Coverlay 3 is positioned at above conductive carbon film circuit 1 and in order to by conductive carbon film circuit isolation.
Further, conductive carbon film circuit 1 is prepared from by carbon nano-tube film, this carbon nano-tube film can by array spinning,
Aerosol or water-laid film prepare, and its sheet resistance is 0.5ohm/sq, and thickness is 50um.
This conductive carbon film circuit 1 have excellence electric conductivity and pliability, bent million times and sheet resistance does not changes.
Further, support membrane is PI (polyimides) film, and its thickness is 10um；
Further, coverlay is PI (polyimides) film, and its thickness is 10um；
Refering to shown in Fig. 2, the manufacture method of foregoing non-metal flexible circuit board specifically includes:
S1, low viscous protecting film that conductive carbon film is fitted；
S2, conductive carbon film is carried out cross cutting formed conductive carbon film circuit；
S3, by support membrane hole, and with conductive carbon film circuit para-position fit；
S4, opposite side on conductive carbon film circuit fit over film, and suppress and solidify；
S5, on nonmetal flexible wiring board deposit metal；
S6, nonmetal flexible circuit board is identified according to drawing, processes.
In abovementioned steps S1, the viscosity of the low viscous protecting film of employing is 5～15gf/ inches, and thickness is 50um.This is low viscous
Protecting film is selected from PET (polyethylene terephthalate), PI (polyimides), PDMS (polydimethylsiloxane), PMMA
Any one in (polymethyl methacrylate), PE (polyethylene), PP (polypropylene) and PC (Merlon), it is for conduction
Carbon film is supported and protects, follow-up cross cutting processing, and is prone to after cross cutting completes separate with conductive carbon film circuit.
In abovementioned steps S2, the cross cutting instrument of employing can be selected from the cutting die that industry is common, the shearing force when cutting
In the range of being preferably controlled in 1～10kg, by before cutting, after respectively to conductive carbon film, the electric conductivity of conductive carbon film circuit,
Microscopic appearance is observed, it appeared that it is basically identical, and the section on conductive carbon film circuit is smooth.
In abovementioned steps S3, processing by support membrane being carried out boring etc., alignment mark can be formed on support membrane
Deng, make support membrane and conductive carbon film circuit para-position to fit, improve Anawgy accuracy, reduce difficulty of construction.
In abovementioned steps S4, after conductive carbon film circuit is fitted with coverlay, can first use 5Mpa pressure pressure
Close, then 120 DEG C solidify 30s, support membrane is fully bonded to coverlay together with.
In abovementioned steps S5, can be at golden finger or need the position of special process (as welding) by plating, atom
The modes such as layer deposition, magnetron sputtering deposit the metal such as nickel and/or gold.
In abovementioned steps S6, lettering symbol, cutting, electrical measurement and clicking technique etc. can be used, by prefabricated nonmetal
Flexible PCB is identified according to drawing, processes, and obtains final products.
The present invention utilizes electric conductivity and the chemical stability of material with carbon element excellence, material with carbon element the conductive carbon film prepared is die cut
The conductive carbon film circuit formed processes through double-sided insulation and obtains novel nonmetal flexible wiring board, and it has the conduction of excellence
Property, pliability and chemical stability, can widen flexible circuitry panel products range of application under extreme chemical environmental conditions；And
And, the manufacture method of nonmetal flexible wiring board product of the present invention is easy, and production cost is low, can realize nonmetal flexible wiring board
Batch production.
Should be appreciated that above-described embodiment is only technology design and the feature of the explanation present invention, its object is to allow and be familiar with this
The personage of item technology will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All
The equivalence change made according to spirit of the invention or modification, all should contain within protection scope of the present invention.
Claims (17)
1. a nonmetal flexible wiring board, it is characterised in that include conductive carbon film circuit, support membrane and coverlay, described in lead
Electrical carbon film circuit is made up of material with carbon element, and described support membrane is positioned at below conductive carbon film circuit and with thinking that conductive carbon film circuit provides
Supporting, described coverlay is positioned at above conductive carbon film circuit and in order to by conductive carbon film circuit isolation.
Nonmetal flexible wiring board the most according to claim 1, it is characterised in that: described material with carbon element include CNT,
Any one or two or more combination in graphite, Graphene and carbon fiber；Preferably, described material with carbon element is selected from least by carbon
Any one two-dimentional film material made in nanotube, graphite, Graphene and carbon fiber.
Nonmetal flexible wiring board the most according to claim 1, it is characterised in that: the thickness of described conductive carbon film circuit is
1～1000 μm, preferably 1 μm～10 μm, 50 μm～200 μm or 500 μm～1000 μm, live width is 50 μm～2mm, preferably 50
～200um or 1～2mm；And/or, the sheet resistance value of described conductive carbon film circuit is 0.01～5ohm/sq, preferably 0.01
～0.1ohm/sq, 0.5～1ohm/sq or 2～5ohm/sq.
4. according to the nonmetal flexible wiring board according to any one of claim 1-3, it is characterised in that: described material with carbon element is selected from
The two-dimentional planar material formed is assembled by CNT；Preferably, the thickness of described two dimension planar material is 1～1000 μm, excellent
Elect 1 μm～10 μm, 50 μm～200 μm or 500 μm～1000 μm as；Preferably, the density of described two dimension planar material is 0.5g/
cm3～2g/cm3, especially preferably 1g/cm3～2g/cm3；Preferably, described two dimension planar material sheet resistance be 0.01～
5ohm/sq, preferably 0.01～0.1ohm/sq, 0.5～1ohm/sq or 2～5ohm/sq.
Nonmetal flexible wiring board the most according to claim 1, it is characterised in that: the material of described support membrane include PET,
The combination of any one or more in PI, PDMS, PMMA, PE, PP and PC；And/or, the thickness of described support membrane be 10 μm～
200 μm, preferably 10～50um or 100～200um.
Nonmetal flexible wiring board the most according to claim 1, it is characterised in that: the material of described coverlay include PET,
The combination of any one or more in PI, PDMS, PMMA, PE, PP and PC；And/or, the thickness of described coverlay be 10 μm～
200 μm, preferably 10～50um or 100～200um.
Nonmetal flexible wiring board the most according to claim 1, it is characterised in that: described coverlay is selected from the viscous protecting film of height
Or the base material of band PUR, and the peeling force of described coverlay is 100gf/ inch～2kgf/ inch, preferably 1kgf/ inch
～2kgf/ inch.
Nonmetal flexible wiring board the most according to claim 1, it is characterised in that: at least at described nonmetal flexible circuit
The selection area of plate has also deposited metal level, and described metal level is electrically combined with described conductive carbon film circuit.
9. the manufacture method of nonmetal flexible wiring board as according to any one of claim 1-8, it is characterised in that including:
Conductive carbon film is carried out cutting formed conductive carbon film circuit, described conductive carbon film circuit have back to first surface with
Second surface；
First surface para-position laminating by support membrane with described conductive carbon film circuit；
Second surface on described conductive carbon film circuit fits over film, and suppresses and solidify, and is formed described nonmetal
Flexible circuit board.
Manufacture method the most according to claim 9, it is characterised in that: the pressure of described compacting is 1Mpa～20Mpa, excellent
Choosing for 5～10Mpa；Described solidification temperature is 120～300 DEG C, and hardening time is 20s～2min, preferably 120 DEG C～
150 DEG C or 200 DEG C～300 DEG C, hardening time is 20s～1min.
11. manufacture methods according to claim 9, it is characterised in that including: first conductive carbon film is pasted with low viscous protecting film
Close, use machine cuts mode conductive carbon film to be cut and forms conductive carbon film circuit afterwards, thereafter by conductive carbon film electricity
Road separates with low viscous protecting film.
12. manufacture methods according to claim 11, it is characterised in that: the viscosity of described low viscous protecting film is 1～50gf/
Inch, preferably 5～15gf/ inch, thickness is 25～180 μm, preferably 50～100 μm.
13. manufacture methods according to claim 9, it is characterised in that including: support membrane is carried out Drilling operation, in order to incite somebody to action
Conducting function part is exposed, afterwards by the first surface para-position laminating of support membrane with described conductive carbon film circuit.
14. manufacture methods according to claim 9, it is characterised in that also include: at described nonmetal flexible wiring board
Selection area deposition metal, carries out following process according to presupposed solution to described nonmetal flexible circuit board afterwards.
15. manufacture methods according to claim 14, it is characterised in that including: at least through plating, ald or
Any one mode in magnetron sputtering deposits metal at the selection area of described nonmetal flexible wiring board, and described metal includes nickel
And/or gold.
16. manufacture methods according to claim 14, it is characterised in that described following process includes: use lettering to accord with,
Described nonmetal flexible circuit board is identified, processes by cutting, electrical measurement and clicking technique.
17. according to the manufacture method according to any one of claim 9-16, it is characterised in that: described manufacture method uses
Cutting mode includes cut, plasma cutting or cutting die cross cutting.
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| CN201610932352.XA CN106304626A (en) | 2016-10-25 | 2016-10-25 | A kind of nonmetal flexible wiring board and preparation method thereof |
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| CN201610932352.XA CN106304626A (en) | 2016-10-25 | 2016-10-25 | A kind of nonmetal flexible wiring board and preparation method thereof |
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| CN110856342A (en) * | 2019-10-30 | 2020-02-28 | 深圳丹邦科技股份有限公司 | Ultra-micro circuit board based on ultra-thin non-adhesive flexible carbon-based material and preparation method thereof |
| CN113518480A (en) * | 2021-04-29 | 2021-10-19 | 安徽宇航派蒙健康科技股份有限公司 | Preparation method of graphene electrothermal film |
| CN114025483A (en) * | 2020-11-30 | 2022-02-08 | 益阳市明正宏电子有限公司 | Processing method for improving electrical testing yield of carbon oil plate |
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