CN106298741A - A kind of radio frequency multi-chip circuit electromagnetic armouring structure - Google Patents

Abstract

The invention relates to an electromagnetic shielding structure of a radio frequency multi-chip circuit, comprising a substrate (1) connected to a substrate (2), a substrate electromagnetic interference shielding layer (3) attached to the lower surface of the substrate (2), the substrate (1), the substrate ( 2) and the substrate electromagnetic interference shielding layer (3) constitute the electromagnetic shielding structure of the first circuit component on the bottom surface; the casing (4) is arranged on the substrate (1), and the casing electromagnetic interference shielding layer (5) is attached to the inner surface of the casing (4) The substrate (2) is arranged inside the casing (4), and the substrate (2), the casing (4) and the electromagnetic interference shielding layer (5) of the casing constitute an electromagnetic shielding structure of the second circuit assembly above. Therefore, the radio frequency multi-chip circuit electromagnetic shielding structure provided by the present invention can realize the electromagnetic shielding inside the multi-chip high-density package, and at the same time realize the electromagnetic shielding of the multi-chip high-density package to the outside.

Description

A radio frequency multi-chip circuit electromagnetic shielding structure

technical field

The invention relates to the technical field of integrated circuits, in particular to an electromagnetic shielding structure for radio frequency multi-chip circuits.

Background technique

The stacked package (English: Package-on-Package, abbreviation: PoP) in the multi-chip package (English: Multi Chip Package, abbreviation: MCP) is designed to vertically integrate discrete logic and storage ball grid arrays (English: BallGrid Array , Abbreviation: BGA) package. Stack the chips of the original discrete structure into the same package, and stack two or more chips into the same package to provide communication equipment, navigation equipment, mobile phones, personal digital terminals, desktop computers, portable computers, tablet computers and other applications. An ideal high-density packaging solution.

Based on this, the inventors of the present invention have found that RF components are included in the high-density packaging, and electromagnetic interference (English: Electromagnetic Interference, abbreviation: EMI) shielding is required to isolate the RF components from the surrounding environment and reduce external interference to them. Prevents leakage of RF components into the surrounding environment. EMI shielding in the prior art is to shield the entire chip externally using a Faraday cage, and shield the chip in the entire package as a whole, which is not conducive to further high-density packaging.

The information disclosed in this Background section is only for enhancing the understanding of the general background of the present invention and should not be taken as an acknowledgment or any form of suggestion that the information constitutes the prior art that is already known to those skilled in the art.

Contents of the invention

technical problem

In view of this, the technical problem to be solved by the present invention is how to provide a radio frequency multi-chip circuit electromagnetic shielding structure, which can realize the electromagnetic shielding inside the multi-chip high-density package, and at the same time realize the electromagnetic shielding of the multi-chip high-density package to the outside .

solution

In order to solve the above technical problems, the present invention provides a radio frequency multi-chip circuit electromagnetic shielding structure, including a substrate 1, a substrate 2, a substrate electromagnetic interference shielding layer 3, a housing 4, a housing electromagnetic interference shielding layer 5, a first circuit assembly 6, a second The circuit assembly 7, wherein: the substrate 1 is connected to the substrate 2, the substrate electromagnetic interference shielding layer 3 is attached to the lower surface of the substrate 2, the substrate 1, the substrate 2 and the substrate electromagnetic interference shielding layer 3 constitute the electromagnetic shielding structure of the first circuit assembly on the bottom surface; and The housing 4 is arranged on the substrate 1, the electromagnetic interference shielding layer 5 of the housing is attached to the inner surface of the housing 4, the substrate 2 is arranged in the space formed by the housing 4 and the substrate 1, and the substrate 2, the housing 4 and the electromagnetic interference shielding layer 5 of the housing are formed The electromagnetic shielding structure of the second circuit assembly above.

In a possible implementation manner, the substrate electromagnetic interference shielding layer 3 includes a thin film absorbing material 31 and a metal layer 32 .

In a possible implementation manner, the electromagnetic interference shielding layer 5 of the casing includes a thin film absorbing material 51 and a metal layer 52 .

In a possible implementation, the first circuit component 6 is disposed on the substrate 1, and the second circuit component 7 is disposed on the substrate 2; and the first circuit component 6 and the second circuit component 7 are active radio frequency circuits or wireless At least one of the source radio frequency circuit components.

In a possible implementation manner, the grounding part of the substrate 1 and the substrate 2 provides heat dissipation channels in the entire chip.

In a possible implementation manner, the housing 4 is made of one or more of plastic materials, ceramic materials, and metal materials.

In a possible implementation manner, the radio frequency multi-chip circuit electromagnetic shielding structure is arranged in at least one of communication equipment, navigation equipment, mobile phones, personal digital terminals, desktop computers, portable computers, and tablet computers.

Beneficial effect

A radio frequency multi-chip circuit electromagnetic shielding structure provided by the present invention is connected to the substrate 2 through the substrate 1, the substrate electromagnetic interference shielding layer 3 is attached to the lower surface of the substrate 2, and the substrate 1, the substrate 2 and the substrate electromagnetic interference shielding layer 3 form the bottom surface The electromagnetic shielding structure of the first circuit assembly; and the shell 4 is arranged on the substrate 1, the electromagnetic interference shielding layer 5 of the shell is attached to the inner surface of the shell 4, the substrate 2 is arranged in the space formed by the shell 4 and the substrate 1, the substrate 2, the shell 4 and the shell electromagnetic interference shielding layer 5 constitute the electromagnetic shielding structure of the second circuit component above, which can realize the electromagnetic shielding inside the multi-chip high-density package, and at the same time realize the electromagnetic shielding of the multi-chip high-density package to the outside.

Other features and aspects of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the accompanying drawings.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 shows a schematic structural diagram of a radio frequency multi-chip circuit electromagnetic shielding structure provided by an embodiment of the present invention;

FIG. 2 shows a schematic structural diagram of a substrate electromagnetic interference shielding layer provided by an embodiment of the present invention;

FIG. 3 shows a schematic structural diagram of an electromagnetic interference shielding layer of a casing provided by an embodiment of the present invention.

detailed description

The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention. Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations thereof such as "includes" or "includes" and the like will be understood to include the stated elements or constituents, and not Other elements or other components are not excluded.

The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

In addition, in order to better illustrate the present invention, numerous specific details are given in the specific embodiments below. It will be understood by those skilled in the art that the present invention may be practiced without certain of the specific details. In some instances, methods, means, and elements well known to those skilled in the art are not described in detail in order to highlight the gist of the present invention.

Figure 1 shows a schematic structural diagram of an electromagnetic shielding structure of a radio frequency multi-chip circuit provided by an embodiment of the present invention. The electromagnetic shielding structure of a radio frequency multi-chip circuit provided by an embodiment of the present invention can be applied to a high-voltage electromagnetic environment, and can be applied to transmission lines on-line Monitoring equipment, as shown in Figure 1, the device includes: a substrate 1, a substrate 2, a substrate electromagnetic interference shielding layer 3, a housing 4, a housing electromagnetic interference shielding layer 5, a first circuit component 6, and a second circuit component 7, wherein, The substrate 1 is connected to the substrate 2, and the substrate electromagnetic interference shielding layer 3 is attached to the lower surface of the substrate 2. For example, the substrate electromagnetic interference shielding layer 3 can be attached to the lower surface of the substrate 2 by processes such as coating and bonding. The substrate 1, the substrate 2 and the substrate electromagnetic interference shielding layer 3 form an electromagnetic shielding structure for the first circuit assembly on the bottom surface, which acts as a shield for the bottom chip located between the substrate 1 and the substrate 2, such as the first circuit assembly 6 in this embodiment.

In a possible implementation manner, the substrate electromagnetic interference shielding layer 3 includes a thin film absorbing material 31 and a metal layer 32 , which can shield the chips on the bottom surface.

The housing 4 is arranged on the substrate 1 and forms a space with the substrate 1. The electromagnetic interference shielding layer 5 of the housing is attached to the inner surface of the housing 4. For example, the electromagnetic interference shielding layer 5 of the housing can be attached to the housing 4 by processes such as coating and bonding. of the inner surface.

The substrate 2 is arranged in the space enclosed by the casing 4 and the substrate 1. The substrate 2, the casing 4 and the casing electromagnetic interference shielding layer 5 constitute the electromagnetic shielding structure of the upper second circuit assembly, and the upper chip located between the casing 4 and the substrate 2 , such as the second circuit component 7 in this embodiment, plays a shielding role. At the same time, electromagnetic shielding with the outside is realized to improve the overall shielding function.

In a possible implementation, the shell electromagnetic interference shielding layer 5 includes a thin film absorbing material 51 and a metal layer 52, which can protect the upper chip located between the shell 4 and the substrate 2, such as the second circuit component in this embodiment. 7. Play a shielding role. At the same time, electromagnetic shielding with the outside is realized to improve the overall shielding function.

Substrate 1 and substrate 2 are grounded. In one possible implementation, substrate 1 and substrate 2 can be grounded on both sides and at the center. In another possible implementation, other locations can be grounded according to electrical connection requirements. . The grounding part of the substrate 1 and the substrate 2 not only provides electromagnetic shielding function, but also serves as a heat dissipation channel for chips or circuit components.

Figure 2 shows a schematic structural view of the substrate electromagnetic interference shielding layer 3 provided by the embodiment of the present invention. As shown in Figure 2, the substrate 2 is provided with a conductive material 31, which includes but is not limited to metals such as gold, silver, and aluminum. After the addition of the conductive material 31 is completed, the thin-film microwave absorbing material 32 is added to form the electromagnetic interference shielding layer 3 of the substrate. The substrate electromagnetic interference shielding layer 3 is grounded through the through hole on the substrate 1 .

Fig. 3 shows the schematic structural view of the housing electromagnetic interference shielding layer 5 provided by the embodiment of the present invention. As shown in Fig. 3, the inner surface of the housing 4 is provided with a conductive material 51, which includes but is not limited to gold, silver, For metals such as aluminum, conductive material 51 is added, and thin-film microwave absorbing material 52 is added to form the electromagnetic interference shielding layer 5 of the shell. The casing 4 to which the conductive material 51 and the thin-film microwave absorbing material 52 have been attached is assembled on the substrate 1 . The electromagnetic interference shielding layer 5 of the shell is grounded through the through hole on the substrate 1 .

As shown in FIG. 1 , the chip component 6 is assembled on the substrate 1 . Chip components 7 are mounted on the substrate 2 . The chip component 6 and the chip component 7 are internally electrically connected as required, and are connected to the outside through the substrate 1 .

Therefore, the radio frequency multi-chip circuit electromagnetic shielding structure provided by the embodiment of the present invention can realize the electromagnetic shielding inside the multi-chip high-density package, and at the same time realize the electromagnetic shielding of the multi-chip high-density package to the outside.

The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling others skilled in the art to make and use various exemplary embodiments of the invention, as well as various Choose and change. It is intended that the scope of the invention be defined by the claims and their equivalents.

The device embodiments described above are only illustrative, and the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in One place, or it can be distributed to multiple network elements. Part or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. It can be understood and implemented by those skilled in the art without any creative efforts.

Claims (7)

1. a radio frequency multi-chip circuit electromagnetic armouring structure, it is characterised in that include substrate (1), substrate (2), substrate electromagnetism Interference shielding layer (3), shell (4), shell electromagnetic interference shield layer (5) first circuit unit (6), second circuit assembly (7), its In:

Described substrate (1) is connected with described substrate (2), and described substrate electromagnetic interference shield layer (3) is attached to described substrate (2) Lower surface, described substrate (1), described substrate (2) constitute bottom surface the first circuit unit with described substrate electromagnetic interference shield layer (3) Electromagnetic armouring structure；And

Described shell (4) is arranged on described substrate (1), and described shell electromagnetic interference shield layer (5) is attached to described shell (4) Inner surface, within described substrate (2) is arranged at the space that described shell (4) and described substrate (1) are constituted, described substrate (2), Described shell (4) and described shell electromagnetic interference shield layer (5) constitute second circuit assembly electromagnetic armouring structure above.

Radio frequency multi-chip circuit electromagnetic armouring structure the most according to claim 1, it is characterised in that described substrate electromagnetism is done Disturb screen layer (3) and include thin-film wave absorbing material (31) and metal level (32).

Radio frequency multi-chip circuit electromagnetic armouring structure the most according to claim 1, it is characterised in that described shell electromagnetism is done Disturb screen layer (5) and include thin-film wave absorbing material (51) and metal level (52).

Radio frequency multi-chip circuit electromagnetic armouring structure the most according to claim 1, it is characterised in that described first circuit group Part (6) is arranged on described substrate (1), and described second circuit assembly (7) is arranged on described substrate (2)；And

Described first circuit unit (6), second circuit assembly (7) be in active radio frequency circuit or passive RF circuit assembly extremely Few one.

Radio frequency multi-chip circuit electromagnetic armouring structure the most according to claim 1, it is characterised in that described substrate (1), institute Stating grounded part in substrate (2), to be that described first circuit unit (6) and described second circuit assembly (7) provide heat to dissipate logical Road.

Radio frequency multi-chip circuit electromagnetic armouring structure the most according to claim 1, it is characterised in that described shell (4) is One or more in plastic material, ceramic material, metal material.

Radio frequency multi-chip circuit electromagnetic armouring structure the most according to claim 1, it is characterised in that described radio frequency multi-chip Circuit electromagnetic armouring structure is arranged at communication equipment, navigator, mobile phone, personal digital terminal, desk computer, portable In at least one in formula computer, tablet PC.