CN106268993B - A kind of differential temperature reaction chip and temperature-conditioned metal bath - Google Patents
A kind of differential temperature reaction chip and temperature-conditioned metal bath Download PDFInfo
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- CN106268993B CN106268993B CN201610794696.9A CN201610794696A CN106268993B CN 106268993 B CN106268993 B CN 106268993B CN 201610794696 A CN201610794696 A CN 201610794696A CN 106268993 B CN106268993 B CN 106268993B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
- B01L7/54—Heating or cooling apparatus; Heat insulating devices using spatial temperature gradients
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/16—Reagents, handling or storing thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
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Abstract
The invention discloses a kind of differential temperature reaction chips and temperature-conditioned metal to bathe, wherein, differential temperature reaction chip includes an accommodating space, it is set in the first base material, the first base material includes the first interarea and the second interarea, the accommodating space have can to flow into the solution in it different height position carry out different temperatures heating Wen Duan so that the solution generates convection current inside accommodating space；One second base material, is set on the first interarea of the first base material, is sealed to the accommodating space.The differential temperature reaction chip of the offer of the present invention is heated by the different temperature of multiple spot so that heating liquid forms convection current, greatly improves heating speed, then coordinate multiple solution buffer structures, ensures that solution flow rate is easy to control in chip, avoids solution from overflowing the loss brought.
Description
Technical field
The present invention relates to the sample analysis fluid chip used in being checked or analyzed etc. of biological respinse and sample analysis sides
Method and equipment for sample analysis fluid chip.More particularly, it relates to can be used in the biochip of albumen or DNA analysis
(disposable biochip) and its equipment.
Background technology
The preservation and reaction of biochemical reagents usually require to meet certain temperature condition, and constant-temperature metal bath is exactly that one kind is made a living
The preservation and reaction for changing reagent carry out temperature controlled instrument, are widely used in the preservations of various biological samples, various enzymes
Preserve and reaction, the denaturation treatment of nucleic acid and protein, PCR reactions (PCR), electrophoresis pre-degeneration and serum
Solidification etc..
Current constant-temperature metal bath is made of in configuration aspects the multiple devices being close to successively from top to bottom, including base
Seat, gasket, heating and cooling component, thermal component, the side of thermal component are equipped with supply unit, display panel, thermal component it is another
Side is equipped with an exhaust fan, and exhaust fan is embedded in casing.The constant-temperature metal bath of the prior art exists in terms of temperature adjusting
Defect is mainly shown as that heat conduction lack of homogeneity, warming and cooling rate are slow.
(1) heat conduction lack of homogeneity.
Since gasket is typically made of aluminum, and the coefficient of heat conduction of aluminium is only K=237W/mK (watt/ meter Du), cannot
Heat is rapidly uniformly spread, therefore its heat conduction uniformity is not good enough；On the other hand, pedestal, gasket, heating and cooling component, dissipate
Generally there are gaps for contact surface between thermal part, if such as certain parts surface it is uneven, with regard to nothing between upper and lower component
Method is bonded completely, and the heat between the part face not being bonded is transmitted by the air of heat conductivility difference, the heat of the part of fitting
It is to be transmitted by the metal in the face being bonded to each other, then the heat-conducting effect of different parts will have larger difference.It is above-mentioned various
Conduction inequality is even caused by reason so that is positioned over the preservation of the reagent of different location or reaction condition in same pedestal and differs
It causes, subsequent biochemical test is caused to can not be successfully progress.
(2) warming and cooling rate is slow.
The heating and cooling mode to constant-temperature metal bath is needed to make an explanation herein.For a specific cooling piece, no matter
In heating or refrigerating state, the absolute value P of the upper and lower surface temperature difference is constant.The prior art is exactly by cooling piece
Different step modes is taken, the heating and cooling to pedestal are controlled using its constant temperature difference absolute value.It such as needs to pedestal liter
Temperature is then powered to cooling piece forward direction, and the underlaying surface temperature of cooling piece is made to be less than upper surface temperature, since the temperature difference is constant, then logical
It crosses and is stepped up underlaying surface temperature, upper surface temperature rise can be made to target temperature；It such as needs to cool down to pedestal, then to cooling piece
It is reversed to be powered, so that the upper surface temperature of cooling piece is less than underlaying surface temperature, since the temperature difference is constant, then by gradually reducing upper table
Face temperature can make underlaying surface temperature drop to target temperature.
In the heating and cooling process of constant-temperature metal bath, the operating of exhaust fan can be conducive to the realization of heating and cooling.Due to heat dissipation
Piece is contacted with cooling piece, and temperature is consistent with the underlaying surface temperature of cooling piece, when exhaust fan operates, will make cooling fin with it is outer
Cross-ventilation is formed between portion's environment, carries out heat exchange.When heating up to pedestal, the underlaying surface temperature of cooling piece is needed to increase,
If the temperature of cooling piece lower surface is lower than environment temperature at this time, then the operating of exhaust fan can make cooling fin and cooling piece following table
The temperature in face rises to environment temperature as early as possible, therefore can improve heating efficiency；When cooling down to pedestal, the following table of cooling piece is needed
Face temperature reduces, if the temperature of cooling piece lower surface is higher than environment temperature at this time, then the operating of exhaust fan can make cooling fin
And the temperature of cooling piece lower surface drops to environment temperature as early as possible, therefore cooling efficiency can be improved.But the prior art is taken
Metal bath lateral location installs the mode of an exhaust fan, and heat exchanger effectiveness is not high, keeps the heating and cooling efficiency of pedestal relatively low.
Except two point defects in terms of above-mentioned temperature adjusting, the metal bath of the prior art also needs to be changed in terms of ease for use
Into.When being heated due to the reagent in the pedestal to constant-temperature metal bath, reagent will heat up, and generate steam, steam encounters cold
When base seat lid, a large amount of steam and condensed water will be generated, when in the condensate return to pedestal that steam is formed, base can be caused
The pollution of reagent in seat；On the other hand, when opening base seat lid, the condensed water in base seat lid can be made under the marginal flow of pedestal
At the waste of reagent, meanwhile, condensed water is flowed into the element below pedestal, and element, damage circuit in meeting etching apparatus make
The safety and service life for obtaining constant-temperature metal bath cannot ensure.
Therefore it needs a kind of new differential temperature temperature-conditioned metal to bathe, temperature regulating power can be improved, and enhance ease for use.
Invention content
The purpose of this part is to summarize some aspects of the embodiment of the present invention and briefly introduce some preferably to implement
Example.It may do a little simplified or be omitted to avoid our department is made in this section and the description of the application and the title of the invention
Point, the purpose of abstract of description and denomination of invention it is fuzzy, and this simplification or omit and cannot be used for limiting the scope of the invention.
The problem of being bathed in view of above-mentioned and/or existing differential temperature reaction chip and temperature-conditioned metal, it is proposed that the present invention.
Therefore, the one of purpose of the present invention is to provide a kind of differential temperature reaction chip.
In order to solve the above technical problems, the present invention provides the following technical solutions：A kind of differential temperature reaction chip, feature exist
In, including, an accommodating space is set in the first base material, and the first base material includes the first interarea and the second interarea, this is accommodating
Space have can to flow into the solution in it different height position carry out different temperatures heating Wen Duan so that it is described molten
Liquid generates convection current inside accommodating space；One second base material, is set on the first interarea of the first base material, to described accommodating
Space is sealed.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：The accommodating space is from described
One interarea is formed to the second interarea, is also formed with, and a liquid feeding end is connected with the accommodating space, and solution is from the liquid feeding end
It is added to the accommodating space；And an exhaust end, it is connected with the accommodating space, the sky inside the accommodating space
Gas is discharged by the exhaust end.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：The liquid feeding end passes through first-class
Road is connected with the accommodating space, and the first diluting tank, and solution in first diluting tank are provided in the first flow path
Extreme lower position higher than solution in the accommodating space extreme higher position.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：The exhaust end passes through second
Road is connected with the accommodating space.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is provided in the second flow path
First storage pool, first storage pool store the solution for overflowing the accommodating space.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is also set up in the second flow path
After thering is the first colour developing pond, the solution to be full of first storage pool, into first colour developing pond.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is provided in the first flow path
First inflection point, solution form connected vessels type solution at first inflection point after entering the accommodating space and retain.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is provided in the second flow path
Second Inflexion Point, solution form connected vessels type solution at the Second Inflexion Point after flowing out the accommodating space and retain.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：The first flow path and the appearance
The bottom end for emptying a vertical direction is connected.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：The second flow path and the appearance
The top for emptying a vertical direction is connected.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is also set up in the second flow path
There is the first buffer pool, after the solution is full of first colour developing pond, into first buffer pool.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is also set up in the second flow path
Enter first absorption cell after thering is the first absorption cell, the solution to be full of the accommodating space.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：It is also set up in the second flow path
There is the first test paper storehouse, the solution is full of after the accommodating space enters first test paper storehouse, first test paper from one end
The other end in storehouse is connected with the exhaust end.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：First absorption cell and first
Test paper storehouse is connected.
As a kind of preferred embodiment of differential temperature reaction chip of the present invention, wherein：Further include a third base material, if
It is placed on the second interarea of the first base material, with described to completing to be sealed accommodating space together with second base material.
Another object of the present invention is to provide a kind of differential temperature temperature-conditioned metal bath of differential temperature reaction chip.
In order to solve the above technical problems, the present invention provides the following technical solutions：A kind of differential temperature temperature control of differential temperature reaction chip
Metal bath, which is characterized in that including heating unit, including energization module and contact module, the contact module can be divided into
The contact of difference in height is formed with described the Wen Duan, the energization module turns electric energy by being powered to the contact module
Turn to thermal energy；And control temperature unit, pass through the control to the energization module so that the contact module is respectively formed difference
The control of temperature.
As a kind of preferred embodiment of differential temperature temperature-conditioned metal of the present invention bath, wherein：Further include gateway unit, shape
At the space that can house the differential temperature reaction chip so that the contact module can be divided into and the differential temperature reaction chip
Wen Duan be formed with the contact of difference in height.
Beneficial effects of the present invention：The differential temperature reaction chip of the offer of the present invention is heated by the different temperature of multiple spot so that heating
Liquid forms convection current, greatly improves heating speed, then coordinate multiple solution buffer structures, ensures that solution flow rate is easily-controllable in chip
System avoids solution from overflowing the loss brought.Meanwhile matched differential temperature temperature-conditioned metal bath can be realized and be reacted differential temperature
Chip carries out fixed point heating in different height different location, realizes efficient operation.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill of field, without having to pay creative labor, it can also be obtained according to these attached drawings other
Attached drawing.Wherein：
Fig. 1 is the overall structure diagram of differential temperature reaction chip described in one embodiment of the present invention；
Fig. 2 is the overall structure diagram of differential temperature reaction chip described in second of embodiment of the invention；
Fig. 3 is the overall structure diagram of differential temperature reaction chip described in the third embodiment of the invention；
Fig. 4 is the overall structure diagram of differential temperature reaction chip described in the 4th kind of embodiment of the invention；
Fig. 5 is the differential temperature reaction chip side, sectional structural schematic diagram that the present invention is bonded second base material；
Fig. 6 is the overall structure side view of differential temperature reaction chip described in the 5th kind of embodiment of the invention；
Fig. 7 is the overall structure diagram of differential temperature reaction chip described in the 6th kind of embodiment of the invention；
Fig. 8 is the differential temperature reaction chip side, sectional structural representation that the present invention is bonded second base material and third base material
Figure；
Fig. 9 is the overall structure diagram of differential temperature temperature-conditioned metal bath described in one embodiment of the present invention；
Figure 10 is the fractionation part-structure schematic diagram of differential temperature temperature-conditioned metal bath described in Fig. 9 illustrated embodiments；
Figure 11 is the partial structural diagram of differential temperature temperature-conditioned metal bath described in Fig. 9 illustrated embodiments.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, right with reference to the accompanying drawings of the specification
The specific implementation mode of the present invention is described in detail.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
Implemented different from other manner described here using other, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by following public specific embodiment.
Secondly, " one embodiment " or " embodiment " referred to herein refers to that may be included at least one realization side of the present invention
A particular feature, structure, or characteristic in formula." in one embodiment " that different places occur in the present specification not refers both to
The same embodiment, nor the individual or selective embodiment mutually exclusive with other embodiment.
As shown in Figure 1, a kind of differential temperature reaction chip provided by the present invention, main carrier is the first base material 800, the base material
With the first interarea M and the second interarea S, is etched from the first interarea M of the first base material 800 to the second interarea S, be formed with accommodating sky
Between 100, the accommodating space 100 have can to flow into the solution in it different height position carry out different temperatures heating
Warm end 101, in this way, since solution is by warm uneven, different location formation temperature difference so that solution produces inside accommodating space 100
Raw convection current.
Referring to Fig. 5, in one embodiment, is formed by the second base material 900 on the first interarea M and reacted with differential temperature
The sealing of device on chip." device " designated herein, refer to the accommodating space formed in the first base material 800 100, into
The location component that the solution such as liquid end 200, exhaust end 300, first flow path 500 or second flow path 600 are flowed through or cached or store.When
It so, in another embodiment, can also be by the second base material 900 and the second interarea S on the first interarea M referring to Fig. 8
Third base material 700 completes the sealing to devices such as accommodating spaces 100 together, to realize the stream of reagent (or solution) in the chip
It is dynamic.Accommodating space 100 is formed from the first interarea M to the second interarea S, both ends have different heating temperature warm end 101, such as
Shown in Fig. 1, by the heating of upper and lower ends different temperatures, reagent upper and lower ends density can be made different, during heating shape
At the convection current of reagent, the quick heating to reagent is realized.Liquid feeding end 200 is connected with accommodating space 100, and reagent passes through liquid feeding end
200 enter accommodating space 100, and exhaust end 300 is connected with accommodating space 100, and the gas in accommodating space 100 passes through exhaust
300 discharge of end.
As shown in Fig. 2, 500 one end of first flow path is connected with the bottom end of 100 vertical direction of accommodating space, the other end with into
Liquid end 200 is connected, and 600 one end of second flow path is connected with the top of 100 vertical direction of accommodating space, the other end and exhaust end
300 are connected.When reagent from liquid feeding end 200 flow into, since first flow path 500, second flow path 600 are slim-lined construction, reagent
Flow velocity is difficult to control soon, is added that dosage is excessive possibly even directly goes out exhaust end 300, causes a degree of loss.First
Flow path 500 is equipped with the first inflection point 501, described " the first inflection point 501 ", structurally, certain section of i.e. first flow path 500 is formed
The bending of certain angle.Reagent, which enters after accommodating space 100, can form connected vessels type reagent at the first inflection point 501 and retain, and
Two flow paths 600 be equipped with Second Inflexion Point 603, it is described " Second Inflexion Point 603 ", structurally, namely second flow path 600 certain section
Form the bending of certain angle.Connected vessels type reagent can be formed at Second Inflexion Point 603 after reagent outflow accommodating space 100 to deposit
It stays, plays good cushioning effect, ensure that reagent flow rate is easy to control, avoid loss caused by due to reagent overflows.
As shown in Fig. 3,7, second flow path 600 is equipped with the first storage pool 601, and reagent is flowed into from liquid feeding end 200, flows through appearance
When entering second flow path 600 after 100 between emptying, the first storage pool 601 has bigger volume, can reduce reagent flow rate,
It prevents from overflowing, while also whether can have liquid level according in the first storage pool 601, judge whether to need to continue to add reagent；First
The first diluting tank 502 is additionally provided on flow path 500, the larger volume of the first diluting tank 502 can be further enhanced and be tried addition
The control of dosage, prevents reagent from overflowing.Preferably, the extreme lower position of solution is higher than in accommodating space 100 in the first diluting tank 502
The extreme higher position of solution.As shown in figure 4, the first colour developing pond 602 is additionally provided in second flow path 600, when reagent is full of the first storage
Enter the first colour developing pond 602 behind pond 601, can be applied to observation reagent and generate corresponding color change, with the first colour developing 602 phase of pond
First buffer pool 604 of connection, the first buffer pool 604 have bigger volume, can reduce reagent flow rate, play buffering and make
With preventing from overflowing, while also whether there can be liquid level according in the first buffer pool 604, judge whether to need to continue to add reagent.
As shown in fig. 7, second flow path 600 is equipped with the first absorption cell 605, reagent enters the after being full of accommodating space 100
One absorption cell 605, meanwhile, the first absorption cell 605 has bigger volume, can further function as the effect for preventing overflowing,
And also whether there can be liquid level according in the first absorption cell 605, judge whether to need to continue to add reagent；In second flow path 600
It is additionally provided with the first test paper storehouse 606, reagent can flow into the first test paper storehouse 606 after being full of accommodating space 100, and the first test paper storehouse 606 is another
One end is connected with exhaust end 300, and preprepared test strips are placed in the first test paper storehouse 606, can be carried out to reagent quick
Detection.
Differential temperature reaction chip has：It is formed with the chip of accommodating space 100, by matching or being bonded setting up and down
Base material forms.It as base material, is not particularly limited as long as not the base material for influencing reagent, in particular, if using containing
The resin material of any one of polypropylene, makrolon, acrylic acid can then ensure good visible light permeability.As
Polypropylene can use the random copolymer of homo-polypropylene or polypropylene and polyethylene.In addition, as acrylic acid, can use
Polymethyl methacrylate or methyl methacrylate and other methacrylates, acrylate, benzene second can be used
The copolymer of the monomers such as alkene.In addition, in the case of using these resin materials, the heat resistance and intensity of chip is also ensured.
As the material in addition to resin material, the metal material of aluminium, copper, silver, nickel, brass, gold etc. can be enumerated.Use metal material
When, it is also excellent in terms of pyroconductivity and sealing performance.Moreover, by keeping the holding of at least side base material of reaction tank transparent,
Thus, it is possible to the detection and analysises from external progress fluorescence etc..Wherein, the present invention in " transparent " and " photopermeability " refer to,
The situation that mean transmissivity under the wavelength region of detection light is 70% or more.If using visible light region (wavelength 350~
Photopermeability material 780nm), then the reagent state being easily recognized in chip, but not limited to this.
Note may be used when for resin material as the processing method for forming well, flow path and the base material in waste liquid portion
It is moulded into the various resin molding methods or machine cuts etc. of type, vacuum forming etc..It, can be by implementing to utilize when for metal material
The attrition process of thicker base material or etching are formed compared with pressure processing or stretch process is implemented on foil.In addition, conduct
Chip 100, when especially with resin material containing any one of polypropylene, makrolon, acrylic acid, it can be ensured that good
Good photopermeability, heat resistance and intensity.In addition, when the thickness of base material is 50 μm~3mm ranges, it can be ensured that good light
Permeability, heat resistance and intensity, and can reliably carry out recess portion processing.In addition, when the thickness of base material is 10 μm~300 μm models
When enclosing, the heat conductivity and leakproofness of base material can be met simultaneously.
As fitting base material method, it can enumerate and be provided as the resinous coat of adhesive linkage on a base material, and keep it molten
The method melted and be bonded two base materials.Preferred resin coating is arranged on the high metal material base material of pyroconductivity and is melted
Bonding.As the material of resinous coat, the resin material of PET, polyacetals, polyester or polypropylene etc. can be used.Certainly, may be used also
In a manner of being fixed using adhesive tape and paraffin binds.
In above-mentioned applying method, the light for being easy to carry out microfabrication and suitable fluorescence measurement is used preferably as base material
Permeability resin material uses pyroconductivity high and is easy setting resinous coat and is pasted by melting adhered as base material
The metal material of conjunction.In addition, by forming resinous coat in metallic substrate surface, Metal Substrate can not be considered in selected material
The resistance to chemical reagents of material itself.
In addition, substrate surface formed resinous coat when, by be used as resinous coat bottom formed thickening (anchoring,
Anchor) layer, it is melting adhered to carry out that laser thus can be used.The carbon black for absorbing optical maser wavelength light is mixed in adhesion promoting layer
(light absorption material) generates heat by irradiating laser, melting adhered thus, it is possible to be carried out to resinous coat.Alternatively, can also
Added in resinous coat carbon black or by the surface of resinous coat applied to black by way of replace adding in adhesion promoting layer
Add carbon black.For example, in the light for the infra-red laser diode that illumination wavelength is 900nm or so, it is possibility to have effect ground molten resin applies
Layer.Different from thermal welding, therefore laser welding, can hardly influence chip or be fixed on core without heating chip
In the case of the reagent of on piece, implement the fitting of base material.
Referring to Fig. 7, when in use, the second base material of tear initiation 900 covers the part of liquid feeding end 200 and exhaust end 300 so that
Liquid feeding end 200 and exhaust end 300 expose, and quantitative addition reagent is carried out on liquid feeding end 200 by the pressing of liquid feeding rifle, reagent from into
Liquid end 200 flows into, and accommodating space 100 is flowed into and be full of by first flow path 500, solid-state has been pre-placed in accommodating space 100
Reaction enzymes, reagent reaction enzymes merge, and air passes through second flow path 600 from 300 row of exhaust end in accommodating space 100 and other flow paths
Go out, then presses the second base material 900 and cover liquid feeding end 200 and exhaust end 300.Chip is put into metal to be incubated, fluorescence inspection
Survey device directly can carry out fluoroscopic examination export reaction result to the reagent after being incubated in accommodating space 100.
Tear again the second base material 900 covering liquid feeding end 200 and exhaust end 300 part, by liquid feeding rifle pressing into
Quantitative addition dilution is carried out on liquid end 200, dilution is flowed into from liquid feeding end 200, and accommodating space is flowed to by first flow path 500
100, the reagent in accommodating space 100 pushes forward, and reagent enters the first storage pool 601, the first storage by second flow path 600
Pond 601 can accommodate all reagents, and dilution also enters the first storage pool 601, and is diluted to reagent, continues to add dilute
Liquid is released, the reagent being diluted flows into and be full of the first absorption cell 605, stops addition dilution, is diluted in the first absorption cell 605
Reagent contact the blotting paper end of test paper in the first test paper storehouse 606, the reagent slow-absorbing that test paper will be diluted, and react display
Testing result, then press the second base material 900 and cover liquid feeding end 200 and exhaust end 300.
Referring to Fig. 9~11, which is heated by the bath of differential temperature temperature-conditioned metal, in an embodiment
In, the bath of differential temperature temperature-conditioned metal includes the heating unit 1000 for being provided with energization module 1001 and contacting module 1002, and is passed through
Control to energization module 1001 so that contact module 1002 is respectively formed the control temperature unit 2000 of different temperatures control.Contact
Module 1002 can divide into the contact that difference in height is formed with warm end 101, and energization module 1001 is by contact module
1002 are powered and then convert electrical energy into thermal energy.Differential temperature temperature-conditioned metal bath further includes that gateway unit 3000, formation can house
Differential temperature reaction chip is inserted vertically into gateway unit 3000 by the space of the differential temperature reaction chip so that contact 1002 energy of module
Enough divide into differential temperature reaction chip warm end 101 be formed with the contact of difference in height.
It can be seen that the differential temperature reaction chip of the offer of the present invention is heated by the different temperature of multiple spot so that heating liquid is formed
Convection current greatly improves heating speed, then coordinates multiple solution buffer structures, ensures that solution flow rate is easy to control in chip, avoids molten
Hydrorrhea goes out the loss brought.Meanwhile matched differential temperature temperature-conditioned metal bath can be realized to differential temperature reaction chip not
Fixed point heating is carried out with height different location, realizes efficient operation.
It should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferable
Embodiment describes the invention in detail, it will be understood by those of ordinary skill in the art that, it can be to the technology of the present invention
Scheme is modified or replaced equivalently, and without departing from the spirit of the technical scheme of the invention and range, should all be covered in this hair
In bright right.
Claims (10)
1. a kind of differential temperature reaction chip, it is characterised in that：Including,
One accommodating space（100）, it is set to the first base material（800）It is interior, the first base material（800）Including the first interarea（M）With
Second interarea（S）, the accommodating space（100）With can to flow into the solution in it different height position carry out different temperatures
Heating Wen Duan（101）So that the solution is in accommodating space（100）Inside generates convection current；
One second base material（900）, it is set to the first base material（800）The first interarea（M）On, to the accommodating space
（100）It is sealed;
The accommodating space（100）From first interarea（M）To the second interarea（S）It is formed, is also formed with,
One liquid feeding end（200）, with the accommodating space（100）It is connected, solution is from described the Wen Duan（101）It is added to the appearance
Between emptying（100）It is interior；And
One exhaust end（300）, with the accommodating space（100）It is connected, the accommodating space（100）Internal air passes through institute
State exhaust end（300）Discharge;
The liquid feeding end（200）Pass through first flow path（500）With the accommodating space（100）It is connected, the first flow path
（500）On be provided with the first diluting tank（502）, and first diluting tank（502）The extreme lower position of interior solution is higher than the appearance
Between emptying（100）The extreme higher position of interior solution；
The exhaust end（300）Pass through second flow path（600）With the accommodating space（100）It is connected；
The second flow path（600）On be provided with the first storage pool（601）, first storage pool（601）To overflowing the appearance
Between emptying（100）Solution stored；
The second flow path（600）On be additionally provided with the first colour developing pond（602）, the solution is full of first storage pool
（601）Afterwards, into first colour developing pond（602）；
The first flow path（500）On be provided with the first inflection point（501）, solution is in the entrance accommodating space（100）Afterwards in institute
State the first inflection point（501）Place forms connected vessels type solution and retains；
The second flow path（600）On be provided with Second Inflexion Point（603）, solution is in the outflow accommodating space（100）Afterwards in institute
State Second Inflexion Point（603）Place forms connected vessels type solution and retains.
2. differential temperature reaction chip as described in claim 1, it is characterised in that：The first flow path（500）With the accommodating sky
Between（100）The bottom end of vertical direction is connected.
3. differential temperature reaction chip as described in claim 1, it is characterised in that：The second flow path（600）With the accommodating sky
Between（100）The top of vertical direction is connected.
4. differential temperature reaction chip as described in claim 1, it is characterised in that：The second flow path（600）On be additionally provided with
One buffer pool（604）, the solution is full of first colour developing pond（602）Afterwards, into first buffer pool（604）.
5. differential temperature reaction chip as described in claim 1, it is characterised in that：The second flow path（600）On be additionally provided with
One absorption cell（605）, the solution is full of the accommodating space（100）Enter first absorption cell afterwards（605）.
6. differential temperature reaction chip as described in claim 1, it is characterised in that：The second flow path（600）On be additionally provided with
One test paper storehouse（606）, the solution is full of the accommodating space（100）Enter first test paper storehouse from one end afterwards（606）, institute
State the first test paper storehouse（606）The other end and the exhaust end（300）It is connected.
7. differential temperature reaction chip as claimed in claim 5, it is characterised in that：First absorption cell（605）With the first test paper
Storehouse（606）It is connected.
8. the differential temperature reaction chip as described in claim 1 or 7 is any, it is characterised in that：Further include,
One third base material（700）, it is set to the first base material（800）The second interarea（S）On, with described to second base
Material（900）It is completed together to accommodating space（100）It is sealed.
9. a kind of temperature-conditioned metal bath, it is characterised in that：Including heating unit（1000）, including energization module（1001）With contact mould
Block（1002）, the contact module（1002）Can divide into differential temperature reaction chip as described in claim 1 Wen Duan
（101）It is formed with the contact of difference in height, the energization module（1001）By to the contact module（1002）In turn will it be powered
Electric energy is converted into thermal energy；And control temperature unit（2000）, by the energization module（1001）Control so that it is described to connect
Touch block（1002）It is respectively formed the control of different temperatures.
10. temperature-conditioned metal bath as claimed in claim 9, it is characterised in that：Further include,
Gateway unit（3000）, form the space that can house the differential temperature reaction chip so that the contact module（1002）
Can divide into the differential temperature reaction chip Wen Duan（101）It is formed with the contact of difference in height.
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| US4689303A (en) * | 1986-02-26 | 1987-08-25 | Kvm Engineering, Inc. | Controlled circulation incubator |
| DE19717085C2 (en) * | 1997-04-23 | 1999-06-17 | Bruker Daltonik Gmbh | Processes and devices for extremely fast DNA multiplication using polymerase chain reactions (PCR) |
| KR100552706B1 (en) * | 2004-03-12 | 2006-02-20 | 삼성전자주식회사 | Nucleic Acid Amplification Method and Apparatus |
| CN203044053U (en) * | 2013-02-22 | 2013-07-10 | 苏州二叶制药有限公司 | Ninety-six-well liquid reaction plate |
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Application publication date: 20170104 Assignee: SHANGHAI KINBIO TECH Co.,Ltd. Assignor: QUICKING BIOTECH Co.,Ltd. Contract record no.: X2024980012286 Denomination of invention: A differential temperature reaction chip and temperature controlled metal bath Granted publication date: 20181026 License type: Common License Record date: 20240816 |