CN106206485A - Imageing sensor module and preparation method thereof - Google Patents

Abstract

The embodiment of the present invention discloses an image sensor module, including: an image sensor chip and at least one auxiliary chip, the image sensor chip and the at least one auxiliary chip are packaged into a chip package by a plastic packaging material, the The circuit faces of the image sensing chip and the at least one auxiliary chip face the same direction; the image sensing chip includes an image sensing unit, and packaging glass arranged above the light-incident surface of the image sensing unit, the A light through hole corresponding to the packaging glass is formed on the front of the chip package, and a rewiring that is electrically connected to the pads of the image sensor chip and the pads of the at least one auxiliary chip is formed on the back of the chip package. A pattern, a plurality of bumps are formed on the rewiring pattern; a lens holder is installed on the front of the chip package, and a lens group is fixed on the lens holder. The invention improves the reliability of the image sensor module and reduces the difficulty of wiring.

Description

Image sensor module and manufacturing method thereof

technical field

The invention relates to the field of sensors, in particular to an image sensor module and a manufacturing method thereof.

Background technique

An image sensor chip is a semiconductor device that senses external light and converts it into electrical signals. After the image sensor chip is manufactured, a series of packaging processes are first performed on the image sensor chip, and then the mirror mount bracket and the lens are installed to form an image sensor module. Image sensor modules are mainly used in electronic devices such as smartphones, tablet computers, digital cameras, car driving recorders, and children's toys.

The existing image sensor chip packaging method is mainly COB (Chip On Board) packaging, the bare chip is attached to the interconnection substrate with conductive or non-conductive adhesive, and then wire bonding is performed to realize its electrical connection. The image sensor packaging method in the prior art only packages a single image sensor chip, and the image sensor module also includes many peripheral auxiliary chips, such as image processing chips, central processing chips and driver chips, etc. These chips need to be attached to the soft and hard Combined with the board, but such a structure has the following disadvantages:

Rigid-flex board has a certain degree of flexibility. Therefore, when the board is bent and collided, the components attached to it are likely to break the pads, which reduces the reliability of the image sensor module; moreover, the rigid-flex board The bonding board needs to be attached to peripheral auxiliary chips, which will inevitably increase the number of layers of the flexible and rigid bonding board, and the difficulty of wiring will also increase.

Contents of the invention

In view of this, the present invention proposes an image sensor module and a manufacturing method thereof to solve the problems existing in the existing image sensor module, improve the reliability of the image sensor module, and reduce the difficulty of wiring.

On the one hand, an embodiment of the present invention provides an image sensor module, including:

The image sensing chip and at least one auxiliary chip, the image sensing chip and the at least one auxiliary chip are packaged into a chip package by a plastic encapsulation material, and the circuit faces of the image sensing chip and the at least one auxiliary chip face the same direction;

The image sensing chip includes an image sensing unit and packaging glass arranged above the light-incident surface of the image sensing unit. The front side of the above-mentioned chip package is formed with a light hole corresponding to the packaging glass, and its back is formed with a hole corresponding to the image sensing chip. A rewiring pattern for electrically connecting the pads of the at least one auxiliary chip to the pads of the auxiliary chip, and a plurality of bumps are formed on the rewiring pattern;

The lens bracket is installed on the front of the chip package, and the lens bracket is fixed with a lens group, and the lens group includes at least one optical film.

Exemplarily, the above-mentioned molding material covers the edge of the light-incident surface of the packaging glass to form a light-through hole.

Exemplarily, the image sensor module also includes a rigid-flex board, the rigid-flex board includes a conductive circuit layer, and a plurality of welding pads arranged on the front surface of the rigid-flex board, and the plurality of welding pads are respectively connected to the chip Multiple bumps on the redistribution pattern on the back of the package are electrically connected.

Exemplarily, a reinforcing steel plate is provided on the back of the rigid-flex board.

Exemplarily, the packaging glass is infrared filter glass;

Alternatively, at least one optical film in the lens group is an infrared filter optical film;

Alternatively, an infrared filtering optical film is arranged between the lens group and the packaging glass, and the infrared filtering optical film is fixed on the lens bracket.

Exemplarily, the auxiliary chip includes one or more of an image processing chip, a central processing chip, a lens group driving chip, and passive components.

Exemplarily, the image sensing unit and the packaging glass are bonded together by glue.

On the other hand, an embodiment of the present invention provides a method for manufacturing an image sensor module, including:

The image sensing chip and at least one auxiliary chip are packaged into a chip package by a plastic packaging material, wherein the image sensing chip includes an image sensing unit, and packaging glass arranged above the light-incident surface of the image sensing unit. A light hole corresponding to the packaging glass is formed on the front of the body;

A rewiring pattern electrically connected to the pads of the image sensor chip and the pads of at least one auxiliary chip is formed on the back of the chip package, and a plurality of bumps are formed on the rewiring pattern;

A lens bracket is installed on the front surface of the chip package, and a lens group is fixed on the lens bracket, and the lens group includes at least one optical film.

Exemplarily, the manufacturing method of the image sensor module further includes:

A rigid-flex board is provided, the rigid-flex board includes a conductive circuit layer, and a plurality of solder pads arranged on the front side of the rigid-flex board;

The multiple pads of the rigid-flex board are respectively electrically connected to the multiple bumps on the rewiring pattern on the back of the chip package.

Exemplarily, the above-mentioned packaging of the image sensor chip and at least one auxiliary chip by a plastic encapsulation material into a chip package includes:

providing a support substrate, an image sensing chip, and at least one companion chip;

attaching the image sensor chip and at least one auxiliary chip to the support substrate;

Plastic packaging the image sensor chip and at least one auxiliary chip into a chip package with a plastic packaging material;

Peel off the support substrate.

Exemplarily, providing an image sensor chip includes:

Provide encapsulation glass and image sensing wafer. The image sensing wafer includes multiple image sensing units, forming a dam on the encapsulation glass and bonding with the image sensing unit;

Fabricate through-silicon vias on the back of the image sensing wafer, and expose pads at the bottom of the through-silicon vias;

Deposition of insulating layers on the backside of image sensing wafers and in TSVs;

The pad at the bottom of the TSV is exposed by drilling technology;

Deposit metal layers on the backside of the image sensing wafer and in the through-silicon vias, and perform metal thickening;

A photolithography process is used to remove redundant metal layers and form bonding pads of the image sensing chip, and the image sensing wafer is cut with the image sensing unit as a unit to obtain independent image sensing chips.

Exemplarily, the above-mentioned making of the rewiring pattern on the back of the chip package includes:

Deposit a metal layer on the back of the chip package and thicken the metal;

The metal layer is processed by photolithography to form a rewiring pattern;

Nickel-gold treatment is performed on the surface of the rewiring pattern, and the solder mask is encapsulated, and the solder pads that need to be balled are exposed through exposure and development;

Solder balls are made on the surface of the pad to form multiple bumps on the redistribution pattern.

Embodiments of the present invention provide an image sensor module and a manufacturing method thereof. The image sensor module realizes an image sensor chip and at least one auxiliary chip by packaging the image sensor chip and at least one auxiliary chip into a chip package. The system-in-chip package of the chip effectively avoids the breakage of the bonding pad of the auxiliary chip, improves the reliability of the image sensing module, and reduces the number of wiring layers of the auxiliary chip and reduces the difficulty of wiring.

Description of drawings

FIG. 1 is a schematic structural diagram of an image sensor module provided by Embodiment 1 of the present invention;

FIG. 2 is a schematic structural diagram of an image sensor module provided in Embodiment 2 of the present invention;

FIG. 3 is a flow chart of a manufacturing method of an image sensor module provided by Embodiment 3 of the present invention;

4a to 4r are process step diagrams of the method for manufacturing an image sensor chip provided by Embodiment 4 of the present invention;

5a to 5l are process steps diagrams of the chip package manufacturing method provided by Embodiment 4 of the present invention;

6a to 6d are step diagrams of the assembly process of the image sensor module provided by Embodiment 4 of the present invention.

detailed description

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings but not all of them.

Embodiment one

FIG. 1 is a schematic structural diagram of an image sensor module provided by Embodiment 1 of the present invention. The image sensor module provided by the embodiments of the present invention can be applied to electronic devices such as smart phones, tablet computers, digital cameras, car driving recorders, and children's toys.

As shown in Figure 1, the image sensor module provided in this embodiment includes:

The image sensing chip 110 and at least one auxiliary chip 120, the image sensing chip 110 and at least one auxiliary chip 120 are packaged into a chip package 100 by the plastic packaging material 101, and the circuit of the image sensing chip 110 and at least one auxiliary chip 120 face in the same direction;

The image sensing chip 110 includes an image sensing unit 111, and an encapsulation glass 112 arranged above the light-incident surface of the image sensing unit 111. The front side of the above-mentioned chip package 100 forms a light through hole 102 corresponding to the encapsulation glass 112. A rewiring pattern electrically connected to the bonding pad of the image sensor chip 110 and the bonding pad of at least one auxiliary chip 120 is formed, and a plurality of bumps 103 are formed on the rewiring pattern;

The lens holder 130 is installed on the front of the chip package 100 , and the lens holder 130 is fixed with a lens group 140 , and the lens group 140 includes at least one optical film 141 .

The optical film 141 can be a glass sheet, or a resin plastic sheet.

Plastic encapsulation is a technology that replaces metal, glass, ceramics, etc. with plastic to encapsulate electronic components. Compared with the prior art, in the image sensor module provided by Embodiment 1 of the present invention, the image sensor chip 110 and at least one auxiliary chip 120 is encapsulated by plastic encapsulation material 101 into a chip package 100, which avoids the situation in the prior art that when the image sensor module is subjected to an external force, the welding pads on the periphery of the auxiliary chip are broken.

Optionally, the plastic packaging material may be epoxy molding compound. The image sensor module provided in this embodiment packages the image sensor chip 110 and at least one auxiliary chip 120 into a chip package 100 through a plastic packaging process to realize system-in-package. Wherein, the image sensing chip 110 and at least one auxiliary chip 120 in the chip package 100 are tiled in a two-dimensional manner, and the circuit surfaces thereof face the same direction. Preferably, the bonding pads on the circuit surface of the image sensor chip 110 and the at least one auxiliary chip 120 may be on the same plane, and such a structure facilitates the rewiring process on the backside of the chip package 100 . Since at least one auxiliary chip 120 is plastic-encapsulated in the chip package 100 and rewired simultaneously with the image sensor chip 110 , the number of wiring layers is reduced and the difficulty of wiring is reduced.

Optionally, if there are too many auxiliary chips 120 mounted, when one side of the chip package 100 cannot be put down, through holes can also be opened in the plastic packaging layer, and metal can be filled in the through holes, and then on the other side of the chip package 100 The auxiliary chip 120 is mounted.

In the image sensor module provided in Embodiment 1 of the present invention, the image sensor chip 110 includes an image sensor unit 111, and an encapsulation glass 112 arranged above the light-incident surface of the image sensor unit 111, wherein the front surface of the chip package 100 A light hole 102 corresponding to the packaging glass is formed. Exemplarily, the light hole 102 is formed by covering the edge of the light-incident surface of the packaging glass 112 with the molding material 101 , so that external light passes through the packaging glass 112 and irradiates the image sensing unit 111 .

Optionally, a fitting structure is formed where the edge of the light-incident surface of the packaging glass 112 is in contact with the molding material 101 , so that the molding layer firmly grasps the packaging glass 112 and improves the mechanical reliability of the image sensor module.

Embodiment 1 of the present invention provides an image sensor module. The image sensor module realizes a system of an image sensor chip and at least one auxiliary chip by packaging the image sensor chip and at least one auxiliary chip into a chip package. Level packaging effectively avoids the bonding pad breakage of the auxiliary chip, improves the reliability of the image sensor module, reduces the number of wiring layers of the auxiliary chip, and reduces the difficulty of wiring.

Embodiment two

FIG. 2 is a schematic structural diagram of an image sensor module provided by Embodiment 2 of the present invention. As shown in FIG. 2 , further, the image sensor module provided in this embodiment also includes a rigid-flex board 150 , wherein the rigid-flex board 150 includes a conductive circuit layer, and the rigid-flex board 150 is arranged on the front surface A plurality of welding pads are respectively electrically connected to a plurality of bumps 103 on the redistribution pattern on the back of the chip package 100 .

Rigid-flex boards, that is, flexible circuit boards (FPC) and rigid circuit boards (PCB), are combined according to relevant process requirements after lamination and other processes to form circuit boards with FPC characteristics and PCB characteristics. The image sensor module provided by Embodiment 2 of the present invention is attached to the rigid-flex board 150. The rigid-flex board 150 has both a certain flexible area and a certain rigid area, which helps to save the internal space of the image sensor module. , to improve the performance of the image sensor module.

Optionally, a reinforcing steel plate 160 is provided on the back of the rigid-flex board 150 .

In order to filter infrared light and improve the imaging quality of the image sensor, an infrared filter optical diaphragm is generally installed in the image sensor module. The position of the infrared filter optical film in the image sensor module is not limited. Optionally, an infrared filter optical film 170 is arranged between the lens group 140 and the packaging glass 112, and the infrared filter optical film 170 is fixed On the lens holder 130.

Optionally, the packaging glass 112 is infrared filter glass, or at least one optical film 141 in the lens group 140 is an infrared filter optical film.

Optionally, the auxiliary chip 120 in the embodiment of the present invention may include one or more of an image processing chip, a central processing chip, a lens group driving chip, and passive components, wherein the passive components include capacitors, resistors, and inductors, etc. .

Optionally, the image sensing unit 111 and the packaging glass 112 are bonded together by glue.

Optionally, a dam is formed on the packaging glass 112 to form a cavity when it is pressed together with the image sensing unit 111 .

Embodiment 2 of the present invention provides an image sensor module. The image sensor module packages the image sensor chip and at least one auxiliary chip into a chip package and attaches it to the soft-hard board, saving image The internal space of the sensor module realizes the system-in-package of the image sensor chip and at least one auxiliary chip, effectively avoids the bonding pad breakage of the auxiliary chip, improves the reliability of the image sensing module, and reduces the wiring of the auxiliary chip The number of layers reduces the difficulty of wiring.

Embodiment Three

FIG. 3 is a flowchart of a manufacturing method of an image sensor module provided by Embodiment 3 of the present invention. This embodiment provides a method for manufacturing an image sensor module, including:

S110, packaging the image sensing chip and at least one auxiliary chip into a chip package with a plastic packaging material, wherein the image sensing chip includes an image sensing unit, and packaging glass arranged above the light-incident surface of the image sensing unit, A light hole corresponding to the packaging glass is formed on the front of the chip package;

S120, forming a rewiring pattern electrically connected to the bonding pad of the image sensor chip and the bonding pad of at least one auxiliary chip on the back of the chip package, and a plurality of bumps are formed on the rewiring pattern;

S130. Install a lens holder on the front surface of the chip package, a lens group is fixed on the lens holder, and the lens group includes at least one optical film.

Exemplarily, the manufacturing method of the image sensor module further includes:

S140. Provide a rigid-flex board. The rigid-flex board includes a conductive circuit layer and a plurality of welding pads arranged on the front side of the rigid-flex board. Rewire multiple bump electrical connections on the pattern.

Embodiment 3 of the present invention provides a method for manufacturing an image sensor module. By packaging the image sensor chip and at least one auxiliary chip into a chip package and attaching it to a rigid-flex board, the image sensor module is saved. The internal space of the group realizes the system-in-package of the image sensor chip and at least one auxiliary chip, effectively avoids the bonding pad breakage of the auxiliary chip, improves the reliability of the image sensing module, and reduces the number of wiring layers of the auxiliary chip , reducing the wiring difficulty.

Embodiment Four

On the basis of the above-mentioned embodiments, the method for manufacturing an image sensor provided by Embodiment 4 of the present invention may include three parts. The first part: making an image sensor chip.

FIG. 4a to FIG. 4r are process step diagrams of the method for fabricating an image sensor chip provided by Embodiment 4 of the present invention. As shown in FIG. 4 a , an image sensing wafer is provided, and the image sensing wafer includes a plurality of image sensing units 111 , that is, small grids on the image sensing wafer, and each image sensing unit 111 is identical. For the convenience of the following description, two of them are selected for section graphic introduction.

As shown in FIG. 4b, an encapsulating glass 112 is provided. For the convenience of drawing, the dotted line in FIG. 4b indicates symmetry.

Optionally, the packaging glass 112 may be common glass or infrared filter glass, the function of which is to filter infrared light and improve the imaging quality of the image sensor.

As shown in FIG. 4 c , a dam 113 is formed on the packaging glass 112 to form a cavity when it is pressed together with the image sensing unit 111 .

As shown in FIG. 4 d , the packaging glass 112 and the image sensing unit 111 are bonded together. Optionally, the packaging glass 112 and the image sensing unit 111 are bonded together by glue.

As shown in FIG. 4e, thinning is performed on the back of the image sensing unit 111, so as to reduce the thickness of the product, and at the same time reduce the difficulty and time of the TSV process.

As shown in Figure 4f and Figure 4g, where Figure 4g is a partial enlarged view of the circle in Figure 4f, the through-silicon hole 114 is formed on the back of the image sensing unit 111, and optionally, the through-silicon hole 114 is formed by a dry etching process. The wafer bonding pad 115 is exposed at the bottom of the TSV 114 .

As shown in FIG. 4h and FIG. 4i , where FIG. 4i is a partial enlarged view of the circle in FIG. 4g , an insulating layer 116 is deposited on the back of the image sensing unit 111 to electrically insulate subsequent processes from the TSV 114 . Optionally, the insulating layer 116 is deposited by a spraying process.

As shown in Fig. 4j and Fig. 4k, Fig. 4k is a partially enlarged view of the circle in Fig. 4j, exposing the metal layer of the wafer pad 115 at the bottom of the TSV 114, optionally, using laser drilling technology.

As shown in FIG. 4l and FIG. 4m , wherein FIG. 4m is a partially enlarged view of the circle in FIG. 4l , a metal layer 117 is deposited on the insulating layer 116 for connecting the wafer pad 115 . And thicken the metal layer 117 to make it reach the required thickness. Optionally, the seed layer metal is deposited by means of magnetron sputtering, vapor deposition, etc., and the metal is electroplated on the seed layer metal to achieve metal thickening.

As shown in FIG. 4n and FIG. 4o, where FIG. 4o is a partially enlarged view of the circle in FIG. 4n, a photoresist 118 is coated on the metal layer 117 for photolithography. Optionally, the photoresist 118 is spin-coated by a coating process, and then exposed and developed to cover the metal layer 117 to be retained with the photoresist 118 .

As shown in FIG. 4p and FIG. 4q, where FIG. 4q is a partial enlarged view of the circle in FIG. 4p, the excess metal layer is removed by etching to form the pad 117a of the image sensing unit 111, and the photoresist is removed.

As shown in FIG. 4 r , the image sensing wafer is cut in units of image sensing units 111 to obtain independent image sensing chips 110 . Preferably, the cutting is performed with a mechanical blade or a laser.

The second part: packaging the image sensor chip and the auxiliary chip into a chip package.

5a to 5l are process steps diagrams of the chip package manufacturing method provided by Embodiment 4 of the present invention.

As shown in FIG. 5 a , a supporting substrate 104 , an image sensing chip 110 and at least one auxiliary chip 120 are provided, and the image sensing chip 110 and at least one auxiliary chip 120 are attached to the supporting substrate 104 .

Preferably, a temporary bonding material 105 is laid on the support substrate 104 for attaching the image sensor chip 110 and at least one auxiliary chip 120 . Moreover, the temporary bonding material 105 can separate the support substrate 104 by means of laser, UV light, machinery, or heating.

As shown in FIG. 5 b , the image sensor chip 110 and at least one auxiliary chip 120 are plastic-packed into a chip package 100 with a plastic packaging material 101 to realize system-in-package, and a light through hole 102 is formed on the front side of the chip package 100 .

As shown in Figure 5c, preferably, if there are too many auxiliary chips 120 mounted, when one side of the chip package 100 cannot be put down, a through hole 106 can also be opened in the plastic packaging layer, and metal can be filled in the through hole 106, and then The auxiliary chip 120 is mounted on the other side of the chip package 100 .

As shown in FIG. 5d, the support substrate 104 is peeled off. Preferably, the support substrate 104 is peeled off by laser, UV light or mechanical means, and the temporary bonding material is cleaned.

Making rewiring patterns on the back side of the chip package 100, including:

As shown in FIG. 5e and FIG. 5f , wherein FIG. 5f is a partial enlarged view of the circle in FIG. 5e , a metal layer 107 is deposited on the back of the chip package 100 and the metal is thickened. Preferably, the seed layer metal is deposited on the back of the chip package 100 by magnetron sputtering or evaporation, and then the metal is electroplated on the seed layer metal to make the metal layer reach a required thickness.

As shown in FIG. 5 g , a photoresist 108 is coated on the surface of the metal layer 107 , and the metal layer 107 to be retained is covered with the photoresist 108 through exposure and development.

As shown in Figure 5h and Figure 5i, wherein Figure 5i is a partial enlarged view of the circle in Figure 5h, the redundant metal layer is removed, optionally, wet etching is used for removal, and the photoresist is removed to form a chip package The bonding pad 107a of 100 constitutes a rewiring pattern.

As shown in Figure 5j and Figure 5k, Figure 5k is a partial enlarged view of the circle in Figure 5j, nickel-gold treatment is performed on the surface of the rewiring pattern, and the insulating solder resist layer 109 is encapsulated, and the area that needs to be balled is exposed through exposure and development. pad 107a.

As shown in FIG. 5l, solder balls are formed on the surface of the pad 107a to form a plurality of bumps 103 in the redistribution pattern.

Part III: Assembly of Image Sensor Module

6a to 6d are step diagrams of the assembly process of the image sensor module provided by Embodiment 4 of the present invention.

As shown in FIG. 6 a and FIG. 6 b , the packaged chip package 100 is pasted on a rigid-flex board 150 , wherein the rigid-flex board 150 may be provided with a reinforcing steel plate 160 or without a reinforcing steel plate 160 .

As shown in FIG. 6c and FIG. 6d , a lens holder 130 is installed on the front surface of the chip package 100 , wherein a lens group 140 is fixed on the lens holder 130 , and the lens group 140 includes at least one optical film. Preferably, if the packaging glass 112 does not use infrared filter glass in the preceding steps, an infrared filter optical film 170 is assembled on the lens holder 130 . After the image sensor module is assembled, it can realize the camera function.

Embodiment 4 of the present invention provides a method for manufacturing an image sensor module. By packaging the image sensor chip and at least one auxiliary chip into a chip package, the system-in-package of the image sensor chip and at least one auxiliary chip is realized. , effectively avoiding the breakage of the bonding pad of the auxiliary chip, improving the reliability of the image sensing module, reducing the number of wiring layers of the auxiliary chip, and reducing the difficulty of wiring.

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, and the present invention The scope is determined by the scope of the appended claims.

Claims (12)

1. An image sensor module, characterized in that, comprising: An image sensor chip and at least one auxiliary chip, the image sensor chip and the at least one auxiliary chip are packaged by a plastic encapsulation material into a chip package, and the circuit faces of the image sensor chip and the at least one auxiliary chip face the same direction; The image sensing chip includes an image sensing unit, and packaging glass arranged above the light-incident surface of the image sensing unit, a light through hole corresponding to the packaging glass is formed on the front of the chip package, and the chip A rewiring pattern electrically connected to the pads of the image sensor chip and the pads of the at least one auxiliary chip is formed on the back of the package, and a plurality of bumps are formed on the rewiring pattern; A lens bracket is installed on the front of the chip package, and a lens group is fixed on the lens bracket, and the lens group includes at least one optical film. 2 . The image sensor module according to claim 1 , wherein the molding material covers an edge of the light incident surface of the packaging glass to form the light through hole. 3 . 3. The image sensor module according to claim 1, further comprising a rigid-flex board, the rigid-flex board comprising a conductive circuit layer, and a plurality of rigid-flex boards arranged on the front surface Welding pads, the plurality of welding pads are respectively electrically connected to the plurality of bumps on the rewiring pattern on the back of the chip package. 4. The image sensor module according to claim 3, wherein a reinforcing steel plate is arranged on the back of the rigid-flex board. 5. The image sensor module according to claim 1, wherein the packaging glass is infrared filter glass; Alternatively, at least one optical film in the lens group is an infrared filter optical film; Alternatively, an infrared filter optical film is arranged between the lens group and the packaging glass, and the infrared filter optical film is fixed on the lens bracket. 6. The image sensor module according to any one of claims 1-5, wherein the auxiliary chip includes one or more of an image processing chip, a central processing chip, a lens group driving chip and passive components . 7. The image sensor module according to any one of claims 1-5, wherein the image sensing unit and the packaging glass are bonded together by glue. 8. A method for manufacturing an image sensor module, comprising: The image sensor chip and at least one auxiliary chip are packaged into a chip package by plastic packaging material, the circuit faces of the image sensor chip and the at least one auxiliary chip face the same direction, wherein the image sensor chip includes an image a sensing unit, and an encapsulation glass arranged above the light-incident surface of the image sensing unit, and a light-through hole corresponding to the encapsulation glass is formed on the front of the chip package; A rewiring pattern electrically connected to the pads of the image sensor chip and the pads of the at least one auxiliary chip is formed on the back of the chip package, and a plurality of bumps are formed on the rewiring pattern; A lens bracket is installed on the front surface of the chip package, and a lens group is fixed on the lens bracket, and the lens group includes at least one optical film. 9. The manufacturing method of the image sensor module according to claim 8, further comprising: A rigid-flex board is provided, the rigid-flex board includes a conductive circuit layer, and a plurality of solder pads arranged on the front surface of the rigid-flex board; Electrically connect the plurality of welding pads of the rigid-flex board to the plurality of bumps on the rewiring pattern on the back of the chip package. 10. The manufacturing method of the image sensor module according to claim 8, wherein said packaging the image sensor chip and the at least one auxiliary chip into a chip package by a plastic packaging material comprises: providing a support substrate, an image sensing chip, and at least one companion chip; attaching the image sensor chip and the at least one auxiliary chip to the support substrate; Molding the image sensing chip and the at least one auxiliary chip into a chip package with a molding material; The support substrate is peeled off. 11. The manufacturing method of the image sensor module according to claim 10, wherein providing an image sensor chip comprises: Provide encapsulation glass and an image sensing wafer, the image sensing wafer includes a plurality of image sensing units, a dam is formed on the encapsulation glass, and bonded together with the image sensing units; making through-silicon vias on the back of the image sensing wafer, and exposing pads at the bottom of the through-silicon vias; Depositing an insulating layer on the back of the image sensing wafer and in the TSVs; exposing the pad at the bottom of the TSV by drilling; Depositing a metal layer on the back of the image sensing wafer and in the TSV, and thickening the metal; A photolithography process is used to remove redundant metal layers and form bonding pads of the image sensing chip, and the image sensing wafer is cut into units of the image sensing unit to obtain independent image sensing chips. 12. The manufacturing method of the image sensor module according to claim 10, wherein said making a rewiring pattern on the back of the chip package comprises: Depositing a metal layer on the back of the chip package and thickening the metal; Processing the metal layer by using a photolithography process to form a rewiring pattern; Perform nickel-gold treatment on the surface of the rewiring pattern, and encapsulate the solder resist layer, and expose the solder pads that need to be balled through exposure and development; Solder balls are made on the surface of the pad to form a plurality of bumps on the rewiring pattern.