CN106161903A - Circuit board and photographic head module for photographic head module - Google Patents
Circuit board and photographic head module for photographic head module Download PDFInfo
- Publication number
- CN106161903A CN106161903A CN201610726325.7A CN201610726325A CN106161903A CN 106161903 A CN106161903 A CN 106161903A CN 201610726325 A CN201610726325 A CN 201610726325A CN 106161903 A CN106161903 A CN 106161903A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fpc
- strengthening course
- photographic head
- head module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005728 strengthening Methods 0.000 claims abstract description 40
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of circuit board for photographic head module and photographic head module.This circuit board includes: pcb board, FPC and for improving the strengthening course of bonding strength, described pcb board is connected with external circuit signals by described FPC, and described strengthening course is arranged on the position being connected with FPC of FPC and pcb board.Due to the existence of strengthening course, thus improve the bonding strength of FPC and pcb board.So, when taking, putting photographic head module, the position that FPC is connected with pcb board is not susceptible to bending.Thus rupture because often bending in the position avoiding connection.
Description
Technical field
The present invention relates to camera head technical field, more particularly, to a kind of circuit board for photographic head module with
And photographic head module.
Background technology
Photographic head module (CCM) is applied in the terminal.This module generally comprises voice coil motor, camera lens, optical filter, one-tenth
As chip and wiring board, wherein, head includes voice coil motor, the camera lens being arranged in voice coil motor, optical filter etc..Imager chip
Arrange in the circuit board.Wiring board includes soft or hard joint portion.Due to the profile feature of photographic head module, i.e. head is heavier, therefore
In photographic head module group assembling or test process, soft or hard joint portion is often bent.Soft or hard joint portion is caused to be easy to fracture.From
And make photographic head module lose efficacy.
In a solution, at the positive cake glue of soft or hard joint portion.To reach the effect of the intensity improving soft or hard joint portion
Really.But some glue can not avoid the fracture of soft or hard joint portion completely.And the soft or hard joint portion of a lot of modules is the shortest, some glue not side
Just operate.
Summary of the invention
It is an object of the present invention to provide a kind of circuit board for photographic head module and the new skill of photographic head module
Art scheme.
According to an aspect of the invention, it is provided a kind of circuit board for photographic head module.This circuit board includes PCB
Plate, FPC and for improving the strengthening course of bonding strength, described pcb board is connected with external circuit signals by described FPC, institute
State strengthening course to be arranged on the position being connected with FPC of FPC and pcb board.
Alternatively, described strengthening course is arranged on the side relative with support of described circuit board.
Alternatively, also including that adapter, described adapter are connected with described FPC signal, described strengthening course is arranged on institute
State the position being connected with described FPC of adapter.
Alternatively, described strengthening course is electromagnetic shielding film, described electromagnetic shielding film by binding agent be arranged on FPC and
On the position being connected with FPC of pcb board.
Alternatively, described PCB is square, is all covered with strengthening course on the four edges of described PCB.
Alternatively, the thickness of described strengthening course is 16 μm.
Alternatively, the width of described strengthening course is 0.5-0.8.
According to a further aspect in the invention, it is provided that a kind of photographic head module.This module includes: voice coil motor, camera lens, optical filtering
The described circuit board that sheet, imager chip and the present invention provide, wherein, described camera lens is arranged in described voice coil motor
On VCM carrier, described voice coil motor is arranged on described pcb board by support, is additionally provided with imaging core on described pcb board
Sheet, described optical filter is arranged on the windowing of described support.
It was found by the inventors of the present invention that conventionally, as the profile feature of photographic head module, i.e. head is heavier,
Therefore in photographic head module group assembling or test process, the soft or hard joint portion of circuit board is often bent.Use method for dispensing glue
Soft or hard joint portion cannot be avoided completely to rupture.Therefore, the present invention is to be realized technical assignment or technology to be solved are asked
Topic be that those skilled in the art never expect or it is not expected that, therefore the present invention is a kind of new technical scheme.
The circuit board that the present invention provides, due to the existence of strengthening course, thus improves the bonding strength of FPC and pcb board.This
Sample, when taking, putting photographic head module, the position that FPC is connected with pcb board will not bend.Thus avoid the position of connection
Rupture because often bending.Improve the service life of circuit board.
By detailed description to the exemplary embodiment of the present invention referring to the drawings, the further feature of the present invention and
Advantage will be made apparent from.
Accompanying drawing explanation
Combined in the description and the accompanying drawing of the part that constitutes description shows embodiments of the invention, and even
With its explanation together for explaining the principle of the present invention.
The structural representation of the circuit board of Fig. 1: the embodiment of the present invention.
Along the sectional view of line A-A in Fig. 2: Fig. 1.
The structural representation of the another kind of circuit board of Fig. 3: the embodiment of the present invention.
Along the sectional view of line B-B in Fig. 4: Fig. 3.
The structural representation of the circuit board with adapter of Fig. 5: the embodiment of the present invention.
Along the sectional view of line C-C in Fig. 6: Fig. 5.
The exploded view of the photographic head module of Fig. 7: the embodiment of the present invention.
In figure, 11:PCB plate；12:FPC；13: electromagnetic shielding film；14: support；15: adapter；16: camera lens；17: voice coil loudspeaker voice coil
Motor；18: optical filter；19: imager chip.
Detailed description of the invention
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should also be noted that unless additionally have
Body illustrates, the parts illustrated the most in these embodiments and positioned opposite, the numerical expression of step and numerical value are not intended to this
The scope of invention.
Description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And any restriction applied or use.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of when, described technology, method and apparatus should be considered a part for description.
It is shown here that any occurrence should be construed as merely exemplary with in all examples discussed, and not
It is as restriction.Therefore, other example of exemplary embodiment can have different values.
It should also be noted that similar label and letter represent similar terms, therefore, the most a certain Xiang Yi in following accompanying drawing
Individual accompanying drawing is defined, then need not it is further discussed in accompanying drawing subsequently.
The invention provides a kind of circuit board for photographic head module.As Figure 1-4, this circuit board includes pcb board
11 (printed substrates), FPC12 (flexible circuit board) and for improving the strengthening course of bonding strength.Pcb board 11 and FPC12 is even
It is connected on one.Pcb board 11 is connected with external circuit signals by FPC12.Strengthening course is arranged on FPC12 and pcb board 11
On the position being connected with FPC12.
Due to the existence of strengthening course, make the bonding strength that improve FPC12 with pcb board 11.So, photographic head is being taken, put
During module, the position that FPC12 is connected with pcb board 11 is not susceptible to bending.Thus avoid the position of connection because of frequent bending
Rupture.Improve the service life of circuit board.
In a kind of specific embodiment of the present invention, circuit board also includes adapter 15.As it can be seen in figures 5 and 6, connect
Device 15 is for being directly connected with external circuit signals.Such as, adapter 15 can directly be inserted on the mainboard of mobile terminal, with master
Circuit on plate is coupled.Adapter 15 is connected with FPC12 signal.The quality of adapter 15 is relatively big, is taking, putting photographic head
Easily make FPC12 bend during module, even rupture.In order to avoid FPC12 ruptures with adapter 15.Except
Arranging on FPC12 outside strengthening course, strengthening course is also arranged on the position being connected with FPC12 of adapter 15.As can be seen here, due to
The existence of strengthening course, is the structure of fixing connection, such that it is able to be effectively prevented between adapter 15, FPC12 and pcb board 11
Circuit board ruptures because often bending.
Strengthening course can be arranged on being used for and propping up of the bottom of circuit board, i.e. relative with support 14 side or circuit board
The side that frame 14 connects.Owing to needing to ensure the flatness that the two connects when circuit board is with the connection of support 14, and strengthening course
Be provided with cause the rough and uneven in surface of circuit board surface.It is preferred, therefore, that strengthening course to be arranged on the bottom of circuit board
On.
The material of strengthening course can be, but not limited to, plastics, metal, rubber or pottery.Preferred in the one of the present invention
Embodiment in, strengthening course is electromagnetic shielding film 13 (EMI), the wide material sources of electromagnetic shielding film 13.Electromagnetic shielding film 13 has
Having higher intensity, it is the thinnest that its thickness can do according to actual needs.And also shielding external signal interference can be played
Effect.Optionally, electromagnetic shielding film 13 is PC6000 or PC5500 etc..Electromagnetic shielding film 13 is bonded in by binding agent
On the position being connected with FPC12 of FPC12 and pcb board 11.Binding agent can be, but not limited to, epoxide-resin glue etc., as long as
The effect of bonding electromagnetic shielding film 13 can be played.
The thickest then reinforcing effect of thickness of strengthening course is the best, but can affect the integral thickness of photographic head module.Therefore, protecting
On the premise of card sufficient intensity, the thickness of strengthening course is the smaller the better.In one example, the thickness of electromagnetic shielding film 13 is 16 μ
m.The electromagnetic shielding film 13 of this thickness has strength and toughness concurrently, and flatness is good.
In a kind of specific embodiment of the present invention, pcb board 11 is square.Preferably, the support being attached thereto
14, voice coil motor etc. are square, and have identical exterior contour.This setup can make photographic head module have
Good surface structure.FPC12 links together with a limit of square pcb board 11.Strengthening course is electromagnetic shielding film 13.As
Fruit only arranges electromagnetic shielding film 13 on this limit, and is not provided with on other three limits, then the thickness on this limit can be made to exceed other
Article three, limit, this structure easily causes module head and deflection occurs.Module head includes camera lens, voice coil motor, optical filter and becomes
As chip etc..Therefore, other three limits are respectively provided with electromagnetic shielding film 13, i.e. all cover on the four edges of pcb board 11
There is strengthening course, thus avoid module head and deflection occurs.The width of electromagnetic shielding film 13 is the biggest, and Ze Ban factory the most easily attaches,
But width conference reduces contact area, affects the earthing effect of photographic head module.The width of electromagnetic shielding film 13 is the least, then plate
Factory is not easy operation.Preferably, the width of strengthening course (such as, electromagnetic shielding film 13) is 0.5-0.8, and this width is correct
The portion i.e. width of square area surrounding pasted EMI film limits.What this width can ensure that strengthening course has enough intensity,
Can guarantee that again the earthing effect of photographic head module.
Preferably, cover the electromagnetic shielding film 13 at multiple positions, such as, cover four at FPC12 and pcb board 11
Electromagnetic shielding film 13 on limit is same film.This setup can make the reinforcing effect of strengthening course optimal.And it is easy to
The bonding of electromagnetic shielding film 13.
The shape of pcb board 11 can be configured according to actual needs, the most circular, square, triangle or trapezoidal.Excellent
Choosing, strengthening course is circumferentially positioned on pcb board, to avoid module head deflection occur.
When making circuit board, first design the size and dimension of strengthening course；Then the electromagnetism of suitable size is cut out
Screened film 13, it will be understood by those skilled in the art that and be all pre-coated with binding agent on electromagnetic shielding film 13；Finally will
Electromagnetic shielding film 13 is bonded to the position set.
Additionally, present invention also offers a kind of photographic head module.As it is shown in fig. 7, this module includes: voice coil motor 17, mirror
16, the circuit board that optical filter 18, imager chip 19 and the present invention provide.Camera lens 16 is arranged in voice coil motor (VCM)
VCM carrier on.Voice coil motor 17 is arranged on pcb board 11 by support 14.Pcb board 11 is additionally provided with imager chip
19.Optical filter 18 is arranged on the windowing of support 14.Optical filter 18 sets the light of wavelength for filtering out, to ensure that imaging is imitated
Really.Such as, for the infrared light optical filter of filtering infrared light.Extraneous light passes sequentially through camera lens 16 and optical filter 18, then arrives
Reach on imager chip 19.Imager chip 19 carries out imaging.
This photographic head module has the feature of length in service life.
Although by example, some specific embodiments of the present invention have been described in detail, but the skill of this area
Art personnel are it should be understood that example above is merely to illustrate rather than in order to limit the scope of the present invention.The skill of this area
Art personnel are it should be understood that can modify to above example without departing from the scope and spirit of the present invention.This
Bright scope is defined by the following claims.
Claims (8)
1. the circuit board for photographic head module, it is characterised in that include pcb board (11), FPC (12) and be used for improving
The strengthening course of bonding strength, described pcb board (11) is connected with external circuit signals by described FPC (12), described strengthening course quilt
It is arranged on the position being connected with FPC (12) of FPC (12) and pcb board (11).
Circuit board the most according to claim 1, it is characterised in that described strengthening course be arranged on described circuit board with
The side that frame (14) is relative.
3. according to the circuit board described in claims 1 or 2, it is characterised in that also include adapter (15), described adapter
(15) being connected with described FPC (12) signal, described strengthening course is arranged on being connected with described FPC (12) of described adapter (15)
Position.
4. according to the circuit board described in claims 1 or 2, it is characterised in that described strengthening course is electromagnetic shielding film (13), institute
State electromagnetic shielding film (13) and be arranged on the position being connected with FPC (12) of FPC (12) and pcb board (11) by binding agent
On.
5. according to the circuit board described in claims 1 or 2, it is characterised in that described PCB is square, at four of described PCB
Strengthening course it is all covered with on limit.
Circuit board the most according to claim 5, it is characterised in that the thickness of described strengthening course is 16 μm.
Circuit board the most according to claim 5, it is characterised in that the width of described strengthening course is 0.5-0.8.
8. a photographic head module, it is characterised in that including: voice coil motor (17), camera lens (16), optical filter (18), imaging core
Sheet (19) and the circuit board as described in any one in claim 1-7, wherein, described camera lens (16) is arranged on described
On VCM carrier in voice coil motor (17), described voice coil motor (17) is arranged on described pcb board (11) by support (14),
Being additionally provided with imager chip (19) on described pcb board (11), described optical filter (18) is arranged on opening of described support (14)
On window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610726325.7A CN106161903A (en) | 2016-08-25 | 2016-08-25 | Circuit board and photographic head module for photographic head module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610726325.7A CN106161903A (en) | 2016-08-25 | 2016-08-25 | Circuit board and photographic head module for photographic head module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106161903A true CN106161903A (en) | 2016-11-23 |
Family
ID=57342184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610726325.7A Pending CN106161903A (en) | 2016-08-25 | 2016-08-25 | Circuit board and photographic head module for photographic head module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106161903A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963495A (en) * | 2018-09-04 | 2018-12-07 | 惠州市众兴圆科技有限公司 | A kind of connector suitable for camera module test |
| CN109068031A (en) * | 2018-08-27 | 2018-12-21 | 惠州市众兴圆科技有限公司 | A kind of double photography/videography head mould groups |
| CN112512206A (en) * | 2020-12-23 | 2021-03-16 | 昆山丘钛光电科技有限公司 | Printed circuit board and camera module that reinforcement temperature warp |
| US20220030151A1 (en) * | 2018-06-26 | 2022-01-27 | Lg Innotek Co., Ltd. | Camera module and optical device including same |
| CN115473990A (en) * | 2022-08-22 | 2022-12-13 | 荣耀终端有限公司 | Camera module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050057468A1 (en) * | 2003-08-29 | 2005-03-17 | Isao Yamamoto | Power supply apparatus |
| CN203225828U (en) * | 2013-04-27 | 2013-10-02 | 南昌欧菲光电技术有限公司 | Camera module |
| CN105100569A (en) * | 2015-07-28 | 2015-11-25 | 南昌欧菲光电技术有限公司 | Camera module and its first circuit board and second circuit board |
| CN204967975U (en) * | 2015-09-30 | 2016-01-13 | 信利光电股份有限公司 | Module and electronic equipment make a video recording |
| CN105827917A (en) * | 2016-05-09 | 2016-08-03 | 江阴新晟电子有限公司 | AF camera module with iris switching function |
| CN105828590A (en) * | 2016-05-10 | 2016-08-03 | 青岛海信移动通信技术股份有限公司 | Terminal equipment |
-
2016
- 2016-08-25 CN CN201610726325.7A patent/CN106161903A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050057468A1 (en) * | 2003-08-29 | 2005-03-17 | Isao Yamamoto | Power supply apparatus |
| CN203225828U (en) * | 2013-04-27 | 2013-10-02 | 南昌欧菲光电技术有限公司 | Camera module |
| CN105100569A (en) * | 2015-07-28 | 2015-11-25 | 南昌欧菲光电技术有限公司 | Camera module and its first circuit board and second circuit board |
| CN204967975U (en) * | 2015-09-30 | 2016-01-13 | 信利光电股份有限公司 | Module and electronic equipment make a video recording |
| CN105827917A (en) * | 2016-05-09 | 2016-08-03 | 江阴新晟电子有限公司 | AF camera module with iris switching function |
| CN105828590A (en) * | 2016-05-10 | 2016-08-03 | 青岛海信移动通信技术股份有限公司 | Terminal equipment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220030151A1 (en) * | 2018-06-26 | 2022-01-27 | Lg Innotek Co., Ltd. | Camera module and optical device including same |
| US11665414B2 (en) * | 2018-06-26 | 2023-05-30 | Lg Innotek Co., Ltd. | Camera module and optical device including same |
| US12028594B2 (en) | 2018-06-26 | 2024-07-02 | Lg Innotek Co., Ltd. | Camera module and optical device including same |
| CN109068031A (en) * | 2018-08-27 | 2018-12-21 | 惠州市众兴圆科技有限公司 | A kind of double photography/videography head mould groups |
| CN108963495A (en) * | 2018-09-04 | 2018-12-07 | 惠州市众兴圆科技有限公司 | A kind of connector suitable for camera module test |
| CN112512206A (en) * | 2020-12-23 | 2021-03-16 | 昆山丘钛光电科技有限公司 | Printed circuit board and camera module that reinforcement temperature warp |
| CN115473990A (en) * | 2022-08-22 | 2022-12-13 | 荣耀终端有限公司 | Camera module and electronic equipment |
| CN115473990B (en) * | 2022-08-22 | 2023-10-24 | 荣耀终端有限公司 | A camera module and electronic equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
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| RJ01 | Rejection of invention patent application after publication |