CN106152598A - Semiconductor refrigeration system - Google Patents
Semiconductor refrigeration system Download PDFInfo
- Publication number
- CN106152598A CN106152598A CN201610693409.5A CN201610693409A CN106152598A CN 106152598 A CN106152598 A CN 106152598A CN 201610693409 A CN201610693409 A CN 201610693409A CN 106152598 A CN106152598 A CN 106152598A
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- CN
- China
- Prior art keywords
- substrate
- hot junction
- refrigeration system
- semiconductor refrigeration
- cold end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/06—Damage
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Air-Conditioning For Vehicles (AREA)
Abstract
The open a kind of semiconductor refrigeration system of the present invention, including refrigerating chip, hot-side heat dissipation device, hot junction fan, described refrigerating chip include P/N type galvanic couple to, conductive electrode, cold end group plate, hot junction substrate, cool and heat ends substrate uses aluminium base, P/N galvanic couple is that mechanical pressurization technique prepares at least one of which galvanic couple crystal grain, hot junction substrate is provided with the installation portion more than cold end group plate, and hot junction substrate is engaged with radiator by fixing bolt.The semiconductor refrigeration system of the present invention uses aluminium base, the problem solving the easy embrittlement of existing pottery.Using pressing process crystal grain, improve particle rigidity, be more suitable for vehicle-mounted use environment, four corner pillar structures are effectively increased the anti-pressure ability of chip.
Description
Technical field
The present invention relates to refrigeration technology field, more particularly to a kind of semiconductor refrigeration system.
Background technology
Along with the development of science and technology and improving constantly of people's living standard, the function achieved by automobile mounted equipment is more come
The most diversified, such as vehicle-mounted computer, vehicle-mounted computer can generate heat, at present, owing to semiconductor refrigeration system has body during using
Long-pending little, install easy to carry, refrigerating efficiency is preferable, the advantage of good reliability, the vehicle-mounted computer IC radiator of prior art is usual
Use semiconductor refrigeration system, but, cool and heat ends many employings ceramic substrate of existing semiconductor refrigeration system, deposit in installation
In the risk easily split, during vehicle rough ride, vibration makes chip internal produce shearing force, ceramic substrate the most easily occurs
Fragmentation and the situation of particle fragmentation, cause radiator to lose efficacy.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of efficient energy-saving, the semiconductor refrigeration system of shockproof anticracking, with
Overcome the deficiencies in the prior art.
For solving above-mentioned technical problem, a kind of semiconductor refrigeration system of structure, including refrigerating chip, hot-side heat dissipation device, warm
End fan, described refrigerating chip include P/N type galvanic couple to, conductive electrode, cold end group plate, hot junction substrate, cool and heat ends substrate use
Aluminium base, hot junction substrate is provided with the installation portion more than cold end group plate, and hot junction substrate is engaged with radiator by fixing bolt.
Arranging pressure-bearing column between cool and heat ends substrate, refrigerating chip surrounding is with silica gel sealing.
Described pressure-bearing column is to be prepared by epoxy resin.
Described pressure-bearing column is arranged on the corner of substrate.
The inner side of described cold end group plate arranges heat conduction glue-line.
P/N galvanic couple is that mechanical pressurization technique prepares at least one of which galvanic couple crystal grain.
First conductive electrode and the second conductive electrode are set on the substrate of described hot junction, arrange between the first electrode and hot junction substrate
Having thermally conductive insulating layer, described first conductive electrode is deposited on thermally conductive insulating layer by chemical means, integral with hot junction substrate.
The invention has the beneficial effects as follows:
The semiconductor refrigeration system of the present invention uses aluminium base, the problem solving the easy embrittlement of existing pottery.Hot junction substrate ratio is cold
End group plate width, its broadside is fixed for the installation of chip with fin, is efficiently solved the orientation problem of chip.
Use pressing process crystal grain, improve particle rigidity, be more suitable for vehicle-mounted use environment；Four corner pillar structures are effectively improved
The anti-pressure ability of chip.
Accompanying drawing explanation
Fig. 1 is that the refrigeration system part of the present invention splits schematic diagram.
Fig. 2 is the structural representation of chip of the present invention.
Fig. 3 is the A-A cut-away view of Fig. 1.
Fig. 4 is the B-B cut-away view of Fig. 1.
Fig. 5 is another embodiment of the present invention structural representation.
Detailed description of the invention
Below in conjunction with accompanying drawing of the present invention, the detailed description of the invention of the present invention is described, it is clear that described is concrete real
Mode of executing is only a part of embodiment, and based on embodiments of the present invention, those of ordinary skill in the art are not making creation
Property work on the premise of other embodiments of being obtained, the most within the scope of the present invention.
See Fig. 15, the semiconductor refrigeration system of the present invention, including chip 10, hot-side heat dissipation device 20, hot junction fan 30,
Described chip include P/N galvanic couple to 4, conductive electrode 3, cold end group plate 2, hot junction substrate 1, cool and heat ends substrate use aluminium base, P/
At least one crystal grain of N galvanic couple pair is that pressurization prepares, and hot junction substrate is provided with the installation portion 11 more than cold end group plate, installation portion
Arranging bolt hole 40 on 11, hot junction substrate is engaged with radiator by fixing bolt.Pressure-bearing column is set between cool and heat ends substrate
5, chip surrounding seals with silica gel 6.Chip cold end group plate 2 is connected can directly be engaged with cooled body by periphery.
The semiconductor refrigeration system of the present invention is applied in the heat radiation of vehicle-mounted computer, the direct contact chip of computer IC cold
End, therefore, chip is subjected to certain pressure, P galvanic couple to or N galvanic couple to use powder metallurgy prepare, its anti-pressure ability is general
10 times of crystal pulling are melted in logical district.Pressure-bearing column also functions to important function to the pressure-bearing of chip.Use soft malleability better than ceramic wafer
Aluminium base, makes chip substrate to ftracture.Hot junction substrate is wider than cold end group plate, and PN galvanic couple is to being distributed in cold end group plate forward projection region
In territory, installation portion broadside is the housing in cold end group plate orthographic projection region, and the installation for chip with fin is fixed.
The inner side of cold end group plate arranges heat conduction glue-line 7, it is possible to absorb certain stress, it is sufficient to offsets vehicle and runs generation
Mechanical vibration, make to be changed into by being rigidly connected between substrate and conductive electrode to flexibly connect, and absorb vibration, thermal expansion and contraction institute
The stress produced.And owing to heat-conducting glue can make system cold lose, therefore, heat conduction glue-line is arranged on the cold end of system, from
And reduce loss of refrigeration capacity.
Described pressure-bearing column is to be prepared by the epoxy resin with certain rigidity, and pressure-bearing column is arranged on the corner of substrate
On, in surrounding with 704 silica gel sealings.
Generally, chip uses the conductive electrode of general thickness, and usual conductive electrode is and aluminium base global formation
After, then on conductive electrode, weld P/N galvanic couple pair, but for big electric current chip, in order to ensure chip reliability, at hot junction base
Bilayer conductive electrode is set on plate, the first conductive electrode 9 and the second conductive electrode 8 is i.e. set, between the first electrode and hot junction substrate
Being provided with thermally conductive insulating layer, the first conductive electrode is deposited on thermally conductive insulating layer by chemical means, integral with hot junction substrate.
Shown in Fig. 5 is conventional die, and hot junction substrate uses the conductive electrode of general thickness, hot junction substrate and conductive electrode
Between be provided with insulating medium layer (not shown), and conductive electrode and hot junction substrate global formation.
The refrigeration system of the present invention is had a style of one's own, and is connected by periphery and directly engages with cooled body.System uses metal
Aluminium base, compacting crystal grain, aluminium base periphery arrange the multiple pressure-bearing designs such as pressure-bearing column, make system can bear relatively strong and cooling body
Activating pressure.
Claims (7)
1. semiconductor refrigeration system, including refrigerating chip, hot-side heat dissipation device, hot junction fan, described refrigerating chip includes P/N type electricity
Couple, conductive electrode, cold end group plate, hot junction substrate, it is characterised in that: cool and heat ends substrate uses aluminium base, and hot junction substrate is arranged
Having the installation portion more than cold end group plate, hot junction substrate is engaged with radiator by fixing bolt.
Semiconductor refrigeration system the most according to claim 1, it is characterised in that: pressure-bearing is set between cool and heat ends substrate and stands
Post, refrigerating chip surrounding is with silica gel sealing.
Semiconductor refrigeration system the most according to claim 2, it is characterised in that: described pressure-bearing column is by epoxy resin system
?.
Semiconductor refrigeration system the most according to claim 3, it is characterised in that: described pressure-bearing column is arranged on the four of substrate
On angle.
Semiconductor refrigeration system the most according to claim 4, it is characterised in that: the inner side of described cold end group plate arranges heat conduction
Glue-line.
6. according to the arbitrary described semiconductor refrigeration system of claim 1 to 5, it is characterised in that: P/N galvanic couple is at least a part of which one
Planting galvanic couple crystal grain is that mechanical pressurization technique prepares.
Semiconductor refrigeration system the most according to claim 6, it is characterised in that: on the substrate of described hot junction, the first conduction is set
Electrode and the second conductive electrode, be provided with thermally conductive insulating layer between the first electrode and hot junction substrate, described first conductive electrode passes through
Chemical means is deposited on thermally conductive insulating layer, integral with hot junction substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610693409.5A CN106152598A (en) | 2016-08-22 | 2016-08-22 | Semiconductor refrigeration system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610693409.5A CN106152598A (en) | 2016-08-22 | 2016-08-22 | Semiconductor refrigeration system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106152598A true CN106152598A (en) | 2016-11-23 |
Family
ID=57342042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610693409.5A Pending CN106152598A (en) | 2016-08-22 | 2016-08-22 | Semiconductor refrigeration system |
Country Status (1)
| Country | Link |
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| CN (1) | CN106152598A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019127608A1 (en) * | 2017-12-31 | 2019-07-04 | 鄞楠 | Uv light booth having heat dissipating function |
| CN110069084A (en) * | 2018-01-24 | 2019-07-30 | 思纳福(北京)医疗科技有限公司 | Temperature control device |
| WO2021136447A1 (en) * | 2019-12-30 | 2021-07-08 | 华为技术有限公司 | Thermoelectric cooler, manufacturing method for thermoelectric cooler, and electronic device |
| CN113490820A (en) * | 2019-06-26 | 2021-10-08 | Lg电子株式会社 | Thermoelectric module and refrigerator comprising same |
| CN115164445A (en) * | 2022-07-15 | 2022-10-11 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
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| US20080022696A1 (en) * | 2006-07-26 | 2008-01-31 | Welle Richard P | Thermoelectric-Based Refrigerator Apparatuses |
| CN101995113A (en) * | 2009-08-05 | 2011-03-30 | 株式会社丰田自动织机 | Heat exchanger including thermoelectric module |
| CN103697618A (en) * | 2013-12-16 | 2014-04-02 | 广东富信科技股份有限公司 | Semiconductor refrigerator and semiconductor refrigerating device |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN205939811U (en) * | 2016-08-22 | 2017-02-08 | 广东富信科技股份有限公司 | Semiconductor refrigerating system |
-
2016
- 2016-08-22 CN CN201610693409.5A patent/CN106152598A/en active Pending
Patent Citations (5)
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| US20080022696A1 (en) * | 2006-07-26 | 2008-01-31 | Welle Richard P | Thermoelectric-Based Refrigerator Apparatuses |
| CN101995113A (en) * | 2009-08-05 | 2011-03-30 | 株式会社丰田自动织机 | Heat exchanger including thermoelectric module |
| CN103697618A (en) * | 2013-12-16 | 2014-04-02 | 广东富信科技股份有限公司 | Semiconductor refrigerator and semiconductor refrigerating device |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN205939811U (en) * | 2016-08-22 | 2017-02-08 | 广东富信科技股份有限公司 | Semiconductor refrigerating system |
Non-Patent Citations (1)
| Title |
|---|
| 徐德胜: "《半导体制冷与应用技术》", 30 November 1992 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019127608A1 (en) * | 2017-12-31 | 2019-07-04 | 鄞楠 | Uv light booth having heat dissipating function |
| CN110069084A (en) * | 2018-01-24 | 2019-07-30 | 思纳福(北京)医疗科技有限公司 | Temperature control device |
| CN113490820A (en) * | 2019-06-26 | 2021-10-08 | Lg电子株式会社 | Thermoelectric module and refrigerator comprising same |
| WO2021136447A1 (en) * | 2019-12-30 | 2021-07-08 | 华为技术有限公司 | Thermoelectric cooler, manufacturing method for thermoelectric cooler, and electronic device |
| CN113130731A (en) * | 2019-12-30 | 2021-07-16 | 华为技术有限公司 | Thermoelectric refrigerator, method for manufacturing thermoelectric refrigerator, and electronic apparatus |
| CN115164445A (en) * | 2022-07-15 | 2022-10-11 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
| CN115164445B (en) * | 2022-07-15 | 2023-10-24 | 中国电子科技集团公司第十研究所 | Semiconductor thermoelectric refrigerator structure and enhanced heat exchange method |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
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| RJ01 | Rejection of invention patent application after publication |