RU175877U1 - CASE OF AN ACTIVE PHASED ANTENNA ARRAY MODULE - Google Patents

Abstract

The utility model relates to heat engineering and is intended for cooling the fuel elements of an active phased array antenna module, to improve the thermal regime of their operation. The module housing of the active phased array antenna is a single array, and the heat pipes are formed directly in the housing array under the places for installing the cooled elements, in parallel channels that contain the wick and steam pipe, and are in direct thermal contact between themselves and with the places for installing the cooled elements. In this case, the minimum possible distance from the installation site of the cooled element to the heat pipe will be equal to the wall thickness of the heat pipe, taking into account the technological requirements of its manufacture. The technical result consists in increasing the manufacturability and reliability of the module housing of an active phased antenna array. 1 ill.

Description

The utility model relates to heat engineering and is intended for cooling the fuel elements of an active phased array antenna module (AFAR), to improve the thermal regime of their operation.

Known multi-section heat pipe (patent RU 147864, IPC F28D 15/02), containing several independent heat pipes, United flat heat-conducting shelves. The disadvantage of a multi-section heat pipe is the difficulty of its installation in the base of the housing of the AFAR module and the lack of thermal interaction between sections of the heat pipe.

The prototype of the proposed device is a module housing an active phased antenna array (patent RU 97219, IPC H01Q 21/00) containing a heat-conducting base, heat distribution devices are installed under the locations of the cooled elements, under which there are evaporation zones of heat pipes. The condensation zones of the heat pipes are located on the outside of the housing and are equipped with an air cooling device. The module case consists of two symmetrical halves, in which hemispherical channels are made on the hermetically sealed surfaces of the base to accommodate the heat pipes, while the thermal contact between the heat pipes and the module case, between the case and heat distribution elements is provided by soldering or using thermal paste. The body halves with installed heat pipes are tightly interconnected.

Of the disadvantages of the prototype should be noted as follows.

The device does not provide an effective heat sink from the cooled elements, due to the large number of thermal transitions between the heat sink elements. Initially, heat is transferred from the cooled element to a heat distribution device. Heat is transferred from the heat distribution device to the heat-conducting base. Then, heat is transferred from the heat-conducting base through heat-conducting paste or soft solder to the heat pipes. The heat distribution device is a composite material consisting of grains of diamond, silicon carbide and silicon. Existing production technology does not allow to obtain a composite material with a low roughness, which would allow for a minimum clearance at the contact of two surfaces. Therefore, to ensure reliable thermal contact of the heat distribution device with the base surface, it is necessary to apply a layer of soft solder or heat-conducting paste, which leads to a sharp increase in thermal resistance and reduces the high thermal conductivity of the composite material. In addition, when installing heat pipes in parallel channels, to ensure thermal contact, it is necessary to use soft solder or heat-conducting paste, which also leads to heat loss.

The technical task that was posed during the development of a utility model is to increase the efficiency of heat removal from cooled elements.

The technical result that is required to be achieved is a reduction in the number of thermal transitions between the cooled elements and the heat pipes.

The technical result is achieved due to the fact that the module casing of the active phased antenna array containing a heat-conducting base with places for installing cooled elements on it, under which, with providing thermal contact with the module casing, heat pipes are located so that their evaporation zones are under places for installation of cooled elements, and condensation zones are located on the outside of the module housing and are equipped with air cooling devices, moreover, the module housing is active phasi antenna antenna array is a single array, directly in which, in parallel channels containing a wick and a steam pipe, heat pipes are formed that are in direct thermal contact with each other, while the module casing is simultaneously the walls of the heat pipes formed in it and the minimum possible distance from the place the installation of the cooled element to the heat pipe will be equal to the wall thickness of the heat pipe taking into account the technological requirements of its manufacture.

In FIG. The proposed housing design of the AFAR module and the design of the channel in which the heat pipe is formed (local section A) are shown.

The housing of the AFAR module contains a housing of heat-conducting material - 1, made, for example, of aluminum. In the case of the module - 1, parallel channels - 2 are made, containing a wick - 3 and a steam line - 4, on which plugs - 5 and refueling fittings - 6 are installed. Also in the case of the module - 1 are air cooling devices - 7 and the locations of the cooled elements - 8.

The design works as follows.

The channels 2 located in the housing 1, containing the wick 3 and the steam line 4, are hermetically sealed with plugs 5 on one side of the housing 1. On the opposite side of the housing 1, filling nozzles 6 are installed on the outlet openings of the channels 2, which are sealed after filling the channels 2 with a heat carrier, forming a heat pipe . The cooled elements installed in zone 8, at the location of the evaporation zone of the heat pipes, give thermal energy to the housing 1 in which the heat pipes are formed, while the housing 1 is simultaneously the walls of the heat pipes formed in it. When the heat pipe is heated, the coolant evaporates, and the steam flows through the steam line 4 into the condensation zone of the heat pipe, to the location of the air cooling device 7, which dissipates the heat received from the heat pipe into the surrounding space. In the condensation zone, steam condenses into a liquid and returns to the evaporation zone of the heat pipe via wick 3.

The formation of heat pipes directly in the array of the AFAR module housing made it possible to abandon heat distribution devices and install a cooled element directly on the heat pipe. This, in turn, eliminates the thermal transition between the heat distribution device and the heat-conducting base and the thermal transition between the heat-conducting base and the heat pipe. The technical result is achieved.

The absence of thermal transitions leads to a decrease in thermal resistance in the area between the cooled element and the heat pipe, which increases the efficiency of heat removal. The technical problem is solved.

In addition, the formation of heat pipes directly in the array of the AFAR module housing allowed not only to install the cooled element directly on the heat pipe, but also to reduce the distance between the cooled element and the heat pipe to the minimum possible, depending only on the technological requirements for the manufacture of the heat pipe wall, which also increases heat sink efficiency from cooled elements.

In the case of using cooled elements with different emitted heat power, the presence of thermal connection between the heat pipes allows you to equalize the temperature of the entire area under the cooled elements, which increases the reliability of the AFAR module. In addition, a decrease in the number of assembly units of the module case and technological operations, including operations on the hermetic connection of two symmetric halves of the AFAR module case, leads to increased reliability.

Claims (1)

The module body of an active phased array antenna, containing a heat-conducting base with places for installing cooled elements on it, under which, with providing thermal contact with the module case, heat pipes are located so that their evaporation zones are under the places for installing cooled elements, and zones condensations are located on the outside of the module housing and are equipped with air cooling devices, characterized in that the module housing of the active phased antenna array represents is a single array, directly in which, in parallel channels containing a wick and a steam pipe, heat pipes are formed that are in direct thermal contact with each other, while the module casing is simultaneously the walls of the heat pipes formed in it and the minimum possible distance from the installation site of the cooled element to heat pipe will be equal to the wall thickness of the heat pipe, taking into account the technological requirements of its manufacture.

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