CN106149039B - Electroplating apparatus - Google Patents

Abstract

The present invention discloses an electroplating device, including a main power supply, a plurality of movable rack groups and a first anode conductive member. The plurality of movable rack groups are used to drive a plurality of objects to be plated to move continuously, each movable rack group includes a rack and a shunt power supply electrically connected to the main power supply, the rack includes a contact portion and a clamping portion for clamping the object to be plated, wherein the shunt power supply is connected to the clamping portion with a cathode, and to the contact portion with an anode; the first anode conductive member is electrically connected to a plurality of electroplating materials, each movable rack group is electrically connected to the first anode conductive member through the contact portion and moves along the first anode conductive member. The plurality of objects to be plated are distributed to the same cathode current through each shunt power supply, and the plurality of electroplating materials share the anode of each shunt power supply through the first anode conductive member.

Description

Plating equipment

technical field

The invention relates to an electroplating equipment, in particular to an electroplating equipment which provides independent cathode current for each object to be plated.

Background technique

In the manufacturing process of the printed circuit board, it is necessary to form a conductive path between the substrates through an electroplating process, and then perform subsequent surface treatment to shape the printed circuit board. As shown in Figure 1, the fixed electroplating equipment 80 of general printed circuit board is designed to connect the electroplating material B of the anode of the power supply 81 to be arranged on both sides of the electroplating tank 82, and to connect the electroplating material B of the anode of the power supply 81. The object to be plated A is placed between the electroplating materials B on both sides of the electroplating tank 82, so that the object to be plated A remains in a fixed state; then by controlling the current output state of the power supply 81, the metal ions from the electroplating material B can be Deposited on the object to be plated A.

For the basic setting of the power supply 81 of this fixed electroplating equipment 80, all the objects to be plated A are fixed on the same conductive copper bar 83 connected to the cathode, and all electroplating materials B are fixed on the same branch and connected to The conductive copper bar 84 with the same anode is then controlled by the power supply 81 to execute the electroplating process.

Another kind of continuous mobile electroplating equipment 90, as shown in Figure 2 and Figure 3, is similar to the aforementioned fixed electroplating equipment in design, and the difference is that the continuous mobile electroplating equipment 90 is that the object A to be plated can be placed in the electroplating tank 92. Continuous movement relative to plating material B. Each moving part 93 holding the object to be plated A can slide along the conductive copper bar 94 through the sliding part 931, and the moving part 93 is electrically connected to the cathode of the power supply 91, so that the object to be plated A and the conductive copper bar 94 are both With cathode electricity. The plurality of electroplating materials B are divided into different areas, and each area is electrically connected to different anodes of the power supply 91 .

And for the setting of the power supply 91 of the continuous mobile electroplating equipment 90, all the objects to be plated A are connected to the same cathode through the conductive copper bar 94 and make it move continuously along one direction in the electroplating tank 92, and the All the electroplating materials B are fixed but connected to different anodes, and then the power supply 91 controls the current output power to execute the electroplating process.

Regardless of any of the aforementioned control methods, all the objects to be plated share the same cathode, so when the electrical conductivity of the objects to be plated is different, different objects to be plated will compete with each other for electricity, resulting in insufficient power receiving between the objects to be plated. On average, it affects the uniformity of the coating thickness on the object to be plated.

Contents of the invention

The main purpose of the present invention is to provide an electroplating device that provides an independent cathode current for each object to be plated, so as to solve the shortcoming that the conventional electroplating equipment that shares the cathode current tends to produce uneven coating thickness on the object to be plated.

To achieve the above purpose, the electroplating equipment includes a main power supply, a plurality of mobile hanger groups and a first anode conductor. A plurality of mobile hanger groups are used to drive multiple objects to be plated to move continuously. Each mobile hanger group includes a hanger and a shunt power supply combined with the hanger. The hanger includes a contact part and a clamp for holding the object to be plated. The holding part, and the shunt power supply is electrically connected to the main power supply; wherein the shunt power supply connects the holding part with the cathode, and connects the contact part with the anode. The first anode conductive member is electrically connected to a plurality of electroplating materials, wherein each mobile hanger group maintains electrical connection with the first anode conductive member through the contact portion and moves along the first anode conductive member. The plurality of objects to be plated are distributed to the same cathode current by each shunt power supply of the plurality of moving hanger groups, and a plurality of electroplating materials share the anode of each shunt power supply through the first anode conductive member.

It further includes at least one second anode conductive element, the at least one second anode conductive element is used to set a plurality of electroplating materials, and each electroplating material is electrically connected to the first anode conductive element through the at least one second anode conductive element.

The shunt power supply includes a wireless control module for receiving wireless control signals to control power output.

The electroplating equipment further includes a conductive component, and the main power supply is electrically connected to each branch power supply through the conductive component, so as to transmit DC power to each branch power supply through the conductive component.

Each shunt power supply further includes a sliding part, and the sliding part forms a slidable connection with the conductive component.

The contact part is at least one sliding component.

The output voltage of the main power supply is greater than the output voltages of each of the shunt power supplies.

With this design, each object to be plated can be individually controlled by an independent shunt power supply, so that each object to be plated has the same cathode current, which improves the uniformity of the coating of the object to be plated.

Description of drawings

Fig. 1 is a side sectional view of a conventional stationary electroplating equipment.

Fig. 2 is a side sectional view of a conventional continuous electroplating equipment.

Fig. 3 is a top view of conventional continuous electroplating equipment.

Fig. 4 is a schematic diagram of the main power supply of the electroplating equipment and a plurality of mobile hanger groups.

Fig. 5 is a side sectional view of an electroplating apparatus.

Fig. 6 is a plan view of the electroplating equipment.

Symbol Description:

Plating Equipment 1

main power supply 10

Mobile hanger set 20

hanger 21

Contact 211

Clamping part 212

Shunt Power Supplies 22

Wireless Control Module 221

Cathode 222

Anode 223

sliding part 224

First anode conductor 30

Second anode conductor 40

Plating tank 50

Conductive components 60

To be plated A

Plating material B

Set direction L

(known technology)

Stationary electroplating equipment 80

power supply 81

Plating tank 82

Conductive copper bar 83

Conductive copper bar 84

Continuous mobile electroplating equipment 90

power supply 91

Plating tank 92

Moving parts 93

sliding part 931

Conductive copper bar 94

To be plated A

Plating material B

Set direction L

detailed description

In order to make the above and other objects, features and advantages of the present application more comprehensible, specific embodiments of the present invention are listed below and described in detail in conjunction with the accompanying drawings.

Please refer to Figure 4 below. As shown in FIG. 4 , the electroplating equipment 1 includes a main power supply 10 and a plurality of mobile hanger groups 20 . The main power supply 10 is used to convert AC power into DC power, and output the DC power to a plurality of mobile hanger sets 20 for subsequent use. A plurality of mobile hanger groups 20 are arranged in sequence, and can be driven by a driving device (such as a motor, etc., not shown in the figure) to move continuously along a set direction L. As shown in FIG.

Each mobile hanger set 20 includes a hanger 21 and a shunt power supply 22 , and the shunt power supply 22 is combined with the hanger 21 . The main power supply 10 is electrically connected to the shunt power supplies 22 of each mobile hanger set 20 so as to obtain a smaller output current through each shunt power supply 22 . In one embodiment of the present invention, the main power supply 10 can convert the high-voltage AC power into a lower voltage DC power, and then distribute it to each branch power supply 22 through the output, so that each branch power supply 22 A smaller output DC power supply is obtained, but the design of the aforementioned DC power supply is not limited to this embodiment.

It should be noted that the number of mobile hanger groups 20 increases or decreases depending on the electroplating requirements and the size of the equipment; and when the number of mobile hanger groups 20 is large, the setting of the electroplating equipment 1 can also increase the main power supply according to the situation The quantity is 10 to deal with the split power supply 22 that distributes the output power to a plurality of mobile hanger groups 20 .

In this embodiment, the shunt power supply 22 includes a wireless control module 221 . The wireless control module 221 is used to receive a wireless control signal from the outside, and control its own power output according to the wireless control signal. Here, the wireless control module 221 can adopt a Bluetooth module, an infrared module, a Wi-Fi module, a 3G/4G network communication module or other wireless control modules with wireless signal transmission functions. Therefore, the user can remotely control the power output of the shunt power supply 22 of each mobile hanger set 20 by using control devices such as a remote control, a mobile phone, and a computer, so as to achieve real-time control and increase operational convenience.

Please refer to FIG. 5 and FIG. 6 together below. As shown in FIG. 5 and FIG. 6 , the electroplating equipment 1 further includes a first anode conductive member 30 , and the first anode conductive member 30 is electrically connected to a plurality of electroplating materials B. As shown in FIG. The hanger 21 of each mobile hanger set 20 includes a contact portion 211 and a clamping portion 212 . The contact portion 211 is used to maintain electrical connection with the first anode conductive member 30 and enable the hanger 21 to move along the first anode conductive member 30 . In this embodiment, the first anode conductor 30 uses an anode copper bar, and the contact part 211 uses at least one sliding component, such as a roller set, etc., and the sliding component is slidably combined with the anode copper bar, so that the hanging The frame 21 can not only move stably and smoothly along the first anode conductor 30 through the contact portion 211, but also ensure the electrical connection between the contact portion 211 and the first anode conductor 30, but the design of the contact portion 211 is not based on This is the limit.

The clamping portion 212 is used for clamping the object to be plated A, so that when the moving hanger set 20 moves, the object to be plated A can be moved together. In this embodiment, the clamping part 212 uses at least one clamping member, such as a metal clip, to clamp or release the object A to be plated manually or electrically.

The shunt power supply 22 of each mobile hanger set 20 includes a cathode 222 and an anode 223 . The cathode 222 of the shunt power supply 22 is electrically connected to the clamping portion 212 , and the anode 223 of the shunt power supply 22 is connected to the contact portion 211 . Thereby, the cathode 222 of the shunt power supply 22 can output the cathode current to the object to be plated A clamped by the clamping portion 212, so that the object to be plated A is charged with cathode; and the anode 223 of the shunt power supply 22 is passed The contact portion 211 is electrically connected to the first anode conductive member 30 , so that the electroplating material B is anodically charged.

In an embodiment of the present invention, the electroplating equipment 1 further includes at least one second anode conductive member 40 used as an electrical connection medium between the first anode conductive member 30 and the plurality of electroplating materials B. As shown in FIG. That is to say, at least one second anode conductive element 40 can be used to arrange a plurality of electroplating materials B, and each electroplating material B can also be electrically connected to the first anode conductive element 30 through the at least one second anode conductive element 40 . Here, at least one second anode conductor 40 adopts two anode copper bars, which are arranged on both sides of the electroplating tank 50 respectively, and each anode copper bar is provided with a plurality of electroplating materials B. It should be noted that the number and type of the at least one second anode conductive member 40 are not limited thereto.

In this way, the cathode 222 of each shunt power supply 22 can independently output the cathode current to the object to be plated A held by the clamping portion 212, that is, each object to be plated A will correspond to an independent shunt power supply and the anodes 223 of each shunt power supply 22 are electrically connected to the first anode conductive member 30 through the contact portion 211 to form the effect of parallel connection of each anode 223 so that the anodes 223 form a common anode circuit.

As shown in FIGS. 5 and 6 , in this embodiment, the electroplating equipment 1 further includes a conductive component 60 . This conductive component 60 is used as the conductive medium between the main power supply 10 and the shunt power supply 22 of each mobile hanger group 20, so that each mobile hanger group 20 can still move relative to the main power supply 10. It is electrically connected with the main power supply 10 . The main power supply 10 is electrically connected to each of the split power supplies 22 through the conductive component 60 for transmitting the DC power outputted by the main power supply 10 to each of the split power supplies 22 through the conductive component 60 .

In terms of design, the conductive component 60 includes two conductive copper bars, which are respectively connected to the anode DC terminal and the cathode RTN terminal of the main power supply 10; and each shunt power supply 22 further includes a sliding part 224, which can be connected with a collar , hooks or other conductive sliding structures are slidably connected to the two conductive copper bars, so that each mobile hanger group 20 can still be electrically connected to the main power supply 10 during the movement process, but this The invention is not limited thereto.

When actually performing the electroplating process, the electroplating equipment 1 will drive a plurality of mobile hanger groups 20 to move continuously along the first anode conductive member 30 toward the set direction L; The object to be plated A will be driven and continuously move among the plurality of electroplating materials B on both sides of the electroplating tank 50 . Of course, each split power supply 22 will also be driven by each mobile hanger set 20 to move continuously. With the power output of each shunt power supply 22 , each electroplating material B will become an anode, and each object A to be plated will become a cathode.

Since each mobile hanger group 20 has an independent shunt power supply 22, each object A to be plated can be independently controlled by the corresponding shunt power supply 22, so that it can be distributed to the same and stable cathode current, and will not Due to the difference in electrical conductivity between the objects A to be plated, uneven power reception is caused; while a plurality of electroplating materials B share the anodes of the shunt power supplies 22 through the first anode conductive member 30 to form the same anode loop.

Thereby, since the cathodic current distributed to each object A to be plated is the same, the uniformity of the coating film thickness can be maintained during electroplating, which greatly improves the shortcomings of conventional electroplating equipment. Users can also monitor the status of the electroplating equipment in real time through the remote control device to ensure the yield and effect of the electroplating process.

To sum up, the present invention shows its characteristics that are very different from the prior art in terms of purpose, means and efficacy. However, it should be noted that the above-mentioned embodiments are only examples for the convenience of description, and the scope of rights claimed by the present invention should be determined by the claims, rather than limited to the above-mentioned embodiments.

Claims (7)

1. An electroplating equipment, in order to plate a plurality of objects to be plated with electroplating material, it is characterized in that, this electroplating equipment comprises: a main power supply; A plurality of mobile hanger groups are used to drive the plurality of objects to be plated to move continuously. Each of the mobile hanger groups includes a hanger and a shunt power supply combined with the hanger. The hanger includes a contact part and a A clamping portion for clamping the object to be plated, and the shunt power supply is electrically connected to the main power supply; wherein the shunt power supply is connected to the clamping portion with a cathode, and the shunt power supply is connected with the an anode is connected to the contact; and A first anode conductive member electrically connected to a plurality of electroplating materials; wherein each of the moving hanger groups maintains electrical connection with the first anode conductive member through the contact portion and moves along the first anode conductive member; Wherein the plurality of objects to be plated are distributed to the same cathode current by each of the shunt power supplies of the plurality of mobile rack groups, and the plurality of electroplating materials are shared by each of the shunt power supplies through the first anode conductive member the anode of the device. 2. The electroplating equipment as claimed in claim 1, further comprising at least one second anode conductive member, the at least one second anode conductive member is used to set the plurality of electroplating materials, and each of the electroplating materials is passed through The at least one second anode conductive element is electrically connected to the first anode conductive element. 3. The electroplating equipment according to claim 1, wherein the shunt power supply comprises a wireless control module for receiving a wireless control signal to control power output. 4. The electroplating equipment as claimed in claim 1, further comprising a conductive component, the main power supply is electrically connected to each of the shunt power supplies through the conductive component, so as to pass DC power through the The conductive components are delivered to each of the shunt power supplies. 5 . The electroplating equipment as claimed in claim 4 , wherein each of the shunt power supplies further comprises a sliding part, and the sliding part forms a slidable connection with the conductive component. 6 . 6. The electroplating equipment as claimed in claim 1, wherein the contact part is at least one sliding component. 7. The electroplating equipment as claimed in claim 1, wherein the output voltage of the main power supply is greater than the output voltage of each of the split power supplies.