CN106132166B - A kind of multiple flow passages structure of cooling system - Google Patents
A kind of multiple flow passages structure of cooling system Download PDFInfo
- Publication number
- CN106132166B CN106132166B CN201610628362.4A CN201610628362A CN106132166B CN 106132166 B CN106132166 B CN 106132166B CN 201610628362 A CN201610628362 A CN 201610628362A CN 106132166 B CN106132166 B CN 106132166B
- Authority
- CN
- China
- Prior art keywords
- outlet
- heat dissipation
- sub
- cooling
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Devices For Dispensing Beverages (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
Abstract
本发明公开了一种散热系统的多流道结构，所述多流道结构包括主散热器和至少两个子冷却器，所述主散热器的一端设置有入口分配器，另一端设置有出口分配器，所述入口分配器上具有主散热入口容室和子冷却第一出口室，所述主散热入口容室与所述主散热器的入口端连通，所述子冷却器靠近入口分配器的一端与子冷却第一出口室连通。本发明具有结构简单、成本低、散热效果好的特点。
The invention discloses a multi-channel structure of a cooling system. The multi-channel structure includes a main radiator and at least two sub-coolers. One end of the main radiator is provided with an inlet distributor, and the other end is provided with an outlet distributor. The inlet distributor has a main heat dissipation inlet chamber and a sub-cooling first outlet chamber, the main heat dissipation inlet chamber communicates with the inlet end of the main radiator, and the sub-cooler is close to one end of the inlet distributor It communicates with the sub-cooling first outlet chamber. The invention has the characteristics of simple structure, low cost and good heat dissipation effect.
Description
技术领域：Technical field:
本发明涉及散热器技术领域，更具体地说涉及一种散热系统的多流道结构。The invention relates to the technical field of radiators, and more specifically relates to a multi-channel structure of a heat dissipation system.
背景技术：Background technique:
有些设备工作时会产生大量的热量，而这些多余的热量不能有快速散去并聚积起来产生高温，很可能会毁坏正在工作的设备，这时散热器便能有效地解决这个问题。散热器是附在发热设备上的一层良好导热介质，扮演犹如中间人一样的角色，有时在导热介质的基础上还会加上风扇等等东西来加快散热效果。现有技术中很多时候也会在散热器上设置流道结构实现散热，但是现有技术中的散热流道的设计结构复杂，而且生产成本高，同时散热效果不好。Some equipment will generate a lot of heat when it is working, and the excess heat cannot be dissipated quickly and accumulates to generate high temperature, which may destroy the working equipment. At this time, the radiator can effectively solve this problem. The heat sink is a layer of good heat-conducting medium attached to the heat-generating device, which acts like a middleman. Sometimes a fan and other things are added to the heat-conducting medium to speed up the heat dissipation effect. In the prior art, a flow channel structure is often provided on the radiator to realize heat dissipation, but the design structure of the heat dissipation channel in the prior art is complicated, and the production cost is high, and the heat dissipation effect is not good at the same time.
发明内容：Invention content:
本发明的目的就在于提供一种散热系统的多流道结构，它具有结构简单、成本低、散热效果好的特点。The purpose of the present invention is to provide a multi-channel structure of a heat dissipation system, which has the characteristics of simple structure, low cost and good heat dissipation effect.
为实现上述目的，本发明的一种散热系统的多流道结构，所述多流道结构包括主散热器和至少两个子冷却器，所述主散热器的一端设置有入口分配器，另一端设置有出口分配器，所述入口分配器上具有主散热入口容室和子冷却第一出口室，所述主散热入口容室与所述主散热器的入口端连通，所述子冷却器靠近入口分配器的一端与子冷却第一出口室连通，所述主散热入口容室与所述主散热器之间设置有分隔部，所述出口分配器上具有主散热出口容室和子冷却第二出口室，所述主散热出口容室与所述主散热器的出口端连通，至少一子冷却器且靠近出口分配器的一端与主散热出口容室连通，剩下的子冷却器靠近所述出口分配器的一端与子冷却第二出口室连通，所述主散热出口容室和子冷却第二出口室之间设置有分隔部。In order to achieve the above object, the present invention provides a multi-channel structure of a heat dissipation system, the multi-channel structure includes a main radiator and at least two sub-coolers, one end of the main radiator is provided with an inlet distributor, and the other end An outlet distributor is provided, and the inlet distributor has a main cooling inlet chamber and a sub-cooling first outlet chamber, the main cooling inlet chamber communicates with the inlet end of the main radiator, and the sub-cooler is close to the inlet One end of the distributor communicates with the first outlet chamber of the sub-cooling, a partition is provided between the main heat dissipation inlet chamber and the main radiator, and the outlet distributor has a main heat dissipation outlet chamber and a second outlet of the sub-cooling chamber, the main heat dissipation outlet chamber communicates with the outlet end of the main radiator, at least one sub-cooler and the end close to the outlet distributor communicates with the main heat dissipation outlet chamber, and the remaining sub-coolers are close to the outlet One end of the distributor communicates with the second sub-cooling outlet chamber, and a partition is provided between the main heat dissipation outlet chamber and the second sub-cooling outlet chamber.
作为上述技术方案的优选，所述主散热器和子冷却器为散热管道。As a preference of the above technical solution, the main radiator and the sub-cooler are heat dissipation pipes.
作为上述技术方案的优选，所述主散热入口容室与主散热入管连通，所述主散热出口容室与主散热出管连通，所述子冷却第一出口室与子冷却第一出管连通，所述子冷却第二出口室与子冷却第二出管连通。As a preference of the above technical solution, the main heat dissipation inlet chamber communicates with the main heat dissipation inlet pipe, the main heat dissipation outlet chamber communicates with the main heat dissipation outlet pipe, and the sub-cooling first outlet chamber communicates with the sub-cooling first outlet pipe , the sub-cooling second outlet chamber communicates with the sub-cooling second outlet pipe.
作为上述技术方案的优选，所述入口分配器与所述主散热器和子冷却器之间设置有密封圈。As a preference of the above technical solution, a sealing ring is provided between the inlet distributor and the main radiator and the sub-cooler.
作为上述技术方案的优选，所述出口分配器与所述主散热器和子冷却器之间设置有密封圈。As a preference of the above technical solution, a sealing ring is provided between the outlet distributor and the main radiator and the sub-cooler.
本发明的有益效果在于：本发明具有结构简单、成本低、散热效果好的特点。The beneficial effect of the present invention is that: the present invention has the characteristics of simple structure, low cost and good heat dissipation effect.
附图说明：Description of drawings:
下面结合附图对本发明做进一步的说明：Below in conjunction with accompanying drawing, the present invention will be further described:
图1为本发明实施例的结构示意图Fig. 1 is the structural representation of the embodiment of the present invention
图中：1、主散热器；2、出口分配器；3、入口分配器；4、子冷却器；5、子冷却器；22、主散热出口容室；23、主散热出管；24、子冷却第二出管；25、分隔部；26、子冷却第二出口室；32、分隔部；33、主散热入管；34、主散热入口容室；35、第一出口室；36、子冷却第一出管。In the figure: 1. main radiator; 2. outlet distributor; 3. inlet distributor; 4. sub-cooler; 5. sub-cooler; 22. main cooling outlet chamber; 23. main cooling outlet pipe; 24. 25, the partition; 26, the second outlet chamber of the sub-cooling; 32, the partition; 33, the main heat dissipation pipe; 34, the main heat dissipation inlet chamber; 35, the first outlet chamber; 36, the sub-cooling Cool the first outgoing tube.
具体实施方式：Detailed ways:
以下所述仅为体现本发明原理的较佳实施例，并不因此而限定本发明的保护范围。The following descriptions are only preferred embodiments embodying the principles of the present invention, and do not therefore limit the protection scope of the present invention.
实施例：如图1所示为本发明一种散热系统的多流道结构的实施例，所述多流道结构包括主散热器1和至少两个子冷却器4、5，所述主散热器1的一端设置有入口分配器3，另一端设置有出口分配器2，所述入口分配器3上具有主散热入口容室34和子冷却第一出口室35，所述主散热入口容室34与所述主散热器1的入口端连通，所述子冷却器4、5靠近入口分配器3的一端与子冷却第一出口室35连通，所述主散热入口容室34与所述主散热器1之间设置有分隔部32，所述出口分配器2上具有主散热出口容室22和子冷却第二出口室26，所述主散热出口容室22与所述主散热器1的出口端连通，至少一子冷却器且靠近出口分配器2的一端与主散热出口容室22连通，剩下的子冷却器靠近所述出口分配器2的一端与子冷却第二出口室26连通，所述主散热出口容室22和子冷却第二出口室26之间设置有分隔部25。Embodiment: As shown in Figure 1, it is an embodiment of a multi-channel structure of a heat dissipation system of the present invention, the multi-channel structure includes a main radiator 1 and at least two sub-coolers 4, 5, and the main radiator One end of 1 is provided with an inlet distributor 3, and the other end is provided with an outlet distributor 2. The inlet distributor 3 has a main cooling inlet chamber 34 and a sub-cooling first outlet chamber 35. The main cooling inlet chamber 34 and The inlet end of the main radiator 1 is communicated, and one end of the sub-coolers 4 and 5 close to the inlet distributor 3 is communicated with the sub-cooling first outlet chamber 35, and the main heat dissipation inlet chamber 34 is connected with the main radiator. 1 is provided with a partition 32, the outlet distributor 2 has a main cooling outlet chamber 22 and a sub-cooling second outlet chamber 26, and the main cooling outlet chamber 22 communicates with the outlet end of the main radiator 1 , at least one sub-cooler and one end close to the outlet distributor 2 communicates with the main heat dissipation outlet chamber 22, and the remaining sub-cooler communicates with the sub-cooling second outlet chamber 26 near one end of the outlet distributor 2, said A partition 25 is provided between the main cooling outlet chamber 22 and the sub-cooling second outlet chamber 26 .
主散热器1和子冷却器4、5为散热管道。The main radiator 1 and the sub-coolers 4, 5 are cooling pipes.
主散热入口容室34与主散热入管33连通，所述主散热出口容室22与主散热出管23连通，所述子冷却第一出口室35与子冷却第一出管36连通，所述子冷却第二出口室26与子冷却第二出管24连通。The main heat dissipation inlet chamber 34 communicates with the main heat dissipation inlet pipe 33, the main heat dissipation outlet chamber 22 communicates with the main heat dissipation outlet pipe 23, and the first sub-cooling outlet chamber 35 communicates with the first sub-cooling outlet pipe 36. The sub-cooling second outlet chamber 26 communicates with the sub-cooling second outlet pipe 24 .
入口分配器3与所述主散热器1和子冷却器4、5之间设置有密封圈。Sealing rings are provided between the inlet distributor 3 and the main radiator 1 and the sub-coolers 4 and 5 .
出口分配器2与所述主散热器1和子冷却器4、5之间设置有密封圈。Sealing rings are provided between the outlet distributor 2 and the main radiator 1 and the sub-coolers 4 and 5 .
本实施例在散热的时候，热传导的介质如图1中箭头方向所示，可以延长其整个流道的流通长度，有效提高散热效果，另外，在结构设计上，可以改进出口分配器2和入口分配器3的容室结构来实现更多流道和更长流道的设计，结构更加简单，成本也更低。In this embodiment, when dissipating heat, the heat conduction medium is shown in the direction of the arrow in Figure 1, which can extend the flow length of the entire flow path and effectively improve the heat dissipation effect. In addition, in terms of structural design, the outlet distributor 2 and the inlet can be improved. The chamber structure of the distributor 3 is used to realize the design of more flow channels and longer flow channels, the structure is simpler and the cost is lower.
本文中所描述的具体实施例仅仅是对本发明精神作举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代，但并不会偏离本发明的精神或者超越所附权利要求书所定义的范围。The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which the present invention belongs can make various modifications or supplements to the described specific embodiments or adopt similar methods to replace them, but they will not deviate from the spirit of the present invention or go beyond the definition of the appended claims range.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610628362.4A CN106132166B (en) | 2016-08-02 | 2016-08-02 | A kind of multiple flow passages structure of cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610628362.4A CN106132166B (en) | 2016-08-02 | 2016-08-02 | A kind of multiple flow passages structure of cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106132166A CN106132166A (en) | 2016-11-16 |
| CN106132166B true CN106132166B (en) | 2018-06-22 |
Family
ID=57254738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610628362.4A Active CN106132166B (en) | 2016-08-02 | 2016-08-02 | A kind of multiple flow passages structure of cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132166B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168303A (en) * | 2018-10-24 | 2019-01-08 | 北京无线电测量研究所 | A kind of water-cooled radiator and cooling system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113027766B (en) * | 2021-03-10 | 2023-05-26 | 重庆奇螺流体设备有限公司 | Oil gas cooler of variable-frequency oil injection screw air compressor and system thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2875003Y (en) * | 2006-02-22 | 2007-02-28 | 元山科技工业股份有限公司 | Heat sinks for electronic components |
| CN203086911U (en) * | 2013-01-14 | 2013-07-24 | 保锐科技股份有限公司 | heat exchange module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100575857C (en) * | 2005-02-02 | 2009-12-30 | 开利公司 | Heat exchanger with multi-stage fluid expansion in headers |
| CN205902311U (en) * | 2016-08-02 | 2017-01-18 | 无锡金鑫集团股份有限公司 | Cooling system's multithread way structure |
-
2016
- 2016-08-02 CN CN201610628362.4A patent/CN106132166B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2875003Y (en) * | 2006-02-22 | 2007-02-28 | 元山科技工业股份有限公司 | Heat sinks for electronic components |
| CN203086911U (en) * | 2013-01-14 | 2013-07-24 | 保锐科技股份有限公司 | heat exchange module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109168303A (en) * | 2018-10-24 | 2019-01-08 | 北京无线电测量研究所 | A kind of water-cooled radiator and cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106132166A (en) | 2016-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203407144U (en) | Liquid cooling heat sink with split flow mechanism | |
| US10342159B2 (en) | Liquid heat-dissipating assembly | |
| US20140268553A1 (en) | System for cooling multiple in-line central processing units in a confined enclosure | |
| CN204887834U (en) | Air conditioner and its electrical box assembly | |
| CN106132166B (en) | A kind of multiple flow passages structure of cooling system | |
| CN104576573A (en) | Micro-channel heat exchanger for drop-shaped pin fins | |
| US20170181317A1 (en) | Liquid-cooling heat sink | |
| CN204440306U (en) | The heating radiator of easy heat radiation in a kind of network system | |
| WO2017049867A1 (en) | Heat dissipation device and heat dissipation plate thereof | |
| CN107809879B (en) | Heat dissipation mechanism and equipment with heat source | |
| CN206149693U (en) | Heat dissipation mechanism and have equipment of heat source | |
| CN104713394B (en) | Radiator and heat pipe cooling system | |
| CN203369018U (en) | Multi-piece water cooling radiator structure | |
| CN208314702U (en) | A kind of multichannel water channels radiator for server CPU | |
| CN205980537U (en) | A high-efficiency freezer radiator | |
| CN205902311U (en) | Cooling system's multithread way structure | |
| CN103134229B (en) | Multipurpose transverse heat guiding temperature control module and temperature control system | |
| TW201517776A (en) | Heat dissipating system | |
| CN109240472A (en) | A kind of computer host box with heat dissipation wind channel structure | |
| CN209283633U (en) | Water-cooled plate and cooling system | |
| CN204667316U (en) | Computer radiator | |
| CN201731679U (en) | Semiconductor refrigerating and radiating device | |
| TWI694563B (en) | Liquid cooling system with dual loops | |
| TWM464723U (en) | Multi-piece water cooling heat sink structure | |
| CN102456643A (en) | Liquid cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A multi channel structure of heat dissipation system Effective date of registration: 20220414 Granted publication date: 20180622 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi Binhu branch Pledgor: WUXI JINXIN GROUP Co.,Ltd. Registration number: Y2022320000168 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180622 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi Binhu branch Pledgor: WUXI JINXIN GROUP Co.,Ltd. Registration number: Y2022320000168 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A multi channel structure of heat dissipation system Granted publication date: 20180622 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi Binhu branch Pledgor: WUXI JINXIN GROUP Co.,Ltd. Registration number: Y2025980017268 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |