CN106054523A - Double response type degradable photoresist as well as preparation method and use method therefor - Google Patents
Double response type degradable photoresist as well as preparation method and use method therefor Download PDFInfo
- Publication number
- CN106054523A CN106054523A CN201610348839.3A CN201610348839A CN106054523A CN 106054523 A CN106054523 A CN 106054523A CN 201610348839 A CN201610348839 A CN 201610348839A CN 106054523 A CN106054523 A CN 106054523A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- acid
- linking agent
- methyl
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 73
- 238000002360 preparation method Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000178 monomer Substances 0.000 claims abstract description 12
- 239000007864 aqueous solution Substances 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 9
- 230000002441 reversible effect Effects 0.000 claims description 46
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 32
- -1 tiglic acid acid anhydride Chemical class 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 27
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 13
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 12
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 11
- 229910021641 deionized water Inorganic materials 0.000 claims description 11
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 11
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical class CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 claims description 9
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 claims description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 6
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 claims description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 claims description 6
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 5
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 claims description 5
- 229960001553 phloroglucinol Drugs 0.000 claims description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 5
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 5
- PCYGLFXKCBFGPC-UHFFFAOYSA-N 4-(hydroxymethyl)benzene-1,2-diol Chemical compound OCC1=CC=C(O)C(O)=C1 PCYGLFXKCBFGPC-UHFFFAOYSA-N 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 150000003944 halohydrins Chemical class 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N n-Butanol Substances CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- 229940079877 pyrogallol Drugs 0.000 claims description 4
- SIJLYRDVTMMSIP-UHFFFAOYSA-N 4-Bromo-1-butanol Chemical compound OCCCCBr SIJLYRDVTMMSIP-UHFFFAOYSA-N 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001263 acyl chlorides Chemical class 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 claims description 3
- BPHYZRNTQNPLFI-UHFFFAOYSA-N 2,4,6-trihydroxytoluene Chemical compound CC1=C(O)C=C(O)C=C1O BPHYZRNTQNPLFI-UHFFFAOYSA-N 0.000 claims description 2
- LECMBPWEOVZHKN-UHFFFAOYSA-N 2-(2-chloroethoxy)ethanol Chemical compound OCCOCCCl LECMBPWEOVZHKN-UHFFFAOYSA-N 0.000 claims description 2
- SZIFAVKTNFCBPC-UHFFFAOYSA-N 2-chloroethanol Chemical compound OCCCl SZIFAVKTNFCBPC-UHFFFAOYSA-N 0.000 claims description 2
- KQOQXYPZBYTICM-UHFFFAOYSA-N 3-bromo-2,2-dimethylpropan-1-ol Chemical compound OCC(C)(C)CBr KQOQXYPZBYTICM-UHFFFAOYSA-N 0.000 claims description 2
- CAZPRAORHCOIHC-UHFFFAOYSA-N 3-chloro-2,2-dimethylpropan-1-ol Chemical compound OCC(C)(C)CCl CAZPRAORHCOIHC-UHFFFAOYSA-N 0.000 claims description 2
- LAMUXTNQCICZQX-UHFFFAOYSA-N 3-chloropropan-1-ol Chemical compound OCCCCl LAMUXTNQCICZQX-UHFFFAOYSA-N 0.000 claims description 2
- RQCDKJFKYGNXBD-UHFFFAOYSA-N 4-(hydroxymethyl)benzene-1,3-diol Chemical compound OCC1=CC=C(O)C=C1O RQCDKJFKYGNXBD-UHFFFAOYSA-N 0.000 claims description 2
- NYUABOGYMWADSF-UHFFFAOYSA-N 5-methylbenzene-1,2,3-triol Chemical compound CC1=CC(O)=C(O)C(O)=C1 NYUABOGYMWADSF-UHFFFAOYSA-N 0.000 claims description 2
- JNTPTNNCGDAGEJ-UHFFFAOYSA-N 6-chlorohexan-1-ol Chemical compound OCCCCCCCl JNTPTNNCGDAGEJ-UHFFFAOYSA-N 0.000 claims description 2
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 2
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 2
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 claims description 2
- CZKMPDNXOGQMFW-UHFFFAOYSA-N chloro(triethyl)germane Chemical compound CC[Ge](Cl)(CC)CC CZKMPDNXOGQMFW-UHFFFAOYSA-N 0.000 claims description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 2
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 claims description 2
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 2
- 235000006408 oxalic acid Nutrition 0.000 claims description 2
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N propane-1,3-dithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 claims description 2
- 229910000342 sodium bisulfate Inorganic materials 0.000 claims description 2
- 238000001291 vacuum drying Methods 0.000 claims description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 4
- 229910052794 bromium Inorganic materials 0.000 claims 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 3
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 claims 2
- 150000008109 benzenetriols Chemical class 0.000 claims 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims 2
- 229940044613 1-propanol Drugs 0.000 claims 1
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 claims 1
- UIERETOOQGIECD-ARJAWSKDSA-M 2-Methyl-2-butenoic acid Natural products C\C=C(\C)C([O-])=O UIERETOOQGIECD-ARJAWSKDSA-M 0.000 claims 1
- DBTWOTKWIVISQR-UHFFFAOYSA-N 2-bromopropan-1-ol Chemical compound CC(Br)CO DBTWOTKWIVISQR-UHFFFAOYSA-N 0.000 claims 1
- HGIAHZLSMMPSME-UHFFFAOYSA-N 2-chloro-2-methyl-3-oxopropanoic acid Chemical compound O=CC(Cl)(C)C(O)=O HGIAHZLSMMPSME-UHFFFAOYSA-N 0.000 claims 1
- AIDLAEPHWROGFI-UHFFFAOYSA-N 2-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=C(C(O)=O)C=CC=C1C(O)=O AIDLAEPHWROGFI-UHFFFAOYSA-N 0.000 claims 1
- OAKURXIZZOAYBC-UHFFFAOYSA-M 3-oxopropanoate Chemical compound [O-]C(=O)CC=O OAKURXIZZOAYBC-UHFFFAOYSA-M 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 claims 1
- XVZXOLOFWKSDSR-UHFFFAOYSA-N Cc1cc(C)c([C]=O)c(C)c1 Chemical group Cc1cc(C)c([C]=O)c(C)c1 XVZXOLOFWKSDSR-UHFFFAOYSA-N 0.000 claims 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims 1
- 229910002651 NO3 Inorganic materials 0.000 claims 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 239000007983 Tris buffer Substances 0.000 claims 1
- VJDDQSBNUHLBTD-GGWOSOGESA-N [(e)-but-2-enoyl] (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(=O)\C=C\C VJDDQSBNUHLBTD-GGWOSOGESA-N 0.000 claims 1
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 claims 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- BPMFZUMJYQTVII-UHFFFAOYSA-N alpha-guanidinoacetic acid Natural products NC(=N)NCC(O)=O BPMFZUMJYQTVII-UHFFFAOYSA-N 0.000 claims 1
- GGNQRNBDZQJCCN-UHFFFAOYSA-N benzene-1,2,4-triol Chemical compound OC1=CC=C(O)C(O)=C1 GGNQRNBDZQJCCN-UHFFFAOYSA-N 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- UJVPXXKBKDRVTG-UHFFFAOYSA-N bis[1-(1-hydroxycyclohexa-2,4-dien-1-yl)cyclohexyl]methanone Chemical compound OC1(CC=CC=C1)C1(CCCCC1)C(=O)C1(CCCCC1)C1(CC=CC=C1)O UJVPXXKBKDRVTG-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- UDRCONFHWYGWFI-UHFFFAOYSA-N ethyl 3-oxopentanoate Chemical compound CCOC(=O)CC(=O)CC UDRCONFHWYGWFI-UHFFFAOYSA-N 0.000 claims 1
- 125000004494 ethyl ester group Chemical group 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N glycerol Substances OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 claims 1
- 229940059574 pentaerithrityl Drugs 0.000 claims 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 1
- 238000001259 photo etching Methods 0.000 claims 1
- 238000010992 reflux Methods 0.000 claims 1
- 229960002317 succinimide Drugs 0.000 claims 1
- 239000011593 sulfur Substances 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 239000001117 sulphuric acid Substances 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- 150000003568 thioethers Chemical class 0.000 claims 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 claims 1
- VJDDQSBNUHLBTD-UHFFFAOYSA-N trans-crotonic acid-anhydride Natural products CC=CC(=O)OC(=O)C=CC VJDDQSBNUHLBTD-UHFFFAOYSA-N 0.000 claims 1
- WCJYTPVNMWIZCG-UHFFFAOYSA-N xylylcarb Chemical compound CNC(=O)OC1=CC=C(C)C(C)=C1 WCJYTPVNMWIZCG-UHFFFAOYSA-N 0.000 claims 1
- 230000009977 dual effect Effects 0.000 abstract description 16
- 238000004132 cross linking Methods 0.000 abstract description 12
- 238000006731 degradation reaction Methods 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 abstract description 4
- 150000003384 small molecules Chemical class 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 6
- HCZMHWVFVZAHCR-UHFFFAOYSA-N 2-[2-(2-sulfanylethoxy)ethoxy]ethanethiol Chemical compound SCCOCCOCCS HCZMHWVFVZAHCR-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- BDAHDQGVJHDLHQ-UHFFFAOYSA-N [2-(1-hydroxycyclohexyl)phenyl]-phenylmethanone Chemical compound C=1C=CC=C(C(=O)C=2C=CC=CC=2)C=1C1(O)CCCCC1 BDAHDQGVJHDLHQ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- RQFUZUMFPRMVDX-UHFFFAOYSA-N 3-Bromo-1-propanol Chemical compound OCCCBr RQFUZUMFPRMVDX-UHFFFAOYSA-N 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- OHLRLMWUFVDREV-UHFFFAOYSA-N ethyl 4-chloro-3-oxobutanoate Chemical compound CCOC(=O)CC(=O)CCl OHLRLMWUFVDREV-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- TUNLYEHIVPWOHK-ONEGZZNKSA-N (e)-2-methylbut-2-enoyl chloride Chemical compound C\C=C(/C)C(Cl)=O TUNLYEHIVPWOHK-ONEGZZNKSA-N 0.000 description 2
- RJUIDDKTATZJFE-NSCUHMNNSA-N (e)-but-2-enoyl chloride Chemical compound C\C=C\C(Cl)=O RJUIDDKTATZJFE-NSCUHMNNSA-N 0.000 description 2
- GZJCDQYVIXPMAW-UHFFFAOYSA-N 1,2-dichloro-3-ethenylbenzene Chemical compound ClC1=CC=CC(C=C)=C1Cl GZJCDQYVIXPMAW-UHFFFAOYSA-N 0.000 description 2
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- PGTWZHXOSWQKCY-UHFFFAOYSA-N 1,8-Octanedithiol Chemical compound SCCCCCCCCS PGTWZHXOSWQKCY-UHFFFAOYSA-N 0.000 description 2
- LDLCZOVUSADOIV-UHFFFAOYSA-N 2-bromoethanol Chemical compound OCCBr LDLCZOVUSADOIV-UHFFFAOYSA-N 0.000 description 2
- VSZSIEBALNXIFG-UHFFFAOYSA-N 2-hydroxyethyl 2,2-bis(sulfanyl)acetate Chemical compound OCCOC(=O)C(S)S VSZSIEBALNXIFG-UHFFFAOYSA-N 0.000 description 2
- BDUBTLFQHNYXPC-UHFFFAOYSA-N 3-methylbut-2-enoyl chloride Chemical compound CC(C)=CC(Cl)=O BDUBTLFQHNYXPC-UHFFFAOYSA-N 0.000 description 2
- FCMCSZXRVWDVAW-UHFFFAOYSA-N 6-bromo-1-hexanol Chemical compound OCCCCCCBr FCMCSZXRVWDVAW-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- FNENWZWNOPCZGK-UHFFFAOYSA-N ethyl 2-methyl-3-oxobutanoate Chemical compound CCOC(=O)C(C)C(C)=O FNENWZWNOPCZGK-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- QEWYKACRFQMRMB-UHFFFAOYSA-N fluoroacetic acid Chemical compound OC(=O)CF QEWYKACRFQMRMB-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- VCWMRQDBPZKXKG-UHFFFAOYSA-N (2S)-O1-alpha-D-Galactopyranosyl-myo-inosit Natural products OC1C(O)C(O)C(CO)OC1OC1C(O)C(O)C(O)C(O)C1O VCWMRQDBPZKXKG-UHFFFAOYSA-N 0.000 description 1
- REDBNPUNYZYECN-AATRIKPKSA-N (e)-hept-2-enoyl chloride Chemical compound CCCC\C=C\C(Cl)=O REDBNPUNYZYECN-AATRIKPKSA-N 0.000 description 1
- WNPSAOYKQQUALV-UHFFFAOYSA-N 1,3-bis(sulfanyl)propan-2-ol Chemical compound SCC(O)CS WNPSAOYKQQUALV-UHFFFAOYSA-N 0.000 description 1
- SRZXCOWFGPICGA-UHFFFAOYSA-N 1,6-Hexanedithiol Chemical compound SCCCCCCS SRZXCOWFGPICGA-UHFFFAOYSA-N 0.000 description 1
- GJRCLMJHPWCJEI-UHFFFAOYSA-N 1,9-Nonanedithiol Chemical compound SCCCCCCCCCS GJRCLMJHPWCJEI-UHFFFAOYSA-N 0.000 description 1
- YYTSGNJTASLUOY-UHFFFAOYSA-N 1-chloropropan-2-ol Chemical compound CC(O)CCl YYTSGNJTASLUOY-UHFFFAOYSA-N 0.000 description 1
- YIIPOGLCNUDSBG-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;3-sulfanylpropanoic acid Chemical compound OC(=O)CCS.OC(=O)CCS.OC(=O)CCS.OC(=O)CCS.OCC(CO)(CO)CO YIIPOGLCNUDSBG-UHFFFAOYSA-N 0.000 description 1
- JTOJLOUPDKBCCH-UHFFFAOYSA-N 2-(2-bromoethoxy)ethanol Chemical compound OCCOCCBr JTOJLOUPDKBCCH-UHFFFAOYSA-N 0.000 description 1
- WQNHWIYLCRZRLR-UHFFFAOYSA-N 2-(3-hydroxy-2,5-dioxooxolan-3-yl)acetic acid Chemical compound OC(=O)CC1(O)CC(=O)OC1=O WQNHWIYLCRZRLR-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical class CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- XYHKMRNYSMEEDT-UHFFFAOYSA-N 2-[3-(2-sulfanylethylsulfanyl)propylsulfanyl]ethanethiol Chemical compound SCCSCCCSCCS XYHKMRNYSMEEDT-UHFFFAOYSA-N 0.000 description 1
- JAEUQHNZRROYID-UHFFFAOYSA-N 2-chloroethyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OCCCl JAEUQHNZRROYID-UHFFFAOYSA-N 0.000 description 1
- KIBOHRIGZMLNNS-UHFFFAOYSA-N 3-bromo-2-methylpropan-1-ol Chemical compound OCC(C)CBr KIBOHRIGZMLNNS-UHFFFAOYSA-N 0.000 description 1
- SFMFACMIOWQIPR-UHFFFAOYSA-N 3-ethoxyprop-2-enoyl chloride Chemical compound CCOC=CC(Cl)=O SFMFACMIOWQIPR-UHFFFAOYSA-N 0.000 description 1
- PRRBQHNMYJRHFW-UHFFFAOYSA-M 3-oxoheptanoate Chemical compound CCCCC(=O)CC([O-])=O PRRBQHNMYJRHFW-UHFFFAOYSA-M 0.000 description 1
- HXHGULXINZUGJX-UHFFFAOYSA-N 4-chlorobutanol Chemical compound OCCCCCl HXHGULXINZUGJX-UHFFFAOYSA-N 0.000 description 1
- VRICZARLROAIDW-UHFFFAOYSA-N 4-iodobutan-1-ol Chemical compound OCCCCI VRICZARLROAIDW-UHFFFAOYSA-N 0.000 description 1
- WJVQJXVMLRGNGA-UHFFFAOYSA-N 5-bromopentan-1-ol Chemical compound OCCCCCBr WJVQJXVMLRGNGA-UHFFFAOYSA-N 0.000 description 1
- DCBJCKDOZLTTDW-UHFFFAOYSA-N 5-chloropentan-1-ol Chemical compound OCCCCCCl DCBJCKDOZLTTDW-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- PTHLEKANMPKYDB-UHFFFAOYSA-N Flopropione Chemical compound CCC(=O)C1=C(O)C=C(O)C=C1O PTHLEKANMPKYDB-UHFFFAOYSA-N 0.000 description 1
- PWGOWIIEVDAYTC-UHFFFAOYSA-N ICR-170 Chemical compound Cl.Cl.C1=C(OC)C=C2C(NCCCN(CCCl)CC)=C(C=CC(Cl)=C3)C3=NC2=C1 PWGOWIIEVDAYTC-UHFFFAOYSA-N 0.000 description 1
- LLHICPSCVFRWDT-UHFFFAOYSA-N S-(5-acetamido-2-hydroxyphenyl)cysteine Chemical compound CC(=O)NC1=CC=C(O)C(SCC(N)C(O)=O)=C1 LLHICPSCVFRWDT-UHFFFAOYSA-N 0.000 description 1
- LCZFHJDUNXXOHE-FIFLTTCUSA-N [(e)-hex-2-enoyl] (e)-hex-2-enoate Chemical compound CCC\C=C\C(=O)OC(=O)\C=C\CCC LCZFHJDUNXXOHE-FIFLTTCUSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- SMTOKHQOVJRXLK-UHFFFAOYSA-N butane-1,4-dithiol Chemical compound SCCCCS SMTOKHQOVJRXLK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- ZOEBOKASEORHKI-UHFFFAOYSA-N ethyl 3-chloro-2-methyl-3-oxopropanoate Chemical compound CCOC(=O)C(C)C(Cl)=O ZOEBOKASEORHKI-UHFFFAOYSA-N 0.000 description 1
- SYFFHRPDTQNMQB-UHFFFAOYSA-N ethyl 3-oxopropanoate Chemical compound CCOC(=O)CC=O SYFFHRPDTQNMQB-UHFFFAOYSA-N 0.000 description 1
- OCJKUQIPRNZDTK-UHFFFAOYSA-N ethyl 4,4,4-trifluoro-3-oxobutanoate Chemical compound CCOC(=O)CC(=O)C(F)(F)F OCJKUQIPRNZDTK-UHFFFAOYSA-N 0.000 description 1
- JKVARUSRBKZGGY-UHFFFAOYSA-N ethyl [2-(2,4,6-trimethylbenzoyl)phenyl] hydrogen phosphate Chemical compound CCOP(O)(=O)OC1=CC=CC=C1C(=O)C1=C(C)C=C(C)C=C1C JKVARUSRBKZGGY-UHFFFAOYSA-N 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- KZSXJTYOPKQNLT-BCKMTSFNSA-N glucinol Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](OC)O[C@H]1O[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@@H]1O KZSXJTYOPKQNLT-BCKMTSFNSA-N 0.000 description 1
- DULSKXKKPSJUFT-UHFFFAOYSA-N hexane-1,3,6-trithiol Chemical compound SCCCC(S)CCS DULSKXKKPSJUFT-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- AGADEVQOWQDDFX-UHFFFAOYSA-N methyl 3-oxopropanoate Chemical compound COC(=O)CC=O AGADEVQOWQDDFX-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- XMHBJPKFTZSWRJ-UHFFFAOYSA-N naphthalene-2,6-dithiol Chemical compound C1=C(S)C=CC2=CC(S)=CC=C21 XMHBJPKFTZSWRJ-UHFFFAOYSA-N 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- JDKQTIKEGOOXTJ-UHFFFAOYSA-N pent-4-enoyl chloride Chemical compound ClC(=O)CCC=C JDKQTIKEGOOXTJ-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- QCCDLTOVEPVEJK-UHFFFAOYSA-N phenylacetone Chemical compound CC(=O)CC1=CC=CC=C1 QCCDLTOVEPVEJK-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- DHGFMVMDBNLMKT-UHFFFAOYSA-N propyl 3-oxobutanoate Chemical compound CCCOC(=O)CC(C)=O DHGFMVMDBNLMKT-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Abstract
本发明涉及一种双重响应型可降解光刻胶及其制备方法和使用方法。本发明以能在不同波长紫外光下发生交联和解交联的分子作为交联剂,通过不同波长紫外光照射来实现光刻胶的交联和解交联;采用可水解的结构作为聚合物骨架,常温下能在pH>7的碱水溶液中发生降解,最终得到溶于水的小分子。将交联剂、光引发剂、活性单体和连接分子混合得到光刻胶体系,然后将此光刻胶应用于纳米压印,表现出优异的压印性能和降解性能,很好地解决了光刻胶对模板的损伤问题。此外,它还具有环保的特性,是一种环保型的可降解光刻胶。The invention relates to a dual-response degradable photoresist, a preparation method and a use method thereof. The present invention uses molecules capable of cross-linking and de-cross-linking under different wavelengths of ultraviolet light as cross-linking agents to realize cross-linking and de-cross-linking of photoresist by irradiation with different wavelengths of ultraviolet light; a hydrolyzable structure is used as a polymer skeleton , can degrade in alkaline aqueous solution with pH>7 at room temperature, and finally obtain small molecules soluble in water. The photoresist system is obtained by mixing crosslinking agent, photoinitiator, active monomer and linking molecule, and then this photoresist is applied to nanoimprinting, which shows excellent imprinting performance and degradation performance, and solves the problem of The problem of photoresist damage to the template. In addition, it is also environmentally friendly and is an environmentally friendly degradable photoresist.
Description
技术领域technical field
本发明涉及一种双重响应型可降解光刻胶及其制备方法和使用方法。The invention relates to a dual-response degradable photoresist, a preparation method and a use method thereof.
背景技术Background technique
随着科学技术的进步,人类社会进入了信息时代,各种通讯设备、移动终端层出不穷,多功能、小体积、易便携是发展的主要方向。集成电路(IC)作为电子设备的重要组成部分,直接影响到其应用与发展,而传统制备集成电路的光刻技术由于种种限制已经无法满足生产更高集成度IC的要求,1995年美国休斯顿大学的周郁教授发明了低成本、高效率和高分辨率的纳米压印技术。With the advancement of science and technology, human society has entered the information age, and various communication devices and mobile terminals emerge in an endless stream. Multi-function, small size, and easy portability are the main directions of development. Integrated circuit (IC), as an important part of electronic equipment, directly affects its application and development, and the traditional photolithography technology for preparing integrated circuits cannot meet the requirements of producing higher integrated ICs due to various limitations. In 1995, the University of Houston, USA Professor Zhou Yu invented the low-cost, high-efficiency and high-resolution nanoimprint technology.
纳米压印过程的主要组成部分有模板(印章)、光刻胶和基材,其中模板的价格昂贵,光刻胶则在整个过程中与模板接触,直接影响到模板的使用寿命。目前光刻胶主要分为热塑性、热固性和紫外光固化三种类型,其中热塑性纳米压印胶由高分子组成,压印前将其加热到玻璃转化温度(Tg)之上增加分子流动性,然后再将模板压印到高分子组成物上,冷却固化后脱模得到压印图形,因此需要的压力较大,对模板损伤严重;热固性纳米压印胶的主要组成部分是预聚体,加热聚合固化,因此对模板的粘附性较强,模板残胶严重,损伤严重;紫外光固化型光刻胶的主要组成是可光聚合的单体、树脂和光引发剂,其反应条件温和,反应速度快,受到了广泛的关注,但也同样面临残胶对模板的损伤问题。The main components of the nanoimprint process are the template (stamp), photoresist and substrate. The template is expensive, and the photoresist is in contact with the template throughout the process, which directly affects the service life of the template. At present, photoresists are mainly divided into three types: thermoplastic, thermosetting and ultraviolet curing. Among them, thermoplastic nanoimprinting adhesive is composed of polymers, which are heated above the glass transition temperature (T g ) before imprinting to increase molecular mobility. Then the template is embossed on the polymer composition, and after cooling and solidification, the embossed pattern is obtained by demolding, so the pressure required is relatively high, and the template is seriously damaged; the main component of the thermosetting nano-imprinting adhesive is a prepolymer. Polymerization and curing, so the adhesion to the template is strong, the residual glue of the template is serious, and the damage is serious; the main components of the UV-curable photoresist are photopolymerizable monomers, resins and photoinitiators, and the reaction conditions are mild and the reaction The speed is fast and has received widespread attention, but it also faces the problem of damage to the template by residual glue.
为解决光刻胶与模板之间的界面问题,目前的主要方法有:在光刻胶中加入含氟(如文章Lin H,Wan X,Jiang X,et al.Journal of Materials Chemistry,2012,22(6):2616-2623)和含硅(如文章Choi P,Fu P F,Guo L J.Advanced Functional Materials,2007,17(1):65-70)的成分,降低光刻胶的表面能,从而降低光刻胶与模板之间的相互作用力,但防粘效果有限,同时也降低了光刻胶与基材之间的粘附力,易出现脱胶现象;对模板(如专利CN10103576447A)和光刻胶表面(如专利CN102604454A)进行处理,使其表面接上含氟基团,降低相互作用力,但是过程复杂,成本高;制备可酸降解的光刻胶(如文章Hu,XinYang,Tao Gu,Ronghua Cui.Journal of Materials Chemistry C,2014 2(10):836-842),其主要原理是光产酸剂在紫外光照下产生H+,在加热的条件下使交联点断裂,增加其在有机溶剂中的溶解性,但是,降解需要高温条件,且酸对模板保护层有损伤;制备热降解型光刻胶(如文章Wiriya,Thongsomboon,Mark Sherwood,Noel Arellano,ACS MacroLetters.2013 2(1):19-22),其原理是在加热条件下交联点断裂,增加光刻胶在有机溶剂中的溶解性,但是使用高温条件,限制了其可应用的范围;制备可逆光刻胶(如专利CN101957559A),利用在不同紫外波长下能发生交联和解交联的单体在侧链作为交联剂,通过紫外光来控制交联程度,从而达到控制其在有机溶剂中的溶解性能,但是其解交联程度有限,且解交联后仍为大分子,溶解效果不明显。In order to solve the interface problem between the photoresist and the template, the current main methods are: adding fluorine to the photoresist (such as the article Lin H, Wan X, Jiang X, et al.Journal of Materials Chemistry, 2012, 22 (6): 2616-2623) and silicon-containing (such as the article Choi P, Fu PF, Guo L J. Advanced Functional Materials, 2007, 17(1): 65-70), reduce the surface energy of the photoresist, Thereby reduce the interactive force between photoresist and template, but antisticking effect is limited, also reduced the adhesive force between photoresist and base material simultaneously, easily occurs debonding phenomenon; To template (as patent CN10103576447A) and The surface of the photoresist (such as patent CN102604454A) is processed so that its surface is connected with fluorine-containing groups to reduce the interaction force, but the process is complicated and the cost is high; prepare acid-degradable photoresist (such as article Hu, XinYang, Tao Gu, Ronghua Cui.Journal of Materials Chemistry C, 2014 2(10):836-842), the main principle is that the photoacid generator generates H + under ultraviolet light, and the crosslinking point is broken under heating conditions, increasing Its solubility in organic solvents, however, requires high temperature conditions for degradation, and acid damages the template protective layer; preparation of thermally degradable photoresists (such as articles Wiriya, Thongsomboon, Mark Sherwood, Noel Arellano, ACS MacroLetters.2013 2 (1): 19-22), the principle is that the crosslinking point breaks under heating conditions, which increases the solubility of photoresist in organic solvents, but the use of high temperature conditions limits its applicable range; preparation of reversible photoresist Glue (such as patent CN101957559A), using monomers that can cross-link and de-cross-link under different ultraviolet wavelengths as a cross-linking agent in the side chain, controls the degree of cross-linking through ultraviolet light, so as to control its dissolution in organic solvents performance, but its decrosslinking degree is limited, and after decrosslinking, it is still a macromolecule, and the dissolution effect is not obvious.
以上方法从一定程度上降低了光刻胶对模板的损伤,但是还存在如下问题,如加热限制了使用范围,可逆程度低使降解不明显,使用有机溶剂对环境污染等等。因此,急需一种能够在常温下快速降解且环保的光刻胶。The above methods reduce the damage of the photoresist to the template to a certain extent, but there are still the following problems, such as heating limits the application range, low reversibility makes the degradation not obvious, and the use of organic solvents pollutes the environment and so on. Therefore, there is an urgent need for a photoresist that can rapidly degrade at room temperature and is environmentally friendly.
发明内容Contents of the invention
本发明旨在提供一种双重响应型可降解光刻胶及其制备方法和使用方法,本发明以能在不同波长紫外光下发生交联和解交联的分子作为交联剂,通过不同波长紫外光照射来实现光刻胶的交联和解交联;采用可水解的结构作为聚合物骨架,常温下能在pH>7的碱水溶液中发生降解,最终得到溶于水的小分子。将交联剂、光引发剂、活性单体、连接分子与溶剂混合得到光刻胶体系,然后将此光刻胶应用于纳米压印,表现出优异的压印性能和降解性能,很好地解决了光刻胶对模板的损伤问题。此外,它还具有环保的特性,是一种环保型的可降解光刻胶。The present invention aims to provide a dual-response degradable photoresist and its preparation method and use method. The present invention uses molecules capable of cross-linking and de-cross-linking under different wavelengths of ultraviolet light as cross-linking agents, through different wavelengths of ultraviolet light Photoresist is crosslinked and decrosslinked by light irradiation; a hydrolyzable structure is used as the polymer skeleton, which can be degraded in an alkaline aqueous solution with pH>7 at room temperature, and finally small molecules soluble in water are obtained. The photoresist system is obtained by mixing crosslinking agent, photoinitiator, active monomer, linking molecule and solvent, and then this photoresist is applied to nanoimprinting, which shows excellent imprinting performance and degradation performance, and is well The problem of photoresist damage to the template is solved. In addition, it is also environmentally friendly and is an environmentally friendly degradable photoresist.
本发明提供的一种双重响应型可降解光刻胶的组成和质量份数为:The composition and mass parts of a kind of dual response type degradable photoresist provided by the present invention are:
A可逆交联剂10-40份,优选10~25份A reversible crosslinking agent 10-40 parts, preferably 10-25 parts
B活性单体5-30份,优选5~20份B active monomer 5-30 parts, preferably 5-20 parts
C连接分子10-30份,优选10~20份10-30 parts of C linking molecules, preferably 10-20 parts
D光引发剂1-5份,优选1~3份D photoinitiator 1-5 parts, preferably 1-3 parts
E有机溶剂0-60份,优选40~60份E organic solvent 0-60 parts, preferably 40-60 parts
上述活性单体B为带两个双键的酸酐,优选自下列物质中的一种或它们的混合物:丙烯酸酐、甲基丙烯酸酐、4-戊烯酐、丁烯酸酐、顺芷酸酐、3-甲基-2-丁酸酐或2-己烯酸酐。进一步优选丙烯酸酐、4-戊烯酐或丁烯酸酐。The above-mentioned active monomer B is an acid anhydride with two double bonds, preferably selected from one of the following substances or a mixture thereof: acrylic anhydride, methacrylic anhydride, 4-pentene anhydride, butenoic anhydride, citric anhydride, 3 - Methyl-2-butyric anhydride or 2-hexenoic anhydride. More preferred is acrylic anhydride, 4-pentene anhydride or crotene anhydride.
上述连接分子C为带两个或两个以上巯基的硫醇,优选自下列物质中的一种或它们的混合物:1,2-乙二硫醇、1,4-丁二硫醇、1,3-丙二硫醇、2-羟基-1,3-丙二硫醇、1,6-己二硫醇、1,6-二巯基-3-己硫醚、1,8-辛二硫醇、3,6-二氧杂-1,8-辛烷二硫醇、1,9-壬二硫醇、3,7-二硫杂-1,9-壬二硫醇、2,6-萘基二硫醇、4,4'-二巯基二苯醚、二巯基乙酸乙二醇酯、2-甲基-1,2,3-丙三醇三(3-巯基丙酸)、三羟甲基丙烷三(2-巯基乙酸酯)、季戊四醇四(3-巯基丙酸)。进一步优选3,6-二氧杂-1,8-辛烷二硫醇、1,6-二巯基-3-己硫醚、3,7-二硫杂-1,9-壬二硫醇或1,8-辛二硫醇。The linker C above is a thiol with two or more mercapto groups, preferably one or a mixture of the following substances: 1,2-ethanedithiol, 1,4-butanedithiol, 1, 3-propanedithiol, 2-hydroxy-1,3-propanedithiol, 1,6-hexanedithiol, 1,6-dimercapto-3-hexanethiol, 1,8-octanedithiol , 3,6-dioxa-1,8-octanedithiol, 1,9-nonanedithiol, 3,7-dithia-1,9-nonanedithiol, 2,6-naphthalene dithiol, 4,4'-dimercaptodiphenyl ether, ethylene glycol dimercaptoacetate, 2-methyl-1,2,3-propanetriol tris(3-mercaptopropionic acid), trimethylol propane tris(2-mercaptoacetate), pentaerythritol tetrakis(3-mercaptopropionic acid). Further preferred are 3,6-dioxa-1,8-octanedithiol, 1,6-dimercapto-3-hexylsulfide, 3,7-dithia-1,9-nonaneedithiol or 1,8-octanedithiol.
上述光引发剂D选自下列本领域常用光引发剂中的一种或它们的混合物:α-羟基酮(如:1-羟基-环己基苯甲酮、2-羟基-2-甲基-1-苯基丙酮或2-羟基-2-甲基-1-对羟乙基醚基苯基丙酮)、苯偶酰(如:α,α’-二甲基苯偶酰缩酮)、酰基膦氧化物(如:2,4,6-三甲基苯甲酰基二苯基氧化膦或2,4,6-三甲基苯甲酰基苯基磷酸乙酯)。Above-mentioned photoinitiator D is selected from one or their mixtures in the photoinitiator commonly used in the following art: α-hydroxyketone (such as: 1-hydroxyl-cyclohexyl benzophenone, 2-hydroxyl-2-methyl-1 -phenylacetone or 2-hydroxy-2-methyl-1-p-hydroxyethyl ether phenylacetone), benzil (such as: α,α'-dimethylbenzil ketal), acylphosphine Oxides (such as: 2,4,6-trimethylbenzoyldiphenylphosphine oxide or 2,4,6-trimethylbenzoylphenyl phosphate ethyl ester).
上述有机溶剂E选自下列物质中的一种或它们的混合物:丙酮、三氯甲烷、二氯甲烷、乙醇、异丙醇、正丁醇、乙酸乙酯、环己烷1,4-二氧六环。有机溶剂为选择性组份,当可逆交联剂完全溶于连接分子和活性单体时,可不加有机溶剂。The above-mentioned organic solvent E is selected from one of the following substances or a mixture thereof: acetone, chloroform, dichloromethane, ethanol, isopropanol, n-butanol, ethyl acetate, cyclohexane 1,4-diox six rings. The organic solvent is an optional component. When the reversible cross-linking agent is completely soluble in the linking molecule and the active monomer, no organic solvent can be added.
本发明上述可逆交联剂A的制备方法为:The preparation method of above-mentioned reversible cross-linking agent A of the present invention is:
(1)制备带两个羟基的可逆交联剂主体:(1) Preparation of a reversible cross-linking agent body with two hydroxyl groups:
将摩尔比为1:(1~5):(0.1~1)的苯三酚类物质、乙酰乙酸乙酯类物质、催化剂与溶剂混合,加热到30~90℃,搅拌反应3~12小时。然后清洗过滤,真空干燥,得到带两个羟基的可逆交联剂主体。Mix glucinol substances, ethyl acetoacetate substances, catalysts and solvents with a molar ratio of 1:(1-5):(0.1-1), heat to 30-90°C, and stir for 3-12 hours. Then wash, filter, and dry in vacuum to obtain a reversible cross-linking agent body with two hydroxyl groups.
苯三酚类物质选自:间苯三酚、邻苯三酚、1,2,4-苯三酚、2,4,6-三羟基甲苯、2,4,6-三羟基苯丙酮、2,4-二羟基苄醇、3,4-二羟基苄醇或3,4,5-三羟基甲苯。进一步优选间苯三酚、邻苯三酚或1,2,4-苯三酚。Glycinols are selected from: phloroglucinol, pyrogallol, 1,2,4-glucinol, 2,4,6-trihydroxytoluene, 2,4,6-trihydroxypropiophenone, 2 , 4-dihydroxybenzyl alcohol, 3,4-dihydroxybenzyl alcohol or 3,4,5-trihydroxytoluene. More preferred are phloroglucinol, pyrogallol, or 1,2,4-pyrogallol.
乙酰乙酸乙酯类物质选自:乙酰乙酸乙酯、三氟乙酰乙酸乙酯、2-氟乙酰乙酸乙酯、4-氯乙酰乙酸乙酯、2-甲基乙酰乙酸乙酯、4-溴乙酰乙酸乙酯、2-乙酰基乙酸氯乙酯、乙酰乙酸正丙酯、丙酰乙酸乙酯、3-氧代丙酸甲酯、3-氧代丙酸乙酯、氟代丙酰基乙酸乙酯或3-氯-2-甲基-3-氧代丙酸乙酯。进一步优选乙酰乙酸乙酯、2-甲基乙酰乙酸乙酯、2-氟乙酰乙酸乙酯或4-氯乙酰乙酸乙酯。Ethyl acetoacetate substances are selected from: ethyl acetoacetate, ethyl trifluoroacetoacetate, ethyl 2-fluoroacetoacetate, ethyl 4-chloroacetoacetate, ethyl 2-methylacetoacetate, 4-bromoacetyl Ethyl acetate, chloroethyl 2-acetylacetate, n-propyl acetoacetate, ethyl propionyl acetate, methyl 3-oxopropionate, ethyl 3-oxopropionate, ethyl fluoropropionyl acetate Or 3-chloro-2-methyl-3-oxopropanoic acid ethyl ester. Further preferred is ethyl acetoacetate, ethyl 2-methylacetoacetate, ethyl 2-fluoroacetoacetate or ethyl 4-chloroacetoacetate.
催化剂选自:70~98%浓硫酸、85~98%磷酸、31~36%盐酸、对甲苯磺酸、碘、氨基磺酸、三氟甲磺酸银、甲磺酸、硫酸氢钠、三氟乙酸、草酸、苯磺酸或硝酸铈铵。进一步优选70~98%浓硫酸、85~98%磷酸、碘或对甲苯磺酸。The catalyst is selected from: 70-98% concentrated sulfuric acid, 85-98% phosphoric acid, 31-36% hydrochloric acid, p-toluenesulfonic acid, iodine, sulfamic acid, silver trifluoromethanesulfonate, methanesulfonic acid, sodium bisulfate, three Fluoroacetic acid, oxalic acid, benzenesulfonic acid, or ceric ammonium nitrate. More preferably 70-98% concentrated sulfuric acid, 85-98% phosphoric acid, iodine or p-toluenesulfonic acid.
溶剂选自:去离子水、1,4-二氧六烷、丙酮、甲苯、甲醇、环己烷、二氯甲烷、四氢呋喃、乙氰或三氯甲烷。The solvent is selected from: deionized water, 1,4-dioxane, acetone, toluene, methanol, cyclohexane, dichloromethane, tetrahydrofuran, acetonitrile or chloroform.
(2)制备带两个长链羟基的可逆交联剂主体:(2) Preparation of a reversible cross-linking agent body with two long-chain hydroxyl groups:
将上述(1)中带两个羟基的可逆交联剂主体、卤代醇和缚酸剂按摩尔比为1:(2~5):(4~10)的比例与溶剂混合,加热到60~100℃,冷凝回流,搅拌反应12~48小时。过滤除去缚酸剂,干燥,得到带两个长链羟基的可逆交联剂主体。Mix the reversible crosslinking agent main body with two hydroxyl groups in the above (1), halohydrin and acid binding agent with the solvent in a molar ratio of 1:(2~5):(4~10), and heat to 60~ 100°C, condensed and refluxed, stirred and reacted for 12 to 48 hours. The acid-binding agent was removed by filtration and dried to obtain the main body of the reversible cross-linking agent with two long-chain hydroxyl groups.
上述卤代醇选自:2-溴乙醇、2-(2-溴乙氧基)乙醇、2-氯乙醇、2-(2-氯乙氧基)乙醇、3-溴丙醇、2-溴-1-丙醇、3-溴-2-甲基-1-丙醇、3-溴-2,2-二甲基-1-丙醇、3-氯-1-丙醇、1-氯-2-丙醇、3-氯-2,2-二甲基-1-丙醇、4-溴丁醇、4-碘-1-丁醇、4-氯-1-丁醇、5-溴戊醇、5-氯-1-戊醇、6-溴己醇或6-氯-1-己醇。进一步优选2-溴乙醇、3-溴丙醇、4-溴丁醇、5-溴戊醇或6-溴己醇。Above-mentioned haloalcohol is selected from: 2-bromoethanol, 2-(2-bromoethoxy)ethanol, 2-chloroethanol, 2-(2-chloroethoxy)ethanol, 3-bromopropanol, 2-bromoethanol -1-propanol, 3-bromo-2-methyl-1-propanol, 3-bromo-2,2-dimethyl-1-propanol, 3-chloro-1-propanol, 1-chloro- 2-propanol, 3-chloro-2,2-dimethyl-1-propanol, 4-bromobutanol, 4-iodo-1-butanol, 4-chloro-1-butanol, 5-bromopentyl alcohol, 5-chloro-1-pentanol, 6-bromohexanol or 6-chloro-1-hexanol. Further preference is given to 2-bromoethanol, 3-bromopropanol, 4-bromobutanol, 5-bromopentanol or 6-bromohexanol.
缚酸剂选自:无水碳酸钾、无水碳酸钠、氢氧化钠、氢氧化钾、碘化钾、三乙胺或吡啶。The acid-binding agent is selected from: anhydrous potassium carbonate, anhydrous sodium carbonate, sodium hydroxide, potassium hydroxide, potassium iodide, triethylamine or pyridine.
溶剂选自:丙酮、二甲基甲酰胺(DMF)、二甲基亚砜(DMSO)、乙腈、四氢呋喃或甲苯。The solvent is selected from: acetone, dimethylformamide (DMF), dimethylsulfoxide (DMSO), acetonitrile, tetrahydrofuran or toluene.
(3)制备带两个双键的可逆交联剂:(3) Preparation of a reversible cross-linking agent with two double bonds:
将步骤(1)带两个羟基或步骤(2)带两个长链羟基的可逆交联剂主体、催化剂按摩尔比为1:(2~5)的比例与溶剂混合,在30~80℃下,搅拌混合均匀,然后将混合物冷却至0℃,再向混合物中缓慢滴加摩尔当量为2~5的酰氯类化合物,搅拌反应1.5~6小时,控制反应温度为0±2℃。反应完成后,经过滤、洗涤、真空干燥,得到带两个双键的可逆交联剂。Mix the main body of the reversible crosslinking agent with two hydroxyl groups in step (1) or two long-chain hydroxyl groups in step (2), and the catalyst in a molar ratio of 1:(2~5) with a solvent, and heat it at 30~80°C Stir and mix evenly, then cool the mixture to 0°C, then slowly add acid chloride compounds with a molar equivalent of 2 to 5 into the mixture, stir and react for 1.5 to 6 hours, and control the reaction temperature to 0±2°C. After the reaction is completed, the reversible cross-linking agent with two double bonds is obtained by filtering, washing and vacuum drying.
酰氯类化合物选自:丙烯酰氯、甲基丙烯酰氯、2-氟丙烯酰氯、丁烯酰氯、3-甲基巴豆酰氯、(E)-2-甲基-2-丁烯酰氯、富马酸单乙酯酰氯、4-戊烯酰氯、3-乙氧基丙烯酰氯、(E)-2-庚烯酰氯或反-8-甲基-6-壬酰氯。进一步优选:丙烯酰氯、甲基丙烯酰氯、丁烯酰氯、3-甲基巴豆酰氯或(E)-2-甲基-2-丁烯酰氯。Acyl chloride compounds are selected from: acryloyl chloride, methacryloyl chloride, 2-fluoroacryloyl chloride, crotonoyl chloride, 3-methylcrotonoyl chloride, (E)-2-methyl-2-butenoyl chloride, fumaric acid mono Acetyl chloride, 4-pentenoyl chloride, 3-ethoxyacryloyl chloride, (E)-2-heptenoyl chloride or trans-8-methyl-6-nonanoyl chloride. More preferred: acryloyl chloride, methacryloyl chloride, crotonoyl chloride, 3-methylcrotonoyl chloride or (E)-2-methyl-2-butenoyl chloride.
催化剂选自:三乙胺、吡啶、无水碳酸钾或无水碳酸钠。The catalyst is selected from: triethylamine, pyridine, anhydrous potassium carbonate or anhydrous sodium carbonate.
溶剂选自:四氢呋喃、二氯甲烷、三氯甲烷、丙酮、二甲基甲酰胺(DMF)、二甲基亚砜(DMSO)、乙氰、甲苯、环己烷或1,4-二氧六环。The solvent is selected from: tetrahydrofuran, dichloromethane, chloroform, acetone, dimethylformamide (DMF), dimethyl sulfoxide (DMSO), acetonitrile, toluene, cyclohexane or 1,4-dioxane ring.
本发明提供的一种双重响应型可降解光刻胶的制备方法为:将带两个双键的可逆交联剂A与活性单体B、连接分子C、光引发剂D按比例溶于有机溶剂E中,在避光的条件下搅拌混合均匀,经过滤制得。过滤器孔径大小优选0.2~2μm。The preparation method of a dual-response degradable photoresist provided by the present invention is: dissolving the reversible crosslinking agent A with two double bonds, the active monomer B, the linking molecule C, and the photoinitiator D in proportion to the organic In solvent E, stir and mix uniformly under the condition of avoiding light, and obtain it by filtration. The filter pore size is preferably 0.2-2 μm.
本发明提供的一种双重响应型可降解光刻胶的使用方法为:将光刻胶涂覆于基板上,形成光刻胶薄膜,置于压印机上进行压印,经365nm(20~35mw/cm2)紫外光曝光(2~10分钟),光刻胶固化成型后脱模,在基板上得到光刻胶的压印图形,再将图形转移至基板上(如:离子刻蚀或剥离技术),然后经254nm(14~25mw/cm2)紫外光曝光(10~30分钟),将基板浸泡在pH=9~12的碱性水溶液中(如:氢氧化钠或氢氧化钾水溶液)除去光刻胶。A method for using a dual-response degradable photoresist provided by the present invention is as follows: coating the photoresist on the substrate to form a photoresist film, placing it on an embossing machine for embossing, /cm 2 ) UV exposure (2 to 10 minutes), the photoresist is cured and molded, and the mold is released, and the imprinted pattern of the photoresist is obtained on the substrate, and then the pattern is transferred to the substrate (such as: ion etching or stripping technology), and then exposed to 254nm (14-25mw/cm 2 ) ultraviolet light (10-30 minutes), soak the substrate in an alkaline aqueous solution with a pH of 9-12 (such as sodium hydroxide or potassium hydroxide aqueous solution) Remove photoresist.
将完成压印的模板在254nm(14~25mw/cm2)紫外光下曝光(10~30分钟),再浸泡到pH=9~12的碱性水溶液中(如:氢氧化钠或氢氧化钾水溶液)除去模板上残留的光刻胶。Expose the imprinted template to 254nm (14-25mw/cm 2 ) ultraviolet light (10-30 minutes), and then soak it in an alkaline aqueous solution with a pH of 9-12 (such as sodium hydroxide or potassium hydroxide aqueous solution) to remove residual photoresist on the template.
基板与模板的光刻胶去除过程可分别进行,也可一起完成。The photoresist removal process of the substrate and the template can be performed separately or together.
本发明制备的双重响应型可降解光刻胶克服了模板清洗难的问题,可以通过紫外光(254nm)和碱水(pH>7)处理,使交联点和主链同时断裂,促进模板上残胶的快速溶解,提高了模板的使用寿命和使用效率。此外,使用水溶液清洗降低了对环境的污染。此光刻胶还可以应用于制备其他特殊条件下的微纳图案,例如制备柔性电路。The double-response degradable photoresist prepared by the present invention overcomes the problem of difficult template cleaning, and can be treated by ultraviolet light (254nm) and alkaline water (pH>7), so that the crosslinking point and the main chain are broken at the same time, so as to promote the formation of the template. The rapid dissolution of residual glue improves the service life and efficiency of the template. In addition, cleaning with an aqueous solution reduces environmental pollution. This photoresist can also be applied to the preparation of micro-nano patterns under other special conditions, such as the preparation of flexible circuits.
附图说明Description of drawings
图1为本发明光刻胶的降解反应原理图;Fig. 1 is the schematic diagram of the degradation reaction of photoresist of the present invention;
图1(a)为交联固化后的光刻胶网状结构,经254nm紫外光光照处理后交联点断裂,得到图1(b)所示的线性分子,再经碱水处理,得到图1(c)所示的可溶于水的小分子。Figure 1(a) shows the photoresist network structure after cross-linking and curing. After being treated with 254nm ultraviolet light, the cross-linking points are broken, and the linear molecules shown in Figure 1(b) are obtained, and then treated with alkaline water to obtain the graph. 1(c) shows a water-soluble small molecule.
图2为实施例1所制备的微型图案;Fig. 2 is the miniature pattern prepared by embodiment 1;
图2(a)和图2(c)为压印模板(20×20μm的方形凹槽,线宽20μm条纹),图2(b)和图2(d)为分别对应的光刻胶压印图形(20×20μm的方形柱体,线宽20μm的条纹)。Figure 2(a) and Figure 2(c) are imprint templates (20×20μm square grooves, line width 20μm stripes), and Figure 2(b) and Figure 2(d) are corresponding photoresist imprinting Graphics (square cylinders of 20×20 μm, stripes with a line width of 20 μm).
具体实施方式:detailed description:
实施例1:Example 1:
(1)制备带两个羟基的可逆交联剂主体(1) Preparation of a reversible cross-linking agent body with two hydroxyl groups
取7.2g的间苯三酚,加入到20ml 85%磷酸溶液中,搅拌均匀,加热到60℃,滴加5.6ml的乙酰乙酸乙酯,继续搅拌至完全溶解。保温2小时,室温搅拌6小时。反应完成后,用滤纸过滤,并用大量去离子水清洗至溶液为中性。真空干燥,得到淡黄色固体粉末,为带两个羟基的可逆交联剂主体。Take 7.2g of phloroglucinol, add it to 20ml of 85% phosphoric acid solution, stir evenly, heat to 60°C, add 5.6ml of ethyl acetoacetate dropwise, and continue stirring until completely dissolved. Keep warm for 2 hours and stir at room temperature for 6 hours. After the reaction is completed, filter with filter paper and wash with a large amount of deionized water until the solution is neutral. Dry in vacuo to obtain a light yellow solid powder, which is the main body of a reversible cross-linking agent with two hydroxyl groups.
(2)制备带两个双键的可逆交联剂(2) Preparation of a reversible cross-linking agent with two double bonds
取4.3g上述(1)中产物和4.6g三乙胺,加入到50ml四氢呋喃溶液中,加热到60℃,搅拌30分钟。温度降低到0℃,向混合物中缓慢滴加4.5g丙烯酰氯,搅拌反应2小时。反应结束后,向混合物中加入去离子水,析出白色固体,过滤,并用去离子水冲洗,真空干燥,得到白色粉末,即为带两个双键的可逆交联剂。Take 4.3g of the product in (1) above and 4.6g of triethylamine, add it to 50ml of tetrahydrofuran solution, heat to 60°C, and stir for 30 minutes. The temperature was lowered to 0° C., 4.5 g of acryloyl chloride was slowly added dropwise to the mixture, and the reaction was stirred for 2 hours. After the reaction, deionized water was added to the mixture to precipitate a white solid, which was filtered, rinsed with deionized water, and dried in vacuum to obtain a white powder, which was a reversible cross-linking agent with two double bonds.
(3)双重响应型可降解光刻胶的制备方法(3) Preparation method of dual responsive degradable photoresist
取步骤(2)可逆交联剂(17.5wt%)、丙烯酸酐(8.0wt%)、3,6-二氧杂-1,8-辛烷二硫醇(23.0wt%)和光引发剂1-羟基-环己基苯甲酮(1173)(1.5wt%)与丙酮(50.0wt%)混合,避光搅拌1小时。混合均匀后使用0.2μm的过滤器过滤净化。Get step (2) reversible cross-linking agent (17.5wt%), acrylic anhydride (8.0wt%), 3,6-dioxa-1,8-octanedithiol (23.0wt%) and photoinitiator 1- Hydroxy-cyclohexylbenzophenone (1173) (1.5 wt%) was mixed with acetone (50.0 wt%), and stirred for 1 hour in the dark. After mixing evenly, use a 0.2 μm filter to filter and purify.
(4)双重响应型可降解光刻胶的使用方法(4) How to use dual-response degradable photoresist
将硅片基板在体积比为1:3的30wt%H2O2和98wt%H2SO4混合溶液中加热到170℃,保持5小时,清洗干燥后在0.2wt%3-(三甲氧基甲硅烷基)丙基-2-甲基-2-丙烯酸酯(MPTES)的甲苯溶液中浸泡6小时,然后清洗干燥。再取适量滴加到处理后的硅片基板,在3000rpm条件下旋涂20秒,得到光刻胶薄膜。在压印机上进行压印,经365nm(25mw/cm2)紫外光灯曝光5分钟,固化后脱模,得到光刻胶的压印图形,利用离子刻蚀将图形转移到基板,将基板和刚脱模的模板在254nm(20mw/cm2)紫外光灯下光照15分钟,再浸泡到pH=12的氢氧化钠或氢氧化钾水溶液中5分钟,取出后分别用去离子水、乙醇和丙酮清洗干燥得到表面干净的模板和基板。Heat the silicon substrate to 170°C in a mixed solution of 30wt% H 2 O 2 and 98wt% H 2 SO 4 with a volume ratio of 1:3, keep it for 5 hours, wash and dry it in 0.2wt% 3-(trimethoxy Soak in a toluene solution of silyl)propyl-2-methyl-2-acrylate (MPTES) for 6 hours, then wash and dry. Then take an appropriate amount and add it dropwise to the treated silicon wafer substrate, and spin-coat at 3000 rpm for 20 seconds to obtain a photoresist film. Carry out imprinting on the embossing machine, expose to 365nm (25mw/cm 2 ) ultraviolet light for 5 minutes, release the mold after curing, and obtain the embossed pattern of photoresist, use ion etching to transfer the pattern to the substrate, and the substrate and The template just released from the mold was exposed to 254nm (20mw/cm 2 ) ultraviolet light for 15 minutes, then soaked in sodium hydroxide or potassium hydroxide aqueous solution with pH = 12 for 5 minutes, after taking it out, wash it with deionized water, ethanol and Wash and dry with acetone to obtain templates and substrates with clean surfaces.
实施例2:Example 2:
(1)制备带两个羟基的可逆交联剂主体(1) Preparation of a reversible cross-linking agent body with two hydroxyl groups
取7.2g的间苯三酚,加入到20ml 85wt%磷酸溶液中,搅拌均匀,加热到60℃,滴加6ml的4-氯乙酰乙酸乙酯,继续搅拌至完全溶解。保温2小时,室温搅拌6小时。反应完成后,用滤纸过滤,并用大量去离子水清洗至溶液为中性。真空干燥,得到淡黄色固体粉末,为带两个羟基的可逆交联剂主体。Take 7.2g of phloroglucinol, add it into 20ml of 85wt% phosphoric acid solution, stir evenly, heat to 60°C, add 6ml of ethyl 4-chloroacetoacetate dropwise, and continue stirring until completely dissolved. Keep warm for 2 hours and stir at room temperature for 6 hours. After the reaction is completed, filter with filter paper and wash with a large amount of deionized water until the solution is neutral. Dry in vacuo to obtain a light yellow solid powder, which is the main body of a reversible cross-linking agent with two hydroxyl groups.
(2)制备带两个双键的可逆交联剂(2) Preparation of a reversible cross-linking agent with two double bonds
取5.1g上述(1)中产物和4.6g三乙胺,加入到60ml四氢呋喃溶液中,加热到60℃,搅拌30分钟。温度降低到0℃,向混合物中缓慢滴加4.5g丙烯酰氯,搅拌反应2小时。反应结束后,向混合物中加入去离子水,析出白色固体,过滤,并用去离子水冲洗,真空干燥,得到白色粉末,即为带两个双键的可逆交联剂。Take 5.1 g of the product in (1) above and 4.6 g of triethylamine, add it to 60 ml of tetrahydrofuran solution, heat to 60° C., and stir for 30 minutes. The temperature was lowered to 0° C., 4.5 g of acryloyl chloride was slowly added dropwise to the mixture, and the reaction was stirred for 2 hours. After the reaction, deionized water was added to the mixture to precipitate a white solid, which was filtered, rinsed with deionized water, and dried in vacuum to obtain a white powder, which was a reversible cross-linking agent with two double bonds.
(3)双重响应型可降解光刻胶的制备方法(3) Preparation method of dual responsive degradable photoresist
称取步骤(2)可逆交联剂(19.8wt%)、丙烯酸酐(7.7wt%)、3,6-二氧杂-1,8-辛烷二硫醇(21.0wt%)和光引发剂1-羟基-环己基苯甲酮(1173)(1.5wt%)与丙酮(50.0wt%)混合,避光搅拌1小时。混合均匀后使用0.2μm的过滤器过滤净化。Weigh step (2) reversible crosslinking agent (19.8wt%), acrylic anhydride (7.7wt%), 3,6-dioxa-1,8-octanedithiol (21.0wt%) and photoinitiator 1 -Hydroxy-cyclohexylbenzophenone (1173) (1.5 wt%) was mixed with acetone (50.0 wt%) and stirred for 1 hour in the dark. After mixing evenly, use a 0.2 μm filter to filter and purify.
(4)双重响应型可降解光刻胶的使用方法(4) How to use dual-response degradable photoresist
同实施例1。With embodiment 1.
实施例3:Example 3:
(1)制备带两个羟基的可逆交联剂主体(1) Preparation of a reversible cross-linking agent body with two hydroxyl groups
同实施例1。With embodiment 1.
(2)制备带两个长链羟基的可逆交联剂主体(2) Preparation of a reversible cross-linking agent body with two long-chain hydroxyl groups
取3g上述(1)中产物、7g无水碳酸钾加入到装有100ml丙酮的三口烧瓶中,加热到80℃,再向混合物中中滴加4.3g 3-溴-1-丙醇,搅拌反应20小时。反应结束后,过滤除去碳酸钾,将滤液减压旋蒸,得到油状物体,再通过柱层析分离(淋洗液为丙酮:石油醚=2:1)提纯,得到白色固体,得到为带两个长链羟基的可逆交联剂主体。Take 3g of the product in (1) above and 7g of anhydrous potassium carbonate and add it to a three-necked flask filled with 100ml of acetone, heat it to 80°C, then add 4.3g of 3-bromo-1-propanol dropwise to the mixture, and stir the reaction 20 hours. After the reaction, potassium carbonate was removed by filtration, and the filtrate was rotary evaporated under reduced pressure to obtain an oily substance, which was then purified by column chromatography (eluent: acetone:petroleum ether=2:1) to obtain a white solid. A reversible cross-linking agent body with a long-chain hydroxyl group.
(3)制备带两个双键的可逆交联剂(3) Preparation of a reversible cross-linking agent with two double bonds
取1g上述(2)中产物和0.7g三乙胺,加入到30ml四氢呋喃溶液中,加热到60℃,搅拌30分钟。温度降低到0℃,向混合物中缓慢滴加0.6g丙烯酰氯,搅拌反应2小时。反应结束后,向混合物中加入去离子水,析出白色固体,过滤,并用去离子水冲洗,真空干燥,得到白色粉末,即为带两个双键的可逆交联剂。Take 1 g of the product in (2) above and 0.7 g of triethylamine, add it to 30 ml of tetrahydrofuran solution, heat to 60° C., and stir for 30 minutes. The temperature was lowered to 0° C., 0.6 g of acryloyl chloride was slowly added dropwise to the mixture, and the reaction was stirred for 2 hours. After the reaction, deionized water was added to the mixture to precipitate a white solid, which was filtered, rinsed with deionized water, and dried in vacuum to obtain a white powder, which was a reversible cross-linking agent with two double bonds.
(4)双重响应型可降解光刻胶的制备方法(4) Preparation method of dual responsive degradable photoresist
称取步骤(3)可逆交联剂(21.5wt%)、丙烯酸酐(7.0wt%)、3,6-二氧杂-1,8-辛烷二硫醇(20.0wt%)和光引发剂1-羟基-环己基苯甲酮(1173)(1.5wt%)与丙酮(50.0wt%)混合,避光搅拌1小时。混合均匀后使用0.2μm的过滤器过滤净化。Weigh step (3) reversible crosslinking agent (21.5wt%), acrylic anhydride (7.0wt%), 3,6-dioxa-1,8-octanedithiol (20.0wt%) and photoinitiator 1 -Hydroxy-cyclohexylbenzophenone (1173) (1.5 wt%) was mixed with acetone (50.0 wt%) and stirred for 1 hour in the dark. After mixing evenly, use a 0.2 μm filter to filter and purify.
(5)双重响应型可降解光刻胶的使用方法(5) How to use dual-response degradable photoresist
同实施例1。With embodiment 1.
实施例4:Example 4:
(1)制备带两个羟基的可逆交联剂主体(1) Preparation of a reversible cross-linking agent body with two hydroxyl groups
同实施例1。With embodiment 1.
(2)制备带两个双键的可逆交联剂(2) Preparation of a reversible cross-linking agent with two double bonds
同实施例1。With embodiment 1.
(3)双重响应型可降解光刻胶的制备方法(3) Preparation method of dual responsive degradable photoresist
称取步骤(2)可逆交联剂(16.1wt%)、4-戊烯酐(9.6wt%)、二巯基乙酸乙二醇酯(22.8wt%)和光引发剂1-羟基-环己基苯甲酮(1173)(1.5wt%)与丙酮(50.0wt%)混合,避光搅拌1小时。混合均匀后使用0.2μm的过滤器过滤净化。Weigh step (2) reversible cross-linking agent (16.1wt%), 4-pentene anhydride (9.6wt%), ethylene glycol dimercaptoacetate (22.8wt%) and photoinitiator 1-hydroxyl-cyclohexylbenzene Ketone (1173) (1.5wt%) was mixed with acetone (50.0wt%) and stirred for 1 hour in the dark. After mixing evenly, use a 0.2 μm filter to filter and purify.
(4)双重响应型可降解光刻胶的使用方法(4) How to use dual-response degradable photoresist
同实施例1。With embodiment 1.
实施例5:Example 5:
(1)制备带两个羟基的可逆交联剂主体(1) Preparation of a reversible cross-linking agent body with two hydroxyl groups
同实施例1。With embodiment 1.
(2)制备带两个双键的可逆交联剂(2) Preparation of a reversible cross-linking agent with two double bonds
同实施例1。With embodiment 1.
(3)双重响应型可降解光刻胶的制备方法(3) Preparation method of dual responsive degradable photoresist
称取步骤(2)可逆交联剂(21.9wt%)、4-戊烯酐(13.6wt%)、1,2-乙二硫醇(13.0wt%)和光引发剂1-羟基-环己基苯甲酮(1173)(1.5wt%)与丙酮(50.0wt%)混合,避光搅拌1小时。混合均匀后使用0.2μm的过滤器过滤净化。Weigh step (2) reversible crosslinking agent (21.9wt%), 4-pentene anhydride (13.6wt%), 1,2-ethanedithiol (13.0wt%) and photoinitiator 1-hydroxyl-cyclohexylbenzene Methanone (1173) (1.5wt%) and acetone (50.0wt%) were mixed and stirred for 1 hour in the dark. After mixing evenly, use a 0.2 μm filter to filter and purify.
(4)双重响应型可降解光刻胶的使用方法(4) How to use dual-response degradable photoresist
同实施例1。With embodiment 1.
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