CN106032036B - cutting device - Google Patents

Abstract

The present invention provides a cutting device, which compactly constitutes an ultraviolet irradiating member that irradiates a wafer with ultraviolet rays to impart hydrophilicity, prevents chips generated during cutting from adhering to the surface of the wafer, and can be divided into individual parts after the wafer is divided. UV rays are irradiated to the dicing tape after the device to reduce the adhesive force. The cutting device includes an ultraviolet irradiation member that irradiates the surface of the wafer with ultraviolet rays to impart hydrophilicity and irradiates the dicing tape with ultraviolet rays to reduce the adhesive force. The ultraviolet irradiation member includes: an ultraviolet irradiation lamp, which irradiates ultraviolet rays, and the ultraviolet rays include wavelengths that irradiate the surface of the wafer to generate ozone and generate active oxygen, and wavelengths that irradiate the dicing tape to reduce the adhesive force; the first frame support member, It is arranged on the lower side of the ultraviolet irradiation lamp, and supports the annular frame supporting the wafer by the dicing tape; The frame supports it.

Description

cutting device

technical field

The present invention relates to a cutting device for cutting wafers such as semiconductor wafers.

Background technique

In the manufacturing process of semiconductor devices, on the surface of a substantially disc-shaped semiconductor wafer, a plurality of regions are divided by dividing lines arranged in a grid pattern, and ICs (Integrated Circuits) are formed in the divided regions. , LSI (Large-scale Integration: large-scale integrated circuits) and other devices. Then, the semiconductor wafer is cut along planned dividing lines, thereby dividing the region where the device is formed, and manufacturing individual devices. In addition, optical devices such as light-emitting diodes and laser diodes are divided into individual optical devices such as light-emitting diodes and laser diodes by cutting along the planned dividing line for optical device wafers formed by laminating gallium nitride-based compound semiconductors on the surface of the sapphire substrate. in the device.

The above-mentioned cutting along the planned dividing line of the semiconductor wafer or the optical device wafer is usually performed by a cutting device called a slicer. This cutting device includes: a holding member that holds wafers such as semiconductor wafers; a cutting member that includes a cutting tool that cuts a workpiece held on the holding member; and a cutting feed member that makes the holding member and The cutting member relatively moves along the cutting feed direction; the index feed member moves the holding member and the cutting member relatively along the index feed direction perpendicular to the cutting feed direction; The cassette mounting table mounts the cassette containing the wafer, the wafer is stuck on the dicing tape whose adhesive force is reduced due to the irradiation of ultraviolet rays, and is supported on the ring frame by the dicing tape; the unloading member includes The wafers stored in the cassette placed on the cassette mounting table are carried out to the temporary storage area; and the transfer member transfers the wafers carried out to the temporary storage area to the holding member. The cutting unit includes a spindle unit including a rotating spindle and a drive mechanism that drives a cutting tool mounted on the spindle and the rotating spindle to rotate, and performs cutting while supplying a cutting fluid to a cutting portion of the cutting tool during cutting. .

However, in the above-mentioned cutting device, there is a problem that chips generated when the wafer is cut by the cutting tool are mixed in the cutting fluid and float on the surface of the wafer, thereby causing the chips to adhere to the surface of the wafer and cause Pollution. That is, chips generated by cutting a wafer adhere to the surface of the wafer when mixed with the cutting fluid and float on the surface of the wafer, and when the cutting fluid disappears and dries, the chips adhere firmly to the surface of the wafer.

In order to solve such a problem, Patent Document 1 below discloses a cutting device including a first ultraviolet irradiating member and a second ultraviolet irradiating member, and the first ultraviolet irradiating member is arranged under the above-mentioned cartridge mounting table. On the side, the wafer is irradiated with ultraviolet rays to impart hydrophilicity, the second ultraviolet irradiation member irradiates ultraviolet rays to the dicing tape to reduce its adhesive force, and before cutting the wafer, the surface of the wafer is irradiated with ultraviolet rays to generate ozone and active oxygen The cutting surface is given hydrophilicity to prevent the chips generated during cutting from adhering to the surface of the wafer, and after the wafer is divided into individual devices, the dicing tape is irradiated with ultraviolet rays to reduce its adhesive force, making the bonding The next pick-up process becomes easy.

Patent Document 1: Japanese Patent Laid-Open No. 2006-295050

In addition, in the cutting apparatus described above, the first ultraviolet irradiation member for imparting hydrophilicity by irradiating ultraviolet rays to the wafer and the second ultraviolet irradiation member for reducing the adhesive force by irradiating ultraviolet rays to the dicing tape are separately arranged, and the Space is restricted, which hinders miniaturization of the device.

Contents of the invention

The present invention has been made in view of the above circumstances, and its main technical problem is to provide a cutting device that is compactly configured with an ultraviolet ray irradiation member that irradiates ultraviolet rays to the wafer to impart hydrophilicity, thereby preventing damage to the wafer during cutting. Chips generated during the process adhere to the surface of the wafer, and the ultraviolet irradiation member can irradiate ultraviolet rays to the dicing tape after the wafer is divided into individual devices to reduce its adhesive force.

In order to solve the above-mentioned main technical problems, according to the present invention, there is provided a cutting device including: a holding member that holds a wafer; a cutting member that includes a cutting tool for cutting the wafer held by the holding member; Cutting feed member, which makes the holding member and the cutting member relatively move along the cutting feeding direction; index feeding member, which makes the holding member and the cutting member move along the indexing feed perpendicular to the cutting feeding direction Direction relative movement; Cassette loading mechanism, which has a cassette loading table, the cassette loading table is loaded with a cassette containing a wafer, the wafer is pasted on the dicing tape whose adhesive force is reduced due to the irradiation of ultraviolet rays, and by means of The dicing tape is supported by a ring-shaped frame; an unloading member that unloads the wafers stored in the cassette placed on the pod mounting table to a temporary storage area; The wafer in the region is conveyed to the holding member, and the cutting device is characterized in that the cutting device includes an ultraviolet ray irradiation member that irradiates ultraviolet rays to the surface of the wafer carried out by the carrying out member to impart hydrophilicity, and The dicing tape is irradiated with ultraviolet rays to reduce the adhesive force, and the ultraviolet irradiation member includes: an ultraviolet irradiation lamp that irradiates ultraviolet rays including wavelengths that irradiate the surface of the wafer to generate ozone and generate active oxygen, and a wavelength at which the dicing tape is irradiated to reduce the adhesive force; a first frame support member is disposed on the lower side of the ultraviolet irradiation lamp, and supports the ring-shaped frame that supports the wafer via the dicing tape; and a second frame A support member is disposed above the ultraviolet irradiation lamp, supports the ring-shaped frame that supports the wafer via the dicing tape, and uses the first frame when irradiating ultraviolet rays to the surface of the wafer to impart hydrophilicity. The support member supports the ring-shaped frame that supports the wafer via the dicing tape, and when the dicing tape is irradiated with ultraviolet rays to reduce the adhesive force, the second frame support member supports the ring that supports the wafer via the dicing tape. shaped frame for support.

The above-mentioned ultraviolet irradiation lamp is preferably a low-pressure mercury lamp.

In the cutting device of the present invention, the ultraviolet irradiation member irradiates ultraviolet rays to the surface of the wafer carried out by the carrying-out member to impart hydrophilicity, and irradiates ultraviolet rays to the dicing tape to reduce its adhesive force, and the ultraviolet irradiation member includes: a lamp for irradiating ultraviolet rays including wavelengths that irradiate the surface of the wafer to generate ozone and generate active oxygen, and wavelengths that irradiate the dicing tape to reduce its adhesive force; the first frame supporting member is equipped with Provided on the lower side of the ultraviolet irradiation lamp, supporting the ring-shaped frame that supports the wafer through the dicing tape; The frame is supported, and when the surface of the wafer is irradiated with ultraviolet rays to impart hydrophilicity, the ring-shaped frame that supports the wafer through the dicing tape is supported by the first frame supporting member, and the adhesive force is increased when the dicing tape is irradiated with ultraviolet rays. When lowering, the ring-shaped frame that supports the wafer through the dicing tape is supported by the second frame support member, so a single ultraviolet irradiation lamp can be used to implement the hydrophilicity of irradiating ultraviolet rays to the surface of the wafer to impart hydrophilicity. The application process and the adhesive force reduction process which irradiate ultraviolet-ray to a dicing tape and reduce adhesive force. Therefore, since there is no need to arrange an ultraviolet irradiation lamp for imparting hydrophilicity and an ultraviolet irradiation lamp for reducing adhesive force, the limitation of the space in the cutting device is eased, and the size of the device can be reduced.

Description of drawings

Figure 1 is a perspective view of a cutting device constructed in accordance with the present invention.

Fig. 2 is a perspective view of a cartridge mounting mechanism included in the cutting device shown in Fig. 1 .

3 is an explanatory view showing a state where a cassette mounting table constituting a cassette loading mechanism equipped in the cutting device shown in FIG. 1 is positioned at a first loading/unloading position.

4 is an explanatory view showing a state where a cassette mounting table constituting a cassette loading mechanism equipped in the cutting device shown in FIG. 1 is positioned at a second loading and unloading position.

5 is an explanatory view showing a state where a cassette mounting table constituting a cassette loading mechanism equipped in the cutting device shown in FIG. 1 is positioned at a third carrying-in/out position.

Label description

2: device housing;

3: Hold the component;

4: Spindle unit;

43: cutting tool;

44: cutting fluid supply nozzle;

5: camera components;

6: display components;

7: Box loading mechanism;

71: box loading table;

72: Lifting member;

8: UV irradiation components;

81: shell;

811: Ultraviolet irradiation room;

82: Ultraviolet irradiation lamp;

83: the first frame support member;

84: the second frame supporting member;

10: box;

11: chip;

12: ring frame;

13: cutting belt;

15: Move in and out components;

16: the first conveying member;

17: cleaning components;

18: The second conveying member.

Detailed ways

Hereinafter, preferred embodiments of the wafer cutting method and cutting apparatus according to the present invention will be described in detail with reference to the drawings.

In FIG. 1 , a perspective view of a cutting device constructed according to the invention is shown.

The cutting device in the illustrated embodiment includes a substantially rectangular parallelepiped-shaped device case 2 . A holding member 3 for holding a wafer as a workpiece is disposed in the apparatus case 2 so as to be movable in a cutting feed direction indicated by an arrow X that is a cutting feed direction. The holding member 3 includes a suction chuck support base 31 and a suction chuck 32 attached to the suction chuck support base 31, and holds, for example, a disk-shaped wafer as a workpiece on the suction chuck support base 31 by a suction member not shown. The surface of the suction chuck 32 is the holding surface. In addition, the holding member 3 is configured to be rotatable by a rotation mechanism not shown.

The cutting device in the illustrated embodiment includes a spindle unit 4 as a cutting member. The spindle unit 4 is provided with: a spindle housing 41, which is mounted on an unillustrated mobile base, and along the indexing direction shown by the arrow Y perpendicular to the cutting feed direction shown by the arrow X, and with the suction The surface of the chuck 32, that is, the holding surface is vertically moved and adjusted in the cutting direction indicated by the arrow Z; the rotating spindle 42 is rotatably supported on the spindle housing 41, and is rotationally driven by a rotary drive mechanism not shown. and a cutting tool 43 mounted on the rotating spindle 42 . Cutting fluid supply nozzles 44 connected to a cutting fluid supply source (not shown) are disposed on both sides of the cutting blade 43 .

The cutting device in the illustrated embodiment includes an imaging member 5 for photographing the surface of the wafer held on the surface of the suction chuck 32 constituting the above-mentioned holding member 3, and detecting the surface of the wafer that should pass through the above-mentioned cutting tool. 43 cutting area, or confirm the state of the cutting groove. The imaging means 5 is constituted by an optical means such as a microscope or a CCD camera. In addition, the cutting device in the illustrated embodiment includes a display unit 6 for displaying an image captured by the imaging unit 5 .

The cutting apparatus in the illustrated embodiment includes a cassette 10 for storing wafers as workpieces. The cassette 10 is provided with a workpiece loading and unloading opening 101 for carrying in and out wafers as workpieces, and a plurality of mounting racks 102 for mounting wafers are provided in both side walls of the cassette 10 so as to face each other in the vertical direction. On the surface. As shown in FIG. 1 , a wafer 11 as a workpiece accommodated in a cassette 10 is formed in a disk shape, and ICs are formed in a plurality of regions on the surface divided by planned dividing lines 111 formed in a lattice shape. , LSI and other devices 112 . Wafer 11 formed in this way is pasted on the surface of dicing tape 13 attached to ring-shaped frame 12 . The dicing tape 13 uses a so-called UV tape in which the adhesive force of the adhesive layer of the dicing tape 13 is lowered by irradiation with ultraviolet rays of a predetermined wavelength. The cassette 10 containing the wafer 11 is placed on the cassette mounting table 71 of the cassette mounting mechanism 7 so that the workpiece is directed from the loading/unloading opening 101 to the temporary storage area 14 . A positioning member 711 for positioning when the cassette 10 is mounted is provided on the upper surface of the cassette mounting table 71 . In addition, the cassette mounting mechanism 7 will be described in detail later.

The cutting apparatus in the illustrated embodiment includes a carry-out member 15 for carrying out the wafer 11 as a workpiece stored in the cassette 10 to the temporary storage area 14 and carrying the chipped wafer 11 into the cassette 10 ; the first conveying member 16, which conveys the wafer 11 carried out by the carrying-out member 15 onto the above-mentioned holding member 3; the cleaning member 17, which cleans the wafer 11 after cutting on the holding member 3; and the second The transfer member 18 transfers the wafer 11 cut on the holding member 3 to the cleaning member 17 .

Next, the cartridge mounting mechanism 7 will be described with reference to FIGS. 2 and 3 .

The cassette mounting mechanism 7 in the illustrated embodiment includes: an ultraviolet irradiation member 8 disposed below the cassette mounting table 71; and an elevating member 72 for vertically moving the cassette mounting table 71.

The ultraviolet irradiation unit 8 includes a case 81 whose upper wall is constituted by the cartridge mounting table 71 . As shown in FIGS. 2 and 3 , the housing 81 includes an ultraviolet irradiation chamber 811 having an opening 811 a formed on the loading/unloading member 15 side (right side in FIG. 3 ). An ultraviolet irradiation lamp 82 is disposed in the middle part of the ultraviolet irradiation chamber 811 of the casing 81 in the vertical direction, and the ultraviolet irradiation lamp 82 irradiates ultraviolet rays having wavelengths that irradiate the surface of the wafer 11 to generate ozone and generate active oxygen. wavelength; and a wavelength at which the adhesive force is reduced by irradiating the dicing tape 13 . The ultraviolet irradiation lamp 82 is constituted by a low-pressure mercury lamp that irradiates ultraviolet rays having a wavelength of 150 nm to 400 nm. In addition, in the ultraviolet irradiation chamber 811 formed in the housing 81, the first frame support member 83 for supporting the ring-shaped frame 12 that is cut by cutting is provided on the lower side of the ultraviolet irradiation lamp 82. The belt 13 supports the wafer 11 , and a second frame support member 84 for supporting the ring-shaped frame 12 supporting the wafer 11 via the dicing belt 13 is disposed above the ultraviolet irradiation lamp 82 . The first frame support member 83 is constituted by a pair of support frames 831, 831, which are respectively provided inside the side walls 812, 813 constituting the casing 81 so as to face each other under the ultraviolet irradiation lamp 82. On the surface, the second frame support member 84 is composed of a pair of support frames 841, 841, which are respectively provided on the side wall 812, 813 on the inner surface.

As shown in FIGS. 2 and 3 , with respect to the casing 81 constituting the above-mentioned ultraviolet irradiation member 8 , a moving block 73 and a guided member 74 that are raised and lowered by a lifting member 72 are mounted on a rear wall 814 .

As shown in FIG. 2 , the lifting member 72 in the illustrated embodiment includes: a guide member 721 arranged in the vertical direction; and a moving member 722 that moves the moving block 73 along the guide member 721 . The guide member 721 includes a pair of guide rails 721 a , 721 a arranged parallel to each other and slidably fitted into a pair of guided grooves 741 , 741 provided in the guided member 74 . The moving member 722 is composed of an externally threaded rod 722a arranged vertically between a pair of guide rails 721a and 721a constituting the guide member 721, and having an upper end portion rotatably attached to the guide member 721. The bearing 721b is supported; and the pulse motor 722b capable of forward rotation and reverse rotation, which makes the externally threaded rod 722a rotate, as shown in Figure 3, the externally threaded rod 722a is screwed in the internally threaded hole 731 provided on the moving block 73 . Therefore, if the pulse motor 722b is driven to rotate in one direction, the moving block 73 and the guided member 74 rise along the external threaded rod 722a and a pair of guide rails 721a, 721a, and if the pulse motor 722b is rotated in the other direction, the moving block 73 And the guided member 74 descends along the externally threaded rod 722a and a pair of guide rails 721a, 721a. The moving block 73 and the guided member 74 raised and lowered in this way are positioned at the first unloading and loading position, the second unloading and loading position, and the third unloading and loading position, and at the first unloading and loading position, as shown in FIG. The cassette 10 on the cassette mounting table 71 is opposed to the above-mentioned unloading and loading member 15, and at the second unloading and loading position, as shown in FIG. The loading/unloading member 15 faces, and at the third loading/unloading position, as shown in FIG. In addition, at the first loading/unloading position, the position of the elevating member 72 is adjusted in accordance with the housing position of the wafers stored in the cassette 10 placed on the cassette mounting table 71 .

The cutting device in the illustrated embodiment is configured as described above, and its operation will be described below.

When cutting the wafer 11 , the cassette 10 containing the wafer 11 is placed at a predetermined position on the cassette mounting table 71 of the cassette mounting mechanism 7 . In addition, when the cassette 10 is placed on the cassette mounting table 71, the cassette mounting table 71 is positioned at the first loading/unloading position as shown in FIG. 3 . By placing the cassette 10 at a predetermined position on the cassette mounting table 71 at the first loading/unloading position as shown in FIG. 3 , preparations for the chipping operation of the wafer 11 stored in the cassette 10 are completed.

Once the preparations for the cutting operation are completed as described above, when the cutting start switch (not shown) is turned on, the lifting member 72 of the cartridge loading mechanism 7 is operated to move the cassette placed on the cassette mounting table 71. The predetermined position of 10 is positioned at the first carrying-in/out position shown in FIG. 3 . After the cassette 10 is positioned at the first loading/unloading position shown in FIG. The wafer 11 is supported by means of a dicing tape 13 . After the ring-shaped frame 12 supporting the wafer 11 via the dicing tape 13 is held by the unloading member 15 in this way, the unloading member 15 is positioned at the position indicated by the two-dot chain line in FIG. 3 .

Next, the elevating member 72 of the cartridge mounting mechanism 7 is operated to position the ultraviolet irradiation member 8 disposed below the cartridge mounting table 71 at the third loading and unloading position shown in FIG. 5 . When the ultraviolet irradiating member 8 is positioned at the third loading/unloading position shown in FIG. After the ultraviolet ray irradiation member 8 is positioned at the 3rd carrying-in position shown in FIG. The inside of the irradiation chamber 811 is irradiated, and the ring-shaped frame 12 is placed on a pair of support frames 831 and 831 constituting the first frame support member 83 . Therefore, the wafer 11 supported by the dicing tape 13 on the ring-shaped frame 12 placed on the pair of support frames 831 , 831 is positioned so that its surface faces the ultraviolet irradiation lamp 82 . In this way, after placing the ring-shaped frame 12 supporting the wafer 11 via the dicing tape 13 on the pair of supporting frames 831, 831 constituting the first frame supporting member 83, the loading and unloading member 15 is positioned as shown in FIG. The location indicated by the dash-dotted line.

As described above, if the ring-shaped frame 12 supporting the wafer 11 via the dicing tape 13 is placed on the pair of support frames 831, 831 constituting the first frame support member 83, and the unloading and loading member 15 is positioned on the 5, the ultraviolet irradiation lamp 82 disposed in the ultraviolet irradiation chamber 811 is turned on to irradiate the wafer 11 mounted on the support frame 831 with ultraviolet rays having a wavelength of 150 nm to 400 nm. As a result, the ultraviolet rays with a wavelength of 184.9 nm decompose oxygen molecules to generate ozone (O ₃ ), and the ultraviolet rays with a wavelength of 253.7 nm decompose ozone (O ₃ ) to generate high-energy active oxygen. The active oxygen generated in this way acts on the surface of the wafer 11, thereby improving the hydrophilicity of the surface of the wafer 11 (hydrophilicity imparting step). After implementing the hydrophilicity imparting step in this way, the ultraviolet irradiation lamp 82 is turned off.

After the above-mentioned hydrophilicity imparting process is carried out, the unloading and loading member 15 is operated to hold the ring-shaped frame 12 supported by the pair of support frames 831, 831, and 831, and support the wafer 11 with the dicing tape 13. In this way, the unloading and loading member 15 of the ring-shaped frame 12 that supports the wafer 11 through the dicing tape 13 is held, and the wafer 11 (hereinafter, only the wafer 11 under the state that the wafer 11 is supported on the ring-shaped frame 12 through the dicing tape 13 11 is referred to as a wafer 11) and carried out to the temporary storage area 14. The wafer 11 carried out to the temporary storage area 14 is transferred to the holding surface of the suction chuck 32 constituting the above-mentioned holding member 3 by the turning operation of the first transfer member 16, and the wafer 11 is sucked and held on the suction chuck 32. . The holding member 3 holding the wafer 11 by suction in this way is moved to directly below the imaging member 5 . When the holding member 3 is positioned directly below the imaging member 5, the planned dividing line 111 formed on the wafer 11 is detected by the imaging member 5, and is moved and adjusted along the indexing direction of the spindle unit 4, that is, the arrow Y direction, to perform Precise position alignment work.

Then, by moving the holding member 3 holding the wafer 11 by suction in the direction indicated by the arrow X (the direction perpendicular to the rotation axis of the cutting blade 43 ) as the cutting feed direction, the cutting blade 43 moves along the The predetermined dividing line 111 cuts the wafer 11 held on the holding member 3 (cutting step). That is, since the cutting tool 43 is installed on the spindle unit 4 and is driven to rotate, the spindle unit 4 moves along the direction shown by the arrow Y as the indexing direction and the direction shown by the arrow Z as the cutting direction. The direction is moved and adjusted and positioned. Therefore, by moving the holding member 3 in the cutting feed direction shown by the arrow X along the lower side of the cutting tool 43, the wafer 11 held on the holding member 3 is cut. The cutter 43 cuts along a predetermined dividing line 111 . By cutting the wafer 11 along the planned dividing line 111 in this way, the wafer 11 is divided into individual devices. The divided devices do not become scattered due to the action of the dicing tape 13 , but maintain the state of the wafer 11 supported by the ring-shaped frame 12 via the dicing tape 13 .

In the cutting step described above, the cutting fluid is supplied from the cutting fluid supply nozzle 44 to the cutting portion of the cutting blade 43 that cuts the wafer 11 . Therefore, chips generated by cutting by the cutting tool 43 are mixed in the cutting fluid and float on the surface of the wafer 11 , that is, the cutting surface. However, since the surface of the wafer 11, i.e., the cutting surface, has increased hydrophilicity through the above-mentioned hydrophilicity-imparting step, and maintains a wet state, chips are not firmly attached to the surface of the wafer 11, i.e., the cutting surface. .

After the cutting process is completed as described above, the divided devices supported on the annular frame 12 via the dicing tape 13 (hereinafter referred to as the wafer 11 after cutting) are returned to the position where the wafer 11 was initially sucked and held, Here, the suction holding of the chipped wafer 11 is released. Next, the chipped wafer 11 is transported by the second transport member 18 to the cleaning unit 17, where chips generated during the cutting are cleaned and removed (cleaning step). In this cleaning step, as described above, since the upper surface of the wafer 11, that is, the cut surface, is given hydrophilicity, chips generated during cutting do not firmly adhere to the upper surface of the wafer 11, that is, the cut surface. Cutting chips can be easily removed. The chipped wafer 11 cleaned in this way is transported to the temporary storage area 14 by the first transport member 16 .

On the other hand, the cassette placement mechanism 7 positions the ultraviolet irradiation member 8 at the second loading and unloading position shown in FIG. 4 . Then, the loading/unloading member 15 is operated, and the ring-shaped frame 12 supporting the cut wafer 11 transported to the temporary storage area 14 through the dicing belt 13 is inserted into the ultraviolet irradiation chamber 811 through the opening 811a. , and place the ring-shaped frame 12 on a pair of support frames 841 and 841 constituting the second frame support member 84 . Therefore, the back surface of the dicing tape 13 attached to the ring-shaped frame 12 mounted on the pair of support frames 841 and 841 is positioned so as to face the ultraviolet irradiation lamp 82 . In this way, after placing the ring-shaped frame 12 supporting the diced wafer 11 via the dicing tape 13 on the pair of support frames 841, 841 constituting the second frame support member 84, the unloading and loading member 15 is positioned on the In the position indicated by the dashed-two dotted line in FIG. 4 , the ultraviolet irradiation lamp 82 arranged in the ultraviolet irradiation chamber 811 is turned on, and the dicing tape 13 on which the cut wafer 11 is pasted is irradiated with ultraviolet rays having a wavelength of 150 nm to 400 nm. ultraviolet light. As a result, the adhesive strength of the dicing tape 13 is lowered by irradiating the dicing tape 13 with ultraviolet light having a wavelength of 300 to 400 nm (adhesive strength reducing step). By performing the adhesive force reducing step in this way, in the pick-up step that is the next step, since the individual devices are separated from the dicing tape 13 , pick-up becomes easy.

After irradiating ultraviolet rays to the dicing tape 13 on which the diced wafer 11 carried to the ultraviolet irradiation member 8 is attached with ultraviolet rays as described above, the ultraviolet irradiation lamp 82 is turned off. Next, the carry-out/carry-in member 15 is operated to carry out the diced wafer 11 stuck on the dicing tape 13 whose adhesive force has been reduced by performing the above-mentioned adhesive force reducing step. Then, after the lifting member 72 of the cassette loading mechanism 7 is operated to position the cassette 10 at the first loading and unloading position shown in FIG. The predetermined position of the cassette 10 positioned at the first carrying-in/out position. In this way, after storing the diced wafer 11 in a predetermined position of the cassette 10, the unloading and loading member 15 is operated to unload the wafer to be diced next from the cassette 10, and the above-mentioned slicing operation is repeated.

In addition, in the cutting work described above, while the wafer 11 that has undergone the hydrophilicity imparting step is subjected to the cutting step, the wafer 11 to be cut next is carried out from the cassette 10 and the hydrophilicity imparting step is performed, and Returning the hydrophilically imparted wafer 11 to the cassette 10 for preparation in advance can improve work efficiency.

As described above, the ultraviolet irradiation member 8 in the illustrated embodiment includes: an ultraviolet irradiation lamp 82 disposed in the ultraviolet irradiation chamber 811 of the casing 81, and composed of a low-pressure mercury lamp that irradiates ultraviolet rays with a wavelength of 150 nm to 400 nm; The first frame support member 83, which is arranged on the lower side of the ultraviolet irradiation lamp 82, is used to support the ring-shaped frame 12 supporting the wafer 11 through the dicing tape 13; and the second frame support member 84, which is arranged on the ultraviolet ray The upper side of the irradiation lamp 82 is used to support the ring-shaped frame 12 that supports the wafer 11 via the dicing tape 13. The dicing tape 13 supports the ring-shaped frame 12 supporting the wafer 11. When the dicing tape 13 is irradiated with ultraviolet light to reduce the adhesive force, the ring-shaped frame supporting the wafer 11 via the dicing tape 13 is supported by the second frame support member 84. 12, therefore, one ultraviolet irradiation lamp 82 can be used to implement the hydrophilicity imparting process of irradiating ultraviolet rays to the surface of the wafer to impart hydrophilicity, and the adhesive force of irradiating ultraviolet rays to the dicing tape to reduce the adhesive force. Reduce process. Therefore, since there is no need to arrange an ultraviolet irradiation lamp for imparting hydrophilicity and an ultraviolet irradiation lamp for reducing adhesive force, the limitation of the space in the cutting device is eased, and the size of the device can be reduced.

As mentioned above, although this invention was demonstrated based on illustrated embodiment, this invention is not limited only to embodiment. In the illustrated embodiment, the example in which the hydrophilicity imparting process is implemented by the ultraviolet irradiation member 8 equipped in the cutting device is shown, but the hydrophilicity may be implemented by the ultraviolet irradiation member arranged adjacent to the cutting device. Aqueous imparting process.

Claims (2)

1. A cutting device comprising: a holding member that holds a wafer; a cutting member that is provided with a cutting tool that cuts the wafer held by the holding member; and a cutting feed member that makes the holding member and The cutting member relatively moves along the cutting feeding direction; the indexing feeding member moves the holding member and the cutting member relative to the indexing feeding direction perpendicular to the cutting feeding direction; the box loading mechanism has a cassette mounting table on which a cassette containing a wafer attached to a dicing tape whose adhesive force is reduced by irradiation of ultraviolet rays and supported on a ring-shaped frame by the dicing tape is mounted; a carry-out member for carrying out the wafer stored in the cassette placed on the cassette mounting table to the temporary storage area; and a transport member for transporting the wafer carried out to the temporary storage area to the holding member, The cutting device is characterized in that, The cutting device includes an ultraviolet irradiating member that irradiates ultraviolet rays to the surface of the wafer carried out by the carrying out member to impart hydrophilicity, and irradiates the dicing tape with ultraviolet rays to reduce the adhesive force, The ultraviolet irradiating member includes: an ultraviolet irradiating lamp that irradiates ultraviolet rays including wavelengths that irradiate the surface of the wafer to generate ozone and generate active oxygen, and wavelengths that irradiate the dicing tape to reduce adhesive force; A first frame support member, which is arranged on the lower side of the ultraviolet irradiation lamp, supports the ring-shaped frame that supports the wafer through the dicing tape; and a second frame support member, which is arranged on the bottom of the ultraviolet irradiation lamp On the upper side, the ring-shaped frame supporting the wafer by the dicing tape is supported, When the surface of the wafer is irradiated with ultraviolet rays to impart hydrophilicity, the ring-shaped frame that supports the wafer via the dicing tape is supported by the first frame support member, and the adhesive force is reduced by irradiating the dicing tape with ultraviolet rays. When using the second frame support member to support the ring-shaped frame that supports the wafer via the dicing tape, The hydrophilicity imparting step of irradiating the surface of the wafer with ultraviolet rays to impart hydrophilicity and the step of reducing the adhesive force of irradiating the dicing tape with ultraviolet rays to reduce the adhesive force can be carried out with one ultraviolet irradiation lamp. 2. The cutting device of claim 1, wherein: The ultraviolet irradiation lamp is a low-pressure mercury lamp.