CN109986461B - Cutting device - Google Patents

Abstract

A cutting device is provided to transport the workpiece without using a separate transport mechanism. The cutting device includes a cutting unit for cutting a workpiece with a cutting tool, and a machining feed unit for placing a chuck table in a machining area where the workpiece is cut and a loading and unloading unit for loading and unloading the workpiece. Move between areas; moving unit, which moves the cutting unit in the direction of the indexing feed and in the direction perpendicular to the holding surface; placing area, which is used to place the workpiece before cutting; The workpiece is unloaded; the transfer pad transports the workpiece before cutting to the chuck table located in the loading and unloading area, and transports the workpiece after cutting to the unloading unit, and the transfer pad is attached and detached relative to the moving unit , the workpiece is sucked and held while being attached to the moving unit, and the workpiece is moved by the moving unit while being sucked and held to convey the workpiece.

Description

Cutting device

technical field

The present invention relates to a cutting device for cutting a workpiece with a cutting tool.

Background technique

There are known cutting apparatuses that cut substrates such as semiconductor wafers, package substrates, ceramic substrates, and glass substrates with a cutting tool attached to a spindle in a manufacturing process of a device chip.

The cutting device includes a cutting unit having a cutting tool and a chuck table that holds a workpiece. The operator of the cutting device carries the workpiece into the cutting device and places it on the holding surface of the upper surface of the chuck table. Then, the workpiece is sucked and held on the chuck table, and the cutting tool is rotated while being brought into contact with the workpiece to cut the workpiece. After the cutting is completed, the operator removes the workpiece from the chuck table.

In this way, a cutting device in which a workpiece is carried into a chuck table by an operator is known as a manual cutting device. On the other hand, there is known a fully automatic cutting apparatus that automatically carries out the loading and unloading of the workpiece.

The fully automatic cutting apparatus includes a placing area on which a workpiece before processing is placed, a carry-out area on which a workpiece after processing is placed, and a conveying mechanism for carrying in and out of the workpiece. This conveyance mechanism carries the workpiece before processing placed in the placement area into the chuck table, and carries out the workpiece after processing from the chuck table to the carry-out area. In addition, a fully automatic cutting apparatus may have a cleaning unit that cleans the workpiece after machining.

A manual type cutting device that does not have a conveying mechanism is inexpensive, has a relatively simple structure, and requires a small area for installation. However, the operator must carry in and unload the workpiece at predetermined timings before and after the cutting process, and the operator is required to perform regular work.

On the other hand, in a fully automatic cutting device having a conveying mechanism, the operator can carry out the loading and unloading of the workpiece to and from the cutting device at any timing regardless of the progress of the cutting process. However, since the conveying mechanism is provided, the structure of the apparatus becomes complicated, and the cutting apparatus is expensive and large, so a relatively wide installation area is required.

Therefore, among fully automatic cutting apparatuses, a cutting apparatus having a conveyance mechanism for conveying a workpiece with a relatively simplified structure has been developed (refer to Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2017-84950

In the fully automatic cutting apparatus described in Patent Document 1, it is necessary to provide a conveyance mechanism having a drive system that is independent of each other for the loading and unloading of the workpiece to and from the chuck table. Therefore, compared with the manual type cutting device, the device structure is still complicated, and the manufacturing cost of the cutting device is relatively high.

SUMMARY OF THE INVENTION

The present invention was made in view of this problem, and an object thereof is to provide a cutting device capable of carrying in and out of a workpiece without using an independent conveying mechanism.

According to one aspect of the present invention, there is provided a cutting device comprising: a cutting unit for cutting a workpiece held by a holding surface of a chuck table with a cutting tool attached to a spindle; A feeding unit, which makes the chuck table move in a machining feed direction parallel to the holding surface between a processing area where the workpiece is cut and a loading and unloading area where the workpiece is loaded and unloaded; the moving unit, It makes the cutting unit move in the indexing feed direction parallel to the holding surface and perpendicular to the machining feed direction and in the direction perpendicular to the holding surface; the placing area, which is adjacent to the carrying-in and carrying-out area, is used for A workpiece before cutting is placed; a carry-out unit that carries out the workpiece after cutting; and a conveying pad that carries the workpiece before cutting placed on the placing area to a machine located in the carrying-in and carrying-out area The chuck table transports the cut workpiece placed on the chuck table to the unloading unit, and the transport pad is loaded with respect to the moving unit in a standby area adjacent to the loading and unloading area. The conveying pad sucks and holds the workpiece while being attached to the moving unit, and moves the moving unit while the workpiece is being sucked and held to convey the workpiece.

In addition, in one aspect of the present invention, the conveyance pad may have an engaged portion at an upper portion, and the moving unit may include a moving plate for fixing the cutting unit, and an arm extending from the moving plate to the cutting unit. The working and feeding direction extends and has an engaging portion that engages with the engaging portion. By moving the moving plate in a direction perpendicular to the holding surface, the engaging portion of the arm is connected to the holding surface. The engaged portion of the conveyance pad in the standby area is engaged to connect the conveyance pad and the moving plate.

In addition, in one aspect of the present invention, the unloading unit may include an unloading table on which the workpiece is placed, and the unloading stage may be able to communicate with the processing feed in a region immediately above the carrying-in and unloading region. The unit moves between carry-out areas on the side of the unit, and the carry-out unit moves the carry-out table on which the workpiece is placed by the transfer pad when positioned in the area directly above the carry-out area, thereby moving the carry-out table to the carry-out area. The processed objects are carried out.

In addition, in one aspect of the present invention, a drying nozzle may be provided that is provided on the moving path of the unloading table, and that sprays gas on the front surface of the workpiece placed on the unloading table to cut the workpiece. The liquid adhering to it is removed from the workpiece. In addition, a cleaning nozzle may be provided which is provided on the moving path of the chuck table moved by the machining feed unit, and the holding surface of the chuck table or the surface held by the chuck table may be provided. The workpiece is sprayed with liquid to clean the holding surface or the workpiece.

A cutting apparatus according to one aspect of the present invention includes a conveyance pad that conveys the workpiece from the placement area to the chuck table, and conveys the workpiece from the chuck table to the unloading unit. Here, the conveyance pad is attached to and detached from a moving unit that moves the cutting unit, and is moved by the moving unit. Therefore, the cutting device does not need a moving mechanism having an independent drive system only for moving the transfer pad.

When the workpiece is not conveyed during cutting of the workpiece, the conveying pad is detached from the moving unit. Therefore, the load of the moving unit that moves the cutting unit does not increase.

Therefore, by providing the cutting device according to the present invention, it is possible to carry in and carry out the workpiece without using an independent conveying mechanism.

Description of drawings

FIG. 1 is a perspective view schematically showing a workpiece and a cutting device.

FIG. 2(A) is a side view schematically showing a state in which a conveyance pad is attached to the moving unit, and FIG. 2(B) is a schematic view showing a state in which a workpiece is carried into the chuck table by the conveyance pad. side view.

FIG. 3(A) is a side view schematically showing a state in which a workpiece is cut by the cutting unit, and FIG. 3(B) is a side view schematically showing a case where the workpiece is placed on the unloading unit by the transfer pad. Side view of the situation.

FIG. 4(A) is a plan view schematically illustrating a state in which a transfer pad is attached to the moving unit, and FIG. 4(B) is a schematic view illustrating that the transfer pad sucks and holds the workpiece placed on the placement area. top view of the situation.

FIG. 5(A) is a plan view schematically showing a state in which the workpiece is carried into the chuck table by the transfer pad, and FIG. 5(B) is a schematic view showing that the workpiece is cut by the cutting unit. Top view of the situation.

FIG. 6(A) is a plan view schematically showing a state in which the workpiece is sucked and held by the conveying pad, and FIG. 6(B) is a plan view schematically showing a state in which the workpiece is placed on the unloading unit. .

FIG. 7(A) is a plan view schematically showing a state in which the workpiece is carried out by the carry-out unit, and FIG. 7(B) is a schematic view showing the moving unit for sucking and holding a new workpiece. A plan view of the state in which the transfer pad is moved.

Label description

1, 1a: workpiece; 3: cutting groove; 2: cutting device; 4: device base; 6: chuck table; 6a: holding surface; 8: cutting unit; 8a: cutting tool; 8b: nozzle; 10: Camera unit; 16: Opening; 18: X-axis moving table; 20: Dust-proof and drip-proof cover; 22: Support structure; 24, 32: Guide rail; 26, 34: Moving plate; 28, 36: Ball screw ;30, 38: Pulse motor; 40: Placement area; 42: Arm; 44: Transfer pad; 46: Engaged part; 48: Engagement part; 50: Carry out unit; Nozzle; 56: Drying Nozzle; 58: Standby Area; 60: Carrying in and Carrying Out Area; 62: Processing Area; 64, 66, 68: Suction Path; 70: Carrying Out Area.

Detailed ways

A cutting device according to one embodiment of the present invention will be described with reference to the drawings. First, the workpiece of the cutting apparatus according to the present embodiment will be described with reference to FIG. 1 . FIG. 1 is a perspective view schematically showing a workpiece and a cutting device.

The workpiece 1 is, for example, a substrate made of materials such as silicon, SiC (silicon carbide), or other semiconductors, or materials such as sapphire, glass, quartz, and ceramics. Alternatively, the workpiece is a package substrate in which the device is covered with resin. A planned dividing line is set on the workpiece 1, and when the workpiece 1 is divided by cutting along the planned dividing line, a device chip can be formed.

Next, the cutting device 2 of the present embodiment will be described. The cutting apparatus 2 has an apparatus base 4 that supports each structure, and on the upper surface of the apparatus base 4 is provided: a chuck table 6 for sucking and holding the workpiece 1 ; and a cutting unit 8 for holding the workpiece 1 . The workpiece 1 is cut. The cutting device 2 sucks and holds the workpiece 1 by the chuck table 6 , and cuts the workpiece 1 with the cutting unit 8 . In addition, the cutting device 2 has a camera unit 10 that captures an image of the workpiece 1 in order to align the cutting unit 8 at a position adjacent to the cutting unit 8 .

The chuck table 6 internally has a suction path (not shown) whose one end is connected to a suction source, and the other end of the suction path is connected to a porous member disposed on the upper part of the chuck table 6 . The porous member is exposed upward, and the upper surface of the porous member serves as the holding surface 6 a of the chuck table 6 .

When the workpiece 1 is placed on the holding surface 6 a and the suction source is operated to apply a negative pressure to the workpiece 1 through the porous member, the workpiece 1 is sucked and held on the chuck table 6 . . The chuck table 6 is rotatable about an axis along a direction perpendicular to the holding surface 6a.

An opening 16 having a long side along the X-axis direction is provided in the center portion of the upper surface of the device base 4, and inside the opening 16, an X-axis moving table 18 and a dust-proof and drip-proof cover are arranged. 20, one end of which is mounted on the X-axis moving table 18. A machining feed unit (not shown) is disposed in the area protected by the dust-proof and drip-proof cover 20 below the X-axis moving table 18 , and the machining and feeding unit moves the X-axis moving table 18 along the holding surface. 6a moves parallel to the X-axis direction.

In this machining and feeding unit, the chuck table 6 is machined and fed in the X-axis direction when the workpiece 1 is cut. That is, let the X-axis direction be the machining feed direction. In addition, this machining and feeding unit feeds the chuck table 6 along the machining direction between the machining area 62 where the workpiece 1 is cut and the loading and unloading area 60 where the workpiece 1 is loaded and unloaded with respect to the chuck table 6 . direction move.

On the rear part of the upper surface of the device base 4 , a support structure 22 is erected and has a protruding part extending toward the upper part of the opening 16 . A pair of Y-axis guide rails 24 parallel to the Y-axis direction are provided on the front side surface of the support structure 22 , and a Y-axis moving plate 26 is slidably attached to the Y-axis guide rails 24 .

A nut portion (not shown) is provided on the rear surface side of the Y-axis moving plate 26 , and the Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed into the nut portion. The Y-axis pulse motor 30 is connected to one end of the Y-axis ball screw 28 . When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30 , the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24 .

A unit composed of a pair of Y-axis guide rails 24 , Y-axis moving plate 26 , Y-axis ball screw 28 , and Y-axis pulse motor 30 serves as a unit for indexing and feeding the cutting unit 8 and the camera unit 10 in the Y-axis direction. The degree feed unit functions. That is, let the Y-axis direction be the indexing feed direction.

Disposed on the front surface of the Y-axis moving plate 26 are: a pair of Z-axis guide rails 32 extending in the Z-axis direction; and a Z-axis moving plate 34 slidably attached to each of the Z-axis guide rails 32 . A nut portion (not shown) is provided on the back side (rear surface side) of the Z-axis moving plate 34 , and a Z-axis ball screw 36 parallel to the Z-axis guide rail 32 is screwed to the nut portion.

A Z-axis pulse motor 38 is connected to one end of the Z-axis ball screw 36 . When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38 , the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide rail 32 . The cutting unit 8 and the camera unit 10 are fixed to the lower part of the front surface side of the Z-axis moving plate 34 .

A unit composed of a pair of Z-axis guide rails 32 , Z-axis moving plate 34 , Z-axis ball screw 36 , and Z-axis pulse motor 38 serves as a unit for making the cutting unit 8 and the camera unit 10 perpendicular to the holding surface 6 a of the chuck table 6 . The lift unit that moves in the Z-axis direction functions. In addition, the indexing and feeding unit and the raising and lowering unit function as moving units for moving the cutting unit 8 and the like.

The cutting unit 8 includes a main shaft (not shown) along the Y-axis direction, and an annular cutting tool 8a attached to the front end of the main shaft. A spindle motor (not shown) is connected to the base end side of the main shaft, and rotates the main shaft in the Y-axis direction. When the spindle is rotated by the spindle motor, the cutting tool 8a is rotated.

The cutting blade 8a has a cutting edge on the outer peripheral portion. The cutting edge contains, for example, abrasive grains and a bonding material in which the abrasive grains are dispersed. When the rotating cutting tool 8a is positioned at a predetermined height position and the X-axis moving table 18 is moved in the machining feed direction, the workpiece 1 is cut by the cutting tool 8a.

When the workpiece 1 is cut by the cutting tool 8a, chips are generated from the workpiece 1 and scattered. In addition, machining heat is generated by cutting, and the workpiece 1 and the cutting tool 8a become high temperature. Therefore, the cutting fluid is supplied to the workpiece 1 and the cutting tool 8a while the workpiece 1 is being cut. The cutting unit 8 has a nozzle 8b on the side of the cutting tool 8a, and the cutting fluid is supplied from the nozzle 8b to the upper surface of the workpiece 1 and the cutting tool 8a.

The cutting fluid supplied from the nozzle 8b is, for example, pure water. The cutting fluid has a function of cooling the workpiece 1 and the cutting tool 8a. In addition, chips and the like generated by the cutting process flow to the outside of the workpiece 1 by the cutting fluid and are removed.

A placement region 40 on which the workpiece 1 before cutting is placed is provided at a position adjacent to the carry-in and carry-out region 60 on the upper surface of the apparatus base 4 . The operator of the cutting device 2 places the workpiece 1 before cutting on the placing area 40 at any timing.

In addition, the carrying-out unit 50 which carries out the workpiece 1 after cutting is provided in another position adjacent to the carrying-in carrying-out area 60 on the upper surface of the apparatus base 4 . The carry-out unit 50 includes, for example, a carry-out table 52 on which a workpiece is placed, and the carry-out table 52 is movable between a region directly above the carry-in region 60 and a carry-out region 70 on the side of the processing and feeding unit. The workpiece 1 after cutting is placed on the unloading unit 50 positioned in the region just above. Then, the unloading unit 50 is moved to the unloading area 70 so that the workpiece 1 can be unloaded.

The cutting device 2 includes a conveyance pad 44 that conveys the workpiece 1 placed in the placement area 40 to the chuck table 6 located in the carry-in/out area 60 and places the workpiece 1 on the chuck table 6 . The workpiece 1 is conveyed to the unloading table 52 of the unloading unit 50 .

The transfer pad 44 can be attached to and detached from the Z-axis moving plate 34 of the moving unit. In another position adjacent to the carry-in and carry-out area 60 , there is provided a waiting area 58 on which the conveying pad 44 is placed, and the conveying pad 44 is placed in the waiting area 58 when not attached to the Z-axis moving plate 34 .

The lower surface of the transfer pad 44 is a suction surface capable of sucking and holding the workpiece 1 , and the inside of the transfer pad 44 has a suction path 68 whose one end reaches the suction surface (see FIG. 2(A) , etc.). The conveyance pad 44 has a bracket-shaped engaged portion 46 on the upper portion, and the other end of the suction path 68 reaches the engaged portion 46 .

An arm 42 extending in the machining feed direction (X-axis direction) is fixed to the front surface of the Z-axis moving plate 34 of the moving unit. The arm 42 has an engaging portion 48 that engages with the engaged portion 46 of the conveyance pad 44 at the lower portion of the front end. The arm 42 has two suction passages 64 and 66 (refer to FIG. 2(A) and the like) whose one end leads to the engaging portion 48 inside the arm 42 . Separate suction sources (not shown) are connected to the other ends of the suction passages 64 and 66 .

The arm 42 of the Z-axis moving plate 34 applies a negative pressure to the engaged portion 46 through the suction passage 64 , so that the engaged portion 46 of the conveyance pad 44 and the engaging portion 48 of the arm 42 are engaged with each other. In addition, when the conveyance pad 44 and the arm 42 are engaged, the suction passage 66 included in the arm 42 communicates with the suction passage 68 included in the conveyance pad 44 . The conveying pad 44 sucks and holds the workpiece 1 by applying a negative pressure to the workpiece 1 in contact with the suction surface through the suction path 66 and the suction path 68 .

In addition, the arm 42 and the engaged portion 46 are formed of, for example, a metal material mainly composed of aluminum for weight reduction. However, in order to improve the adhesiveness of the to-be-engaged portion 46 and the engaging portion 48, for example, stainless steel may be used for the contact portion with each other, and the contact surface may be polished. In addition, in this contact portion, in order to improve the airtightness of the connecting portion between the suction passage 66 and the suction passage 68, a sealing member such as an O-ring may be provided so as to surround the periphery of the connecting portion.

The cutting device 2 has a tubular cleaning nozzle 54 extending over the opening 16 in the index feed direction (Y-axis direction) above the movement path of the chuck table 6 between the machining area 62 and the carry-in and carry-out area 60 . The cleaning nozzle 54 is provided with a plurality of ejection ports (not shown) facing downward, and the cleaning nozzle 54 can eject a cleaning liquid such as pure water from the ejection ports. When the chuck table 6 moves from the machining area 62 to the carry-in/out area 60 , the workpiece 1 cut by the cutting unit 8 can be cleaned when the cleaning liquid is ejected from the cleaning nozzle 54 .

In addition, in order to enhance the cleaning effect, a high-pressure cleaning liquid may be ejected from the cleaning nozzle 54 to the workpiece 1 . In addition, two fluids in which air and water are mixed may be ejected from the cleaning nozzle 54 .

In addition, the cutting device 2 has, above the moving path of the unloading table 52 between the area just above the carrying-in and unloading area 60 and the carrying-out area 70 , a pipe-shaped tube that straddles the moving path in the index feeding direction (Y-axis direction). Dry nozzle 56 . The drying nozzle 56 is provided with a plurality of ejection ports (not shown) facing downward, and the drying nozzle 56 can eject gas such as drying air from the ejection ports. When the unloading table 52 moves from the area just above the loading and unloading region 60 to the loading and unloading region 70 , the workpiece 1 to which cutting fluid or the like adheres can be dried when gas is ejected from the drying nozzle 56 .

Next, the loading and unloading of the workpiece 1 with respect to the cutting device 2 and the cutting of the workpiece 1 will be described with reference to the drawings. First, as shown in FIG. 1 , the operator of the cutting device 2 places the workpiece 1 on the placement area 40 . The cutting device 2 conveys the workpiece 1 placed on the placement area 40 on the holding surface 6 a of the chuck table 6 by the conveyance pad 44 .

When the workpiece 1 is to be conveyed by the conveyance pad 44, the conveyance pad 44 is attached to the Z-axis moving plate 34 of the moving unit. Since the conveyance pad 44 before mounting is placed in the standby area 58 , first, the moving unit is operated to position the engaging portion 48 at the lower end of the arm 42 just below the engaged portion 46 of the conveyance pad 44 . Then, the Z-axis moving plate 34 is moved in the Z-axis direction so that the engaging portion 48 and the engaged portion 46 are brought into contact with each other.

FIG. 2(A) is a side view schematically showing a state in which a conveyance pad is attached to the moving unit, and FIG. 4(A) is a plan view schematically showing a state in which the conveyance pad is attached to the moving unit. The state when the engaging part 48 and the to-be-engaged part 46 are brought into contact are schematically shown in FIG. 2(A) and FIG. 4(A) . When a negative pressure is applied to the engaged portion 46 through the suction passage 64 in a state where the engaging portion 48 and the engaged portion 46 are brought into contact, the conveyance pad 44 is attached to the moving unit.

Next, the moving means is operated to move in the index feeding direction (Y-axis direction), and the conveyance pad 44 is moved to the placement area 40 . Then, the transfer pad 44 is lowered to bring the suction surface into contact with the workpiece 1 . Then, when a negative pressure is applied to the workpiece 1 through the suction path 66 and the suction path 68 , the workpiece 1 is sucked and adsorbed on the conveyance pad 44 . FIG. 4(B) is a plan view schematically showing a state in which the workpiece 1 placed on the placement area 40 is sucked and held by the conveyance pad 44 .

Then, the conveyance pad 44 is raised and moved in the index feeding direction (Y-axis direction), and is positioned above the carry-in and carry-out area 60 . Then, the processing feed unit is operated to move the chuck table 6 to the carry-in and carry-out area 60, and the conveyance pad 44 is lowered. When the workpiece 1 comes into contact with the holding surface 6a of the chuck table 6, the lowering of the transfer pad 44 is stopped. When the suction and suction of the workpiece 1 by the transfer pad 44 is released and the workpiece 1 is sucked and held on the chuck table 6 , the transfer of the workpiece 1 by the transfer pad 44 is completed.

FIG. 2(B) is a side view schematically showing a state in which the workpiece 1 is carried into the chuck table 6 by the transfer pad 44 , and FIG. A plan view of the case where the workpiece 1 is carried into the chuck table 6 . In this way, the workpiece 1 can be conveyed by moving the conveyance pad 44 by the moving means. Therefore, in the cutting device 2 of the present embodiment, a separate moving mechanism for moving the conveyance pad 44 is not required.

FIG. 3(A) is a side view schematically showing a state in which the workpiece is cut by the cutting unit, and FIG. 5(B) is a plan view schematically showing a state in which the workpiece is cut by the cutting unit . When the conveying pad 44 is attached to the moving unit, the load when the cutting unit 8 is moved by the moving unit during cutting of the workpiece 1 increases, so the conveying pad 44 can be removed from the moving unit before the workpiece 1 is cut. It is detached and placed in the standby area 58 .

The conveyance pad 44 placed in the standby area 58 is shown in FIG.3(A) and FIG.5(B). When the transfer pad 44 is placed in the standby area 58 , the moving unit is operated to make the transfer pad 44 come into contact with the standby area 58 , and the suction of the transfer pad passing through the suction path 66 is stopped.

When cutting the workpiece 1 , the machining feed unit is operated to move the X-axis moving table 18 to the machining area 62 . Then, when the moving unit is operated, the cutting tool 8a of the cutting unit 8 is positioned at a predetermined height suitable for cutting the workpiece 1, and the X-axis moving table 18 is moved in the machining feed direction, the chuck is The workpiece 1 held on the holding surface 6 a of the table 6 is cut to form the cutting groove 3 . When cutting the workpiece 1 , the camera unit 10 images the workpiece 1 to confirm the planned cutting line, and performs alignment.

After the workpiece 1 is cut along one planned cutting line, the moving unit is operated to move the cutting unit 8 in the indexing feed direction, and the machining feed unit is operated again to move the workpiece 1 Make a cut. Then, after the cutting of the workpiece 1 in one direction is completed, the chuck table 6 is rotated about an axis perpendicular to the holding surface 6a to cut the workpiece 1 in the other direction.

When the workpiece 1 is cut, the cutting fluid is ejected from the nozzle 8b to supply the cutting tool 8a and the workpiece 1 with the cutting fluid. Chips generated from the workpiece 1 by cutting are washed with the cutting fluid. In addition, the heat generated by the friction between the workpiece 1 and the cutting tool 8a is removed by the cutting fluid.

In addition, while the workpiece 1 is being cut, the operator of the cutting device 2 can place a new workpiece 1 a on the placement area 40 as shown in FIG. 5(B) . In this way, the operator can carry the workpiece 1a into the cutting device 2 at any timing.

After the cutting of the workpiece 1 is completed, the machining feed unit is operated to move the chuck table 6 to the carry-in and carry-out area 60 . At this time, when the cleaning liquid is ejected from the cleaning nozzle 54 to the workpiece 1 , the workpiece 1 is cleaned on the side to be processed.

Next, the workpiece 1 is carried out from the chuck table 6 . When the workpiece 1 is carried out from the chuck table 6, the transfer pad 44 is attached to the arm 42 of the Z-axis moving plate 34 of the moving unit again. And the conveyance pad 44 is moved by operating a moving means, and the to-be-processed object 1 is attracted and held by this conveyance pad 44. As shown in FIG. FIG. 6(A) is a plan view schematically showing a state in which the workpiece 1 is sucked and held by the conveyance pad 44 .

Then, the workpiece 1 is moved in a direction (Z-axis direction) perpendicular to the holding surface 6a. Then, the carry-out table 52 of the carry-out unit 50 is moved in the machining feed direction (X-axis direction), and the carry-out table 52 is positioned below the transfer pad in the area immediately above the carry-in and carry-out area 60 . Next, the transfer pad 44 is lowered to bring the workpiece 1 into contact with the unloading table 52 , and the suction and adsorption of the workpiece 1 by the transfer pad 44 is released.

Then, the workpiece 1 is placed on the unloading table 52 . FIG. 3(B) is a side view schematically showing a state in which the workpiece 1 is placed on the unloading unit 50 by the conveyance pad 44 , and FIG. 6(B) is a schematic view showing that the workpiece 1 is placed on the unloading unit 50 . A plan view in the case of the carry-out unit 50 . Then, when the unloading table 52 of the unloading unit 50 is moved to the unloading area 70, the workpiece 1 is unloaded. FIG. 7(A) is a plan view schematically showing a state in which the workpiece 1 is carried out by the carry-out unit 50 .

In addition, liquids such as cutting fluid and cleaning fluid adhere to the workpiece 1 carried out from the cutting device 2 . This liquid may scatter to the ground surface or the storage container of the workpiece 1 outside the processing apparatus 2 and cause contamination. In addition, when the liquid adheres to the workpiece 1 , it may also cause deterioration of the workpiece 1 . Therefore, when the unloading table 52 of the unloading unit 50 is moved to the unloading area 70 , the high-pressure gas can be jetted from the drying nozzle 56 to the workpiece 1 to dry the workpiece 1 and remove the liquid.

The processed to-be-processed object 1 can be carried out from the carry-out table 52 at any timing by the operator of the processing apparatus 2 . In the processing apparatus 2, as shown in FIG.7(B), before carrying out the to-be-processed object 1 from the unloading table 52, the conveyance of the new to-be-processed object 1a by the conveyance pad 44 can be started. (B) of FIG. 7 is a plan view schematically showing a state in which the conveyance pad 44 is moved by the moving means in order to suck and hold the new workpiece 1a.

In addition, the drying of the workpiece 1 may be performed while the new workpiece 1 a is being cut by the cutting unit 8 . That is, while the new workpiece 1 a is being cut, the unloading table 52 on which the workpiece 1 is placed can be repeatedly moved below the drying nozzle 56 while the high-pressure gas is ejected from the drying nozzle 56 . The workpiece 1 is dried.

According to the cutting apparatus 2 of the present embodiment, the workpiece 1 can be conveyed by the conveyance pad 44 that can be attached to and detached from the moving unit. The conveyance pad 44 can be moved by a moving unit that moves the cutting unit 8 and the like, so that the workpiece 1 can be conveyed in the cutting device 2 without using a separate conveying mechanism. The cutting device 2 is a fully automatic cutting device that can carry the workpiece 1 in and out at any time by the operator, but does not require a separate moving mechanism for the transportation of the workpiece 1, and the structure of the cutting device 2 does not It becomes complicated, and the increase in size and cost of the cutting device 2 can be suppressed.

In addition, in the above-mentioned embodiment, the operator places the workpiece 1 before cutting on the placing area 40 and unloads the workpiece 1 after cutting from the unloading table 52 of the unloading unit 50, but one embodiment of the present invention The cutting device 2 of the embodiment is not limited to this.

For example, the operator may place the workpiece 1 before cutting on the unloading table 52 . In this case, the cutting device 2 transports the workpiece 1 to the chuck table 6 by the unloading unit 50 and the transport pad 44 , and transports the workpiece 1 after cutting to the placement area 40 by the transport pad 44 . Then, the operator carries out the workpiece 1 after cutting which is placed in the placement area 40 .

In addition, in the said embodiment, although the conveyance pad 44 hold|maintains the to-be-processed object 1 by suction, the holding|maintenance method of the to-be-processed object 1 is not limited to this. For example, the transfer pad 44 may hold the workpiece 1 by magnetic force or electrostatic force.

In addition to this, the structure, method, etc. of the above-described embodiments can be appropriately changed and implemented as long as they do not deviate from the scope of the object of the present invention.

Claims (5)

1. A cutting device is characterized in that a cutting tool is provided,

the cutting device comprises:

a cutting unit for cutting the workpiece held by the holding surface of the chuck table by a cutting tool attached to the spindle;

a processing feeding unit which moves the chuck table in a processing feeding direction parallel to the holding surface between a processing area for cutting the workpiece and a carrying-in/out area for carrying in/out the workpiece;

a moving unit that moves the cutting unit in an indexing feed direction parallel to the holding surface and perpendicular to the machining feed direction and in a direction perpendicular to the holding surface;

a loading area adjacent to the carrying-in and carrying-out area for loading the workpiece before cutting;

a carrying-out unit for carrying out the cut workpiece; and

a conveying pad for conveying the pre-cut workpiece placed on the placing area to the chuck table located in the carrying-in and carrying-out area, and conveying the post-cut workpiece placed on the chuck table to the carrying-out unit,

the conveying pad is attached to and detached from the moving unit that moves the cutting unit in a standby area adjacent to the carrying in and out area, sucks and holds the workpiece in a state of being attached to the moving unit that moves the cutting unit, and conveys the workpiece by moving the moving unit that moves the cutting unit in an indexing direction and a direction perpendicular to the holding surface in a state of sucking and holding the workpiece.

2. The cutting device of claim 1,

the carrying pad has an engaged portion at an upper portion,

the mobile unit has:

a moving plate that fixes the cutting unit; and

an arm extending from the moving plate in the machining feed direction and having an engaging portion for engaging with the engaged portion,

the moving plate is moved in a direction perpendicular to the holding surface, so that the engaging portion of the arm engages with the engaged portion of the conveying pad placed in the standby area, thereby coupling the conveying pad and the moving plate.

3. The cutting device according to claim 1 or 2,

the carrying-out unit has a carrying-out table on which the object to be processed is placed,

the carrying-in/out table is movable between an area directly above the carrying-in/out area and a carrying-out area on a side of the processing feeding unit,

the carrying-out unit moves the carrying-out table on which the object is placed by the conveying pad when positioned in the area directly above to the carrying-out area, thereby carrying out the object.

4. The cutting device of claim 3,

the cutting device is provided with a drying nozzle which is arranged on a moving path of the carrying-out workbench, and sprays gas to the front surface of the processed object carried on the carrying-out workbench to remove liquid attached during cutting from the processed object.

5. The cutting device according to claim 1 or 2,

the cutting device is provided with a cleaning nozzle which is arranged on a moving path of the chuck workbench moving through the processing feeding unit and sprays liquid to the holding surface of the chuck workbench or the processed object held by the chuck workbench to clean the holding surface or the processed object.

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